JP2018178140A - Film deposition apparatus of metallic film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition apparatus of a metallic film that can prevent a solid electrolyte membrane from getting caught by a chamber and can avoid a metallic solution in the chamber from spilling out of the chamber.SOLUTION: A solid electrolyte membrane 13 of a film deposition apparatus 1 is arranged so as to cover an opening 15a of a chamber 15 and to seal a housing space G. The chamber 15 comprises: a first sealing material 41 for sealing the opening 15a; a second sealing material 42 for surrounding the outer part of the chamber; and a drainage port 15d formed between the first sealing material 41 and the second sealing material 42. The film deposition apparatus 1 further comprises a sending-out roller 31A for sending out the solid electrolyte membrane 13 and a winding-up roller 31B in a state that a metallic solution L is supplied to the housing space G by a feed pump.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a film forming apparatus for a metal film in which a solid electrolyte film is brought into contact with the surface of a substrate to form a metal film on the surface of the substrate.

  Conventionally, the surface of a substrate is applied by applying a voltage to the anode and the cathode while the solid electrolyte film is in contact with the substrate between the anode and the substrate corresponding to the cathode disposed below the anode. A film forming apparatus for forming a metal film on the substrate is used.

  As such a technology, for example, Patent Document 1 proposes the following film forming apparatus. The film forming apparatus includes an anode, a solid electrolyte film disposed between the anode and the substrate below the anode, a solution storage unit that stores a metal solution in contact with the solid electrolyte film and the anode, and the anode And a substrate, a power supply unit for applying a voltage.

  At the time of film formation, when a voltage is applied between the anode and the substrate, metal ions contained in the metal solution contained in the solution containing portion move in the direction from the anode toward the substrate in the solid electrolyte film, It is reduced at the surface. Thereby, a metal film can be formed on the surface of the substrate.

Unexamined-Japanese-Patent No. 2014-051701

  However, in the film forming apparatus shown in Patent Document 1, when replacing the solid electrolyte film after forming the metal film, the solid electrolyte film is disposed below the anode, so the metal solution existing between them is present. , It flows down from the solution storage part and leaks. In addition, although oxygen gas is generated from the metal solution at the time of film formation, the oxygen gas may form bubbles, float in the metal solution by buoyancy, and adhere to the anode. As a result, at the time of film formation, the portion to which the oxygen gas attached to the anode is attached is electrically insulated, which may cause film formation failure.

  In view of such a point, for example, if a solid electrolyte membrane is disposed above the anode and a solution storage portion (chamber) for containing the metal solution is provided together with the anode, the metal solution is removed regardless of removal of the solid electrolyte membrane. Can be held in the solution container. Thereby, the liquid leak of the metal solution at the time of replacement | exchange of a solid electrolyte membrane can be reduced.

  However, even if such a structure is adopted, when the solid electrolyte membrane is transported and replaced, the solid electrolyte membrane is caught in the solution containing portion and the solid electrolyte membrane is broken, and the metal solution in the solution containing portion , There is a risk of spilling from the solution container.

  The present invention has been made in view of such a point, and the purpose of the present invention is to prevent the solid electrolyte membrane from being caught in the solution storage unit, and the metal solution in the solution storage unit from the solution storage unit. It is providing the film-forming apparatus of the metal film which can avoid spilling.

  In view of the above problems, a film forming apparatus for a metal film according to the present invention has an anode, the anode, and a substrate corresponding to the cathode above the anode so that the surface of the substrate is in contact. A solution storage portion in which a solid electrolyte membrane to be arranged, a storage space for storing a metal solution containing metal ions together with the anode, is formed, and an opening is formed to open the storage space upward, and the solution storage It is a film-forming apparatus of the metal film provided with the liquid supply part which supplies the said metal solution to the said accommodation space of a part, and the power supply part which applies a voltage between the said anode and the said board | substrates, An electrolyte membrane is disposed to cover the opening, and the solution storage portion is disposed in contact with the solid electrolyte membrane, a first sealing material disposed to seal the opening, and Arranged to enclose the outside of the first seal material And a drainage port for draining the metal solution formed between the first sealing material and the second sealing material, and the film forming apparatus further comprises: The apparatus further comprises a transport unit for transporting the solid electrolyte membrane in a state where the metal solution is supplied to the storage space by the liquid supply unit.

  According to the film forming apparatus of the metal film according to the present invention, the first seal material arranged to seal the opening of the accommodation space, and the second seal arranged to surround the outer side of the first seal material At the time of film formation, the storage space can be sealed by the material in a state where the solid electrolyte membrane and the solution storage portion are in contact with each other. Thus, the metal film can be formed on the surface of the substrate in contact with the solid electrolyte film without the metal solution stored in the storage space leaking.

  After the film formation, the solid electrolyte membrane floats up from the solution storage unit by the metal solution supplied to the storage space in the liquid supply unit, so the solid electrolyte membrane may be transported by the transport unit without contacting the solution storage unit. it can. Thus, when the solid electrolyte membrane is transported and replaced, it is possible to prevent the solid electrolyte membrane from being caught in the solution storage portion.

  Furthermore, the metal solution in which the solid electrolyte membrane is lifted from the solution storage portion is drained from the drainage port formed between the first and second sealing materials without entraining bubbles, and the metal solution is stored in the solution. It does not spill from the department.

It is a schematic cross section of the film-forming apparatus of the metal film which concerns on embodiment of this invention. It is principal part sectional drawing of the film-forming apparatus shown in FIG. It is a figure for demonstrating the flow of the metal solution in the accommodation space at the time of conveyance of a solid electrolyte membrane, (a) is a top view of the chamber shown in FIG. 2, (b) is a composition shown in FIG. It is principal part sectional drawing of a membrane apparatus.

  Below, with reference to FIGS. 1-3, the film-forming apparatus of the metal film which concerns on embodiment of this invention is demonstrated.

1. Regarding Film Forming Apparatus 1 of Metal Film First, the film forming apparatus 1 of metal film will be described. FIG. 1 is a schematic cross-sectional view of a film-forming apparatus 1 for a metal film according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of relevant parts of the film-forming apparatus 1 shown in FIG. FIG. 3 is a view for explaining the flow of the metal solution L in the accommodation space G at the time of transporting the solid electrolyte film 13, and (a) is a plan view of the chamber 15 shown in FIG. 2 is a cross-sectional view of the main part of the film forming apparatus 1 shown in FIG.

  As shown in FIG. 1, a film forming apparatus 1 according to the present embodiment is an apparatus for depositing a metal film made of deposited metal on a surface of a substrate B by depositing a metal from metal ions. Here, the substrate B may be a substrate made of a metal material such as aluminum, a substrate in which a metal underlayer is formed on a treated surface of a resin or silicon substrate, or a semiconductor substrate (diode) in which current flows in one direction. be able to.

  The film forming apparatus 1 includes a solid electrolyte film 13 disposed between a metal anode 11 and a substrate B disposed above the anode 11 and a voltage between the anode 11 and the substrate B. And at least a power supply unit 14 for applying

  The anode 11 is electrically connected to the positive electrode of the power supply unit 14 via a chamber (solution storage unit) 15, and the substrate B to be the cathode is, for example, a power supply via a substrate holding member 17 made of a conductive material. It is electrically connected to the negative electrode of the part 14. An accommodation space G for accommodating a metal solution L described later is formed in the chamber 15 and is made of a material insoluble to the metal solution L. A suction passage 17 a for suctioning the substrate B is formed in the substrate holding member 17, and a pressing cylinder 18 for pressing the substrate B against the solid electrolyte film 13 is disposed above the suction passage 17 a.

  The anode 11 is disposed in the housing space G of the chamber 15, and examples thereof include ruthenium oxide, platinum, iridium oxide and the like which are insoluble in the metal solution L, and these metals are coated on a copper plate or the like. It may be an anode. In the present embodiment, the anode 11 may be a soluble anode made of the same metal as the metal of the metal film (metal of the metal ion of the metal solution L).

  By bringing the solid electrolyte film 13 into contact with the above-described metal solution L, metal ions can be impregnated inside, and when a voltage is applied, metals derived from metal ions can be deposited on the surface of the substrate B. If it is, it will not be limited in particular. The material of the solid electrolyte film 13 is, for example, a fluorocarbon resin such as Nafion (registered trademark) manufactured by DuPont, a hydrocarbon resin, a polyamic acid resin, and Seremion (registered trademark) manufactured by Asahi Glass (CMV, CMD, CMF series) Etc. can be mentioned.

  In the present embodiment, the solid electrolyte film 13 is in the form of a band, one end of which is wound around the delivery roller 31A, and the other end of which is wound around the take-up roller 31B. As shown in FIG. 1, the transfer rollers 33 are disposed on both sides of the chamber 15, and the solid electrolyte film 13 is opened at the opening of the chamber 15 by adjusting the heights of the transfer rollers 33. It may be located slightly above the chamber 15 above 15a. At the time of film formation, the solid electrolyte film 13 is pressed against the substrate B to cover the opening 15 a and completely seal the accommodation space G.

  The delivery roller 31A and the take-up roller 31B are configured to rotate in synchronization with each other, and the solid electrolyte film 13 can be transported by these rotations. The “conveying unit” in the present invention corresponds to the delivery roller 31A and the winding roller 31B.

  In the present embodiment, the delivery roller 31A and the take-up roller 31B are in a state in which the supply pump 23, described later, is operated after the metal film is formed (the state in which the metal solution L is supplied to the storage space G by the supply pump 23). , Rotates in synchronization, and transports the solid electrolyte membrane 13. As a result, the solid electrolyte film 13 floats up from the chamber 15, and the solid electrolyte film 13 can be transported without contacting the chamber 15.

  In the present embodiment, as described above, the chamber (solution storage unit) 15 stores the metal solution L, and a storage space G for storing the metal solution L is formed therein. The metal solution L may be, for example, an electrolytic solution containing ions of copper, nickel, silver, etc. In the metal solution L, a metal to be a metal film is present in the form of ions.

  An accommodation space G is formed in the chamber 15, and an opening 15 a equal to or larger than the size of the surface of the anode 11 is formed in the upper part of the chamber 15 so that the accommodation space G opens upward. It is done. At the time of film formation, the solid electrolyte film 13 is disposed so as to cover the opening 15a.

  Since the storage space G is opened upward, the metal solution L leaks out from the storage space G even if there is a defect in the solid electrolyte film 13 or the solid electrolyte film 13 is broken due to abnormal metal deposition. There is no.

  In the present embodiment, the film forming apparatus 1 includes the supply pump 23 (liquid supply unit) that supplies the metal solution L to the storage space G of the chamber 15. The supply pump 23 is connected to the tank 26 so as to suck the metal solution L from the tank 26 containing the metal solution L.

  The supply pump 23 is in communication with the accommodation space G of the chamber 15 via the supply flow passage 15 b, and the metal solution L supplied to the chamber 15 is sprayed toward the solid electrolyte membrane 13. 15b is formed. The opening (supply port) facing the accommodation space G of the supply flow passage 15b is formed in a slit shape along the peripheral wall surface forming the accommodation space G in the vicinity of the opening 15a.

  Further, in the chamber 15, a discharge flow path 15c for discharging the metal solution L supplied from the supply flow path 15b and stored in the storage space G is formed, and the discharge flow path 15c communicates with the tank 26. There is. An opening (discharge port) facing the housing space G of the discharge flow passage 15c is formed in a slit shape along the peripheral wall surface forming the housing space G in the vicinity of the opening 15a.

  By forming the supply flow path 15b and the discharge flow path 15c having such openings, it is possible to suppress adhesion of air bubbles generated from the anode 11 to the solid electrolyte film 13 by the liquid flow of the metal solution L. . Further, the air bubbles flowed by the liquid flow of the metal solution L are discharged together with the metal solution L supplied to the storage space G to the tank 26 via the discharge flow path 15 c by the hydraulic pressure from the supply pump 23. Can.

  Further, as shown in FIGS. 1 and 3A, the chamber 15 includes a first seal member 41 and a second seal member 42. The first seal member 41 is disposed so as to seal the opening 15 a of the accommodation space G in a state of being in contact with the solid electrolyte film 13. The second seal member 42 is disposed to surround the outer side of the first seal member 41.

  Between the first seal member 41 and the second seal member 42, a drain port 15d is formed for draining the metal solution L flowing therebetween. The drainage port 15d is connected to the drainage pump 24 via a drainage passage 15e. The drainage pump 24 is connected to the tank 26 via the drainage passage 15 e so as to push out the metal solution L discharged from the drainage port 15 d of the chamber 15 to the tank 26.

2. About the film-forming method of a metal film Below, the film-forming method of the metal film concerning this embodiment is demonstrated, referring FIG. 1 and FIG. First, in the present embodiment, the solid electrolyte film 13 is disposed above the opening 15 a of the chamber 15 so as to cover the opening 15 a.

  Next, as shown in FIG. 2, the air in the suction passage 17a of the substrate holding member 17 is suctioned to adsorb the substrate B to the substrate holding member 17 and hold it. In this state, the substrate holding member 17 is lowered by the cylinder 18 to press the substrate B against the solid electrolyte film 13.

  Thus, the opening 15a is covered with the solid electrolyte film 13, and the first and second sealing materials 41 and 42 are pressed against the solid electrolyte film 13 to press the storage space G in which the metal solution L is stored. It can be completely sealed at 13.

  In this state, as shown in FIG. 1, the supply pump 23 is operated to suck the metal solution L from the tank 26 containing the metal solution L, and the storage space G of the chamber 15 is supplied via the supply flow path 15b. The metal solution L is supplied. When the metal solution L supplied to the storage space G reaches a predetermined pressure, the metal solution L is discharged from the storage space G to the tank 26 via the discharge flow path 15c.

  Next, a voltage is applied between the anode 11 and the substrate B by the power supply unit 14. When a voltage is applied between the anode 11 and the substrate B, metal ions of the metal solution L accommodated in the accommodation space G flow in the solid electrolyte film 13 from the anode 11 toward the substrate B and the surface of the substrate B This is reduced and the metal is deposited. Thereby, a metal film can be formed on the surface of the substrate B.

  After the film formation of the metal film is completed, the substrate holding member 17 is raised by the cylinder 18 to separate the substrate B from the solid electrolyte film 13 and the suction of the air in the suction passage 17 a is stopped. Remove the board B.

  When the substrate holding member 17 is raised by the cylinder 18 to separate the substrate B from the solid electrolyte film 13, as shown in FIGS. 3A and 3B, the supply pump 23 is operating. The metal solution L accommodated in the accommodation space G overflows from the opening 15a.

  However, at this time, by operating the drainage pump 24, the overflowing metal solution L can be drained from the drainage port 15d formed between the first sealing material 41 and the second sealing material 42. it can.

  The metal solution L discharged from the drainage port 15d is sucked into the drainage pump 24 through the drainage passage 15e as shown in FIG. 3B, and the metal solution L sucked is contained in the tank 26. Discharged into Since the metal solution L is drained from the drainage port 15 d formed between the first and second sealing materials 41 and 42, even if the metal solution L overflows from the opening 15 a, it spills out of the chamber 15. Can be avoided.

  Furthermore, in the present embodiment, since the supply pump 23 and the drainage pump 24 are operated simultaneously, the space between the solid electrolyte film 13 and the chamber 15 may be made of metal solution L as shown in FIG. 3 (a). Liquid flow occurs. Therefore, even if the solid electrolyte film 13 floats up from the chamber 15, air can be prevented from entering as a bubble between them.

  Furthermore, as described above, the solid electrolyte film 13 floats up from the chamber 15 by the metal solution L supplied from the supply pump 23, so the solid electrolyte film 13 is wound around the delivery roller 31A without contacting the chamber 15. It can be transported by the take-up roller 31B. Thus, when the solid electrolyte film 13 is transported and replaced, the solid electrolyte film 13 can be prevented from being caught in the chamber 15.

  As mentioned above, although the embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and there are design changes and the like within the scope of the present invention. Also, they are included in the present invention.

  1: film forming apparatus, 11: anode, 13: solid electrolyte membrane, 14: power supply unit, 15 chambers (solution processing unit), 15a: opening, 15d: drain, 23: supply pump, 24: drainage pump , 26: tank, 31A: delivery roller (conveyance unit), 31B: take-up roller (conveyance unit), 41: first seal material, 42: second seal material, G: accommodation space, L: metal solution

Claims (1)

With the anode,
A solid electrolyte film disposed above the anode such that the surface of the substrate is in contact with the substrate between the anode and a substrate corresponding to the cathode;
A solution storage portion in which a storage space for storing a metal solution containing metal ions is formed together with the anode, and an opening is formed so that the storage space is opened upward;
A liquid supply unit that supplies the metal solution to the storage space of the solution storage unit;
It is a film-forming apparatus of the metal film provided with the power supply part which applies a voltage between the said anode and the said board | substrate,
The solid electrolyte membrane is disposed to cover the opening,
The solution storage portion includes a first seal member disposed to seal the opening in a state of being in contact with the solid electrolyte membrane, and a second seal disposed to surround the outer side of the first seal member. And a drainage port for draining the metal solution formed between the first sealing material and the second sealing material,
The film forming apparatus for metal film, further comprising: a transfer unit for transferring the solid electrolyte film in a state where the metal solution is supplied to the storage space by the liquid supply unit.

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