JP6767811B2 - 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法 - Google Patents

位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法 Download PDF

Info

Publication number
JP6767811B2
JP6767811B2 JP2016170066A JP2016170066A JP6767811B2 JP 6767811 B2 JP6767811 B2 JP 6767811B2 JP 2016170066 A JP2016170066 A JP 2016170066A JP 2016170066 A JP2016170066 A JP 2016170066A JP 6767811 B2 JP6767811 B2 JP 6767811B2
Authority
JP
Japan
Prior art keywords
feature points
position detection
image
feature point
correlation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016170066A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018036528A5 (https=
JP2018036528A (ja
Inventor
忠喜 宮崎
忠喜 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016170066A priority Critical patent/JP6767811B2/ja
Priority to US15/689,051 priority patent/US10503079B2/en
Priority to KR1020170109965A priority patent/KR102233662B1/ko
Priority to CN201710767002.7A priority patent/CN107797389B/zh
Publication of JP2018036528A publication Critical patent/JP2018036528A/ja
Publication of JP2018036528A5 publication Critical patent/JP2018036528A5/ja
Application granted granted Critical
Publication of JP6767811B2 publication Critical patent/JP6767811B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2016170066A 2016-08-31 2016-08-31 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法 Active JP6767811B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016170066A JP6767811B2 (ja) 2016-08-31 2016-08-31 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法
US15/689,051 US10503079B2 (en) 2016-08-31 2017-08-29 Position detection method, position detection apparatus, lithography apparatus, and article manufacturing method
KR1020170109965A KR102233662B1 (ko) 2016-08-31 2017-08-30 위치 검출 방법, 위치 검출 장치, 리소그래피 장치 및 물품 제조 방법
CN201710767002.7A CN107797389B (zh) 2016-08-31 2017-08-31 位置检测方法和装置、存储介质、光刻装置和制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016170066A JP6767811B2 (ja) 2016-08-31 2016-08-31 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法

Publications (3)

Publication Number Publication Date
JP2018036528A JP2018036528A (ja) 2018-03-08
JP2018036528A5 JP2018036528A5 (https=) 2019-10-10
JP6767811B2 true JP6767811B2 (ja) 2020-10-14

Family

ID=61242393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016170066A Active JP6767811B2 (ja) 2016-08-31 2016-08-31 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法

Country Status (4)

Country Link
US (1) US10503079B2 (https=)
JP (1) JP6767811B2 (https=)
KR (1) KR102233662B1 (https=)
CN (1) CN107797389B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108764100B (zh) * 2018-05-22 2022-03-25 全球能源互联网研究院有限公司 一种目标行为检测方法及服务器
CN113987228B (zh) * 2018-06-20 2025-08-08 深圳引望智能技术有限公司 一种数据库构建方法、一种定位方法及其相关设备
EP3650940A1 (en) * 2018-11-09 2020-05-13 ASML Netherlands B.V. A method in the manufacturing process of a device, a non-transitory computer-readable medium and a system configured to perform the method
JP7317579B2 (ja) * 2019-06-07 2023-07-31 キヤノン株式会社 位置合わせ装置、位置合わせ方法、リソグラフィ装置、および、物品の製造方法
JP7418080B2 (ja) * 2019-10-04 2024-01-19 キヤノン株式会社 位置検出装置、位置検出方法、リソグラフィ装置、及び物品の製造方法
CN117203665B (zh) * 2021-05-13 2025-11-18 发那科株式会社 图像处理装置
CN113703282B (zh) * 2021-08-02 2022-09-06 联芯集成电路制造(厦门)有限公司 光罩热膨胀校正方法
CN116072583B (zh) * 2023-02-13 2024-01-30 无锡星微科技有限公司 一种基于视觉的晶圆预对准平台以及对准方法
CN116563861B (zh) * 2023-05-06 2025-11-11 广电运通集团股份有限公司 纸币的面向识别方法、装置、电子设备及存储介质

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2689688B2 (ja) * 1990-05-12 1997-12-10 三菱電機株式会社 画像処理方式
JPH0498377A (ja) * 1990-08-09 1992-03-31 Matsushita Electric Ind Co Ltd パターンマッチング方法
JP2962266B2 (ja) * 1996-05-31 1999-10-12 日本電気株式会社 画像の位置合わせ方法
JPH10326739A (ja) * 1997-05-23 1998-12-08 Nikon Corp 位置合わせ方法及び露光方法
KR20020006690A (ko) * 1999-03-24 2002-01-24 시마무라 테루오 위치계측장치, 위치계측방법 및 노광장치, 노광방법그리고 중첩계측장치, 중첩계측방법
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP2003324055A (ja) * 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4272862B2 (ja) * 2002-09-20 2009-06-03 キヤノン株式会社 位置検出方法、位置検出装置及び露光装置
JP4227470B2 (ja) * 2003-06-18 2009-02-18 キヤノン株式会社 位置検出方法
JP4470503B2 (ja) * 2004-01-30 2010-06-02 株式会社ニコン 基準パターン決定方法とその装置、位置検出方法とその装置、及び、露光方法とその装置
US7746446B2 (en) * 2004-03-31 2010-06-29 Nikon Corporation Alignment condition determination method and apparatus of the same, and exposure method and apparatus of the same
US7259828B2 (en) * 2004-05-14 2007-08-21 Asml Netherlands B.V. Alignment system and method and device manufactured thereby
JP4736707B2 (ja) * 2005-10-18 2011-07-27 株式会社ニコン 露光装置及びデバイス製造方法、並びに観察装置
US7983482B2 (en) * 2005-11-08 2011-07-19 Kitakyushu Foundation For The Advancement Of Industry, Science And Technology Matching apparatus, image search system, and histogram approximate restoring unit, and matching method, image search method, and histogram approximate restoring method
WO2007138593A1 (en) * 2006-05-30 2007-12-06 Yissum Research Development Company Of The Hebrew University Of Jerusalem Pattern matching
JP4943228B2 (ja) * 2007-05-22 2012-05-30 Ｊｕｋｉ株式会社 画像のマッチング処理方法
US8279409B1 (en) * 2009-08-05 2012-10-02 Cadence Design Systems, Inc. System and method for calibrating a lithography model
JP5689629B2 (ja) * 2010-08-30 2015-03-25 Juki株式会社 画像処理装置
JP5566928B2 (ja) * 2011-03-04 2014-08-06 株式会社東芝 マスク検査方法およびその装置
JP2013109589A (ja) * 2011-11-21 2013-06-06 Nikon Corp 相関演算装置
JP2015060421A (ja) * 2013-09-19 2015-03-30 株式会社バッファロー 類似画像検索方法及び類似画像検索装置
JP6567004B2 (ja) * 2017-08-30 2019-08-28 キヤノン株式会社 パターン形成装置、決定方法、プログラム、情報処理装置及び物品の製造方法

Also Published As

Publication number Publication date
US20180059553A1 (en) 2018-03-01
CN107797389B (zh) 2021-02-26
US10503079B2 (en) 2019-12-10
JP2018036528A (ja) 2018-03-08
KR20180025266A (ko) 2018-03-08
KR102233662B1 (ko) 2021-03-31
CN107797389A (zh) 2018-03-13

Similar Documents

Publication Publication Date Title
JP6767811B2 (ja) 位置検出方法、位置検出装置、リソグラフィ装置および物品製造方法
US10600667B2 (en) Systems and methods for wafer alignment
TWI685724B (zh) 判定圖案化製程之校正之方法、元件製造方法、用於微影裝置之控制系統及微影裝置
CN114341630B (zh) 等概率缺陷检测
KR102339243B1 (ko) 리소그래피 장치 및 물품 제조 방법
TW202223536A (zh) 度量衡方法及相關聯裝置
TW201837459A (zh) 量測變化之方法、檢測系統、電腦程式及電腦系統
KR102720076B1 (ko) 얼라인먼트 장치, 얼라인먼트 방법, 리소그래피 장치, 및 물품의 제조방법
JP6584170B2 (ja) 検出装置、リソグラフィ装置、物品の製造方法、および検出方法
KR102907522B1 (ko) 처리 장치, 계측 장치, 리소그래피 장치, 물품을 제조하는 방법, 모델, 처리 방법, 계측 방법, 생성 방법, 및 생성 장치
KR102915871B1 (ko) 마크 검출 장치, 마크 학습 장치, 기판 처리 장치, 마크 검출 방법, 및 물품의 제조 방법
KR102413895B1 (ko) 패턴 형성 방법, 리소그래피 장치, 및 물품 제조 방법
EP3731020A1 (en) Metrology method and apparatus, computer program and lithographic system
JP6685715B2 (ja) 位置検出方法、プログラム、位置検出装置、リソグラフィ装置、および物品の製造方法
US12124174B2 (en) Metrology method and apparatus, computer program and lithographic system
US12393113B2 (en) Inter-step feedforward process control in the manufacture of semiconductor devices
JP6945601B2 (ja) パターン形成装置、決定方法、プログラム、情報処理装置及び物品の製造方法
JP2025034099A (ja) テンプレートを作成する方法、プログラム、検出装置、リソグラフィ装置、および物品製造方法
US20080002171A1 (en) Method for in-line monitoring a lens controller of a photolithography system
JP2025121705A (ja) 検出装置、検出方法、プログラム、基板処理装置及び物品の製造方法
JP4389871B2 (ja) 基準パターン抽出方法とその装置、パターンマッチング方法とその装置、位置検出方法とその装置及び露光方法とその装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190828

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190828

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200727

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200918

R151 Written notification of patent or utility model registration

Ref document number: 6767811

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151