JP6764701B2 - 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器 - Google Patents

画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器 Download PDF

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JP6764701B2
JP6764701B2 JP2016117054A JP2016117054A JP6764701B2 JP 6764701 B2 JP6764701 B2 JP 6764701B2 JP 2016117054 A JP2016117054 A JP 2016117054A JP 2016117054 A JP2016117054 A JP 2016117054A JP 6764701 B2 JP6764701 B2 JP 6764701B2
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image
unit
display
defective product
registration
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JP2017224023A (ja
JP2017224023A5 (https=
Inventor
広志 匂坂
広志 匂坂
史享 山岡
史享 山岡
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Keyence Corp
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Keyence Corp
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Priority to US15/585,182 priority patent/US10096103B2/en
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/188—Capturing isolated or intermittent images triggered by the occurrence of a predetermined event, e.g. an object reaching a predetermined position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Studio Devices (AREA)
JP2016117054A 2016-06-13 2016-06-13 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器 Active JP6764701B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016117054A JP6764701B2 (ja) 2016-06-13 2016-06-13 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
US15/585,182 US10096103B2 (en) 2016-06-13 2017-05-03 Image processing sensor, image processing method, image processing program, and computer-readable recording medium and device having image processing program recorded therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016117054A JP6764701B2 (ja) 2016-06-13 2016-06-13 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器

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JP2017224023A JP2017224023A (ja) 2017-12-21
JP2017224023A5 JP2017224023A5 (https=) 2019-04-25
JP6764701B2 true JP6764701B2 (ja) 2020-10-07

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6333871B2 (ja) * 2016-02-25 2018-05-30 ファナック株式会社 入力画像から検出した対象物を表示する画像処理装置
JP6684158B2 (ja) * 2016-06-13 2020-04-22 株式会社キーエンス 画像処理センサ、画像処理方法
JP6730855B2 (ja) 2016-06-13 2020-07-29 株式会社キーエンス 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
US10255526B2 (en) * 2017-06-09 2019-04-09 Uptake Technologies, Inc. Computer system and method for classifying temporal patterns of change in images of an area
KR102308437B1 (ko) 2017-07-07 2021-10-06 주식회사 고영테크놀러지 대상체의 외부의 검사를 최적화하기 위한 장치 및 그 방법
JP2019053050A (ja) * 2017-09-13 2019-04-04 キヤノン株式会社 情報処理装置、情報処理方法、及びプログラム
WO2019103037A1 (ja) 2017-11-21 2019-05-31 住友金属鉱山株式会社 非水系電解質二次電池用正極活物質、非水系電解質二次電池用正極活物質の製造方法
JP6969439B2 (ja) * 2018-02-23 2021-11-24 オムロン株式会社 外観検査装置、及び外観検査装置の照明条件設定方法
JP7370285B2 (ja) * 2020-03-16 2023-10-27 株式会社キーエンス マーキングシステム、診断支援装置、診断支援方法、診断支援プログラム及び記憶媒体
KR102542367B1 (ko) * 2020-12-10 2023-06-12 기가비스주식회사 초점 변화 기반 3차원 측정기에서 최적의 스캔 범위 자동 설정 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3398775B2 (ja) * 1994-09-28 2003-04-21 オムロン株式会社 画像処理装置および画像処理方法
JPH11312249A (ja) 1998-04-28 1999-11-09 Omron Corp 画像処理方法およびその装置
JP5581122B2 (ja) * 2010-06-10 2014-08-27 Ｈｏｙａ株式会社 電子内視鏡装置
JP5865707B2 (ja) * 2012-01-06 2016-02-17 株式会社キーエンス 外観検査装置、外観検査方法及びコンピュータプログラム
CN103383774B (zh) * 2012-05-04 2018-07-06 苏州比特速浪电子科技有限公司 图像处理方法及其设备
JP6408259B2 (ja) * 2014-06-09 2018-10-17 株式会社キーエンス 画像検査装置、画像検査方法、画像検査プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
JP5861743B2 (ja) * 2014-06-24 2016-02-16 オムロン株式会社 画像処理装置
JP6684158B2 (ja) 2016-06-13 2020-04-22 株式会社キーエンス 画像処理センサ、画像処理方法
JP6730855B2 (ja) 2016-06-13 2020-07-29 株式会社キーエンス 画像処理センサ、画像処理方法、画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器

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US10096103B2 (en) 2018-10-09
US20170358069A1 (en) 2017-12-14
JP2017224023A (ja) 2017-12-21

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