JP2005150971A - Electronic device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device and electronic equipment capable of attaining excellent vibration characteristics or oscillation characteristics. <P>SOLUTION: An oscillator (electronic device) 10 comprises a quartz resonator (element) 11 having a driving electrode (not shown) stuck to the surface, a rectangular substrate 12 arranged oppositely to the quartz resonator 11, and an elastic body 13 bonding the quartz resonator 11 and the substrate 12. The quartz resonator 11 is a WT type resonator having such a shape as two T-shaped members are arranged symmetrically to the bottom part thereof. The elastic body 13 bonds the quartz resonator 11 to the substrate 12 in the center of vibration of the quartz resonator 11. The substrate 12 and the quartz resonator 11 are connected electrically through a bonding wire 17. Preferably, the elastic body 13 has Young's modulus in the range of 0.1-50 MPa. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic device and an electronic apparatus including the electronic device.

Conventionally, an oscillator that accurately oscillates a predetermined frequency signal has been used as an electronic device used for a mobile phone, a PC (Personal Computer), a PDA (Personal Digital Assistance), a digital camera, a GPS (Global Positioning System), a gyro sensor, and the like. The
In such an oscillator, a crystal resonator such as an AT resonator or a tuning fork resonator is mounted on a base substrate as a base, but in order to ensure conduction from a wiring of the substrate to a drive electrode disposed on the resonator. In addition, the vibrator and the substrate are connected by a conductive adhesive material such as a solder paste, a silver paste, or a conductive silicon paste.

FIG. 10 is a perspective view showing a schematic configuration of a conventional oscillator.
In FIG. 10, an oscillator 150 includes an AT vibrator 151 having a convex or flat rectangular shape sealed in a container (not shown), and a base 152 that is an airtight terminal. The base 152 has an outer periphery such as Kovar. It consists of a metal part 153, a sealing glass 154 disposed inside the outer peripheral metal part 153, and a lead wire 155 such as Kovar penetrating the sealing glass 154. The inner lead 156 that is an exposed portion and the outer lead 157 that is an outer exposed portion that is not sealed. The AT vibrator 151 has an excitation electrode film (not shown) such as silver on its end surface and an extension thereof, and is inserted into the gap between the two inner leads 156 with the long axis aligned with the axis of the base 152 to melt at a high temperature. The extension portions of the electrode films on the front and back are electrically and mechanically connected to each of the inner leads 156 by a solder lump 158 using a paste mainly composed of a solder material (see, for example, Patent Document 1).

On the other hand, for example, an oscillator used in a GPS or gyro sensor is used not only as a frequency oscillation device that oscillates a predetermined frequency but also as an angular velocity detection device that detects an angular velocity based on the Coriolis force. It is necessary to detect the vibration of the crystal unit due to the noise with high precision. To that end, it is necessary to improve the freedom of the vibration mode in the crystal unit. In order to obtain characteristics, there is a growing demand for improvement in the degree of freedom of vibration modes in crystal resonators.
However, as described above, in the conventional oscillator, since the crystal unit is mounted on the base by a highly rigid adhesive material such as a solder paste, fluctuations of the crystal unit with respect to the base, particularly fluctuations in the horizontal rotation direction, are regulated. For this reason, it is difficult to improve the degree of freedom of the vibration mode in the crystal resonator, and there is a problem that good vibration characteristics and oscillation characteristics cannot be obtained.

JP 2001-94372 A (2nd page, right column, lines 11-29)

  An object of the present invention is to provide an electronic device capable of obtaining excellent vibration characteristics and oscillation characteristics and an electronic apparatus including the electronic device.

Such an object is achieved by the present invention described below.
An electronic device of the present invention includes an oscillating element having a drive electrode,
A base disposed opposite to the element;
An elastic body for joining the vibration center portion of the element and the base body;
A first conductor that electrically connects the drive electrode and the base in the vicinity of the vibration center portion is provided.
Thereby, when the electronic device of the present invention is applied to an oscillator, the degree of freedom of vibration of the element can be improved. As a result, the oscillator exhibits excellent vibration characteristics and oscillation characteristics.

In the electronic device of the present invention, a housing-like container that houses the element, the base body, and the elastic body,
It is preferable to include a second conductor that electrically connects the container and the base.
Thereby, since the influence of the surrounding environment can be sufficiently suppressed, more excellent vibration characteristics and oscillation characteristics can be exhibited.

In the electronic device of the present invention, it is preferable that the second conductor is a bonding wire.
Thereby, a container and a base | substrate can be connected easily. For example, when the element and the substrate are connected by a bonding wire, they can be connected in the same process, so that the manufacturing process can be reduced.

In the electronic device of the present invention, it is preferable that the second conductor is an outer lead.
Thereby, since a base | substrate and a container can be connected by outer lead bonding, the electrical connection and mechanical connection of a base | substrate and a container can be performed simultaneously. As a result, low cost and short TAT (Turn Around Time) can be achieved.

In the electronic device of the present invention, it is preferable that the second conductor is an inner lead.
Thereby, since a base | substrate and a container can be connected by inner lead bonding, the electrical connection and mechanical connection of a base | substrate and a container can be performed simultaneously. As a result, low cost and short TAT can be achieved.

An electronic device of the present invention includes an oscillating element having a drive electrode,
A base disposed opposite to the element;
An elastic body for joining the vibration center portion of the element and the base body;
A housing-like container for housing the element, the base, and the elastic body;
A first conductor that electrically connects the drive electrode in the vicinity of the vibration center and the container is provided.
Thereby, when the electronic device of the present invention is applied to an oscillator, the degree of freedom of vibration of the element can be improved. As a result, the oscillator exhibits excellent vibration characteristics and oscillation characteristics.

In the electronic device of the present invention, the elastic body is preferably an adhesive.
As a result, the degree of freedom of vibration of the element can be further improved while sufficiently maintaining the bonding strength between the element and the substrate. As a result, when the electronic device of the present invention is applied to an oscillator, more excellent vibration characteristics and oscillation characteristics are exhibited.
In the electronic device of the present invention, the elastic body preferably has a Young's modulus of 0.1 to 50 MPa.
Thereby, when the electronic device of the present invention is applied to an oscillator, more excellent vibration characteristics and oscillation characteristics can be exhibited. In particular, when the Young's modulus of the elastic body is in such a range, the temperature characteristics of the oscillation frequency and impedance can be further improved. In addition, for example, when the oscillator is incorporated in an electronic device for personal use such as a mobile phone, the impact resistance of the electronic device incorporating the oscillator can be improved because the impact due to the dropping of the electronic device is absorbed.

In the electronic device of the present invention, it is preferable that the first conductor is a bonding wire.
Thereby, an element and a base can be easily connected. In addition, for example, when the container and the base are connected by a bonding wire, they can be connected in the same process, so that the manufacturing process can be reduced.
An electronic apparatus according to the present invention includes the electronic device according to the present invention.
Thereby, an electronic device with high reliability can be provided.

Hereinafter, the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
In this embodiment, a case where the electronic device of the present invention is applied to an oscillator will be described as a representative example.
<First Embodiment>
First, the structure of the first embodiment when the electronic device of the present invention is applied to an oscillator will be described with reference to the accompanying drawings.
FIG. 1 is a schematic view showing a first embodiment in which the electronic device of the present invention is applied to an oscillator, FIG. 1 (a) is a longitudinal sectional view, and FIG. 1 (b) is a plan view. In the following description, the upper side in each of FIGS. 1 and 2 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.

As shown in FIG. 1, the oscillator 10 includes a crystal resonator (element) 11 having a driving electrode (not shown) attached to the surface thereof, and a rectangular base body disposed to face the crystal resonator 11. 12 and an elastic body 13 that joins the crystal unit 11 and the base body 12 to each other.
The crystal unit 11 is a WT type unit and has a shape in which two T-shaped members are arranged so as to be symmetrical with respect to their bottoms.

The base 12 includes a substrate 14, an insulating layer 15 provided on the surface of the substrate 14 facing the crystal resonator 11, and a wiring layer 16 provided on the surface of the insulating layer 15 facing the crystal resonator 11. It is comprised by the laminated body of.
The substrate 14 is a predetermined rectangular flat plate made of metal or the like. The substrate 14 may be a conductor, a semiconductor, or an insulator. However, the constituent material of the substrate 14 is a highly rigid metal because the substrate 14 serves as a base of the crystal unit 11 via an elastic body 13 described later. It is preferable to use SUS, and in particular, from the viewpoint of cost and corrosion resistance, it is more preferable to use SUS.

The insulating layer 15 is, for example, SiO _2, TEOS (ethyl silicate), polysilazane, polyimide, and a Low-K material or the like.
The wiring layer 16 is made of a conductive material capable of forming a thin film such as copper (Cu), silver (Ag), or gold (Au).
The wiring layer 16 can be formed by, for example, a dipping method, a printing method, a wet plating method such as electrolytic plating, immersion plating, and electroless plating, or a chemical vapor deposition method (CVD such as plasma CVD, thermal CVD, or laser CVD). ), Vacuum plating, sputtering, dry plating methods such as ion plating, thermal spraying, metal foil bonding, and the like.

A predetermined wiring pattern (not shown) is formed on the wiring layer 16. For example, reactive ion etching, plasma etching, beam etching, dry etching such as optically assisted etching, wet etching, or the like is used to form the wiring pattern.
The elastic body 13 joins the crystal unit 11 to the base 12 at the center of vibration corresponding to the portion where the two T-shaped members of the crystal unit 11 are brought together.

Conventionally, a high-rigidity adhesive material such as a solder paste has been used to join the crystal unit and the substrate. However, when bonding using such a highly rigid material, fluctuations in the crystal unit relative to the base, particularly fluctuations in the horizontal rotation direction, are restricted, and it is difficult to improve the freedom of vibration modes in the crystal unit. There was a problem that vibration characteristics and oscillation characteristics could not be obtained.
However, the degree of freedom of vibration of the crystal unit is maintained while maintaining the bonding strength between the crystal unit and the substrate by bonding the crystal unit (element) and the substrate using an elastic body as in the present invention. Can be improved. As a result, excellent vibration characteristics and oscillation characteristics are exhibited.

  The elastic body 13 preferably has a Young's modulus in the range of 0.1 to 50 MPa, and more preferably in the range of 0.5 to 20 MPa. When the Young's modulus of the elastic body 13 is in such a range, the oscillator 10 can exhibit more excellent vibration characteristics and oscillation characteristics. In particular, when the Young's modulus of the elastic body 13 is in such a range, the temperature characteristics of the oscillation frequency and impedance can be further improved. Further, for example, when the oscillator 10 is incorporated in a personal use electronic device such as a mobile phone, the impact resistance of the electronic device incorporating the oscillator 10 can be improved in order to absorb the impact caused by the drop of the electronic device. it can. On the other hand, if the Young's modulus is less than the lower limit, sufficient vibration characteristics and oscillation characteristics may not be obtained. On the other hand, if the Young's modulus exceeds the upper limit, the temperature characteristics of the oscillation frequency and impedance may not be sufficiently obtained depending on the material constituting the elastic body.

  The material constituting the elastic body 13 is not particularly limited, but it is preferable to use an adhesive such as a silicon adhesive or an epoxy resin adhesive. Thereby, the degree of freedom of vibration of the crystal unit 11 can be further improved while sufficiently maintaining the bonding strength between the crystal unit 11 and the base 12. As a result, the oscillator 10 exhibits more excellent vibration characteristics and oscillation characteristics.

The bonding area of the elastic body 13 with the crystal resonator 11 is preferably 0.01 to ¹ mm ² , although it depends on the size of the crystal resonator 11, and is 0.04 to 0.5 mm ² . More preferably. Thereby, the degree of freedom of vibration of the crystal unit 11 can be further improved while sufficiently maintaining the bonding strength between the crystal unit 11 and the base 12.
The crystal unit 11 (drive electrode) and the base 12 (wiring layer 16) are electrically connected by a bonding wire (first conductor) 17.

The bonding wire 17 is pulled out from the vicinity of the center of the crystal unit 11 and connected to the base 12 as shown in the configuration. Thus, by pulling out the bonding wire from the vicinity of the center of the crystal unit 11, the crystal unit 11 and the base 12 can be more reliably connected without disturbing the vibration of the crystal unit 11.
The bonding wire 17 is made of a material having good conductivity, such as gold (Au), aluminum (Al), solder, or an alloy thereof.

  As described above, in the present invention, the vibration center portion of the crystal resonator (element) and the substrate are joined by an elastic body, and the drive electrode and the substrate in the vicinity of the vibration center portion are bonded to the bonding wire (first conductor). It is characterized by electrical connection. By adopting such a configuration, the crystal resonator and the base can be reliably bonded without interfering with the vibration of the crystal resonator, and the crystal resonator and the base can be reliably connected. . As a result, excellent vibration characteristics and oscillation characteristics are exhibited.

Second Embodiment
Next, the structure of the second embodiment when the electronic device of the present invention is applied to an oscillator will be described with reference to the accompanying drawings. In the following description, differences from the first embodiment described above will be mainly described, and description of similar matters will be omitted.
FIG. 2 is a longitudinal sectional view showing a second embodiment when the electronic device of the present invention is applied to an oscillator.

The oscillator 10 of this embodiment includes a crystal resonator (element) 11, a base 12, an elastic body 13, and a housing-like container 22 having a housing space 21 for housing them.
The container 22 includes a bottom portion 23, a wall portion 24, and a lid body 40, and a housing space 21 is defined by the bottom portion 23, the wall portion 24, and the lid body 40.
The bottom 23 has an electrode 25 on the accommodation space 21 side.

The wall portion 24 has a single stepped step portion 26 and an electrode 27 on the upper surface of the step portion 26.
A plurality of wirings (not shown) are formed on the bottom portion 23 and the wall portion 24, and the plurality of wirings electrically connect the electrode 25 and the electrode 27.
As a constituent material of the container 22, for example, various glasses, various ceramic materials as described above, metals, and the like can be used.

A control IC 28 for controlling the crystal unit 11 is joined to the bottom 23.
The control IC 28 is electrically connected to the electrode 25 by a bonding wire 29. Note that the electrode 25 and the control IC 28 may be joined electrically and mechanically through a brazing material or the like, for example.
In the accommodation space 21, the base 12 is joined to the step portion 26.

The wiring pattern on the wiring layer 16 of the base 12 and the electrode 27 are electrically connected by a bonding wire (second conductor) 29 ′. Thereby, the control IC 28 and the crystal unit 11 are electrically connected, and the control IC 28 can control the oscillation of the crystal unit 11.
Also in the second embodiment, the vibration center portion of the crystal unit 11 and the base body 12 are joined by the elastic body 13, and the drive electrode and the base body 12 near the vibration center portion are bonded to the bonding wire (first conductor). ) Since the electrical connection is made at 17, the same operation and effect as in the first embodiment can be obtained. Furthermore, since the quartz resonator 11 and the like are housed in the container 22 and are sealed, the influence of the surrounding environment can be sufficiently suppressed, so that more excellent vibration characteristics and oscillation characteristics are exhibited. can do.

Next, an example of a method for manufacturing the oscillator (electronic device) 10 according to the first embodiment will be described with reference to the drawings.
FIG. 3 is a process diagram (cross-sectional view) showing a method for manufacturing the oscillator of FIG. In the following description, the upper side in each drawing of FIG. 3 is referred to as “upper” or “upward”.
1-1. First, a crystal resonator 11 that includes a drive electrode, a detection electrode, and the like and is molded into a predetermined WT type is prepared. A predetermined amount of the elastic precursor 30 is applied to the driving center portion of the surface of the crystal unit 11 facing the base 12 by a method such as dispenser, pin transfer, or ink jet ((a) in FIG. 3).

1-2. On the other hand, the insulating layer 15 is formed by applying polyimide or the like using a screen or the like on the substrate 14 cut into a predetermined rectangular shape from a material such as SUS material.
Next, a wiring layer 16 made of a copper thin film or the like is formed on the insulating layer 15 by vacuum deposition or the like, and dry etching or the like is further performed on the formed wiring layer 16 to form a predetermined wiring pattern.
Next, a predetermined amount of the elastic precursor 31 is applied to a portion of the wiring layer 16 corresponding to the driving center of the crystal unit 11 by a method such as a dispenser, pin transfer, or ink jet.

1-3. The elastic precursor 30 on the crystal unit 11 and the elastic precursor 31 on the substrate 12 formed as described above are brought into contact with each other ((b) in FIG. 3).
1-4. Thereafter, the elastic body precursor 30 and the elastic body precursor 31 are heated by a method such as reflow to join the base 12 and the crystal unit 11. At this time, the elastic body precursor 30 and the elastic body precursor 31 are fused, and then the elastic body 13 is formed by cooling ((c) in FIG. 3).

1-5. Next, a bonding wire 17 is formed using a wire bonding method, and the drive center portion of the crystal resonator 11 and the wiring pattern on the wiring layer 16 are electrically connected ((d) in FIG. 3).
Thus, the oscillator (electronic device) 10 according to the first embodiment is obtained.
In this embodiment, the case where the elastic body precursor is provided on both the base body 12 and the crystal unit 11 has been described. However, such an elastic body precursor is either the base body 12 or the crystal unit 11. It may be provided on one side and the base 12 and the crystal unit 11 may be joined.

Next, an example of a method for manufacturing the oscillator (electronic device) 10 according to the second embodiment will be described. In the following description, differences from the above-described embodiment will be mainly described, and description of similar matters will be omitted.
FIG. 4 is a process diagram (cross-sectional view) showing a method for manufacturing the oscillator (electronic device) of FIG.
2-1. First, a container 22 having an electrode 25 and an electrode 27 is prepared.

2-2. Next, the lid 40 is removed from the container 22, and the control IC 28 is mechanically joined to the bottom 23 of the container 22 with an adhesive or the like.
2-3. Next, a bonding wire 29 is formed using a wire bonding method, and the control IC 28 and the electrode 25 are electrically connected ((a) in FIG. 4).
2-4. Next, in the same manner as (1-1) to (1-5) in the manufacturing method of the above-described embodiment, the base body 12 on which the crystal resonator 11 is joined electrically and mechanically is placed on the step portion 26. In this way, it is mechanically joined with an adhesive or the like.

2-5. Next, a bonding wire 29 ′ is formed by using a wire bonding method, and the wiring pattern on the wiring layer 16 on the substrate 12 and the electrode 27 are electrically connected ((b) in FIG. 4).
2-6. Thereafter, the lid 40 is returned to seal the accommodation space 21 ((c) in FIG. 4). The sealed housing space 21 may be evacuated and vacuumed by a turbo molecular pump (not shown) through an exhaust hole (not shown) provided in advance. Further, after the accommodation space 21 is evacuated, it may be filled with an inert gas such as nitrogen (N ₂ ) gas.
Thus, the oscillator (electronic device) 10 according to the second embodiment is obtained.

Next, another embodiment in which the electronic device of the present invention is applied to an oscillator will be described.
<Third Embodiment>
Hereinafter, an oscillator (electronic device) according to a third embodiment of the present invention will be described. However, differences from the above-described embodiment will be mainly described, and description of similar matters will be omitted.

FIG. 5 is a longitudinal sectional view showing a third embodiment when the electronic device of the present invention is applied to an oscillator.
The oscillator 10 according to the present embodiment includes a crystal resonator 11, a base 51, an elastic body 13 that joins the drive center of the crystal resonator 11 and the base 51, and a container 22 that stores them. .

The base 51 can be made of the same material as that of the substrate 14 of the above-described embodiment, for example. In the embodiment described above, the base 12 has an insulating layer and a wiring layer. However, in the present embodiment, the base 51 may not have an insulating layer or a wiring layer, and may be formed of, for example, SUS. A single plate may be used.
The crystal resonator 11 (drive electrode) and the electrode 27 of the container 22 are electrically connected by a bonding wire (first conductor) 61.

The bonding wire 61 is pulled out from the vicinity of the center of the crystal unit 11 and connected to the electrode 27 as shown in the drawing.
In such a third embodiment, the vibration center portion of the crystal unit 11 and the base 12 are joined by the elastic body 13, and the drive electrode and the container 22 near the vibration center portion are bonded to the bonding wire (first conductor). ) Since the electrical connection is made at 17, the same operation and effect as in the first embodiment can be obtained. Further, since the container 22 is hermetically sealed, the same operation and effect as the second embodiment can be obtained.

<Fourth embodiment>
Next, an oscillator (electronic device) according to a fourth embodiment of the invention will be described. The description will focus on differences from the above-described embodiment, and description of similar matters will be omitted.
FIG. 6 is a longitudinal sectional view showing a fourth embodiment when the electronic device of the present invention is applied to an oscillator.

The oscillator 10 according to the present embodiment includes a crystal resonator 11, a base body 81, an elastic body 13 that joins the drive center of the crystal resonator 11 and the base body 81, and a container 22 that stores them. .
The base 81 includes a substrate 82, an insulating layer 15, and a plurality of outer leads (second conductors) 83.

The outer lead 83 is a plate-like terminal and protrudes from the vicinity of both ends of the base 81 toward the outside of the base 81.
The drive center portion of the crystal unit 11 (drive electrode) and the outer lead 83 are electrically connected by a bonding wire (first conductor) 84.
The outer lead 83 is made of a highly rigid and conductive material such as copper (Cu), gold or copper plated with nickel / gold.

The outer lead 83 is electrically and mechanically joined to the electrode 27 of the container 22 via a brazing material or the like.
By configuring the oscillator 10 as described above, the base 81 and the container 22 can be connected by outer lead bonding, so that the electrical connection and mechanical connection between the base 81 and the container 22 are simultaneously performed. can do. As a result, low cost and short TAT can be achieved.

Although the oscillator 10 of the present embodiment has been described as having the outer lead 83, the oscillator 10 may have an inner lead (second conductor) instead of the outer lead 83. Also in this case, excellent vibration characteristics and oscillation characteristics can be obtained, and the base body 81 and the container 22 can be connected by inner lead bonding. Therefore, the electrical connection between the base body 81 and the container 22 and the machine Simultaneous connection can be performed simultaneously. As a result, low cost and short TAT can be achieved.
And the oscillator 10 which is an electronic device mentioned above can be applied to various electronic devices, and the obtained electronic device has high reliability.

Hereinafter, an electronic device of the present invention will be described in detail with reference to the drawings.
FIG. 7 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.
In this figure, a personal computer 1100 includes a main body 1104 having a keyboard 1102 and a display unit 1106. The display unit 1106 is supported by the main body 1104 via a hinge structure so as to be rotatable. Yes.
Such a personal computer 1100 incorporates an electronic device 10 that functions as an antenna 1101, a resonator, a filter, and the like.

FIG. 8 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied.
In this figure, a cellular phone 1200 includes an antenna 1201, a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit is disposed between the operation buttons 1202 and the earpiece 1204.
Such a cellular phone 1200 incorporates an electronic device 10 that functions as a resonator, a filter, a VCO, or the like.

FIG. 9 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.
In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

Such a digital still camera 1300 incorporates an electronic device 10 that functions as a time standard, a microcomputer clock source, or the like.
In addition to the personal computer (mobile personal computer) in FIG. 7, the mobile phone in FIG. 8, and the digital still camera in FIG. 9, the electronic apparatus of the present invention includes, for example, an ink jet type ejection device (for example, an ink jet printer), Laptop personal computers, TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments (for example, Vehicles, aircraft, ship instrumentation), flight simille It can be applied to equal.

As mentioned above, although the electronic device and electronic device of this invention were demonstrated based on embodiment of illustration, this invention is not limited to these.
For example, in the above-described embodiment, the case where the electronic device of the present invention is applied to an oscillator has been described. However, the electronic device of the present invention is not limited to this.
In the above-described embodiment, an oscillator as an electronic device is manufactured by bonding a crystal resonator to a base and then mounting the base on a container. However, the crystal resonator is directly mounted on the container. May be.
Further, the shape of the crystal resonator is not limited to the above-described WT type, and may be any shape such as an AT type, a tuning fork type, a T type, and an H type.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows 1st Embodiment at the time of applying the electronic device of this invention to an oscillator, Fig.1 (a) is a longitudinal cross-sectional view, FIG.1 (b) is a top view. It is a longitudinal cross-sectional view which shows 2nd Embodiment at the time of applying the electronic device of this invention to an oscillator. It is process drawing (sectional drawing) which shows the manufacturing method of the oscillator (electronic device) of FIG. It is process drawing (sectional drawing) which shows the manufacturing method of the oscillator (electronic device) of FIG. It is a longitudinal cross-sectional view which shows 3rd Embodiment at the time of applying the electronic device of this invention to an oscillator. It is a longitudinal cross-sectional view which shows 4th Embodiment at the time of applying the electronic device of this invention to an oscillator. 1 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows schematic structure of the conventional oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Oscillator 11 ... Crystal oscillator 12, 51, 81 ... Base | substrate 13 ... Elastic body 14, 82 ... Board | substrate 15 ... Insulating layer 16 ... Wiring layer 17, 29, 29 ', 61, 84 ... ... bonding wire 21 ... accommodating space 22 ... accommodator 23 ... bottom 24 ... wall 25,27 ... electrode 26 ... step 28 ... control IC 30, 31 ... elastic precursor 40 ... Cover 83 ... Outer lead 1100 ... Personal computer 1101 ... Antenna 1102 ... Keyboard 1104 ... Main body 1106 ... Display unit 1200 ... Mobile phone 1201 ... Antenna 1202 ... Operation buttons 1204 ... Earpiece 1206 Mouthpiece 1300 Digital still camera 1302 Case (body) 1304 Light reception Knit 1306 ... Shutter button 1308 ... Memory 1312 ... Video signal output terminal 1314 ... Input / output terminal for data communication 1430 ... Television monitor 1440 ... Personal computer 150 ... Oscillator 151 ... AT vibrator 152 ... Base 153 ... Metal outer part 154 ... Sealing glass 155 ... Lead wire 156 ... Inner lead 157 ... Outer lead

Claims (10)

An oscillatable element having a drive electrode;
A base disposed opposite to the element;
An elastic body for joining the vibration center portion of the element and the base body;
An electronic device comprising: a first conductor that electrically connects the drive electrode in the vicinity of the vibration center portion and the base body. A housing-like container for housing the element, the base, and the elastic body;
The electronic device according to claim 1, further comprising a second conductor that electrically connects the container and the base body.   The electronic device according to claim 2, wherein the second conductor is a bonding wire.   The electronic device according to claim 2, wherein the second conductor is an outer lead.   The electronic device according to claim 2, wherein the second conductor is an inner lead. An oscillatable element having a drive electrode;
A base disposed opposite to the element;
An elastic body for joining the vibration center portion of the element and the base body;
A housing-like container for housing the element, the base, and the elastic body;
An electronic device comprising: a first conductor that electrically connects the drive electrode in the vicinity of the vibration center portion and the container.   The electronic device according to claim 1, wherein the elastic body is an adhesive.   The electronic device according to claim 1, wherein the elastic body has a Young's modulus of 0.1 to 50 MPa.   The electronic device according to claim 1, wherein the first conductor is a bonding wire. An electronic apparatus comprising the electronic device according to claim 1.

Images