JP2015050483A - Electronic device, electronic apparatus, and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device, an electronic apparatus, and a mobile capable of accurately positioning an integrated circuit board and a base.SOLUTION: An electronic device 1 includes a vibration element 3 and a package 2 housing the vibration element 3. The package 2 includes: a base 21 in which a recess 211 with a bottom is formed; and an integrated circuit board 22 bonded with an inner peripheral surface of the recess 211 in a state of being fitted in the recess 211 and has an active surface 23a present inside the recess, the active surface 23a including an electric circuit which drives the vibration element 3. The vibration element 3 is housed in a housing space S which is formed by the recess 211 and the integrated circuit board 22, and is fixed to the active surface 23a via conductive adhesives 41, 42. The electric circuit is extended to the other principal surface of the base 21 via a through electrode 62 formed on the base 21.

Description

  The present invention relates to an electronic device, an electronic apparatus, and a moving object.

2. Description of the Related Art Conventionally, as an oscillator (electronic device) using a crystal resonator element, a crystal resonator element accommodated in a package is widely known. In addition, in order to reduce the size of an oscillator, a configuration is also known in which an integrated circuit substrate in which an oscillation circuit is formed is used as part of a package (see, for example, Patent Document 1).
The oscillator of Patent Document 1 has a package having a box-shaped base having a recess and a plate-like integrated circuit substrate that closes the recess, and a crystal resonator element is accommodated in the recess. In addition, the active surface of the integrated circuit substrate is located inside the recess, and the crystal resonator element is fixed to the active surface.
However, in the oscillator of Patent Document 1, the integrated circuit board has a plate shape and is not caught by the base. Therefore, the integrated circuit board cannot be accurately positioned with respect to the base, and there is a problem that, for example, poor contact between terminals occurs.

JP 2006-129417 A

  An object of the present invention is to provide an electronic device, an electronic apparatus, and a moving body capable of accurately positioning an integrated circuit board and a base.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
[Application Example 1]
The electronic device of the present invention includes a vibration element,
A package containing the vibration element,
The package is
A base that is plate-shaped and has a bottomed recess that opens on one main surface;
An integrated circuit board that is joined to the inner peripheral surface of the recess in a state of being fitted into the recess and has an active surface including an electric circuit that drives the vibration element, facing the inside of the recess,
The vibration element is accommodated in an accommodation space formed by the recess and the integrated circuit substrate, and is fixed to the active surface via a fixing member,
The electric circuit is drawn out to the other main surface of the base through a through electrode formed in the base.
Thereby, an electronic device capable of accurately positioning the integrated circuit substrate and the base is obtained.

[Application Example 2]
In the electronic device of the present invention, the recess has a bottomed first recess that opens to the one main surface, and a bottomed second recess that opens to the center of the bottom surface of the first recess,
The integrated circuit board is preferably fitted in the first recess.
Thereby, positioning of a base and an integrated circuit board can be performed correctly and easily, ensuring the accommodation space of a vibration element by a 2nd recessed part.

[Application Example 3]
In the electronic device of the present invention, the integrated circuit board has a plate shape, and has a main body portion having the active surface, and an outer edge portion that is thinner than the main body portion and provided on an outer edge of the main body portion,
It is preferable that a side surface of the main body portion and an inner peripheral surface of the first recess face each other, and a surface of the outer edge portion on the base side and the one main surface of the base face each other.
Thereby, the positioning of the base and the integrated circuit board can be performed accurately and easily.

[Application Example 4]
In the electronic device according to the aspect of the invention, it is preferable that the outer edge portion is bonded to the one main surface of the base.
Thereby, an integrated circuit board and a base can be joined more firmly.
[Application Example 5]
In the electronic device according to the aspect of the invention, it is preferable that the electric circuit is electrically connected to the through electrode through a conductive member disposed in the housing space.
Thereby, the electric circuit and the through electrode can be easily connected.

[Application Example 6]
The electronic device of the present invention includes a vibration element,
A package containing the vibration element,
The package is
An integrated circuit board having a plate-like recess having a bottom and opening on one main surface, the bottom of the recess being an active surface including an electric circuit for driving the vibration element;
A base joined to the inner peripheral surface of the recess in a state fitted in the recess;
The vibration element is accommodated in an accommodation space formed by the concave portion and the base, and is fixed to the active surface via a fixing member,
The electrical circuit is drawn out to the outer surface of the package through wiring formed on the inner peripheral surface of the recess.
Thereby, an electronic device capable of accurately positioning the integrated circuit substrate and the base is obtained.

[Application Example 7]
In the electronic device of the present invention, the recess has a bottomed first recess that opens to the one main surface, and a bottomed second recess that opens to the center of the bottom surface of the first recess,
The base is preferably fitted in the first recess.
Thereby, positioning of a base and an integrated circuit board can be performed correctly and easily, ensuring the accommodation space of a vibration element by a 2nd recessed part.

[Application Example 8]
In the electronic device of the present invention, the base has a plate-like main body portion, and an outer edge portion that is thinner than the main body portion and provided on the outer edge of the main body portion,
It is preferable that a side surface of the main body portion and an inner peripheral surface of the first concave portion face each other, and a surface of the main body portion on the integrated circuit board side and a bottom surface of the first concave portion face each other.
Thereby, the positioning of the base and the integrated circuit board can be performed accurately and easily.

[Application Example 9]
In the electronic device according to the aspect of the invention, it is preferable that a surface of the main body portion on the integrated circuit substrate side is bonded to a bottom surface of the first recess.
Thereby, an integrated circuit board and a base can be joined more firmly.
[Application Example 10]
In the electronic device of the present invention, the base is preferably made of a glass material.
Thereby, it becomes easy to process the base.

[Application Example 11]
In the electronic device of the present invention, the fixing member has electrical conductivity,
It is preferable that the electric circuit and the vibration element are electrically connected via the fixing member.
As a result, the number of parts can be reduced, and the configuration of the electronic device can be simplified.

[Application Example 12]
In the electronic device according to the aspect of the invention, it is preferable that the electric circuit includes an oscillation circuit for causing the vibration element to oscillate.
As a result, the oscillation output generated by the oscillation circuit can be used as a reference signal such as a clock signal, for example.

[Application Example 13]
An electronic apparatus according to the present invention includes the electronic device according to the present invention.
As a result, a highly reliable electronic device can be obtained.
[Application Example 14]
The moving body of the present invention includes the electronic device of the present invention.
Thereby, a mobile body with high reliability is obtained.

It is sectional drawing which shows the electronic device concerning 1st Embodiment of this invention. It is the top view and permeation | transmission figure of the vibration element which the electronic device shown in FIG. 1 has. It is a top view of the base which the electronic device shown in FIG. 1 has. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows the electronic device concerning 2nd Embodiment of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. 1 is a perspective view schematically showing an automobile as an example of a moving object of the present invention.

Hereinafter, an electronic device, an electronic apparatus, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the drawings.
1. Electronic Device FIG. 1 is a cross-sectional view showing an electronic device according to a first embodiment of the present invention. 2 is a plan view and a transparent view of a vibration element included in the electronic device shown in FIG. FIG. 3 is a top view of a base included in the electronic device shown in FIG. 4 and 5 are cross-sectional views showing a method for manufacturing the electronic device shown in FIG. In the following, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.
As shown in FIG. 1, the electronic device 1 includes a package 2 and a vibration element 3 accommodated in the package 2.

-Vibration element-
As shown in FIGS. 2A and 2B, the vibration element 3 includes a piezoelectric substrate 31 having a rectangular plate shape in plan view, and an electrode 32 formed on the surface of the piezoelectric substrate 31. Yes.
The piezoelectric substrate 31 is a quartz base plate that mainly performs thickness shear vibration. In the present embodiment, a quartz base plate cut at a cut angle called AT cut is used as the piezoelectric substrate 31. The AT cut is mainly obtained by rotating a plane (Y plane) including the X axis and the Z axis, which are crystal axes of quartz, about 35 degrees and 15 minutes around the X axis from the Z axis in the counterclockwise direction. Cutting out to have a surface (a main surface including the X axis and the Z ′ axis). In such a piezoelectric substrate 31, the longitudinal direction thereof coincides with the X axis that is the crystal axis of the crystal, the lateral direction thereof coincides with the Z ′ axis, and the thickness direction thereof coincides with the Y ′ axis.

The electrode 32 is arranged side by side on the excitation electrode 321 disposed on the upper surface of the piezoelectric substrate 31, the excitation electrode 322 disposed on the lower surface of the piezoelectric substrate 31 so as to face the excitation electrode 321, and the proximal end portion of the upper surface of the piezoelectric substrate 31. The bonding pads 323 and 324, the wiring 325 that electrically connects the excitation electrode 321 and the bonding pad 323, and the wiring 326 that electrically connects the excitation electrode 322 and the bonding pad 324 are provided.
Such a vibration element 3 is fixed to the package 2 via a pair of conductive adhesives (fixing members) 41 and 42.

  Although the vibration element 3 has been described above, the vibration element 3 accommodated in the package 2 is not limited to this. For example, in the vibration element 3 of the present embodiment, the piezoelectric substrate 31 has a flat plate shape, but may be a “mesa type” in which the vibration part protrudes, or may be a “reverse mesa type” in which the vibration part is recessed. There may be. Further, a BT cut piezoelectric substrate 31 may be used instead of the AT cut. In addition, the vibration element 3 of the present embodiment is a thickness-slip type vibration element. In addition, the vibration element 3 has two vibration arms, and these vibration elements are in-plane bending vibration types that vibrate by repeatedly approaching and separating from each other. It may be an element, or may be an out-of-plane bending vibration type (walk type) vibration element having three vibration arms arranged side by side and the adjacent vibration arms vibrating in opposite directions in the thickness direction. Also good.

−Package−
The package 2 includes a cavity-shaped (box-shaped) base 21 having a concave portion 211 opened on the upper surface, and a plate-like integrated circuit substrate 22 that closes the opening of the concave portion 211, and these are bonded via a bonding member 5. Has been. The bonding member 5 is not particularly limited as long as the base 21 and the integrated circuit substrate 22 can be hermetically bonded. For example, a metal brazing material such as Au or solder, various adhesives, low-melting glass, or the like is used. be able to.
An airtight housing space S is formed inside the package 2, and the vibration element 3 is housed in the housing space S. For example, the storage space S may be in an atmospheric pressure state, may be in a reduced pressure state (particularly in a vacuum state), or may be filled with an inert gas such as nitrogen, helium, or argon. Good.

  The concave portion 211 formed in the base 21 has two steps, and the bottomed first concave portion 211a that opens to the central portion excluding the edge portion of the upper surface of the base 21 and the edge portion of the bottom surface of the first concave portion 211a. It has a bottomed second concave portion 211b that opens to the central portion. The integrated circuit board 22 is fitted in the first recess 211 a, and the accommodation space S is formed by the integrated circuit board 22 and the recess 211. By fitting the integrated circuit board 22 into the first recess 211a, the base 21 and the integrated circuit board 22 can be positioned accurately and easily.

  The constituent material of the base 21 is not particularly limited. For example, various ceramic materials such as alumina, silica, titania, zirconia, quartz glass, Tempax glass, Pyrex glass (where “Pyrex” is a registered trademark), etc. Although various glass materials, various resin materials, etc. can be used, it is preferable to use glass materials among these. According to the glass material, the base 21 with good shape accuracy can be manufactured easily and inexpensively.

  As shown in FIGS. 1 and 3, the electric wiring 6 that communicates the inside and outside of the accommodation space S is formed on the base 21. The electrical wiring 6 has four internal electrodes 61, four external electrodes (output / input terminals and ground terminals) 62, and four through electrodes 63. The four internal electrodes 61 are spaced apart along the circumferential direction on the bottom surface of the first recess 211a, and the four external electrodes 62 are spaced apart along the circumferential direction on the bottom surface of the base 21. Yes. One internal electrode 61 and one external electrode 62 are electrically connected by one through electrode 63.

As shown in FIG. 1, the integrated circuit board 22 includes a plate-like base 23 made of, for example, single crystal silicon, and an electric circuit for driving the vibration element 3 formed on the active surface (lower surface) 23 a of the base 23. (Not shown).
In the electric circuit, for example, a temperature sensing element for detecting an ambient temperature state, temperature compensation data for compensating the temperature characteristic of the vibration element 3, and the vibration characteristic of the vibration element 3 based on the temperature compensation data are changed in temperature. Includes a temperature compensation circuit that corrects according to the frequency, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the oscillation output generated by the oscillation circuit is, for example, a reference such as a clock signal Used as a signal.

Further, as shown in FIG. 1, the electric circuit has two terminals 241 and four terminals 242 that are electrically connected to the circuits described above. However, in FIG. 1, only two terminals 242 are shown. The two terminals 241 are disposed to face the bonding pads 323 and 324 of the vibration element 3, and the four terminals 242 are disposed to face the four internal electrodes 61 formed on the base 21.
The base body 23 is fitted in the first recess 211a, and is provided on a plate-like main body portion 231 whose lower surface is an active surface 23a and an outer edge of the main body portion 231, and has a frame shape that is thinner than the main body portion 231. And an outer edge portion 232. Further, the active surface (lower surface) 23 a of the main body 231 is positioned below the lower surface of the outer edge portion 232, and a step is formed therebetween.

  In addition, the vibration element 3 is mounted (fixed) on the active surface 23 a of the base 23 via conductive adhesives 41 and 42. The conductive adhesive 41 electrically connects one terminal 241 and the bonding pad 323, and the conductive adhesive 42 electrically connects the other terminal 241 and the bonding pad 324. As a result, the electric circuit and the vibration element 3 are electrically connected. The conductive adhesives 41 and 42 are not particularly limited as long as they have adhesiveness and conductivity. For example, the conductive adhesives 41 and 42 are conductive such as metal filler (metal fine particles such as silver powder and copper powder) and carbon fiber. Silicone-based, epoxy-based, polyimide-based adhesives mixed with particles can be used.

  Further, the main body portion 231 of the base 23 is formed to be slightly smaller than the first concave portion 211a in a plan view so as to be fitted into the first concave portion 211a. By forming the main body portion 231 slightly smaller than the first recess 211a, rattling when the main body portion 231 is fitted into the first recess 211a can be suppressed, and positioning of the integrated circuit board 22 with respect to the base 21 (in the planar direction) Positioning) can be performed with high accuracy. In addition, since the space for interposing the bonding member 5 can be appropriately secured between the side surface of the main body portion 231 and the inner peripheral surface of the first recess 211a, the integrated circuit substrate 22 and the base 21 are securely and firmly secured. Can be joined. Note that the distance between the side surface of the main body 231 and the inner peripheral surface of the first recess 211a is not particularly limited, but is preferably about 1 μm or more and 5 μm or less, for example. Thereby, the above effect becomes more remarkable.

On the other hand, the outer edge portion 232 is formed larger than the first recess 211a so as to be caught by the upper surface of the base 21. For this reason, the outer edge portion 232 functions as a stopper when the integrated circuit board 22 is fitted into the base 21, whereby the integrated circuit board 22 can be accurately positioned with respect to the base 21 (positioning in the height direction). .
In such a package 2, the side surface of the main body portion 231 faces the inner peripheral surface of the first recess 211 a, and the lower surface of the outer edge portion 232 faces the upper surface of the base 21. And the joining member 5 is provided between the side surface of the main-body part 231 and the internal peripheral surface of the 1st recessed part 211a, and between the lower surface of the outer edge part 232, and the upper surface of the base 21, By this joining member 5, The base 21 and the integrated circuit board 22 are joined.

  By disposing the bonding member 5 in this way, the bonding member 5 and the internal electrode 61 are separately disposed on different surfaces, and a sufficiently large separation distance between the bonding member 5 and the internal electrode 61 can be ensured. Therefore, contact between the joining member 5 and each internal electrode 61 can be prevented. Therefore, in particular, when the joining member 5 is a metal brazing material, it is possible to prevent a short circuit of the electric circuit via the joining member 5. Moreover, since the joining member 5 can be arrange | positioned over a wide range, the base 21 and the integrated circuit board 22 can be joined more firmly and airtightly. Furthermore, the joining member 5 has a horizontal surface (the lower surface of the outer edge portion 232 and the upper surface of the base 21) and a vertical surface (the side surface of the main body portion 231 and the inner peripheral surface of the first recess 211a) orthogonal to the horizontal surface. Since the bonding is performed, the package 2 has high durability against the stress regardless of the direction in which the stress is applied due to, for example, thermal expansion.

  Further, four conductive bumps (conductive members) 7 are arranged in the accommodation space S of the package 2 and between the active surface 23a and the bottom surface of the first recess 211a. The four conductive bumps 7 are located between each set of the terminal 242 and the internal electrode 61 and electrically connect them. As a result, the electric circuit is drawn out to the outer surface of the package 2 (the bottom surface of the base 21) by the conductive bump 7, the internal electrode 61, the through electrode 63 and the external electrode 62.

The conductive bump 7 is not particularly limited as long as it has conductivity. For example, a conductive material such as a metal brazing material such as solder, a metal filler (metal fine particles such as silver powder or copper powder), or carbon fiber. A silicone-based, epoxy-based, polyimide-based or the like mixed with can be used.
The electronic device 1 has been described above.

Next, a method for manufacturing the electronic device 1 will be described.
-First step (integrated circuit wafer preparation step)-
First, as shown in FIG. 4A, an integrated circuit wafer 220 in which a plurality of integrated circuit substrates 22 are integrally formed in a matrix is prepared. Specifically, for example, first, an ingot of single crystal silicon is sliced to a predetermined thickness to obtain a silicon wafer. Next, a plurality of bases 23 having a main body portion 231 and an outer edge portion 232 are formed by forming bottomed grooves 2320 in a lattice shape on the lower surface of the silicon wafer using a photolithography technique and an etching technique. Further, an electric circuit is formed on the lower surface of the main body portion 231 of each base 23 using a known semiconductor manufacturing technique. Thus, an integrated circuit wafer 220 in which a plurality of integrated circuit substrates 22 are integrally formed is obtained.

-Second step (vibration element mounting step)-
Next, as shown in FIG. 4B, the vibration element 3 is mounted on the lower surface (active surface) of each integrated circuit substrate 22 using conductive adhesives 41 and 42.
-Third step (glass substrate preparation step)-
On the other hand, regardless of the order of the first step and the second step, as shown in FIG. 4C, a glass substrate 210 in which a plurality of bases 21 are integrally formed in a matrix is prepared. Specifically, for example, first, a plate-shaped glass base material is prepared, and the bottomed concave portions 211 (first and second concave portions 211a and 211b) are formed in a matrix on the upper surface by using a photolithography technique and an etching technique. A plurality are formed in a shape. Next, for example, a through hole is formed through the bottom surface of each first recess 211a and the lower surface of the glass base material by laser processing or the like, and the through hole is filled with a metal material such as Au or Cu. An electrode 63 is formed. Next, using the photolithography technique and the etching technique, the internal electrode 61 is formed on the bottom surface of each first recess 211a, and the external electrode 62 is formed on the bottom surface of the glass base material. Thereby, the glass substrate 210 in which the plurality of bases 21 are integrally formed is obtained.

-Fourth step (lamination step)-
Next, as shown in FIG. 5A, the bonding member 5 made of a metal brazing material is applied to the upper surface of the glass substrate 210 (a frame-like surface surrounding each recess 211), and the internal electrode in each recess 211. Conductive bumps 7 made of a metal brazing material are also disposed on 61. Thereafter, the integrated circuit wafer 220 and the glass substrate 210 are overlapped with each other so that each main body portion 231 of the integrated circuit wafer 220 is fitted into the concave portion 211 of the glass substrate 210 to obtain a laminated body.

-Fifth step (melting step)-
Next, in a vacuum environment, the laminated body is heated while lightly holding the integrated circuit wafer 220 against the glass substrate 210 to melt the bonding member 5 and the conductive bumps 7. As a result, as shown in FIG. 5B, the integrated circuit wafer 220 and the glass substrate 210 are bonded by the bonding member 5, and the terminals 242 and the internal electrodes 61 are electrically connected by the conductive bumps 7. Connected. At this time, since the molten bonding member 5 spreads in the gap between the side surface of the main body portion 231 and the inner peripheral surface of the first recess 211a, the upper surface of the glass substrate 210 is melted by the bonding member 5 after melting. The bottom surface of the groove 2320 of the integrated circuit wafer 220 (the lower surface of the outer edge portion 232) is bonded, and the side surface of the main body portion 231 and the inner peripheral surface of the first recess 211a are bonded. Thereby, the integrated circuit wafer 220 and the glass substrate 210 can be firmly bonded.
-Sixth step (individualization step)-
Next, as illustrated in FIG. 5C, for example, a dicing saw is used to divide the stacked body along the center line of the groove 2320, thereby obtaining a plurality of electronic devices 1 simultaneously.

Second Embodiment
Next, a second embodiment of the electronic device of the present invention will be described.
FIG. 6 is a cross-sectional view of an electronic device according to the second embodiment of the present invention.
Hereinafter, the electronic device according to the second embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.

The electronic device according to the second embodiment of the present invention is the same as the first embodiment described above except that the package configuration is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.
A package 2A included in the electronic device 1A illustrated in FIG. 6 includes a cavity-shaped (box-shaped) integrated circuit substrate 22 having a recess 291 that is open on the upper surface, and a convex plate-shaped base 21 that closes the opening of the recess 291. These are joined via the joining member 5. In this embodiment, the integrated circuit board 22 has the same shape as the base of the first embodiment, and conversely, the base has the same shape as the integrated circuit board of the first embodiment. Hereinafter, the integrated circuit board 22 and the base 21 will be described in detail.

The integrated circuit board 22 includes, for example, a box-shaped base body 23 made of single crystal silicon and having a concave portion 291 formed thereon, and an electric circuit for driving the vibration element 3 formed on the active surface (bottom surface of the concave portion 291) 23a of the base body 23. Circuit (not shown).
The concave portion 291 formed in the base body 23 has two stages, and a bottomed first concave portion 291a that opens to the central portion excluding the edge portion of the upper surface of the integrated circuit substrate 22, and an edge of the bottom surface of the first concave portion 291a And a bottomed second concave portion 291b that opens to a central portion excluding the portion. The base 21 is fitted in the first recess 291a, and the accommodation space S is formed by the integrated circuit board 22 and the recess 291.

  The electric circuit provided on the active surface 23a stores, for example, a temperature sensing element that detects the ambient temperature state, temperature compensation data that compensates for the temperature characteristics of the vibration element 3, and based on the temperature compensation data. A temperature compensation circuit that corrects the vibration characteristics of the vibration element 3 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like. The output is used as a reference signal such as a clock signal, for example.

  In addition, the electric circuit includes two terminals 241 provided on the active surface 23a and four external terminals 243 provided on the upper surface of the integrated circuit substrate 22 and exposed to the outside of the package 2A. Each external terminal 243 is led out from the active surface 23 a to the upper surface of the integrated circuit substrate 22 by wiring 244 formed on the inner surface (bottom surface and inner peripheral surface) of the recess 291. However, in FIG. 6, only two external terminals 243 are shown.

  The vibration element 3 is mounted (fixed) on the active surface 23 a of the base 23 via conductive adhesives 41 and 42. The conductive adhesive 41 electrically connects one terminal 241 and the bonding pad 323, and the conductive adhesive 42 electrically connects the other terminal 241 and the bonding pad 324. As a result, the electric circuit and the vibration element 3 are electrically connected.

One base 21 has a plate-like main body portion 218 fitted in the first recess 291 a and a frame-like outer edge portion 219 that is provided on the outer edge of the main body portion 218 and is thinner than the main body portion 218. ing. Further, the lower surface of the main body portion 218 is located below the lower surface of the outer edge portion 219, and a step is formed therebetween.
Moreover, the main-body part 218 is formed slightly smaller than the 1st recessed part 291a in the planar view so that it can be inserted in the 1st recessed part 291a. By forming the main body portion 218 slightly smaller than the first concave portion 291a, rattling when the main body portion 218 is fitted into the first concave portion 291a can be suppressed, and positioning of the base 21 with respect to the integrated circuit substrate 22 (planar direction) Positioning) can be performed with high accuracy. In addition, since the space for interposing the bonding member 5 can be appropriately secured between the side surface of the main body 218 and the inner peripheral surface of the first recess 291a, the integrated circuit substrate 22 and the base 21 are securely and firmly secured. Can be joined.

  On the other hand, the outer edge portion 219 around the main body portion 218 is formed larger than the first concave portion 291a so as to be caught on the upper surface of the integrated circuit substrate 22. For this reason, the outer edge portion 219 functions as a stopper when the base 21 is fitted into the integrated circuit board 22, whereby the base 21 can be accurately positioned with respect to the integrated circuit board 22 (positioning in the height direction). . The outer edge portion 219 is formed to be smaller than the upper surface of the integrated circuit substrate, and the four external terminals 243 arranged on the upper surface of the integrated circuit substrate 22 can be exposed outside the package 2A. .

  In such a package 2A, the side surface of the main body 218 faces the inner peripheral surface of the first recess 291a, and the lower surface of the main body 218 faces the bottom of the first recess 291a. An insulating bonding member 5 is provided between the side surface of the main body 218 and the inner peripheral surface of the first recess 291a and between the lower surface of the main body 218 and the bottom of the first recess 291a. The integrated circuit board 22 and the base 21 are joined by the member 5.

According to such a package 2A, since the joining member 5 can be disposed over a wide range, the base 21 and the integrated circuit board 22 can be joined more firmly and airtightly. Furthermore, the joining member 5 includes a horizontal surface (the lower surface of the main body portion 218 and the bottom surface of the first concave portion 291a) and a vertical surface (the side surface of the main body portion 218 and the inner peripheral surface of the first concave portion 291a). Therefore, even if stress is applied in any direction due to thermal expansion, for example, the package 2A has high durability against the stress.
In the present embodiment, metal bumps 8 made of, for example, solder balls are provided on each external terminal 243. Thereby, the electronic device 1 can be easily mounted on another circuit board or the like by reflow or the like.

2. Next, an electronic apparatus to which the electronic device of the present invention is applied (electronic apparatus of the present invention) will be described.
FIG. 7 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 8 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display portion 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 9 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  In addition to the personal computer (mobile personal computer) in FIG. 7, the mobile phone in FIG. 8, and the digital still camera in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments (E.g., vehicle, aircraft, Instruments of 舶), can be applied to a flight simulator or the like.

3. Next, the moving body (the moving body of the present invention) to which the electronic device of the present invention is applied will be described.
FIG. 10 is a perspective view schematically showing an automobile as an example of the moving body of the present invention. An electronic device 1 is mounted on the automobile 1500. Electronic device 1 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine control, hybrid vehicle, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.
As described above, the electronic device, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is an arbitrary function having the same function. It can be replaced with the configuration of In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

  DESCRIPTION OF SYMBOLS 1, 1A ... Electronic device 2, 2A ... Package 21 ... Base 210 ... Glass substrate 211 ... Recessed part 211a ... 1st recessed part 211b ... 2nd recessed part 218 ... Main-body part 219 ... Outer edge part 22 ... ... Integrated circuit board 220 ... Integrated circuit wafer 23 ... Base 23a ... Active surface 231 ... Body 232 ... Outer edge 2320 ... Groove 241 ... Terminal 242 ... Terminal 243 ... External terminal 244 ... Wiring 291 …… Recess 291a …… First recess 291b …… Second recess 3 …… Vibrating element 31 …… Piezoelectric substrate 32 …… Electrodes 321 and 322 …… Excitation electrodes 323 and 324 …… Bonding pads 325 and 326 …… Wiring 41, 42 ... conductive adhesive 5 ... bonding member 6 ... electrical wiring 61 ... internal electrode 62 ... external electrode 63 ... penetrating Electrode 7 …… Conductive bump 8 …… Metal bump 1100 …… Personal computer 1102 …… Keyboard 1104 …… Main body 1106 …… Display unit 1108 …… Display unit 1200 …… Mobile phone 1202 …… Operation button 1204 …… Reception Mouth 1206 ... Mouthpiece 1208 ... Display 1300 ... Digital still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display 1312 ... Video signal output terminal 1314 ... ... Input / output terminal 1430 ... TV monitor 1440 ... Personal computer 1500 ... Automobile S ... Containment space

Claims (14)

A vibration element;
A package containing the vibration element,
The package is
A base that is plate-shaped and has a bottomed recess that opens on one main surface;
An integrated circuit board that is joined to the inner peripheral surface of the recess in a state of being fitted into the recess and has an active surface including an electric circuit that drives the vibration element, facing the inside of the recess,
The vibration element is accommodated in an accommodation space formed by the recess and the integrated circuit substrate, and is fixed to the active surface via a fixing member,
The electronic device is characterized in that the electric circuit is drawn out to the other main surface of the base through a through electrode formed in the base. The concave portion has a bottomed first concave portion that opens to the one main surface, and a bottomed second concave portion that opens to a central portion of the bottom surface of the first concave portion,
The electronic device according to claim 1, wherein the integrated circuit board is fitted in the first recess. The integrated circuit board has a plate shape and has a main body having the active surface, and an outer edge provided on an outer edge of the main body thinner than the main body.
The side surface of the main body part and the inner peripheral surface of the first recess face each other, and the base side surface of the outer edge part and the one main surface of the base face each other. Electronic devices.   The electronic device according to claim 3, wherein the outer edge portion is bonded to the one main surface of the base.   5. The electronic device according to claim 1, wherein the electric circuit is electrically connected to the through electrode via a conductive member disposed in the accommodation space. A vibration element;
A package containing the vibration element,
The package is
An integrated circuit board having a plate-like recess having a bottom and opening on one main surface, the bottom of the recess being an active surface including an electric circuit for driving the vibration element;
A base joined to the inner peripheral surface of the recess in a state fitted in the recess;
The vibration element is accommodated in an accommodation space formed by the concave portion and the base, and is fixed to the active surface via a fixing member,
The electronic device is characterized in that the electric circuit is drawn out to an outer surface of the package through a wiring formed on an inner peripheral surface of the recess. The concave portion has a bottomed first concave portion that opens to the one main surface, and a bottomed second concave portion that opens to a central portion of the bottom surface of the first concave portion,
The electronic device according to claim 6, wherein the base is fitted in the first recess. The base has a plate-shaped main body portion, and an outer edge portion that is thinner than the main body portion and provided at an outer edge of the main body portion,
The side surface of the main body and the inner peripheral surface of the first recess face each other, and the surface of the main body on the side of the integrated circuit board and the bottom surface of the first recess face each other. Electronic devices.   The electronic device according to claim 8, wherein a surface of the main body portion on the integrated circuit board side is bonded to a bottom surface of the first recess.   The electronic device according to claim 1, wherein the base is made of a glass material. The fixing member has conductivity,
The electronic device according to claim 1, wherein the electric circuit and the vibration element are electrically connected via the fixing member.   The electronic device according to claim 1, wherein the electric circuit includes an oscillation circuit for causing the vibration element to oscillate.   An electronic apparatus comprising the electronic device according to claim 1.   A moving body comprising the electronic device according to claim 1.

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