JP6740951B2 - Metal film forming equipment - Google Patents

Description

The present invention relates to a metal film forming apparatus for bringing a solid electrolyte film into contact with the surface of a substrate to form a metal film on the surface of the substrate.

Conventionally, between the anode and the substrate corresponding to the cathode arranged below the anode, the surface of the substrate is obtained by applying a voltage to the anode and the cathode with the solid electrolyte membrane being in contact with the substrate. A film forming apparatus for forming a metal film on a substrate is used.

As such a technique, for example, Patent Document 1 proposes the following film forming apparatus. This film forming apparatus includes an anode, a solid electrolyte membrane disposed between the anode and a substrate below the anode, a solution containing section for containing a metal solution so as to contact the solid electrolyte membrane and the anode, and an anode. And a power supply unit for applying a voltage between the substrate and the substrate.

At the time of film formation, when a voltage is applied between the anode and the substrate, the metal ions contained in the metal solution contained in the solution container move in the solid electrolyte membrane in the direction from the anode to the substrate, Reduced on the surface. As a result, a metal film can be formed on the surface of the substrate.

JP, 2014-051701, A

However, in the film forming apparatus disclosed in Patent Document 1, when the solid electrolyte film is replaced after the metal film is formed, since the solid electrolyte film is arranged below the anode, the metal solution existing between them is , It flows down from the solution container and leaks. Further, during the film formation, oxygen gas is generated from the metal solution, but this oxygen gas may become bubbles and float in the metal solution due to buoyancy and adhere to the anode. As a result, at the time of film formation, the portion to which the oxygen gas that has adhered to the anode adheres is electrically insulated, which may cause a film formation failure.

In view of such a point, for example, if the solid electrolyte membrane is arranged above the anode and a solution containing portion (chamber) for containing the metal solution is provided together with the anode, the metal solution is removed regardless of the removal of the solid electrolyte membrane. It is possible to maintain the state in which is stored in the solution storage portion. As a result, liquid leakage of the metal solution when replacing the solid electrolyte membrane can be reduced.

However, even if such a structure is adopted, when the solid electrolyte membrane is conveyed and replaced, the solid electrolyte membrane is caught in the solution containing portion, the solid electrolyte membrane is damaged, and the metal solution in the solution containing portion is , There is a risk of spilling from the solution container.

The present invention has been made in view of such a point, and an object thereof is to prevent the solid electrolyte membrane from being caught in the solution storage portion, and the metal solution in the solution storage portion from the solution storage portion. An object of the present invention is to provide a metal film forming apparatus capable of avoiding spilling.

In view of the above problems, the apparatus for depositing a metal film according to the present invention, between the anode, the anode, and a substrate corresponding to the cathode, above the anode so that the surface of the substrate is in contact. A solid electrolyte membrane to be arranged, a storage space for storing a metal solution containing metal ions is formed together with the anode, a solution storage part having an opening formed so that the storage space opens upward, and the solution storage A liquid supply unit for supplying the metal solution to the accommodation space of a unit, and a power supply unit for applying a voltage between the anode and the substrate, wherein The electrolyte membrane is arranged so as to cover the opening, and the solution storage portion is arranged so as to seal the opening in a state of being in contact with the solid electrolyte membrane; A second seal member arranged so as to surround the outside of the first seal member; and a drain port for draining the metal solution formed between the first seal member and the second seal member. It is characterized in that the film forming apparatus further comprises a carrying unit for carrying the solid electrolyte membrane in a state where the metal solution is supplied to the accommodation space by the liquid supply unit.

According to the metal film forming apparatus of the present invention, the first seal member arranged to seal the opening of the accommodation space and the second seal member arranged to surround the outer side of the first seal member. The material can seal the storage space in the state where the solid electrolyte membrane and the solution storage portion are in contact with each other during film formation. As a result, a metal coating can be formed on the surface of the substrate in contact with the solid electrolyte membrane without the metal solution contained in the accommodation space leaking.

After the film formation, the solid electrolyte membrane is lifted from the solution storage portion by the metal solution supplied to the storage space in the liquid supply portion, so that the solid electrolyte membrane can be transported by the transport portion without contacting the solution storage portion. it can. This can prevent the solid electrolyte membrane from being caught in the solution storage portion when the solid electrolyte membrane is transported and replaced.

Furthermore, the metal solution in which the solid electrolyte membrane is lifted from the solution storage portion is drained from the drain port formed between the first and second sealing materials without entraining bubbles, and the metal solution is stored in the solution storage portion. It does not spill from the department.

1 is a schematic cross-sectional view of a metal film forming apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of main parts of the film forming apparatus shown in FIG. 1. It is a figure for demonstrating the flow of the metal solution in the accommodation space at the time of conveying a solid electrolyte membrane, (a) is a top view of the chamber shown in FIG. 2, (b) is a figure shown in FIG. It is an important section sectional view of a membrane device.

Hereinafter, a metal film forming apparatus according to an embodiment of the present invention will be described with reference to FIGS.

1. Metal Film Forming Apparatus 1 First, the metal film forming apparatus 1 will be described. FIG. 1 is a schematic cross-sectional view of a metal film forming apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a main-part cross-sectional view of the film forming apparatus 1 shown in FIG. FIG. 3 is a diagram for explaining the flow of the metal solution L in the accommodation space G when the solid electrolyte membrane 13 is transported, (a) is a plan view of the chamber 15 shown in FIG. 2] is a cross-sectional view of a main part of the film forming apparatus 1 shown in FIG. 1.

As shown in FIG. 1, the film forming apparatus 1 according to the present embodiment is an apparatus that deposits a metal from metal ions and forms a metal coating film of the deposited metal on the surface of the substrate B. Here, the substrate B includes a substrate made of a metal material such as aluminum, a substrate in which a metal underlayer is formed on a treated surface of a resin or a silicon substrate, or a semiconductor substrate (diode) in which a current flows in one direction. be able to.

The film forming apparatus 1 includes a solid electrolyte membrane 13 disposed between a metal anode 11 and a substrate B which is disposed above the anode 11 and corresponds to a cathode, and a voltage applied between the anode 11 and the substrate B. And a power supply unit 14 for applying a voltage.

The anode 11 is electrically connected to the positive electrode of the power supply unit 14 via a chamber (solution containing unit) 15, and the substrate B serving as a cathode is powered by a substrate holding member 17 made of, for example, a conductive material. It is electrically connected to the negative electrode of the portion 14. An accommodation space G for accommodating a metal solution L described later is formed in the chamber 15, and is made of a material insoluble in the metal solution L. A suction passage 17a for sucking the substrate B is formed in the substrate holding member 17, and a pressing cylinder 18 for pressing the substrate B against the solid electrolyte membrane 13 is arranged above the suction passage 17a.

The anode 11 is disposed in the accommodation space G of the chamber 15, and examples thereof include ruthenium oxide, platinum, and iridium oxide, which are insoluble in the metal solution L, and these metals are coated on a copper plate or the like. It may be an anode. In the present embodiment, the anode 11 may be a soluble anode made of the same metal as the metal of the metal film (metal of the metal ion of the metal solution L).

The solid electrolyte membrane 13 can be impregnated with metal ions inside by contacting with the metal solution L described above, and a metal derived from metal ions can be deposited on the surface of the substrate B when a voltage is applied. If so, it is not particularly limited. Examples of the material of the solid electrolyte membrane 13 include fluorocarbon resins such as Nafion (registered trademark) manufactured by DuPont, hydrocarbon resins, polyamic acid resins, and Selemion (registered trademark) manufactured by Asahi Glass Co., Ltd. (CMV, CMD, CMF series). ) And other resins having an ion exchange function.

In the present embodiment, the solid electrolyte membrane 13 has a strip shape, one end side of which is wound around the delivery roller 31A, and the other end side of which is wound around the winding roller 31B. As shown in FIG. 1, the transport rollers 33, 33 are disposed on both sides of the chamber 15, and the solid electrolyte membrane 13 is formed in the opening of the chamber 15 by adjusting the height of the transport rollers 33, 33. It may be arranged at a position slightly above the chamber 15 above the chamber 15a. During film formation, the solid electrolyte membrane 13 is pressed against the substrate B to cover the opening 15a and completely seal the accommodation space G.

The delivery roller 31A and the take-up roller 31B are configured to rotate in synchronization, and the rotation of these allows the solid electrolyte membrane 13 to be conveyed. The “conveying section” in the present invention corresponds to the delivery roller 31A and the winding roller 31B.

In the present embodiment, the feed roller 31A and the take-up roller 31B are in a state in which the supply pump 23 described later is in operation (a state in which the metal solution L is supplied to the accommodation space G by the supply pump 23) after the metal film is formed. , Rotate in synchronization with each other and convey the solid electrolyte membrane 13. As a result, the solid electrolyte membrane 13 is lifted from the chamber 15, and the solid electrolyte membrane 13 can be transported without contacting the chamber 15.

In the present embodiment, the chamber (solution storage unit) 15 stores the metal solution L as described above, and the storage space G for storing the metal solution L is formed inside thereof. The metal solution L may be, for example, an electrolytic solution containing ions of copper, nickel, silver or the like, and the metal forming the metal film is present in the metal solution L in an ionic state.

A storage space G is formed in the chamber 15, and an opening portion 15a having the same size as or larger than the surface of the anode 11 is formed in the upper portion of the chamber 15 so that the storage space G opens upward. Has been done. At the time of film formation, the solid electrolyte membrane 13 is arranged so as to cover the opening 15a.

Since the accommodation space G is open upward, even if the solid electrolyte membrane 13 has a defect or the solid electrolyte membrane 13 is damaged due to abnormal deposition of metal, the metal solution L leaks from the accommodation space G. There is no.

In the present embodiment, the film forming apparatus 1 includes a supply pump 23 (liquid supply unit) that supplies the metal solution L to the accommodation space G of the chamber 15. The supply pump 23 is connected to the tank 26 so as to suck the metal solution L from the tank 26 containing the metal solution L.

The supply pump 23 is in communication with the accommodation space G of the chamber 15 via the supply flow path 15b, and the metal solution L supplied to the chamber 15 is sprayed toward the solid electrolyte membrane 13 so that the supply flow path is supplied. 15b is formed. The opening (supply port) facing the accommodation space G of the supply channel 15b is formed in a slit shape along the peripheral wall surface forming the accommodation space G near the opening 15a.

Further, the chamber 15 is formed with a discharge flow path 15c for discharging the metal solution L supplied from the supply flow path 15b and stored in the storage space G. The discharge flow channel 15c communicates with the tank 26. There is. The opening (exhaust port) of the discharge passage 15c facing the accommodation space G is formed in a slit shape along the peripheral wall surface forming the accommodation space G near the opening 15a.

By forming the supply flow path 15b and the discharge flow path 15c having such openings, it is possible to prevent the bubbles generated from the anode 11 from adhering to the solid electrolyte membrane 13 due to the liquid flow of the metal solution L. .. Further, the bubbles flown by the liquid flow of the metal solution L, together with the metal solution L supplied to the accommodation space G, are discharged to the tank 26 via the discharge flow path 15c by the hydraulic pressure from the supply pump 23. You can

Further, as shown in FIGS. 1 and 3( a ), the chamber 15 includes a first seal material 41 and a second seal material 42. The first sealing material 41 is arranged so as to seal the opening 15a of the accommodation space G while being in contact with the solid electrolyte membrane 13. The second sealing material 42 is arranged so as to surround the outside of the first sealing material 41.

A drain port 15d for draining the metal solution L flowing between them is formed between the first seal material 41 and the second seal material 42. The drainage port 15d is connected to the drainage pump 24 via a drainage passage 15e. The drainage pump 24 is connected to the tank 26 via the drainage passage 15e so as to push the metal solution L discharged from the drainage port 15d of the chamber 15 into the tank 26.

2. Metal Film Forming Method A metal film forming method according to this embodiment will be described below with reference to FIGS. 1 and 2. First, in the present embodiment, the solid electrolyte membrane 13 is arranged above the opening 15a of the chamber 15 so as to cover the opening 15a.

Next, as shown in FIG. 2, by sucking the air in the suction passage 17a of the substrate holding member 17, the substrate B is attracted to the substrate holding member 17 and held. In this state, the cylinder 18 lowers the substrate holding member 17 to press the substrate B against the solid electrolyte membrane 13.

As a result, the solid electrolyte membrane 13 covers the opening 15a, the first and second sealing members 41 and 42 contact and are pressed against the solid electrolyte membrane 13, and the solid electrolyte membrane forms a storage space G in which the metal solution L is stored. It can be completely sealed with 13.

In this state, as shown in FIG. 1, the supply pump 23 is operated so as to suck the metal solution L from the tank 26 containing the metal solution L, and the storage space G of the chamber 15 is supplied to the storage space G via the supply flow path 15b. A metal solution L is supplied. When the metal solution L supplied to the accommodation space G reaches a predetermined pressure, it is discharged from the accommodation space G to the tank 26 via the discharge flow path 15c.

Next, a voltage is applied between the anode 11 and the substrate B by the power supply unit 14. When a voltage is applied between the anode 11 and the substrate B, the metal ions of the metal solution L accommodated in the accommodation space G flow in the solid electrolyte membrane 13 from the anode 11 toward the substrate B, and the surface of the substrate B Then, this is reduced and metal is deposited. Thereby, a metal film can be formed on the surface of the substrate B.

After the formation of the metal film is completed, the cylinder 18 raises the substrate holding member 17 to separate the substrate B from the solid electrolyte membrane 13, stop the suction of the air in the suction passage 17a, and remove the air from the substrate holding member 17. Substrate B is removed.

When the substrate holding member 17 is lifted by the cylinder 18 to separate the substrate B from the solid electrolyte membrane 13, the supply pump 23 is operating as shown in FIGS. 3A and 3B. The metal solution L stored in the storage space G overflows from the opening 15a.

However, at this time, by operating the drainage pump 24, the overflowing metal solution L can be drained from the drainage port 15d formed between the first sealing material 41 and the second sealing material 42. it can.

As shown in FIG. 3B, the metal solution L discharged from the drain port 15d is sucked into the drain pump 24 via the drain passage 15e, and the sucked metal solution L is stored in the tank 26. Is discharged to. Since the metal solution L is discharged from the drain port 15d formed between the first and second seal members 41 and 42, even if the metal solution L overflows from the opening 15a, it should be spilled from the chamber 15. Can be avoided.

Further, in the present embodiment, since the supply pump 23 and the drainage pump 24 are operated at the same time, the metal solution L as shown in FIG. 3A is provided between the solid electrolyte membrane 13 and the chamber 15. Liquid flow occurs. Therefore, even if the solid electrolyte membrane 13 floats up from the chamber 15, it is possible to prevent the atmosphere from entering between them as bubbles.

Further, as described above, the solid electrolyte membrane 13 is lifted from the chamber 15 by the metal solution L supplied from the supply pump 23, so that the solid electrolyte membrane 13 is wound around the delivery roller 31A without contacting the chamber 15. It can be conveyed by the take-up roller 31B. This can prevent the solid electrolyte membrane 13 from being caught in the chamber 15 when the solid electrolyte membrane 13 is transported and replaced.

The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like within the scope not departing from the gist of the present invention. However, they are included in the present invention.

1: film forming device, 11: anode, 13: solid electrolyte membrane, 14: power supply part, 15 chamber (solution processing part), 15a: opening part, 15d: drain port, 23: supply pump, 24: drain pump , 26: tank, 31A: delivery roller (conveying section), 31B: winding roller (conveying section), 41: first sealing material, 42: second sealing material, G: accommodation space, L: metal solution

Claims (1)

An anode,
Between the anode and the substrate corresponding to the cathode, so that the surface of the substrate is in contact, a solid electrolyte membrane disposed above the anode,
A storage space for storing a metal solution containing metal ions is formed together with the anode, and a solution storage part having an opening formed so that the storage space opens upward,
In the storage space of the solution storage unit, a liquid supply unit that supplies the metal solution,
A power supply unit for applying a voltage between the anode and the substrate, and a metal film forming apparatus comprising:
The solid electrolyte membrane is arranged to cover the opening,
The solution accommodating portion is arranged so as to seal the opening while being in contact with the solid electrolyte membrane, and a second seal arranged so as to surround the outside of the first sealing material. A drainage port for draining the metal solution formed between the first sealing material and the second sealing material,
The said film-forming apparatus is further equipped with the conveyance part which conveys the said solid electrolyte membrane in the state which supplied the metal solution to the said accommodation space by the said liquid supply part, The film-forming apparatus of the metal film characterized by the above-mentioned.

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