JP2010183228A - Constant-temperature piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compacted high-stability piezoelectric oscillator which is enhanced in the degree of frequency stability and which is reduced in power consumption. <P>SOLUTION: This piezoelectric oscillator includes a base member 7; a printed board 5, electrically and mechanically connected to and supported by connection pins 8 extending from the base member 7; a piezoelectric vibrator 25 mounted in a thermally-coupled state to the printed board; oscillation circuit components 20 mounted on the printed board 5; a first temperature control part 10 for controlling the temperature of the piezoelectric vibrator; a second temperature control part 14 for controlling the temperatures of the oscillation circuit components 20; and a case 9. The first temperature control part includes a first heat generation component 11 for heating the piezoelectric vibrator; a first thermosensor 12; and a first temperature control circuit component 13, wherein the first heat generation component 11 and the first thermosensor 12 are coupled thermally only to the piezoelectric vibrator 25. The second temperature control part 14 includes second heat generation components 15 for heating the oscillation circuit components; a second thermosensor 16, and a second temperature control circuit component 17. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an improvement of a constant temperature type piezoelectric oscillator (highly stable piezoelectric oscillator) used as a frequency control device or the like, and in particular, a piezoelectric vibrator is heated by a heat-generating component such as a power transistor and the heating temperature is controlled by a temperature control circuit. The present invention relates to a thermostatic piezoelectric oscillator that can solve the problem caused by insufficient temperature control of an oscillation circuit component disposed in a thermostatic chamber.

As a piezoelectric oscillator such as a crystal oscillator, which is a frequency control device used in mobile communication equipment and transmission communication equipment, a thermostatic oven type piezoelectric oscillator that can output a highly stable frequency without being affected by external temperature changes has been conventionally used. Known from. Furthermore, in recent years, in these fields, various devices have been required to be small and light, and accordingly, the thermostatic chamber type piezoelectric oscillator has also been reduced in size, weight, and low power consumption from the market. It has been demanded.
In order to obtain a highly stable frequency, a conventional thermostatic oven type piezoelectric oscillator houses a piezoelectric vibrator in a recess of a thermostatic oven (even) such as a metal block having a large heat capacity, and further heats the metal block to a predetermined temperature with a heater. It was heated to. However, when a large metal block is used, the bulk of the entire oscillator increases, so that it has not been possible to satisfy the demand for reduction in size and weight. In addition, since the piezoelectric vibration element inside the piezoelectric vibrator is heated via the metal block, there is a problem that it takes a long time for the heat from the heater to reach the piezoelectric vibration element and reach the desired frequency. .

As a miniaturized highly stable piezoelectric oscillator that does not use a large metal block, JP-A-2
005-33315 (Patent Document 1) discloses a highly stable piezoelectric oscillator of a type in which a heating element is mounted on a printed circuit board side. FIG. 5 is a diagram showing the configuration of a highly stable oscillator.
a) is a cross-sectional view, and FIG. The high stability oscillator includes a crystal resonator 67 having a configuration in which a crystal resonator element is sealed in a metal casing, a heating supply body 71 that supplies heat to the crystal resonator 67 to keep the temperature constant, and a crystal resonator. 67, an oscillation element 68 that constitutes an oscillation circuit, a temperature control element 65 that constitutes a temperature control circuit that controls the temperature of the crystal oscillator 67, a crystal oscillator 67, a heating supply 71, an oscillation element 68, and a temperature. And a circuit board 61 on which the control element 65 is mounted. The heat supply body 71 has a lead wire insertion hole for the crystal resonator 67 and is attached to the circuit board 61, and faces the crystal resonator 67 and is directly thermally coupled to the heat conducting plate 7.
2 and heating chip resistors 73a and 73b mounted on the circuit board 61 in proximity to the heat conducting plate 72 and thermally coupled to the heat conducting plate 72. The power transistors 65B1 and 65B2 of the temperature control element 65 are also used for heating.

The heat conducting plate 72 made of an aluminum plate is provided in a central region with a first recess 74a provided on one end side of a square aluminum plate, a second recess 74b provided on the other end side orthogonal to the first recess 74a. And an opening 75. A through hole 76 through which the lead wire 69 of the crystal resonator 67 is inserted is provided on the outer periphery of the opening 75. Then, the four corners of the heat conducting plate 72 are screwed onto the circuit board 61 with screws (not shown). A thermally conductive resin is applied between the circuit board 61 and the heat conducting plate 72 to thermally couple them. The circuit board 61 that is the four corners of the heat conducting plate 72 is provided with a penetrating notch 77 penetrating therethrough.
The voltage variable capacitance element 68 </ b> A and the thermistor 65 </ b> A, which are heat sensitive elements, are arranged in the opening 75 provided in the heat conducting plate 72. The other oscillation elements 68 are arranged on the other main surface of the circuit board 61, and the temperature control element 65 is mounted on the outer periphery of both main surfaces of the circuit board 61.
Since the heat conducting plate 72 is heated by the chip resistors 73a and 73b mounted on the circuit board 61, and the quartz vibrator 67 is faced and directly thermally coupled thereto, a thermostat is not required. It is disclosed that the structure is simple with a single circuit board, and that the height dimension can be particularly reduced.

JP 2005-333315 A

However, in the high stability piezoelectric oscillator disclosed in Patent Document 1, a heating supply body (chip resistance, chip resistance, and the like) is mounted by mounting a crystal resonator and a printed circuit board on which a heating element is mounted via a heat conducting plate.
The heat conduction plate), the crystal unit, and the circuit board are formed as one heat mass. For this reason, the circuit board temperature becomes very high due to heat generated by the heating supply body, circuit components such as an oscillation element, a voltage variable capacitance element, and a temperature control element to be mounted are excessively heated, and the failure of the circuit parts due to thermal stress. There is a problem that the reliability increases and the reliability of the highly stable piezoelectric oscillator may decrease.
The present invention has been made in order to solve the above-mentioned problem. The heating of the piezoelectric vibrator and the heating of the oscillation circuit component (oscillation circuit element and variable capacitance element) are separated, and both are provided with a temperature gradient. An object of the present invention is to provide a constant temperature piezoelectric oscillator that is configured to be thermally coupled and prevents excessive heating of circuit components.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application Example 1 The constant temperature piezoelectric oscillator according to the present invention is a base member for mounting on a motherboard in order to realize a small highly stable piezoelectric oscillator with high frequency stability, low power consumption and high reliability. A printed circuit board electrically and mechanically connected and supported by a connection pin extending from the base member at a position spaced from the upper surface of the base member, and a piezoelectric device mounted in a state of being thermally coupled to the lower surface of the printed circuit board A vibrator, an oscillation circuit component mounted on the printed circuit board, a first temperature control unit for temperature control of the piezoelectric vibrator, a second temperature control unit for temperature control of the oscillation circuit component, And a case for forming a thermostatic chamber that seals each of the components with the base member, wherein the first temperature control unit is for heating the piezoelectric vibrator. A first heat generating component, One temperature sensing element and a first temperature control circuit component, wherein the first heat generating component and the first temperature sensing element are thermally coupled only to the piezoelectric vibrator, and the second The temperature control unit includes a second heat generating component for heating the oscillation circuit component mounted on the printed circuit board, a second temperature sensing element, and a second temperature control circuit component, and is mounted on the printed circuit board. A constant temperature piezoelectric oscillator.

By providing two temperature control units, a first temperature control unit for controlling the temperature of the piezoelectric vibrator and a second temperature control unit for controlling the temperature of the oscillation circuit component, and controlling the temperature individually. The piezoelectric vibrator can be individually set to an optimum temperature, and the temperature of the oscillation circuit component can be set to be approximately 2 ° C. higher than the upper limit of the use temperature range of the constant temperature piezoelectric oscillator. The holder base of the piezoelectric vibrator and the printed board are thermally coupled, and a temperature gradient is formed from the first heat generating component, the piezoelectric vibrator to the printed board. By this temperature gradient and the second temperature control unit, the temperature of the piezoelectric vibrator can be maintained higher than that of the oscillation circuit component, so that the stability of the constant temperature piezoelectric oscillator can be improved and power saving can be achieved. In addition, by not excessively raising the temperature of the oscillation circuit component, it is possible to reduce the failure of the oscillation circuit component and increase the reliability.

Application Example 2 In the constant temperature type piezoelectric oscillator, the power consumption amount of the first temperature control unit is the second temperature control unit in the power consumption amounts of the first temperature control unit and the second temperature control unit. The constant-temperature piezoelectric oscillator according to Application Example 1, wherein the constant-temperature piezoelectric oscillator is larger than the power consumption amount of the piezoelectric oscillator.

The power consumption amount of the second temperature control unit can be made smaller than the power consumption amount of the first temperature control unit, and the frequency stability of the constant temperature piezoelectric oscillator can be maintained, which has the effect of reducing the power consumption. Further, by keeping the temperature of the oscillation circuit component low, there is an effect that the failure rate can be reduced and the reliability of the constant temperature type piezoelectric oscillator can be improved.

Application Example 3 The constant temperature piezoelectric oscillator according to Application Example 1, wherein the first heat-generating component is a power transistor or a heater wire.

By using a power transistor or a heater wire as the first heat generating component in contact with the piezoelectric vibrator, the speed of raising the piezoelectric vibrator to a predetermined temperature is fast, temperature control is facilitated, and miniaturization can be achieved. There is.

Application Example 4 In the constant temperature type piezoelectric oscillator, the base member is a lower metal case member that forms the constant temperature bath in cooperation with the case, and the connection pin is provided in the lower metal case member. The constant temperature piezoelectric oscillator according to any one of Application Examples 1 to 3, wherein a hole is passed through an insulating material and a lower end portion is protruded to the outside.

The base member is formed of a lower metal case member, and the thermostatic chamber is formed by the cooperation of the base member and the case, so that an airtight and robust constant temperature type piezoelectric oscillator can be configured. Furthermore, the metallic case and the base member have an effect of blocking noise from the outside and preventing noise from being emitted to the outside.

Application Example 5 In the constant temperature piezoelectric oscillator, any one of Application Examples 1 to 3, wherein the base member is a surface-printed base printed circuit board and supports a lower end portion of the connection pin. A constant temperature piezoelectric oscillator according to claim 1.

By constructing a thermostatic piezoelectric oscillator using a base printed board for surface mounting as a base member, a surface-mounting type thermoelectric oscillator can be obtained, and the mounting work on the mother board can be automated.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which showed the structure of the constant temperature type piezoelectric oscillator 1 of a 1st Example, (a) is a top view of a printed circuit board, (b) is the side view, (c) is a side view of a piezoelectric vibrator block body. (D) is a side view of a base member and a connection pin, (e) is sectional drawing of the constant temperature type piezoelectric oscillator 1. FIG. (A) is a side view of the piezoelectric vibrator block body, (b) is a cross-sectional view of the thermostatic piezoelectric oscillator 2. Sectional drawing of the constant temperature type piezoelectric oscillator 3 of a 3rd Example. Sectional drawing of the constant temperature type piezoelectric oscillator 4 of a 4th Example. (A) is sectional drawing which shows the structure of the conventional highly stable piezoelectric oscillator, (b) is a principal part top view.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of a constant temperature piezoelectric oscillator (highly stable piezoelectric oscillator) 1 according to an embodiment of the present invention. Figure 1
(a) is a top view of the printed circuit board, (b) is a side view of the printed circuit board, and (c) is a state in which the first heat generating component and the first temperature sensing element are attached to the piezoelectric vibrator. Side view shown, (d)
These are side views which show the state which attached the connection pin to the base member via the insulating material, and the same figure (e) is sectional drawing of the constant temperature type piezoelectric oscillator 1 which concerns on this invention.
The constant temperature piezoelectric oscillator 1 includes a base member 7 for mounting on a mother board, and a printed circuit board 5 electrically and mechanically connected and supported by connection pins 8 extending from the base member 7 at a position spaced from the upper surface of the base member 7. A piezoelectric vibrator 25 mounted in a state of being thermally coupled to the lower surface of the printed circuit board 5, and an oscillation circuit component 20 (20a, 20b) mounted on the printed circuit board 5,
The above components are sealed between the first temperature control unit 10 for temperature control of the piezoelectric vibrator 25, the second temperature control unit 14 for temperature control of the oscillation circuit component 20, and the base member 7. And a case for forming a thermostatic chamber.

The first temperature control unit 10 includes a first heat generating component 11 (for example, a power transistor) for heating the piezoelectric vibrator 25, a first temperature sensing element 12 such as a thermistor, and a first temperature sensing element. 1
The first temperature control circuit component 13 that controls the first heat generating component 11 based on the signal 2 is provided on the printed circuit board 5. The first heat generating component 11 and the first temperature sensing element 12 are thermally coupled only to the piezoelectric vibrator 25.
The second temperature control unit 14 includes a second heat generating component 15 (for example, a chip resistor or a heater that generates Joule heat) for heating the oscillation circuit component 20 mounted on the printed circuit board 5, and a thermistor, for example. A second temperature control element 16 and a second temperature control circuit component 17 for controlling the second heat generating component 15 based on a signal from the second temperature sensing element 16 are provided. Yes.
The oscillation circuit component 20 includes an oscillation element 20a formed as an IC for causing the piezoelectric vibrator 25 to oscillate.
And a variable capacitance element 20b such as a varicap diode, for example, and is mounted on the printed circuit board 5. The reason why the variable capacitance element 20b is provided is to vary the oscillation frequency of the constant temperature piezoelectric oscillator 1 from the outside as necessary.
The piezoelectric vibrator 25 is, for example, a crystal vibrator, and a piezoelectric vibration element (crystal vibration element) is hermetically sealed in a metal case, and the piezoelectric vibration element is placed in the metal case by an inner end portion of a lead terminal 25a extending into the metal case. It has the structure supported in non-contact. A piezoelectric vibration element is a piezoelectric substrate (
This is an element in which excitation electrodes are formed on the main surface of a quartz substrate.

As shown in FIG. 1 (a), a plurality of through holes 6a are formed in the printed circuit board 5 at the periphery thereof for penetrating connection pins 8 to be connected and fixed. The printed circuit board 5 includes a plurality of through holes 6 b for the lead terminals 25 a of the piezoelectric vibrator 25, a plurality of through holes 6 c for the lead terminals 11 a of the first heat generating component 11, and the first temperature sensing element 12. A plurality of through holes 6d and the like for the lead terminal 12a are formed.
As shown in FIGS. 1A and 1B, the first temperature control circuit component 13, the second heat generating component 15, and the second temperature sensing element 16 are formed on one surface of the printed circuit board 5. And a second temperature control circuit component 17 are mounted. On the other surface, an oscillation circuit component 20 including an oscillation circuit element 20a and a variable capacitance element 20b is mounted.

As shown in FIG. 1C, the first heat generating component (for example, a power transistor) 11 is soldered to the lower surface of the piezoelectric vibrator 25 using cream solder, or an adhesive having good heat conduction. Etc., and the first temperature sensing element 12 (for example, a thermistor) is adhered and fixed to the side surface of the piezoelectric vibrator 25 using an adhesive to form the piezoelectric vibrator block body 23. . The lead terminals 11a (three in the case of a power transistor) of the first heat generating component 11 of the piezoelectric vibrator block body 23 are bent at a substantially right angle with respect to the main surface of the first heat generating component 11 from a predetermined position. Yes. The terminals 12a (two) of the first temperature sensing element are thinner and more flexible than the lead terminal 11a and the lead terminal 25a of the piezoelectric vibrator 25, and need not be bent in advance.
The lead terminals 11a, 12a, and 25a of the piezoelectric vibrator block body 23 are passed through through holes 6c, 6d, and 6b provided in the printed circuit board 5, and the holder base 25b of the piezoelectric vibrator 25 is passed.
Is brought into contact with the printed circuit board 5, and the lead terminals 11a, 12a, 25a are inserted into the through holes 6c.
, 6d, and 6b to form a printed board block. The piezoelectric vibrator 25 is thermally coupled to the printed circuit board 5 via the holder base 25b and the lead terminals 25a.

As shown in FIG.1 (d), the base member 7 and the connection pin 8 are connected through an insulating material. Specifically, when a metal plate is used for the base member 7, a plurality of holes are formed in the metal plate, and the connection pins 8 are inserted and supported through a hermetic seal material (insulating material) filled in these holes.
When an insulating material such as a printed circuit board or a ceramic substrate is used as the base member 7, a plurality of through holes are formed in these insulating materials, and metallic connection pins 8 are passed through the through holes, and a predetermined length is obtained. To solder the connection pin 8 and the through hole.
A through hole 6a of the printed board block is passed through a connecting pin 8 extending vertically from the base member 7 shown in FIG. 1D, and a first heat generating component (for example, a power transistor) 11 of the printed board block is a base member. Through hole 6a and connecting pin 8 at a position away from 7
Are connected and fixed with solder.
Then, as shown in the sectional view of FIG. 1 (e), a metal case 9 is covered so as to cover the printed board block, and the outer peripheral edge of the base member 7 and the lower part of the case 9 are soldered, so that a constant temperature piezoelectric oscillator is obtained. Complete 1 In FIG. 1E, the oscillation circuit element 20a is not shown because it is located behind the piezoelectric vibrator 25 in the drawing. Moreover, the example of FIG.1 (e) is sectional drawing supposing the metal base members 7. FIG.
In the illustrated example, the base member 7 is a lower metal case member that forms a thermostatic chamber in cooperation with a metal case (upper metal case) 9, and the connection pins insulate holes provided in the lower metal case member 7. The lower end is protruded outside through the material.

As the piezoelectric vibrator used in the constant temperature type piezoelectric oscillator (highly stable piezoelectric oscillator) 1 according to the present invention, for example, an SC cut crystal vibrator is used. The SC cut crystal resonator is a crystal resonator using a quartz substrate that is rotated twice. Three vibration modes are excited, and the main vibration, which is the lowest frequency, is the thickness shear vibration mode (C mode). . A thickness torsion mode (B mode), a thickness longitudinal mode (A mode), and the like are present on the higher frequency side than the vibration mode. The resonance frequency (f2) of the B mode adjacent to the C mode (resonance frequency f1) of the main vibration is about 9 to 10% higher than the resonance frequency f1 of the C mode, and thus does not cause a frequency jump phenomenon or the like. Thus, it is necessary to devise the oscillation circuit.
The frequency temperature characteristic of the SC cut vibrator (C mode) exhibits a cubic curve, and the inflection point temperature (Ti) is about 95 ° C. And the vertex temperature Tp which shows a zero temperature coefficient in the low temperature side from an inflection point temperature (Ti) depends on the 2nd rotation angle to cut | disconnect, and the setting range of the vertex temperature Tp is 70 degreeC-
It becomes about 85 ° C. Accordingly, the set temperature of the first temperature control unit 10 is set in the vicinity of the apex temperature Tp.

The constant temperature type piezoelectric oscillator (highly stable piezoelectric oscillator) 1 of the present invention is characterized by a first temperature control unit 10 that maintains the temperature of the piezoelectric vibrator 25 at a vertex temperature Tp that indicates a zero temperature coefficient, and an oscillation circuit component 20.
Is maintained at approximately 2 ° C. higher than the upper limit of the operating temperature range of the constant temperature piezoelectric oscillator 1.
4 and two temperature control units are provided. The piezoelectric vibrator 25 is in contact with the printed circuit board 5, and the heat generated by the first heat generating component 11 of the first temperature control unit 10 is generated by the piezoelectric vibrator 25.
Conducted to the printed circuit board 5 via However, the holder base 25b of the piezoelectric vibrator 25,
Both holder cases 25c are made of metal and have higher thermal conductivity than the printed circuit board 5. Therefore, when the temperature reaches a steady state, a temperature gradient is formed between the piezoelectric vibrator 25 and the printed board 5, and the temperature of the printed board 5 becomes lower than the temperature of the piezoelectric vibrator 25.
When the ambient temperature of the constant temperature type piezoelectric oscillator 1 changes, the temperature of the oscillation circuit component 20 also changes, and the load capacity of the oscillation circuit component 20 viewed from the piezoelectric vibrator 25 changes. Even if the load capacitance of the oscillation circuit component 20 slightly changes, the oscillation frequency of the constant temperature piezoelectric oscillator 1 varies.
Conventional double thermostat type highly stable piezoelectric oscillators house a piezoelectric vibrator in an inner thermostat,
Oscillator circuit parts are housed in the outer temperature chamber, the temperature change of the inner temperature chamber is kept at about 0.1 ° C, the temperature change of the outer temperature chamber is kept at about 1 ° C, and the frequency stability is about 10 ^-10. Was getting. This also shows that it is important to keep the temperature of the oscillation circuit component constant with respect to the ambient temperature change.
However, in a mobile communication base station such as a WCDMA base station, it is small (for example, 25 mm
There is a demand for a highly stable piezoelectric oscillator of variable frequency type that is low in price and has a frequency stability of about 10 ⁻⁹ . To make the frequency variable type, it is necessary to mount a variable capacitance element (varicap diode or the like).

In view of the above, the constant-temperature piezoelectric oscillator 1 of the present invention has the second on the printed circuit board 5.
The second temperature control unit 14 including the heat generating component 15, the second temperature sensing element 16, and the second temperature control circuit component 17 is provided, and the oscillation circuit component 2 including the oscillation circuit element 20a and the variable capacitance element 20b.
The temperature change of 0 can be maintained within a predetermined temperature range. That is, the temperature holding of the piezoelectric vibrator 25 is individually controlled by the first temperature control unit 10, and the temperature holding of the oscillation circuit component 20 is individually controlled by the second temperature control unit 14. By individually controlling in this manner, the oscillation circuit component 20 is brought to the optimum temperature, that is, the apex temperature Tp indicating the zero temperature coefficient.
Can be set individually to be approximately 2 ° C. higher than the upper limit of the operating temperature range.

For example, when an SC cut crystal resonator is used, the vertex temperature Tp indicating the zero temperature coefficient is 80.
It is in the vicinity of ° C., and the set temperature of the first temperature control unit 10 is set in the vicinity of 80 ° C. On the other hand, the upper limit of the operating temperature range of the constant temperature type piezoelectric oscillator 1 is about 70 ° C., and the set temperature of the second temperature control unit 14 is set to about 72 ° C., which is about 2 ° C. higher than the upper limit temperature. That is, since the power consumption of each of the first temperature control unit and the second temperature control unit 10 and 14 is high in the set temperature of the first temperature control unit, the power consumption of the first temperature control unit is high. It becomes larger than the power consumption of the second temperature control unit.
As described above, the piezoelectric vibrator 25 is obtained by the first and second temperature controllers 10 and 14.
By controlling the temperature of the oscillation circuit component 20 mounted on the printed circuit board 5 with high accuracy,
While improving the stability of the constant temperature type piezoelectric oscillator 1, it is effective in power saving. In addition, by not excessively raising the temperature of the oscillation circuit component 20 or the like, there is an effect of reducing the failure rate of the oscillation circuit component 20 and improving the reliability.
By using a power transistor or a heater wire for the first heat-generating component 11 (11 ′) in contact with the piezoelectric vibrator 25, the temperature rise rate to a predetermined temperature is fast, temperature control is facilitated, and miniaturization is also achieved. There is an effect that it can be planned.
Further, it is the first and second heat generating components 11, 1 that contribute to the stability of the constant temperature piezoelectric oscillator 1.
5 is to suppress the conduction of heat generated in 5 to the outside, and it is necessary to consider fine points such as increasing the thermal resistance by reducing the thickness of the connection pin 8 connecting the printed circuit board 5 and the base member 7. is there.
Further, since the base member 7 is formed of a metal member and the thermostatic chamber is formed by the cooperation of the base member 7 and the case 9, there is an effect that an airtight and robust constant temperature type piezoelectric oscillator can be configured. Furthermore, the metal case and the base member are effective in blocking noise from the outside and preventing noise from being emitted to the outside.

FIG. 2 is a schematic diagram showing the configuration of the constant temperature piezoelectric oscillator 2 of the second embodiment. Since the configuration of the printed circuit board is the same as that shown in FIGS. 1A is a side view of the piezoelectric vibrator block body 23 in which the first heat generating component 11 ′ and the first temperature sensing element 12 are attached to the piezoelectric vibrator 25, and FIG. It is sectional drawing of the constant temperature type piezoelectric oscillator 2 of an Example. The constant temperature type piezoelectric oscillator 2 according to the second embodiment is different from the constant temperature type piezoelectric oscillator 1 shown in FIG. 1 in a first temperature control unit 10, particularly a first heat generating component 11 ′. The first heat generating component 11 ′ is a heating element configured by winding a resistance wire (heater wire) around the holder case 25 c of the piezoelectric vibrator 25. Alternatively, a heating element may be formed by wrapping a resistance wire around a metal bobbin having a diameter slightly larger than the diameter of the holder case 25c and having good heat conductivity, and may be attached to the holder case 25c.
By using a winding for the first heat generating component 11 ', there is an effect that the constant temperature type piezoelectric oscillator 2 of the second embodiment can be reduced in height.

FIG. 3 is a schematic cross-sectional view showing the structure of a surface-mount type constant temperature piezoelectric oscillator 3 of the third embodiment. A difference from the constant temperature type piezoelectric oscillator 1 shown in FIG. 1 is an example in which a connection pin 8 penetrating the printed circuit board 5 is soldered to a land electrode formed on the upper surface of the base member 7 to be a surface mount type. As the base member 7, an insulating base member is used. A plurality of terminal electrodes connected to the mother board are formed on the lower surface of the base member 7. The power of the oscillation circuit element 20a and the first and second temperature control units 10 and 14 is supplied via the terminal electrode, and the oscillation frequency generated by the constant temperature type piezoelectric oscillator 3 is supplied to the mother board side.
By constructing a thermostatic piezoelectric oscillator using a surface-mounting base printed circuit board as a base member, a surface-mounting type thermostatic piezoelectric oscillator can be realized, and the mounting on a mother board can be automated.

FIG. 4 is a schematic cross-sectional view showing the structure of a surface-mount type constant temperature piezoelectric oscillator 4 of the fourth embodiment. A difference from the constant temperature type piezoelectric oscillator 2 shown in FIG. 2 is an example in which a connection pin 8 penetrating the printed circuit board 5 is soldered to a land electrode formed on the upper surface of the base member 7 to be a surface mount type. An insulating base member is used as the base member 7, and a plurality of terminal electrodes are formed on the lower surface of the base member 7. The constant temperature type piezoelectric oscillator 4 of the fourth embodiment is also effective in that the mounting on the mother board can be automated.

1, 2, 3, 4, constant temperature piezoelectric oscillator, 5, printed circuit board, 6 a, 6 b, 6 c, 6 d, through hole, 7, base member, 8, connection pin, 9, case, 10, first temperature control Part, 1
DESCRIPTION OF SYMBOLS 1, 11 '... 1st heat-emitting component, 11a, 11'a ... Lead terminal of 1st heat-generating component, 12 ...
1st temperature sensing element, 12a ... lead terminal of 1st temperature sensing element, 13 ... 1st temperature control circuit component, 14 ... 2nd temperature control part, 15 ... 2nd heat-emitting component, 16 ... 2nd Temperature sensing element, 17 ... second
20 ... Oscillator circuit component, 20a ... Oscillator circuit element, 20b ... Variable capacitance element, 23 ... Piezoelectric vibrator block body, 25 ... Piezoelectric vibrator, 25a ... Lead terminal, 25b ... Holder base, 25c ... Holder case

Claims (5)

A base member for mounting on a motherboard, a printed board electrically and mechanically connected and supported by a connection pin extending from the base member at a position spaced from the upper surface of the base member, and thermally coupled to the lower surface of the printed board A piezoelectric vibrator mounted in the above-described state, an oscillation circuit component mounted on the printed circuit board, a first temperature control unit for temperature control of the piezoelectric vibrator, and a temperature control unit for the oscillation circuit component A thermostat piezoelectric oscillator comprising: a second temperature control unit; and a case for forming a thermostatic chamber for sealing each of the components between the base member,
The first temperature control unit includes a first heat generating component for heating the piezoelectric vibrator, a first temperature sensing element,
And the first temperature control circuit component, wherein the first heat generating component and the first temperature sensing element are thermally coupled only to the piezoelectric vibrator,
The second temperature control unit includes a second heat generating component for heating the oscillation circuit component mounted on the printed circuit board, a second temperature sensing element, and a second temperature control circuit component, and the printed circuit board. A constant temperature piezoelectric oscillator characterized by being mounted on The power consumption amount of each of the first temperature control unit and the second temperature control unit is such that the power consumption amount of the first temperature control unit is larger than the power consumption amount of the second temperature control unit. Item 2. The constant temperature piezoelectric oscillator according to Item 1. The constant temperature piezoelectric oscillator according to claim 1, wherein the first heat generating component is a power transistor or a heater wire. The base member is a lower metal case member that forms the thermostatic chamber in cooperation with the case, and the connection pin penetrates a hole provided in the lower metal case member through an insulating material and has a lower end portion. The constant temperature type piezoelectric oscillator according to any one of claims 1 to 3, characterized in that is protruded to the outside. The constant temperature piezoelectric oscillator according to any one of claims 1 to 3, wherein the base member is a surface-printed base printed circuit board and supports a lower end portion of the connection pin.

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