JP6740572B2 - Electronic device, electronic device, and base station device - Google Patents

Description

The present invention relates to an electronic device, an electronic device, and a base station device.

Conventionally, as an example of an electronic device, a vibrating device (vibrator) in which the temperature of the vibrating element is stabilized by heating the vibrating element and the resonance frequency is stable has been known. For example, in Patent Document 1, a heater IC (Integrated Circuit) and a crystal oscillator are housed in a package made of ceramic or the like, and an oscillation element (oscillation IC) having a function of vibrating the crystal oscillator is provided in the package. A temperature compensated crystal oscillator (OCXO) provided outside is disclosed.

JP, 2014-192674, A

However, in the temperature-compensated crystal oscillator (OCXO) as an example of the vibrating device having the above-described configuration, the vibrating element is heated and kept at a constant temperature, but the oscillator (oscillation IC) is provided outside the package. Therefore, the temperature is likely to change. When the temperature of the oscillation element (oscillation IC) changes, the temperature-dependent characteristic (temperature characteristic) of the oscillation element (oscillation IC) changes, and as a result, the oscillation frequency of the oscillation element changes, and the oscillation frequency There was a possibility that the accuracy of the above could not be maintained.

The present invention has been made to solve at least a part of the problems described above, and can be realized as the following modes or application examples.

Application Example 1 An electronic device according to this application example has a package including a recess including a thin bottom portion and a thick bottom portion thicker than the thin bottom portion, an oscillation portion provided in the thin bottom portion, and the thick bottom portion. A first connecting portion including a connecting portion between the heating element and the oscillating portion, a second connecting portion including a connecting portion between the heating element, and the first connecting portion and the second connecting portion. And a heat conducting portion having a connecting portion that connects the.

According to this application example, the heating element is arranged in the thick bottom portion having a large heat capacity, the oscillating portion is arranged in the thin bottom portion having a small heat capacity, and they are connected by the heat conducting portion. With this heat conducting portion, it is possible to efficiently conduct heat from the thick bottom portion having a large heat capacity to the thin bottom portion having a small heat capacity, and the oscillation portion arranged at the thin bottom portion can be stabilized at a higher temperature. As a result, it is possible to reduce the range of temperature change of the oscillator, and improve the temperature accuracy of the oscillator. This makes it possible to provide an electronic device with improved oscillation frequency accuracy.

Application Example 2 In the electronic device described in the above application example, it is preferable that the connecting portion is in contact with a step side surface provided between the thick bottom portion and the thin bottom portion.

According to this application example, the connecting portion that is in contact with the step side surface provided between the thick bottom portion and the thin bottom portion can efficiently perform heat transfer from the thick bottom portion to the thin bottom portion. The thin bottom part can be easily heated.

Application Example 3 In the electronic device according to the application example described above, it is preferable that the connecting portion includes a first via electrically connected to the oscillating portion.

According to this application example, by using the first via as the heat transfer member forming the connecting portion, both electrical connection and thermal connection can be achieved. This makes it possible to simplify the structure of the connecting portion (heat conduction portion).

Application Example 4 In the electronic device according to the application example described above, a lid portion that covers the recess is provided, and the lid portion is connected to the heating element or the heat conduction portion, and at least the connection portion and the connection portion. It is preferable that the second connection part and the oscillation part are included and connected to the package.

According to this application example, since the concave portion accommodating the heating element, the oscillating portion, or the heat conducting portion is included by the lid portion connected to the heating element or the heat conducting portion, the temperature distribution in the concave portion can be further improved. It becomes possible to make uniform.

APPLICATION EXAMPLE 5 In the electronic device described in the above application example, it is preferable that the lid has conductivity.

According to this application example, since the lid portion has conductivity, the lid portion can have a fixed potential, and the lid portion can have a shielding effect against electric noise. This makes it possible to suppress the intrusion of noise.

Application Example 6 In the electronic device according to the application example described above, it is preferable that the lid section is connected to the heat conducting section via a second via provided in the package.

According to this application example, since the lid portion is connected to the second connection portion (heat conduction portion) by the second via, the lid portion can be heated more efficiently. Therefore, it is possible to reduce variations in the temperature distribution of the temperature inside the recess of the package.

Application Example 7 In the electronic device according to the application example described above, the package has a pad electrode provided between the thick bottom portion and the thin bottom portion in plan view, and the pad electrode is made of metal. It is preferable that the wiring is connected to the oscillation unit.

According to this application example, since the periphery of the pad electrode can also be heated by the heat conducting portion, it is possible to improve the total heating efficiency of the oscillating portion.

Application Example 8 In the electronic device according to the application example described above, the metal wiring is provided in a position overlapping with other outer peripheral edges of the oscillation portion on the side where the connecting portion is located, except for the outer peripheral edge thereof in plan view. Preferably.

According to this application example, since the pad electrode is not arranged between the oscillating portion and the heating element in a plan view, the area and volume of the heat conducting portion can be increased. This makes it possible to more efficiently conduct heat from the thick bottom portion to the thin bottom portion.

Application Example 9 In the electronic device according to the above application example, the electronic device further includes a second lid portion having conductivity, and the second lid portion includes at least a part of the recess side and the outer side surface of the package. However, it is preferably connected to the package.

According to this application example, since the second lid portion encloses at least a part of the concave portion side and the outer side surface of the package, it is possible to make the temperature distribution of the entire package uniform.

Application Example 10 An electronic apparatus according to this application example is characterized by including the electronic device described in any one of the above application examples.

According to this application example, since the range of temperature change of the oscillation unit is small and the electronic device having the higher temperature accuracy of the oscillation unit is provided, it is possible to provide an electronic device with further improved accuracy of oscillation. Becomes

Application Example 11 A base station apparatus according to this application example is characterized by including the electronic device described in any one of the above application examples.

According to this application example, since the range of temperature change of the oscillation unit is small and the electronic device having the increased temperature accuracy of the oscillation unit is provided, it is possible to provide the base station apparatus with further improved accuracy of oscillation. It will be possible.

1 is a plan view showing an outline of an electronic device according to a first embodiment of the invention. 1 is a cross-sectional view taken along the line AA of FIG. 1, showing an outline of an electronic device according to a first embodiment. Sectional drawing (partially enlarged view) which shows the heat conduction part which comprises the electronic device which concerns on 1st Embodiment. The top view which shows the outline of the electronic device which concerns on 2nd Embodiment of this invention. FIG. 5 is a cross-sectional view taken along the line BB of FIG. 4, showing an outline of the electronic device according to the second embodiment. The perspective view which shows the heat conduction part which comprises the electronic device which concerns on 2nd Embodiment. The top view which shows the outline of the electronic device which concerns on 3rd Embodiment of this invention. FIG. 8 is a cross-sectional view taken along line CC of FIG. 7, showing an outline of an electronic device according to a third embodiment. The perspective view which shows the connection part in the heat conduction part which comprises the electronic device which concerns on 3rd Embodiment. The top view which shows the outline of the electronic device which concerns on 4th Embodiment of this invention. FIG. 11 is a cross-sectional view taken along line DD of FIG. 10, showing an outline of an electronic device according to a fourth embodiment. The top view which shows the outline of the electronic device which concerns on 5th Embodiment of this invention. The top view which shows the outline of the electronic device which concerns on 6th Embodiment of this invention. The outline of the electronic device which concerns on 6th Embodiment is shown, and the EE sectional view of FIG. FIG. 12 is a front sectional view schematically showing an electronic device according to a seventh embodiment of the present invention. The functional block diagram which shows one structural example of the electronic device of this invention. FIG. 3 is a schematic diagram showing a configuration example of a network server as an example of an electronic device. FIG. 3 is a perspective view showing a configuration of a mobile personal computer as an example of an electronic device. FIG. 3 is a perspective view showing a configuration of a mobile phone as an example of an electronic device. The perspective view showing the composition of the digital still camera as an example of electronic equipment. The functional block diagram which shows the structural example of the positioning system to which the base station apparatus of this invention is applied.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following, for convenience of description, in each drawing, an X axis, a Y axis, and a Z axis are shown as three axes orthogonal to each other, and a direction parallel to the X axis is an “X axis direction” and a Y axis. The direction parallel to is called the “Y-axis direction”, and the direction parallel to the Z-axis is called the “Z-axis direction”. Further, the +Z axis side is also referred to as “upper” or “upper”, and the −Z axis side is also referred to as “lower” or “lower”.

<First Embodiment>
An electronic device according to the first embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3. 1 and 2 schematically show an electronic device according to a first embodiment of the present invention, FIG. 1 is a plan view, and FIG. 2 is a sectional view taken along line AA of FIG. In FIG. 1, the lid 30 and the vibrating element 17 shown in FIG. 2 are omitted (perspective). FIG. 3 is a cross-sectional view (partially enlarged view) taken along the line AA of FIG. 1, showing the heat conducting portion that constitutes the electronic device according to the first embodiment.

The electronic device 1 according to the first embodiment of the present invention is a so-called temperature control type oscillator (vibration device) in which the vibration element (crystal vibrating piece) 17 and the heating element 26 are housed in the package 20. The electronic device 1 shown in FIGS. 1 and 2 includes a vibrating element 17, a package 20 that houses the vibrating element 17, a circuit element 19 as an oscillating unit having at least a function of oscillating the vibrating element 17, and the vibrating element 17. And a lid 30 as a lid portion that forms an internal space (accommodation space) 16 with the package 20. Hereinafter, the vibrating element 17, the package 20, the circuit element 19 as the oscillating section, the heating element 26, and the lid 30 as the lid section will be sequentially described in detail.

(Vibration element)
The resonator element 17 of this embodiment uses an AT-cut quartz substrate (piezoelectric substrate) made of quartz as an example of a piezoelectric material. Although not shown, a piezoelectric material such as quartz crystal belongs to a trigonal system and has crystal axes X, Y and Z orthogonal to each other. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. As the crystal substrate, a flat plate cut out from crystal along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ is used. For example, in the case of an AT cut crystal substrate, θ is about 35°15'. The Y axis and the Z axis are also rotated by θ around the X axis to form the Y′ axis and the Z′ axis, respectively. Therefore, the AT-cut quartz substrate has crystal axes X, Y', Z'which are orthogonal to each other. In the AT-cut quartz crystal substrate, the thickness direction is the Y'axis, the XZ' plane (the plane including the X axis and the Z'axis) orthogonal to the Y'axis is the main surface, and the thickness shear vibration is the main vibration. Be excited. By processing this AT-cut quartz crystal substrate, a piezoelectric substrate as a base plate of the vibration element 17 can be obtained. That is, in the piezoelectric substrate, the Z axis is tilted in the -Y direction of the Y axis about the X axis of the orthogonal coordinate system including the X axis (electrical axis), the Y axis (mechanical axis), and the Z axis (optical axis). The axis is the Z'axis, the Y axis is the axis tilted in the +Z direction of the Z axis, and the Y'axis is composed of planes parallel to the X axis and the Z'axis, and the thickness is the direction parallel to the Y'axis. It consists of an AT-cut crystal substrate.

The crystal substrate according to the present invention is not limited to the AT cut having the angle θ of about 35°15′ as described above, but other piezoelectric such as SC cut and BT cut for exciting thickness shear vibration. The substrate can also be widely applied.

In the vibrating element 17 of the present embodiment, various electrodes are provided on the front and back surfaces (main surfaces) of the element pieces of the AT-cut quartz crystal substrate (piezoelectric substrate) formed in a disk shape with quartz as an example of a piezoelectric material. There is. In this example, an excitation electrode 18 and a connection electrode (not numbered) are formed as various electrodes. Note that, in FIG. 2, various electrodes are not shown for convenience of reading the drawing. The excitation electrode 18 is provided in a substantially circular shape at the center of the front and back main surfaces of the vibration element 17. The connection electrode (not numbered) is arranged so as to extend from the excitation electrode 18 to one end of the front and back main surfaces. The excitation electrodes 18 and the connection electrodes on the front and back sides are provided so as to face each other with substantially the same shape.

(package)
The package 20 will be described with reference to FIG. 3 in addition to FIGS. 1 and 2. The package 20 is provided on the plate-shaped bottom plate 11, the frame-shaped first frame plate 12 provided on the peripheral portion of the upper surface 11 a of the bottom plate 11, and the peripheral portion of the upper surface 12 a of the first frame plate 12. The frame-shaped second frame plate 13, the frame-shaped third frame plate 14 provided on the peripheral portion of the upper surface 13a of the second frame plate 13, and the peripheral portion of the upper surface 14a of the third frame plate 14. The frame-shaped side wall 15 is included. A seam ring 29 used as a joining material for joining a lid 30 as a lid portion described later is provided on the upper surface 20a of the side wall 15. The package 20 accommodates the vibrating element 17, the circuit element 19 as an oscillating unit, the heating element 26, and the like.

The package 20 has a concave portion (internal space 16) that opens to the upper surface. The opening of the recess is closed by a lid 30 as a lid that is joined to the side wall 15 via a seam ring 29 as a joining material. Then, the lid 30 closes the opening of the recess of the package 20 to form the sealed internal space 16. The internal pressure of the sealed internal space 16 can be set to a desired atmospheric pressure. For example, the internal space 16 is filled with nitrogen gas to have an atmospheric pressure or vacuum (pressure lower than normal atmospheric pressure (1×10 ⁵ Pa to 1×10 ⁻¹⁰ Pa or less (JIS Z 8126-1:1999)). It is possible to continue more stable vibration of the vibrating element 17 by setting the state of the space)). The internal space 16 of the present embodiment is set in the above vacuum state. Further, the internal space 16 used in the electronic device 1 as in the present embodiment is sealed by closing the opening of the recess of the package 20, and is filled with nitrogen gas to have an atmospheric pressure or a vacuum (normal atmospheric pressure). It is preferable to use a lower pressure (a state of a space filled with a gas of 1×10 ⁵ Pa to 1×10 ⁻¹⁰ Pa or less), but this is not the case for electronic devices having other configurations. For example, in another configuration, the configuration may be filled with nitrogen (N ₂ ) gas or the configuration may be open to the atmosphere.

The first frame plate 12 joined to the upper surface 11a of the bottom plate 11 has a frame shape having an opening in the center. The second frame plate 13 joined to the upper surface 12a of the frame-shaped first frame plate 12 has an opening end outside (both directions) of the opening of the first frame plate 12 in the X-axis direction, and has a Y-axis direction. In, a frame shape having an opening having an opening end overlapping with the opening of the first frame plate 12 is formed. The third frame plate 14 joined to the upper surface 13a of the frame-shaped second frame plate 13 has an opening end outside the opening of the second frame plate 13 in the X-axis direction, and has a second end in the Y-axis direction. It has a frame shape with an opening having an opening end that overlaps with the opening of the frame plate 13.

The side wall 15 joined to the upper surface 14a of the frame-shaped third frame plate 14 has an opening end outside the opening of the third frame plate 14 in the X-axis direction, and has a third frame plate 14 in the Y-axis direction. Is provided in an approximately rectangular frame shape along the outer peripheral edge (upper peripheral portion) of the package 20 in which the bottom plate 11 to the third frame plate 14 are stacked. In other words, the side wall 15 has a substantially rectangular peripheral shape having an opening shape that opens to the upper surface of the recess. A seam ring 29 made of an alloy such as Kovar is provided on the upper surface 20a of the frame-shaped side wall 15. The seam ring 29 has a function as a bonding material between the lid 30 as a lid portion and the side wall 15, and is provided in a frame shape (a substantially rectangular peripheral shape) along the upper surface 20 a of the side wall 15. ..

In the package 20 having such a configuration, the region exposed by the opening of the first frame plate 12 and in which the bottom plate 11 (upper surface 11a) on which the first connection portion 25c is disposed is located corresponds to the thin bottom portion of the package 20. To do. Further, the first frame plate 12 and the second frame plate 13 are laminated on the bottom plate 11, are exposed by the opening of the third frame plate 14, and the upper surface of the second frame plate 13 on which the second connection portion 25a is arranged. The region where 13a is located corresponds to the thick bottom portion of the package 20. That is, the package 20 has a thin bottom portion, which is an area where the bottom plate 11 (upper surface 11a) is located, in the center thereof, and an upper surface 13a of an area in which the first frame plate 12 and the second frame plate 13 are laminated on the bottom plate 11. The region is located, and has a concave portion including a thick bottom portion that is thicker than the thin bottom portion. The concave portion opened (opened) on the upper surface forms the internal space 16.

The package 20 is formed of a material having a coefficient of thermal expansion that matches or is as close as possible to the coefficient of thermal expansion of the vibrating element 17, the heating element 26, and the lid 30, and in this example, ceramic is used. The package 20 is formed by stacking green sheets formed into a predetermined shape and sintering them. The green sheet is, for example, a sheet-like kneaded product produced by dispersing ceramic powder in a predetermined solution and adding a binder.

Further, as shown in FIG. 3, the upper surface 13 a of the second frame plate 13 exposed in the opening of the third frame plate 14, the opening side surface (step side surface) 13 c of the third frame plate 14, and the opening of the second frame plate 13. The upper surface 12a of the first frame plate 12 exposed on the upper surface, the opening side surface (step side surface) 13c of the second frame plate 13, and the upper surface 11a of the bottom plate 11 exposed on the opening of the first frame plate 12 include the second frame plate. A heat conducting portion 25 is provided that connects from the upper surface 13 a of 13 to the upper surface 11 a of the bottom plate 11.

The heat conducting section 25 will be described in more detail. The heat conducting portion 25 is provided on the upper surface 11a of the bottom plate 11, is provided on the first connecting portion 25c including a connecting portion with the circuit element 19 as an oscillating portion, which will be described later, and is provided on the upper surface 13a of the second frame plate 13, and will be described later. The second connection portion 25a including the connection portion with the heating element 26, the opening side surface (step side surface) 13c of the third frame plate 14, the upper surface 12a of the first frame plate 12, the opening side surface of the second frame plate 13 ( The connecting portion 25d that is provided over the step side surface 13c and that connects the first connecting portion 25c and the second connecting portion 25a is provided. The connecting portion 25d is provided in contact with the first connecting portion 25b provided in contact with the upper surface 12a of the first frame plate 12 and the opening side surface (step side surface) 12c of the first frame plate 12. The second connecting portion 25f as a connecting portion and the third connecting portion 25e as a connecting portion provided in contact with the opening side surface (step side surface) 13c of the second frame plate 13 are included.

By the connecting portion 25d including the second connecting portion 25f that is in contact with the opening side surface (step portion side surface) 12c and the third connecting portion 25e that is in contact with the opening side surface (step portion side surface) 13c, Heat can be efficiently transferred from the second connecting portion 25a located at the thick bottom portion to the first connecting portion 25c located at the thin bottom portion, and as a result, the thin bottom portion can be easily heated.

The heat conducting portion 25 is formed by using, for example, tungsten metallization, firing it after forming a required shape, and then plating nickel and gold or silver. It is desirable to use a material having a relatively high thermal conductivity for the heat conducting portion 25. For example, in addition to the above-described tungsten metallization, a conductive paste containing silver/palladium as a main component can be used. In this case, it can be formed by performing a curing (drying) process after forming the shape required by the conductive paste. Further, the heat conducting portion 25 can also be formed by using another forming method such as a sputtering method using tungsten or the like or an evaporation method.

The four pad electrodes 28 are provided on the upper surface 14 a of the third frame plate 14 exposed in the opening of the side wall 15. Moreover, pad electrodes 23 and 24 are provided on the upper surfaces 12 a and 12 b of the first frame plate 12 exposed in the openings of the second frame plate 13. Specifically, three pad electrodes 24 are provided in each of the regions on both sides of the first connecting portion 25b on the one upper surface 12a, and two pad electrodes 23 are provided on the other upper surface 12b. ing.

The pad electrodes 23, 24, and 28 are formed of a conductive paste such as silver and palladium or tungsten metallization, similarly to the heat conducting portion 25, and are fired after forming a required shape, and then nickel and gold or It is formed by plating silver or the like. The pad electrodes 23, 24, 28 are arranged so as to be connected to the connection electrodes of the vibration element 17, the circuit element 19, and the heating element 26, which will be described later. Note that the number of pad electrodes 23, 24, 28 may be provided as needed, and is not limited to the number in this example. Some of the pad electrodes 23, 24, 28 are electrically connected to an external connection terminal (not shown) formed on the outer bottom of the package 20. Can be electrically connected to, for example, the circuit element 19.

(Heating element)
The heating element 26 heats the connected vibration element 17 and also heats the circuit element 19 via the heat conducting portion 25. The heating element 26 is an electronic component having a so-called constant temperature function of keeping the temperature of the vibration element 17 and the circuit element 19 constant. The heating element 26 is provided with a heating element including a power transistor, a temperature sensor, a functional element, etc. on the functional surface side of a substrate formed of a semiconductor or the like. The temperature is controlled by the heating element whose temperature is controlled by the temperature sensor, and a constant temperature can be maintained. Bonding pads (not shown) are provided on the functional surface (upper surface).

The heat generating element 26 is fixed on the second connecting portion 25a constituting the heat conducting portion 25 described above by a resin adhesive (not shown) or the like. The heat generating element 26 connects the vibrating element 17 on a functional surface (upper surface) that is a surface opposite to the surface on the second connecting portion 25a side. The bonding pads provided on the heating element 26 are electrical external connection electrodes, and each is electrically connected to the pad electrode 28 provided on the upper surface 14 a of the third frame plate 14 by the metal wiring (bonding wire) 27. It is connected to the. A part of the pad electrode 28 is electrically connected to an external connection electrode (not shown) formed on the outer bottom of the package 20.

The vibrating element 17 is connected to the heating element 26 at one end using a conductive adhesive (not shown). Although not shown, the connection electrode on the upper surface of the vibration element 17 is electrically connected to one of the pad electrodes 28 provided on the upper surface 14a of the third frame plate 14 by a metal wiring (bonding wire). .. Further, the connection electrode on the back surface of the vibration element 17 is electrically connected to the connection electrode provided on the heating element 26. As described above, by directly connecting the vibrating element 17 to the heat generating element 26, it is possible to prevent the temperature of the vibrating element 17 from decreasing, and it is possible to stably maintain the temperature of the vibrating element 17.

(Circuit element)
The circuit element 19 as the oscillating section is connected to the first connecting section 25c provided on the upper surface 11a of the bottom plate 11 by, for example, a conductive adhesive (not shown). The circuit element 19 includes, for example, an oscillation circuit that oscillates the vibrating element 17, a control circuit that controls the temperature of the heating element 26, and the like. The temperature control of the heating element 26 is performed as a so-called constant temperature function of keeping the temperature of the vibration element 17 and the circuit element 19 constant. Bonding pads (not shown) are provided on the active surface of the circuit element 19, and are provided on the bonding pads and the upper surfaces 12a and 12b of the first frame plate 12 exposed in the openings of the second frame plate 13, respectively. The pad electrodes 23 and 24 are electrically connected to each other by metal wirings (bonding wires) 21 and 22. Although not shown, the pad electrodes 23 and 24 are electrically connected to other pad electrodes 28 and external connection terminals (not shown).

In a plan view seen from the Z-axis direction, the upper surface 12a of the first frame plate 12 provided with the pad electrode 24 between the thick bottom portion and the thin bottom portion is disposed so as to be adjacent to the pad electrode 24. The heat conducting portion 25 is provided. With such a configuration, the region in the vicinity of the pad electrode 24 is heated by the heat conducting portion 25, so that the total heating efficiency of the circuit element 19 can be improved.

In this embodiment, in the heat conducting portion 25, the connecting portion 25d is provided at the central portion in the Y-axis direction, and the pad electrodes 24 are provided on both sides of the connecting portion 25d. However, the configuration is not limited to this. Absent. The connecting portion 25d only needs to connect the first connecting portion 25c and the second connecting portion 25a, and the connecting portion 25d is provided at any position, for example, one connecting portion 25d is provided on each end side in the Y-axis direction. It may be.

(Lid as lid)
The lid 30 as a lid is a plate-shaped member, and closes an opening of a recess opened on the upper surface of the package 20 to form an internal space 16. The lid 30 is joined to the periphery of the opening of the recess corresponding to the upper surface 20a of the side wall 15 by using, for example, a seam welding method. Since the lid 30 of this example is plate-shaped, it can be easily formed and is excellent in shape stability. In addition, the lid 30 of the present example uses a Kovar plate material having conductivity.

By using a Kovar plate for the lid 30, the seam ring 29 formed of Kovar and the lid 30 are melted in the same molten state at the time of sealing, and are easily alloyed, which facilitates sealing. It can be performed reliably. Further, by using a plate material having conductivity for the lid 30, the lid 30 can be made to have a fixed potential, and the lid 30 can have a shielding effect. As a result, it becomes possible to prevent electrical noise that enters from the lid 30 side. Note that the lid 30 may be made of a plate material of another material instead of Kovar, and for example, a metal material such as 42 alloy or stainless steel, or the same material as the side wall 15 of the package 20 can be used.

According to the electronic device 1 according to the first embodiment, the heat generating element 26 is arranged on the second connecting portion 25a provided on the upper surface 13a of the second frame plate 13 which is a thick bottom portion having a large heat capacity, and the thin heat generating element 26 has a small heat capacity. The circuit element 19 is arranged on the first connecting portion 25c provided on the upper surface 11a of the bottom plate 11 which is the bottom portion. The second connecting portion 25a and the first connecting portion 25c are connected via the connecting portion 25d including the first connecting portion 25b, the second connecting portion 25f, and the third connecting portion 25e, and the heat conducting portion 25 is configured. There is. Therefore, the heat generating element 26 and the circuit element 19 are connected to each other via the heat conducting portion 25. With such a heat conducting portion 25, the heat quantity obtained by the heating element 26 can be efficiently conducted from the thick bottom portion having a large heat capacity to the thin bottom portion having a small heat capacity, and the heat conducting portion 25 is arranged at the thin bottom portion. The circuit element 19 as the oscillator can be stabilized at a higher temperature. This makes it possible to reduce the range of temperature change of the circuit element 19 and improve the temperature accuracy of the circuit element 19. As a result, it is possible to provide the electronic device 1 with improved oscillation frequency accuracy.

<Second Embodiment>
Next, an electronic device according to the second embodiment of the present invention will be described with reference to FIGS. 4, 5, and 6. 4, 5, and 6 schematically show an electronic device according to a second embodiment of the present invention, FIG. 4 is a plan view, and FIG. 5 is a sectional view taken along line BB of FIG. In addition, in FIG. 4, the lid 30 and the vibrating element 17 illustrated in FIG. 5 are omitted (perspective). FIG. 6 is a perspective view showing a heat conducting unit that constitutes the electronic device according to the second embodiment.

The electronic device 2 according to the second embodiment of the present invention is of a so-called temperature control type in which the vibrating element (quartz crystal vibrating piece) 17 and the heating element 26 are housed in the package 20, as in the first embodiment. It is an oscillator. The electronic device 2 shown in FIGS. 4 and 5 is, as in the first embodiment, a vibrating element 17, a package 20 that houses the vibrating element 17, and an oscillating unit that has at least the function of oscillating the vibrating element 17. A circuit element 19, a heat generating element 26 that is connected to the vibrating element 17 and heats the vibrating element 17 and the like, and a lid 30 that serves as a lid that forms an internal space (accommodation space) 16 between the package 20. have.

The electronic device 2 according to the second embodiment is different from the electronic device 1 according to the first embodiment in the configuration of the heat conducting portion. Hereinafter, the electronic device 2 according to the second embodiment will be described in detail. However, the vibrating element 17, the circuit element 19, the lid 30, and the package 20 having the same configuration as the electronic device 1 according to the first embodiment described above. The same symbols are attached to some of the configurations, and the description thereof may be omitted.

As in the first embodiment, the package 20 constituting the electronic device 2 includes a plate-shaped bottom plate 11, a frame-shaped first frame plate 12 provided on the peripheral portion of the upper surface 11 a of the bottom plate 11, and a first frame plate 12. A frame-shaped second frame plate 13 provided on the peripheral portion of the upper surface 12a of the frame plate 12, and a frame-shaped third frame plate 14 provided on the peripheral portion of the upper surface 13a of the second frame plate 13, It includes a frame-shaped side wall 15 provided on the peripheral portion of the upper surface 14a of the third frame plate 14. A seam ring 29 is provided on the upper surface 20 a of the side wall 15 as a joining material for the lid 30 as a lid.

As described above, in the package 20 that constitutes the electronic device 2 according to the second embodiment, the heat conducting portion 32 (the heat conducting portion 25 of the first embodiment is provided in the recess (internal space 16) of the package 20. (Corresponding) configuration is different. Hereinafter, the configuration of the heat conducting portion 32 will be mainly described with reference to FIG.

As shown in FIG. 6, the heat conducting portion 32 is formed by, for example, bending a metal thin plate of copper (Cu) or copper alloy whose surface is plated with nickel (Ni) or tin (Sn). It is a molded product.

The heat conducting portion 32 is exposed at the upper surface 13a of the second frame plate 13 exposed at the opening of the third frame plate 14, the opening side surface (step side surface) 13c of the third frame plate 14, and the opening of the second frame plate 13. The upper surface 12a of the first frame plate 12, the opening side surface (step side surface) 13c of the second frame plate 13, and the upper surface 11a of the bottom plate 11 exposed in the opening of the first frame plate 12 are respectively copied so as to come into contact with each other. The upper surface 13 a of the frame plate 13 is connected to the upper surface 11 a of the bottom plate 11.

More specifically, referring to FIGS. 4, 5, and 6, the heat conducting portion 32 is provided on the upper surface 11a of the bottom plate 11, and includes a first connecting portion 37 including a connecting portion with the circuit element 19. The second connection portion 33 provided on the upper surface 13a of the second frame plate 13 and including the connection portion with the heating element 26, the opening side surface (step side surface) 13c of the second frame plate 13, and the upper surface of the first frame plate 12 12a and a connecting portion 42 that is provided across the opening side surface (step side surface) 12c of the first frame plate 12 and that connects the first connecting portion 37 and the second connecting portion 33. The connecting portion 42 is provided in contact with the first connecting portion 35 provided in contact with the upper surface 12a of the first frame plate 12 and the opening side surface (step side surface) 12c of the first frame plate 12. A second connecting portion 36 as a connecting portion and a third connecting portion 34 as a connecting portion provided in contact with the opening side surface (step side surface) 13c of the second frame plate 13 are included.

Further, the connecting portion 42 has an opening in the center, and connects the first connecting portion 37 and the second connecting portion 33 at both ends in the Y-axis direction. The pad electrode 24 is provided on the upper surface 12a of the first frame plate 12 exposed in the opening of the connecting portion 42, and is connected to the circuit element 19, the bonding pad, and the metal wiring (bonding wire) 21. .. Although not shown, the pad electrode 24 is electrically connected to another pad electrode 28 and an external connection terminal (not shown). With such a configuration, the heat conduction portion 32 (the connection portion 42) is arranged so as to surround the pad electrode 24 between the thick bottom portion and the thin bottom portion from both sides in a plan view viewed from the Z-axis direction. Therefore, the pad electrode 24 can be efficiently heated. Therefore, the total heating efficiency of the circuit element 19 including the pad electrode 24 can be improved.

In the present embodiment, the configuration is shown in which the connecting portion 42 has an opening in the center thereof and the pad electrode 24 is disposed therein, but the configuration is not limited to this. The connecting portion 42 has only to connect the first connecting portion 37 and the second connecting portion 33, and may be arranged at any position. For example, as in the above-described first embodiment (see FIG. 1), the connecting portion 42 may be provided in the central portion in the Y-axis direction and the pad electrodes 24 may be provided on both sides of the connecting portion 42. It may be configured to be provided on one of the two sides.

The electronic device 2 according to the second embodiment includes the second connecting portion 36 that is in contact with the opening side surface (step portion side surface) 12c and the third connecting portion 34 that is in contact with the opening side surface (step portion side surface) 13c. The connecting portion 42 can efficiently transfer heat from the second connecting portion 33 located at the thick bottom portion to the first connecting portion 37 located at the thin bottom portion, and as a result, easily heats the thin bottom portion. be able to. Further, the heat conducting portion 32 can be easily formed by bending a thin metal plate using press working or the like. Moreover, since the heat conducting portion 32 can be formed in a separate step, the electronic device 2 can be efficiently assembled.

<Third Embodiment>
Next, an electronic device according to the third embodiment of the present invention will be described with reference to FIGS. 7, 8 and 9. 7, 8 and 9 schematically show an electronic device according to a third embodiment of the present invention, FIG. 7 is a plan view, and FIG. 8 is a sectional view taken along line CC of FIG. 7. In FIG. 7, the lid 30 and the vibrating element 17 shown in FIG. 8 are omitted (perspective). FIG. 9 is a perspective view showing a connecting portion in the heat conducting portion that constitutes the electronic device according to the third embodiment.

The electronic device 3 according to the third embodiment of the present invention is of a so-called temperature control type in which the vibrating element (quartz crystal vibrating piece) 17 and the heating element 26 are housed in the package 20, as in the first embodiment. It is an oscillator. Similar to the first embodiment, the electronic device 3 shown in FIGS. 7 and 8 serves as an oscillating unit having at least a vibrating element 17, a package 20 that houses the vibrating element 17, and a function of causing the vibrating element 17 to oscillate. A circuit element 19, a heat generating element 26 that is connected to the vibrating element 17 and heats the vibrating element 17 and the like, and a lid 30 that serves as a lid that forms an internal space (accommodation space) 16 between the package 20. have.

The electronic device 3 according to the third embodiment is different from the electronic device 1 according to the first embodiment in the configuration of the heat conducting portion. Hereinafter, the electronic device 3 according to the third embodiment will be described in detail, but the vibration element 17, the circuit element 19, the lid 30, and the package 20 having the same configuration as the electronic device 1 according to the first embodiment described above. The same symbols are attached to some of the configurations, and the description thereof may be omitted.

As in the first embodiment, the package 20 that constitutes the electronic device 3 includes a plate-shaped bottom plate 11, a frame-shaped first frame plate 12 provided on the peripheral portion of the upper surface 11 a of the bottom plate 11, and a first frame plate 12. A frame-shaped second frame plate 13 provided on the peripheral portion of the upper surface 12a of the frame plate 12, and a frame-shaped third frame plate 14 provided on the peripheral portion of the upper surface 13a of the second frame plate 13, It includes a frame-shaped side wall 15 provided on the peripheral portion of the upper surface 14a of the third frame plate 14. A seam ring 29 is provided on the upper surface 20 a of the side wall 15 as a joining material for the lid 30 as a lid.

As described above, in the package 20 that constitutes the electronic device 3 according to the third embodiment, the heat conducting portion 45 (the heat conducting portion 25 of the first embodiment is provided in the recess (internal space 16) of the package 20. (Corresponding) configuration is different. Hereinafter, the configuration of the heat conducting portion 45 will be mainly described with reference to FIG.

The heat conducting portion 45 according to the third embodiment is provided in the opening of the first frame plate 12 and the second connecting portion 25a provided on the upper surface 13a of the second frame plate 13 exposed in the opening of the third frame plate 14. A first connecting portion 25c provided on the exposed upper surface 11a of the bottom plate 11 and a connecting portion 48 connecting the second connecting portion 25a and the first connecting portion 25c are provided.

Specifically, the heat conducting portion 45 is provided on the upper surface 11 a of the bottom plate 11, and is provided on the upper surface 13 a of the second frame plate 13 and the first connecting portion 25 c including the connecting portion with the circuit element 19 as an oscillating portion described later. A second connecting portion 25a which is provided and includes a connecting portion with a heating element 26 described later, an opening side surface (step portion side surface) 13c of the third frame plate 14, an upper surface 12a of the first frame plate 12, and a second frame plate 13 are provided. And a connecting portion 48 that is provided over the opening side surface (step portion side surface) 13c and connects the first connecting portion 25c and the second connecting portion 25a.

The connecting portion 48 is provided in contact with the upper surface 12a of the first frame plate 12 and the connecting portion 25b provided in contact with the opening side surface (step side surface) 12c of the first frame plate 12. Second connecting portion 25f and a first via that is partially exposed at the opening side surface (step side surface) 13c of the second frame plate 13 and connects the second connecting portion 25a and the first connecting portion 25b. 38 and 38 are included. As described above, in the heat conducting portion 45 of the present embodiment, the connecting portion 48 that uses the first via 38 as the heat transfer member is applied.

The first via 38 is a penetrating electrode and is formed, for example, by using copper (Cu) in a through hole penetrating from the upper surface 13a of the second frame plate 13 to the lower surface of the second frame plate 13 that is in contact with the first frame plate 12. It is formed by embedding (filling) a heat transfer member having good thermal conductivity and good electrical conductivity. In this way, by using the first via 38 as the connecting portion 48, it is possible to have both electrical connection and thermal connection. This allows the connecting portion 48 (heat conduction portion 45) to be easily configured.

The first via 38 is provided so that a part of the through hole (a part of the conductive member) is exposed at the opening side surface (step side surface) 13c of the second frame plate 13. In this way, by exposing a part of the first via 38 to the opening side surface (step side surface) 13c, the stress during heating due to the difference in the coefficient of thermal expansion between the heat transfer member and the second frame plate 13 is released. Therefore, the influence of the stress on the package 20 can be reduced. As the heat transfer member, tungsten (W), aluminum (Al) or the like can be used instead of copper (Cu).

Although not shown, the first via 38 is preferably electrically connected to the circuit element 19. With this configuration, the heat conduction portion 45 including the first via 38 can also serve as the electrical connection between the circuit element 19 and the heating element 26, and the efficiency of arranging the electrical wiring can be improved.

According to the electronic device 3 according to the third embodiment, the first connecting portion 25b in contact with the upper surface 12a, the first via 38 connecting the second connecting portion 25a and the first connecting portion 25b, and the opening side surface. The connecting portion 48 including the second connecting portion 25f in contact with the (step side surface) 12c efficiently transfers heat from the second connecting portion 25a located at the thick bottom portion to the first connecting portion 25c located at the thin bottom portion. As a result, heating of the thin bottom portion can be easily performed.

In the above description, the configuration in which one first via 38 is provided has been described, but the number of first vias 38 to be arranged is not limited to this, and any number of first vias 38 may be provided in the arrangement space. Good.

<Fourth Embodiment>
Next, an electronic device according to the fourth embodiment of the present invention will be described with reference to FIGS. 10 and 11. 10 and 11 schematically show an electronic device according to the fourth embodiment of the present invention, FIG. 10 is a plan view, and FIG. 11 is a sectional view taken along line D-D of FIG. 10. Note that, in FIG. 10, the lid 30 and the vibrating element 17 shown in FIG. 11 are omitted (perspective).

The electronic device 4 according to the fourth embodiment of the present invention is of a so-called temperature control type in which the vibrating element (crystal vibrating piece) 17 and the heat generating element 26 are housed in the package 20, as in the first embodiment. It is an oscillator. Similar to the first embodiment, the electronic device 4 shown in FIGS. 10 and 11 serves as an oscillating unit having at least a vibrating element 17, a package 20 that houses the vibrating element 17, and a function of causing the vibrating element 17 to oscillate. A circuit element 19, a heat generating element 26 that is connected to the vibrating element 17 and heats the vibrating element 17 and the like, and a lid 30 that serves as a lid that forms an internal space (accommodation space) 16 between the package 20. have.

The electronic device 4 according to the fourth embodiment has a second via 39 on the side wall 15 in addition to the configuration of the electronic device 1 of the first embodiment. Hereinafter, the electronic device 4 according to the fourth embodiment will be described in detail. However, the vibrating element 17, the circuit element 19, the lid 30, and the package 20 having the same configuration as the electronic device 1 according to the first embodiment described above. The same symbols are attached to some of the configurations, and the description thereof may be omitted.

As in the first embodiment, the package 20 constituting the electronic device 4 includes a plate-shaped bottom plate 11, a frame-shaped first frame plate 12 provided on the peripheral portion of the upper surface 11 a of the bottom plate 11, and a first frame plate 12. A frame-shaped second frame plate 13 provided on the peripheral portion of the upper surface 12a of the frame plate 12, and a frame-shaped third frame plate 14 provided on the peripheral portion of the upper surface 13a of the second frame plate 13, It includes a frame-shaped side wall 15 provided on the peripheral portion of the upper surface 14a of the third frame plate 14. A seam ring 29 is provided on the upper surface 20 a of the side wall 15 as a joining material for the lid 30 as a lid.

As described above, in the package 20 that constitutes the electronic device 4 according to the fourth embodiment, the second via 39 that is partially exposed is provided on the inner surface of the side wall 15. The second via 39 connects the seam ring 29 and the second connection portion 25 a forming the heat conduction portion 25. That is, the lid 30 is thermally and electrically connected to the heating element 26 and the circuit element 19 via the second via 39 and the heat conducting portion 25.

The second via 39 is a through electrode and is embedded in the through hole that penetrates from the upper surface 20a of the side wall 15 to the lower surface of the third frame plate 14 (the surface in contact with the second frame plate 13) and the through hole. The heat transfer member having good thermal conductivity and good electrical conduction such as copper (Cu). As the heat transfer member, tungsten (W), aluminum (Al) or the like can be used instead of copper (Cu).

The second via 39 has one end (upper end) connected to the seam ring 29, and the other end (lower end) connected to a part of the second connection portion 25 a to which the heating element 26 is connected. By providing such a second via 39, the lid 30 serving as a lid is connected to the heating element 26 via the seam ring 29 and the second connecting portion 25a (heat conducting portion 25). Thus, the lid 30 can be heated more efficiently.

The second via 39 is provided so that a part of the through hole (a part of the conductive member) is exposed on the inner surface of the side wall 15 as described above. In this way, by exposing a part of the second via 39 to the inner surface of the side wall 15, the stress at the time of heating due to the difference in the thermal expansion coefficient between the heat transfer member and the side wall 15 can be released, and the stress can be released. It is possible to reduce the influence on the package 20 due to.

According to the electronic device 4 according to the fourth embodiment, the lid 30 as the lid is connected to the second connection portion 25a (heat conduction portion 25) by the second via 39, so that the lid 30 can be more efficiently. It can be heated. Therefore, it is possible to reduce variations in temperature distribution in the recess (internal space 16) of the package 20. Further, by setting the lid to a fixed potential, it is possible to prevent intrusion of electrical noise from the outside.

In the above description, the configuration in which one second via 39 is provided has been described, but the number of second vias 39 to be arranged is not limited to this, and any number of second vias 39 may be provided as long as they are provided in the arrangement space. Good.

<Fifth Embodiment>
Next, an electronic device according to the fifth embodiment of the present invention will be described with reference to FIG. FIG. 12 is a plan view showing the outline of the electronic device according to the fifth embodiment of the present invention. Note that, in FIG. 12, the lid portion and the vibrating element 17 are omitted (seen through) as described above.

The electronic device 5 according to the fifth embodiment of the present invention is a so-called temperature control type in which the vibrating element (crystal vibrating piece) 17 and the heat generating element 26 are housed in the package 20, as in the first embodiment. It is an oscillator. Similar to the first embodiment, the electronic device 5 shown in FIG. 12 includes a vibrating element 17, a package 20 that houses the vibrating element 17, and a circuit element 19 as an oscillating unit that has at least a function of causing the vibrating element 17 to oscillate. A heating element 26 that is connected to the vibration element 17 and that heats the vibration element 17 and the like; and a lid 30 that serves as a lid that forms an internal space (storage space) 16 between the package 20 and the vibration element 17. ing.

The electronic device 5 according to the fifth embodiment has an opening shape of the first frame plate 12 and a first frame plate 12 exposed in the opening of the second frame plate 13 as compared with the configuration of the electronic device 1 of the first embodiment. The configuration of the upper surface 12d of the above is different from that of the pad electrodes 24a and 24b provided on the upper surface 12d of the first frame plate 12. As a result, the wiring pattern between the circuit element 19 and the pad electrodes 24a and 24b also differs. Hereinafter, the electronic device 5 according to the fifth embodiment will be described in detail. However, the vibrating element 17, the circuit element 19, the lid 30, and the package 20 having the same configuration as the electronic device 1 according to the first embodiment described above. The same symbols are attached to some of the configurations, and the description thereof may be omitted.

As in the first embodiment, the package 20 that constitutes the electronic device 5 includes a plate-shaped bottom plate 11, a frame-shaped first frame plate 12 provided on the peripheral portion of the upper surface 11a of the bottom plate 11, and a first frame plate 12. A frame-shaped second frame plate 13 provided on the peripheral portion of the upper surface 12a of the frame plate 12, and a frame-shaped third frame plate 14 provided on the peripheral portion of the upper surface 13a of the second frame plate 13, It includes a frame-shaped side wall 15 provided on the peripheral portion of the upper surface 14a of the third frame plate 14. A seam ring 29 is provided on the upper surface 20 a of the side wall 15 as a joining material for the lid 30 as a lid.

The first frame plate 12 joined to the upper surface 11a of the bottom plate 11 has a frame shape having an opening in the center. The second frame plate 13 joined to the upper surface 12a of the frame-shaped first frame plate 12 has an opening end that surrounds the outer side along the opening of the first frame plate 12, and is arranged in the X-axis direction and the Y-axis direction. It has a frame shape with an opening exposing the upper surface 12d of the first frame plate 12 in the axial direction. The third frame plate 14 joined to the upper surface 13a of the frame-shaped second frame plate 13 has an opening end outside the opening of the second frame plate 13 in the X-axis direction, and has a second end in the Y-axis direction. It has a frame shape with an opening having an opening end that overlaps with the opening of the frame plate 13. The side wall 15 joined to the upper surface 14a of the frame-shaped third frame plate 14 has an opening end outside the opening of the third frame plate 14 in the X-axis direction, and has a third frame plate 14 in the Y-axis direction. Is provided in an approximately rectangular frame shape along the outer peripheral edge (upper peripheral portion) of the package 20 in which the bottom plate 11 to the third frame plate 14 are stacked.

In the first frame plate 12, the pad electrodes 24a are provided on one upper surface 12d and the pad electrodes 24b are provided on the other upper surface 12d on the respective upper surfaces 12d provided along the X axis so as to face each other in the Y-axis direction. It is provided. Similar to the pad electrodes 23 and 24 of the first embodiment, the pad electrodes 24a and 24b are formed by using a conductive paste such as silver and palladium or tungsten metallization, and firing after forming a required shape. It can be formed by plating nickel and gold or silver.

The circuit element 19 as the oscillator is connected to the first connecting portion 25c provided on the upper surface 11a of the bottom plate 11. The circuit element 19 includes, for example, an oscillation circuit that oscillates the vibrating element 17, a control circuit that controls the temperature of the heating element 26, and the like. Bonding pads (not shown) are provided on the active surface of the circuit element 19. Pad electrodes provided on the bonding pads and on the upper surface 12d of the first frame plate 12 exposed in the opening of the second frame plate 13, respectively. 24a and 24b are electrically connected to each other by metal wirings (bonding wires) 21a and 21b. Although not shown, the pad electrodes 24a and 24b are electrically connected to other pad electrodes 28 and external connection terminals (not shown). As described above, the metal wirings (bonding wires) 21a and 21b are provided at positions overlapping with other outer peripheral edges except the outer peripheral edge of the circuit element 19 on the side where the connecting portion 25d is located in a plan view.

According to the electronic device 5 of the fifth embodiment, the pad electrodes 24a and 24b are provided on the upper surface 12d of the first frame plate 12 arranged on both sides facing each other in the Y-axis direction. Therefore, in plan view, the pad electrode is not arranged on the side where the connecting portion 25d is located, that is, between the circuit element 19 and the heat generating element 26, so the area and volume of the heat conducting portion 25 (connecting portion 25d) should be increased. You can Thereby, it becomes possible to more efficiently perform heat conduction from the thick bottom portion to the thin bottom portion of the package 20.

<Sixth Embodiment>
Next, an electronic device according to the sixth embodiment of the present invention will be described with reference to FIGS. 13 and 14. 13 and 14 schematically show an electronic device according to a sixth embodiment of the present invention, FIG. 13 is a plan view, and FIG. 14 is a sectional view taken along line EE of FIG. Note that in FIG. 13, the lid 30 and the vibrating element 17 shown in FIG. 14 are omitted (perspective).

The electronic device 6 according to the sixth embodiment of the present invention is a so-called temperature control type in which the vibrating element (crystal vibrating piece) 17 and the heating element 26 are housed in the package 60, as in the first embodiment. It is an oscillator. Similar to the first embodiment, the electronic device 6 shown in FIGS. 13 and 14 is an oscillating unit that includes at least the vibrating element 17, the package 60 that houses the vibrating element 17, and the function of oscillating the vibrating element 17. Of the circuit element 19, the heat generating element 26 connected to the vibration element 17 as a heat generating portion for heating the vibration element 17 and the like, and the package 60 as the second lid portion forming an internal space (accommodation space) 57. It has a cap 40 and a lid 30 as a lid portion that includes the cap 40 and seals the package 60.

The electronic device 6 according to the sixth embodiment has a lid 30 and a cap 40 (second lid) that are double lids, as compared with the configuration of the electronic device 1 according to the first embodiment. The configuration of the package 60 is different. Hereinafter, the electronic device 6 according to the sixth embodiment will be described in detail. Regarding the configurations of the vibrating element 17, the circuit element 19, and the lid 30, which have the same configuration as the electronic device 1 of the above-described first embodiment. , And the description thereof will be omitted, and the configuration of the package 60 will be mainly described.

The package 60 is provided on the plate-shaped bottom plate 51, the frame-shaped first frame plate 52 provided on the peripheral portion of the upper surface 51 a of the bottom plate 51, and the peripheral portion of the upper surface 52 a of the first frame plate 52. The frame-shaped second frame plate 53, the frame-shaped third frame plate 54 provided on the peripheral portion of the upper surface 53a of the second frame plate 53, and the peripheral portion of the upper surface 54a of the third frame plate 54. It includes a frame-shaped fourth frame plate 55 and a frame-shaped side wall 56 provided on the peripheral portion of the upper surface 55a of the fourth frame plate 55. A seam ring 29 is provided on the upper surface 60 a of the side wall 56 as a bonding material for the lid 30 as a lid. The package 60 houses the vibrating element 17 and the heating element 26.

The package 60 has a recess (internal space 57) that opens to the upper surface. The opening of the concave portion is a double layer of a cap 40 as a second lid portion joined to the upper surface 55a of the fourth frame plate 55 and a lid 30 as a lid portion joined to the side wall 56 via the seam ring 29. It is blocked by the lid part. That is, the recesses in which the vibrating element 17, the circuit element 19, the heating element 26, and the like are arranged are closed by the cap 40 and the lid 30, and a sealed internal space 57 is formed. Although the internal pressure of the sealed internal space 57 can be set to a desired atmospheric pressure, its state is the same as that of the first embodiment, and therefore the description thereof is omitted.

The first frame plate 52 joined to the upper surface 51a of the bottom plate 51 has a frame shape with an opening in the center. The second frame plate 53 joined to the upper surface 52a of the frame-shaped first frame plate 52 has an opening end outside (both directions) of the opening of the first frame plate 52 in the X-axis direction, and has a Y-axis direction. The frame shape is provided with an opening having an opening end that overlaps with the opening of the first frame plate 52. The third frame plate 54 joined to the upper surface 53a of the frame-shaped second frame plate 53 has an opening end outside the opening of the second frame plate 53 in the X-axis direction, and has a second end in the Y-axis direction. It has a frame shape with an opening having an opening end that overlaps with the opening of the frame plate 53. The fourth frame plate 55 joined to the upper surface 54a of the frame-shaped third frame plate 54 has an opening end outside the opening of the third frame plate 54 in the X-axis direction, and has a third end in the Y-axis direction. It has a frame shape with an opening having an opening end that overlaps the opening of the frame plate 54. The fourth frame plate 55 is provided with an upper surface 55a that is exposed to the upper side over the entire circumference on the inner surface side of the side wall 56 by joining the later-described side wall 56.

The side wall 56 joined to the upper surface 55a of the frame-shaped fourth frame plate 55 has a frame shape having an opening having an opening end outside the opening of the fourth frame plate 55 in the X-axis direction and the Y-axis direction. I am doing it. The side wall 56 is provided in a substantially rectangular frame shape along the outer peripheral edge (upper peripheral portion) of the package 60 in which the bottom plate 51 to the fourth frame plate 55 are stacked. In other words, the side wall 56 has an opening shape that opens to the upper surface of the recessed portion and has a substantially rectangular peripheral shape. A seam ring 29 made of an alloy such as Kovar is provided on the upper surface of the frame-shaped side wall 56. The seam ring 29 has a function as a bonding material between the lid 30 as a lid portion and the side wall 56, and is provided in a frame shape (a substantially rectangular circumferential shape) along the upper surface 60 a of the side wall 56. ..

In the package 60 having such a configuration, the region exposed by the opening of the first frame plate 52 and in which the bottom plate 51 (upper surface 51a) where the later-described first connecting portion 25c is disposed is located is the thin bottom portion of the package 60. Corresponds to. Further, the first frame plate 52 and the second frame plate 53 are laminated on the bottom plate 51, are exposed by the opening of the third frame plate 54, and the second frame plate 53 on which the second connecting portion 25a described later is arranged. The region where the upper surface 53a of the above is located corresponds to the thick bottom portion of the package 60. That is, the package 60 has a thin bottom portion, which is an area where the bottom plate 51 (upper surface 51a), which is a thin bottom portion, is located in the central portion, and an area where the first frame plate 52 and the second frame plate 53 are laminated on the bottom plate 51. Is a region where the upper surface 53a is located, and has a concave portion including a thick bottom portion thicker than the thin bottom portion.

In the package 60, as in the first embodiment, the upper surface 53a of the second frame plate 53 exposed in the opening of the third frame plate 54, the opening side surface (step side surface) of the second frame plate 53, and the second On the upper surface 52a of the first frame plate 52 exposed to the opening of the frame plate 53, the opening side surface (step side surface) of the first frame plate 52, and the upper surface 51a of the bottom plate 51 exposed to the opening of the first frame plate 52, The heat conducting portion 25 is provided to connect from the upper surface 53a of the second frame plate 53 to the upper surface 51a of the bottom plate 51. The heat conducting portion 25 is similar to that of the first embodiment, and therefore detailed description thereof will be omitted, but it has the same effect as that of the first embodiment.

In addition, the pad electrode 28 provided on the upper surface 54a of the third frame plate 54 exposed in the opening of the fourth frame plate 55, and the upper surfaces 52a, 52b of the first frame plate 52 exposed in the opening of the second frame plate 53. The pad electrodes 23 and 24 provided are the same as those in the first embodiment, and detailed description thereof will be omitted.

The cap 40 as the second lid portion is a plate-like lid member having conductivity, and closes the opening of the concave portion opened to the upper surface of the package 60 to form the internal space 57. In this internal space 57, the vibration element 17, the circuit element 19, the heat generating element 26, the heat conducting portion 25, and the like are arranged. For the cap 40, a plate material having conductivity such as a Kovar plate is used. For the cap 40, a brazing material such as silver brazing material is arranged on one surface of the plate material, and the brazing material is melted and solidified to join the periphery of the opening of the concave portion corresponding to the upper surface 55a of the fourth frame plate 55. You can The cap 40 may be made of a metal material such as 42 alloy or stainless steel plated with nickel (Ni), for example, instead of Kovar.

The lid 30 as a lid is a plate-shaped member having conductivity and closes the opening of the recess of the package 60 to which the cap 40 is joined. The lid 30 is joined around the opening of the recess corresponding to the upper surface 60a of the side wall 56 by using, for example, a seam welding method. A plate material of Kovar is used for the lid 30 of this example. By using a Kovar plate for the lid 30, at the time of sealing, the seam ring 29 formed of Kovar and the lid 30 are melted in the same molten state, and are easily alloyed, which facilitates sealing. It can be performed reliably. The lid 30 may be made of a plate material made of another material instead of Kovar, and for example, a metal material such as 42 alloy or stainless steel, or the same material as the side wall 56 of the package 60 can be used.

The electronic device 6 according to the sixth embodiment has a so-called double sealing structure in which the recess 40 side of the package is sealed by the cap 40 as the second lid and the outside thereof is sealed by the lid 30. As a result, the sealing can be performed more firmly and reliably, and the temperature distribution of the entire package can be made uniform. Further, by using a conductive plate material for the lid 30 or the cap 40, the lid 30 or the cap 40 can have a fixed potential, and the lid 30 or the cap 40 can have a shielding effect. This makes it possible to suppress noise that enters from the upper side of the package 60 (the lid 30 side).

<Seventh Embodiment>
Next, an electronic device according to the seventh embodiment of the present invention will be described with reference to FIG. FIG. 16 is a front sectional view schematically showing an electronic device according to the seventh embodiment of the present invention. In the following description, the configuration using the electronic device 1 according to the above-described first embodiment is illustrated, and the electronic device 1 according to the first embodiment is denoted by the same reference numeral and detailed description thereof is given. Is omitted.

The electronic device 7 according to the seventh embodiment has an internal space 224 formed by a cap 155 as a second lid made of metal or resin covered on the printed board 101. The cap 155 is connected to the printed circuit board 101 using solder 123 or a resin adhesive. The internal space 224 may be non-airtight, that is, open to the atmosphere, or may be an airtight space. In the internal space 224, an electronic device (vibration device) 1 that is connected to the printed board 101 with a connection plate 105 spaced apart from each other, and a variable capacitance that is connected to an external terminal 107 provided on the back surface of the electronic device 1. The circuit 110 and the electronic component 121 and another electronic component 120 connected to the printed circuit board 101 are provided.

The electronic device 1 is arranged with the bonding side of the lid 30 on the upper side, and is connected to the printed circuit board 101 via the connection plate 105. The connection board 105 also has a function of electrically connecting the electronic device 1 and the printed circuit board 101. External connection terminals 122 are provided on the back surface (outer surface) of the printed circuit board 101. Although not shown, the external connection terminal 122 is electrically connected to the variable capacitance circuit 110, the electronic components 120 and 121, and the like.

According to the electronic device 7 of the seventh embodiment, the electronic device 1 sealed with the lid 30 is doubly capped by the cap 155 as the second lid portion. As a result, the hermeticity of the internal space 224 is improved, and the temperature distribution of the entire inside of the electronic device 7 can be made uniform. Further, by making the cap 155 a conductive member, the cap 155 can have a fixed potential, and the cap 155 can be a shield member. With such a configuration, it is possible to enhance the shield effect of suppressing external noise.
In the above description, the cap 155 forms the internal space 224. However, for example, the cap 155 may be in contact with the outer surface of the electronic device 1. Further, as the material of the cap 155, for example, copper can be used. With such a configuration, the temperature of the electronic device 1 can be further stabilized.

In the above-described first to seventh embodiments, quartz is used as the piezoelectric material forming the vibrating element 17, but the piezoelectric material is not limited to this. For example, lithium tantalate, lithium niobate, or the like. It is also possible to use the above piezoelectric material. The vibrating element 17 may be configured using a MEMS (Micro Electro Mechanical Systems) element that forms the vibrating element on a silicon or glass substrate. The vibrating element 17 may be a vibrating element having a structure in which a vibrating body is formed on a substrate such as a silicon or glass substrate.

[Electronics]
Next, electronic equipment to which the electronic devices 1 to 7 according to the embodiment of the present invention are applied will be described in detail with reference to FIGS. 16 and 17. FIG. 16 is a functional block diagram of the electronic device 300. FIG. 17 is a schematic diagram showing a configuration example of a network server as an example of the electronic device. In the description, an example in which the electronic device 1 including the vibrating element 17 is applied is shown. The same elements as those in FIGS. 1 to 3 for explaining the electronic device 1 are designated by the same reference numerals and will not be described.

An electronic device 300 illustrated in FIG. 16 includes an electronic device 1 and an electronic component 200 including a variable capacitance circuit 110, a CPU (Central Processing Unit) 320, an operation unit 330, a ROM (Read Only Memory) 340, and a RAM (Random Access Memory). 350, a communication unit 360, a display unit 370, and a sound output unit 380. Note that electronic device 300 may have a configuration in which some of the constituent elements (respective parts) in FIG. 16 are omitted or changed, or other constituent elements may be added.

The electronic component 200 includes a variable capacitance circuit 110 and an electronic device (vibration device) 1, and supplies a clock signal from the electronic device 1 to each unit as well as the CPU 320 (not shown).

The CPU 320 performs various calculation processes and control processes using the clock signal output from the electronic component 200 according to the programs stored in the ROM 340 and the like. Specifically, the CPU 320 performs various processes according to operation signals from the operation unit 330, processes that controls the communication unit 360 to perform data communication with the outside, and various kinds of information that are displayed on the display unit 370. A process of transmitting a display signal, a process of causing the sound output unit 380 to output various sounds, and the like are performed.

The operation unit 330 is an input device including operation keys, button switches, and the like, and outputs an operation signal according to an operation by the user to the CPU 320.

The ROM 340 stores programs and data for the CPU 320 to perform various calculation processes and control processes.

The RAM 350 is used as a work area of the CPU 320, and temporarily stores programs and data read from the ROM 340, data input from the operation unit 330, calculation results executed by the CPU 320 according to various programs, and the like.

The communication unit 360 performs various controls for establishing data communication between the CPU 320 and an external device.

The display unit 370 is a display device including an LCD (Liquid Crystal Display) or the like, and displays various kinds of information based on a display signal input from the CPU 320. The sound output unit 380 is a device that outputs sound such as a speaker.

The electronic device 300 can adjust the setting data of the variable capacitance circuit 110 by the control signal 150 of the CPU 320. Therefore, even if the oscillation frequency of the clock signal deviates, it can be easily adjusted.

FIG. 17 is a diagram showing an example of the appearance of a network server which is an example of the electronic device 300. The network server, which is the electronic device 300, includes an LCD as the display unit 370. Then, in the network server which is the electronic device 300, the setting data of the variable capacitance circuit 110 can be adjusted by the control signal 150. Therefore, even if the oscillation frequency of the clock signal deviates, it can be easily adjusted. As a result, reliability is increased because an accurate clock signal is available.

Next, specific examples of electronic devices to which the electronic devices 1 to 7 according to the embodiment of the present invention are applied will be described in detail with reference to FIGS. In the description, an example in which the electronic device 1 including the vibrating element 17 is applied is shown.

FIG. 18 is a perspective view showing a schematic configuration of a mobile (or notebook) personal computer as an electronic apparatus including the electronic device 1 according to the embodiment of the invention. In this figure, a personal computer 1100 is composed of a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 100. The display unit 1106 is rotated relative to the main body portion 1104 via a hinge structure portion. It is movably supported. Such a personal computer 1100 incorporates the electronic device 1 having a function as a timing source for signal processing.

FIG. 19 is a perspective view showing a schematic configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic device 1 according to the embodiment of the invention. In this figure, a mobile phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is arranged between the operation buttons 1202 and the earpiece 1204. Such a mobile phone 1200 incorporates the electronic device 1 having a function as a timing source for signal processing.

FIG. 20 is a perspective view showing a schematic configuration of a digital still camera as an electronic apparatus including the electronic device 1 according to the embodiment of the invention. It should be noted that this figure also simply shows the connection with an external device. Here, while a conventional film camera exposes a silver halide photographic film to an optical image of a subject, a digital still camera 1300 photoelectrically converts an optical image of the subject by an image pickup device such as a CCD (Charge Coupled Device). To generate an image pickup signal (image signal).

The display unit 100 is provided on the back surface of the case (body) 1302 of the digital still camera 1300, and is configured to perform display based on the image pickup signal from the CCD. The display unit 100 displays the subject as an electronic image. Functions as a finder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (back side in the drawing) of the case 1302.

When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Further, in this digital still camera 1300, a video signal output terminal 1312 and an input/output terminal 1314 for data communication are provided on the side surface of the case 1302. Then, as shown in the drawing, a television monitor 1430 is connected to the video signal output terminal 1312, and a personal computer 1440 is connected to the input/output terminal 1314 for data communication, if necessary. Further, the image pickup signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates the electronic device 1 having a function as a timing source for signal processing.

The electronic device 1 according to an embodiment of the present invention is, for example, an inkjet discharge device in addition to the personal computer (mobile personal computer) of FIG. 18, the mobile phone of FIG. 19, the digital still camera of FIG. (For example, inkjet printer), laptop personal computer, TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game machine, word processor, workstation , Videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measurement device, ultrasonic diagnostic device, electronic endoscope), fish finder, various measuring devices , Electronic instruments such as instruments (for example, instruments for vehicles, aircrafts and ships), flight simulators, head mounted displays, motion traces, motion tracking, motion controllers, PDR (pedestrian position and orientation measurement), etc. .. In addition, if the electronic device 1 described above is used, a constant temperature state is maintained, and thus it is suitable for an electronic device used under a severe temperature environment such as a communication base station.

[Base station equipment]
The positioning system 2000 shown in FIG. 21 includes a GPS satellite 2200, a base station device 2300, and a GPS receiving device 2400. The GPS satellite 2200 transmits positioning information (GPS signal).

The base station device 2300 receives the positioning information from the GPS satellite 2200 with high accuracy via the antenna 2301 installed at an electronic reference point (GPS continuous observation station), and the receiving device 2302. A transmitter 2304 for transmitting positioning information via the antenna 2303.

Here, the receiving device 2302 is an electronic device including the electronic device 1 of the present invention described above as its reference frequency oscillation source. Such a receiving device 2302 has excellent reliability. The positioning information received by the receiving device 2302 is transmitted by the transmitting device 2304 in real time.

The GPS receiving device 2400 receives the positioning information from the GPS satellite 2200 via the antenna 2401 and the base station receiving unit 2404 receives the positioning information from the base station device 2300 via the antenna 2403. With.

1, 2, 3, 4, 5, 6, 7... Electronic device, 11... Bottom plate, 12... First frame plate, 12a... Top face of first frame plate, 13... Second frame plate, 13a... Second frame plate Top surface, 14... Third frame plate, 14a... Upper surface of third frame plate, 15... Side wall, 16... Internal space (recess), 17... Vibration element, 18... Excitation electrode, 19... Circuit element as oscillation section, 20... Package, 20a... Side wall upper surface 21,22... Metal wiring (bonding wire), 23, 24,... Pad electrode, 25... Heat conduction part, 25a... Second connection part, 25b... First connection part, 25c ... 1st connection part, 25d... Connection part, 25e... 3rd connection part, 25f... 2nd connection part, 26... Heating element as a heating part, 27... Metal wiring (bonding wire), 28... Pad electrode, 30... A lid as a lid, 300... Electronic equipment, 1100... Mobile personal computer as electronic equipment, 1200... Mobile phone as electronic equipment, 1300... Digital still camera as electronic equipment, 2000... Positioning system, 2300... Base Station equipment.

Claims (14)

A package having a recess including a thin bottom portion and a thick bottom portion thicker than the thin bottom portion;
An oscillator provided on the thin bottom,
A heating element provided in the thick bottom portion,
A vibrating element mounted on the side opposite to the thick bottom side of the heating element,
A first connecting portion that is a conductive layer formed on the thin bottom portion, a second connecting portion that is a conductive layer formed on the thick bottom portion, and connects the first connecting portion and the second connecting portion. A heat conducting portion having a connecting portion,
The electronic device, wherein the first connecting portion is in contact with the oscillating portion, and the second connecting portion is in contact with the heating element. The electronic device according to claim 1, wherein the connecting portion is provided on a side surface of a step portion provided between the thick bottom portion and the thin bottom portion. The electronic device according to claim 1, wherein the connecting portion includes a first via electrically connected to the oscillating portion. The package has a pad electrode provided between the thick bottom portion and the thin bottom portion in plan view,
The electronic device according to claim 1, wherein the pad electrode is electrically connected to the oscillation unit by a metal wiring. The pad electrode is provided along with the connecting portion along a direction intersecting with a direction in which the heating element and the oscillating portion are arranged,
At least a portion of the metal lines, in plan view, of the outer peripheral edge of the oscillating unit, a the side the connecting portion is positioned and disposed in parallel with the parts minutes positions overlapping the connection portion The electronic device according to claim 4, wherein the electronic device comprises: The package has a pad electrode provided between the side wall on the opening side of the recess and the thin bottom portion in plan view,
The electronic device according to claim 1, wherein the pad electrode is electrically connected to the oscillation unit by a metal wiring. The pad electrode is provided between the side wall on the opening side of the recess other than the side where the connecting portion is located and the thin bottom portion,
7. The electronic device according to claim 6, wherein the metal wiring is provided at a position overlapping with the outer peripheral edge of the oscillation portion other than the side where the connecting portion is located, in a plan view. .. Wherein is attached to the first end surface of the opening side of the concave portion, electrons according to any one of claims 1 to 7, characterized in that it comprises a first cover portion that closes the opening device. The electronic device according to claim 8, wherein the first lid portion has conductivity. The electronic device according to claim 9, wherein the first lid portion is electrically connected to the heat conducting portion via a second via provided in the package. Further comprising a second lid,
The package connects the inner surface of the concave portion surrounding the heating element and the oscillating portion to the first end surface in a plan view, and has a step between the first end surface. Has a second end face,
The second lid portion is disposed on the second end surface,
11. The electronic device according to claim 8, wherein the second lid portion closes the concave portion of the package on a side closer to the vibrating element than the first lid portion. device. A substrate to which the package is attached, and a third lid portion,
The electronic device according to any one of claims 1 to 10, wherein the package is arranged in an internal space formed between the substrate and the third lid portion. An electronic apparatus comprising the electronic device according to any one of claims 1 to 12. A base station apparatus comprising the electronic device according to any one of claims 1 to 12.

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