JP6710601B2 - Semiconductor element mounting board - Google Patents

Description

The present invention relates to a substrate on which a semiconductor element is attached, and more particularly to a substrate on which other components are attached.

Conventionally, as a substrate to which a semiconductor element is attached and other components are attached, there is one such as disclosed in Patent Document 1, for example. According to the technique of Patent Document 1, a semiconductor device such as a FET is mounted on a main board, and the FET is fixed to a standing printed circuit board standing upright on the main board, and a snubber circuit for absorbing a surge voltage is formed. A resistor, a snubber capacitor and a snubber diode are attached. A large number of through holes are formed in the standing printed circuit board for heat radiation to the FET. In order to stand the standing printed board on the main board, the convex portion formed on the standing printed board is inserted into the slit formed on the main board.At the time of this insertion, the wiring pattern formed on these standing printed boards and the main board The wiring pattern formed in the above is connected, and the snubber circuit and the FET are connected. Further, the FET is connected to an external electronic circuit via a wiring pattern on the main board.

JP, 2014-203855, A

According to the technique of Patent Document 1, heat can be dissipated to the FET, and components can be connected to the FET. However, in addition to mounting the FET on the main substrate and the component mounting on the standing substrate, This standing printed circuit board has to be attached to the main board, and its assembly work is troublesome. Furthermore, since the printed circuit board is mounted vertically on the main circuit board, it becomes large in size, and the heat radiation of the FET can be performed only from the surface of the standing printed circuit board and the surface of the FET, and it is difficult to obtain further heat radiation effect. It was

It is an object of the present invention to provide a semiconductor element mounting substrate which is easy to assemble and can be mounted on a semiconductor element mounting substrate even in a small space, and has a high heat dissipation effect.

A semiconductor element mounting substrate according to one aspect of the present invention includes a semiconductor element, a substrate, and a terminal. This semiconductor element has a mounting portion for connecting to an external electric circuit. A component connected to the semiconductor element is attached to the substrate. For example, the component is attached to one surface of the substrate. Furthermore, a through hole corresponding to the mounting portion of the semiconductor element is formed in the substrate. The through hole penetrates, for example, in the thickness direction of the substrate. A semiconductor connection pattern is formed around the through hole on the surface facing the mounting portion, for example, the other surface . Also, a wiring pattern connecting the components can be provided on the substrate. It is desirable that the wiring pattern is provided on one surface of the substrate and includes a wiring pattern located around the through hole. The semiconductor element is arranged with the mounting portion aligned with the through hole. Regarding the terminal, a part of the terminal is interposed between the substrate and the mounting portion, and a part of the terminal is in contact with the semiconductor connection pattern of the substrate and the mounting portion of the semiconductor element. The terminal is connected to the mounting portion of the semiconductor element by passing through the through hole of the substrate from a surface opposite to the mounting portion of the substrate and penetrating the part of the terminal to be coupled to the mounting portion of the semiconductor element. It has a portion attached to the substrate and the semiconductor element and protruding from the substrate to the outside. By this fastening, the wiring pattern and the semiconductor connection pattern are connected. The semiconductor connection pattern formed on the substrate has an area larger than the area of the mounting portion of the semiconductor element.

In this configuration, when the terminal and the semiconductor element are mounted via the substrate, the mounting portion of the semiconductor element and the terminal are electrically connected. Therefore, the assembly work is easy. Moreover, since the area of the semiconductor connection pattern is larger than the area of the mounting portion, the heat dissipation effect of the semiconductor element can be enhanced. Since the terminal protrudes from the substrate to the outside, the shape and area of the terminal can be appropriately designed, so that the heat generated by the semiconductor element can be efficiently radiated through the terminal. Further, since the components are mounted on the board, it is possible to save space.

In the above aspect, the component can be surface-mounted on the substrate. When the component is surface-mounted, the lead wire does not protrude from the component, the component does not hang on the board, and there is no risk of the component breaking even if vibration is applied during transportation.

Further, the semiconductor element may form a snubber circuit. For example, it can be a diode. In this case, the component is a component of the snubber circuit including a resistor and a capacitor, and preferably a surface mount component is used. According to this structure, the snubber circuit is mounted on the substrate by surface mounting, so that the component can be easily mounted on the substrate and the manufacturing efficiency can be improved.

As described above, according to the present invention, the work of attaching the terminals and the semiconductor element to the substrate is facilitated, and the semiconductor element attachment substrate can be saved in space.

1A is a front view of a semiconductor element mounting substrate according to an embodiment of the present invention, FIG. 1B is a cross-sectional view taken along the line bb of FIG. 1A, and FIG. It is sectional drawing which follows the c line. 1A is a perspective view of a semiconductor module used for the semiconductor element mounting substrate of FIG. 1, and FIG. 1B is a vertical cross-sectional view of the semiconductor module. It is a rear view of the semiconductor element mounting substrate of FIG. FIG. 3 is a rear view of a board used in the semiconductor element mounting board of FIG. 1. FIG. 2 is a rear view of the semiconductor element mounting substrate of FIG. 1 with terminals attached to the substrate.

As shown in FIGS. 1A to 1C, a semiconductor element mounting substrate according to an embodiment of the present invention mounts a semiconductor element, for example, a semiconductor module 4 on a substrate 2 and attaches each electrode of the semiconductor module 4 to the outside. A plurality of terminals for connecting to the electric circuit of the semiconductor module 4, for example, terminals 6a, 6b, 6c on the substrate 2, and a plurality of other parts provided on the substrate 2 for these terminals 6a, 6b, 6c. 8 are connected on the substrate 2.

As shown in FIGS. 2A and 2B, the semiconductor module 4 includes a semiconductor chip 14, specifically, a semiconductor switching element such as an IGBT or an FET, on a base 12 built in a substantially rectangular parallelepiped housing 10. A chip and a plurality of diode chips connected in series or in parallel are arranged. Leads are respectively connected on the plurality of electrodes, in this embodiment, three electrodes, and the tips of the leads project on one main surface of the housing 10 at a distance from the main surface, and the mounting portion 16a is formed. , 16b, 16c are arranged in a line with each other. Mounting holes 18a, 18b, 18c are formed in the mounting portions 16a, 16b, 16c, respectively, and fasteners, such as bolts, inserted through the mounting holes 18a, 18b, 18c correspond to the mounting portions 16a, 16b, 16c. Then, the three nuts 19a, 19b, 19c arranged in the recesses 17a, 17b, 17c formed in the housing 10 are respectively screwed. The semiconductor module 4 produces a potential difference between the mounting portions 16a and 16b and between the mounting portions 16a and 16c in the usage state.

The substrate 2 is formed in a substantially rectangular shape as shown in FIGS. 3 and 4, and has a shape in which both ends of the lower edge thereof are cut off. As shown in FIG. 4 is attached. Therefore, as shown in FIG. 4, the back surface of the substrate 2 and the other surface, for example, the front surface of the substrate 2 are penetrated to correspond to the mounting holes 18a to 18c of the mounting portions 16a to 16c of the semiconductor module 4, Through holes 20a, 20b, 20c are formed below the central portion of the substrate 2. Further, on the back surface side of the substrate 2, semiconductor element patterns 22a, 22b and 22c for connecting with the respective electrodes of the semiconductor module 4 are formed around the respective through holes 20a to 20c. These semiconductor element patterns 22a, 22b, 22c are formed to have a larger area than the mounting portions 16a, 16b, 16c. In addition, as shown in FIGS. 1B and 1C, wiring patterns 23a to 23c have a size corresponding to conductive bolts 26a to 26c, which will be described later, around the through holes 20a to 20c on the surface of the substrate 2. Is formed in.

As shown in FIG. 1A, a component 8 connected to the semiconductor module 4, for example, a resistor, a capacitor, a diode or the like forming a snubber circuit is mounted on the surface of the substrate 2 from the central portion to the upper portion by surface mounting. It is installed.

One ends of the terminals 6a to 6c described above are sandwiched between the back surface of the substrate 2 and the mounting portions 16a to 16c of the semiconductor module 4. The first terminal, for example, the terminal 6a is a conductive metal Z-shaped member, one end of which is in contact with the semiconductor element pattern 22a corresponding to the mounting portion 16a in the center of the semiconductor module 4, and the terminal 6a As shown in FIG. 5, a through hole 24a is formed in each of the through holes 20a. A coupling means, for example, a conductive bolt 26a is inserted from the front surface side of the substrate 2 into the through hole 20a of the substrate 2 and the through hole 24a of the terminal 6a as shown in FIG. It enters into the mounting hole 18a and is screwed into the nut 19a in the recess 17a of the housing 10. As a result, the mounting portion 16a of the semiconductor module 4 is connected to the semiconductor element connection pattern 22a on the back surface side of the substrate 2 and is connected to the wiring pattern 23a on the front surface side of the substrate 2 to form a circuit together with the component 8. The terminal 6a is bent toward the surface side of the substrate 2 near the position corresponding to the lower edge of the substrate 2, for example, as shown in FIG. Through a notch 27 formed in the center of the lower edge of the substrate 2, and projects further forward from the surface of the substrate 2, and the other end extending downward from the protruding portion is below the substrate 2. It is located below the edge. In this way, the terminal 6a projects from the substrate 2 to the outside. As shown in FIGS. 1B and 5, a penetrating screw hole 28 is formed at the other end of the protruding portion of the terminal 6a to connect the central electrode of the semiconductor module 4 to an external electric circuit. The mounting bracket 30 is placed on the front surface side of the substrate 2 so as to overlap with the through screw hole 28, and is attached to the other end of the terminal 6a by a conductive bolt 32a as shown in FIG. As a result, the mounting portion 16a of the semiconductor module 4 is connected to the external electric circuit.

The second terminal, for example, the terminal 6b and the third terminal, for example, the terminal 6c, are conductive metal and are L-shaped metal fittings wider than the terminal 6a. The semiconductor element patterns 22b and 22c corresponding to the mounting portions 16b and 16c on both sides of the portion 16a are in contact, and through holes 24b and 24c are formed corresponding to the through holes 20b and 20c as shown in FIG. ing. As shown in FIG. 1C, a conductive bolt 26b inserted from the front surface side of the semiconductor module 4 by being inserted into the through holes 20b and 20c of the substrate 2 and the through holes 24b and 24c of the terminals 6b and 6c, 26c penetrates into the mounting holes 18b, 18c of the mounting portions 16b, 16c and is screwed into the nuts 19b, 19c in the recesses 17b, 17c of the housing 10, respectively. As a result, the mounting portions 16b and 16c of the semiconductor module 4 are connected to the semiconductor element connection patterns 22b and 22c on the back surface side of the substrate 2 and to the wiring patterns 23b and 23c on the front surface side of the substrate 2 together with the component 8. It constitutes a circuit. Then, as will be described later, the other ends of the terminals 6b and 6c project downward from the substrate to the outside of the substrate 2. In this way, the terminals 6a, 6b, and 6c are mounted and connected to the back surface of the substrate 2 of the semiconductor module 4 by the bolts 26a, 26b, and 26c.

Each of the terminals 6b and 6c extends straight downward from one end thereof with a larger area than the terminal 6a, passes through the lower edge of the substrate 2, and is further below the lower end of the first terminal 6a. A predetermined distance and the lower end portion is bent to the front side of the substrate 2. At these bent portions, the substrates 2 are mechanically supported on the blocks 34, 34, 36, 36 by being fixed to the blocks 34, 34, 36, 36 by bolts 32b, 32b, 32c, 32c. Thus, the terminals 6b and 6c have a large area and protrude to the outside of the substrate 2, so that the heat from the semiconductor module 4 is efficiently radiated from the wide surfaces of the terminals 6b and 6c.

Further, the surface of the semiconductor module 4 opposite to the surface on which the mounting portions 16a, 16b, 16c are provided (the surface on the side of the base 12) has a heat radiating means, as shown in FIGS. 1(b) and 1(c). For example, it is attached to the heat sink 37. The heat sink 37 is located above the upper end of the substrate 2 and is sized to cover the entire back surface side of the substrate 2.

Since the bent portion of the terminal 6a is in the cutout 27, the insulation distance is higher in the vertical direction of the board 2 than when the bent portion of the terminal 6a is passed through the lower edge of the board 2 without forming the cutout 27. It's getting bigger.

It should be noted that both ends of the terminals 6b and 6c are cut off at their upper ends to form a space in cooperation with the cut-off lower edge of the substrate 2, to which the mounting bracket 30 is connected. This is because the cord 38 can be easily pulled out to the back surface side of the substrate 2.

In this semiconductor element mounting board, the terminals 6a, 6b, 6c and the mounting portions 16a, 16b, 16c of the semiconductor module 4 are provided on the semiconductor element patterns 22a, 22b, 22c on the back surface side of the board 2 on which the component 8 is surface-mounted. The terminals 6a, 6b, 6c and the semiconductor module 4 can be mounted on the substrate 2 by the bolts 26a, 26b, 26c from the front surface side of the substrate 2 and can be electrically connected. In this way, the semiconductor module 4 can be attached to the substrate 2, the terminals 6a, 6b and 6c of the semiconductor module 4 can be connected, and the semiconductor module 4 of the component 8 can be connected only by screwing the bolts 26a, 26b and 26c. Assembling work can be facilitated. The terminals 6a, 6b, 6c extend from the substrate 2 to the outside, and the other end of the protruding terminal 6a is on the front surface side of the substrate 2 and the terminals 6b, 6c on both sides thereof are on the back surface side of the substrate 2. Since the substrates 2 are spaced apart from each other in the front and rear, the degree of freedom in designing the size and shape of the protruding portions of the terminals 6a, 6b, 6c is increased, and the area thereof can be increased. Therefore, the heat of the semiconductor module 4 can be efficiently radiated from the terminals 6a, 6b, 6c having a large area.

Moreover, since the semiconductor element patterns 22a, 22b, 22c have a larger area than the mounting portions 16a, 16b, 16c of the semiconductor module 4, the heat dissipation effect of the semiconductor module 4 can be enhanced.

Further, since the component 8 is surface-mounted on the substrate 2, the component 8 does not have leads and is fixed on the substrate 2. Therefore, when the device using the semiconductor element mounting substrate is conveyed, vibration is generated in the semiconductor. Even if it is applied to the element mounting board, no failure will occur due to disconnection of the lead of the component. Further, since the heat sink 37 for the semiconductor module has a size capable of covering the entire back surface of the substrate 2, the heat released from the component 8 is absorbed by the heat sink 37.

In each of the above embodiments, the semiconductor module 4 is shown to have three mounting portions, but the present invention is not limited to this, and a semiconductor module having at least two mounting portions can be used. In the above-described embodiment, the component 8 is for the snubber circuit, but the component 8 is not limited to this, and a component according to the application of the semiconductor module 4 can be used. Although the component 8 is provided on the front surface side of the substrate 2, the component can be attached to the back surface side instead of or in addition to the front surface side. In the above-described embodiment, the terminals 6a are Z-shaped and the terminals 6b and 6c are L-shaped. However, the present invention is not limited to these, and all the terminals are on one side of the substrate 2. The shape is arbitrary as long as it can be attached to the surface.

2 substrate 4 semiconductor module (semiconductor element)
6a 6b 6c terminal 8 parts 26a 26b 26c bolt (coupling means)

Claims (3)

A semiconductor element having a mounting portion for connection to an external electric circuit,
A component to be connected to the semiconductor element is attached, has a through hole corresponding to the attachment portion of the semiconductor element, and a semiconductor connection pattern is formed around the through hole in a surface facing the attachment portion , A substrate in which the mounting portion of the semiconductor element is arranged so as to match the through hole;
A part is interposed between the substrate and the mounting part, and a part of the part is in contact with the semiconductor connection pattern of the substrate and the mounting part of the semiconductor element, and the side opposite to the mounting part of the substrate. From the surface of the substrate through the through hole, is attached to the substrate and the semiconductor element by a coupling means that penetrates the part and is coupled to the mounting portion of the semiconductor element, and protrudes from the substrate to the outside. The terminal that has the
Have,
The semiconductor element mounting substrate , wherein the semiconductor connection pattern formed on the substrate has an area larger than an area of the mounting portion of the semiconductor element. The semiconductor element mounting substrate according to claim 1, wherein the component is surface-mounted on the substrate. The semiconductor element mounting board according to claim 2, wherein the semiconductor element constitutes a snubber circuit, and the component is a component of the snubber circuit.

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