CN112737540A - Internal heating surface-mounted crystal, constant temperature structure of crystal oscillator and crystal oscillator - Google Patents
Internal heating surface-mounted crystal, constant temperature structure of crystal oscillator and crystal oscillator Download PDFInfo
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- CN112737540A CN112737540A CN202011589471.2A CN202011589471A CN112737540A CN 112737540 A CN112737540 A CN 112737540A CN 202011589471 A CN202011589471 A CN 202011589471A CN 112737540 A CN112737540 A CN 112737540A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/08—Holders with means for regulating temperature
Abstract
The application relates to the technical field of piezoelectric elements and discloses an internal heating surface-mounted crystal. The internal heating surface-mounted crystal comprises a base, a cover plate, a temperature sensing part, a heating part and a quartz wafer, wherein the base is of a concave structure, and a supporting part is arranged in the middle of a concave surface of the concave structure; the quartz wafer is arranged on the supporting component; the cover plate is arranged on the top of the base; the temperature sensing part and the heating part are arranged at the bottom of the concave surface of the concave structure, and the heights of the temperature sensing part and the heating part are lower than that of the supporting part. The internal heating surface-mounted crystal has the advantage of small volume. The embodiment of the disclosure also provides a constant temperature structure of the crystal oscillator and the crystal oscillator.
Description
Technical Field
The application relates to the technical field of piezoelectric elements, for example to an internal heating surface-mounted crystal, a constant temperature structure of a crystal oscillator and the crystal oscillator.
Background
At present, the quartz crystal oscillator is widely applied to the fields of aerospace, communication systems and equipment, precise instruments and meters and the like due to good stability, and provides reference frequency and clock reference for electronic equipment and systems. Because the crystal oscillator is sensitive to the ambient temperature, the frequency of the common crystal oscillator changes greatly along with the ambient temperature. In order to reduce the influence of the ambient temperature, an oven controlled crystal oscillator is generally adopted, and the oven controlled crystal oscillator has the advantages of high stability and good noise.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
the oven controlled crystal oscillator is bulky.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides an internal heating surface-mounted crystal, an oven-controlled structure of a crystal oscillator and the crystal oscillator, which are used for solving the technical problem that the volume of the oven-controlled crystal oscillator in the prior art is large.
In some embodiments, an internally heated surface mount crystal includes a base, a cover plate, a temperature sensing member, a heating member, and a quartz wafer; the base is of a concave structure, and a supporting part is arranged in the middle of a concave surface of the concave structure; the quartz wafer is arranged on the supporting part; the cover plate is arranged on the top of the base; the temperature sensing piece and the heating piece are arranged at the bottom of the concave surface of the concave structure, and the heights of the temperature sensing piece and the heating piece are lower than that of the supporting part.
Optionally, the support member is a boss around an edge disposed at a bottom of a concavity of the concave structure.
Optionally, the temperature sensing member is a thermistor.
Optionally, the heating element is a power tube.
In some embodiments, the oven structure of the crystal oscillator comprises a first circuit board, a temperature sensitive element and the internally heated surface mount crystal provided by the previous embodiments; the internal heating surface-mounted crystal is arranged on one surface of the first circuit board, and the temperature sensitive element is arranged on the other surface of the first circuit board.
Optionally, the plate of the first circuit board is a ceramic substrate.
Optionally, the temperature sensitive elements are uniformly distributed on the other side of the first circuit board.
In some embodiments, a crystal oscillator includes a base, a housing, a second circuit board, and the oven structure of the crystal oscillator provided in the previous embodiments; the housing is connected with the base, the housing and the base form an accommodating space, the constant temperature structure is arranged on the second circuit board, the second circuit board is arranged on the base, and the constant temperature structure and the second circuit board are arranged in the accommodating space.
Optionally, the crystal oscillator further includes a hard wire, the constant temperature structure is electrically connected to the second circuit board through the hard wire, and the hard wire supports the constant temperature structure to suspend the constant temperature structure.
Optionally, the hard wire is a metal wire.
The constant temperature structure of the internal heating surface-mounted crystal and the crystal oscillator provided by the embodiment of the disclosure can realize the following technical effects:
the temperature sensing part and the heating part are arranged inside the internal heating surface-mounted crystal, and the internal heating surface-mounted crystal is utilized to form a constant temperature structure, so that the volume of the constant temperature structure can be reduced, and the volume of the crystal oscillator is further reduced.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are considered to be similar elements, and in which:
FIG. 1 is a schematic view of an internally heated surface mount crystal provided by an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a constant temperature structure of a crystal oscillator provided by an embodiment of the present disclosure;
fig. 3 is a schematic diagram of a crystal oscillator according to an embodiment of the disclosure.
Reference numerals:
100. a constant temperature structure; 110. internally heating the surface-mounted crystal; 111. a base; 1111. a support member; 112. a cover plate; 113. a temperature sensing member; 114. a heating member; 115. a quartz wafer; 120. a first circuit board; 130. a temperature sensitive element; 200. a base; 300. a housing; 400. a second circuit board; 500. a hard wire.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.
The term "plurality" means two or more unless otherwise specified.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
At present, the quartz crystal oscillator is widely applied to the fields of aerospace, communication systems and equipment, precise instruments and meters and the like due to good stability, and provides reference frequency and clock reference for electronic equipment and systems. Because the crystal oscillator is sensitive to the ambient temperature, the frequency of the common crystal oscillator changes greatly along with the ambient temperature. The embodiment of the disclosure provides an internal heating surface-mounted crystal, inside heating surface-mounted crystal including temperature-sensing spare and heating member integration, the volume of internal heating surface-mounted crystal has been reduced, also can improve the stable rate of temperature and reduce the heating consumption simultaneously, the constant temperature structure that adopts this internal heating surface-mounted crystal also has small, the high and low advantage of heating consumption of the stable rate of temperature, the crystal oscillator that adopts this constant temperature structure also has small, the high and low advantage of heating consumption of the stable rate of temperature.
Fig. 1 is a schematic view of an internally heated surface mount crystal according to an embodiment of the disclosure. As shown in fig. 1, the internal heating surface-mount crystal 110 includes a base 111, a cover plate 112, a temperature sensing member 113, a heating member 114, and a quartz wafer 115; the susceptor 111 is of a concave structure, the supporting part 1111 is arranged in the middle of a concave surface of the concave structure, the quartz wafer 115 is arranged on the supporting part 1111, the cover plate 112 is arranged at the top of the susceptor 111, the temperature sensing part 113 and the heating part 114 are arranged at the bottom of the concave surface of the concave structure, and the heights of the temperature sensing part 113 and the heating part 114 are lower than that of the supporting part 1111.
The temperature sensing member 113 and the heating member 114 are both disposed inside the internal heating surface-mounted crystal 110, and the constant temperature structure 100 is composed of the internal heating surface-mounted crystal 110, so that the volume of the constant temperature structure 100 can be reduced, and the volume of the crystal oscillator can be further reduced.
In addition, the heating member 114 disposed at the bottom of the concave surface of the concave structure can directly heat the quartz wafer 115, and heating power consumption can be reduced.
Moreover, the heating member 114 disposed at the bottom of the concave surface of the concave structure can directly heat the quartz wafer 115, and the temperature sensing member 113 disposed inside the susceptor 111 can directly detect the temperature of the quartz wafer 115, thereby increasing the temperature stabilizing speed of the quartz wafer 115.
In some embodiments, the quartz crystal wafer may be a quartz wafer 115 obtained by SC dicing.
The cover plate 112 may be a metal cover plate 112, and the cover plate 112 and the base 111 are connected in a vacuum environment by a parallel welding process. Therefore, the cover plate 112 and the base 111 can form a closed vacuum space, the oxidation process of the quartz wafer 115, the temperature sensing part 113 and the heating part 114 arranged in the vacuum space can be reduced, the service lives of the quartz wafer 115, the temperature sensing part 113 and the heating part 114 are prolonged, the service life of the internal heating surface-mounted crystal 110 is also prolonged, when the internal heating surface-mounted crystal 110 is assembled into the constant temperature structure 100, the service life of the constant temperature structure 100 is also prolonged, and when the constant temperature structure 100 is assembled into a crystal oscillator, the service life of the crystal oscillator is also prolonged.
In some embodiments, the temperature sensing member 113 and the heating member 114 may be connected by bonding with gold wires, and the temperature sensing member 113 and the heating member 114 may be fixedly disposed on the bottom of the concave surface of the concave structure by using a thermal conductive adhesive, so as to increase the thermal conduction effect. In addition, when the height of the supporting member 1111 is set, the height difference between the supporting member 1111 and the temperature sensing member 113 may be made as small as possible, or the height difference between the supporting member 1111 and the heating member 114 may be made as small as possible, so that the heating effect of the heating member 114 on the quartz wafer 115 may be improved, the heating power consumption may be reduced, and the temperature sensing member 113 may more accurately detect the temperature of the quartz wafer 115. In the above technical solutions, the term "as small as possible" refers to the minimum height difference available to a person skilled in the art under the condition of the current production process, or the minimum height difference selectable by a person skilled in the art under the condition of meeting the production requirement, and the embodiment of the present disclosure does not specifically limit "as small as possible", and the person skilled in the art may adaptively select the specific height difference according to the actual production process or the actual production requirement.
Alternatively, the support component 1111 is a boss, surrounding an edge disposed at the bottom of the concavity of the concave structure.
Optionally, the temperature sensing member 113 is a thermistor.
Optionally, the heating element 114 is a power tube.
Fig. 2 is a schematic diagram of a constant temperature structure of a crystal oscillator provided in an embodiment of the present disclosure. Referring to fig. 2, the constant temperature structure 100 of the crystal oscillator includes a first circuit board 120, a temperature sensor 130, and the internal heating surface-mounted crystal 110 provided in the foregoing embodiment; the internal heating surface-mounted crystal 110 is disposed on one side of the first circuit board 120, for example, the internal heating surface-mounted crystal 110 may be disposed in the middle of one side of the first circuit board 120; the temperature sensitive elements 130 are disposed on the other side of the first circuit board 120, for example, the temperature sensitive elements 130 may be uniformly distributed on the other side of the first circuit board 120, so that the temperature of the first circuit board 120 can be more accurately obtained by disposing the temperature sensitive elements 130.
The temperature sensing part 113 and the heating part 114 are arranged inside the internal heating surface-mounted crystal 110 provided by the foregoing embodiment, so that the volume of the internal heating surface-mounted crystal 110 is small, and the thermostatic structure 100 is composed of such internal heating surface-mounted crystals 110, so that the volume of the thermostatic structure 100 can be reduced, and the volume of the crystal oscillator can be further reduced.
In some embodiments, a fiberglass (RF4) sheet may be used as the sheet for the first circuit board 120.
Alternatively, the plate material of the first circuit board 120 may also be a ceramic substrate. Since the thermal conductivity of the ceramic substrate is much greater than that of the conventional FR4 board, when the board of the first circuit board 120 is a ceramic substrate, the thermal conductivity of the thermostatic structure 100 is better, the heat distribution is more uniform, and even the whole thermostatic structure 100 can be regarded as an isothermal body.
In some application scenarios, the plate of the first circuit board 120 is a ceramic substrate, the internal heating surface-mounted crystal is connected to the first circuit board 120 by welding, and the internal heating surface-mounted crystal is attached to the first circuit board 120. This may provide greater thermal conductivity between the internally heated surface mount crystal and the first circuit board 120.
Fig. 3 is a schematic diagram of a crystal oscillator according to an embodiment of the disclosure. As shown in fig. 3, the crystal oscillator includes a base 200, a housing 300, a second circuit board 400, and the oven structure 100 of the crystal oscillator provided in the foregoing embodiment; the housing 300 is connected to the base 111, and the housing and the base form an accommodation space, the thermostatic structure 100 is disposed on the second circuit board 400, the second circuit board 400 is disposed on the base 200, and the thermostatic structure 100 and the second circuit board 400 are both disposed in the accommodation space.
The foregoing embodiment provides the constant temperature structure 100 with a small volume, and the crystal oscillator constituted by using such constant temperature structure 100 also has a small volume.
Optionally, the crystal oscillator further includes a hard wire 500, the constant temperature structure 100 is electrically connected to the second circuit board 400 through the hard wire 500, and the hard wire 500 supports the constant temperature structure 100 to suspend the constant temperature structure 100. Therefore, the thermal resistance between the constant temperature structure 100 and the external environment can be increased, the heat loss can be effectively reduced, the power consumption of the crystal oscillator is reduced, the stability of the crystal oscillator is improved, and the stabilization time of the crystal oscillator is shortened.
Optionally, the hard wire 500 is a metal wire.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. An internal heating surface-mounted crystal is characterized by comprising a base, a cover plate, a temperature sensing part, a heating part and a quartz wafer;
the base is of a concave structure, and a supporting part is arranged in the middle of a concave surface of the concave structure;
the quartz wafer is arranged on the supporting part;
the cover plate is arranged on the top of the base;
the temperature sensing piece and the heating piece are arranged at the bottom of the concave surface of the concave structure, and the heights of the temperature sensing piece and the heating piece are lower than that of the supporting part.
2. The internally heated surface mount crystal of claim 1, wherein the support member is a boss surrounding an edge disposed at a bottom of a concavity of the concave structure.
3. The internally heated surface mount crystal of claim 1, wherein the temperature sensing element is a thermistor.
4. The internally heated surface mount crystal of claim 1, wherein the heating element is a power tube.
5. A constant temperature structure of a crystal oscillator, comprising a first circuit board, a temperature sensitive element and the internally heated surface-mount crystal of any one of claims 1 to 4;
the internal heating surface-mounted crystal is arranged on one surface of the first circuit board, and the temperature sensitive element is arranged on the other surface of the first circuit board.
6. The thermostatic structure according to claim 5, wherein the plate material of the first circuit board is a ceramic substrate.
7. The thermostatic structure according to claim 5, wherein the temperature sensitive elements are uniformly distributed on the other side of the first circuit board.
8. A crystal oscillator comprising a base, a housing, a second circuit board, and a constant temperature structure of the crystal oscillator of any one of claims 5 to 7;
the shell with the pedestal connection, the two constitutes accommodation space, constant temperature structure sets up on the second circuit board, the second circuit board sets up on the base, constant temperature structure with the second circuit board all sets up in the accommodation space.
9. The crystal oscillator of claim 8, further comprising a rigid wire through which the thermostatic structure is electrically connected to the second circuit board, the rigid wire supporting the thermostatic structure and suspending the thermostatic structure.
10. The crystal oscillator of claim 9, wherein the hard wire is a metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011589471.2A CN112737540A (en) | 2020-12-29 | 2020-12-29 | Internal heating surface-mounted crystal, constant temperature structure of crystal oscillator and crystal oscillator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011589471.2A CN112737540A (en) | 2020-12-29 | 2020-12-29 | Internal heating surface-mounted crystal, constant temperature structure of crystal oscillator and crystal oscillator |
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| CN112737540A true CN112737540A (en) | 2021-04-30 |
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| CN202011589471.2A Pending CN112737540A (en) | 2020-12-29 | 2020-12-29 | Internal heating surface-mounted crystal, constant temperature structure of crystal oscillator and crystal oscillator |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872984A (en) * | 2012-12-10 | 2014-06-18 | 日本电波工业株式会社 | Oscillation apparatus |
| CN104579227A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Crystal oscillator |
| JP2017028360A (en) * | 2015-07-16 | 2017-02-02 | セイコーエプソン株式会社 | Electronic device, electronic apparatus, and base station device |
| US20170373693A1 (en) * | 2016-06-27 | 2017-12-28 | Seiko Epson Corporation | Oscillator, electronic apparatus, and vehicle |
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2020
- 2020-12-29 CN CN202011589471.2A patent/CN112737540A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872984A (en) * | 2012-12-10 | 2014-06-18 | 日本电波工业株式会社 | Oscillation apparatus |
| CN104579227A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Crystal oscillator |
| JP2017028360A (en) * | 2015-07-16 | 2017-02-02 | セイコーエプソン株式会社 | Electronic device, electronic apparatus, and base station device |
| US20170373693A1 (en) * | 2016-06-27 | 2017-12-28 | Seiko Epson Corporation | Oscillator, electronic apparatus, and vehicle |
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