JP6551649B2 - Method of manufacturing vibrating piece, vibrating piece, vibrator, oscillator, real time clock, electronic device, and moving body - Google Patents

Description

  The present invention relates to a method of manufacturing a vibrating reed, a vibrating reed, a vibrator, an oscillator, a real time clock, an electronic device, and a movable body.

  Electronic devices such as vibrators and oscillators are used in small information devices such as HDDs (hard disk drives), mobile computers, or IC cards, and in mobile communication devices such as mobile phones, car phones, or paging systems. Widely used.

  As the above-described vibrator or oscillator, one in which a vibrating piece is accommodated in a package is known. Such a vibrating reed has, for example, a base, a pair of vibrating arms extending from the base, and a support arm positioned between the pair of vibrating arms extending from the base. Each vibrating arm is provided with two drive electrodes for driving the vibrating arm, and each drive electrode is either one of two electrode pads of different polarity provided on one main surface of the support arm. And are electrically connected. Such a vibrating reed is fixed to the package via the conductive bonding member at the two electrode pads. The drive electrode and the electrode pad are formed by patterning the metal layer by photolithography and etching.

  In the case of the above-described vibrating reed, the resist layer provided on the surface of the metal layer can not be exposed on the side surface of the support arm, and the metal layer may not be patterned. Therefore, when the resonator element is fixed to the package, the metal layer (metal layer that cannot be patterned) provided on the side surface of the support arm around the electrode pad and the conductive bonding member come into contact with each other, and the two electrode pads are electrically connected. May be short-circuited.

  For example, Patent Document 1 describes that a cutout is formed on a side surface of a support arm in order to prevent an electrical short circuit between two electrode pads.

JP 2014-22965 A

  However, in the vibrating piece as described above, in particular, the side surface on the -X-axis direction side of the support arm (the side surface on the -X-axis direction side of the X-axis as an electrical axis that is crystal axis of quartz) It is difficult to incline with respect to the surface (it tends to be perpendicular to the main surface), and the metal layer in the notch portion may not be sufficiently removed.

  One of the objects according to some aspects of the present invention is to provide a method of manufacturing a vibrating reed that can reduce the possibility of electrical shorting between two electrode pads. In addition, one of the objects according to some aspects of the present invention is a vibrating reed that can reduce the possibility of electrical shorting between two electrode pads, and a vibrator including the vibrating reed. In providing an oscillator, a real time clock, an electronic device, and a mobile.

The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following aspects or application examples.

Application Example 1
The manufacturing method of the vibrator element according to the application example is
Etching the piezoelectric substrate, a base, a pair of vibrating arms extending along the first direction from the base, and aligned along a second direction intersecting the first direction, and the base from the first direction Forming a support arm provided between the pair of vibrating arms extending along the
Etching the support arm to form a notch on the side surface of the support arm that intersects the second direction;
Forming a metal layer on the surface of the base, the vibrating arm, and the support arm;
Applying a resist layer to the surface of the metal layer;
Exposing the resist layer;
Developing the exposed resist layer;
Etching the metal layer using the developed resist layer as a mask;
Including
In the step of exposing the resist layer,
By irradiating light from a direction inclined with respect to a perpendicular line of the main surface of the support arm, the resist layer in the notch is obliquely exposed.
In the step of etching the metal layer,
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, positioned on the first direction side with respect to the notch, and electrically connected to the first drive electrode;
A second electrode pad provided on the main surface, located on the side opposite to the first direction with respect to the notch and electrically connected to the second drive electrode;
Form.

  In the method of manufacturing such a vibrating reed, the possibility of an electrical short between two electrode pads can be reduced.

[Application Example 2]
In the method of manufacturing a vibrator element according to this application example,
In the step of exposing the resist layer,
The oblique exposure may be performed from a direction in which the first direction or a direction opposite to the first direction is inclined at a predetermined angle from a third direction orthogonal to the first direction and the second direction.

  In the method of manufacturing such a vibrating reed, the resist layer can be exposed without the light for exposure being blocked by the vibrating arm.

[Application Example 3]
In the method of manufacturing a vibrator element according to this application example,
The predetermined angle may be greater than 0 ° and less than 50 °.

  In the method of manufacturing such a vibrating reed, it is possible to more reliably irradiate the light for exposure to the second dystoxic layer 84 in the notch.

Application Example 4
In the method of manufacturing a vibrator element according to this application example,
The piezoelectric substrate is made of quartz,
The first direction is
The electric crystal axis is an X axis, the mechanical axis is a Y axis, the optical axis is a Z axis, and the X axis is a rotation axis.
The Y axis is rotated so that the + Y side is inclined to the + side of the Z axis to form a Y ′ axis,
When the Z-axis is rotated so that the + Z side is inclined to the-side of the Y-axis to form a Z 'axis,
The first direction is a -Y 'direction of the Y' axis,
The second direction may be a -X direction of the X axis.

  In the method of manufacturing such a vibrating reed, the surface of the notch can be inclined with respect to the Z ′ axis, and the resist layer in the notch can be exposed more reliably.

Application Example 5
In the method of manufacturing a vibrator element according to this application example,
The step of forming the notch may be performed by wet etching.

  In such a method for manufacturing a resonator element, the surface of the notch can be inclined with respect to the Z ′ axis.

[Application Example 6]
In the method of manufacturing a vibrator element according to this application example,
In the step of forming the notches,
The notch portion is
A first surface that is parallel to the side surface and is located on the opposite side of the side surface from the second direction;
A second surface which is inclined with respect to the first surface and connected to the first surface and the side surface;
A third surface located closer to the first direction than the second surface and inclined with respect to the first surface and connected to the first surface and the side surface;
Formed to have
The second surface has a smaller width in a third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The third surface may increase in width in the third direction as it goes in the first direction.

  In the method of manufacturing such a vibrating reed, the possibility of an electrical short between two electrode pads can be reduced.

Application Example 7
In the method of manufacturing a vibrator element according to this application example,
Etching the vibrating arm to form a groove,
The step of forming the groove and the step of forming the notch may be performed in the same step.

  In such a method of manufacturing a vibrating reed, the process can be shortened as compared to the case where the process of forming the groove and the process of forming the notch are performed in different processes.

Application Example 8
The vibrator element according to this application example is
The base,
A pair of vibrating arms extending from the base along a first direction and aligned in a second direction intersecting the first direction;
A support arm extending from the base along the first direction and provided between the pair of vibrating arms;
A notch portion provided on a side surface of the support arm that intersects a second direction orthogonal to the first direction;
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, positioned on the first direction side with respect to the notch, and electrically connected to the first drive electrode;
A second electrode pad provided on the main surface, located on the side opposite to the first direction with respect to the notch and electrically connected to the second drive electrode;
Including
The notch portion is
A first surface that is parallel to the side surface and is located on the opposite side of the side surface from the second direction;
A second surface which is inclined with respect to the first surface and connected to the first surface and the side surface;
A third surface located closer to the first direction than the second surface and inclined with respect to the first surface and connected to the first surface and the side surface;
Have
The second surface has a smaller width in a third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The width in the third direction increases in the third surface as it goes in the first direction.

  In such a resonator element, the possibility that the two electrode pads are electrically short-circuited can be reduced.

Application Example 9
In the vibrating reed according to this application example,
The support arm is made of quartz,
The electric crystal axis is an X axis, the mechanical axis is a Y axis, the optical axis is a Z axis, and the X axis is a rotation axis.
The Y axis is rotated so that the + Y side is inclined to the + side of the Z axis to form a Y ′ axis,
When the Z-axis is rotated so that the + Z side is inclined to the-side of the Y-axis to form a Z 'axis,
The first direction is a -Y 'direction of the Y' axis,
The second direction may be a -X direction of the X axis.

  In such a resonator element, the possibility that the two electrode pads are electrically short-circuited can be reduced.

Application Example 10
In the vibrating reed according to this application example,
The vibrating arm may have an arm connected to the base and a weight connected to the arm.

  With such a vibrating reed, thermoelastic loss can be reduced.

Application Example 11
In the vibrating reed according to this application example,
The width of the weight may be greater than the width of the arm.

  With such a vibrating reed, thermoelastic loss can be reduced.

Application Example 12
In the vibrating reed according to this application example,
The vibrating arm may be provided with a groove.

  In such a vibrating reed, diffusion (heat conduction) of heat generated by flexural vibration can be suppressed, and thermoelastic loss can be reduced.

Application Example 13
The vibrator according to this application example is
A vibrating reed according to this application example;
A package in which the vibrating reed is accommodated;
Is equipped.

  Such a vibrator is provided with the vibrator element according to this application example, so that it can have good electrical characteristics.

Application Example 14
The oscillator according to this application example is
A vibrating reed according to this application example;
An oscillation circuit electrically connected to the resonator element;
Is equipped.

  Such an oscillator is provided with the vibrating reed according to the application example, so that it can have good electrical characteristics.

Application Example 15
The real time clock according to this application example is
A vibrating reed according to this application example;
An oscillation circuit electrically connected to the resonator element;
Based on a signal output from the oscillation circuit, a clock circuit that generates date and time data,
Is equipped.

  In such a real time clock, since the vibrating reed according to this application example is provided, good electrical characteristics can be obtained.

Application 16
The electronic device according to this application example is
The vibrator element according to the application example is provided.

  Such an electronic device is provided with the vibrating reed according to the application example, so that it can have good electrical characteristics.

Application Example 17
The mobile unit according to this application example is
The vibrator element according to the application example is provided.

  Such a movable body can have good electrical characteristics because it includes the vibrating reed according to this application example.

FIG. 2 is a plan view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a plan view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a perspective view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a side view schematically showing a vibrating reed according to the present embodiment. The flowchart for demonstrating the manufacturing method of the resonator element which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibrating piece which concerns on this embodiment. FIG. 7 is a perspective view schematically showing a manufacturing process of the vibrator element according to the embodiment. FIG. 7 is a plan view schematically showing a resonator element according to a first modification of the embodiment. FIG. 10 is a plan view schematically showing a resonator element according to a second modification of the embodiment. Sectional drawing which shows typically the vibrating piece which concerns on the 3rd modification of this embodiment. FIG. 2 is a plan view schematically showing a vibrator according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing a vibrator according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing an oscillator according to the present embodiment. FIG. 2 is a functional block diagram of a real time clock according to the present embodiment. FIG. 2 is a plan view schematically showing the electronic device according to the embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 2 is a plan view schematically showing a mobile unit according to the present embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Further, not all of the configurations described below are necessarily essential configuration requirements of the present invention.

1. Vibrating Reed First, the vibrating reed according to the present embodiment will be described with reference to the drawings. 1 and 2 are plan views schematically showing a vibrating reed 100 according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1 schematically showing the vibrating reed 100 according to the present embodiment.

  Note that in FIGS. 1 to 3 and FIGS. 4, 5 and 7 to 17 shown below, an X axis, a Y ′ axis, and a Z ′ axis are illustrated as three axes orthogonal to each other. Here, assuming that the electric axis is the crystal axis of quartz, the electric axis is the X axis, the machine axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis, the Y 'axis is the Y axis and the + Y side. The Z ′ axis is an axis formed by rotating the Z axis so that the + Z side is inclined to the − side of the Y axis. The inclination to be rotated is performed in the range of -5 degrees or more and 15 degrees or less from the viewpoint of reducing the change in resonance frequency due to the temperature change.

  The vibrating reed 100 includes a quartz crystal substrate (piezoelectric substrate) 101 having principal surfaces (principal surfaces in a relationship of front and back) 101a and 101b orthogonal to the Z ′ axis, as shown in FIGS. FIG. 1 is a diagram of the resonator element 100 as viewed from the main surface 101a side, and is a diagram for explaining the configuration of the resonator element 100 on the main surface 101a side. FIG. 2 is a view of the vibrating reed 100 seen from the main surface 101 a side, and is a view for explaining the configuration of the main surface 101 b of the vibrating reed 100.

  As shown in FIGS. 1 to 3, the resonator element 100 includes a base 10, a pair of vibrating arms 20 a and 20 b, a support arm 30, a notch 40, drive electrodes 50 a and 50 b, an extraction electrode 52 a, 52b, electrode pads 54a and 54b, and conductive layers 60 and 62. The base 10, the vibrating arms 20a and 20b, and the support arm 30 constitute a quartz substrate 101.

  The base 10 has a substantially flat shape. The length of the base 10 along the Y ′ axis direction is, for example, 50 μm or more and 300 μm or less.

  The vibrating arms 20 a and 20 b extend from the base 10 along the −Y ′ axis direction (first direction, −Y ′ direction of the Y ′ axis) side by side with each other. The vibrating bars 20a and 20b are arranged along the X-axis direction (direction intersecting the first direction). In the illustrated example, the first vibrating arm 20 a is provided on the + X axial direction side of the support arm 30, and the second vibrating arm 20 b is provided on the −X axial direction side of the support arm 30. The vibrating arms 20 a and 20 b have an arm portion 22 connected to the base portion 10 and a weight portion 24 connected to the arm portion 22.

  The bottomed groove 23 is provided on the main surfaces 101a and 101b of the arm 22 of the vibrating arms 20a and 20b. The groove portion 23 extends along the Y ′ axis in a plan view (as viewed from the Z ′ axis direction). In the illustrated example, the tip of the groove 23 is located at the boundary between the arm 22 and the weight 24, and the base end of the groove 23 is located at the boundary between the base 10 and the arm 22. The arm portion 22 has a substantially H-shaped cross-sectional shape as shown in FIG. The distance W between the groove portion 23 and the side surfaces 22a and 22b (inner side surface 22a and outer side surface 22b) of the vibrating arms 20a and 20b is preferably 6 μm or less. Furthermore, when the maximum depth of the groove 23 is t and the thickness of the vibrating arms 20a and 20b (the length along the Z 'axis) is T, η represented by 2t / T is 0.6 or more. Is preferred. As a result, the equivalent series resistance and CI (Crystal Impedance) value of the resonator element 100 can be reduced, and power consumption can be reduced. In the example shown in FIG. 3, the side surfaces 22a and 22b are inclined with respect to the main surfaces 101a and 101b, but may be perpendicular.

  The length of the groove 23 along the Y ′ axis direction is not particularly limited. For example, the groove portion 23 may be provided also in the weight portion 24 or may be provided in the base portion 10.

  The weight portion 24 of the vibrating arms 20a and 20b has a substantially flat plate shape as shown in FIGS. In the illustrated example, the width W1 of the weight portion 24 in the X-axis direction is larger than the width W2 of the arm portion 22 in the X-axis direction. The ratio (W1 / W2) of the width W2 to the width W1 is 2 or more and 10 or less, preferably 5 or more and 7 or less. As a result, thermoelastic loss (loss of vibration energy caused by heat conduction generated between the compression part and the extension part of the vibration piece that flexes and vibrates) is reduced, and vibration leakage due to twisting of the weight part is suppressed. be able to.

  The width W1 of the weight portion 24 of the vibrating arms 20a and 20b is, for example, not less than 100 μm and not more than 400 μm. The length along the Y′-axis direction of the weight portion 24 is, for example, 50 μm or more and 600 μm or less. The distance between the weight portion 24 of the first vibrating arm 20a and the weight portion 24 of the second vibrating arm 20b is, for example, not less than 20 μm and not more than 200 μm. The width W2 of the arm 22 is, for example, not less than 20 μm and not more than 50 μm. The length of the arm portion 22 along the Y′-axis direction is, for example, not less than 300 μm and not more than 1000 μm.

The shape of the weight according to the present invention is not particularly limited as long as the weight per unit length is larger than that of the arm. For example, the weight may have a width that is the same size as the width of the arm and may be thicker than the arm. The weight portion may be configured by forming a surface of the vibrating arm corresponding to the weight portion or a recess and providing a metal such as gold thereon. Furthermore, the weight portion may be made of a substance having a mass density higher than that of the arm portion. That is, when the mass per unit length (Y′-axis direction length) in the arm portion and the weight portion is Ma and Mb, respectively, the relationship of Ma <Mb is satisfied in all the arm portions or in all the weight portions. It suffices to meet the requirements.

  The support arm 30 is provided between the pair of vibrating arms 20a and 20b. The support arm 30 extends along the −Y ′ axis direction from the side surface 10 a (facing the −Y ′ axis direction in plan view) on the −Y ′ axis direction side of the base 10. The length of the support arm 30 in the Y′-axis direction is smaller than the length of the vibrating arms 20a and 20b in the Y′-axis direction. The tip of the support arm 30 is located closer to the base 10 than the tips of the vibrating arms 20a and 20b in plan view. In the illustrated example, the support arm 30 is not provided between the weight portion 24 of the first vibrating arm 20 a and the weight portion 24 of the second vibrating arm 20 b.

  The distance Lg between the support arm 30 and the weight portion 24 satisfies, for example, the relationship of T × 50/130 ≦ Lg ≦ 200 μm, where T (μm) is the thickness of the vibrating arms 20a and 20b. Preferably, the relationship of T × 70/130 ≦ Lg ≦ 100 μm is satisfied. When the distance Lg is smaller than T × 50/130, the conductive bonding member (not shown) provided on the second electrode pad 44b and the drive electrodes 40a and 40b provided on the weight portion 24 come into contact with each other. There is. Furthermore, since the plane orthogonal to the Y ′ axis in plan view is inclined with respect to the main surfaces 101a and 101b, when the distance Lg is smaller than T × 50/130, the vibrating arms 20a and 20b and the supporting arms are formed by wet etching. When forming the outer shape of 30, the weight part 24 and the support arm 30 may be connected. If the distance Lg is greater than 200 μm, it may be difficult to reduce the size of the resonator element.

  The distance between the support arm 30 and the arm 22 is, for example, 10 μm or more and 200 μm or less, and preferably 50 μm or more and 100 μm or less. When the distance between the support arm 30 and the arm 22 is smaller than 10 μm, the conductive bonding members (not shown) provided on the electrode pads 54a and 54b contact the arm 22 and the vibration of the arm 22 is inhibited May be In particular, when a resin bump is used as the conductive bonding member, the distance between the support arm 30 and the arm 22 is preferably 50 μm or more. If the distance between the support arm 30 and the arm 22 is greater than 200 μm, it may be difficult to miniaturize the vibrating reed.

  The support arm 30 has, for example, a constricted portion 32 connected to the base 10 and a wide portion 34 connected to the constricted portion 32. The constricted portion 32 is a portion that is provided between the base portion 10 and the wide portion 34 and has a smaller width than the width of the wide portion 34 along the X-axis direction. By the constricted portion 32, in the resonator element 100, the in-phase bending vibration mode in the X-axis direction (the bending vibration mode in which the pair of vibrating arms are simultaneously displaced in the + X-axis direction and then displaced in the −X-axis direction). Resonance frequency and the opposite phase in the X axis direction (the one of the pair of vibrating arms is displaced in the + X axis direction, the other is displaced in the −X axis direction, and then one is displaced in the −X axis direction) And the resonant frequency of the bending vibration mode in which the other is sequentially displaced in the + X axis direction can be separated. Thereby, the coupling between the in-phase flexural vibration mode and the reverse-phase flexural vibration mode is suppressed to reduce the mixing of the in-phase flexural vibration mode with the in-phase flexural vibration mode. And vibration leakage can be reduced.

  The length of the narrow portion 32 of the support arm 30 along the Y ′ axis direction is, for example, 50 μm or more and 500 μm or less. The minimum width (width along the X-axis direction) of the constricted portion 32 is 5 μm or more and 200 μm or less.

  The wide portion 34 of the support arm 30 has a rectangular shape in which the notch 40 is provided in a plan view. The wide portion 34 has a side surface on the −X axis direction side (surface facing the −X axis direction in plan view) 34 a and a side surface on the + X axis direction side (surface facing the + X axis direction in plan view) 34 b. ing. In the example shown in FIG. 3, the side surfaces 34a and 34b are inclined with respect to the main surfaces 101a and 101b, but may be perpendicular.

  The length along the Y ′ axis direction of the wide portion 34 of the support arm 30 is, for example, 100 μm or more and 900 μm or less. The width (width along the X-axis direction) of the wide portion 34 where the notch 40 is not provided is, for example, 30 μm or more and 300 μm or less.

  The notch 40 is provided on a side surface 34 a (specifically, orthogonal to the plan view) intersecting with the −X axis direction (second direction, −X direction of X axis) of the wide portion 34. The side surface 34a is a surface on the −X axis direction side of the wide portion 34, and is a surface facing the −X axis direction in plan view. Here, FIG. 4 is a perspective view schematically showing the support arm 30 around the notch 40. FIG. 5 is a side view schematically showing the support arm 30 around the notch 40.

  As shown in FIGS. 4 and 5, the notch 40 has a first surface 41, a second surface 42, a third surface 43, a fourth surface 44, a fifth surface 45, and a sixth surface 46. And the seventh surface 47. The surfaces 41 to 47 are the inner surface of the notch 40, and the notch 40 is defined by the surfaces 41 to 47.

  The first surface 41 of the notch 40 is a surface parallel to the side surface 34 a. The first surface 41 is located on the + X axis direction side of the side surface 34a. In the example shown in FIG. 3, the first surface 41 is inclined with respect to the main surfaces 101a and 101b, but may be vertical.

  As shown in FIG. 4, the second surface 42 of the notch 40 is inclined with respect to the first surface 41 and connected to the first surface 41 and the side surface 34a. In the second surface 42, the width D1 in the Z 'axis direction (third direction) decreases as it goes in the -Y' axis direction. The end 42 a on the −Y ′ axial direction side of the second surface 42 is configured by a line (in the illustrated example, a straight line parallel to the Z ′ axis). The second surface 42 is connected to the first surface 41 at an end 42 a. The second surface 42 has, for example, a trapezoidal shape as viewed in the X-axis direction as shown in FIG.

  The third surface 43 of the notch 40 is located on the −Y′-axis direction side of the second surface 42. The third surface 43 is inclined with respect to the first surface 41 and connected to the first surface 41 and the side surface 34a. The third surface 43 has a width D2 in the Z′-axis direction that increases toward the −Y′-axis direction. The end 43a on the + Y 'axial direction side of the third surface 43 is formed by a line (in the illustrated example, a straight line parallel to the Z' axis). The third surface 43 is connected to the first surface 41 at an end 43 a. In the illustrated example, the end 43 a of the third surface 43 is parallel to the end 42 a of the second surface 42. The third surface 43 is separated from the second surface 42. The distance L1 between the end 42a and the end 43a is, for example, 5 μm or more and 20 μm or less. As shown in FIG. 5, the third surface 43 has, for example, a trapezoidal shape when viewed from the X-axis direction.

  The fourth surface 44 and the fifth surface 45 of the notch 40 are connected to the first surface 41 and the second surface 42. The fourth surface 44 is located on the + Z ′ axial direction side of the fifth surface 45. The surfaces 44 and 45 have, for example, a triangular shape when viewed from the Z′-axis direction as shown in FIGS. 1 and 2.

  The sixth surface 46 and the seventh surface 47 of the notch 40 are connected to the first surface 41 and the third surface 43. The sixth surface 46 is located on the + Z ′ axial direction side of the seventh surface 47. As shown in FIGS. 1 and 2, the surfaces 46 and 47 have, for example, a triangular shape when viewed from the Z′-axis direction.

  The length L2 along the Y′-axis direction of the notch 40 is, for example, 50 μm or more and 200 μm or less. The length L3 along the X-axis direction of the notch 40 is, for example, not less than 5 μm and not more than 50 μm.

  The base 10 of the vibrating piece 100, the vibrating arms 20a and 20b, and the support arm 30 (hereinafter, also referred to as "vibrating arms 20a and 20b and the like") are integrally provided. Specifically, the vibrating arms 20a, 20b, and the like are cut out from a quartz crystal (Lambard) at a predetermined angle (for example, a Z plate whose thickness direction is the crystal Z-axis (optical axis) is an X-axis). It is formed on a single quartz wafer using a technique such as photolithography or etching, for example, by rotating within a range of 0 degrees to 15 degrees with respect to (electrical axis). That is, the vibrating arms 20a, 20b, etc. are made of quartz.

The vibrating arms 20a, 20b, etc. are not limited to quartz wafers. For example, aluminum nitride (AlN), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), lead zirconate titanate (PZT) , Oxide substrates such as lithium tetraborate (Li ₂ B ₄ O ₇ ) and langasite (La ₃ Ga ₅ SiO ₁₄ ), and piezoelectric materials such as aluminum nitride and tantalum pentoxide (Ta ₂ O ₅ ) on a glass substrate. You may form from the lamination | stacking piezoelectric material board | substrate which laminated | stacked the body material, or a piezoelectric ceramic board | substrate. Alternatively, the vibrating arms 20a and 20b may be formed using a silicon semiconductor material or the like.

  The first drive electrode 50a and the second drive electrode 50b are provided on the surfaces of the vibrating arms 20a and 20b, as shown in FIGS. 1 and 2. Specifically, the first drive electrode 50a is formed by the groove 23 provided on the main surfaces 101a and 101b of the first vibrating arm 20a, the side surfaces 22a and 22b of the second vibrating arm 20b, and the weight of the second vibrating arm 20b. It is provided at 24. The second drive electrode 50b is provided in the groove portion 23 provided on the side surfaces 22a and 22b of the first vibrating arm 20a, the weight portion 24 of the first vibrating arm 20a, and the main surfaces 101a and 101b of the second vibrating arm 20b. ing.

  In FIGS. 1 and 2, the first drive electrode 50a, the first extraction electrode 52a, and the first electrode pad 54a are indicated by horizontal lines, and the second drive electrode 50b, the second extraction electrode 52b, and the second electrode pad 54b are shown. Is indicated by diagonal lines. Further, in FIGS. 1 and 2, the base 10, the vibrating arms 20a and 20b, and the drive electrodes 50a and 50b provided on the side surfaces of the support arm 30, the lead-out electrodes 52a and 52b, the electrode pads 54a and 54b, and the conductive layer 60 and 62 are indicated by thick lines.

  The first extraction electrode 52 a and the second extraction electrode 52 b are provided on the base 10 and the support arm 30. The first lead-out electrode 52a connects the first drive electrode 50a provided on the first vibrating arm 20a and the first drive electrode 50a provided on the second vibrating arm 20b. Further, the first lead-out electrode 52a connects the first drive electrode 50a and the first electrode pad 54a. The second lead-out electrode 52b connects a second drive electrode 50b provided on the first vibrating arm 20a and a second drive electrode 50b provided on the second vibrating arm 20b. Further, the second lead-out electrode 52b connects the second drive electrode 50b and the second electrode pad 54b.

  The first electrode pad 54a and the second electrode pad 54b are provided on the main surface 101a of the support arm 30, as shown in FIG. The first electrode pad 54 a is located on the −Y′-axis direction side with respect to the notch 40. The first electrode pad 54a is electrically connected to the first drive electrode 50a via the first extraction electrode 52a. The second electrode pad 54 b is located on the + Y′-axis direction side with respect to the notch 40. The second electrode pad 54b is electrically connected to the second drive electrode 50b through the second extraction electrode 52b. The electrode pads 54a and 54b are provided side by side along the Y 'axis. In the illustrated example, the electrode pads 54a and 54b have a rectangular shape in plan view, but the present invention is not limited to this, and corner portions may be rounded or elliptical. It is also good.

The first conductive layer 60 and the second conductive layer 62 are provided on the side surface of the support arm 30. The first conductive layer 60 is connected to the first electrode pad 54a. The second conductive layer 62 is in an electrically floating state. In the illustrated example, the first conductive layer 60 is provided on the −Y ′ axial direction side of the side surface 34 a of the wide portion 34 and on the side surface 34 b. The second conductive layer 62 is provided on the side in the + Y ′ axial direction of the side surface 34 a of the wide portion 34. The conductive layers 60 and 62 are not provided in the notch 40. Furthermore, the conductive layers 60 and 62 are not provided on the side surface 10 a of the base 10.

  For the drive electrodes 50a and 50b, the lead-out electrodes 52a and 52b, the electrode pads 54a and 54b, and the conductive layers 60 and 62, for example, chromium or nickel is used as a base layer, and a metal layer such as gold or silver is formed on the base layer. Is used.

  Next, the operation of the resonator element 100 will be described.

  An electric field is generated in the vibrating reed 100 by a drive signal (alternating voltage) applied to the drive electrodes 50a and 50b from the outside through the electrode pads 54a and 54b. Then, due to the inverse piezoelectric effect of quartz, the arrow A direction (the direction in which the vibrating arms 20a and 20b are away from each other) and the arrow B direction (the vibrating arm 20a, shown in FIGS. 1 and 2) Bending vibration which displaces so as to bend alternately in the direction in which 20b approaches each other) is generated (the vibrating arms 20a and 20b vibrate in the bending vibration mode of the opposite phase in the X-axis direction).

  The vibration (drive) method of the vibrating reed according to the present invention is not limited to the piezoelectric drive. For example, the vibrating reed according to the present invention may be a vibrating reed such as an electrostatic drive type using electrostatic force or a Lorentz drive type using magnetic force other than the piezoelectric drive type using a piezoelectric substrate. .

  The vibrating reed 100 has, for example, the following features.

  The vibrating reed 100 includes a notch 40 provided on the side surface 34 a of the support arm 30. Therefore, the second conductive layer 62 can be electrically floated. Specifically, the first electrode pad 54a and the second conductive layer 62 can be electrically separated. Therefore, for example, even if the conductive bonding member provided on the second electrode pad 54b and the second conductive layer 62 come into contact with each other, the possibility that the two electrode pads 54a and 54b are electrically short-circuited can be reduced. it can.

  In the vibrating reed 100, the end 42a of the second surface 42 of the notch 40 and the end 43a of the third surface 43 are formed as straight lines parallel to each other and are separated. Therefore, even when an impact is applied to the vibrating reed 100, for example, breakage of the second surface 42 and the third surface 43 can be suppressed. For example, the end of the second surface and the end of the third surface are corners (having a pointed shape), or the end of the second surface and the end of the third surface are in contact with each other In this case, when an impact is applied to the vibrating reed, a large stress concentration may occur to damage the second and third surfaces.

  The vibrating reed 100 has a weight 24 connected to the arm 22. For this reason, the width (length in the X-axis direction) of the arm portion 22 can be increased without increasing the resonance frequency of the anti-phase bending vibration mode, and this occurs due to bending deformation during bending vibration. Since the heat conduction path in the width direction in the arm portion 22 can be lengthened, in the vibrating reed 100, thermoelastic loss can be reduced in the adiabatic region.

  In the vibrating piece 100, the groove portions 23 are provided in the vibrating arms 20a and 20b. Therefore, in the vibrating reed 100, since the path of heat generated by the bending vibration is narrowed, it is possible to suppress heat diffusion (heat conduction). Thereby, in the vibrating reed 100, thermoelastic loss can be reduced in the adiabatic region.

2. Method of Manufacturing Vibrating Piece Next, a method of manufacturing the vibrating piece 100 according to the present embodiment will be described with reference to the drawings. FIG. 6 is a flowchart for explaining a method for manufacturing the resonator element 100 according to the present embodiment. 7 to 13 are cross-sectional views schematically showing the manufacturing process of the vibrating reed 100 according to the present embodiment, and show the same cross section as FIG. 3. FIG. 14 is a perspective view schematically showing a manufacturing process of the vibrating reed 100 according to the present embodiment. In addition, illustration of members other than the support arm 30 is abbreviate | omitted in FIG. 14 for convenience.

  As shown in FIG. 7, the first metal layer 70 is formed on the quartz substrate 101 (S1). The first metal layer 70 is formed by, for example, a sputtering method or a CVD (Chemical Vapor Deposition) method. The first metal layer 70 is formed, for example, by sequentially forming a chromium layer and a gold layer from the quartz substrate 101 side. The thickness of the chromium layer is, for example, about 10 nm. The thickness of the gold layer is, for example, about 50 nm. The quartz crystal substrate 101 may be cleaned with sulfuric acid and buffered hydrofluoric acid (BHF) before the first metal layer 70 is formed.

  As shown in FIG. 8, after the first resist layer 80 is applied to the surface of the first metal layer 70, the first resist layer 80 is exposed and developed to form the first resist layer 80 in a predetermined shape (S2) ). The first resist layer 80 is applied, for example, using a spin coater. Next, the first metal layer 70 is etched using the first resist layer 80 as a mask. Thereafter, the first resist layer 80 is removed.

  As shown in FIG. 9, after the second resist layer 82 is applied on the surface of the first metal layer 70, the second resist layer 82 is exposed and developed to form the second resist layer 82 in a predetermined shape (S3) ). The second resist layer 82 is applied, for example, using a spin coater.

  As shown in FIG. 10, the quartz substrate 101 is etched (eg, wet etched) using the first metal layer 70 and the second resist layer 82 as a mask to form the base 10, the vibrating arms 20a and 20b, and the support arm 30. (S4). The etching time is determined in consideration of the thickness of the quartz substrate 101.

  As shown in FIG. 11, the first metal layer 70 is etched using the second resist layer 82 as a mask, and then the vibrating arms 20a and 20b are etched (for example, wet etching) to form a groove 23 and a support arm 30 is etched (for example, wet etching) to form a notch 40 in the side surface 34a (S5). Since the notch 40 is open on the −X axis direction side (since there is no surface of the support arm 30 on the −X axis direction side), the etching rate for forming the notch 40 is the groove 23. It is larger than the etching rate for forming. Thereafter, the second resist layer 82 and the first metal layer 70 are removed, and the quartz crystal substrate 101 is washed with, for example, sulfuric acid.

  The step of forming the groove 23 and the step of forming the notch 40 may be performed in the same step as described above, or may be performed in separate steps.

  As shown in FIG. 12, the second metal layer 72 is formed on the surfaces of the base 10, the vibrating arms 20a and 20b, and the support arm 30 (S6). The second metal layer 72 is formed by, for example, a sputtering method or a CVD method. The second metal layer 72 is formed, for example, by sequentially forming a chromium layer and a gold layer from the side of the vibrating arms 20a, 20b and the like. The thickness of the chromium layer is, for example, about 20 nm. The thickness of the gold layer is, for example, about 40 nm.

  As shown in FIG. 13, the 3rd resist layer 84 is apply | coated to the surface of the 2nd metal layer 72 (S7). The third resist layer 84 is applied, for example, using a spin coater.

  Next, the third resist layer 84 is exposed (S8). In this step, light is irradiated from a direction inclined with respect to the perpendicular to the main surfaces 101a and 101b of the support arm 30, and the third resist layer 84 in the notch 40 is obliquely exposed (see FIG. 14). Specifically, oblique exposure is performed from a direction inclined by a predetermined angle θ in the + Y ′ axis direction or the −Y ′ axis direction from the Z ′ axis direction. The predetermined angle θ is, for example, greater than 0 ° and less than 50 °, preferably 5 ° or more and 45 ° or less, and more preferably 10 ° or more and 20 ° or less. Since the surfaces 42 to 47 of the notch 40 are inclined with respect to the main surfaces 101 a and 101 b, the third resist layer 84 on the second metal layer 72 provided on the surfaces 42 to 47 can be reliably exposed. can do.

  For example, in the example shown in FIG. 14, oblique exposure is performed from a direction inclined at an angle θ from the Z′-axis direction to the −Y′-axis direction. The light for exposing the third resist layer 84 may be irradiated from both the + Z′-axis direction side and the −Z′-axis direction side as shown in FIG.

  The step (S8) of exposing the third resist layer 84 includes oblique exposure in which light is irradiated from a direction inclined with respect to the normal lines of the main surfaces 101a and 101b, and a normal direction (Z′-axis) of the main surfaces 101a and 101b. Exposure which irradiates light from direction) may be used together.

  Next, the exposed third resist layer 84 is developed (S9). Next, the second metal layer 72 is etched using the developed third resist layer 84 as a mask to drive the drive electrodes 50a and 50b, the lead-out electrodes 52a and 52b, and the electrode pads 54a and 54, as shown in FIGS. 54b and conductive layers 60 and 62 are formed (S10). Thereafter, the third resist layer 84 is removed.

  The vibrator element 100 can be manufactured by the above steps.

  The equivalent series resistance may be measured after the vibrating reed 100 is manufactured. Alternatively, a metal layer (not shown) serving as a weight may be provided on the drive electrodes 50a and 50b of the weight portion 24, and the resonance frequency of the vibrating reed 100 may be adjusted by scraping the metal layer.

  The method of manufacturing the vibrating reed 100 has, for example, the following features.

  In the method of manufacturing the vibrating reed 100, the step of forming the notch 40 on the side surface 34a of the support arm 30, and the light from the direction inclined with respect to the perpendicular to the main surfaces 101a and 101b (with respect to the Z 'axis direction). And irradiating the third resist layer 84 in the notch 40. Therefore, the third resist layer 84 in the notch 40 can be reliably exposed, and the second metal layer 72 provided on the side surface 34 a of the support arm 30 can be removed. Thereby, the second conductive layer 62 and the first electrode pad 54a can be electrically separated. Therefore, in the method of manufacturing the vibrating reed 100, for example, even if the conductive bonding member provided on the second electrode pad 54b contacts the second conductive layer 62, the two electrode pads may be electrically shorted. Can be reduced.

  In the method of manufacturing the resonator element 100, oblique exposure is performed from a direction inclined by a predetermined angle θ from the Z′-axis direction to the + Y′-axis direction or the −Y′-axis direction. Therefore, the third resist layer 84 can be exposed without the light for exposure being blocked by the second vibrating arm 20b. For example, when oblique exposure is performed from a direction inclined from the Z′-axis direction to the −X-axis direction, light may be blocked by the second vibrating arm, and the resist layer may not be exposed. Furthermore, in particular, when the distance between the vibrating arm and the supporting arm is small, light for exposure is reflected on the metal layer provided on the supporting arm, and the reflected light causes the drive electrode to be also on the side surface of the vibrating arm. The portion which is not formed may be provided large. As a result, the size of the drive electrode capable of applying an electric field to the vibrating arm may be reduced, and the equivalent series resistance may be increased.

  In the manufacturing method of the vibrating reed 100, the oblique exposure is performed from the direction inclined by a predetermined angle θ in the −Y ′ axis direction from the Z ′ axis direction, thereby providing the side surface 10a on the −Y ′ axis direction side of the base 10. The third resist layer 84 on the second metal layer 72 can be reliably exposed. Therefore, it can suppress that the 1st conductive layer 60 and the 2nd drive electrode 50b provided in the side 22a of the 1st vibrating arm 20a connect, and an electrical short circuit is carried out.

  In the method of manufacturing the vibrating reed 100, the predetermined angle θ is larger than 0 ° and smaller than 50 °. Therefore, the third resist layer 84 in the notch 40 can be more reliably irradiated with light for exposure. For example, when the predetermined angle θ is 50 ° or more, the light for exposure may be blocked by the vibrating reed and the resist layer in the notch may not be exposed.

  In the method of manufacturing the vibrating reed 100, the cutaway portion 40 is formed on the side surface (side surface on the -X-axis direction side) 32a orthogonal to the -X-axis direction of the support arm 30 in plan view. Therefore, the surfaces 42 to 47 of the notch 40 can be inclined with respect to the Z ′ axis, and the third resist layer 84 in the notch 40 can be exposed more reliably.

  In the method for manufacturing the resonator element 100, the step of forming the notch 40 is performed by wet etching. Therefore, the surfaces 42 to 47 of the notch 40 can be inclined with respect to the Z ′ axis.

  In the method for manufacturing the resonator element 100, the step of forming the groove portion 23 and the step of forming the notch portion 40 are performed in the same step. Therefore, in the method of manufacturing the vibrating reed 100, the process can be shortened compared to the case where the process of forming the groove 23 and the process of forming the notch 40 are performed in separate processes.

3. Modification of Vibrating Piece 3.1. First Modified Example Next, a vibrator element according to a first modified example of the embodiment will be described with reference to the drawings. FIG. 15 is a plan view schematically showing a resonator element 200 according to a first modification of the present embodiment.

  Hereinafter, in the vibrating reed 200 according to the first modification of the present embodiment, members having the same functions as the constituent members of the vibrating reed 100 according to the present embodiment have the same reference numerals, and the detailed description thereof is omitted. Do. The same applies to the resonator element according to the second and third modifications of the present embodiment described below.

  In the case of the vibrating reed 100 described above, as shown in FIG. 1, the outline of the notch 40 has a corner (for example, a portion that forms 90 °) in plan view. On the other hand, in the resonator element 200, the outline of the cutout portion 40 has a curved portion in plan view as shown in FIG. Therefore, in the vibrating reed 200, compared to, for example, the vibrating reed 100, when an impact is applied to the support arm 30, it is difficult for stress to be concentrated, and the shock resistance can be improved.

3.2. Second Modified Example Next, a resonator element according to a second modified example of the embodiment will be described with reference to the drawings. FIG. 16 is a plan view schematically showing a resonator element 300 according to a second modification of the present embodiment.

In the resonator element 300, as illustrated in FIG. 16, the side surface 34 a of the support arm 30 has a convex portion 340 that protrudes toward the −X axis direction, and the notch 40 is provided in the convex portion 340. Therefore, the vibrating reed 300 does not have a portion in which the width of the wide portion 34 along the X-axis direction is reduced by providing the notch 40. In the illustrated example, the width of the wide portion 34 where the notch 40 is provided and the width of the wide portion 34 where the notch 40 is not provided are the same. Thereby, in the vibrating reed 300, compared with the vibrating reed 100, for example, impact resistance can be improved.

3.3. Third Modified Example Next, a resonator element according to a third modified example of the embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view schematically showing a vibrating reed 400 according to a third modification of the present embodiment, and shows the same cross section as FIG. 3 schematically showing the vibrating reed 100. For convenience, in FIG. 17, illustration of members other than the vibrating arms 20a and 20b is omitted.

  In the vibrating reed 100 described above, as shown in FIG. 3, one groove portion 23 is provided on each of the main surfaces 101 a and 101 b of the vibrating arms 20 a and 20 b. On the other hand, in the vibrating reed 300, as shown in FIG. 17, two groove portions 23 are provided on the main surfaces 101a and 101b. The two groove portions 23 provided on each of the main surfaces 101a and 101b are provided side by side along the X axis. Although not illustrated, each of the main surfaces 101a and 101b may be provided with three or more groove portions 23.

4. Vibrator Next, a vibrator according to the present embodiment will be described with reference to the drawings. FIG. 18 is a plan view schematically showing a vibrator 800 according to the present embodiment. FIG. 19 is a cross-sectional view taken along line XIX-XIX of FIG. 18 schematically showing a vibrator 800 according to this embodiment. For convenience, the lid 814 is omitted in FIG. 18 and 19 show the resonator element 100 in a simplified manner.

  The vibrator 800 includes the vibrator element according to the present invention. Hereinafter, a vibrator 800 including the vibrating reed 100 as the vibrating reed according to the present invention will be described. The vibrator 800 includes a vibrating reed 100 and a package (container) 810 as shown in FIGS. 18 and 19.

  The package 810 includes a box-shaped base 812 having a concave portion 811 that is open on the upper surface, and a plate-shaped lid 814 that is joined to the base 812 so as to close the opening of the concave portion 811. Such a package 810 has a storage space formed by the recess 811 being closed by the lid 814, and the vibrating reed 100 is airtightly stored and installed in the storage space. That is, the vibrating reed 100 is accommodated in the package 810.

  The storage space (recess 811) in which the resonator element 100 is stored may be in a reduced pressure (vacuum) state, or may be filled with an inert gas such as nitrogen, helium, or argon. . Thereby, the vibration characteristic of the vibrating reed 100 is improved.

  The material of the base 812 is, for example, an aluminum oxide-based sintered body, a mullite-based sintered body, an aluminum nitride-based sintered body, a silicon carbide-based sintered body, and a glass ceramic sintered body obtained by forming, laminating and firing ceramic green sheets. Ceramic insulating materials such as body, crystal, glass, silicon (high resistance silicon) and the like. The material of the lid 814 is the same as that of the base 812, or a metal such as Kovar or 42 alloy.

  To join the base 812 and the lid 814, place the seal ring 813 on the base 812 and place the lid 814 on the seal ring 813 and weld the seal ring 813 to the base 812 using, for example, a resistance welder. Done by The joining of the base 812 and the lid 814 is not particularly limited, and may be performed using an adhesive or may be performed by seam welding.

  Internal terminals 816 a and 816 b are provided on the inner bottom surface (inner bottom surface) 815 of the recess 811 of the base 812 at positions facing the electrode pads 54 a and 54 b of the vibrating reed 100. The first electrode pad 54a is bonded to the internal terminal 816a via the first conductive bonding member 90a, and the second electrode pad 54b is bonded to the internal terminal 816b via the second conductive bonding member 90b.

  The conductive bonding members 90a and 90b may be made of, for example, epoxy, silicone, polyimide, acrylic or bismaleimide conductive adhesive mixed with a conductive material such as a metal filler, gold, or the like. They are metal bumps such as aluminum and solder bumps, and resin bumps in which metal wiring is formed on a metal layer or a core made of resin.

  Electrode terminals 818 a and 818 b are provided on an outer bottom surface (outer bottom surface) 817 opposite to the inner bottom surface 815 of the base 812. The electrode terminals 818a and 818b are electrically connected to the internal terminals 816a and 816b through internal wiring (not shown). Specifically, the electrode terminal 818a is electrically connected to the internal terminal 816a, and the electrode terminal 818b is electrically connected to the internal terminal 816b. The internal terminals 816a and 816b and the electrode terminals 818a and 818b are metal films in which a film such as nickel or gold is laminated on a metallized layer such as tungsten or molybdenum by plating or the like.

  Although not shown, the package 810 may have a flat base 812 and a lid 814 having a recess. In addition, the package 810 may have recesses in both the base 812 and the lid 814.

  In the vibrator 800, for example, the vibration piece 100 is excited by bending vibration by a drive signal applied via the electrode terminals 818a and 818b from an oscillation circuit integrated in an IC chip of an electronic device, and has a predetermined frequency. And resonate (oscillate), and output a resonance signal (oscillation signal) from the electrode terminals 818a and 818b.

  Since the vibrator 800 includes the vibrating reed 100, good electrical characteristics can be obtained.

5. Oscillator Next, the oscillator according to the present embodiment will be described with reference to the drawings. FIG. 20 is a cross-sectional view schematically showing an oscillator 900 according to this embodiment.

  Hereinafter, in the oscillator 900 according to the present embodiment, members having the same functions as the constituent members of the vibrator 800 according to the present embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted.

  The oscillator 900 includes the vibrating reed according to the present invention. Hereinafter, an oscillator 900 including the resonator element 100 will be described as the resonator element according to the invention. The oscillator 900, as shown in FIG. 20, includes a vibrating reed 100, a package 810, and an IC chip 910.

  The inner bottom surface 815 of the base 812 is provided with a recessed storage portion 912. The IC chip 910 is housed in the housing portion 912. The IC chip 910 incorporates an oscillation circuit. The IC chip 910 is fixed to the bottom surface of the housing portion 912 with an adhesive (not shown).

  The IC chip 910 is connected to internal connection terminals 916 a and 916 b provided on the bottom surface of the housing portion 912 by a wire 914 such as gold or aluminum. The internal connection terminals 916a and 916b are metal films in which a film such as nickel or gold is laminated on a metallized layer such as tungsten or molybdenum by plating or the like. The internal connection terminals 916a and 916b are connected to the electrode terminals 818a and 818b and the internal terminals 816a and 816b via internal wiring (not shown). That is, the IC chip (oscillation circuit) 910 is electrically connected to the resonator element 100.

  Although not shown, the connection between the IC chip 910 and the internal connection terminals 916a and 916b is performed by flipping the IC chip 910 and flipping the chip in addition to the connection direction by wire bonding using the wire 914. May be used. The IC chip 910 may be mounted in a recess provided on the outer bottom surface 817 of the base 812 and sealed by a molding material.

  In the oscillator 900, the vibrating reed 100 is excited by bending vibration and resonates (oscillates) at a predetermined frequency by drive signals applied from the IC chip 910 via the internal connection terminals 916a and 916b and the internal terminals 816a and 816b. . Then, the oscillator 900 outputs an oscillation signal generated along with the oscillation to the outside through the IC chip 910, the electrode terminals 818a and 818b, and the like.

  Since the oscillator 900 includes the resonator element 100, it can have good electrical characteristics.

6. Real Time Clock Next, the real time clock according to the present embodiment will be described with reference to the drawings. FIG. 21 is a functional block diagram of the real time clock 1000 according to the present embodiment.

  The real time clock 1000 comprises an oscillator according to the invention. Hereinafter, a real-time clock 1000 including the oscillator 900 will be described as an oscillator according to the present invention. As shown in FIG. 21, the real-time clock 1000 includes an oscillator 900, a timing circuit 1010, an event detection circuit 1020, a memory 1030, and a control circuit 1040.

  The oscillator 900 includes the vibrating reed 100 and an oscillating circuit (IC chip) 910 electrically connected to the vibrating reed 100. The vibrating reed 100 receives an electric signal through the oscillation circuit 910. As a result, it vibrates at a predetermined frequency. Then, the oscillation circuit 910 amplifies the signal output from the resonator element 100 and outputs the amplified signal.

  Oscillator 900 is connected to clock circuit 1010, and when the frequency of 1 [Hz] is obtained by dividing the signal output from oscillator 900, the year, month using the 1 [Hz] signal , Day, hour, minute, and second are measured in each time register (not shown). That is, the timer circuit 1010 generates date and time data based on the signal output from the oscillator circuit 910 of the oscillator 900. By having such a clock circuit 1010, time data can be obtained, and it becomes possible to record, in the memory 1030, the date and time etc. when an event occurs (every event detection cycle). In addition to the year, month, day, hour, minute, and second, the time measuring circuit 1010 can store data regarding the day of the week by setting.

The event detection circuit 1020 is connected to an event input terminal 1022 which is an external terminal of the real time clock 1000. The event detection circuit 1020 is configured to set an event occurrence flag when an electrical signal indicating that an event has occurred is input to the event input terminal 1022. As described above, by indicating the occurrence of an event by a flag, it is possible to determine the presence or absence of an event based on the flag. Specifically, the event occurrence flag is set to 1 (change from 0 to 1).

  The memory 1030 is storage means for recording the above-described time data and data related to event occurrence.

  The control circuit 1040 is connected to the above-described timing circuit 1010, event detection circuit 1020, memory 1030, and interrupt output terminal 1042 as an external terminal. The control circuit 1040 is configured to be able to read out from the clock circuit 1010 time data when it is detected that the flag is set based on the flag information input from the event detection circuit 1020.

  Note that the interrupt output terminal 1042 plays a role of interrupting and outputting a signal to the CPU simultaneously with recording of time data and data related to the occurrence of an event when an arbitrary event input occurs.

  Since the real-time clock 1000 includes the resonator element 100, it can have good electrical characteristics.

7). Electronic Device Next, an electronic device according to the present embodiment will be described with reference to the drawings. An electronic device according to the present embodiment includes the resonator element according to the present invention. Hereinafter, an electronic apparatus including the resonator element 100 will be described as the resonator element according to the invention.

  FIG. 22 is a plan view schematically showing a smartphone 1300 as an electronic device according to the present embodiment. The smartphone 1300 is provided with an oscillator 900 having a vibrating reed 100 as shown in FIG.

  The smartphone 1300 uses the oscillator 900 as a timing device such as a reference clock oscillation source, for example. The smartphone 1300 can further include a display unit (such as a liquid crystal display or an organic EL display) 1310, an operation unit 1320, and a sound output unit 1330 (such as a microphone). The smartphone 1300 may use the display unit 1310 as an operation unit by providing a contact detection mechanism for the display unit 1310.

  Note that the electronic device typified by the smartphone 1300 preferably includes an oscillation circuit that drives the vibrating reed 100 and a temperature compensation circuit that corrects the frequency fluctuation associated with the temperature change of the vibrating reed 100.

  According to this, since the electronic device represented by the smartphone 1300 includes the oscillation circuit that drives the vibrating reed 100 and the temperature compensation circuit that corrects the frequency fluctuation caused by the temperature change of the vibrating reed 100, the oscillation circuit Therefore, it is possible to provide temperature compensation for the resonance frequency at which oscillation occurs and to provide an electronic device having excellent temperature characteristics.

FIG. 23 is a perspective view schematically showing a mobile (or notebook) personal computer 1400 as an electronic apparatus according to the present embodiment. As shown in FIG. 23, the personal computer 1400 includes a main body portion 1404 having a keyboard 1402 and a display unit 1406 having a display portion 1405. The display unit 1406 is a hinge structure portion with respect to the main body portion 1404. It is supported so that rotation is possible. Such a personal computer 1400 incorporates a vibrating reed 100 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 24 is a perspective view schematically showing a cellular phone (including PHS) 1500 as an electronic apparatus according to the present embodiment. The cellular phone 1500 includes a plurality of operation buttons 1502, an earpiece 1504, and a mouthpiece 1506. A display unit 1508 is disposed between the operation button 1502 and the earpiece 1504. Such a cellular phone 1500 incorporates the vibrating reed 100 which functions as a filter, a resonator, or the like.

  FIG. 25 is a perspective view schematically showing a digital still camera 1600 as an electronic apparatus according to the present embodiment. In FIG. 25, connection with an external device is also simply shown. Here, a normal camera sensitizes a silver halide photographic film with a light image of an object, whereas the digital still camera 1600 photoelectrically converts the light image of the object with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1603 is provided on the back of a case (body) 1602 in the digital still camera 1600, and is configured to perform display based on an imaging signal by a CCD, and the display unit 1603 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1604 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1602.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1606, the CCD image pickup signal at that time is transferred and stored in the memory 1608. In the digital still camera 1600, a video signal output terminal 1612 and an input / output terminal 1614 for data communication are provided on the side of the case 1602. As shown, a television monitor 1630 is connected to the video signal output terminal 1612, and a personal computer 1640 is connected to the data communication input / output terminal 1614 as necessary. Further, the imaging signal stored in the memory 1608 is configured to be output to the television monitor 1630 or the personal computer 1640 by a predetermined operation. Such a digital still camera 1600 incorporates a vibrating reed 100 that functions as a filter, a resonator, and the like.

  Since the electronic devices 1300, 1400, 1500, and 1600 include the vibrating reed 100, they can have favorable electrical characteristics.

  Note that the electronic device provided with the vibrating reed of the present invention is not limited to the above example, and for example, an ink jet discharge device (for example, ink jet printer), laptop personal computer, television, video camera, video tape recorder, Car navigation devices, pagers, electronic notebooks (including communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, television monitors for crime prevention, electronic binoculars, POS terminals, medical devices (such as electronic thermometers) , Blood pressure monitor, blood glucose meter, electrocardiogram measurement device, ultrasound diagnostic device, electronic endoscope), fish finder, various measuring instruments, instruments (for example, instruments of vehicles, aircrafts, ships), flight simulators, etc. can do.

8. Mobile Body Next, a mobile body according to the present embodiment will be described with reference to the drawings. FIG. 26 is a plan view schematically showing an automobile as a mobile unit 1700 according to the present embodiment.

  The movable body according to the present embodiment includes the vibrating reed according to the present invention. Below, the moving body provided with the vibration piece 100 is demonstrated as a vibration piece which concerns on this invention.

  The moving body 1700 according to this embodiment further includes a controller 1720 that performs various controls such as an engine system, a brake system, and a keyless entry system, a controller 1730, a controller 1740, a battery 1750, and a backup battery 1760. ing. In addition, the mobile body 1700 according to the present embodiment may omit or change some of the components (each unit) illustrated in FIG. 26, or may have a configuration in which other components are added.

  As such a mobile body 1700, various mobile bodies can be considered. For example, a car (including an electric car), an aircraft such as a jet plane or a helicopter, a ship, a rocket, a satellite, etc. can be mentioned.

  Since the moving body 1700 includes the resonator element 100, it can have good electrical characteristics.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is also possible to combine each embodiment and each modification suitably.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). Further, the present invention includes a configuration in which a nonessential part of the configuration described in the embodiment is replaced. The present invention also includes configurations that can achieve the same effects as the configurations described in the embodiments or that can achieve the same purpose. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... Base part, 10a ... Side surface, 20a ... 1st vibration arm, 20b ... 2nd vibration arm, 22 ... Arm part, 22a, 22b ... Side surface, 23 ... Groove part, 24 ... Weight part, 30 ... Support arm, 32 ... Constriction 34, wide portion, 34a, 34b ... side surface, 40 ... notch, 41 ... first surface, 42 ... second surface, 42a ... end, 43 ... third surface, 43a ... end, 44 ... fourth surface 45 ... 5th surface, 46 ... 6th surface, 47 ... 7th surface, 50a ... first drive electrode, 50b ... second drive electrode, 52a ... first extraction electrode, 52b ... second extraction electrode, 54a ... first. 1 electrode pad, 54b ... 2nd electrode pad, 60 ... 1st conductive layer, 62 ... 2nd conductive layer, 70 ... 1st metal layer, 72 ... 2nd metal layer, 80 ... 1st resist layer, 82 ... 2nd Resist layer, 84: third resist layer, 90a: first conductive bonding member, 90b: second conductive bonding member, 100: Moving piece, 101... Crystal substrate, 101 a, 101 b ... main surface, 200, 300 ... vibrating piece, 340 ... convex portion, 400 ... vibrating piece, 800 ... vibrator, 810 ... package, 811 ... concave portion, 812 ... base, 813 ... seal ring, 814 ... lid, 815 ... inner bottom surface, 816a, 816b ... internal terminal, 817 ... outer bottom surface, 818a, 818b ... electrode terminal, 900 ... oscillator, 910 ... IC chip, 912 ... housing part, 914 ... wire, 916a, 916b ... internal connection terminals, 1000 ... real time clock, 1010 ... timer circuit, 1020 ... event detection circuit, 1022 ... event input terminal, 1030 ... memory, 1040 ... control circuit, 1042 ... interrupt output terminal, 1300 ... smartphone, 1310 ... display unit, 1320 ... operation unit, 1330 ... sound output unit, 1 00 ... Personal computer, 1402 ... Keyboard, 1404 ... Main unit, 1405 ... Display unit, 1406 ... Display unit, 1500 ... Mobile phone, 1502 ... Operation button, 1504 ... Earpiece, 1506 ... Mouthpiece, 1508 ... Display unit, DESCRIPTION OF SYMBOLS 1600 ... Digital still camera, 1602 ... Case, 1603 ... Display part, 1604 ... Light receiving unit, 1606 ... Shutter button, 1608 ... Memory, 1612 ... Video signal output terminal, 1614 ... Input / output terminal, 1630 ... Television monitor, 1640 ... Personal Computer, 1700 mobile unit, 1720 controller, 1730 controller, 1740 controller, 1750 battery, 1
760 ... Backup battery

Claims (17)

Etching the piezoelectric substrate, a base, a pair of vibrating arms extending along the first direction from the base, and aligned along a second direction intersecting the first direction, and the base from the first direction Forming a support arm provided between the pair of vibrating arms extending along the
Etching the support arm to form a notch on the side surface of the support arm that intersects the second direction;
Forming a metal layer on the surface of the base, the vibrating arm, and the support arm;
Applying a resist layer to the surface of the metal layer;
Exposing the resist layer;
Developing the exposed resist layer;
Etching the metal layer using the developed resist layer as a mask;
Including
In the step of exposing the resist layer,
By irradiating light from a direction inclined with respect to a perpendicular line of the main surface of the support arm, the resist layer in the notch is obliquely exposed.
In the step of etching the metal layer,
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, positioned on the first direction side with respect to the notch, and electrically connected to the first drive electrode;
A second electrode pad provided on the main surface, located on the side opposite to the first direction with respect to the notch and electrically connected to the second drive electrode;
A method of manufacturing a vibrating reed. In claim 1,
In the step of exposing the resist layer,
A method of manufacturing a resonator element, wherein oblique exposure is performed from a direction inclined at a predetermined angle from the first direction and a third direction orthogonal to the second direction to the first direction or a direction opposite to the first direction. In claim 2,
The method for manufacturing a resonator element, wherein the predetermined angle is greater than 0 ° and less than 50 °. In any one of Claims 1 thru | or 3,
The piezoelectric substrate is made of quartz,
The first direction is
The electric crystal axis is an X axis, the mechanical axis is a Y axis, the optical axis is a Z axis, and the X axis is a rotation axis.
The Y axis is rotated so that the + Y side is inclined to the + side of the Z axis to form a Y ′ axis,
When the Z-axis is rotated so that the + Z side is inclined to the-side of the Y-axis to form a Z 'axis,
The first direction is a -Y 'direction of the Y' axis,
The method for manufacturing a resonator element, wherein the second direction is a −X direction of the X axis. In any one of Claims 1 thru | or 4,
The step of forming the notch is a method for manufacturing a resonator element, which is performed by wet etching. In any one of Claims 1 thru | or 5,
In the step of forming the notches,
The notch portion is
A first surface that is parallel to the side surface and is located on the opposite side of the side surface from the second direction;
A second surface inclined to the first surface and connected to the first surface and the side surface;
A third surface located closer to the first direction than the second surface and inclined with respect to the first surface and connected to the first surface and the side surface;
Formed to have
The second surface has a smaller width in a third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The method of manufacturing a vibrator element, wherein the third surface has a width in the third direction that increases in the first direction. In any one of Claims 1 thru | or 6,
Etching the vibrating arm to form a groove,
The manufacturing method of the vibrator element in which the process of forming the said groove part and the process of forming the said notch part are performed at the same process. The base,
A pair of vibrating arms extending from the base along a first direction and aligned in a second direction orthogonal to the first direction;
A support arm extending from the base along the first direction and provided between the pair of vibrating arms;
A notch portion provided on a side surface intersecting the support arm, before Symbol second direction,
A first drive electrode and a second drive electrode provided on the surface of the vibrating arm;
A first electrode pad provided on the main surface of the support arm, positioned on the first direction side with respect to the notch, and electrically connected to the first drive electrode;
A second electrode pad provided on the main surface, located on the side opposite to the first direction with respect to the notch and electrically connected to the second drive electrode;
Including
The notch portion is
A first surface that is parallel to the side surface and is located on the opposite side of the side surface from the second direction;
A second surface which is inclined with respect to the first surface and connected to the first surface and the side surface;
A third surface located closer to the first direction than the second surface and inclined with respect to the first surface and connected to the first surface and the side surface;
Have
The second surface has a smaller width in a third direction orthogonal to the first direction and the second direction as it goes in the first direction,
The third surface has a width in the third direction that increases in the first direction.
The vibrating piece , wherein the first surface is on the center side of the support arm with respect to the side surface in the second direction . In claim 8,
The support arm is made of quartz,
The electric crystal axis is an X axis, the mechanical axis is a Y axis, the optical axis is a Z axis, and the X axis is a rotation axis.
The Y axis is rotated so that the + Y side is inclined to the + side of the Z axis to form a Y ′ axis,
When the Z-axis is rotated so that the + Z side is inclined to the-side of the Y-axis to form a Z 'axis,
The first direction is a -Y 'direction of the Y' axis,
The vibrator element, wherein the second direction is a -X direction of the X axis. In claim 8 or 9,
The vibrating reed in which the vibrating arm includes an arm connected to the base and a weight connected to the arm. In claim 10,
The vibrating reed, wherein a width of the weight portion is larger than a width of the arm portion. In any one of claims 8 to 11,
The vibrating arm is provided with a groove portion. A vibrating reed according to any one of claims 8 to 12,
A package in which the vibrating reed is accommodated;
Is equipped with a vibrator. A vibrating reed according to any one of claims 8 to 12,
An oscillation circuit electrically connected to the resonator element;
It has an oscillator. A vibrating reed according to any one of claims 8 to 12,
An oscillation circuit electrically connected to the resonator element;
Based on a signal output from the oscillation circuit, a clock circuit that generates date and time data,
Has a real time clock.   An electronic apparatus comprising the resonator element according to claim 8.   A moving body comprising the resonator element according to claim 8.