JP6750711B2 - Vibrating element, vibrator, oscillator, real-time clock, electronic device, and mobile unit - Google Patents

Description

The present invention relates to a resonator element manufacturing method, a resonator element, a vibrator, an oscillator, a real-time clock, an electronic device, and a moving body.

In small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems, electronic devices such as oscillators and oscillators are used. Widely used.

As the above-described vibrator and oscillator, there is known one in which a resonator element is housed in a package. Such a vibrating piece has, for example, a base portion, a pair of vibrating arms extending from the base portion, and a support arm extending from the base portion and positioned between the pair of vibrating arms. Each vibrating arm is provided with two drive electrodes for driving the vibrating arm, and each drive electrode is one of two electrode pads of different polarities provided on one main surface of the supporting arm. And is electrically connected. Such a vibrating piece is fixed to the package at the two electrode pads via a conductive joining member. The drive electrode and the electrode pad are formed by patterning the metal layer by photolithography and etching.

In the vibrating piece as described above, the resist layer provided on the surface of the metal layer cannot be exposed on the side surface of the support arm, and the metal layer may not be patterned. Therefore, when the resonator element is fixed to the package, the metal layer (the metal layer that cannot be patterned) provided on the side surface of the support arm around the electrode pad and the conductive bonding member come into contact with each other, and the two electrode pads are electrically connected to each other. May be short circuited.

For example, Patent Document 1 describes that a notch is formed on a side surface of a support arm in order to prevent an electrical short circuit between two electrode pads.

JP, 2014-22965, A

However, in the vibrating piece as described above, particularly, the side surface on the −X axis direction side of the support arm (the side surface on the −X axis direction side of the X axis as the electric axis that is the crystal axis of the crystal) is the main side of the support arm. It is difficult to tilt with respect to the surface (it tends to be perpendicular to the main surface), and the metal layer in the cutout portion may not be sufficiently removed.

An object of some aspects of the present invention is to provide a method of manufacturing a resonator element that can reduce the possibility that two electrode pads are electrically short-circuited. Further, one of the objects according to some aspects of the present invention is a vibrating piece that can reduce the possibility that two electrode pads are electrically short-circuited, and a vibrator including the vibrating piece. It is to provide an oscillator, a real-time clock, an electronic device, and a mobile body.

The present invention has been made to solve at least a part of the problems described above, and can be realized as the following aspects or application examples.

[Application example 1]
The manufacturing method of the resonator element according to this application example,
The piezoelectric substrate is etched to form a base portion, a pair of vibrating arms extending from the base portion along a first direction and aligned along a second direction intersecting the first direction, and the base portion in the first direction. A step of forming a support arm provided along the pair of vibrating arms extending along
Etching the support arm to form a notch on a side surface of the support arm that intersects the second direction;
Depositing a metal layer on the surfaces of the base, the vibrating arm, and the supporting arm;
A step of applying a resist layer on the surface of the metal layer,
Exposing the resist layer,
Developing the exposed resist layer,
Etching the metal layer using the developed resist layer as a mask,
In the step of exposing the resist layer,
Irradiating light from a direction inclined with respect to the vertical line of the main surface of the supporting arm, obliquely exposing the resist layer in the cutout portion,
In the step of etching the metal layer,
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, located on the first direction side with respect to the cutout portion, and electrically connected to the first drive electrode;
A second electrode pad that is provided on the main surface, is located on the side opposite to the first direction with respect to the cutout portion, and is electrically connected to the second drive electrode.

In such a vibrating reed manufacturing method, it is possible to reduce the possibility that the two electrode pads are electrically short-circuited.

[Application example 2]
In the method for manufacturing a resonator element according to this application example,
In the step of exposing the resist layer,
The oblique exposure may be performed from a direction inclined by a predetermined angle in the first direction or the direction opposite to the first direction from a third direction orthogonal to the first direction and the second direction.

In such a method of manufacturing the vibrating piece, the resist layer can be exposed without the light for exposure being blocked by the vibrating arm.

[Application example 3]
In the method for manufacturing a resonator element according to this application example,
The predetermined angle may be greater than 0° and less than 50°.

According to such a method of manufacturing the resonator element, the light for exposure can be more reliably irradiated to the second gist layer 84 in the cutout portion.

[Application example 4]
In the method for manufacturing a resonator element according to this application example,
The piezoelectric substrate is made of crystal,
The first direction is
The electric axis, which is the crystal axis of the crystal, is the X axis, the mechanical axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis.
The Y axis is rotated so that the +Y side is tilted to the + side of the Z axis to form the Y′ axis,
When the Z axis is rotated so that the +Z side is tilted to the − side of the Y axis to form the Z′ axis,
The first direction is the −Y′ direction of the Y′ axis,
The second direction may be the -X direction of the X axis.

According to such a method of manufacturing a resonator element, the surface of the cutout portion can be inclined with respect to the Z′ axis, and the resist layer in the cutout portion can be exposed more reliably.

[Application example 5]
In the method for manufacturing a resonator element according to this application example,
The step of forming the cutout portion may be performed by wet etching.

In such a method of manufacturing a resonator element, the surface of the cutout portion can be inclined with respect to the Z′ axis.

[Application example 6]
In the method for manufacturing a resonator element according to this application example,
In the step of forming the cutout portion,
The cutout is
A first surface which is a surface parallel to the side surface and which is located on the side opposite to the second direction from the side surface;
A second surface inclined to the first surface and connected to the first surface and the side surface;
And a third surface that is located on the first direction side with respect to the second surface and that is inclined with respect to the first surface and that is connected to the first surface and the side surface,
The width of the second surface becomes smaller in the third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The width of the third surface may increase in the third direction as the width increases in the first direction.

With such a method of manufacturing a resonator element, it is possible to reduce the possibility that two electrode pads are electrically short-circuited.

[Application example 7]
In the method for manufacturing a resonator element according to this application example,
Including the step of etching the vibrating arm to form a groove,
The step of forming the groove and the step of forming the cutout may be performed in the same step.

In such a vibrating reed manufacturing method, the steps can be shortened as compared with the case where the step of forming the groove and the step of forming the notch are performed in separate steps.

[Application example 8]
The resonator element according to this application example is
The base,
A pair of vibrating arms extending from the base along the first direction and arranged in a second direction intersecting the first direction;
A support arm extending from the base along the first direction and provided between the pair of vibrating arms;
A cutout portion provided on a side surface of the support arm that intersects a second direction orthogonal to the first direction,
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, located on the first direction side with respect to the cutout portion, and electrically connected to the first drive electrode;
A second electrode pad that is provided on the main surface, is located on the side opposite to the first direction with respect to the cutout portion, and is electrically connected to the second drive electrode;
The cutout is
A first surface which is a surface parallel to the side surface and which is located on the side opposite to the second direction from the side surface;
A second surface inclined to the first surface and connected to the first surface and the side surface;
A third surface located on the first direction side with respect to the second surface, inclined with respect to the first surface, and connected to the first surface and the side surface;
The width of the second surface becomes smaller in the third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The width of the third surface in the third direction increases as it goes in the first direction.

With such a resonator element, it is possible to reduce the possibility that the two electrode pads are electrically short-circuited.

[Application example 9]
In the resonator element according to this application example,
The support arm is made of crystal,
The electric axis, which is the crystal axis of the crystal, is the X axis, the mechanical axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis.
The Y axis is rotated so that the +Y side is tilted to the + side of the Z axis to form the Y′ axis,
When the Z axis is rotated so that the +Z side is tilted to the − side of the Y axis to form the Z′ axis,
The first direction is the −Y′ direction of the Y′ axis,
The second direction may be the -X direction of the X axis.

With such a resonator element, it is possible to reduce the possibility that the two electrode pads are electrically short-circuited.

[Application Example 10]
In the resonator element according to this application example,
The vibrating arm may include an arm portion connected to the base portion and a weight portion connected to the arm portion.

With such a vibrating piece, thermoelastic loss can be reduced.

[Application example 11]
In the resonator element according to this application example,
The width of the weight may be larger than the width of the arm.

With such a vibrating piece, thermoelastic loss can be reduced.

[Application Example 12]
In the resonator element according to this application example,
A groove may be provided in the vibrating arm.

With such a vibrating piece, it is possible to suppress diffusion (heat conduction) of heat generated by bending vibration, and it is possible to reduce thermoelastic loss.

[Application example 13]
The vibrator according to this application example is
A resonator element according to this application example,
A package in which the vibrating piece is housed.

Since such a vibrator includes the resonator element according to this application example, it can have good electrical characteristics.

[Application Example 14]
The oscillator according to this application example,
A resonator element according to this application example,
An oscillating circuit electrically connected to the resonator element.

Since such an oscillator includes the resonator element according to this application example, it can have good electrical characteristics.

[Application example 15]
The real-time clock according to this application example is
A resonator element according to this application example,
An oscillation circuit electrically connected to the resonator element,
A clock circuit that generates date and time data based on a signal output from the oscillator circuit.

Since such a real-time clock includes the resonator element according to this application example, it can have good electrical characteristics.

[Application example 16]
The electronic device according to this application example,
The resonator element according to this application example is provided.

Since such an electronic device includes the resonator element according to this application example, it can have good electrical characteristics.

[Application example 17]
The moving body according to this application example is
The resonator element according to this application example is provided.

Since such a moving body includes the resonator element according to this application example, it can have good electric characteristics.

The top view which shows the resonator element which concerns on this embodiment typically. The top view which shows the resonator element which concerns on this embodiment typically. Sectional drawing which shows the resonator element which concerns on this embodiment typically. The perspective view which shows the resonator element which concerns on this embodiment typically. The side view which shows the resonator element which concerns on this embodiment typically. 5 is a flowchart for explaining the method of manufacturing the resonator element according to the embodiment. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. Sectional drawing which shows the manufacturing process of the resonator element which concerns on this embodiment typically. The perspective view which shows typically the manufacturing process of the resonator element which concerns on this embodiment. The top view which shows typically the resonator element which concerns on the 1st modification of this embodiment. The top view which shows typically the resonator element which concerns on the 2nd modification of this embodiment. Sectional drawing which shows typically the resonator element which concerns on the 3rd modification of this embodiment. FIG. 3 is a plan view schematically showing the vibrator according to the present embodiment. Sectional drawing which shows the vibrator|oscillator which concerns on this embodiment typically. Sectional drawing which shows the oscillator which concerns on this embodiment typically. The functional block diagram of the real-time clock which concerns on this embodiment. The top view which shows the electronic device which concerns on this embodiment typically. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The top view which shows the mobile body which concerns on this embodiment typically.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the content of the invention described in the claims. Further, not all of the configurations described below are essential configuration requirements of the invention.

1. Vibrating Piece First, the vibrating piece according to the present embodiment will be described with reference to the drawings. 1 and 2 are plan views schematically showing the resonator element 100 according to the present embodiment. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1 schematically showing the resonator element 100 according to the present embodiment.

In addition, in FIGS. 1 to 3 and FIGS. 4, 5, and 7 to 17 shown below, an X axis, a Y′ axis, and a Z′ axis are illustrated as three axes orthogonal to each other. Here, when the electric axis, which is the crystal axis of crystal, is the X axis, the mechanical axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis, the Y′ axis is the Y axis and the +Y side is the Y axis. The Z′ axis is an axis that is rotated so as to be tilted to the + side of the Z axis, and the Z′ axis is an axis that is rotated so that the +Z side is tilted to the − side of the Y axis. In addition, from the viewpoint of reducing the change in the resonance frequency due to the change in temperature, the inclination of the rotation is performed in the range of -5 degrees to 15 degrees.

As shown in FIGS. 1 to 3, the resonator element 100 includes a quartz substrate (piezoelectric substrate) 101 having main surfaces (main surfaces having a front-back relationship with each other) 101a and 101b orthogonal to the Z′ axis. Note that FIG. 1 is a view of the vibrating piece 100 as viewed from the main surface 101a side, and is a diagram for explaining the configuration of the vibrating piece 100 on the main surface 101a side. FIG. 2 is a view of the vibrating piece 100 seen through from the main surface 101a side, and is a diagram for explaining the configuration of the vibrating piece 100 on the main surface 101b side.

As shown in FIGS. 1 to 3, the vibrating piece 100 includes a base portion 10, a pair of vibrating arms 20a and 20b, a supporting arm 30, a cutout portion 40, drive electrodes 50a and 50b, and extraction electrodes 52a and 52a. 52b, electrode pads 54a and 54b, and conductive layers 60 and 62. The base 10, the vibrating arms 20a and 20b, and the support arm 30 form a crystal substrate 101.

The base 10 has a substantially flat plate shape. The length of the base 10 along the Y′-axis direction is, for example, 50 μm or more and 300 μm or less.

The vibrating arms 20a and 20b are arranged side by side and extend from the base 10 along the −Y′ axis direction (first direction, −Y′ direction of Y′ axis). The vibrating pieces 20a and 20b are arranged side by side along the X-axis direction (direction intersecting with the first direction). In the illustrated example, the first vibrating arm 20a is provided on the +X axis direction side of the support arm 30, and the second vibrating arm 20b is provided on the −X axis direction side of the support arm 30. The vibrating arms 20 a and 20 b have an arm portion 22 connected to the base portion 10 and a weight portion 24 connected to the arm portion 22.

A bottomed groove portion 23 is provided on the main surfaces 101a and 101b of the arm portions 22 of the vibrating arms 20a and 20b. The groove portion 23 extends along the Y′ axis in plan view (as viewed from the Z′ axis direction). In the illustrated example, the tip of the groove 23 is located at the boundary between the arm 22 and the weight 24, and the base end of the groove 23 is located at the boundary between the base 10 and the arm 22. As shown in FIG. 3, the arm portion 22 has a substantially H-shaped cross-sectional shape. The distance W between the groove 23 and the side surfaces 22a, 22b (inner side surface 22a, outer side surface 22b) of the vibrating arms 20a, 20b is preferably 6 μm or less. Further, when the maximum depth of the groove portion 23 is t and the thickness of the vibrating arms 20a and 20b (length along the Z′ axis direction) is T, η represented by 2t/T is 0.6 or more. Preferably. As a result, the equivalent series resistance and the CI (Crystal Impedance) value of the resonator element 100 can be reduced, and the power consumption can be reduced. In the example shown in FIG. 3, the side surfaces 22a and 22b are inclined with respect to the main surfaces 101a and 101b, but may be vertical.

The length of the groove 23 along the Y′-axis direction is not particularly limited. For example, the groove portion 23 may be provided on the weight portion 24 or the base portion 10.

The weight portions 24 of the vibrating arms 20a and 20b have a substantially flat plate shape, as shown in FIGS. In the illustrated example, the width W1 of the weight portion 24 along the X-axis direction is larger than the width W2 of the arm portion 22 along the X-axis direction. The ratio of the width W2 to the width W1 (W1/W2) is 2 or more and 10 or less, and preferably 5 or more and 7 or less. This reduces thermoelastic loss (loss of vibration energy caused by heat conduction generated between the compression portion and the extension portion of the vibrating resonating member) and suppresses vibration leakage due to twisting of the weight portion. be able to.

The width W1 of the weight portion 24 of the vibrating arms 20a and 20b is, for example, 100 μm or more and 400 μm or less. The length of the weight portion 24 along the Y′-axis direction is, for example, 50 μm or more and 600 μm or less. The distance between the weight portion 24 of the first vibrating arm 20a and the weight portion 24 of the second vibrating arm 20b is, for example, 20 μm or more and 200 μm or less. The width W2 of the arm portion 22 is, for example, 20 μm or more and 50 μm or less. The length of the arm portion 22 along the Y′-axis direction is, for example, 300 μm or more and 1000 μm or less.

The shape of the weight portion according to the present invention is not particularly limited as long as the weight per unit length is larger than that of the arm portion. For example, the weight portion has the same width as the width of the arm portion, and may have a shape thicker than the arm portion. Further, the weight portion may be configured by forming a surface of the vibrating arm corresponding to the weight portion or forming a concave portion and providing a metal such as gold on the concave portion. Further, the weight portion may be made of a substance having a mass density higher than that of the arm portion. That is, when the mass per unit length (length in the Y′-axis direction) in the arm portion and the weight portion is Ma and Mb, respectively, the relation of Ma<Mb is satisfied in all the arm portions or all the weight portions. All you have to do is satisfy.

The support arm 30 is provided between the pair of vibrating arms 20a and 20b. The support arm 30 extends along the -Y'-axis direction from the side surface 10a on the -Y'-axis direction side of the base 10 (which faces the -Y'-axis direction in plan view). The length of the support arm 30 in the Y′-axis direction is smaller than the length of the vibrating arms 20a and 20b in the Y′-axis direction. The tip of the support arm 30 is located closer to the base 10 than the tips of the vibrating arms 20a and 20b in a plan view. In the illustrated example, the support arm 30 is not provided between the weight portion 24 of the first vibrating arm 20a and the weight portion 24 of the second vibrating arm 20b.

The distance Lg between the support arm 30 and the weight portion 24 satisfies, for example, a relationship of T×50/130≦Lg≦200 μm when the thickness of the vibrating arms 20a and 20b is T (μm). Preferably, the relationship of T×70/130≦Lg≦100 μm is satisfied. When the distance Lg is smaller than T×50/130, the conductive bonding member (not shown) provided on the second electrode pad 44b and the drive electrodes 40a and 40b provided on the weight portion 24 come into contact with each other. There is. Furthermore, since the plane orthogonal to the Y′ axis in plan view is inclined with respect to the main surfaces 101a and 101b, when the distance Lg is smaller than T×50/130, the vibrating arms 20a and 20b and the supporting arms are wet-etched. When forming the outer shape of 30, the weight portion 24 and the support arm 30 may be connected to each other. If the distance Lg is larger than 200 μm, it may be difficult to reduce the size of the resonator element.

The distance between the support arm 30 and the arm portion 22 is, for example, 10 μm or more and 200 μm or less, and preferably 50 μm or more and 100 μm or less. When the distance between the support arm 30 and the arm portion 22 is smaller than 10 μm, the conductive joint members (not shown) provided on the electrode pads 54a and 54b come into contact with the arm portion 22 and the vibration of the arm portion 22 is disturbed. May be done. In particular, when a resin bump is used as the conductive joining member, the distance between the support arm 30 and the arm portion 22 is preferably 50 μm or more. If the distance between the support arm 30 and the arm portion 22 is larger than 200 μm, it may be difficult to reduce the size of the resonator element.

The support arm 30 has, for example, a narrowed portion 32 connected to the base portion 10 and a wide portion 34 connected to the narrowed portion 32. The constricted portion 32 is a portion that is provided between the base portion 10 and the wide portion 34 and has a width smaller than the width of the wide portion 34 along the X-axis direction. In the vibrating piece 100, the bending vibration mode of the same phase in the X-axis direction due to the constricted portion 32 (a bending vibration mode in which a pair of vibrating arms are simultaneously displaced in the +X axis direction and then displaced in the −X axis direction is repeated). Bending frequency of the opposite phase in the X-axis direction (one of the pair of vibrating arms is displaced in the +X-axis direction, the other is displaced in the -X-axis direction, and then one is displaced in the -X-axis direction). However, the other can be separated from the resonance frequency of the bending vibration mode in which the displacement in the +X axis direction is sequentially repeated. As a result, it is possible to suppress the coupling between the in-phase bending vibration mode and the anti-phase bending vibration mode, and reduce the mixture of the in-phase bending vibration mode and the in-phase bending vibration mode. Therefore, vibration leakage can be reduced.

The length of the constricted portion 32 of the support arm 30 along the Y′-axis direction is, for example, 50 μm or more and 500 μm or less. The minimum width (width along the X-axis direction) of the constricted portion 32 is 5 μm or more and 200 μm or less.

The wide portion 34 of the support arm 30 has a shape in which the notch 40 is provided in a rectangular shape in a plan view. The wide portion 34 has a side surface on the −X axis direction side (a surface facing the −X axis direction in a plan view) 34a and a side surface on the +X axis direction side (a surface facing the +X axis direction in a plan view) 34b. ing. In the example shown in FIG. 3, the side surfaces 34a and 34b are inclined with respect to the main surfaces 101a and 101b, but may be vertical.

The length of the wide portion 34 of the support arm 30 along the Y′-axis direction is, for example, 100 μm or more and 900 μm or less. The width (width along the X-axis direction) of the portion of the wide portion 34 where the cutout portion 40 is not provided is, for example, 30 μm or more and 300 μm or less.

The cutout portion 40 is provided on the side surface 34 a that intersects with the wide portion 34 in the −X axis direction (the second direction, the −X direction of the X axis) (specifically, is orthogonal to each other in a plan view). The side surface 34a is a surface on the −X axis direction side of the wide portion 34, and is a surface facing the −X axis direction in plan view. Here, FIG. 4 is a perspective view schematically showing the support arm 30 around the cutout portion 40. FIG. 5 is a side view schematically showing the support arm 30 around the cutout portion 40.

As shown in FIGS. 4 and 5, the cutout portion 40 includes a first surface 41, a second surface 42, a third surface 43, a fourth surface 44, a fifth surface 45, and a sixth surface 46. And a seventh surface 47. The surfaces 41 to 47 are inner surfaces of the cutout portion 40, and the cutout portion 40 is defined by the surfaces 41 to 47.

The first surface 41 of the cutout portion 40 is a surface parallel to the side surface 34a. The first surface 41 is located on the +X axis direction side of the side surface 34a. In the example shown in FIG. 3, the first surface 41 is inclined with respect to the main surfaces 101a and 101b, but may be vertical.

As shown in FIG. 4, the second surface 42 of the cutout portion 40 is inclined with respect to the first surface 41 and is connected to the first surface 41 and the side surface 34a. The width D1 of the second surface 42 in the Z′-axis direction (third direction) becomes smaller toward the −Y′-axis direction. An end 42a on the −Y′ axis direction side of the second surface 42 is configured by a line (a straight line parallel to the Z′ axis in the illustrated example). The second surface 42 is connected to the first surface 41 at the end 42a. The second surface 42 has, for example, a trapezoidal shape when viewed from the X-axis direction as shown in FIG.

The third surface 43 of the cutout portion 40 is located on the −Y′-axis direction side of the second surface 42. The third surface 43 is inclined with respect to the first surface 41 and is connected to the first surface 41 and the side surface 34a. The width D2 of the third surface 43 in the Z′-axis direction increases as it goes in the −Y′-axis direction. An end 43a of the third surface 43 on the +Y′ axis direction side is configured by a line (a straight line parallel to the Z′ axis in the illustrated example). The third surface 43 is connected to the first surface 41 at the end 43a. In the illustrated example, the end 43 a of the third surface 43 is parallel to the end 42 a of the second surface 42. The third surface 43 is separated from the second surface 42. The distance L1 between the end 42a and the end 43a is, for example, 5 μm or more and 20 μm or less. As shown in FIG. 5, the third surface 43 has, for example, a trapezoidal shape when viewed in the X-axis direction.

The fourth surface 44 and the fifth surface 45 of the cutout portion 40 are connected to the first surface 41 and the second surface 42. The fourth surface 44 is located on the +Z′-axis direction side of the fifth surface 45. The surfaces 44 and 45 have, for example, a triangular shape when viewed in the Z′-axis direction as shown in FIGS. 1 and 2.

The sixth surface 46 and the seventh surface 47 of the cutout portion 40 are connected to the first surface 41 and the third surface 43. The sixth surface 46 is located on the +Z′-axis direction side of the seventh surface 47. The surfaces 46 and 47 have, for example, a triangular shape when viewed in the Z′-axis direction as shown in FIGS. 1 and 2.

The length L2 of the cutout portion 40 along the Y′-axis direction is, for example, 50 μm or more and 200 μm or less. The length L3 of the cutout portion 40 along the X-axis direction is, for example, 5 μm or more and 50 μm or less.

The base portion 10 of the vibrating piece 100, the vibrating arms 20a and 20b, and the support arm 30 (hereinafter, also referred to as “vibrating arms 20a and 20b”) are integrally provided. Specifically, the vibrating arms 20a, 20b, etc. are cut out at a predetermined angle from a rough crystal (lumbard) (for example, a Z plate having the Z axis (optical axis) of the crystal as the thickness direction is defined as the X axis It is formed on a single crystal wafer (such as one rotated in the range of 0 to 15 degrees with respect to the (electrical axis)) by using a technique such as photolithography or etching. That is, the vibrating arms 20a, 20b and the like are made of crystal.

Incidentally, the vibrating arms 20a, 20b, etc. is not limited to quartz wafer, for example, aluminum nitride (AlN) or lithium niobate (LiNbO _3), lithium tantalate (LiTaO _3), lead zirconate titanate (PZT) , Lithium tetraborate (Li ₂ B ₄ O ₇ ), langasite (La ₃ Ga ₅ SiO ₁₄ ), or other oxide substrates, or glass substrates such as aluminum nitride or tantalum pentoxide (Ta ₂ O ₅ ) piezoelectrics. It may be formed of a laminated piezoelectric substrate formed by stacking body materials or a piezoelectric ceramic substrate. Further, the vibrating arms 20a, 20b and the like may be formed using a silicon semiconductor material or the like.

The first drive electrode 50a and the second drive electrode 50b are provided on the surfaces of the vibrating arms 20a and 20b, as shown in FIGS. 1 and 2. Specifically, the first drive electrode 50a includes groove portions 23 provided on the main surfaces 101a and 101b of the first vibrating arm 20a, side surfaces 22a and 22b of the second vibrating arm 20b, and a weight portion of the second vibrating arm 20b. 24. The second drive electrode 50b is provided in the side surfaces 22a and 22b of the first vibrating arm 20a, the weight portion 24 of the first vibrating arm 20a, and the groove portion 23 provided in the main surfaces 101a and 101b of the second vibrating arm 20b. ing.

1 and 2, the first drive electrode 50a, the first lead electrode 52a, and the first electrode pad 54a are indicated by horizontal lines, and the second drive electrode 50b, the second lead electrode 52b, and the second electrode pad 54b. Is indicated by diagonal lines. 1 and 2, the drive electrodes 50a and 50b, the extraction electrodes 52a and 52b, the electrode pads 54a and 54b, and the conductive layers provided on the side surfaces of the base portion 10, the vibrating arms 20a and 20b, and the support arm 30. The thick lines 60 and 62 are shown.

The first extraction electrode 52a and the second extraction electrode 52b are provided on the base 10 and the support arm 30. The first extraction electrode 52a connects the first drive electrode 50a provided on the first vibrating arm 20a and the first drive electrode 50a provided on the second vibrating arm 20b. Further, the first extraction electrode 52a connects the first drive electrode 50a and the first electrode pad 54a. The second extraction electrode 52b connects the second drive electrode 50b provided on the first vibrating arm 20a and the second drive electrode 50b provided on the second vibrating arm 20b. Further, the second extraction electrode 52b connects the second drive electrode 50b and the second electrode pad 54b.

The first electrode pad 54a and the second electrode pad 54b are provided on the main surface 101a of the support arm 30, as shown in FIG. The first electrode pad 54a is located on the −Y′-axis direction side of the cutout portion 40. The first electrode pad 54a is electrically connected to the first drive electrode 50a via the first extraction electrode 52a. The second electrode pad 54b is located on the +Y′-axis direction side of the cutout portion 40. The second electrode pad 54b is electrically connected to the second drive electrode 50b via the second extraction electrode 52b. The electrode pads 54a and 54b are provided side by side along the Y′ axis. In the illustrated example, the electrode pads 54a and 54b have a rectangular shape in plan view, but the shape is not limited to this, and the corners may be rounded or oval. Good.

The first conductive layer 60 and the second conductive layer 62 are provided on the side surface of the support arm 30. The first conductive layer 60 is connected to the first electrode pad 54a. The second conductive layer 62 is in an electrically floating state. In the illustrated example, the first conductive layer 60 is provided on the −Y′-axis direction side of the side surface 34 a of the wide portion 34 and the side surface 34 b. The second conductive layer 62 is provided on the +Y′-axis direction side of the side surface 34 a of the wide portion 34. The conductive layers 60 and 62 are not provided in the cutout 40. Further, the conductive layers 60 and 62 are not provided on the side surface 10a of the base 10.

As the drive electrodes 50a and 50b, the extraction electrodes 52a and 52b, the electrode pads 54a and 54b, and the conductive layers 60 and 62, for example, chromium or nickel is used as an underlayer, and a metal layer such as gold or silver is formed on the underlayer. A laminated product is used.

Next, the operation of the resonator element 100 will be described.

An electric field is generated in the vibrating piece 100 by a drive signal (alternating voltage) externally applied to the drive electrodes 50a and 50b via the electrode pads 54a and 54b. Then, due to the inverse piezoelectric effect of the crystal, the direction of the arrow A (the direction in which the vibrating arms 20a and 20b separate from each other) and the direction of the arrow B (the vibrating arm 20a, 20a, 20b) shown in FIGS. Flexural vibrations are generated such that the flexural vibrations are displaced so as to alternately bend when 20b approaches each other (the vibrating arms 20a and 20b vibrate in a flexural vibration mode of opposite phase in the X-axis direction).

The vibration (driving) method of the resonator element according to the present invention is not limited to piezoelectric driving. For example, the vibrating piece according to the present invention may be a vibrating piece of a piezoelectric drive type using a piezoelectric substrate, an electrostatic drive type using an electrostatic force, or a Lorentz drive type using a magnetic force. ..

The vibrating piece 100 has the following features, for example.

The vibrating piece 100 includes the cutout portion 40 provided on the side surface 34 a of the support arm 30. Therefore, the second conductive layer 62 can be brought into an electrically floating state. Specifically, the first electrode pad 54a and the second conductive layer 62 can be electrically separated. Therefore, for example, even if the conductive bonding member provided on the second electrode pad 54b and the second conductive layer 62 come into contact with each other, the possibility that the two electrode pads 54a and 54b are electrically short-circuited can be reduced. it can.

In the resonator element 100, the end 42a of the second surface 42 and the end 43a of the third surface 43 of the cutout portion 40 are formed by straight lines parallel to each other and are separated from each other. Therefore, for example, even when a shock is applied to the vibrating piece 100, it is possible to prevent the second surface 42 and the third surface 43 from being damaged. For example, the end of the second surface and the end of the third surface are corners (having a pointed shape), or the end of the second surface and the end of the third surface are in contact with each other. In this case, when a shock is applied to the vibrating piece, a large stress concentration occurs, which may damage the second surface and the third surface.

The vibrating piece 100 has a weight portion 24 connected to the arm portion 22. Therefore, the width (length in the X-axis direction) of the arm portion 22 can be widened without increasing the resonance frequency of the flexural vibration mode of the opposite phase, which is caused by flexural deformation during flexural vibration. Since the heat conduction path in the width direction of the arm portion 22 can be lengthened, the vibrating piece 100 can reduce thermoelastic loss in the adiabatic region.

In the vibrating piece 100, the vibrating arms 20 a and 20 b are provided with the groove 23. Therefore, in the resonator element 100, the path of the heat generated by the bending vibration is narrowed, so that the diffusion (heat conduction) of the heat can be suppressed. Thereby, in the resonator element 100, the thermoelastic loss can be reduced in the adiabatic region.

2. Method for Manufacturing Resonator Reed Next, a method for manufacturing the resonator element 100 according to the present embodiment will be described with reference to the drawings. FIG. 6 is a flowchart for explaining the method for manufacturing the resonator element 100 according to this embodiment. 7 to 13 are sectional views schematically showing the manufacturing process of the resonator element 100 according to this embodiment, and show the same section as FIG. 3. FIG. 14 is a perspective view schematically showing the manufacturing process of the resonator element 100 according to this embodiment. Note that, for convenience, members other than the support arm 30 are not shown in FIG. 14.

As shown in FIG. 7, the first metal layer 70 is formed on the quartz substrate 101 (S1). The first metal layer 70 is formed by, for example, a sputtering method or a CVD (Chemical Vapor Deposition) method. The first metal layer 70 is formed, for example, by sequentially forming a chromium layer and a gold layer from the crystal substrate 101 side. The chromium layer has a thickness of, for example, about 10 nm. The thickness of the gold layer is, for example, about 50 nm. The quartz substrate 101 may be washed with sulfuric acid and buffered hydrofluoric acid (BHF) before forming the first metal layer 70.

As shown in FIG. 8, after the first resist layer 80 is applied to the surface of the first metal layer 70, the first resist layer 80 is exposed and developed to form the first resist layer 80 into a predetermined shape (S2). ). The first resist layer 80 is applied using, for example, a spin coater. Next, the first metal layer 70 is etched using the first resist layer 80 as a mask. Then, the first resist layer 80 is removed.

As shown in FIG. 9, after the second resist layer 82 is applied on the surface of the first metal layer 70, the second resist layer 82 is exposed and developed to form the second resist layer 82 in a predetermined shape (S3). ). The second resist layer 82 is applied using, for example, a spin coater.

As shown in FIG. 10, the quartz substrate 101 is etched (for example, wet-etched) using the first metal layer 70 and the second resist layer 82 as a mask to form the base portion 10, the vibrating arms 20 a and 20 b, and the support arm 30. (S4). The etching time is determined in consideration of the thickness of the quartz substrate 101.

As shown in FIG. 11, the first metal layer 70 is etched using the second resist layer 82 as a mask, and then the vibrating arms 20a and 20b are etched (for example, wet etching) to form the groove portion 23, and further, the supporting arm. The notch portion 40 is formed on the side surface 34a by etching 30 (for example, wet etching) (S5). Since the cutout portion 40 is open on the −X axis direction side (since the surface of the support arm 30 does not exist on the −X axis direction side), the etching rate for forming the cutout portion 40 is equal to the groove portion 23. Is greater than the etching rate for forming. Then, the second resist layer 82 and the first metal layer 70 are removed, and the quartz substrate 101 is washed with, for example, sulfuric acid.

The step of forming the groove portion 23 and the step of forming the cutout portion 40 may be performed in the same step as described above, or may be performed in separate steps.

As shown in FIG. 12, the second metal layer 72 is formed on the surfaces of the base 10, the vibrating arms 20a and 20b, and the support arm 30 (S6). The second metal layer 72 is formed by, for example, a sputtering method or a CVD method. The second metal layer 72 is formed, for example, by sequentially forming a chrome layer and a gold layer from the vibrating arms 20a, 20b and the like. The thickness of the chrome layer is, for example, about 20 nm. The thickness of the gold layer is, for example, about 40 nm.

As shown in FIG. 13, a third resist layer 84 is applied to the surface of the second metal layer 72 (S7). The third resist layer 84 is applied using, for example, a spin coater.

Next, the third resist layer 84 is exposed (S8). In this step, the third resist layer 84 in the cutout 40 is obliquely exposed by irradiating light from a direction inclined with respect to the perpendicular of the main surfaces 101a and 101b of the support arm 30 (see FIG. 14). Specifically, oblique exposure is performed from a direction inclined by a predetermined angle θ from the Z′-axis direction to the +Y′-axis direction or the −Y′-axis direction. The predetermined angle θ is, for example, larger than 0° and smaller than 50°, preferably 5° or more and 45° or less, and more preferably 10° or more and 20° or less. Since the surfaces 42 to 47 of the cutout portion 40 are inclined with respect to the main surfaces 101a and 101b, the third resist layer 84 on the second metal layer 72 provided on the surfaces 42 to 47 can be reliably exposed. can do.

For example, in the example shown in FIG. 14, oblique exposure is performed from a direction inclined by an angle θ from the Z′-axis direction to the −Y′-axis direction. The light for exposing the third resist layer 84 may be irradiated from both the +Z′ axis direction side and the −Z′ axis direction side, as shown in FIG.

The step of exposing the third resist layer 84 (S8) is performed by oblique exposure in which light is irradiated from a direction inclined with respect to the vertical line of the main surfaces 101a and 101b and in the vertical direction of the main surfaces 101a and 101b (Z' axis You may use together with the exposure which irradiates light from (direction).

Next, the exposed third resist layer 84 is developed (S9). Next, the second metal layer 72 is etched by using the developed third resist layer 84 as a mask, and as shown in FIGS. 1 to 3, drive electrodes 50a and 50b, extraction electrodes 52a and 52b, electrode pads 54a, and 54b and the conductive layers 60 and 62 are formed (S10). Then, the third resist layer 84 is removed.

The resonator element 100 can be manufactured through the above steps.

The equivalent series resistance may be measured after manufacturing the resonator element 100. Further, a resonance frequency of the resonator element 100 may be adjusted by providing a metal layer (not shown) to be a weight on the drive electrodes 50a and 50b of the weight portion 24 and scraping the metal layer.

The method of manufacturing the resonator element 100 has the following features, for example.

In the method of manufacturing the vibrating piece 100, the step of forming the cutout portion 40 on the side surface 34a of the support arm 30 and the light from the direction inclined with respect to the perpendicular of the principal surfaces 101a and 101b (with respect to the Z'-axis direction). Irradiating to expose the third resist layer 84 in the cutout portion 40. Therefore, the third resist layer 84 in the cutout 40 can be reliably exposed, and the second metal layer 72 provided on the side surface 34a of the support arm 30 can be removed. This allows the second conductive layer 62 and the first electrode pad 54a to be electrically separated. Therefore, in the method of manufacturing the resonator element 100, for example, even if the conductive bonding member provided on the second electrode pad 54b and the second conductive layer 62 come into contact with each other, the two electrode pads may be electrically short-circuited. Can be reduced.

In the method of manufacturing the vibrating piece 100, oblique exposure is performed from a direction inclined by a predetermined angle θ from the Z′-axis direction to the +Y′-axis direction or the −Y′-axis direction. Therefore, it is possible to expose the third resist layer 84 without blocking the light for exposure by the second vibrating arm 20b. For example, when oblique exposure is performed from a direction tilted from the Z′-axis direction to the −X-axis direction, light may be blocked by the second vibrating arm and the resist layer may not be exposed. Further, particularly when the distance between the vibrating arm and the supporting arm is small, the light for exposure is reflected by the metal layer provided on the supporting arm, and the reflected light also causes the drive electrode to be formed on the side surface of the vibrating arm. There may be a case where a large portion is not formed. Therefore, the size of the drive electrode that can apply an electric field to the vibrating arm becomes small, and the equivalent series resistance may become high.

In the method of manufacturing the vibrating piece 100, the exposure is performed obliquely from the direction inclined at the predetermined angle θ from the Z′-axis direction to the −Y′-axis direction, thereby providing the base portion 10 on the −Y′-axis direction side surface 10a. The third resist layer 84 on the second metal layer 72 can be reliably exposed. Therefore, it is possible to prevent the first conductive layer 60 and the second drive electrode 50b provided on the side surface 22a of the first vibrating arm 20a from being connected and electrically short-circuited.

In the manufacturing method of the resonator element 100, the predetermined angle θ is larger than 0° and smaller than 50°. Therefore, the third resist layer 84 in the cutout portion 40 can be more reliably irradiated with the light for exposure. For example, when the predetermined angle θ is 50° or more, the light for exposure is blocked by the member of the vibrating piece, and the resist layer in the cutout portion may not be exposed.

In the method for manufacturing the vibrating piece 100, the notch 40 is formed on the side surface (side surface on the −X axis direction side) 32 a of the support arm 30 orthogonal to the −X axis direction in plan view. Therefore, the surfaces 42 to 47 of the cutout portion 40 can be inclined with respect to the Z′ axis, and the third resist layer 84 in the cutout portion 40 can be exposed more reliably.

In the method of manufacturing the resonator element 100, the step of forming the cutout portion 40 is performed by wet etching. Therefore, the surfaces 42 to 47 of the cutout portion 40 can be inclined with respect to the Z′ axis.

In the method of manufacturing the resonator element 100, the step of forming the groove portion 23 and the step of forming the cutout portion 40 are performed in the same step. Therefore, in the method of manufacturing the resonator element 100, the number of steps can be shortened as compared with the case where the step of forming the groove portion 23 and the step of forming the cutout portion 40 are performed in separate steps.

3. Modification of vibrating piece 3.1. First Modified Example Next, a resonator element according to a first modified example of the present embodiment will be described with reference to the drawings. FIG. 15 is a plan view schematically showing the resonator element 200 according to the first modified example of the present embodiment.

Hereinafter, in the resonator element 200 according to the first modified example of the present embodiment, members having the same functions as the constituent members of the resonator element 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. To do. This also applies to the resonator elements according to the second and third modified examples of the present embodiment described below.

In the above-described vibrating piece 100, the contour of the cutout portion 40 has a corner portion (for example, a portion forming 90°) in a plan view as shown in FIG. 1. On the other hand, in the resonator element 200, the contour of the cutout portion 40 has a curved portion in a plan view as shown in FIG. Therefore, in the vibrating piece 200, as compared with the vibrating piece 100, for example, stress is less likely to be concentrated when a shock is applied to the support arm 30, and the shock resistance can be improved.

3.2. Second Modified Example Next, a resonator element according to a second modified example of the present embodiment will be described with reference to the drawings. FIG. 16 is a plan view schematically showing the resonator element 300 according to the second modified example of the present embodiment.

In the vibrating piece 300, as shown in FIG. 16, the side surface 34 a of the support arm 30 has a convex portion 340 protruding toward the −X axis direction side, and the cutout portion 40 is provided in the convex portion 340. Therefore, the vibrating piece 300 does not have a portion where the width of the wide portion 34 along the X-axis direction is reduced by providing the cutout portion 40. In the illustrated example, the width of the portion of the wide portion 34 where the cutout portion 40 is provided is the same as the width of the portion of the wide portion 34 where the cutout portion 40 is not provided. As a result, the vibration piece 300 can be improved in impact resistance as compared with, for example, the vibration piece 100.

3.3. Third Modified Example Next, a resonator element according to a third modified example of the present embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view schematically showing the resonator element 400 according to the third modification of the present embodiment, and shows the same section as FIG. 3 schematically showing the resonator element 100. Note that, for convenience, members other than the vibrating arms 20a and 20b are not shown in FIG.

In the above-described vibrating piece 100, as shown in FIG. 3, one groove 23 is provided on each of the main surfaces 101a and 101b of the vibrating arms 20a and 20b. On the other hand, in the resonator element 300, as shown in FIG. 17, two groove portions 23 are provided on each of the main surfaces 101a and 101b. The two groove portions 23 provided on each of the main surfaces 101a and 101b are provided side by side along the X axis. Although not shown, each of the main surfaces 101a and 101b may be provided with three or more groove portions 23.

4. Vibrator Next, the vibrator according to the present embodiment will be described with reference to the drawings. FIG. 18 is a plan view schematically showing the vibrator 800 according to this embodiment. FIG. 19 is a cross-sectional view taken along the line XIX-XIX in FIG. 18, which schematically shows the vibrator 800 according to the present embodiment. Note that the lid 814 is omitted in FIG. 18 for convenience. 18 and 19, the resonator element 100 is shown in a simplified manner.

The vibrator 800 includes the resonator element according to the present invention. Hereinafter, a vibrator 800 including the resonator element 100 will be described as the resonator element according to the invention. As shown in FIGS. 18 and 19, the vibrator 800 includes a resonator element 100 and a package (container) 810.

The package 810 has a box-shaped base 812 having a concave portion 811 opened on the upper surface, and a plate-shaped lid 814 joined to the base 812 so as to close the opening of the concave portion 811. Such a package 810 has a storage space formed by closing the recess 811 with the lid 814, and the resonator element 100 is hermetically stored and installed in the storage space. That is, the resonator element 100 is housed in the package 810.

The storage space (recess 811) in which the resonator element 100 is stored may be in a reduced pressure (vacuum) state, or may be filled with an inert gas such as nitrogen, helium, or argon. .. As a result, the vibration characteristics of the vibrating piece 100 are improved.

The material of the base 812 is, for example, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, or a glass ceramic sintered body obtained by molding, stacking and firing ceramic green sheets. Examples include ceramic-based insulating materials such as bodies, crystals, glass, and silicon (high resistance silicon). The material of the lid 814 is the same as that of the base 812, or a metal such as Kovar or 42 alloy.

To join the base 812 and the lid 814, a seal ring 813 is provided on the base 812, the lid 814 is placed on the seal ring 813, and the seal ring 813 is welded to the base 812 using, for example, a resistance welding machine. Done by The joining of the base 812 and the lid 814 is not particularly limited, and may be performed using an adhesive or seam welding.

Internal terminals 816a and 816b are provided on the inner bottom surface (inner bottom surface) 815 of the recess 811 of the base 812 at positions facing the electrode pads 54a and 54b of the resonator element 100. The first electrode pad 54a is bonded to the internal terminal 816a via the first conductive bonding member 90a, and the second electrode pad 54b is bonded to the internal terminal 816b via the second conductive bonding member 90b.

The conductive joining members 90a and 90b are, for example, conductive adhesives such as epoxy-based, silicone-based, polyimide-based, acrylic-based, bismaleimide-based mixed with conductive materials such as metal fillers, gold, It is a metal bump such as aluminum or a solder bump, or a resin bump in which metal wiring is formed on a metal layer or a resin core.

Electrode terminals 818a and 818b are provided on an outer bottom surface (outer bottom surface) 817 of the base 812 opposite to the inner bottom surface 815. The electrode terminals 818a and 818b are electrically connected to the internal terminals 816a and 816b by unillustrated internal wiring. Specifically, the electrode terminal 818a is electrically connected to the internal terminal 816a, and the electrode terminal 818b is electrically connected to the internal terminal 816b. The internal terminals 816a and 816b and the electrode terminals 818a and 818b are metal coatings in which a coating of nickel, gold or the like is laminated by plating or the like on a metallization layer of tungsten or molybdenum, for example.

Although not shown, the package 810 may have a flat plate-shaped base 812 and a lid 814 having a recess. Further, the package 810 may be provided with a recess in both the base 812 and the lid 814.

In the vibrator 800, for example, a bending signal is excited by the drive signal applied from the oscillation circuit integrated in the IC chip of the electronic device via the electrode terminals 818a and 818b to cause the vibrating piece 100 to have a predetermined frequency. And resonate (oscillate) and output a resonance signal (oscillation signal) from the electrode terminals 818a and 818b.

Since the vibrator 800 includes the resonator element 100, the vibrator 800 can have good electrical characteristics.

5. Oscillator Next, the oscillator according to the present embodiment will be described with reference to the drawings. FIG. 20 is a sectional view schematically showing the oscillator 900 according to this embodiment.

Hereinafter, in the oscillator 900 according to the present embodiment, members having the same functions as the constituent members of the vibrator 800 according to the present embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The oscillator 900 includes the resonator element according to the present invention. Hereinafter, an oscillator 900 including the resonator element 100 will be described as the resonator element according to the invention. As shown in FIG. 20, the oscillator 900 includes a resonator element 100, a package 810, and an IC chip 910.

On the inner bottom surface 815 of the base 812, a housing portion 912 formed in a concave shape is provided. The IC chip 910 is housed in the housing portion 912. The IC chip 910 has a built-in oscillation circuit. The IC chip 910 is fixed to the bottom surface of the accommodating portion 912 with an adhesive or the like (not shown).

The IC chip 910 is connected to internal connection terminals 916a and 916b provided on the bottom surface of the housing 912 by a wire 914 such as gold or aluminum. The internal connection terminals 916a and 916b are, for example, metal coatings in which a coating of nickel, gold or the like is laminated by plating or the like on a metallization layer of tungsten, molybdenum or the like. The internal connection terminals 916a and 916b are connected to the electrode terminals 818a and 818b and the internal terminals 816a and 816b via unillustrated internal wiring. That is, the IC chip (oscillation circuit) 910 is electrically connected to the resonator element 100.

Although not shown, the connection between the IC chip 910 and the internal connection terminals 916a and 916b is performed by flipping the IC chip 910 by flipping the IC chip 910 in addition to the connection direction by wire bonding using the wire 914. May be used. Further, the IC chip 910 may be mounted in a recess provided in the outer bottom surface 817 of the base 812 and sealed with a molding material.

In the oscillator 900, the vibrating reed 100 is excited by flexural vibration by a drive signal applied from the IC chip 910 via the internal connection terminals 916a and 916b, the internal terminals 816a and 816b, and resonates (oscillates) at a predetermined frequency. .. Then, the oscillator 900 outputs an oscillation signal generated by this oscillation to the outside through the IC chip 910, the electrode terminals 818a and 818b, and the like.

Since the oscillator 900 includes the resonator element 100, the oscillator 900 can have good electrical characteristics.

6. Real Time Clock Next, the real time clock according to the present embodiment will be described with reference to the drawings. FIG. 21 is a functional block diagram of the real-time clock 1000 according to this embodiment.

The real-time clock 1000 includes the oscillator according to the present invention. Hereinafter, a real-time clock 1000 including an oscillator 900 will be described as an oscillator according to the present invention. As shown in FIG. 21, the real-time clock 1000 includes an oscillator 900, a timing circuit 1010, an event detection circuit 1020, a memory 1030, and a control circuit 1040.

The oscillator 900 includes the vibrating piece 100 and an oscillation circuit (IC chip) 910 electrically connected to the vibrating piece 100. The vibrating piece 100 receives an electric signal via the oscillation circuit 910. By vibrating, it vibrates at a predetermined frequency. Then, the oscillation circuit 910 amplifies and outputs the signal output from the resonator element 100.

An oscillator 900 is connected to the clock circuit 1010. When the frequency of the signal output from the oscillator 900 is divided to obtain a frequency of 1 [Hz], the 1 [Hz] signal is used for the year and month. , Clock, day, hour, minute, and second are clocked by each clock register (not shown). That is, the clock circuit 1010 generates date and time data based on the signal output from the oscillation circuit 910 of the oscillator 900. By having such a clock circuit 1010, time data can be obtained and the date and time when an event occurs (at each event detection cycle) can be recorded in the memory 1030. Note that the clock circuit 1010 can be configured to store data regarding the day of the week in addition to the above year, month, day, hour, minute, and second.

The event detection circuit 1020 is connected to the event input terminal 1022, which is an external terminal of the real-time clock 1000. The event detection circuit 1020 is configured to raise an event occurrence flag when an electric signal indicating that an event has occurred is input to the event input terminal 1022. In this way, by indicating the occurrence of the event by the flag, it is possible to determine the presence or absence of the event based on the flag. Specifically, the event occurrence flag is set to 1 (changed from 0 to 1).

The memory 1030 is a storage unit that records the above-mentioned time data and data regarding event occurrence.

The clock circuit 1010, the event detection circuit 1020, the memory 1030, and the interrupt output terminal 1042 as an external terminal are connected to the control circuit 1040. The control circuit 1040 is configured to be able to read from the time counting circuit 1010 time data when it is detected that the flag is set, based on the flag information input from the event detection circuit 1020.

The interrupt output terminal 1042 plays a role of outputting a signal to the CPU at the same time as recording the time data and the data related to the event occurrence when an arbitrary event input occurs.

Since the real-time clock 1000 includes the vibrating piece 100, the real-time clock 1000 can have good electrical characteristics.

7. Electronic Device Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic device according to this embodiment includes the resonator element according to the invention. Hereinafter, an electronic device including the resonator element 100 as the resonator element according to the invention will be described.

FIG. 22 is a plan view schematically showing a smartphone 1300 as an electronic device according to this embodiment. As shown in FIG. 22, the smartphone 1300 includes an oscillator 900 having the resonator element 100.

The smartphone 1300 uses the oscillator 900 as a timing device such as a reference clock oscillation source. The smartphone 1300 can further include a display unit (a liquid crystal display, an organic EL display, or the like) 1310, an operation unit 1320, and a sound output unit 1330 (a microphone or the like). The smartphone 1300 may also use the display unit 1310 as an operation unit by providing a contact detection mechanism for the display unit 1310.

It is preferable that the electronic device typified by the smartphone 1300 includes an oscillation circuit that drives the resonator element 100 and a temperature compensation circuit that corrects frequency fluctuations due to temperature changes of the resonator element 100.

According to this, the electronic device typified by the smartphone 1300 includes the oscillation circuit that drives the resonator element 100 and the temperature compensation circuit that corrects the frequency fluctuation due to the temperature change of the resonator element 100. The resonance frequency oscillated by can be temperature-compensated, and an electronic device having excellent temperature characteristics can be provided.

FIG. 23 is a perspective view schematically showing a mobile (or notebook) personal computer 1400 as the electronic apparatus according to this embodiment. As shown in FIG. 23, the personal computer 1400 includes a main body portion 1404 having a keyboard 1402 and a display unit 1406 having a display portion 1405. The display unit 1406 has a hinge structure portion with respect to the main body portion 1404. It is rotatably supported via. Such a personal computer 1400 incorporates the resonator element 100 that functions as a filter, a resonator, a reference clock, or the like.

FIG. 24 is a perspective view schematically showing a mobile phone (including PHS) 1500 as an electronic device according to this embodiment. The mobile phone 1500 includes a plurality of operation buttons 1502, an earpiece 1504, and a mouthpiece 1506, and a display portion 1508 is provided between the operation buttons 1502 and the earpiece 1504. Such a mobile phone 1500 incorporates the resonator element 100 that functions as a filter, a resonator, or the like.

FIG. 25 is a perspective view schematically showing a digital still camera 1600 as an electronic device according to this embodiment. Note that FIG. 25 also simply shows the connection with an external device. Here, while a normal camera exposes a silver halide photographic film with a light image of a subject, a digital still camera 1600 photoelectrically converts a light image of the subject with an image pickup device such as a CCD (Charge Coupled Device). An image pickup signal (image signal) is generated.

A display unit 1603 is provided on the back surface of a case (body) 1602 in the digital still camera 1600, and is configured to perform display based on an image pickup signal from a CCD. The display unit 1603 displays a subject as an electronic image. Functions as a finder. A light receiving unit 1604 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (back side in the drawing) of the case 1602.

When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1606, the CCD image pickup signal at that time is transferred and stored in the memory 1608. Further, in the digital still camera 1600, a video signal output terminal 1612 and an input/output terminal 1614 for data communication are provided on the side surface of the case 1602. Then, as shown in the drawing, a television monitor 1630 is connected to the video signal output terminal 1612, and a personal computer 1640 is connected to the input/output terminal 1614 for data communication, if necessary. Further, the image pickup signal stored in the memory 1608 is output to the television monitor 1630 or the personal computer 1640 by a predetermined operation. Such a digital still camera 1600 incorporates the resonator element 100 that functions as a filter, a resonator, or the like.

Since the electronic devices 1300, 1400, 1500, 1600 are provided with the vibrating piece 100, they can have good electrical characteristics.

The electronic device provided with the vibrating piece of the invention is not limited to the above example, and may be, for example, an inkjet discharge device (for example, an inkjet printer), a laptop personal computer, a television, a video camera, a video tape recorder, Car navigation devices, pagers, electronic notebooks (including communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (for example, electronic thermometers) , Blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish finder, various measuring devices, measuring instruments (for example, measuring instruments for vehicles, aircraft, ships), flight simulator, etc. can do.

8. Moving Body Next, the moving body according to the present embodiment will be described with reference to the drawings. FIG. 26 is a plan view schematically showing an automobile as a moving body 1700 according to this embodiment.

The moving body according to the present embodiment includes the resonator element according to the present invention. Below, the moving body provided with the resonator element 100 as the resonator element according to the present invention will be described.

The moving body 1700 according to the present embodiment is further configured to include a controller 1720, a controller 1730, a controller 1740, a battery 1750, and a backup battery 1760 that perform various controls such as an engine system, a brake system, and a keyless entry system. ing. Note that the moving body 1700 according to the present embodiment may omit or change some of the constituent elements (each part) shown in FIG. 26, or may have a configuration in which other constituent elements are added.

Various mobile objects can be considered as the mobile object 1700, and examples thereof include an automobile (including an electric vehicle), an aircraft such as a jet plane and a helicopter, a ship, a rocket, and an artificial satellite.

Since the moving body 1700 includes the vibrating piece 100, the moving body 1700 can have good electrical characteristics.

The above-described embodiments and modified examples are merely examples, and the present invention is not limited to these. For example, each embodiment and each modification can be appropriately combined.

The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same functions, methods and results, or configurations having the same objects and effects). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. In addition, the invention includes a configuration that achieves the same effects as the configurations described in the embodiments or a configuration that can achieve the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

10... Base, 10a... Side, 20a... 1st vibrating arm, 20b... 2nd vibrating arm, 22... Arm, 22a, 22b... Side, 23... Groove, 24... Weight part, 30... Support arm, 32... Part, 34... Wide part, 34a, 34b... Side surface, 40... Notch part, 41... First surface, 42... Second surface, 42a... End, 43... Third surface, 43a... End, 44... Fourth surface , 45... Fifth surface, 46... Sixth surface, 47... Seventh surface, 50a... First driving electrode, 50b... Second driving electrode, 52a... First extraction electrode, 52b... Second extraction electrode, 54a... 1st electrode pad, 54b... 2nd electrode pad, 60... 1st conductive layer, 62... 2nd conductive layer, 70... 1st metal layer, 72... 2nd metal layer, 80... 1st resist layer, 82... 2nd Resist layer, 84... Third resist layer, 90a... First conductive bonding member, 90b... Second conductive bonding member, 100... Vibrating piece, 101... Quartz substrate, 101a, 101b... Main surface, 200, 300... Vibration Pieces 340... Convex portion, 400... Vibrating piece, 800... Transducer, 810... Package, 811... Recessed portion, 812... Base, 813... Seal ring, 814... Lid, 815... Inner bottom surface, 816a, 816b... Internal terminal, 817... Outer bottom surface, 818a, 818b... Electrode terminal, 900... Oscillator, 910... IC chip, 912... Housing part, 914... Wire, 916a, 916b... Internal connection terminal, 1000... Real time clock, 1010... Clock circuit, 1020... Event detection circuit, 1022... Event input terminal, 1030... Memory, 1040... Control circuit, 1042... Interrupt output terminal, 1300... Smartphone, 1310... Display section, 1320... Operation section, 1330... Sound output section, 1400... Personal computer, Reference numeral 1402... Keyboard, 1404... Main body section, 1405... Display section, 1406... Display unit, 1500... Mobile phone, 1502... Operation button, 1504... Earpiece, 1506... Mouthpiece, 1508... Display section, 1600... Digital still camera , 1602... Case, 1603... Display unit, 1604... Light receiving unit, 1606... Shutter button, 1608... Memory, 1612... Video signal output terminal, 1614... Input/output terminal, 1630... Television monitor, 1640... Personal computer, 1700... Move Body, 1720... Controller, 1730... Controller, 1740... Controller, 1750... Battery, 1760... Backup battery

Claims (11)

The base,
A pair of vibrating arms that extend along a first direction from said base portion,
A support arm extending from the base along the first direction and provided between the pair of vibrating arms;
A direction in which the one vibrating arm, the supporting arm, and the other vibrating arm are arranged side by side as a second direction, and a cutout portion provided on a side surface side of the supporting arm intersecting the second direction,
A first drive electrode and a second drive electrode provided on the vibrating arm ;
A first electrode pad provided on the support arm, located on the first direction side with respect to the cutout portion, and electrically connected to the first drive electrode;
A second electrode pad provided on the support arm, located on a side opposite to the first direction with respect to the cutout portion, and electrically connected to the second drive electrode;
Including,
The side surface of the support arm has a first side surface located on the first direction side with respect to the cutout portion, and a second side surface located on the opposite direction side with respect to the cutout portion,
The cutout is
A first surface along the first direction, which is closer to the center of the support arm in the second direction than the side surface;
A length along a third direction that connects the first surface and the first side surface, includes a surface inclined with respect to the first surface, and extends in a third direction orthogonal to the first direction and the second direction. A first sloping portion that increases in size in the first direction;
A length that connects the first surface and the second side surface, includes a surface inclined with respect to the first surface, and extends along a third direction orthogonal to the first direction and the second direction. A second inclined portion in which the angle increases in the opposite direction,
A vibrating piece including: In claim 1 ,
The first inclined portion has a length along the second direction that increases toward the first direction,
The second slanted portion is a vibrating piece whose length along the second direction increases in the opposite direction. In claim 1 or 2 ,

The support arm is made of crystal,
The electric axis, which is the crystal axis of the crystal, is the X axis, the mechanical axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis.
The Y axis is rotated so that the +Y side is tilted to the + side of the Z axis to form the Y′ axis,
When the Z axis is rotated so that the +Z side is tilted to the − side of the Y axis to form the Z′ axis,
The first direction is the −Y′ direction of the Y′ axis,
The vibrating reed, wherein the second direction is the -X direction of the X axis. In any one of Claim 1 thru|or 3 ,
The vibrating arm includes an arm portion connected to the base portion, and a weight portion connected to the arm portion. In claim 4 ,
The width of the weight portion is larger than the width of the arm portion. In any one of Claim 1 thru|or 5 ,
A vibrating piece in which a groove is provided in the vibrating arm. A resonator element according to any one of claims 1 to 6 ,
A package containing the vibrating piece,
A vibrator. A resonator element according to any one of claims 1 to 6 ,
An oscillation circuit electrically connected to the resonator element,
Equipped with an oscillator. A resonator element according to any one of claims 1 to 6 ,
An oscillation circuit electrically connected to the resonator element,
A clock circuit that generates date and time data based on a signal output from the oscillator circuit,
Has a real-time clock. And a resonator element according to any one of claims 1 to 6, electronic device. Claims 1 comprises a resonator element according to any one of 6, the moving body.

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