JP6751655B2 - Probes and electrical connections - Google Patents

Description

The present invention relates to a probe and an electrical connection device used for electrical inspection of an object to be inspected.

A large number of integrated circuits built into a semiconductor wafer are generally subjected to an electrical inspection to see if they perform as specified before being cut and separated from the wafer. As a device used for such an electrical inspection, there is an electrical connection device provided with a plurality of probes.

When performing an electrical inspection using this type of electrical connection device, the base end (upper end) of a plurality of probes is brought into contact with the electrodes of the probe substrate connected to the device such as a tester, and the tip of the probe is contacted. The portion (lower end portion) is brought into contact with the electrode of the object to be inspected such as an integrated circuit.

Further, as a probe incorporated in an electrical connection device, a probe having a spring portion that exerts a spring function (elastic force) in a part of a section in the vertical direction has been proposed (see, for example, Patent Document 1).

Such a probe includes a plunger portion that comes into contact with an object to be inspected, a barrel portion having a cylindrical shape, and the barrel portion includes a spring portion in the vertical direction (longitudinal direction).

By having the probe having a spring portion in this way, in the electrical inspection, the probe is secured in a crimping state (so-called overdrive state) in which the tip portion of the probe applies an appropriate pressing force to the object to be inspected. And the electrical connection between the subject and the subject to be inspected is maintained.

Further, in the probe according to the prior art, a part of the plunger portion is inserted into the barrel portion, and the insertion portion of the plunger portion inserted into the barrel portion is fixed to the barrel portion at a predetermined position. The insertion portion of the plunger portion has a length that reaches the inside of the spring portion of the barrel portion.

Japanese Unexamined Patent Publication No. 2013-007730 (Fig. 5, etc.)

However, in the probe according to the prior art, when the spring portion expands and contracts, the insertion portion of the plunger portion may come into contact with various positions of the barrel portion such as the inner surface of the spring portion. In this case, current paths having various resistance values are formed in each of the plurality of probes, and the resistance values of the respective probes vary.

In particular, since the spring portion is formed by thinning a part of the barrel portion in a spiral shape, the resistance value of the spring portion is larger than that of the portion other than the spring portion of the barrel portion. Therefore, when a current path including the spring portion is formed, such as when the plunger portion comes into contact with the inner surface of the spring portion, the resistance value of the probe becomes large, so that the variation in the resistance value of the probe becomes even larger. There was a risk.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a probe and an electrical connection device capable of stabilizing the resistance value of the probe.

In order to achieve the above object, the first feature of the probe according to the present invention is a probe that electrically connects the first contact object and the second contact object, which is composed of a conductive member and extends in the vertical direction. A plunger portion composed of a tubular barrel portion and a conductive member, a part of which is inserted into the barrel portion and electrically connected to the barrel portion, and a part of the barrel portion and the plunger portion are electrically connected. The barrel portion includes a spring portion that exerts a spring function in the vertical direction, and the plunger portion has the first contact on the first contact target side with respect to the spring portion. A first connection portion that electrically connects to the target, a second connection portion that electrically connects to the second contact target on the second contact target side of the spring portion, and the first connection portion and the second contact portion. A third connecting portion that electrically connects the connecting portion is provided, and the insulating portion is provided with the insulating portion from the end of the spring portion of the barrel portion on the first contact target side to the barrel portion. It is located over the end on the second contact target side.

The second feature of the probe according to the present invention relates to the above feature, and the barrel portion includes a non-spring portion that does not exert a spring function on the first contact target side of the spring portion, and the first connection portion. Is to slide the inner surface of the non-spring portion and electrically connect to the first contact target via the non-spring portion.

A third feature of the probe according to the present invention is related to the above feature, that the insulating portion is formed on the surface of the plunger portion.

The fourth feature of the probe according to the present invention relates to the above-mentioned feature, and in the plunger portion, the first connection portion contacts the first contact target on the first contact target side rather than the barrel portion. The second connecting portion contacts the second contact target on the second contact target side of the barrel portion, and the third connecting portion is connected to the second connecting portion and described as described above. It is possible to slide in the vertical direction while contacting the first connecting portion.

The feature of the electrical connection device according to the present invention is an electrical connection device including a probe for electrically connecting the first contact object and the second contact object, and the probe is composed of a conductive member and is vertically and vertically connected. A plunger portion composed of a tubular barrel portion extending in the direction and a conductive member, a part of which is inserted into the barrel portion and electrically connected to the barrel portion, and a part of the barrel portion and the plunger portion. The barrel portion is provided with a spring portion that exerts a spring function in the vertical direction, and the plunger portion is located on the first contact target side with respect to the spring portion. A first connection portion that electrically connects to the first contact target, a second connection portion that electrically connects to the second contact target on the second contact target side of the spring portion, and the first connection portion. A third connecting portion that electrically connects the second connecting portion is provided, and the insulating portion is provided with the barrel from the end of the spring portion of the barrel portion on the first contact target side in the vertical direction. The portion is arranged over the end portion on the second contact target side of the portion.

According to the present invention, it is possible to provide a probe and an electrical connection device capable of stabilizing the resistance value of the probe.

It is a side view which shows typically the inspection apparatus including the electrical connection apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows typically the electric connection device (probe support) which concerns on 1st Embodiment of this invention. It is an exploded perspective view which shows typically the probe which concerns on 1st Embodiment of this invention. It is a side view which shows typically the probe which concerns on 1st Embodiment of this invention. It is sectional drawing which shows typically the probe which concerns on 1st Embodiment of this invention. It is a partially enlarged sectional view schematically showing the probe which concerns on 1st Embodiment of this invention. (A) It is sectional drawing which shows the electric current path of the probe which concerns on 1st Embodiment of this invention. (B) It is a circuit diagram which shows the relationship between the current path and resistance of the probe which concerns on 1st Embodiment of this invention. It is a partially enlarged sectional view schematically showing the probe which concerns on another Embodiment of 1st Embodiment of this invention. (A) It is sectional drawing which shows typically the probe which concerns on the modification of 1st Embodiment of this invention. (B) It is a perspective view which shows schematicly the plunger part which concerns on the modification of 1st Embodiment of this invention. (A) It is sectional drawing which shows typically the probe which concerns on the modification of 1st Embodiment of this invention. (B) It is a perspective view which shows schematicly the plunger part which concerns on the modification of 1st Embodiment of this invention.

Hereinafter, the electrical connection device according to the embodiment of the present invention will be described in detail with reference to the drawings. Further, the embodiments shown below exemplify an apparatus or the like for embodying the technical idea of the present invention, and the technical idea of the present invention describes the arrangement of each component and the like as follows. Not specific. The technical idea of the present invention can be modified in various ways within the scope of the claims.

[First Embodiment]
<Configuration of inspection equipment>
FIG. 1 is a side view schematically showing an inspection device 1 including an electrical connection device including the probe 20 according to the first embodiment of the present invention. For the sake of explanation, the vertical direction Z, the horizontal direction X orthogonal to the vertical direction Z, and the front-rear direction Y orthogonal to the vertical direction Z and the horizontal direction X are defined in the drawings. Further, the vertical direction Z can be paraphrased as the longitudinal direction of the probe 20.

As shown in FIG. 1, the inspection device 1 mainly includes a card-shaped connecting device 2 and a chuck 12.

A card-like connecting device 2 (sometimes also referred to as a probe card) is held by a frame (not shown) above a chuck 12 that can be raised and lowered. A semiconductor wafer 14 is held on the chuck 12 as an example of the object to be inspected. A large number of integrated circuits are incorporated in the semiconductor wafer 14.

The semiconductor wafer 14 is arranged on the chuck 12 for electrical inspection of the integrated circuit, with a large number of electrode pads 14a of the integrated circuit facing upward.

The card-shaped connecting device 2 includes a probe substrate 16 and a probe support 18.

The probe substrate 16 is made of, for example, a circular rigid wiring board. The probe substrate 16 is electrically connected to the base end portion 20b (upper end portion) of the probe 20.

A large number of tester lands 16b serving as connection ends to testers (not shown) are provided on the peripheral edge of one surface (upper surface shown in FIG. 1) of the probe substrate 16. Each tester land 16b is connected to a wiring 16a provided on the probe substrate 16.

Further, on one surface (upper surface shown in FIG. 1) of the probe substrate 16, for example, a metal reinforcing plate 5 for reinforcing the probe substrate 16 is provided. The reinforcing plate 5 is arranged at the central portion of the probe substrate 16 excluding the peripheral portion where the tester land 16b is provided. A probe support 18 is arranged on the other surface (lower surface shown in FIG. 1) of the probe substrate 16.

The probe support 18 is held on the probe substrate 16 by a predetermined holding member. The probe support 18 includes a plurality of probes 20. The probe support 18 prevents the probes 20 from interfering with each other when the tip 20a (lower end) of the probe 20 is pressed against the semiconductor wafer 14. The probe support 18 provided with the probe 20 constitutes the electrical connection device described in the claims.

The probe 20 has a tip portion 20a and a proximal end portion 20b. The tip portion 20a of the probe 20 is arranged so as to face the electrode pad 14a provided corresponding to the semiconductor wafer 14.

The base end portion 20b of the probe 20 is in contact with the connection pad (not shown) of the probe substrate 16 in a crimped state, that is, in a preloaded state. As a result, the base end portion 20b of the probe 20 is electrically connected to the probe substrate 16.

In the present embodiment, the connection pad (not shown) of the probe substrate 16 constitutes the first contact object described in the claims, and the electrode pad 14a of the semiconductor wafer 14 is described in the claims. It constitutes a second contact object.

<Structure of probe support>
Next, the configuration of the probe support 18 will be described in detail with reference to FIG. FIG. 2 is a cross-sectional view for explaining a schematic configuration of the probe support 18. Here, in FIG. 2, nine probes 20 are shown for simplification of description, but the number is not limited to nine. Further, FIG. 2 illustrates a case where the arrangement of the plurality of probes 20 is one row, but the present invention is not limited to this, and the arrangement may be arbitrarily arranged such as a matrix arrangement when viewed from the vertical direction Z. good. Note that FIG. 2 shows a schematic configuration of the probe 20, and a detailed configuration of the probe 20 will be described later (see FIG. 3).

The probe support 18 has an upper guide plate 31, a lower guide plate 32, an intermediate guide plate 33, a fixing screw 36, and a probe 20.

The upper guide plate 31 is a support member for positioning and holding the upper portion of each probe 20 and allowing the probe 20 to slide. That is, the upper guide plate 31 is a position holding guide on the upper part of each probe 20. The upper guide plate 31 is formed in a flat plate shape having a recess 31x extending upward in the center. The recess 31x is provided with a guide hole 31a through which the upper portion of the probe 20 is supported. The guide holes 31a are arranged so as to be aligned with the respective guide holes 33a of the intermediate guide plate 33, and are provided so as to correspond to the positions aligned with the respective electrodes (not shown) of the probe substrate 16. As a result, the upper portion of each probe 20 is fitted into each guide hole 31a, so that the base end portion 20b of each probe 20 comes into contact with each connection pad of the probe substrate 16. Due to the spring function described later of each probe 20, the upper part of each probe 20 slides in a state of penetrating each guide hole 31a as the probe 20 expands and contracts.

The upper guide plate 31 is made of ceramic, for example, and has an insulating property. Further, instead of the upper guide plate 31, a spacer formed in an annular ring, a rectangular ring, or the like may be applied.

The lower guide plate 32 is a support member for positioning and holding the lower portion of each probe 20 and allowing the probe 20 to slide. That is, the lower guide plate 32 is a position holding guide at the lower part of each probe 20. The lower guide plate 32 is formed in a flat plate shape having a recess 32x downward in the center. The recess 32x is provided with a guide hole 32a through which the lower portion of the probe 20 is penetrated and supported. The guide hole 32a is provided at a position consistent with each electrode pad 14a of the semiconductor wafer 14 so as to correspond to each electrode pad 14a. As a result, the lower portion of each probe 20 is fitted into each guide hole 32a, so that the tip portion 20a of each probe 20 comes into contact with each electrode pad 14a of the semiconductor wafer 14. Due to the spring function described later of each probe 20, the lower part of each probe 20 slides in a state of penetrating each guide hole 32a as the probe 20 expands and contracts.

The lower guide plate 32 is, for example, molded of ceramic and has an insulating property. Instead of the lower guide plate 32, a spacer formed in an annular ring, a rectangular ring, or the like may be applied.

The intermediate guide plate 33 is a member for preventing a short circuit between adjacent probes 20 and maintaining the verticality of each probe 20. The peripheral edge of the intermediate guide plate 33 is supported by being sandwiched between the upper guide plate 31 and the lower guide plate 32.

The intermediate guide plate 33 is provided with corresponding guide holes 33a at positions consistent with the guide holes 31a of the upper guide plate 31 and the guide holes 32a of the lower guide plate 32. The intermediate guide plate 33 is thinly made of a synthetic resin film having excellent wear resistance and heat resistance, such as a polyimide film. The intermediate guide plate 33 may be made of ceramic or the like.

The fixing screw 36 is a screw for integrally fixing the entire probe support 18. The upper guide plate 31, the lower guide plate 32, and the intermediate guide plate 33 are integrally fixed by the fixing screws 36 and are detachably configured.

<Probe configuration>
Next, the configuration of the probe 20 according to the first embodiment will be described in detail with reference to FIGS. 3 to 5. FIG. 3 is an exploded perspective view of the probe 20. FIG. 4 is a side view of the probe 20. FIG. 5 is a cross-sectional view taken along the central axis of the probe 20.

As shown in FIGS. 3 to 5, the probe 20 includes a tubular barrel portion 50, a plunger portion 60, and an insulating portion 70. Both the barrel portion 50 and the plunger portion 60 are made of conductive members.

The barrel portion 50 is formed in a cylindrical shape extending in the vertical direction Z. The barrel portion 50 includes a lower end portion 50a and an upper end portion 50b. The lower end portion 50a of the barrel portion 50 is located above the tip portion 20a of the probe 20. On the other hand, the upper end portion 50b of the barrel portion 50 is located at the uppermost position of the probe 20 and comes into contact with the probe substrate 16. The upper end portion 50b of the barrel portion 50 can be paraphrased as the base end portion 20b of the probe 20.

Further, the barrel portion 50 includes spring portions 52, 54 that exert a spring function in the vertical direction Z, and non-spring portions 51, 53, 55 that do not exert a spring function. That is, the barrel portion 50 includes two spring portions 52, 54 and three non-spring portions 51, 53, 55.

The non-spring portion 51 is arranged on the semiconductor wafer 14 side (lower side shown in FIG. 1) with respect to the spring portion 52, and the non-spring portion 53 is arranged between the spring portion 52 and the spring portion 54. The 55 is arranged on the probe substrate 16 side (upper side shown in FIG. 1) with respect to the spring portion 54. As a result, in the barrel portion 50, the non-spring portion 51, the spring portion 52, the non-spring portion 53, the spring portion 54, and the non-spring portion 55 are arranged in this order along the vertical direction Z.

The plunger portion 60 is formed in a substantially columnar shape. A part of the plunger portion 60 is inserted into the barrel portion 50 and is electrically connected to the barrel portion 50. Further, the other portion of the plunger portion 60 extends downward from the barrel portion 50. The lower end portion 60a of the extending plunger portion 60 can be paraphrased as the tip portion 20a of the probe 20 in contact with the semiconductor wafer 14.

The plunger portion 60 includes a plunger tip portion 61, a plunger main body portion 62, and a plunger base end portion 63.

The plunger tip portion 61 is a portion extending from the barrel portion 50. The outer diameter of the plunger tip portion 61 is set smaller than the outer diameter of the barrel portion 50.

The plunger tip portion 61 is located at the lowermost position in the vertical direction Z in the plunger portion 60. The plunger tip portion 61 comes into contact with the semiconductor wafer 14 during an electrical inspection of the semiconductor wafer 14.

As a result, the plunger tip portion 61 is electrically connected to the semiconductor wafer 14 on the semiconductor wafer 14 side of the spring portions 52 and 54. The plunger tip portion 61 constitutes the second connection portion described in the claims.

The plunger body portion 62 electrically connects the plunger tip portion 61 and the plunger base end portion 63. The plunger body portion 62 is located between the plunger tip portion 61 and the plunger base end portion 63. The plunger body portion 62 connects the plunger tip portion 61 and the plunger base end portion 63. The outer diameter of the plunger body portion 62 is set smaller than the inner diameter of the barrel portion 50.

Further, the plunger main body portion 62 has a recess formed at a predetermined position CB in the vertical direction Z, and is fixed to the barrel portion 50 at the recess by joining. The joining method includes, for example, a method of joining by caulking, but may be joined by resistance welding (spot welding), laser welding, or the like. The plunger tip portion 61 constitutes the third connection portion described in the claims.

The plunger base end portion 63 is located at the uppermost position in the vertical direction Z in the plunger portion 60. The outer diameter of the plunger base end portion 63 is set to be equivalent to the inner diameter of the barrel portion 50. Further, the plunger base end portion 63 is electrically connected to the probe substrate 16 on the probe substrate 16 side of the spring portions 52 and 54.

Here, FIG. 6 shows a partially enlarged cross-sectional view of the A1 region in FIG. As shown in FIG. 6, the surface 63a of the plunger base end portion 63 comes into contact with the inner surface 55x of the non-spring portion 55 of the barrel portion 50. As a result, the plunger base end portion 63 is electrically connected to the non-spring portion 55 and is electrically connected to the probe substrate 16 via the non-spring portion 55.

When the spring portions 52 and 54 expand and contract, the plunger base end portion 63 slides on the inner surface 55x of the non-spring portion 55 and is electrically connected to the probe substrate 16 via the non-spring portion 55. ..

The plunger base end portion 63 is arranged so as not to come into contact with the spring portion 54 even if the spring portions 52 and 54 expand and contract. The plunger base end portion 63 constitutes the first connection portion described in the claims.

The insulating portion 70 electrically insulates a part of the barrel portion 50 and the plunger portion 60. The insulating portion 70 is made of, for example, a member having an insulating property such as a resin.

The insulating portion 70 is formed on the surface of the plunger portion 60. Specifically, the insulating portion 70 is formed on the surface 62a of the plunger main body portion 62.

Further, the insulating portion 70 is arranged from the upper end portion 54a of the spring portion 54 of the barrel portion 50 on the probe substrate 16 side to the lower end portion 50a of the barrel portion 50 on the semiconductor wafer 14 side at least in the vertical direction Z.

The upper end portion of the insulating portion 70 may be located above the upper end portion 54a of the spring portion 54 as long as it does not cover the surface 63a of the plunger base end portion 63. Further, the lower end portion of the insulating portion 70 may be located below the lower end portion 50a of the barrel portion 50 as long as it does not cover the lower end portion of the plunger tip portion 61 (the lower end portion 60a of the plunger portion 60). ..

Further, the thickness of the insulating portion 70 may be arbitrarily set. The thickness of the insulating portion 70 is not particularly limited as long as the function of insulating the plunger main body portion 62 and the barrel portion 50 can be exhibited without hindering the sliding of the plunger main body portion 62 and the barrel portion 50.

By arranging the insulating portion 70 as described above, the electrical contact between the plunger portion 60 and the barrel portion 50 is only the contact between the plunger base end portion 63 and the non-spring portion 55.

<Action and effect>
As described above, the probe 20 according to the first embodiment of the present invention includes a barrel portion 50, a plunger portion 60, and an insulating portion 70. The barrel portion 50 includes spring portions 52, 54 and non-spring portions 51, 53, 55, and the plunger portion 60 includes a plunger tip portion 61, a plunger main body portion 62, and a plunger base end portion 63. And.

The plunger tip portion 61 is electrically connected to the semiconductor wafer 14 on the semiconductor wafer 14 (second contact target) side of the spring portions 52 and 54. Further, the plunger base end portion 63 is electrically connected to the probe substrate 16 on the probe substrate 16 (first contact target) side of the spring portions 52 and 54.

Here, FIG. 7A shows a cross-sectional view for explaining the current path CR flowing through the probe 20, and FIG. 7B shows the relationship between the current path CR of the probe 20 and the resistor. A circuit diagram showing the above is shown.

As shown in FIG. 7A, the current path CR of the probe 20 is divided into sections C1 to C3. The section C1 is a section from the upper end portion 50b of the barrel portion 50 (base end portion 20b of the probe 20) to the contact point between the barrel portion 50 and the plunger base end portion 63. The section C2 is a section from the contact point between the barrel portion 50 and the plunger base end portion 63 to the lower end portion 50a of the barrel portion 50. The section C3 is a section from the lower end portion 50a of the barrel portion 50 to the lower end portion 60a of the plunger portion 60 (the tip end portion 20a of the probe 20).

Further, as shown in FIG. 7B, the resistance value of the non-spring portion 55 of the barrel portion 50 arranged in the section C1 is set to “R1”, and the plunger base end of the plunger portion 60 arranged in the section C2. When the resistance value of the portion 63 and the plunger main body portion 62 is "R3" and the resistance value of the plunger tip portion 61 arranged in the section C3 is "R4", the combined resistance value in the current path CR is "R1 + R3 + R4". ".

Further, the insulating portion 70 is arranged from the upper end portion 54a of the spring portion 54 of the barrel portion 50 on the probe substrate 16 side to the lower end portion 50a of the barrel portion 50 on the semiconductor wafer 14 side at least in the vertical direction Z. As a result, in the section C2, “R2”, which is the resistance value of the spring portions 52, 54 and the non-spring portions 51, 53 of the barrel portion 50, exists, but as shown in FIG. 7B, “R2” Is no longer included in the current path CR.

In this way, the current flowing through the probe 20 from the probe substrate 16 toward the semiconductor wafer 14 is a current path via the plunger base end portion 63 of the plunger portion 60, the plunger main body portion 62, and the plunger tip portion 61. It flows through CR.

As a result, for example, even if the position of the plunger base end portion 63 in contact with the barrel portion 50 changes slightly, a current path CR that does not pass through the spring portions 52 and 54 of the barrel portion 50 is formed, so that the probe 20 The resistance value (combined resistance value) is stable.

That is, according to the probe 20 according to the first embodiment of the present invention, it is possible to suppress the variation in the resistance value of the probe 20 in each of the plurality of probes 20 and stabilize the resistance value of the probe 20.

Further, since the current path CR of the probe 20 is configured without passing through the spring portions 52 and 54 having a large resistance value, the resistance value of the probe 20 (as compared with the case where the probe 20 is configured via the spring portions 52 and 54). Combined resistance value) can be reduced.

Further, as one of the indexes for evaluating the performance of the probe having the spring portion, there is a probe allowable current value that can be passed through the probe. The probe allowable current value is measured as follows.

Specifically, a current is passed through the probe compressed so as to exert a predetermined pressing force (initial value) while increasing the specified current value (for example, 25 mA) every 2 minutes. Further, when a current is passed through the probe, Joule heat is generated by the current flowing through the probe, and the spring portion is deteriorated (so-called sagging) due to this Joule heat. Therefore, the larger the current value, the more the probe The pressing pressure decreases. Then, the current value flowing through the probe is measured when the pressing force of the probe is reduced by a specified ratio (for example, 20%) from the initial value. The current value measured in this way becomes the probe allowable current value. As the method for measuring the allowable probe current described above, the method specified in ISMI Probe Council Currant Carrying Capability Measurement Guideline (July 30, 2009 edition, “Chapter 5 Method”) may be applied.

In the probe 20 according to the first embodiment of the present invention, the current flowing through the probe 20 flows through the plunger portion 60 without passing through the spring portions 52 and 54, so that even if the current flowing through the probe 20 increases. , The spring portions 52 and 54 are less likely to deteriorate. This also makes it possible to improve the allowable probe current value that can be passed through the probe 20.

In the probe 20 according to the first embodiment described above, the outer diameter of the plunger base end portion 63 of the plunger portion 60 is increased so that the probe 20 is in contact with the inner surface 55x of the non-spring portion 55 of the barrel portion 50. , Not limited to this. For example, as shown in FIG. 8, after inserting the plunger portion 60 into the barrel portion 50, the inner diameter of the non-spring portion 55 is narrowed by processing such as caulking at a predetermined position CY of the non-spring portion 55 of the barrel portion 50. You may. In this case, it should be noted that the inner diameter of the non-spring portion 55 is narrowed so that the non-spring portion 55 and the plunger base end portion 63 can slide.

By narrowing the inner diameter of the non-spring portion 55 in this way, it is not necessary to increase the outer diameter of the plunger base end portion 63 of the plunger portion 60. As a result, the plunger portion 60 can be easily inserted into the barrel portion 50, and the probe 20 can be easily assembled.

[Modification 1]
Next, a modification 1 of the probe 20 according to the first embodiment of the present invention will be described focusing on the difference from the first embodiment.

Here, the probe 20 according to the first modification is mainly different from the probe 20 according to the first embodiment in the configuration of the plunger section 60. Therefore, the configuration of the plunger unit 60 according to the first modification will be described.

FIG. 9A is a cross-sectional view schematically showing the probe 20 according to the modified example 1, and FIG. 9B is a perspective view schematically showing the plunger portion 60 according to the modified example 1.

As shown in FIGS. 9A to 9B, the plunger portion 60 according to the modification 1 includes a plunger tip portion 161, a plunger main body portion 162, and a plunger base end portion 163.

The plunger tip portion 161 is located at the lowermost position in the vertical direction Z in the plunger portion 60. The plunger tip portion 161 projects toward the semiconductor wafer 14 from the barrel portion 50, and comes into contact with the semiconductor wafer 14 on the semiconductor wafer 14 side from the barrel portion 50. The plunger tip portion 161 comes into contact with the semiconductor wafer 14 and is electrically connected to the semiconductor wafer 14 during the electrical inspection of the semiconductor wafer 14. The plunger tip portion 161 has substantially the same configuration as the plunger tip portion 61 according to the first embodiment. The plunger tip portion 161 constitutes the second connection portion described in the claims.

The plunger body portion 162 is located between the plunger tip portion 161 and the plunger base end portion 163. The plunger body portion 162 is connected to the plunger tip portion 161. Further, the plunger body portion 162 is slidable in the vertical direction Z while being in contact with the plunger base end portion 163.

Specifically, the plunger main body portion 162 is partially provided with a semi-cylindrical portion 162x, and the flat surface 162a of the semi-cylindrical portion 162x slides while being in contact with the plunger base end portion 163. The plunger body portion 162 constitutes the third connection portion described in the claims.

The plunger base end portion 163 is located at the uppermost position in the vertical direction Z in the plunger portion 60. The plunger base end portion 163 contacts the probe substrate 16 on the probe substrate 16 side of the barrel portion 50. Specifically, a part of the plunger base end portion 163 is inserted into the barrel portion 50, and the other portion extends from the barrel portion 50 toward the probe substrate 16.

The upper end portion 163b of the plunger base end portion 163 extending from the barrel portion 50 contacts the probe substrate 16 and is electrically connected to the probe substrate 16. The upper end portion 163b of the plunger base end portion 163 can be paraphrased as the base end portion 20b of the probe 20. The plunger base end portion 163 constitutes the first connection portion described in the claims.

Further, the plunger base end portion 163 is fixed to the barrel portion 50 at the insertion portion. For example, the plunger base end portion 163 is fixed to the barrel portion 50 by joining at a predetermined position CT of the insertion portion. Examples of the joining method include resistance welding (spot welding), laser welding, and caulking.

Further, the plunger base end portion 163 includes a semi-cylindrical portion 163x at the insertion portion, and the flat surface 163a of the semi-cylindrical portion 163x is electrically connected to the plunger main body portion 162.

Specifically, the flat surface 163a of the semi-cylindrical portion 163x of the plunger base end portion 163 comes into contact with the flat surface 162a of the semi-cylindrical portion 162x of the plunger main body portion 162. As a result, the plunger base end portion 163 and the plunger body portion 162 are electrically connected. Further, the flat surface 163a of the plunger base end portion 163 slides on the flat surface 162a of the plunger main body portion 162 when the spring portions 52 and 54 expand and contract, and the plunger base end portion 163 and the plunger main body portion 162 slide. An electrical connection with is maintained.

Further, as in the first embodiment, in the probe 20 according to the first modification, the insulating portion 70 has a barrel portion from the upper end portion 54a of the spring portion 54 of the barrel portion 50 on the probe substrate 16 side at least in the vertical direction Z. The 50 semiconductor wafers are arranged over the lower end portion 50a on the 14 side. Specifically, as shown in FIGS. 9A to 9B, the insulating portion 70 is formed on a part of the surface of the plunger base end portion 163 and a part of the surface of the plunger main body portion 162. Plunger.

As described above, in the probe 20 according to the first modification, the plunger base end portion 163 of the plunger portion 60 is electrically connected to the probe substrate 16 by directly contacting the probe substrate 16. As a result, in the probe 20, a current path is formed from the probe substrate 16 to the semiconductor wafer 14 only through the plunger portion 60, so that the resistance value becomes more stable.

[Modification 2]
Next, the second modification of the probe 20 according to the first embodiment of the present invention will be described focusing on the differences from the first embodiment.

Here, the probe 20 according to the second modification is mainly different from the probe 20 according to the first embodiment in the configuration of the plunger section 60. Therefore, the configuration of the plunger unit 60 according to the second modification will be described.

10 (a) is a cross-sectional view schematically showing the probe 20 according to the modified example 2, and FIG. 10 (b) is a perspective view schematically showing the plunger portion 60 according to the modified example 2.

As shown in FIGS. 10A to 10B, the plunger portion 60 according to the modified example 2 includes a plunger tip portion 261, a plunger main body portion 262, and a plunger base end portion 263.

The plunger tip portion 261 is located at the lowermost position in the vertical direction Z in the plunger portion 60. The plunger tip portion 261 protrudes from the barrel portion 50 toward the semiconductor wafer 14, and comes into contact with the semiconductor wafer 14 on the semiconductor wafer 14 side from the barrel portion 50. The plunger tip portion 261 comes into contact with the semiconductor wafer 14 and is electrically connected to the semiconductor wafer 14 during the electrical inspection of the semiconductor wafer 14. The plunger tip portion 261 has substantially the same configuration as the plunger tip portion 61 according to the first embodiment. The plunger tip portion 261 constitutes the second connection portion described in the claims.

The plunger body portion 262 is located between the plunger tip portion 261 and the plunger base end portion 263. The plunger body portion 262 is connected to the plunger tip portion 261. Further, the plunger main body portion 262 is slidable in the vertical direction Z while being in contact with the plunger base end portion 263.

Specifically, the plunger main body portion 262 includes an insertion hole 262x extending downward from the upper end portion in the vertical direction Z, and the inner surface 262a of the insertion hole 262x is in contact with the plunger base end portion 263 in the vertical direction. It is slidable to Z. The plunger body portion 262 constitutes the third connection portion described in the claims.

The plunger base end portion 263 is located at the uppermost position in the vertical direction Z in the plunger portion 60. The plunger base end portion 263 contacts the probe substrate 16 on the probe substrate 16 side of the barrel portion 50. Specifically, a part of the plunger base end portion 263 is inserted into the barrel portion 50, and the other portion extends from the barrel portion 50 toward the probe substrate 16.

The upper end portion 263b of the plunger base end portion 263 extending from the barrel portion 50 contacts the probe substrate 16 and is electrically connected to the probe substrate 16. The upper end portion 263b of the plunger base end portion 263 can be paraphrased as the base end portion 20b of the probe 20. The plunger base end portion 263 constitutes the first connection portion described in the claims.

Further, the plunger base end portion 263 is fixed to the barrel portion 50 at the insertion portion. For example, the plunger base end portion 263 is fixed to the barrel portion 50 by joining at a predetermined position CT of the insertion portion. Examples of the joining method include resistance welding (spot welding), laser welding, and caulking.

Further, the plunger base end portion 263 includes a columnar rod-shaped portion 263x that is inserted into the insertion hole 262x of the plunger main body portion 262 at the insertion portion. The outer diameter of the rod-shaped portion 263x of the plunger base end portion 263 is set to be equivalent to the inner diameter of the insertion hole 262x of the plunger main body portion 262.

When the rod-shaped portion 263x of the plunger base end portion 263 is inserted into the insertion hole 262x of the plunger body portion 262, the surface 263a of the rod-shaped portion 263x comes into contact with the plunger body portion 262. As a result, the plunger base end portion 263 and the plunger body portion 262 are electrically connected.

The rod-shaped portion 263x of the plunger base end portion 263 slides in the insertion hole 262x of the plunger body portion 262 when the spring portions 52 and 54 expand and contract, and the plunger base end portion 263 and the plunger body portion 262 The electrical connection is maintained.

Further, as in the first embodiment, in the probe 20 according to the second modification, the insulating portion 70 has a barrel portion from the upper end portion 54a of the spring portion 54 of the barrel portion 50 on the probe substrate 16 side at least in the vertical direction Z. The 50 semiconductor wafers are arranged over the lower end portion 50a on the 14 side. Specifically, as shown in FIGS. 10A to 10B, the insulating portion 70 is formed on the surface of the plunger main body portion 262.

As described above, in the probe 20 according to the second modification, the plunger base end portion 263 of the plunger portion 60 is electrically connected to the probe substrate 16 by directly contacting the probe substrate 16. As a result, in the probe 20, a current path is formed from the probe substrate 16 to the semiconductor wafer 14 only through the plunger portion 60, so that the resistance value becomes more stable.

[Other Embodiments of the present invention]
Although the present invention has been described in detail using the above-described embodiments, it is clear to those skilled in the art that the present invention is not limited to the embodiments described in the present specification.

For example, in the probe 20 according to the above-described embodiment, the insulating portion 70 is formed on the surface of the plunger portion 60, but it may be formed on the inner surface of the barrel portion 50. That is, the insulating portion 70 is arranged so that the insulating portion 70 extends from the upper end portion 54a of the spring portion 54 of the barrel portion 50 on the probe substrate 16 side to the lower end portion 50a of the barrel portion 50 on the semiconductor wafer 14 side at least in the vertical direction Z. If so, it may be formed on the barrel portion 50.

As described above, the present invention is not limited to the above-described embodiment as it is, and at the implementation stage, the components can be modified and embodied without departing from the gist thereof. In addition, various inventions can be formed by an appropriate combination of the plurality of components disclosed in the above-described embodiment. For example, some components may be removed from all the components shown in the embodiments.

1 ... Inspection device 2 ... Card-shaped connecting device 12 ... Chuck 14 ... Semiconductor wafer 14a ... Electrode pad 16 ... Probe substrate 18 ... Probe support 20 ... Probe 20a ... Tip portion 20b ... Base end portion 31 ... Upper guide plate 32 ... Lower Guide plate 33 ... Intermediate guide plate 50 ... Barrel portion 50a ... Lower end portion 50b ... Upper end portion 51, 53, 55 ... Non-spring portion 52, 54 ... Spring portion 54a ... Upper end portion 60 ... Plunger portion 61 ... Plunger tip portion 62 ... Plunger body 63 ... Plunger base end 70 ... Insulation

Claims (2)

A probe that electrically connects the first contact object and the second contact object.
A tubular barrel made of conductive members that extends in the vertical direction,
A plunger portion made of a conductive member, a part of which is inserted into the barrel portion and electrically connected to the barrel portion,
An insulating portion that electrically insulates the barrel portion and a part of the plunger portion is provided.
The barrel portion includes a spring portion that exerts a spring function in the vertical direction.
The plunger portion includes a first connection portion that electrically connects to the first contact target on the first contact target side of the spring portion, and the second contact target on the second contact target side of the spring portion. A second connection portion that electrically connects to the first connection portion and a third connection portion that electrically connects the first connection portion and the second connection portion are provided.
The insulating portion is arranged in the vertical direction from the end of the spring portion of the barrel portion on the first contact target side to the end of the barrel portion on the second contact target side .
In the plunger section
The first connecting portion contacts the first contact target on the first contact target side of the barrel portion.
The second connecting portion contacts the second contact target on the second contact target side of the barrel portion.
The third connecting portion is connected to the second connecting portion and is slidable in the vertical direction while being in contact with the first connecting portion. probe. An electrical connection device including a probe that electrically connects a first contact object and a second contact object.
The probe
A tubular barrel made of conductive members that extends in the vertical direction,
A plunger portion made of a conductive member, a part of which is inserted into the barrel portion and electrically connected to the barrel portion,
An insulating portion that electrically insulates the barrel portion and a part of the plunger portion is provided.
The barrel portion includes a spring portion that exerts a spring function in the vertical direction.
The plunger portion includes a first connection portion that electrically connects to the first contact target on the first contact target side of the spring portion, and the second contact target on the second contact target side of the spring portion. A second connection portion that electrically connects to the first connection portion and a third connection portion that electrically connects the first connection portion and the second connection portion are provided.
The insulating portion is arranged in the vertical direction from the end of the spring portion of the barrel portion on the first contact target side to the end of the barrel portion on the second contact target side .
In the plunger section
The first connecting portion contacts the first contact target on the first contact target side of the barrel portion.
The second connection portion comes into contact with the second contact target on the second contact target side of the barrel portion.
The third connecting portion is connected to the second connecting portion and is slidable in the vertical direction while being in contact with the first connecting portion. Electrical connection device.

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