JP6729663B2 - Exposure method and exposure apparatus - Google Patents

Description

The present invention relates to an exposure method and an exposure apparatus for projecting and exposing a pattern on a mask onto a plate.

In recent years, thin display panels using elements such as liquid crystal or organic EL (Electro Luminescence) have been widely used as information display devices. These display panels are manufactured by patterning a transparent thin film electrode on a thin glass substrate by photolithography. In this photolithography process, an image of the pattern is projected onto the plate by using a lens array such as MLA (Micro Lens Array) as an apparatus for projecting and exposing the pattern formed on the mask onto a photosensitive substrate (hereinafter, also referred to as plate). There is an exposure device (for example, Patent Document 1). In the exposure apparatus described in Patent Document 1, when the pattern image is exposed on the plate, the mask and the wafer are relatively opposed to the illumination optical system for illuminating the mask and the MLA as the projection optical system for projecting the pattern image. It is disclosed to move.

JP, 9-244255, A

For example, when manufacturing a display panel, a pattern of a plurality of layers is laminated on one plate by repeating exposure and development of the pattern on one plate. In this case, the exposure device exposes the pattern on the same plate multiple times. Here, the plate to be exposed may expand or contract due to development processing or the like. When the exposure apparatus includes a general projection optical system that transmits and reflects light with an optical member such as a lens and a mirror, instead of the MLA, it copes with a pattern shift caused by expansion and contraction of a plate in a part of the projection optical system. For this reason, some devices are equipped with a mechanism for adjusting the projection magnification and the like.

However, since the exposure apparatus including the lens array as in Patent Document 1 has a configuration in which the distance between the mask and the substrate is narrowed, it is difficult to provide a mechanism for adjusting the projection magnification. Further, if a mechanism for adjusting the projection magnification is provided between the mask and the substrate in addition to the lens array, the distance between the mask and the substrate is widened, and the effect obtained by providing the lens array is significantly reduced.

An aspect of the present invention is to provide an exposure method and an exposure apparatus capable of exposing a mask pattern to a more appropriate position on a plate while using a lens array.

According to a first aspect of the present invention, there is provided an exposure method of irradiating a mask with illumination light through an illumination optical system and transferring a pattern formed on the mask onto a plate through a lens array, which has a strip shape. The plurality of masks are arranged in a non-scanning direction which is a direction orthogonal to the scanning direction in a direction in which the scanning direction is long, and the illumination optical system and the lens array, the mask and the plate, The mask is moved relative to the scanning direction along the plate, the illumination optical system irradiates the pattern with the illumination light, and the image of the pattern formed on the mask is transferred through the lens array. Projecting on the plate, and during the relative movement of the illumination optical system, the lens array, the mask, and the plate in the scanning direction, a plurality of non-scanning directions orthogonal to the scanning direction are provided. And changing the distance between the masks.

According to the second aspect of the present invention, an illumination optical system for irradiating the mask with illumination light and an image of a pattern formed on the mask illuminated by the illumination optical system are projected on a plate, and the mask is projected onto the mask. An exposure apparatus comprising: a lens array that transfers the formed pattern to the plate; and a moving device that relatively moves the illumination optical system and the lens array in a scanning direction along the mask and the plate. A plurality of strip-shaped masks are arranged along a non-scanning direction which is a direction orthogonal to the scanning direction in a direction in which the scanning direction is the longitudinal direction, and in the non-scanning direction which is a direction orthogonal to the scanning direction. A mask support mechanism having a mask space adjustment mechanism for changing the space between the plurality of masks, a support base for supporting the mask space adjustment mechanism, a plate support mechanism for supporting the plate, and a relative support by the moving device. An exposure apparatus is provided that includes a control device that adjusts the intervals between the plurality of masks by the mask interval adjustment mechanism during movement.

According to the aspect of the present invention, the position of the mask pattern projected on the plate is changed by changing the interval between the plurality of masks in the non-scanning direction orthogonal to the scanning direction and changing the relative position between the mask and the plate. It can be adjusted according to the deviation of the pattern of the plate. This allows the mask pattern to be exposed at a more appropriate position on the plate while using the lens array.

FIG. 1 is a side view of the exposure apparatus according to the first embodiment. FIG. 2 is a top view of the mask support mechanism of the exposure apparatus shown in FIG. FIG. 3 is a side view of the mask support mechanism shown in FIG. FIG. 4 is a view of the exposure apparatus according to the first embodiment as seen from between the projection optical system and the plate. FIG. 5 is a view of the exposure apparatus according to the first embodiment as seen from the direction in which the illumination optical system and the projection optical system move. FIG. 6 is a side view showing a state in which a position detection device is installed in the exposure apparatus shown in FIG. FIG. 7 is a top view showing a state in which a position detection device is installed in the exposure apparatus shown in FIG. FIG. 8 is a side view showing a state in which a mask is arranged in the exposure apparatus shown in FIG. FIG. 9 is a top view showing a state in which the mask of the exposure apparatus shown in FIG. 7 is arranged. FIG. 10 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 11 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 12 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 13 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 14 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 15 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 16 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 17 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 18 is a side view of the exposure apparatus according to the second embodiment. FIG. 19 is a side view of the exposure apparatus according to the third embodiment. FIG. 20 is a view of the exposure apparatus according to the third embodiment as seen from between the projection optical system and the plate. FIG. 21 is a diagram of the exposure apparatus according to the third embodiment viewed from the direction in which the illumination optical unit and the projection optical system move. FIG. 22 is a flowchart showing each step of the device manufacturing method according to this embodiment.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below. In the following, the lower side is the direction in which gravity acts (vertical direction), and the upper side is the side opposite to the direction in which gravity acts.

(Embodiment 1)
The exposure apparatus according to the first embodiment will be described below with reference to FIGS. 1 to 5. FIG. 1 is a side view of the exposure apparatus according to the first embodiment. FIG. 2 is a top view of the mask support mechanism of the exposure apparatus shown in FIG. FIG. 3 is a side view of the mask support mechanism shown in FIG. FIG. 4 is a view of the exposure apparatus according to the first embodiment as seen from between the projection optical system and the mask. FIG. 5 is a view of the exposure apparatus according to the first embodiment as seen from the direction in which the illumination optical system and the projection optical system move. The exposure apparatus 1 uses an MLA (Micro Lens Array) for the projection optical system, and moves (scans) the illumination optical unit and the projection optical system with respect to the mask and the plate (photosensitive substrate) to form a mask pattern on the plate. It is a scanning type exposure apparatus that exposes a (mask pattern). The exposure apparatus 1 of the present embodiment supports the mask unit M including a plurality of masks, and exposes the patterns of the plurality of masks on the plate, respectively. In the following, the Z axis is taken in the direction parallel to the optical axis AXL of the projection optical system (see FIG. 1), the X axis is taken in the scanning direction of the illumination optical system and the projection optical system, and the Z axis is orthogonal to the X axis. Take the Y-axis in the direction you want to. First, the outline of the exposure apparatus 1 will be described.

<Outline of exposure equipment>
The exposure apparatus 1 includes a frame 1F, an illumination optical system 2, a projection optical system 3, and a moving device 21. The exposure apparatus 1 is provided with a light source 6 that outputs light toward the illumination optical system 2. The exposure apparatus 1 guides the light emitted from the light source 6 to the mask unit M by the illumination optical system 2, and guides the light that has passed through the mask unit M by the projection optical system 3 to form the pattern of the mask unit M on the plate P. To project. The exposure apparatus 1 is controlled by the control device 9. The exposure apparatus 1 also includes a position detection device that detects the position of the pattern formed on the mask unit M and the position of the pattern formed on the plate. The position detection device will be described later.

The frame 1F has a base portion 1V, a side portion 1W attached to the base portion 1V, a pair of illumination system guides 5L for supporting the illumination optical system 2, and a pair of projection system guides 5P for supporting the projection optical system 3. .. The base portion 1V is attached to an installation target (for example, a foundation) of the exposure apparatus 1 and is located below the exposure apparatus 1. The side portion 1W is attached to the upper portion of the base portion 1V. A pair of illumination system guides 5L and a pair of projection system guides 5P are attached to the side portion 1W. The former of the illumination system guide 5L and the pair of projection system guides 5P is arranged above the latter and is supported by the side portion 1W.

The illumination system guide 5L and the projection system guide 5P extend in a direction parallel to the X axis. The pair of illumination system guides 5L and the pair of projection system guides 5P are arranged at a predetermined interval in the Y direction. The illumination optical system 2 straddles a pair of illumination system guides 5L and is supported thereby. Then, the illumination optical system 2 moves in the X direction (direction indicated by arrow xl in FIG. 1) along the pair of illumination system guides 5L. The projection optical system 3 straddles a pair of projection system guides 5P and is supported thereby. Then, the projection optical system 3 moves in the X direction (the direction indicated by the arrow xp in FIG. 1) along the pair of projection system guides 5P. Since the illumination system guide 5L is arranged above the projection system guide 5P, the illumination optical system 2 is arranged above the projection optical system 3.

<Plate stage>
A plate stage 1S is provided above the base 1V. The plate stage 1S mounts the plate P to be exposed. In the present embodiment, the plate stage 1S is mounted with the plate P held by the holder. The plate stage 1S has a support portion 32 that supports the plate P and a base 34 that supports the support portion 32 in a movable state. The base 34 is fixed to the base 1V. The plate stage 1S can move the plate P with respect to the frame 1F by moving the support portion 32 that supports the plate with respect to the base 34. The plate stage 1S serves as a moving mechanism for moving the plate P by the support portion 32 and the base 34. The plate stage 1S can move the plate P in the scanning direction. In the plate stage 1S, that is, various linear motion actuators can be used as a mechanism for moving the support portion 32 with respect to the base 34.

<Mask stage>
The mask stage 1T will be described with reference to FIGS. 1 to 3. The mask stage 1T supports the mask unit M. The mask unit M is supported above the plate stage 1S by the mask stage 1T protruding from the side portion 1W to the inside of the frame 1F. In the present embodiment, the plate stage 1S mounts and supports the plate P while being held by the holder.

The mask unit M held by the mask stage 1T will be described. The mask unit M includes a plurality of masks as described above, and five masks Ma, Mb, Mc, Md, and Me in this embodiment. In the mask unit M, the masks Ma, Mb, Mc, Md, and Me are arranged in a row on the surface of the mask unit M in the direction orthogonal to the scanning direction, that is, in the Y direction (also referred to as the non-scanning direction). That is, as the masks Ma, Mb, Mc, Md, and Me, adjacent masks are arranged in the Y direction. The masks Ma, Mb, Mc, Md, and Me have basically the same configuration except that the arrangement positions are different. Therefore, the mask Ma will be described below as a representative. The mask Ma has a rectangular shape with a long side (longitudinal direction) in the scanning direction and a short side (shorter direction) in the Y direction. The mask Ma has a plurality of pattern regions 50 formed on a rectangular base. The pattern area 50 is an area in which a transfer pattern is formed, and is arranged in rows in the scanning direction. In the mask Ma, a shielding region 52 for shielding the illumination light is arranged between the pattern regions 50 on the base and the pattern regions. In this manner, the mask Ma has the pattern regions 50 and the shielding regions 52 alternately arranged in the scanning direction at the base, and the shielding regions 52 are arranged between the adjacent pattern regions 50. The shielding region 52 is a region in which a transfer pattern is not formed, and is formed with a film that does not substantially transmit illumination light, for example, a chrome film.

In the mask unit M, masks Ma to Me having a plurality of pattern regions 50 arranged in the scanning direction are arranged in parallel in the non-scanning direction. Here, among the plurality of pattern regions 50 included in the masks Ma to Me, one pattern region 50 is preferably used as a mask pattern for forming a TFT array substrate of a small-sized liquid crystal display panel. On the masks Ma to Me, for example, a pattern for forming a TFT array substrate of a medium-sized liquid crystal display panel is drawn. The middle- and small-sized liquid crystal panels are liquid crystal panels having a screen size of, for example, up to about 10 inches (width 205.2 mm×length 153.9 mm). In the exposure apparatus 1 of the present embodiment, as will be described later, since the exposure is performed at the same size, the pattern area 50 corresponding to one liquid crystal panel has the same size. Therefore, one pattern region 50 has a size of 205.2 mm in width×153.9 mm in length. The masks Ma to Me have a plurality of pattern areas 50 of these sizes arranged in the scanning direction. The sizes of the masks Ma to Me are, for example, 160 mm in width×700 mm in length×10 mm in thickness. Further, the masks Ma to Me of the present embodiment have the same pattern formed in the pattern region. Thereby, the mask unit M can transfer a plurality of the same patterns onto the plate P.

As shown in FIGS. 1 and 2, the mask stage 1T includes a support base 40 and a plurality of mask spacing adjustment mechanisms 41. The support base 40 is fixed to the side portion 1W. The support base 40 of this embodiment is one member that is connected to the side portion 1W. The mask interval adjustment mechanism 41 is installed on the support base 40. The mask interval adjusting mechanism 41 is installed for each of the masks Ma to Me included in the mask unit M. Further, the mask gap adjusting mechanism 41 is installed at both ends of each of the masks Ma to Me. That is, the mask stage 1T is provided with two mask interval adjusting mechanisms 41 for each of the masks Ma to Me. Therefore, the mask stage 1T of the present embodiment is provided with ten mask interval adjusting mechanisms 41.

The mask interval adjustment mechanism 41 includes a support portion 42 that supports the corresponding mask among the masks Ma to Me, and a base 44 that supports the support portion 42 in a movable state. The base 44 is fixed to the support base 40. The mask interval adjusting mechanism 41 can move the mask with respect to the frame 1F by moving the support portion 42 that supports the mask with respect to the base 44. The mask interval adjusting mechanism 41 can move the mask in the Y direction, that is, the direction of the arrow 45. Here, the Y direction is a direction that is orthogonal to the X direction, which is the scanning direction, on a plane parallel to the surfaces of the mask unit M and the plate P, and can also be called a non-scanning direction. Various linear motion actuators can be used for the mask interval adjustment mechanism 41. That is, various mechanisms can be used as a mechanism for moving the support portion 42 with respect to the base 44. In the present embodiment, the mask Mc becomes the center of the mask unit M in the Y direction. Therefore, the mask gap adjusting mechanism 41 arranged corresponding to the mask Mc does not move the mask Mc in the Y direction. The exposure apparatus 1 may move the mask at the center of the mask unit M in the Y direction.

The mask stage 1T can independently adjust the positions of the masks Ma to Me in the Y direction by providing the mask interval adjusting mechanism 41 corresponding to the masks Ma to Me. As a result, the mask stage 1T can change the positions of the masks Ma to Me in the Y direction, and can change the distance between the masks Ma to Me and the adjacent masks.

The exposure apparatus 1 supports the mask unit M using the mask stage 1T and supports the plate P using the plate stage 1S, so that the plate P faces the mask unit M supported by the mask stage 1T. Support. While the mask pattern is projected and exposed on the plate P, the mask unit M is air-adsorbed and fixed by the vacuum chuck provided on the mask stage 1T. When the mask unit M is replaced, the air suction is released and the mask unit M can be replaced with a desired one. The mask unit M is arranged above the plate P. When exposing the plate P, the plate P is arranged at the bottom, and the projection optical system 3, the mask unit M, and the illumination optical system 2 are arranged in this order upward. The illumination optical system 2 and the projection optical system 3 project the mask pattern onto the plate P while moving synchronously in the X direction.

The exposure apparatus 1 includes a moving device 21. The moving device 21 has a support portion 22 that supports the illumination optical system 2 and the projection optical system 3, and moves the support portion 22 in the X direction along the illumination system guide 5L and the projection system guide 5P to obtain the illumination optical system. The system 2 and the projection optical system 3 are moved in the X direction along the illumination system guide 5L and the projection system guide 5P. That is, the moving device 21 moves the illumination optical system 2 and the projection optical system 3 in the X direction by moving the support portion 22 in the direction along the surfaces of the mask unit M and the plate P. Further, the moving device 21 supports the light source 6 with the support portion 22, and moves the light source 6 together with the illumination optical system 2 and the projection optical system 3.

In the exposure apparatus 1, the support 40 of the mask stage 1T and the base 34 of the plate stage 1S are attached and fixed to the frame 1F. As a result, the exposure apparatus 1 can set the positions of the mask unit M and the plate P with respect to the frame 1F to predetermined positions. The illumination optical system 2 and the projection optical system 3 project and expose the mask pattern on the plate P while moving in the X direction with respect to the mask stage 1T and the plate stage 1S. When projecting and exposing the mask pattern onto the plate P, the illumination optical system 2 and the projection optical system 3 move in the X direction with respect to the mask stage 1T and the plate stage 1S.

<Illumination optical system>
The illumination optical system 2 guides the light emitted from the light source 6 and makes it incident as light for illuminating the mask unit M. The exposure apparatus 1 includes a plurality of light sources 6. The exposure apparatus 1 may be provided with a plurality of output units that output light, and the plurality of light sources 6 may be realized by one apparatus. In the present embodiment, the light source 6 is a laser light source, but is not limited to this. The illumination optical system 2 has partial illumination optical units 10L and 10R that form the illumination visual fields SR and SL shown in FIG. 4, and a partial illumination optical unit 10C that forms the illumination visual field SC. The light output from the light source 6 enters the partial illumination optical units 10L and 10R, and the relay optical system 12 projects the emission end face of the light source 6 onto the incident face of the fly-eye lens 13. At this time, the relay optical system 12 magnifies the exit end surface of the light source 6 by a predetermined multiple and projects it on the entrance surface of the fly-eye lens 13. The fly-eye lens 13 has a plurality of element lenses arranged and joined. In the present embodiment, eight element lenses are arranged in the column direction and ten element lenses are arranged in the row direction, and a total of 80 elements are joined.

The light emitted from the fly-eye lens 13 passes through the σ stop 14. The σ stop 14 defines the illumination NA by limiting the diameter of light. The light passing through the σ stop 14 is condensed on the surface of the mask unit M (the surface on the side of the illumination optical system 2) via the two condenser lenses 15 and the mirror 16 to form an illumination field. The incident surface of the fly-eye lens 13 and the surface of the mask unit M are in a conjugate relationship, and the illuminance distribution on the incident surface of the fly-eye lens 13 is overlapped and averaged for each element lens of the fly-eye lens 13 to obtain a mask. A uniform illuminance distribution is obtained on the surface of the unit M. By such partial illumination optical units 10L and 10R, the illumination fields SR and SL shown in FIG. 4 are formed on the surface of the mask unit M. The partial illumination optical unit 10C forming the illumination field SC also has the same structure as the partial illumination optical units 10L and 10R, except that the arrangement of the condenser lens 15 and the mirror 16 is different.

<Projection optical system>
Next, the projection optical system 3 will be described in more detail. The projection optical system 3 is an optical system for forming an image of the mask pattern on the surface of the plate P and projecting it. The projection optical system 3 includes a lens array movably provided between the mask unit M supported by the mask stage 1T and the plate P supported by the plate stage 1S, and has a pattern formed on the mask unit M. The image is projected on the plate P. In the present embodiment, the projection optical system 3 forms an image of the mask pattern on the surface of the plate P by using an image forming optical system using a microlens array. The microlens array is an imaging element in which a large number of element lenses are two-dimensionally arranged. The projection optical system has a plurality of micro lens arrays (MLA) 8. As shown in FIGS. 1 and 4, the MLA 8 is mounted on the stage 3S of the projection optical system 3. When the stage 3S moves along the projection system guide 5P, the MLA 8 moves in the X direction. Although the MLA 8 is used as the projection optical system 3 of the present embodiment, a lens array other than the microlens array can be used. The stage 3S that supports the projection optical system 3 becomes a part of the support unit 22.

In the present embodiment, MLA8R, MLA8C and MLA8L are arranged at positions corresponding to the illumination visual fields SR, SC and SL formed by the illumination optical system 2, respectively. In the following, when the MLA8R, MLA8C, and MLA8L are not distinguished, they are simply referred to as MLA8. In the present embodiment, the illumination visual fields SR, SC, SL are arranged in a zigzag pattern with a predetermined gap in the X direction from each other in the Y direction. By doing so, the MLAs 8R, MLA8C, and MLA8L are also arranged in a zigzag pattern in the Y direction, so that these interferences can be avoided. As a result, it becomes possible to expand the illumination visual field in the Y direction. Since the MLA 8 is thin, the projection optical system 3 is also thin.

The exposure apparatus 1 also includes a rangefinder as a detection unit that measures the distance between the mask stage 1T and the plate stage 1S. The exposure apparatus 1 can detect the distance between the mask unit M and the plate P by measuring the distance between the mask stage 1T and the plate stage 1S with a distance meter. When the mask pattern is projected and exposed on the plate P, the exposure apparatus 1 determines the relative position in the optical axis direction between the mask stage 1T and the plate stage 1S based on the distance between the mask unit M and the plate P measured by a distance meter. adjust. Thereby, the exposure apparatus 1 can correctly arrange the mask and the plate at the in-focus position of the projection lens (in this embodiment, the MLA 8 included in the projection optical system 3). The exposure apparatus 1 can correct the focus shift due to the variation in the thickness of the plate P, and can suppress the deterioration of the exposure performance.

The exposure apparatus 1 also includes a measurement system that measures the position information of each stage. As the measuring system, an interferometer system including a laser interferometer may be used to measure position information of each stage, or an encoder system for detecting a scale (diffraction grating) provided in each stage. May be used.

Next, the position detection device 80 will be described with reference to FIGS. 6 to 9. FIG. 6 is a side view showing a state in which a position detection device is installed in the exposure apparatus shown in FIG. FIG. 7 is a top view showing a state in which a position detection device is installed in the exposure apparatus shown in FIG. FIG. 8 is a side view showing a state in which a mask is arranged in the exposure apparatus shown in FIG. FIG. 9 is a top view showing a state in which the mask of the exposure apparatus shown in FIG. 7 is arranged. The exposure apparatus 1 includes the plurality of position detection devices 80 as described above. In the exposure apparatus 1, a position detection device 80 is arranged corresponding to each of the masks Ma to Me. Further, in the exposure apparatus 1, the position detection devices 80 are arranged respectively facing the both ends of the masks Ma to Me in the scanning direction. That is, in the exposure apparatus 1, two position detection devices 80 are arranged for each of the five masks Ma to Me, similarly to the mask interval adjustment mechanism 41, and a total of ten position detection devices 80 are arranged. ..

In the exposure apparatus 1 of the present embodiment, the five position detection devices 80 arranged at one end in the scanning direction of the region where the masks Ma to Me are arranged are position detection devices 80a, and the other end is arranged. The five position detecting devices 80 arranged in the above are referred to as position detecting devices 80b. The position detection devices 80a and 80b are devices that detect the position of the pattern region 50 formed on each of the corresponding masks Ma to Me of the mask unit M and the position of the pattern that has already been exposed and developed on the plate P. .. In the position detecting device 80a, a portion of the masks Ma to Me or the detection region 89a of the plate P is a detection target region. In the position detection device 80b, a portion of the masks Ma to Me or the detection region 89b of the plate P is a detection target region.

The five position detection devices 80a are supported by the support portion 86a. The support portion 86a is movable in the scanning direction along the rail 87a. By moving along the rail 87a, the supporting portion 86a can move from a position facing the masks Ma to Me on the XY plane to a position not facing the masks Ma to Me. The five position detection devices 80b are supported by the support portion 86b. The support portion 86b is movable in the scanning direction along the rail 87b. By moving along the rail 87b, the supporting portion 86b can move from a position facing the masks Ma to Me on the XY plane to a position not facing. The exposure apparatus 1 can attach/detach the masks Ma to Me to/from the mask stage by moving the position detectors 80a and 80b to positions that do not face the masks Ma to Me. As a result, in the exposure apparatus 1, as shown in FIGS. 8 and 9, the masks Ma to Me are not arranged on the mask stage, and as shown in FIGS. 6 and 7, the masks Ma to Me are arranged on the mask stage. It is possible to switch between the existing state.

The position detection devices 80a and 80b detect the marks formed on the masks Ma to Me and the plate P, so-called alignment marks, and detect the positions of the respective patterns. The position detection device 80 is a so-called alignment microscope, and has a light source 81, an image detection unit 82, an index 83, a beam splitter 84, and an optical system 85. The light source 81 is a light emitting source that outputs light, and outputs light having a wavelength that the plate P does not sensitize. The image detection unit 82 is a device such as a CCD that reads an image. The index 83 is arranged on the optical path of the light output from the light source 81. Specifically, it is arranged between the light source 81 and the beam splitter 84. The index 83 is a plate-shaped member in which the light-transmitting portion has a predetermined shape and the other portions shield light, and the light output from the light source 81 is made into light of a predetermined shape. The predetermined shape is a reference shape for comparison, and includes a line segment, a curve, a circle, a cross, and the like. The beam splitter 84 reflects a part of the light and transmits a part of the light. The beam splitter 84 reflects a part of the light passing through the index 83, and transmits a part of the light reflected by the masks Ma to Me or the plate P in the detection areas 89a and 89b. The optical system 85 is arranged between the beam splitter 84 and the detection areas 89a and 89b. The optical system 85 guides the light reflected by the beam splitter 84 to predetermined positions of the detection regions 89a and 89b, and guides the light reflected by the detection regions 89a and 89b to predetermined positions of the beam splitter 84. The optical system 85 includes an objective lens and the like. The light reflected by the masks Ma to Me or the plate P in the detection areas 89a and 89b and passing through the optical system 85 and the beam splitter 84 enters the image detection unit 82.

The light output from the light source 81 passes through the index 83 to be formed into a predetermined shape, is then reflected by the beam splitter 84, passes through the optical system 85, and reaches the detection regions 89a and 89b. The light that reaches the detection areas 89a and 89b is reflected by the detection areas 89a and 89b, passes through the optical system 85 and the beam splitter 84, and reaches the image detection unit 82. As a result, the position detecting devices 80a and 80b are configured such that the shape of the light processed into the predetermined shape by the index 83 and the specific pattern formed on the masks Ma to Me or the plate P in the detection areas 89a and 89b, that is, the alignment. The position of the alignment mark formed on the masks Ma to Me or the plate P is specified by comparing the mark shape with the mark shape. The position detecting devices 80a and 80b only need to be able to specify the position of the pattern formed on the masks Ma to Me or the plate P, and various mechanisms can be used as the detecting mechanism.

Here, the position detection devices 80a and 80b move the position of the optical system 85 in the optical axis direction to adjust the focus to the position of the mask or the position of the plate. The position detection devices 80a and 80b project the index 83 on the detection areas 89a and 89b, and detect the position of the alignment mark in the detection areas 89a and 89b with the position of the index 83 as a reference. As a result, the influence of the drive error of the optical system 85 can be avoided. It is preferable that the moving stroke of the optical system 85 in the optical axis direction is equal to or more than the distance between the surface of the mask (pattern surface) and the surface of the plate. Thereby, the focus can be adjusted to an appropriate position.

<Exposure method>
Next, the exposure method will be described with reference to FIGS. The exposure method according to this embodiment can be realized by the exposure apparatus 1. FIG. 10 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. Prior to the start of the process of FIG. 10, neither the mask unit M nor the plate P is installed in the exposure apparatus 1. The exposure apparatus 1 can realize the process shown in FIG. 10 by controlling the operation of each unit by the control device 9.

The exposure apparatus 1 installs a plate in step S110. That is, the exposure apparatus 1 installs the plate P to be processed on the plate stage 1S. The exposure apparatus 1 installs the plate P on the plate stage 1S by a plate supply device or the like. As a result, in the exposure apparatus 1, the plate P is set on the plate stage 1S as shown in FIGS. 8 and 9 described above. When the plate is set on the plate stage 1S, the exposure apparatus 1 detects the position of the plate P in step S112. The exposure apparatus 1 acquires images of portions of the plate P included in the detection regions 89a and 89b by the position detection devices 80a and 80b, and acquires the position and shape of the alignment mark formed on the plate P. The exposure apparatus 1 detects the position of the pattern formed on the plate P from the acquired position and shape of the alignment mark. The exposure apparatus 1 can detect the position of the alignment mark by comparing the alignment mark with the image of the index projected on the plate P.

When the position of the plate is detected in step S112, the exposure apparatus 1 sets a mask in step S114. Specifically, the exposure apparatus 1 retracts the position detection devices 80a and 80b from the area where the mask unit M is arranged. After that, the exposure apparatus 1 sets the masks Ma to Me to be used on the corresponding supporting portions 42 of the mask stage 1T by using a mask supply device or the like. When the masks Ma to Me are installed, the exposure apparatus 1 sucks air by a vacuum chuck. The exposure apparatus 1 may install the masks Ma to Me one by one, or may move the masks Ma to Me included in the mask unit M integrally and install them simultaneously. As a result, the exposure apparatus 1 is in a state in which the plate P is installed on the plate stage 1S and the mask unit M is installed on the mask stage 1T, as shown in FIGS. 6 and 7.

After setting the mask on the mask stage in step S114, the exposure apparatus 1 detects the position of the mask in step S116. The exposure apparatus 1 moves the support portions 86a and 68b to move the position detection devices 80a and 80b to positions facing the masks Ma to Me. The exposure apparatus 1 acquires images of portions of the masks Ma to Me included in the detection areas 89a and 89b by the position detection devices 80a and 80b, and acquires positions and shapes of alignment marks formed on the masks Ma to Me. .. The exposure apparatus 1 detects the position of the pattern area 50 formed on the masks Ma to Me from the acquired position and shape of the alignment mark. The exposure apparatus 1 can detect the position of the alignment mark by comparing the alignment mark with the image of the index projected on the masks Ma to Me.

After detecting the position of the mask in step S116, the exposure apparatus 1 detects the relative positional relationship between the mask and the plate in step S118. Specifically, the exposure apparatus 1 detects the relative position between the position of the plate pattern detected by the position detection devices 80a and 80b and the position of the pattern area 50 of the mask. When the exposure apparatus 1 detects the relative positional relationship in step S118, the exposure apparatus 1 determines the position correction amount at the time of exposure based on the relative positional relationship in step S120. Specifically, when exposing the plate P for the second and subsequent patterns, the exposure apparatus 1 detects the relative position between the mask and the plate, which is the position where the mask pattern overlaps the exposed pattern, and detects the detected relative position. The amount of movement to move to the position is the position correction amount. The position correction amount includes at least the mask interval in the non-scanning direction that can be adjusted by the mask interval adjustment mechanism 41. The position correction amount also includes the position in the scanning direction of the plate P that can be moved by the plate stage 1S. The exposure apparatus 1 can adjust the relative position between the mask and the plate in the scanning direction by moving the plate P in the scanning direction on the plate stage 1S. At the time of exposure, it is preferable to calculate for each relative position between the illumination optical system 2 and the projection optical system 3 and the mask or plate, that is, for each position of the support portion 22 in the present embodiment. Thereby, the relative position of the mask and the plate can be corrected for each position of the plate P, and the pattern of the mask can be projected on a more appropriate position on the plate.

After determining the position correction amount in step S120, the exposure apparatus 1 adjusts the mask interval in step S122. In the exposure apparatus 1, the mask interval adjusting mechanism 41 moves the masks Ma to Me by the calculated position correction amount. In this way, the exposure apparatus 1 changes the mask interval by moving the mask to the position corresponding to the position where the plate P is initially exposed.

The exposure apparatus 1, after adjusting the mask interval in step S122, performs exposure in step S124. The exposure apparatus 1 moves the position detection devices 80a and 80b to a position that does not interfere with the exposure process. When the projection exposure is started, the exposure apparatus 1 moves (scans) the illumination optical system 2 and the projection optical system 3 in the X direction with respect to the mask and the plate. For example, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 by the moving device 21 to scan the illumination optical system 2 and the projection optical system 3 with respect to the mask unit M and the plate P. As a result, the exposure apparatus 1 transfers the pattern formed on the mask unit M onto the plate P. The exposure apparatus 1 does not have to move the illumination optical system 2 and the projection optical system 3 to the entire area in the X direction.

Next, with reference to FIGS. 11 and 12, an example of an operation performed by the exposure apparatus 1 to adjust a mask interval during exposure will be described. FIG. 11 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 12 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment.

The exposure apparatus 1 starts relative movement of the mask and the plate with the illumination optical system and the projection optical system in step S130. The exposure apparatus 1 of this embodiment starts moving the illumination optical system 2 and the projection optical system 3 in the scanning direction by the moving device 21. After starting the relative movement in step S130, the exposure apparatus 1 determines in step S132 whether or not the illumination position is in the shielding area. Here, the illumination position is a position that serves as an illumination field. That is, the exposure apparatus 1 determines whether the area of the mask illuminated by the illumination light is the masking area 52 of the mask, that is, whether or not the illumination visual field does not include the pattern area 50.

If the exposure apparatus 1 determines in step S132 that the illumination position is the shielded area (Yes in step S132), the exposure apparatus 1 proceeds to step S134 and determines in step S132 that the illumination position is not the shielded area (No in step S132). In this case, the process proceeds to step S136.

If the exposure apparatus 1 determines Yes in step S132, it adjusts the mask interval in step S134. In the exposure apparatus 1, the mask interval adjusting mechanism 41 moves the masks Ma to Me by the calculated position correction amount. Here, the exposure apparatus 1 moves the masks Ma to Me based on the position correction amount calculated for the pattern region 50 that passes next to the shielded region 52 where the illumination field (illumination position) is currently passing. Let The exposure apparatus 1 changes the mask interval by moving the masks Ma to Me. When the position correction amount is 0, the exposure apparatus 1 does not move the mask, that is, does not change the mask interval. The exposure apparatus 1 may not change the mask interval depending on the shielding area. It should be noted that when the intervals of the patterns formed on the plate corresponding to the pattern regions sandwiching the shielding region are the same, the position correction amount is 0. As described above, when transferring the pattern formed on the mask of the mask unit M, the exposure apparatus 1 may perform adjustment without changing the mask interval depending on the pattern area of the mask. After adjusting the mask interval in step S134, the exposure apparatus 1 proceeds to step S136.

If the exposure apparatus 1 determines No in step S132 or executes the process of step S134, the exposure apparatus 1 determines in step S136 whether the exposure has ended. That is, the exposure apparatus 1 determines whether the transfer of the patterns of the masks Ma to Me onto the plate P has been completed. The exposure apparatus 1 determines that the exposure is completed, for example, when the support unit 22 is moved to the end of the movement range by the moving device 21 or when the illumination field is moved to the end of the mask in the scanning direction. If the exposure apparatus 1 determines in step S136 that the exposure has not ended (No in S136), the exposure apparatus 1 returns to step S132 and again executes the processing of step S132 and subsequent steps. If the exposure apparatus 1 determines in step S136 that the exposure has ended (Yes in S136), it ends this processing.

The plate P1 shown in FIG. 12 shows an example of a state in which the pattern of the mask unit M is transferred. In the plate P1, the pattern 60 corresponding to one pattern area 50 is indicated by “F”. The exposure apparatus 1 can form the pattern 60 of the arrangement of the plate P1 by transferring the pattern by widening the interval between the masks each time when passing through the shield region 52 of the mask unit M. Further, the plurality of patterns 60 formed on the plate P1 have a larger interval between the patterns 60 adjacent to each other in the non-scanning direction, as the distance from one end in the scanning direction to the other end in the scanning direction increases. In the plate P1, the space 62 between the patterns 60a formed at one end of the pattern 60 is the smallest, and the space 64 between the patterns 60b formed at the other end of the pattern 60 is the widest. The mask interval at the time of exposure is not limited to simple increase. The exposure apparatus 1 may be adjusted based on the detected position of the plate pattern so that the mask pattern overlaps the plate pattern.

As described above, the exposure apparatus 1 can adjust the mask interval with the mask interval adjusting mechanism 41. Thereby, in the non-scanning direction, the position on the plate P where the pattern of the pattern region 50 is formed can be changed depending on the position of the plate in the scanning direction. The exposure apparatus 1 can change the distribution of the regions to which the pattern regions are transferred with respect to the entire plate P by adjusting the distance between the masks. As a result, it is possible to reduce the influence of the size difference between the pattern formed on the plate and the pattern formed on the mask, which occurs in the exposure apparatus 1, and the pattern of the pattern region 50 is set at an appropriate position on the plate P. Can be transcribed. The position of the pattern formed on the mask is also the position of the image formed on the plate by the pattern formed on the mask.

The exposure apparatus 1 uses the mask even when the plate expands and contracts with respect to the reference size and the size of the pattern formed on the plate and the size of the pattern of the mask projected on the plate are deviated. By adjusting the interval of, it is possible to suppress the deviation of the pattern. More specifically, when the mask unit is a single mask, when the plate expands and contracts, the amount of deviation between the pattern of the plate and the pattern projected from the mask increases as the plate moves toward the end in the non-scanning direction. Become. On the other hand, the exposure apparatus 1 can individually adjust the position of the mask of the mask unit. As a result, the amount of deviation between the mask and the plate can be adjusted individually, and the pattern area in the non-scanning direction can be projected with a small deviation from the corresponding plate pattern.

The exposure apparatus 1 is not limited to the process shown in FIG. 11, and the mask interval adjusting mechanism 41 may move the masks Ma to Me in the Y direction while the pattern region 50 is being irradiated with the illumination light. In this case, the exposure apparatus 1 may move the masks Ma to Me in the Y direction at the set constant speed, or may change the moving speed of the masks Ma to Me. The amount of movement of the masks Ma to Me in the Y direction (the amount of adjustment of the mask interval) by the mask interval adjusting mechanism 41 is preferably about 30 μm.

In the exposure apparatus 1, the position detection devices 80a and 80b can be moved on the XY plane and can be retracted from the arrangement area of the mask M, so that the mask can be easily installed.

Next, with reference to FIGS. 13 to 17, an example of an operation performed by the exposure apparatus 1 to adjust the mask interval will be described. FIG. 13 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment.

The exposure apparatus 1 determines the relative moving speed of the mask and the plate in the scanning direction based on the position correction amount in step S140. After determining the relative movement speed in step S140, the exposure apparatus 1 starts relative movement between the mask and plate and the illumination optical system and projection optical system in step S142. The exposure apparatus 1 of this embodiment starts moving the illumination optical system 2 and the projection optical system 3 in the scanning direction by the moving device 21. After starting the relative movement in step S142, the exposure apparatus 1 starts the relative movement between the mask and the plate in step S144. Specifically, the exposure apparatus 1 moves the plate P in the scanning direction by moving the support portion 32 of the plate stage 1S with respect to the base 34 in the scanning direction. The mask does not move in the scanning direction. Thereby, the exposure apparatus 1 can relatively move the plate P and the mask in the scanning direction. Further, by setting the moving speed of the plate P to the relative moving speed described above, the plate P and the mask can be moved at the relative moving speed in the scanning direction.

When the relative movement of the mask and the plate is started in step S144, the exposure apparatus 1 determines in step S146 whether the exposure is completed. That is, the exposure apparatus 1 determines whether the transfer of the patterns of the masks Ma to Me onto the plate P has been completed. If the exposure apparatus 1 determines in step S146 that the exposure has not ended (No in S146), the process returns to step S146 and the process of step S146 is executed again. When the exposure apparatus 1 determines in step S136 that the exposure has ended (Yes in S146), this processing ends.

An example of a pattern transferred to the plate when the mask and the plate are moved relative to each other will be described below with reference to FIGS. 14 to 17. FIG. 14 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 15 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 16 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 17 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 14 shows a case where the mask and the pattern are not moved relative to each other. An arrow 79 shown in FIG. 14 indicates an arrangement region when the plate P is arranged at the reference position in this embodiment. Further, in the exposure apparatus shown in FIG. 14, the moving device 21 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction, from left to right in the figure. This point is the same in FIGS. 15 and 16.

In this case, when the exposure apparatus 1 starts the exposure, the moving apparatus 21 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction, and passes the position of step S1. The exposure apparatus 1 projects the mask pattern on a part of the left side of the plate P in the scanning direction when passing through the position of step S1. On the plate P, the pattern is transferred to the area 70 where the light passing through the mask reaches.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S1 to the position of step S2. The exposure apparatus 1 projects the mask pattern on a part of the center of the plate P in the scanning direction when passing through the position of step S2. On the plate P, the pattern is transferred to the area 72 where the light passing through the mask reaches.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S2 to the position of step S3. The exposure apparatus 1 projects the mask pattern onto a part of the right side of the plate P in the scanning direction when passing through the position of step S3. On the plate P, the pattern is transferred to the area 74 where the light passing through the mask reaches.

The exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction as in steps S1 to S3, and transfers the pattern of the mask unit M onto the plate P. The plate P2 shown in FIG. 14 shows an example of a state in which the pattern of the mask unit M has been transferred. Here, in FIG. 14, the mask and the plate P are not moved relative to each other. Therefore, in the plate P2, the interval 76 between the region 70 and the region 72 and the interval 78 between the region 72 and the region 74 are the illumination optical system 2 and the projection optical system 3 when the region is exposed from the corresponding region. It will be the same distance as the movement distance of. In FIG. 14, only the areas 70, 72, 74 are shown to show the relationship between the areas 70, 72, 74 to which the patterns are transferred in steps S1, S2, S3, but the areas to which the patterns are transferred are not shown. , The illumination optical system 2 and the projection optical system 3 move in the scanning direction, and a pattern is formed over the entire scanned area.

FIG. 15 shows a case where the pattern moves in the scanning direction with respect to the mask. In this case, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21 when the exposure is started, and passes the position of step S11. The exposure apparatus 1 projects the mask pattern on a part of the left side of the plate P in the scanning direction when passing the position of step S11. Therefore, on the plate P, the pattern is transferred to the region 70a where the light passing through the mask reaches. The plate P in step S11 has a part on the left side in the drawing outside the range indicated by the arrow 79.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S11 to the position of step S12. Further, the exposure apparatus 1 moves the plate P in the positive X direction by the plate stage 1S, and moves it from the position of step S11 to the position of step S12. As a result, the plate P in step S12 is arranged within the range indicated by the arrow 79. The exposure apparatus 1 projects the mask pattern on a part of the center of the plate P in the scanning direction when passing through the position of step S12. On the plate P, the pattern is transferred to the area 72a where the light passing through the mask reaches.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S12 to the position of step S13. Further, the exposure apparatus 1 moves the plate P in the positive X direction by the plate stage 1S, and moves it from the position of step S12 to the position of step S13. As a result, the plate P in step S13 has a part on the right side in the drawing outside the range indicated by the arrow 79. The exposure apparatus 1 projects the mask pattern on a part of the right side of the plate P in the scanning direction when passing through the position of step S13. On the plate P, the pattern is transferred to the area 74a where the light passing through the mask has reached.

The exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction while moving the plate P in the positive direction of the X direction as in steps S11 to S13. Then, the pattern of the mask unit M is transferred. The plate P3 shown in FIG. 15 shows an example of a state in which the pattern of the mask unit M has been transferred. Here, in FIG. 15, the pattern is moved in the scanning direction with respect to the mask. Accordingly, in the plate P3, the interval 76a between the area 70a and the area 72a and the interval 78a between the area 72a and the area 74a are the illumination optical system 2 and the projection optical system 3 when the area is exposed from the corresponding area. The distance is shorter than the moving distance of. That is, in the plate P3, the area where the mask pattern is projected becomes short.

FIG. 16 shows a case where the pattern moves in the direction opposite to the scanning direction with respect to the mask. In this case, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21 when the exposure is started, and passes the position of step S21. The exposure apparatus 1 projects the mask pattern on a part of the left side of the plate P in the scanning direction when passing through the position of step S21. Therefore, on the plate P, the pattern is transferred to the region 70b where the light passing through the mask reaches. The plate P in step S21 has a part on the right side in the drawing outside the range indicated by the arrow 79.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S21 to the position of step S22. Further, the exposure apparatus 1 moves the plate P in the negative X direction by the plate stage 1S and moves it from the position of step S21 to the position of step S22. As a result, the plate P in step S22 is arranged within the range indicated by the arrow 79. The exposure apparatus 1 projects the mask pattern on a part of the center of the plate P in the scanning direction when passing through the position of step S22. On the plate P, the pattern is transferred to the region 72b where the light passing through the mask has reached.

After that, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive X direction by the moving device 21, and moves them from the position of step S22 to the position of step S23. Further, the exposure apparatus 1 moves the plate P in the negative direction of the X direction by the plate stage 1S and moves it from the position of step S22 to the position of step S23. As a result, the plate P in step S23 has a part on the left side in the drawing outside the range indicated by the arrow 79. The exposure apparatus 1 projects the mask pattern onto a part of the right side of the plate P in the scanning direction when passing through the position of step S23. On the plate P, the pattern is transferred to the region 74b where the light passing through the mask has reached.

The exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction while moving the plate P in the negative direction of the X direction as in steps S21 to S23. Then, the pattern of the mask unit M is transferred. The plate P4 shown in FIG. 16 shows an example of a state in which the pattern of the mask unit M has been transferred. Here, in FIG. 16, the pattern is moved in the direction opposite to the scanning direction with respect to the mask. Accordingly, in the plate P4, the interval 76b between the area 70b and the area 72b and the interval 78b between the area 72b and the area 74b are the illumination optical system 2 and the projection optical system 3 when the area is exposed from the corresponding area. Is longer than the travel distance of. That is, the plate P4 has a long area on which the mask pattern is projected.

FIG. 17 shows plates P2, P3, P4 on which patterns are transferred by the exposure methods of FIGS. 14 to 16. As shown in FIG. 17, the plate P3 in which the pattern is formed by moving the plate P in the positive X direction has a shorter length of the pattern 60 in the X direction than the plate P2. In other words, the exposure apparatus 1 can transfer the pattern reduced in the X direction by the reduction ratio to the plate P by moving the plate P in the positive direction of the X direction. Further, the plate P4 in which the pattern is formed by moving the plate P in the negative direction of the X direction has the length of the pattern 60 in the X direction longer than that of the plate P2. In other words, the exposure apparatus 1 can transfer the pattern enlarged in the X direction by the magnification increased by moving the plate P in the negative direction of the X direction to the plate P.

As described above, the exposure apparatus 1 performs the exposure while relatively moving the plate and the mask in the scanning direction, so that the pattern formed on the plate and the pattern formed on the mask in the X direction are formed. The relative position of can be adjusted. The position of the pattern formed on the mask is also the position of the image formed on the plate by the pattern formed on the mask. As a result, it is possible to reduce the influence of the size deviation between the pattern of the plate and the pattern of the mask in the exposure apparatus 1 in the scanning direction, and it is possible to transfer the pattern of the pattern region 50 to an appropriate position on the plate P. it can. The exposure apparatus 1 uses the mask even when the plate expands and contracts with respect to the reference size and the size of the pattern formed on the plate and the size of the pattern of the mask projected on the plate are deviated. By relatively moving the plate and the plate during the exposure, specifically, moving the plate in the scanning direction with respect to the mask, it is possible to suppress the deviation of the pattern. This makes it possible to adjust the amount of misalignment between the mask and the plate individually, and to project the pattern area in the scanning direction with a small deviation from the pattern of the corresponding plate.

Here, it is preferable that the exposure apparatus 1 set the moving distance for the plate and the mask to move relatively in the scanning direction to 1 mm or less with respect to the moving amount of the scanning optical exposure of the projection optical system 3 once. As a result, it is possible to properly suppress the positional deviation in the scanning direction. Further, it is possible to maintain the exposure quality while simplifying the apparatus configuration.

The exposure apparatus 1 is not limited to the processing of FIG. 13, and may change the relative position of the mask and the plate in the scanning direction while the illumination position is the masking region 52, as in FIG. 11. .. With this, it is possible to adjust the position of the pattern in which each pattern region is projected with respect to the entire plate while maintaining the pattern projected on the mask as it is. Specifically, the distance between the pattern areas can be changed, and the deviation between the position of the pattern area projected from the mask and the position of the pattern corresponding to the pattern area of the substrate can be further reduced. be able to.

The exposure apparatus 1 includes a Y-direction gap between the mask and a relative position between the mask and the plate in the X-direction.
Both may be adjusted. That is, the process of FIG. 11 and the process of FIG. 13 may be executed in parallel.

In the exposure apparatus 1 according to the first embodiment, the movement amount of the mask interval adjusting mechanism 41 arranged at each end of one mask is the same, and the longitudinal direction of the mask is parallel to the X axis in the Y direction. It was moved, but is not limited to this. The length of the mask may be tilted with respect to the X-axis by changing the amount of movement of the mask interval adjusting mechanism 41 arranged at each end of the mask.

<Embodiment 2>
The exposure apparatus according to the second embodiment will be described below with reference to FIG. FIG. 18 is a side view of the exposure apparatus according to the second embodiment. The exposure apparatus 201 of the second embodiment shown in FIG. 18 has the same configuration as the exposure apparatus 1 except for the configuration of the illumination optical system 202. A description of the same configuration as the exposure apparatus 1 will be omitted, and a configuration unique to the exposure apparatus 201 will be described. In the exposure apparatus 201, a part of the illumination optical system 202 is supported by the support portion 22 and the other part is supported by the support base 220. The illumination optical system 202 of the present embodiment includes a guide optical unit 230 having a portion not supported by the support portion 22, and an illumination optical unit 231 supported by the support portion 22. The exposure apparatus 201 also has a moving mechanism 240 that moves a part of the guide optical unit 230.

The exposure apparatus 201 is provided with a light source 206 that outputs light toward the illumination optical unit 231 of the illumination optical system 202. The light source 206 is fixed to the support base 220 that does not move during exposure, and its relative position does not change with respect to the stator side of the moving mechanism 240 during exposure. The support base 220 is connected to the frame 1F or the like. The support base 220 is a member separate from the support portion 22 of the moving device 21 that supports a part of the illumination optical system 2 and the projection optical system 3, and is independent of the moving portion. That is, the moving device 21 can move the support portion 22 relative to the support base 220.

<Illumination optical system>
The illumination optical system 202 guides the light emitted from the light source 206 and makes it incident as light for illuminating the mask unit M. The illumination optical system 202 has a guide optical unit 230 and an illumination optical unit 231. The guide optical unit 230 is an optical system that guides the light output from the light source 206 to the illumination optical unit 231. A part of the guide optical unit 230 on the light source 206 side is supported by the support base 220. Further, the guide optical unit 230 is partially supported by the moving mechanism 240 on the side of the illumination optical unit 228. The moving mechanism 240 is a mechanism that moves the guide optical unit 230, and is fixed to a member such as the frame 1F that does not move during exposure. The illumination optical unit 231 causes the light guided by the guide optical unit 230 to enter as light for illuminating the mask unit M. The illumination optical unit 231 is supported by the support portion and moved by the moving device. In the exposure apparatus 201, the mechanism for moving the illumination optical unit 231, that is, the moving device 21 is also included as a part of the moving mechanism 240.

<Guide optical unit>
The guide optical unit 230 is an optical system that guides the laser light (light) output from the light source 206 to the illumination optical unit 231. The guide optical unit 230 has a plurality of condenser lenses 206L, a plurality of optical fibers (light guide fibers) 207, and a bundle 232. In the guide optical unit 230, the condenser lens 206L and a part of the optical fiber 207 on the light source 206 side (first end portion) are supported by the support base 220. Further, in the guide optical unit 230, a part (second end portion) of the optical fiber 207 on the illumination optical unit 231 side is supported by the moving mechanism 240. The exposure apparatus 201 includes a plurality of light sources 206, like the light source 6. The configuration of the light source 206 is not particularly limited. In the guide optical unit 230, a condenser lens 206L and an optical fiber 207 are arranged corresponding to the light source 206. The guide optical unit 230 condenses the light output from the light source 206 with the condensing lens 206L and makes it enter the optical fiber 207. In this embodiment, the optical fiber 207 is a single quartz fiber. One end (first end) of the optical fiber 207 is arranged in the vicinity of the focal point of the condenser lens 206L, and the other end (second end) thereof is arranged to face the illumination optical unit 231. .. The other end of the optical fiber 207 is fixed to the mover of the moving mechanism of the illumination optical unit 231, and moves together with the illumination optical unit 231. The optical fiber 207 is condensed by the condenser lens 206L but is incident from one end. The optical fiber 207 causes the light input from one end to be output from the other end. The bundle 232 collects the parts other than the vicinity of the ends of the plurality of optical fibers 207 into one. In the optical fiber 207 of the present embodiment, one end (the end on the first end side) is fixed to the light source 206, and the other end (the end on the second end side) is illuminated. It is fixed to the optical unit 231. As a result, the guide optical unit 230 can prevent the relative displacement between the light source 206 and the illumination optical unit 231 from being shifted.

<Movement mechanism>
The moving mechanism 240 moves the position of the guide optical unit 230 while maintaining the optical path length from the light source 206 side end (first end) of the guide optical unit 230 to the illumination optical unit 231 within a predetermined range. Is. Here, maintaining the optical path length within a predetermined range means maintaining the optical path length from the end portion (first end portion) of the guide optical unit 230 on the light source 206 side to the illumination optical unit 231 to a substantially constant optical path length. Is. In other words, the moving mechanism 240 moves the guide optical unit 230 in accordance with the movement of the illumination optical unit 231 by the moving device 21, and changes the optical path length from the end of the guide optical unit 230 on the light source 206 side to the illumination optical unit 231. It is a mechanism that keeps the change below a predetermined threshold. When the first end of the guide optical unit 230 is supported at a predetermined position with respect to the light source 206 and the second end of the guide optical unit 230 is supported at a predetermined position with respect to the illumination optical unit 231, the guide is provided. It can be said that the end portion of the optical unit 230 on the light source 206 side to the illumination optical unit 231 is the portion supported by the support portion 22 of the illumination optical system 202 from the light source 206.

The moving mechanism 240 has a constant pulley 244 and a linear actuator 246. The constant pulley 244 is held by the frame 1F by a holding mechanism (not shown), and supports the bundle 232 in a freely movable state. The linear actuator 246 has a mover 248 and a stator 250. The linear actuator 246 is arranged such that the mover 248 is movable in the X direction with respect to the stator 250. The stator 250 is held by the frame 1F by a holding mechanism (not shown). The mover 248 is, for example, a pulley, and is connected to the stator 250 in a rotatable state and a fulcrum in the X direction. The mover 248 rotates as the bundle 232 moves. In the linear actuator 246, the pulley of the mover 248 supports the bundle 232.

The moving mechanism 240 moves the mover 248 of the linear actuator 246 in the X direction to move the position of the bundle 232. In the moving mechanism 240 of this embodiment, the constant pulley 244 and the stator 250 are fixed to, for example, the frame 1F, but may be fixed to a portion that does not move during exposure of the exposure apparatus 201, that is, a portion that does not scan. ..

<Illumination optical unit>
The illumination optical unit 231 guides the light emitted from the light source 206 and guided and output by the guide optical unit 230, and is incident as light for illuminating the mask unit M. The illumination optical unit 231 has partial illumination optical units 10L and 10R that form the illumination visual fields SR and SL, and a partial illumination optical unit 10C that forms the illumination visual field SC. The light output from the optical fiber 207 of the guide optical unit 230 enters the partial illumination optical units 10L and 10R, and the relay optical systems 11 and 12 cause the exit end surface of the optical fiber 207 of the guide optical unit 230 to move to the fly-eye lens 13. Project on the incident surface. The illumination optical unit 231 has the same configuration as the illumination optical system 2 except that the relay optical system 11 is provided as an optical system. At this time, the relay optical systems 11 and 12 enlarge the emission end surface of the optical fiber 207 of the guide optical unit 230 to a predetermined multiple and project it on the incident surface of the fly-eye lens 13. The fly-eye lens 13 has a plurality of element lenses arranged and joined. In the present embodiment, eight element lenses are arranged in the column direction and ten element lenses are arranged in the row direction, and a total of 80 elements are joined.

The light emitted from the fly-eye lens 13 passes through the σ stop 14. The σ stop 14 defines the illumination NA by limiting the diameter of light. The light passing through the σ stop 14 is condensed on the surface of the mask unit M (the surface on the side of the illumination optical system 2) via the two condenser lenses 15 and the mirror 16 to form an illumination field. The incident surface of the fly-eye lens 13 and the surface of the mask unit M are in a conjugate relationship, and the illuminance distribution on the incident surface of the fly-eye lens 13 is overlapped and averaged for each element lens of the fly-eye lens 13 to obtain a mask. A uniform illuminance distribution is obtained on the surface of the unit M. Illumination fields SR and SL are formed on the surface of the mask unit M by the partial illumination optical units 10L and 10R. The partial illumination optical unit 10C forming the illumination field SC also has the same structure as the partial illumination optical units 10L and 10R, except that the arrangement of the condenser lens 15 and the mirror 16 is different.

In the exposure apparatus 201 configured as described above, the guide optical unit 230 is moved by the moving mechanism 240 in accordance with the movement of the support portion 22 during exposure. When the projection exposure is started, the control device 9 moves (scans) the illumination optical unit 231 and the projection optical system 3 in the X direction on the moving direction side of the MLA 8, that is, the moving direction side of the projection optical system 3. The exposure apparatus 201 moves the illumination optical unit 231 and the projection optical system 3 by the movement device 21, thereby causing the mask optical unit 231 and the plate P to scan the illumination optical unit 231 and the projection optical system 3. As a result, the exposure apparatus 201 transfers the pattern formed on the mask unit M onto the plate P.

In the exposure apparatus 201, the moving device 21 moves the illumination optical unit 231 and the projection optical system 3, and the moving mechanism 240 illuminates from the optical path length of the guide optical unit 230, that is, the end portion (first end portion) on the light source 206 side. The position of the optical path is moved while maintaining the optical path length up to the optical unit 231 within a predetermined range, that is, keeping the optical path length substantially the same. The moving mechanism 240 of the present embodiment moves the mover 248 of the linear actuator 246 in the same direction as the movement of the illumination optical unit 231 and the projection optical system 3 in the X direction, at the same distance as the illumination optical unit 231 and the projection optical system 3, To move. When the mover 248 of the moving mechanism 240 moves, the bundle 232 supported by the mover 248 also moves. When the mover 248 moves, the relative position between the mover 248 and the constant pulley 244 changes. The bundle 232 moves in a position in contact with the constant pulley 244 in response to a change in relative position between the mover 248 and the constant pulley 244. The constant pulley 244 can be rotated to change the position in contact with the bundle 232 and smoothly change the contact position.

As described above, also when the light source 206 is installed on the support base 220 that does not move together with the support 22 and the illumination optical system 202 is configured to include the guide optical unit 230 and the illumination optical unit 231, the mask stage is similar to the above. The 1T mask interval adjusting mechanism 41 adjusts the mask interval in the Y direction, and the plate stage 1S adjusts the relative position between the mask unit M and the plate P in the scanning direction. The effect can be obtained.

In the exposure apparatus 201, the guide optical unit 230 that guides the light output from the light source 206 to the illumination optical unit 231 includes the optical fiber 207, and one end of the optical fiber 207 is fixed to the light source 206. , The other end is fixed to the illumination optical unit 231. Thereby, the exposure apparatus 201 can maintain the optical path length until the light output from the light source 206 reaches the illumination optical unit 231 within a predetermined range. That is, even if the illumination optical unit 231 moves in the Z direction during exposure, the optical path length between the fixed light source 206 and the moving illumination optical unit 231 can be maintained within a predetermined range. As a result, the exposure apparatus 201 can suppress the light illuminating the mask unit M from varying depending on the position of the mask unit M in the X direction, can irradiate the mask with stable light, and the plate P can be irradiated. The pattern of the mask unit M can be transferred more appropriately.

In the exposure apparatus 201, the optical fiber 207 of the guide optical unit 230 is arranged such that one end (the end on the first end side) is arranged on the optical path of the illumination light output from the light source 206 and the other end ( The end portion on the second end side) may be moved together with the illumination optical unit 231 by the moving mechanism 240. That is, the exposure apparatus 201 does not need to fix the end portion of the guide optical unit 230 on the light source 206 side to the light source 206. In this case, the optical path length can be maintained within a predetermined range by adjusting the optical path amount based on the shift in the relative position between the light source 206 and the guide optical unit 230. Accordingly, even when the position of the light source 6 can be adjusted, the same processing as above can be realized.

Further, the exposure apparatus 201 fixes the light source 206 to a position that does not scan during exposure of the frame 1F or the like, in the present embodiment, to the support base 220, that is, the light source serves as a scanning optical system (illumination optical unit and projection optical system). By separating, the structure for scanning at the time of exposure can be reduced in weight. As a result, it is possible to suppress an increase in the size of a drive source that scans the scanning configuration, and to suppress an increase in the size of a mechanism that supports the scanning configuration. Therefore, in the exposure apparatus 201, the scanning exposure system can be downsized, and the energy required for scanning of the scanning exposure system can be reduced.

Further, the exposure apparatus 201 uses the guide optical unit 230 to maintain the optical path amount between the light source 206 and the illumination optical unit 231 within a predetermined range, so that the scanning optical system is separated even if the light source is separated from the scanning optical system. It is possible to prevent the exposure conditions from varying depending on the position of, and it is possible to perform exposure with performance comparable to that when the light source is integrated with the scanning optical system. Further, the exposure apparatus 201 has a configuration in which the light source is separated from the scanning optical system, so that the light source can be increased in size without changing the scanning configuration. Thereby, the output of the light source can be easily increased, the illuminance of light can be improved, and the production efficiency can be improved. For example, the exposure apparatus 201 is provided with a plurality of light sources that output laser light for one optical fiber 207 (or one partial illumination optical unit), and the light output from the plurality of light sources is provided in one optical fiber 207. By making it incident, the illuminance can be increased.

Further, the exposure apparatus 201 uses the moving mechanism 240 to move the guide optical unit 230 in accordance with the movement of the illumination optical unit 231 and the projection optical system 3 to thereby guide the light output from the light source 206. 207 can be moved smoothly. In the exposure apparatus 201, a part of the other end of the optical fiber 207 is supported by the housing that supports the illumination optical unit 231. Therefore, in the exposure apparatus 201, the casing that supports the illumination optical unit 231 and the moving mechanism that moves the illumination optical unit 231 are also part of the moving mechanism 240.

Although the exposure apparatus 201 uses the optical system using the optical fiber 207 as the guide optical unit 230, the present invention is not limited to this. The exposure apparatus 201 may use an optical system including a mirror instead of the optical fiber 207, and move the mirror according to the movement of the illumination optical unit 231 or the like to adjust the optical path length.

<Embodiment 3>
The exposure apparatus 501 of the third embodiment will be described below with reference to FIGS. 19 to 21. FIG. 19 is a side view of the exposure apparatus according to the third embodiment. FIG. 20 is a view of the exposure apparatus according to the third embodiment as seen from between the projection optical system and the plate. FIG. 21 is a diagram of the exposure apparatus according to the third embodiment viewed from the direction in which the illumination optical unit and the projection optical system move.

The exposure device 501 includes a frame 1F, an illumination optical system 502, a projection optical system 503, and a moving device 21. Further, in the exposure apparatus 501, the light output from the light source 506 is incident on the illumination optical system 502. The projection optical system 3 included in the above-described exposure apparatus 1 (see FIG. 1 and the like) includes a plurality of MLAs 8, but the projection optical system 503 included in the exposure apparatus 501 of the present modification extends in the Y direction. It has MLA 508 pieces. Further, the illumination optical unit 550 uses one concave mirror 516 to emit light to the projection optical system 503. The exposure device 501 causes the light output from one light source 506 to enter the illumination optical system 502.

The illumination optical system 502 is configured to output the light output from the light source 506 as the light for illuminating the mask unit M. The illumination optical system 502 has an optical system that forms the illumination field S shown in FIG. In the illumination optical system 502, the light emitted from the light source 506 is collimated by the relay optical system 511, reflected by the mirror 512, and incident on the fly-eye lens 514 via the relay optical system 513. At this time, the relay optical systems 511 and 513 expand the emission end surface of the optical fiber 532 to a predetermined multiple and enter the incident surface of the fly-eye lens 514. The fly-eye lens 514 has a plurality of element lenses arranged and joined together. In the present embodiment, five element lenses in the column direction and 17 element lenses in the row direction are arranged, and a total of 85 elements are joined. The light emitted from the fly-eye lens 514 passes through the σ stop 515. The σ stop 515 defines the illumination NA by limiting the diameter of light passing therethrough. The light passing through the σ stop 515 is condensed by the concave mirror 516 on the surface of the mask unit M (the surface on the side of the illumination optical unit 550) to form an illumination field S.

The projection optical system 503 has one MLA 508 extending in the Y direction. The MLA 508 is arranged at a position corresponding to the illumination visual field S formed by the illumination optical system 502. The MLA 508 is mounted on the stage 503S of the projection optical system 503. As the stage 503S moves along the projection system guide 5P, the MLA 508 moves in the X direction.

As described above, also in the case of the configuration in which one illumination optical system 502 illuminates the entire illumination visual field S, the mask spacing adjustment mechanism of the mask stage 1T adjusts the mask spacing in the Y direction in the same manner as described above. By adjusting the relative position of the mask unit M and the plate P in the scanning direction on the plate stage 1S, the same effect as in the above embodiment can be obtained.

<Device manufacturing method>
FIG. 22 is a flowchart showing each step of the device manufacturing method according to this embodiment. When manufacturing a device by the device manufacturing method according to the present embodiment, first, the function and performance of the device (electronic device) are designed (step S201). Next, a mask based on the design in step S201 is manufactured (step S202). Next, a step of projecting the mask pattern of the mask manufactured in step S202 onto the resist-coated plate P, a step of developing the exposed plate P, a step of heating the developed plate P, an etching step, etc. Substrate processing including is performed (step S203).

In the step of projecting and exposing the mask pattern on the plate P in the substrate processing, the exposure apparatus 1, 201, 501 executes the exposure method according to the present embodiment to form a pattern formed on the mask, that is, the same shape as the mask pattern. Pattern is transferred to the plate P. In the substrate processing, a plurality of masks are used as the mask unit M, and the pattern of each mask of the mask unit M is transferred to the plate P. The plate P to which the mask pattern is transferred is processed based on the transferred pattern by developing, heating, and etching. After the substrate processing is completed, the device is assembled including the processing processes such as the dicing process, the bonding process, and the packaging process (step S204), and the device is completed through the subsequent inspection (step S205).

The projection system (mainly the projection optical system) of each of the exposure apparatuses 1, 201, and 501 of the above-described embodiments has been described as a case where the projection magnification is set to 1, but the projection system is not limited to this. The exposure apparatuses 1, 201, and 501 can set the projection magnification to an arbitrary magnification by changing the arrangement of the lenses forming the optical system of the projection system and the focal position. The exposure apparatuses 1, 201 and 501 have a projection magnification of less than 1, reduce the line width of the mask pattern by the projection magnification, and form an image on the plate P, that is, the line width of the mask pattern is the plate P. The size may be several times (2 times, 3 times) the line width of the pattern formed in (1). Further, the exposure apparatuses 1, 201 and 501 have a configuration in which the projection magnification is made larger than 1 and the line width of the mask pattern is enlarged by the projection magnification to form an image on the plate P, that is, the line width of the mask pattern. May have a size which is a fraction of the line width of the pattern imaged on the plate P (1/2, 1/3).

As the plate P, not only a glass substrate for a display device but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or a mask or a reticle master plate (synthetic quartz, used in an exposure apparatus, Silicon wafer) or the like can be used.

The present invention also relates to a twin stage type exposure having a plurality of plate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796 and the like. It can also be applied to devices.

Further, the present invention provides a plate stage for holding a plate as disclosed in US Pat. No. 6,897,963, European Patent Application Publication No. 1713113, etc., and a reference mark without holding the plate. It can also be applied to an exposure apparatus provided with a formed reference member and/or a measurement stage on which various photoelectric sensors are mounted. Further, an exposure apparatus including a plurality of plate stages and a measurement stage can be adopted.

The type of the exposure apparatus 1, 201, 501 is not limited to the exposure apparatus for manufacturing a liquid crystal display element or a display, and an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the plate P, a thin film magnetic head, an image pickup device. The invention can be widely applied to devices (CCD), micromachines, MEMS, DNA chips, exposure apparatuses for manufacturing reticles or masks, and the like.

In the above embodiment, the masks Ma to Me have a structure in which the shielding region 52 is formed between the pattern regions 50, but the structure is not limited to this. The masks Ma to Me may be regions that transmit light between the pattern regions 50. In this case, it is possible to switch whether or not light is projected on the plate by providing a shutter in the projection optical system or the illumination optical system of the exposure apparatus 1, 201, 501 and switching the opening/closing of the shutter. Here, the shutter may be provided also when the shielding region 52 is formed on the masks Ma to Me. In this case, the exposure apparatuses 1, 201, and 501 change the intervals in the non-scanning direction of the masks Ma to Me in a state where the shutter is closed and light is not projected on the plate. Accordingly, it is possible to obtain the same effect as that in the case where the interval between the masks Ma to Me is changed in the shielding region 52 described above.

In the above-described embodiment, the light-transmissive mask in which the predetermined light-shielding pattern (or the phase pattern/darkening pattern) is formed on the light-transmissive substrate is used, but instead of this mask, for example, US Pat. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also called an electronic mask, active mask, or image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, instead of the variable shaping mask including the non-emissive image display element, a pattern forming apparatus including a self-emissive image display element may be provided.

The exposure apparatuses 1, 201, and 501 of the above-described embodiment ensure that various subsystems including the constituent elements recited in the claims of the present application maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. , Manufactured by assembling. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems before and after assembly to ensure these various kinds of accuracy. Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. It goes without saying that before the process of assembling the exposure apparatus from these various subsystems, there is the process of assembling each subsystem individually. After the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies of the exposure apparatus as a whole. It is desirable that the exposure apparatus is manufactured in a clean room where the temperature and cleanliness are controlled.

The requirements of the above-described embodiments and modifications can be combined as appropriate. In addition, some components may not be used. Further, various omissions, substitutions or changes of the constituent elements can be made without departing from the scope of the present invention. Further, as far as legally permitted, the disclosures of all publications and US patents relating to the exposure apparatus and the like cited in the above-mentioned embodiments and modifications are incorporated by reference. As described above, all other embodiments and operational techniques made by those skilled in the art based on the above embodiments are included in the scope of the present invention.

1, 201, 501 Exposure device 1S Plate stage 1T Mask stage 2 Illumination optical system 3 Projection optical system 3S Stage 6 Light source 9 Control device 10C, 10L, 10R Partial optical units 12, 511, 513 Relay optical system 13, 514 Fly-eye lens 15 Condenser lens 16 Mirror 21 Moving device 22 Supports 32, 42 Supports 34, 44 Base 40 Support 41 Mask gap adjusting mechanism 50 Pattern area 52 Shielding area 230 Guiding optical unit 231 Illumination optical unit 516 Concave mirror M Mask unit Ma, Mb, Mc, Md, Me mask

Claims (6)

An illumination optical system irradiates the illumination light to the mask via a projection image of the pattern formed on the mask, there is provided an exposure method for projecting to the plate through the lens array,
The plurality of masks are arranged apart from each other along a non-scanning direction intersecting the scanning direction, and the illumination optical system and the lens array are moved in the scanning direction relative to the mask and the plate. And illuminating the pattern with the illumination light from the illumination optical system, and projecting an image of the pattern formed on the mask onto the plate through the lens array,
During the relative movement of the illumination optical system and the lens array with respect to the mask and the plate in the scanning direction, the projection image projected on the plate is moved to the pattern formed on the mask and the position in the scanning direction. Moving the plate relative to the plurality of masks in the scanning direction so as to be different from each other . During the relative movement, a plurality of the plurality of patterns that are adjacent to each other in the non-scanning direction are changed so that the distance between the plurality of patterns formed on the plate while being separated from each other in the non-scanning direction is changed by the movement. The exposure method according to claim 1, wherein the interval between the masks is changed. Detecting the position of the pattern formed on the plate,
3. The relative position of the mask in the relative movement and the plate in the scanning direction is determined based on the detected position of the pattern formed on the plate. Exposure method. The exposure method according to claim 3 , wherein the position of the pattern formed on the plate is detected by detecting an alignment mark formed on the plate. An illumination optical system that illuminates the mask with illumination light,
A lens array for projecting a projected image of a pattern formed on the mask illuminated on the illumination optical system onto a plate and transferring the pattern formed on the mask onto the plate,
A moving device that relatively moves the illumination optical system and the lens array in the scanning direction with respect to the mask and the plate;
A stage supporting the plate,
During the relative movement of the illumination optical system and the lens array by the moving mechanism with respect to the mask and the plate in the scanning direction, the projection image projected on the plate is scanned with the pattern formed on the mask and the scanning. as varying the direction of the position, Ru said stage for supporting the plate for a plurality of said masks are arranged spaced apart from one another the non-scanning direction crossing the scanning direction are relatively moved to the scanning direction An exposure apparatus including an adjusting mechanism. The scanning of the illumination optical system and the lens array by the moving mechanism with respect to the mask and the plate so that the intervals of the plurality of patterns formed on the plate spaced from each other in the non-scanning direction are changed. The exposure apparatus according to claim 5 , further comprising a mask adjusting mechanism that changes a distance between the plurality of masks adjacent to each other in the non-scanning direction during relative movement in the direction.

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