JP2573531B2 - Large current wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-current wiring board, and in particular, mounts and configures a power electronic circuit such as a motor controller (an inverter, a servo controller, etc.), an uninterrupted power supply, and a DC / DC power supply on the board. The present invention relates to a high-current wiring board according to technology.

[0002]

2. Description of the Related Art For power electronics circuits,
Conventionally, attempts have been made to apply a large current to a printed circuit board.However, there is a limit to the current that can be passed with the copper foil pattern of a normal printed circuit board. Practical application of the technology for enhancing the current capacity by attaching the battery has been progressing. For example, among Japanese manufacturers, Furukawa Electric Co., Ltd. and Hitachi Cable Co., Ltd. have commercialized such high-current printed circuit boards. As a typical example of the conventional example, Furukawa Electric Time Report: No. 87, December issue,
1990 p. 108.

FIGS. 9 to 12 are schematic structural views showing a general conventional large current wiring board disclosed in the above-mentioned document. That is, FIG. 9 is a plan view showing a component mounting surface,
10 is a sectional view taken along the line AB shown in FIG. 9, FIG. 11 is a partial detailed view showing the inside of a dotted line circle in FIG. 10, and FIG. 12 is a plan view showing a soldering surface. In the above figure, 2 is a substrate,
2 is a pattern formed on the substrate 1, 3 is a through hole formed on the pattern 2 of the substrate 1, 4 is a short bar fixed on the substrate 1, 5 is a burring applied to the short bar 4, 6 is This is a copper foil pattern provided on the substrate 1 below the short bar 4. 7 is short bar 4
, A solder for fixing the copper foil pattern 6, 8 denotes a glass epoxy resin constituting the substrate 1, and 9 denotes a land around the burring 5.

[0004] The board 1 configured as described above is used as a large current wiring board in power electronics equipment. FIG. 13 shows an example of its use, and is a sectional view of a main part of a conventional large current wiring board. In the drawing, reference numeral 10 denotes a diode module attached to the cooling fin 12,
Reference numeral 11 denotes an IGBT (insulated gate bipolar mode transistor) module attached to the cooling fin 12. The screw 13 passes through the burring 5 of the short bar 4,
Terminal 10a of substrate 1 and diode module 10, IG
The terminal 11a of the BT module is fixed. Therefore, the diode module 10 and the IGBT module 11 are electrically connected by the short bar 4, and a large current flows between them.

[0005]

Since the conventional high current wiring board is constructed as described above, if the heights of the diode module 10 and the IGBT module 11 are different as shown in FIG. It was necessary to change the height of the surface for each component having a different height. In FIG. 13, the cooling fins 12 are formed by aluminum die casting, and the height is changed for each part. Therefore, it is not possible to use inexpensive cooling fins with a flat component mounting surface made of extruded materials, etc., which are generally available on the market. I had to. In addition, the finished surface roughness of aluminum die-casting is poor, and it is necessary to improve the surface roughness by milling or the like, which also causes an increase in cost.

As a means for adjusting the height, there is a method of inserting an aluminum plate 16 as a spacer between the heat generating component and the cooling fins 12 as shown in FIG.
There were problems such as an increase in the cost of the aluminum plate and an increase in man-hours and labor costs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and has a large current wiring board having a structure in which a component mounting surface of a cooling fin is flat and an inexpensive commercially available cooling fin can be used. It is intended to provide.

[0008]

A high current wiring board according to the present invention comprises a board made of an insulating material, a hole provided at a predetermined position of the board, and a soldering, brazing or welding penetrating through the hole. It has a plurality of cylindrical conductors fixed by welding or crimping, and is constituted by at least one cylindrical conductor in which the distance from the substrate to the end face of the cylindrical conductor is classified by a plurality of different dimensions. .

[0009]

According to the present invention, the hole provided in the substrate is penetrated by a tubular conductor and then fixed, and the electrical connection is made using a conductor bus bar or the like. Can be changed according to the height of the component. When such a change is made, the individual bases of the heat-generating components are at a fixed distance from the substrate irrespective of the components, so that the component mounting surface is flat and assembly using inexpensive extrusion cooling fins becomes possible.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings for each of Embodiments 1 to 4.

Embodiment 1 FIG. 1 is a sectional view of a main part of an embodiment of a first large current wiring board according to the present invention, wherein 1 is a board, 3 is a through hole formed in the board 1, and 9 is a through hole. Lands 15 around the holes are cylindrical conductors that penetrate through holes 3 and short bars (conductor bus bars) 4 and are fixed by soldering.

FIG. 2 is a sectional view of an essential part showing an example in which this large current wiring board is used for a power electronic device. Reference numeral 10 denotes a diode module mounted on a cooling fin 12, and reference numeral 11 denotes a diode module mounted on the cooling fin 12. I
A GBT module in which the screw 13a is a cylindrical conductor 15a
Through the substrate 1 and the diode module 10
Terminal 10a is fixed. Further, the screw 13b fastens the cylindrical conductor 15b with a through screw and is fixed to the terminal 11a of the IGBT module. Therefore, the diode module 10 and the IGBT module 11 are electrically connected to the large current wiring board 1. That is, the cylindrical conductor 1
5a and the cylindrical conductor 15b are electrically connected by the short bar 4, and a large current can flow.

Next, the operation will be described. In this large-current wiring board, the cylindrical conductors 15a, 15
Since the height of 5b is changed, the bases of the diode module 10 and the IGBT module 11 are on the same plane. Therefore, the cooling fins 12 also have a flat component mounting surface.

Embodiment 2 FIG. 3 is a sectional view of a main part of an embodiment of a second high-current wiring board according to the present invention. In the figure, 1 is a substrate, 3 is a through hole formed in the substrate 1, 9 is a land around the through hole, 25 is a through hole 3 and a short bar 4,
It is a cylindrical conductor fixed by caulking. FIG. 4 is a cross-sectional view showing an example in which this high-current wiring board is used for a power electronic device. Reference numeral 10 denotes a diode module attached to the cooling fins 12, 11 denotes an IGBT module attached to the cooling fins 12, Screw 13a
Then, the cylindrical conductor 15a is screwed through and the substrate 1 and the terminal 10a of the diode module 10 are fixed. Also, the screw 13b fastens the cylindrical conductor 15b with a through screw, and the IGBT
The terminal 11a of the module 11 is fixed. Therefore, the diode module 10 and the IGBT module 1
1 is electrically connected to the large current wiring board 14. That is,
A short bar 4 is provided between the cylindrical conductors 15a and 15b.
, And a large current can flow. In addition,
The operation is the same as in the first embodiment, and a description thereof will not be repeated.

Embodiment 3 FIG. 5 is a sectional view showing a main part of an embodiment of a third high-current wiring board according to the present invention. 1 is a substrate, 3 is a through hole formed in the substrate 1, 9 is a land around the through hole, 35 is a cylindrical conductor penetrating through the through hole 3 and fixed by soldering with solder 7. FIG. 6 is a cross-sectional view of an essential part showing an example in which this high-current wiring board is used for a power electronic device. Reference numeral 10 denotes a diode module mounted on the cooling fins 12, and 11 denotes an IGBT module mounted on the cooling fins 12. Yes, the cylindrical conductor 15 with the screw 13a
a and the short bar 4 by tightening the through screw.
Is the terminal 10 of the diode module 10 via the substrate 1
a is fixed. Further, the cylindrical conductor 15b and the short bar 4 are screwed through with the screw 13b and fixed to the terminal 11a of the IGBT module. Therefore, the diode module 10 and the IGBT module 11 are connected to the short bar 4
Is to be electrically connected. The operation is the same as that described in the first embodiment.

Embodiment 4 FIG. 7 is a sectional view showing a main part of an embodiment of a fourth high-current wiring board according to the present invention. 1 is a substrate, 2 is a pattern formed on the substrate 1, 3 is a through hole formed in the substrate 1, 9 is a land around the through hole, 45 is penetrated through the through hole 3 and the short bar 4, and is fixed by caulking. Cylindrical conductor. Reference numeral 26 denotes swaging. FIG. 8 is a cross-sectional view showing an example in which this high-current wiring board is used for a power electronic device. Reference numeral 10 denotes a diode module mounted on the cooling fins 12, 11 denotes an IGBT module mounted on the cooling fins 12, The screw 13a penetrates the cylindrical conductor 45a and the short bar 4, and is fixed to the terminal 10a of the diode module 10 by screwing. The screw 13b penetrates the tubular conductor 45b and the short bar 4, and is fixed by screwing to the terminal 11a of the IGBT module. Therefore, the diode module 10 and the IGB
The T module 11 is electrically connected. That is, the tubular conductor 45a and the tubular conductor 45b are electrically connected by the short bar 4, so that a large current can flow. The operation is as described in the first embodiment.

In the above-described first to fourth embodiments, a semiconductor module has been described as an example of a component to be used. However, another component may be used. In addition, although the example where the height of the cylindrical conductor was changed to make the component surface of the cooling fins flat was shown, for example, in order to draw out with a bus bar, to secure the insulation distance, the height was increased for other purposes. You may change it. Further, in this embodiment, the through hole 3 is provided, but it may be a simple hole, or one surface may be soldered. In the embodiment, the example of the soldering and fixing is shown, but other welding and fixing means other than soldering, such as brazing and welding, may be used. In addition, in this embodiment, the short bar is fixed together with the cylindrical conductor. However, it is not necessary to fix the short bar if connection of a large current is unnecessary. In the present embodiment, the dimension between the substrate of the cylindrical conductor and the cooling fin is changed, but the dimension on the opposite side may be changed.

[0018]

As described above, according to the present invention, a cylindrical conductor fixedly inserted through a hole provided in an insulating substrate and, if necessary, a conductor busbar for a large current are provided between the cylindrical conductors. In the board, since the base of the mounted parts can be aligned by changing the distance from the board to the end face of the cylindrical conductor by changing the dimensions of the cylindrical conductor, the component mounting surface of the cooling fins can be assembled as a plane, By using an inexpensive cooling fin such as an extruded material, a large-current wiring board can be formed at low cost.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a first embodiment of a large current wiring board according to the present invention.

FIG. 2 is a cross-sectional view showing an example of use of a power electronic device using the large current wiring board of FIG.

FIG. 3 is a cross-sectional view of a principal part showing a second embodiment of the large current wiring board according to the present invention.

FIG. 4 is a cross-sectional view showing an example of use of a power electronic device using the large current wiring board of FIG.

FIG. 5 is a sectional view of a main part showing a third embodiment of the large current wiring board according to the present invention.

6 is a cross-sectional view showing an example of use of a power electronic device using the large current wiring board of FIG.

FIG. 7 is a sectional view of a main part showing a fourth embodiment of the large current wiring board according to the present invention.

8 is a cross-sectional view showing an example of use of an electronic device using the high-current wiring board of FIG.

FIG. 9 is a plan view showing a component mounting surface of a conventional large current wiring board.

FIG. 10 is a sectional view taken along line AB in FIG. 9;

FIG. 11 is a detailed sectional view showing the inside of the dotted circle in FIG. 10;

FIG. 12 is a plan view showing a soldering surface.

FIG. 13 is a cross-sectional view of a main part showing one example in which a conventional large current wiring board is used for a power electronic device.

FIG. 14 is a sectional view of a main part showing another example in which a conventional large current wiring board is used for a power electronic device.

[Explanation of symbols]

1 substrate, 2 patterns, 3 through holes, 4 short bar, 5 burring, 6 copper foil pattern, 7 solder, 8 glass epoxy resin, 9 lands, 10 diode module, 10a diode module terminal, 11 IGBT module, 11a IGBT module Terminals, 12 cooling fins, 13, 13a, 13
b Screw, 15, 15a, 15b, 25, 25a, 25
b, 35, 35a, 35b, 45, 45a, 45b
Tubular conductor, 16 aluminum plate, 26 caulking.

Claims (1)

(57) [Claims] 1. A wiring board made of an insulating material, a hole provided at a predetermined position of the wiring board, soldering penetrate into the hole, that brazing, having a fixed structure by fixing means welding or caulking the wiring board obtained by disposing a tubular conductor of multiple, characterized in that is constituted by the cylindrical conductor size and type of a plurality of different sizes to the end face of the cylindrical conductor from the wiring substrate Large current wiring board.