JP2018018880A - Semiconductor element mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate work for mounting a terminal or a semiconductor element to a substrate and to save a space for a semiconductor element mounting substrate.SOLUTION: A component 8 to be connected to a semiconductor module 4 comprising mounting parts 16a-16c for connection to an external electric circuit is mounted onto a substrate 2, and through-holes 20a-20c corresponding to the mounting parts 16a-16c are formed on the substrate 2. Semiconductor connection patterns 22a-22c are formed around the through-holes 20a-20c in such a manner that the semiconductor connection patterns can be brought into contact with the mounting parts 16a-16c, and the semiconductor module 4 is disposed while matching the mounting parts 16a-16c with the through-holes 20a-20c. Portions of the terminals 6a-6c are brought into contact with the substrate 2 and while penetrating the portions, bolts 26a-26c are coupled to the mounting parts 16a-16c of the semiconductor module 4 via the through-holes 20a-20c of the substrate 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate on which a semiconductor element is attached, and more particularly to a substrate on which other components are attached.

  2. Description of the Related Art Conventionally, for example, another component attached to a substrate on which a semiconductor element is attached is disclosed in Patent Document 1. According to the technique of Patent Document 1, a semiconductor device such as an FET is mounted on a main substrate, the FET is fixed to a standing printed circuit board that stands upright to the main substrate, and a snubber circuit configured to absorb a surge voltage is formed. A resistor, a snubber capacitor and a snubber diode are attached. A large number of through holes are formed in the standing printed circuit board for heat dissipation to the FET. Projections formed on the standing printed board are inserted into the slits formed on the main board in order to stand the standing printed board on the main board. At the time of this insertion, the wiring pattern formed on the standing printed board and the main board Are connected to the wiring pattern, and the snubber circuit and the FET are connected. Further, the FET is connected to an external electronic circuit via a wiring pattern on the main substrate.

JP 2014-203855 A

  According to the technique of Patent Document 1, heat dissipation to the FET is performed and components can be connected to the FET. However, after attaching the FET to the main substrate, it is necessary to attach the component to the standing substrate. This standing printed board must be attached to the main board, and the assembly work is troublesome. Furthermore, because the printed circuit board is mounted vertically on the main board, it becomes large in size, and the heat radiation of the FET can be performed only from the surface of the printed circuit board and the surface of the FET, making it difficult to obtain a further heat dissipation effect. It was.

  It is an object of the present invention to provide a semiconductor element mounting substrate that is easy to assemble and that can be attached to a semiconductor element mounting substrate even in a small space and has a high heat dissipation effect.

  A semiconductor element mounting substrate of one embodiment of the present invention includes a semiconductor element, a substrate, and a terminal. This semiconductor element has a mounting portion for connection to an external electric circuit. Components to be connected to the semiconductor element are attached to the substrate. For example, a component is attached to one surface of the substrate. Furthermore, a through hole corresponding to the mounting portion of the semiconductor element is formed in the substrate. The through hole penetrates in the thickness direction of the substrate, for example. A semiconductor connection pattern is formed around the through hole so as to be in contact with the mounting portion. The semiconductor connection pattern can be provided, for example, on the other surface side of the substrate. Also, a wiring pattern connecting the components can be provided on the substrate. The wiring pattern is preferably provided on one surface of the substrate and includes those located around the through hole. The semiconductor element is arranged with the mounting portion aligned with the through hole. A part of the terminal is in contact with the substrate, and is attached to the substrate and the semiconductor element by coupling means that penetrates part of the terminal and is coupled to the mounting part of the semiconductor element through the through hole of the substrate. It has been. By this fastening, the wiring pattern and the semiconductor connection pattern are connected. Further, the terminal protrudes from the substrate to the outside.

  If comprised in this way, when a terminal and a semiconductor element are attached via a board | substrate, the electrical connection of the attachment part and terminal of a semiconductor element will be performed. Therefore, the assembly work is easy. In addition, since the semiconductor connection pattern can be made large, the contact area between the mounting portion of the semiconductor element and the terminal can be increased, and since the terminal protrudes from the substrate to the outside, the shape and area of the terminal can also be appropriately designed. The heat generated can be efficiently radiated through the terminals. Furthermore, since the components are attached on the substrate, space can be saved.

  In the above aspect, the component can be surface-mounted on the substrate. When the component is surface-mounted, the lead wire does not protrude from the component, the component does not sag on the board, and the component is not broken even if vibration is applied during conveyance.

  Furthermore, the semiconductor element may constitute a snubber circuit. For example, it can be a diode. In this case, the component is a component of the snubber circuit composed of a resistor or a capacitor, and preferably a surface-mounted component. If comprised in this way, since the snubber circuit is attached to the board | substrate by surface mounting, attachment to the board | substrate of components will become easy and manufacturing efficiency will be improved.

  Said aspect WHEREIN: The semiconductor connection pattern around the said through-hole shall have an area larger than the area of the said attaching part of the said semiconductor element. If comprised in this way, the thermal radiation effect of a semiconductor element can be improved.

  As described above, according to the present invention, it is easy to attach terminals and semiconductor elements to a substrate, and the semiconductor element mounting substrate can be saved in space.

(A) is a front view of the semiconductor element mounting substrate of one embodiment of the present invention, (b) is a cross-sectional view taken along line bb of FIG. 1 (a), and (c) is c-- of FIG. 1 (a). It is sectional drawing which follows c line. (A) is a perspective view of the semiconductor module used for the semiconductor element attachment board | substrate of FIG. 1, (b) is a longitudinal cross-sectional view of a semiconductor module. It is a rear view of the semiconductor element attachment board | substrate of FIG. It is a rear view of the board | substrate currently used with the semiconductor element attachment board | substrate of FIG. FIG. 2 is a rear view of the semiconductor element mounting substrate of FIG. 1 in a state where terminals are attached to the substrate.

  As shown in FIGS. 1A to 1C, a semiconductor element mounting substrate according to an embodiment of the present invention has a semiconductor element, for example, a semiconductor module 4 attached to a substrate 2, and each electrode of the semiconductor module 4 is connected to the outside. A plurality of terminals, for example, terminals 6a, 6b and 6c, which are attached to the semiconductor module 4 on the substrate 2, and a plurality of other components provided on the substrate 2 are connected to the terminals 6a, 6b and 6c. 8 are connected on the substrate 2.

  As shown in FIGS. 2A and 2B, the semiconductor module 4 includes a semiconductor chip 14, specifically a semiconductor switching element such as an IGBT or FET, on a base 12 built in a housing 10 having a substantially rectangular parallelepiped shape. A chip and a plurality of diode chips connected in series or in parallel are arranged. A lead is connected to each of the plurality of electrodes, in this embodiment, three electrodes, and the tip of each lead protrudes on one main surface of the housing 10 at a distance from the main surface, and the mounting portion 16a. 16b and 16c are arranged in a line with each other. Mounting holes 18a, 18b, and 18c are formed in the mounting portions 16a, 16b, and 16c, respectively, and fasteners, for example, bolts inserted through the mounting holes 18a, 18b, and 18c correspond to the mounting portions 16a, 16b, and 16c. Then, they are screwed into the three nuts 19a, 19b, 19c arranged in the recesses 17a, 17b, 17c formed in the housing 10, respectively. The semiconductor module 4 generates a potential difference between the mounting portions 16a and 16b and between the mounting portions 16a and 16c in the usage state.

  The substrate 2 is formed in a substantially rectangular shape as shown in FIGS. 3 and 4 and is formed by cutting off both ends of the lower edge thereof. As shown in FIG. 4 is attached. Therefore, as shown in FIG. 4, corresponding to the mounting holes 18a to 18c of the mounting portions 16a to 16c of the semiconductor module 4, the back surface of the substrate 2 and the other surface, for example, the front surface of the substrate 2 are penetrated. Through holes 20 a, 20 b, and 20 c are formed below the center portion of the substrate 2. Further, on the back side of the substrate 2, semiconductor element patterns 22a, 22b, and 22c for connecting to the respective electrodes of the semiconductor module 4 are formed around the respective through holes 20a to 20c. These semiconductor element patterns 22a, 22b, and 22c are formed to have larger areas than the attachment portions 16a, 16b, and 16c. Further, as shown in FIGS. 1B and 1C, the wiring patterns 23a to 23c have sizes corresponding to conductive bolts 26a to 26c described later around the through holes 20a to 20c on the surface of the substrate 2. Is formed.

  As shown in FIG. 1 (a), components 8 connected to the semiconductor module 4, such as resistors, capacitors, diodes, and the like connected to the semiconductor module 4 are mounted on the surface of the substrate 2 by surface mounting. It is attached.

  One end portions of the terminals 6a to 6c described above are sandwiched between the back surface of the substrate 2 and the mounting portions 16a to 16c of the semiconductor module 4. The first terminal, for example, the terminal 6a is in the shape of a conductive metal Z metal fitting, one end of which is in contact with the semiconductor element pattern 22a corresponding to the mounting portion 16a in the center of the semiconductor module 4, and the terminal 6a. As shown in FIG. 5, a through hole 24a is formed corresponding to the through hole 20a. As shown in FIG. 1B, for example, a conductive bolt 26a is inserted into the through hole 20a of the substrate 2 and the through hole 24a of the terminal 6a as shown in FIG. Is inserted into the mounting hole 18a and screwed into the nut 19a in the recess 17a of the housing 10. As a result, the mounting portion 16 a of the semiconductor module 4 is connected to the semiconductor element connection pattern 22 a on the back surface side of the substrate 2, and is connected to the wiring pattern 23 a on the front surface side of the substrate 2. The terminal 6a is bent toward the surface side of the substrate 2 in the middle thereof, for example, in the vicinity of a position corresponding to the lower edge of the substrate 2, and the bent portion is formed on the substrate 2 as shown in FIG. The other end portion that protrudes further forward than the surface of the substrate 2 through the notch 27 formed in the center of the lower edge of the substrate 2, for example, the lower end of the substrate 2 is below the substrate 2. It is located below the edge. Thus, the terminal 6a protrudes from the substrate 2 to the outside. As shown in FIG. 1B and FIG. 5, a through screw hole 28 is formed at the protruding other end of the terminal 6a to connect the central electrode of the semiconductor module 4 to an external electric circuit. The mounting bracket 30 is placed on the surface of the substrate 2 so as to overlap the through screw hole 28, and is attached to the other end of the terminal 6a by a conductive bolt 32a as shown in FIG. Thereby, the mounting portion 16a of the semiconductor module 4 is connected to an external electric circuit.

  The second terminal, for example, the terminal 6b and the third terminal, for example, the terminal 6c, are conductive metallic and have an L-shaped bracket shape wider than the terminal 6a. One end of the second terminal is attached to the center of the semiconductor module 4. The semiconductor element patterns 22b and 22c corresponding to the mounting portions 16b and 16c on both sides of the portion 16a are in contact with each other, and through holes 24b and 24c are formed corresponding to the through holes 20b and 20c, respectively, as shown in FIG. ing. As shown in FIG. 1C, conductive bolts 26b inserted through the through holes 20b and 20c of the substrate 2 and the through holes 24b and 24c of the terminals 6b and 6c and inserted from the surface side of the semiconductor module 4, 26c enters the mounting holes 18b and 18c of the mounting portions 16b and 16c, and is screwed into the nuts 19b and 19c in the recesses 17b and 17c of the housing 10, respectively. As a result, the mounting portions 16 b and 16 c of the semiconductor module 4 are connected to the semiconductor element connection patterns 22 b and 22 c on the back surface side of the substrate 2, and are connected to the wiring patterns 23 b and 23 c on the front surface side of the substrate 2. The circuit is configured. As will be described later, the other ends of the terminals 6b and 6c protrude outward from the substrate 2 downward from the substrate. In this manner, the terminals 6a, 6b, and 6c and the attachment and connection of the semiconductor module 4 to the back surface of the substrate 2 are performed by the bolts 26a, 26b, and 26c.

  Each of the terminals 6b and 6c extends straight downward from one end of the terminal 6b with a larger area than the terminal 6a, passes through the lower edge of the substrate 2, and is further below the lower end of the first terminal 6a. The lower end is bent to the front side of the substrate 2. These bent portions are fixed to the blocks 34, 34, 36, and 36 by bolts 32b, 32b, 32c, and 32c, and the substrate 2 is mechanically supported on the blocks 34, 34, 36, and 36. Thus, since the terminals 6b and 6c have a large area and protrude outside the substrate 2, the heat from the semiconductor module 4 is efficiently radiated from the wide surfaces of the terminals 6b and 6c.

  Moreover, the surface (surface on the base 12 side) opposite to the surface on which the mounting portions 16a, 16b, and 16c in each semiconductor module 4 are provided is a heat radiating means, as shown in FIGS. For example, it is attached to the heat sink 37. The heat sink 37 is located above the upper end of the substrate 2 and is sized to cover the entire back side of the substrate 2.

  Since the bent portion of the terminal 6a is in the notch 27, the insulation distance is increased in the vertical direction of the substrate 2 as compared with the case where the bent portion of the terminal 6a is passed through the lower edge of the substrate 2 without forming the notch 27. It is getting bigger.

  In addition, both sides of the terminal 6b and the terminal 6c have their upper ends cut off to form a space together with the lower edge of the board 2 cut off, and this is connected to the mounting bracket 30. This is because the code 38 is easily pulled out to the back side of the substrate 2.

  In this semiconductor element mounting substrate, terminals 6a, 6b, 6c and mounting portions 16a, 16b, 16c of the semiconductor module 4 are provided on the semiconductor element patterns 22a, 22b, 22c on the back surface side of the substrate 2 on which the component 8 is surface-mounted. The terminals 6a, 6b, 6c and the semiconductor module 4 can be attached to the substrate 2 with bolts 26a, 26b, 26c from the surface side of the substrate 2 and can be electrically connected. Thus, the mounting of the semiconductor module 4 to the substrate 2, the connection to the terminals 6a, 6b, 6c of the semiconductor module 4 and the connection of the semiconductor module 4 of the component 8 can be performed only by screwing the bolts 26a, 26b, 26c. Assembly work can be facilitated. The terminals 6a, 6b, and 6c extend from the substrate 2 to the outside, and the other end protruding from the terminal 6a is on the front surface side of the substrate 2, and the adjacent terminals 6b and 6c are on the back surface side of the substrate 2. Since the board 2 is spaced forward and backward, the size of the protruding portion of each terminal 6a, 6b, 6c and the degree of freedom in designing the shape are increased, and the area can be increased. Therefore, the heat of the semiconductor module 4 can be efficiently radiated from the terminals 6a, 6b, and 6c having a large area.

  Moreover, since the semiconductor element patterns 22a, 22b, and 22c have a larger area than the mounting portions 16a, 16b, and 16c of the semiconductor module 4, the heat dissipation effect of the semiconductor module 4 can be enhanced.

  Since the component 8 is surface-mounted on the substrate 2, the component 8 does not have a lead and is fixed on the substrate 2. Therefore, when the device using the semiconductor element mounting substrate is transported, vibration is generated in the semiconductor. Even if it is added to the element mounting board, failure due to disconnection of component leads does not occur. Further, since the heat sink 37 for the semiconductor module is large enough to cover the entire back surface of the substrate 2, the heat released from the component 8 is absorbed by the heat sink 37.

  In each of the above embodiments, the semiconductor module 4 has three attachment portions. However, the present invention is not limited to this, and a semiconductor module having at least two attachment portions can be used. In the above embodiment, the component 8 is for the snubber circuit. However, the present invention is not limited to this, and a component according to the application of the semiconductor module 4 can be used. Moreover, although the component 8 was provided in the surface side of the board | substrate 2, it can replace with the surface side or can attach a component to the back surface side in addition to the surface side. In the above embodiment, the terminal 6a is a Z-fitting-shaped one, and the terminals 6b and 6c are L-shaped fittings. However, the present invention is not limited to these, and all the terminals are one of the substrates 2. Any shape can be used as long as it can be attached to the surface.

2 Substrate 4 Semiconductor module (semiconductor element)
6a 6b 6c Terminal 8 Parts 26a 26b 26c Bolt (coupling means)

Claims (4)

A semiconductor element having a mounting portion for connection to an external electric circuit;
A component to be connected to the semiconductor element is attached, and a semiconductor connection pattern having a through hole corresponding to the attachment portion of the semiconductor element and provided in contact with the attachment portion is formed around the through hole. A substrate in which the mounting portion of the semiconductor element is arranged so as to coincide with the through hole;
Terminals attached to the substrate and the semiconductor element by coupling means partially contacting the substrate and penetrating through the part and coupled to the mounting portion of the semiconductor element through the through hole of the substrate And
Have
A semiconductor element mounting substrate in which the terminals protrude outward from the substrate.   2. The semiconductor element mounting board according to claim 1, wherein the component is surface-mounted on the board.   3. The semiconductor element mounting substrate according to claim 2, wherein the semiconductor element constitutes a snubber circuit, and the component is a component of the snubber circuit.   2. The semiconductor element mounting board according to claim 1, wherein a semiconductor connection pattern around the through hole has an area larger than an area of the mounting portion of the semiconductor element.

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