JP6710320B2 - Vehicle power converter - Google Patents

Vehicle power converter Download PDF

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Publication number
JP6710320B2
JP6710320B2 JP2019508332A JP2019508332A JP6710320B2 JP 6710320 B2 JP6710320 B2 JP 6710320B2 JP 2019508332 A JP2019508332 A JP 2019508332A JP 2019508332 A JP2019508332 A JP 2019508332A JP 6710320 B2 JP6710320 B2 JP 6710320B2
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main surface
groove
electronic component
base
heat
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JP2019508332A
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JPWO2018179031A1 (en
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宏和 高林
宏和 高林
良介 中川
良介 中川
一法師　茂俊
茂俊 一法師
健 篠▲崎▼
健 篠▲崎▼
裕之 牛房
裕之 牛房
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Description

この発明は、冷却装置を備えた車両用電力変換装置に関する。 The present invention relates to a vehicle power conversion device including a cooling device.

電力変換装置が有する半導体素子はスイッチング動作時に熱を発生させる。半導体素子が発生させる熱を放熱するために、電力変換装置には冷却装置が設けられる。特許文献１に開示されるヒートパイプを備えるヒートシンクは、ベース板に対してヒートパイプをほぼ全長に亘り埋設させて構成される。ヒートパイプは、ベース板に形成された埋め込み溝に挿入されてから、半田で埋め込まれる。特許文献２に開示される電力変換装置は、鉄道車両の床下に設けられる。該電力変換装置において、受熱部材の一方の面にはパワー半導体モジュールが設置され、他方の面には、ヒートパイプが埋め込まれる。ヒートパイプは、半田付けによって受熱部材と熱的に接続されている。 The semiconductor element included in the power conversion device generates heat during the switching operation. A cooling device is provided in the power conversion device to radiate the heat generated by the semiconductor element. The heat sink including the heat pipe disclosed in Patent Document 1 is configured by embedding the heat pipe in the base plate over substantially the entire length. The heat pipe is inserted into the embedding groove formed in the base plate and then embedded with solder. The power conversion device disclosed in Patent Document 2 is provided under the floor of a railway vehicle. In the power conversion device, the power semiconductor module is installed on one surface of the heat receiving member, and the heat pipe is embedded on the other surface. The heat pipe is thermally connected to the heat receiving member by soldering.

特許第４４９１２０９号公報Japanese Patent No. 4491209 特許第５５６０１８２号公報Patent No. 5560182

特許文献１に開示されるヒートシンクにおいては、ベース板とヒートパイプとの間に設けられる半田によって、熱抵抗が増大する。特許文献２に開示される電力変換装置においては、受熱部材とヒートパイプとの間に設けられる半田によって、熱抵抗が増大する。熱抵抗が増大すると、冷却装置の冷却効率は低下してしまう。 In the heat sink disclosed in Patent Document 1, the thermal resistance increases due to the solder provided between the base plate and the heat pipe. In the power conversion device disclosed in Patent Document 2, the thermal resistance increases due to the solder provided between the heat receiving member and the heat pipe. When the thermal resistance increases, the cooling efficiency of the cooling device decreases.

本発明は上述の事情に鑑みてなされたものであり、車両用電力変換装置の冷却性能を向上させることが目的である。 The present invention has been made in view of the above circumstances, and an object thereof is to improve the cooling performance of a vehicle power conversion device.

上記目的を達成するために、本発明の車両用電力変換装置は、電子部品が内部に格納され、開口が形成され、車両に取り付けられる筐体、筐体に取り付けられるベース、および複数の放熱部を備える。ベースは、水平方向に対向する第１の主面および第２の主面を有する板状部材である。ベースの内部には、第１の主面および第２の主面に沿って伸びて、冷媒が封入される溝が形成される。ベースは、第１の主面が筐体の内側に面する向きで、開口を塞ぐ。第１の主面に電子部品が取り付けられる。複数の放熱部は、互いに間隔を空けて、第２の主面に接合される。溝は、第１の主面と第２の主面とが対向する方向を中心軸とする環状の形状を有する環状の溝である。複数の環状の溝は、水平方向に並べて形成される。第１の主面の内、水平方向に隣接する複数の環状の溝のそれぞれの一部に対向する部分に、電子部品が取り付けられる。 In order to achieve the above object, a power converter for a vehicle of the present invention includes a housing in which electronic components are stored, an opening is formed, a housing mounted in a vehicle, a base mounted in the housing, and a plurality of heat dissipation portions. Equipped with. The base is a plate-shaped member having a first main surface and a second main surface that face each other in the horizontal direction. Inside the base, Shin along the first main surface and a second main surface the Activity, a groove refrigerant Ru is sealed is made form. The base closes the opening so that the first main surface faces the inside of the housing. The electronic component is attached to the first main surface. A plurality of heat radiation member, spaced apart from each other, are joined to the second major surface. The groove is an annular groove having an annular shape whose center axis is in the direction in which the first main surface and the second main surface face each other. The plurality of annular grooves are formed side by side in the horizontal direction. The electronic component is attached to a portion of the first main surface that faces a part of each of the plurality of annular grooves that are horizontally adjacent to each other.

本発明によれば、冷媒が封入される溝が内部に形成されるベースの面に、互いに間隔をあけて、複数の放熱部を接合することで、車両用電力変換装置の冷却性能を向上させることが可能である。 ADVANTAGE OF THE INVENTION According to this invention, the cooling performance of a vehicle power converter is improved by joining the some heat dissipation part to the surface of the base in which the groove|channel in which a refrigerant|coolant is enclosed is mutually spaced. It is possible.

本発明の実施の形態１に係る冷却装置の側面図The side view of the cooling device which concerns on Embodiment 1 of this invention. 実施の形態１に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 1. 実施の形態１に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 1. 実施の形態１に係る電力変換装置の断面図Sectional drawing of the power converter device which concerns on Embodiment 1. 実施の形態１に係る電力変換装置の断面図Sectional drawing of the power converter device which concerns on Embodiment 1. 実施の形態１に係る電力変換装置の車両への搭載例を示す図The figure which shows the example of mounting in the vehicle of the power converter device which concerns on Embodiment 1. 本発明の実施の形態２に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 2 of this invention. 実施の形態２に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 2. 実施の形態２に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 2. 本発明の実施の形態３に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る冷却装置の断面図Sectional drawing of the cooling device which concerns on Embodiment 4 of this invention.

以下、本発明の実施の形態について図面を参照して詳細に説明する。なお図中、同一または同等の部分には同一の符号を付す。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or equivalent parts are designated by the same reference numerals.

（実施の形態１）
図１は、本発明の実施の形態１に係る冷却装置の側面図である。冷却装置１は、板状部材であるベース１０およびベース１０に取り付けられる複数の放熱部２０を備える。放熱部２０の数は任意である。図１の例では、放熱部２０は、フィンである。ベース１０は、電子部品が取り付けられる第１の主面１１、および第１の主面１１と対向する第２の主面１２を有する。放熱部２０は、第２の主面１２に取り付けられる。冷却装置１は、第１の主面１１に取り付けられる電子部品を冷却する。(Embodiment 1)
1 is a side view of a cooling device according to Embodiment 1 of the present invention. The cooling device 1 includes a base 10 that is a plate-shaped member and a plurality of heat dissipation portions 20 attached to the base 10. The number of heat dissipation parts 20 is arbitrary. In the example of FIG. 1, the heat dissipation part 20 is a fin. The base 10 has a first main surface 11 to which electronic components are attached, and a second main surface 12 facing the first main surface 11. The heat dissipation portion 20 is attached to the second main surface 12. The cooling device 1 cools electronic components mounted on the first main surface 11.

図２は、実施の形態１に係る冷却装置の断面図である。ベース１０の内部には、第１の主面１１および第２の主面１２に沿って伸びる溝１３が形成される。溝１３には、冷媒１４が封入される。冷媒１４は、気体の状態である冷媒１４と、液体の状態である冷媒１４とが混在する、気液二相の状態である。冷媒は、例えば、純水、エタノール、アセトン等である。 FIG. 2 is a cross-sectional view of the cooling device according to the first embodiment. A groove 13 extending along the first main surface 11 and the second main surface 12 is formed inside the base 10. A coolant 14 is sealed in the groove 13. The refrigerant 14 is in a gas-liquid two-phase state in which the refrigerant 14 in the gas state and the refrigerant 14 in the liquid state are mixed. The coolant is, for example, pure water, ethanol, acetone or the like.

図３は、実施の形態１に係る冷却装置の断面図である。図３は、図２のＡ−Ａ線での断面図である。実施の形態１では、第１の主面１１と第２の主面１２とに沿って、それぞれが水平方向に伸びる複数の溝１３が、鉛直方向に並べて形成される。実施の形態１の例では、放熱部２０は、鉛直方向に伸びるフィンであるが、放熱部２０を取り付ける向きは任意である。放熱部２０は、水平方向に伸びるフィンでもよい。放熱部２０として、溝１３と同じ方向に伸びるフィンを設けることで、車両用電力変換装置２の冷却性能を向上させることが可能である。またフィンが伸びる方向を車両の進行方向に一致させることで、走向風を放熱部２０に接触させることができるため、車両用電力変換装置２の冷却性能を向上させることが可能である。図３において、破線で示す箇所は、第１の主面１１において、後述する電子部品が取り付けられる箇所と対向する箇所である。すなわち、図３において、破線で示す箇所が、電子部品での発熱によって、温度が上昇する箇所である。溝１３のそれぞれに封入される冷媒１４の温度は、冷媒１４の対流により、水平方向に均一化される。そのため、第１の主面１１に取り付けられる、後述する電子部品の温度は、水平方向に均一化される。 FIG. 3 is a cross-sectional view of the cooling device according to the first embodiment. FIG. 3 is a sectional view taken along line AA of FIG. In the first embodiment, along the first main surface 11 and the second main surface 12, a plurality of grooves 13 each extending in the horizontal direction are formed side by side in the vertical direction. In the example of the first embodiment, the heat dissipation part 20 is a fin extending in the vertical direction, but the direction in which the heat dissipation part 20 is attached is arbitrary. The heat dissipation part 20 may be a fin extending in the horizontal direction. By providing the fins extending in the same direction as the groove 13 as the heat dissipation portion 20, it is possible to improve the cooling performance of the vehicle power conversion device 2. Further, by making the direction in which the fins extend coincide with the traveling direction of the vehicle, it is possible to bring the headwind into contact with the heat dissipation portion 20, and therefore it is possible to improve the cooling performance of the vehicle power conversion device 2. In FIG. 3, a portion indicated by a broken line is a portion of the first main surface 11 that faces a portion to which an electronic component described later is attached. That is, in FIG. 3, the part indicated by the broken line is the part where the temperature rises due to heat generation in the electronic component. The temperature of the coolant 14 sealed in each of the grooves 13 is made uniform in the horizontal direction by the convection of the coolant 14. Therefore, the temperatures of the electronic components, which will be described later, attached to the first main surface 11 are made uniform in the horizontal direction.

図４は、実施の形態１に係る電力変換装置の断面図である。図５は、実施の形態１に係る電力変換装置の断面図である。図５は、図４のＢ−Ｂ線での断面図である。図６は、実施の形態１に係る車両用電力変換装置の車両への搭載例を示す図である。車両用電力変換装置２は、筐体３および冷却装置１を備える。筐体３の内部には、電子部品６が格納される。筐体３には、開口７が形成される。車両１００の床下に、車両用電力変換装置２の筐体３が取り付けられる。冷却装置１は筐体３に取り付けられる。冷却装置１のベース１０が開口７を塞ぐ。ベース１０の第１の主面１１は、筐体３の内側に面する。電子部品６が第１の主面１１に取り付けられる。ベース１０には溝１３が形成されるため、第１の主面１１と第２の主面１２が対向する方向のベース１０の厚みは、筐体３の厚みより厚い。図４の例では、冷却装置１は、カバー４で覆われる。カバー４には、通気口５が形成される。通気口５から流入した空気が、放熱部２０に接触しながら流れる。放熱部２０から空気に熱が伝達されることで、電子部品６が冷却される。 FIG. 4 is a cross-sectional view of the power conversion device according to the first embodiment. FIG. 5 is a cross-sectional view of the power conversion device according to the first embodiment. FIG. 5 is a sectional view taken along line BB of FIG. FIG. 6 is a diagram showing an example of mounting the vehicle power conversion device according to the first embodiment on a vehicle. The vehicle power conversion device 2 includes a housing 3 and a cooling device 1. An electronic component 6 is stored inside the housing 3. An opening 7 is formed in the housing 3. Under the floor of the vehicle 100, the housing 3 of the vehicle power converter 2 is attached. The cooling device 1 is attached to the housing 3. The base 10 of the cooling device 1 closes the opening 7. The first main surface 11 of the base 10 faces the inside of the housing 3. The electronic component 6 is attached to the first main surface 11. Since the groove 13 is formed in the base 10, the thickness of the base 10 in the direction in which the first main surface 11 and the second main surface 12 face each other is larger than the thickness of the housing 3. In the example of FIG. 4, the cooling device 1 is covered with the cover 4. Vents 5 are formed in the cover 4. The air flowing in from the ventilation port 5 flows while coming into contact with the heat dissipation part 20. The heat is transferred from the heat dissipation unit 20 to the air, so that the electronic component 6 is cooled.

冷却装置１による電子部品６の冷却について説明する。電子部品６で生じた熱は、ベース１０の第１の主面１１を介して、冷媒１４に伝達される。電子部品６から伝達された熱によって、液状の冷媒１４の温度が上昇し、冷媒１４は気体に変化する。気体に変化した冷媒１４は、溝１３の内部において、より温度が低い箇所に流れる。冷媒１４が溝１３の内部を、温度が低い箇所に向かって流れる間に、冷媒１４から第２の主面１２を介して、放熱部２０に熱が伝達される。放熱部２０に熱を伝達した冷媒１４の温度は下がり、冷媒１４は液体に変化する。冷媒１４から熱を伝達された放熱部２０は、放熱部２０に接触しながら流れる空気に熱を伝達する。空気に熱を伝達することで、放熱部２０が冷却される。上述のように、電子部品６で生じた熱が、冷媒１４および放熱部２０を介して空気に伝達され、電子部品６が冷却される。 The cooling of the electronic component 6 by the cooling device 1 will be described. The heat generated in the electronic component 6 is transferred to the coolant 14 via the first main surface 11 of the base 10. Due to the heat transferred from the electronic component 6, the temperature of the liquid coolant 14 rises, and the coolant 14 changes to gas. The refrigerant 14 that has changed to a gas flows inside the groove 13 to a location where the temperature is lower. While the coolant 14 flows through the inside of the groove 13 toward the place where the temperature is low, heat is transferred from the coolant 14 to the heat radiating section 20 via the second main surface 12. The temperature of the refrigerant 14 that has transferred the heat to the heat radiating portion 20 decreases, and the refrigerant 14 changes to a liquid. The heat radiating part 20 to which the heat is transferred from the refrigerant 14 transfers the heat to the air flowing while contacting the heat radiating part 20. The heat dissipation part 20 is cooled by transferring heat to the air. As described above, the heat generated in the electronic component 6 is transferred to the air via the refrigerant 14 and the heat radiating portion 20, and the electronic component 6 is cooled.

溝１３の内面には、毛細管現象を発生させることで、冷媒１４の流動を促進する構造、例えばウィッグ、グルーブ、メッシュ等が設けられる。ベース１０および放熱部２０の材質は、例えばアルミニウムである。放熱部２０は、例えばろう付け、摩擦攪拌接合等によって、第２の主面１２に接合される。板状部材の一方の面に溝１３を彫り、溝１３に冷媒１４を流し入れた後、該板状部材に別の板状部材を接合して溝１３を塞ぐことで、ベース１０を形成することができる。また第１の主面１１および第２の主面１２を有する板状部材の側面から溝１３を彫り、溝１３に冷媒１４を流し入れた後、側面を塞ぐことで、ベース１０を形成してもよい。 The inner surface of the groove 13 is provided with a structure, such as a wig, a groove, or a mesh, which promotes the flow of the refrigerant 14 by generating a capillary phenomenon. The material of the base 10 and the heat dissipation part 20 is, for example, aluminum. The heat dissipation portion 20 is joined to the second main surface 12 by brazing, friction stir welding, or the like. Forming the base 10 by carving the groove 13 on one surface of the plate-shaped member, pouring the coolant 14 into the groove 13, and then joining another plate-shaped member to the plate-shaped member to close the groove 13. You can Further, even if the base 10 is formed by engraving the groove 13 from the side surface of the plate-shaped member having the first main surface 11 and the second main surface 12, pouring the coolant 14 into the groove 13, and then closing the side surface. Good.

実施の形態１では、電子部品６からベース１０の第１の主面１１を介して冷媒１４に熱が伝達され、冷媒１４から第２の主面１２を介して放熱部２０に熱が伝達される。ヒートパイプをベースプレートに半田付けするヒートパイプ冷却器と比べて、電子部品６と冷媒１４との間の熱抵抗、および冷媒１４と放熱部２０との間の熱抵抗は低いため、該ヒートパイプ冷却器より、実施の形態１に係る冷却装置１の冷却性能は高い。 In the first embodiment, heat is transferred from the electronic component 6 to the coolant 14 via the first main surface 11 of the base 10, and heat is transferred from the coolant 14 to the heat dissipation unit 20 via the second main surface 12. It The heat resistance between the electronic component 6 and the refrigerant 14 and the heat resistance between the refrigerant 14 and the heat radiating portion 20 are lower than those of a heat pipe cooler in which the heat pipe is soldered to the base plate. The cooling performance of the cooling device 1 according to the first embodiment is higher than that of the cooling device.

電子部品６は、電力変換装置であり、例えばインバータである。電子部品６は、例えば、ケイ素に比べてバンドギャップが大きいワイドバンドギャップ半導体によって形成される、スイッチング素子、ダイオード等の電子素子を有する。ワイドバンドギャップ半導体とは、例えば、炭化ケイ素、窒化ガリウム系材料、ダイヤモンド等である。ワイドバンドギャップ半導体によって形成されたスイッチング素子を用いると、スイッチング速度が速くなるため、電子部品６で生じる熱が増大する。実施の形態１に係る冷却装置１を設けることで、ワイドバンドギャップ半導体によって形成された電子素子を有する電子部品６を十分に冷却することが可能である。 The electronic component 6 is a power conversion device, for example, an inverter. The electronic component 6 has an electronic element such as a switching element or a diode formed of a wide bandgap semiconductor having a bandgap larger than that of silicon, for example. The wide band gap semiconductor is, for example, silicon carbide, gallium nitride-based material, diamond or the like. When the switching element formed of the wide band gap semiconductor is used, the switching speed is increased, so that the heat generated in the electronic component 6 is increased. By providing the cooling device 1 according to the first embodiment, it is possible to sufficiently cool the electronic component 6 having the electronic element formed of the wide band gap semiconductor.

以上説明したとおり、本実施の形態１に係る車両用電力変換装置２によれば、冷媒１４が封入される溝１３が内部に形成されるベース１０の第２の主面１２に、互いに間隔をあけて、複数の放熱部２０を接合することで、車両用電力変換装置２の冷却性能を向上させることが可能である。また水平方向に伸びる溝１３をベース１０の内部に形成することで、電子部品６の温度を、水平方向に均一化することが可能である。放熱部２０として、溝１３と同じ方向に伸びるフィンを設けることで、車両用電力変換装置２の冷却性能を向上させることが可能である。水平方向に伸びる溝１３がベース１０の内部に形成されているため、実施の形態１に係る車両用電力変換装置２は、水平方向に温度のばらつきが生じ得る冷却方法、例えば水平方向に流れる走向風を利用した冷却方法に適している。 As described above, according to the vehicle electric power converter 2 of the first embodiment, the second main surface 12 of the base 10 in which the groove 13 in which the refrigerant 14 is sealed is formed is spaced from each other. It is possible to improve the cooling performance of the vehicular electric power conversion device 2 by connecting the plurality of heat radiating portions 20 apart. Further, by forming the groove 13 extending in the horizontal direction inside the base 10, it is possible to make the temperature of the electronic component 6 uniform in the horizontal direction. By providing the fins extending in the same direction as the groove 13 as the heat dissipation portion 20, it is possible to improve the cooling performance of the vehicle power conversion device 2. Since the groove 13 extending in the horizontal direction is formed inside the base 10, the power conversion device 2 for a vehicle according to the first embodiment is provided with a cooling method in which the temperature may vary in the horizontal direction, for example, a strike that flows in the horizontal direction. Suitable for cooling method using wind.

（実施の形態２）
図７は、本発明の実施の形態２に係る冷却装置の断面図である。図８は、実施の形態２に係る冷却装置の断面図である。図８は、図７のＣ−Ｃ線における断面図である。実施の形態２に係る冷却装置１のベース１０においては、実施の形態１と異なり、それぞれが鉛直方向に伸びる複数の溝１５が、水平方向に並べて形成される。放熱部２０は、実施の形態１と同様に、第２の主面１２に接合される。(Embodiment 2)
FIG. 7 is a cross-sectional view of the cooling device according to the second exemplary embodiment of the present invention. FIG. 8 is a cross-sectional view of the cooling device according to the second embodiment. FIG. 8 is a sectional view taken along the line CC of FIG. In the base 10 of the cooling device 1 according to the second embodiment, unlike the first embodiment, a plurality of grooves 15 each extending in the vertical direction are formed side by side in the horizontal direction. The heat dissipation part 20 is joined to the second main surface 12 as in the first embodiment.

実施の形態１と同様に、冷却装置１によって、電子部品６が冷却される。図７の例では、気体に変化した冷媒１４は、溝１５の内部において、より温度が低い箇所に流れる。冷媒１４が鉛直方向に移動するため、第１の主面１１に取り付けられる電子部品６の温度は、鉛直方向に均一化される。 Similar to the first embodiment, the cooling device 1 cools the electronic component 6. In the example of FIG. 7, the refrigerant 14 that has changed to a gas flows inside the groove 15 at a location where the temperature is lower. Since the refrigerant 14 moves in the vertical direction, the temperature of the electronic component 6 attached to the first main surface 11 is made uniform in the vertical direction.

図９は、実施の形態２に係る冷却装置の断面図である。図９に示す冷却装置１においては、複数の溝１５の内、少なくとも一部の溝１５の鉛直方向の下端を連結するバイパス１６が形成される。バイパス１６を設けることで、バイパス１６において冷媒１４が対流し、冷媒１４の温度は、対流により、水平方向において均一化される。そのため、バイパス１６と対向する第１の主面１１の一部に取り付けられる電子部品６の温度は、水平方向に均一化される。 FIG. 9 is a cross-sectional view of the cooling device according to the second embodiment. In the cooling device 1 shown in FIG. 9, a bypass 16 that connects the lower ends in the vertical direction of at least some of the plurality of grooves 15 is formed. By providing the bypass 16, the refrigerant 14 convects in the bypass 16, and the temperature of the refrigerant 14 is made uniform in the horizontal direction by the convection. Therefore, the temperature of the electronic component 6 attached to a part of the first main surface 11 facing the bypass 16 is made uniform in the horizontal direction.

以上説明したとおり、本実施の形態２に係る車両用電力変換装置２によれば、冷媒１４が封入される溝１５が内部に形成されるベース１０の第２の主面１２に、互いに間隔をあけて、複数の放熱部２０を接合することで、車両用電力変換装置２の冷却性能を向上させることが可能である。また鉛直方向に伸びる溝１５をベース１０の内部に形成することで、電子部品６の温度を、鉛直方向に均一化することが可能である。放熱部２０として、溝１５と同じ方向に伸びるフィンを設けることで、車両用電力変換装置２の冷却性能を向上させることが可能である。鉛直方向に伸びる溝１５がベース１０の内部に形成されているため、実施の形態２に係る車両用電力変換装置２は、鉛直方向に温度のばらつきが生じ得る冷却方法、例えば自然対流を利用した冷却方法に適している。 As described above, according to the vehicle electric power converter 2 of the second embodiment, the second main surface 12 of the base 10 in which the groove 15 in which the refrigerant 14 is sealed is formed is spaced from each other. It is possible to improve the cooling performance of the vehicular electric power conversion device 2 by connecting the plurality of heat radiating portions 20 apart. Further, by forming the groove 15 extending in the vertical direction inside the base 10, it is possible to make the temperature of the electronic component 6 uniform in the vertical direction. By providing the fins extending in the same direction as the groove 15 as the heat dissipation portion 20, it is possible to improve the cooling performance of the vehicle power conversion device 2. Since the groove 15 extending in the vertical direction is formed inside the base 10, the vehicle power conversion device 2 according to the second embodiment uses a cooling method that may cause temperature variations in the vertical direction, for example, natural convection. Suitable for cooling method.

（実施の形態３）
図１０は、本発明の実施の形態３に係る冷却装置の断面図である。実施の形態３に係る冷却装置１のベース１０においては、実施の形態１と異なり、第１の主面１１と第２の主面１２とが対向する方向を中心軸とする環状の形状を有する溝１７が形成される。放熱部２０は、実施の形態１と同様に、第２の主面１２に接合される。(Embodiment 3)
FIG. 10 is a cross-sectional view of the cooling device according to the third exemplary embodiment of the present invention. Unlike the first embodiment, the base 10 of the cooling device 1 according to the third embodiment has an annular shape whose central axis is in the direction in which the first main surface 11 and the second main surface 12 face each other. The groove 17 is formed. The heat dissipation part 20 is joined to the second main surface 12 as in the first embodiment.

実施の形態１と同様に、冷却装置１によって、電子部品６が冷却される。図１０において破線で示すように、溝１７の一部と対向する第１の主面１１の箇所に電子部品６を取り付けることで、図１０において実線の矢印で示すように、冷媒１４が対流する。冷媒１４の対流により、第１の主面１１に取り付けられる電子部品６の温度は、均一化される。 Similar to the first embodiment, the cooling device 1 cools the electronic component 6. As shown by a broken line in FIG. 10, the electronic component 6 is attached to a portion of the first main surface 11 that faces a part of the groove 17, so that the refrigerant 14 convects as shown by a solid arrow in FIG. .. Due to the convection of the coolant 14, the temperature of the electronic component 6 attached to the first main surface 11 is made uniform.

以上説明したとおり、本実施の形態３に係る車両用電力変換装置２によれば、冷媒１４が封入される溝１７が内部に形成されるベース１０の第２の主面１２に、互いに間隔をあけて、複数の放熱部２０を接合することで、車両用電力変換装置２の冷却性能を向上させることが可能である。また環状の溝１７をベース１０に形成することで、電子部品６の温度を、均一化することが可能である。 As described above, according to the vehicle electric power converter 2 of the third embodiment, the second main surface 12 of the base 10 in which the groove 17 in which the refrigerant 14 is sealed is formed is spaced from each other. It is possible to improve the cooling performance of the vehicular electric power conversion device 2 by connecting the plurality of heat radiating portions 20 apart. By forming the annular groove 17 in the base 10, the temperature of the electronic component 6 can be made uniform.

（実施の形態４）
図１１は、本発明の実施の形態４に係る冷却装置の断面図である。実施の形態４に係る冷却装置１のベース１０においては、実施の形態１と異なり、少なくとも１つの分岐を有する溝１８が形成される。(Embodiment 4)
FIG. 11 is a sectional view of a cooling device according to Embodiment 4 of the present invention. In the base 10 of the cooling device 1 according to the fourth embodiment, unlike the first embodiment, the groove 18 having at least one branch is formed.

図１１において破線で示すように、溝１８の一部と対向する第１の主面１１の箇所に電子部品６を取り付けることで、少なくとも１つの分岐を有する溝１８を冷媒１４が対流する。冷媒１４の対流により、電子部品６の温度を、均一化することが可能である。また分岐を有する溝１８を形成することで、放熱部２０全体に熱を伝達することが可能となり、車両用電力変換装置２の冷却性能を向上させることが可能である。 As shown by a broken line in FIG. 11, the electronic component 6 is attached to a portion of the first main surface 11 that faces a part of the groove 18, so that the refrigerant 14 convects the groove 18 having at least one branch. The convection of the coolant 14 makes it possible to make the temperature of the electronic component 6 uniform. Further, by forming the groove 18 having a branch, it becomes possible to transfer heat to the entire heat radiating portion 20, and it is possible to improve the cooling performance of the vehicle power conversion device 2.

以上説明したとおり、本実施の形態４に係る車両用電力変換装置２によれば、冷媒１４が封入される溝１８が内部に形成されるベース１０の第２の主面１２に、互いに間隔をあけて、複数の放熱部２０を接合することで、車両用電力変換装置２の冷却性能を向上させることが可能である。また少なくとも１つの分岐を有する溝１８をベース１０に形成することで、電子部品６の温度を、均一化すること、および放熱部２０全体に熱を伝達することにより、車両用電力変換装置２の冷却性能を向上させることが可能である。 As described above, according to the vehicle electric power converter 2 of the fourth embodiment, the second main surface 12 of the base 10 in which the groove 18 in which the refrigerant 14 is sealed is formed has a space therebetween. It is possible to improve the cooling performance of the vehicular electric power conversion device 2 by connecting the plurality of heat radiating portions 20 apart. In addition, by forming the groove 18 having at least one branch in the base 10, the temperature of the electronic component 6 is made uniform, and the heat is transferred to the entire heat radiating portion 20, so that the power conversion device 2 for the vehicle is provided. It is possible to improve the cooling performance.

本発明は、上述の実施の形態に限られず、上述の実施の形態の内、任意の実施の形態を組み合わせてもよい。放熱部２０の形状はフィンに限られず、例えば剣山状、蛇腹状等の形状でもよい。冷却装置１が車両用電力変換装置２に取り付けられる向きは、上述の例に限られない。例えば、第１の主面１１と第２の主面１２とは鉛直方向に対向し、冷却装置１は、車両用電力変換装置２の鉛直方向の上面に形成された開口７を塞いで、車両用電力変換装置２に取り付けられてもよい。上述の例では、ベース１０は、筐体３の外側から開口７を塞ぐが、ベース１０は、筐体３の内部に設けられ、筐体３の内側から開口７を塞ぎ、開口７から放熱部２０が筐体３の外側に突出してもよい。 The present invention is not limited to the above-described embodiments, and any of the above-described embodiments may be combined. The shape of the heat dissipation portion 20 is not limited to the fin, and may be, for example, a sword mountain shape, a bellows shape, or the like. The direction in which the cooling device 1 is attached to the vehicle power conversion device 2 is not limited to the above example. For example, the first main surface 11 and the second main surface 12 face each other in the vertical direction, and the cooling device 1 closes the opening 7 formed in the upper surface in the vertical direction of the vehicle power conversion device 2 so that the vehicle It may be attached to the power conversion device 2. In the above-described example, the base 10 closes the opening 7 from the outside of the housing 3, but the base 10 is provided inside the housing 3, closes the opening 7 from the inside of the housing 3, and radiates from the opening 7. 20 may protrude to the outside of the housing 3.

本発明は、本発明の広義の精神と範囲を逸脱することなく、様々な実施の形態及び変形が可能とされるものである。また、上述した実施の形態は、この発明を説明するためのものであり、本発明の範囲を限定するものではない。すなわち、本発明の範囲は、実施の形態ではなく、特許請求の範囲によって示される。そして、特許請求の範囲内及びそれと同等の発明の意義の範囲内で施される様々な変形が、この発明の範囲内とみなされる。 The present invention allows various embodiments and modifications without departing from the broad spirit and scope of the present invention. Further, the above-described embodiments are for explaining the present invention and do not limit the scope of the present invention. That is, the scope of the present invention is shown not by the embodiments but by the scope of the claims. Various modifications made within the scope of the claims and within the scope of the meaning of the invention equivalent thereto are regarded as within the scope of the present invention.

１ 冷却装置、２ 車両用電力変換装置、３ 筐体、４ カバー、５ 通気口、６ 電子部品、７ 開口、１０ ベース、１１ 第１の主面、１２ 第２の主面、１３，１５，１７，１８ 溝 １４ 冷媒、１６ バイパス、２０ 放熱部、１００ 車両。 DESCRIPTION OF SYMBOLS 1 cooling device, 2 electric power converter for vehicles, 3 housing, 4 cover, 5 ventilation holes, 6 electronic parts, 7 openings, 10 base, 11 1st main surface, 12 2nd main surface, 13, 15, 17, 18 groove 14 refrigerant, 16 bypass, 20 heat dissipation part, 100 vehicle.

Claims (4)

電子部品が内部に格納され、開口が形成され、車両に取り付けられる筐体と、
水平方向に対向する第１の主面および第２の主面を有する板状部材であって、前記第１の主面および前記第２の主面に沿って伸びて、冷媒が封入される溝が内部に形成され、前記第１の主面が前記筐体の内側に面する向きで前記開口を塞ぎ、前記第１の主面に前記電子部品が取り付けられ、前記筐体に取り付けられるベースと、
互いに間隔を空けて、前記第２の主面に接合される複数の放熱部と、を備え、
前記溝は、前記第１の主面と前記第２の主面とが対向する方向を中心軸とする環状の形状を有する環状の溝であって、
複数の前記環状の溝が、水平方向に並べて形成され、
前記第１の主面の内、水平方向に隣接する複数の前記環状の溝のそれぞれの一部に対向する部分に、前記電子部品が取り付けられる、
車両用電力変換装置。 A housing in which electronic components are stored, an opening is formed, and which is attached to a vehicle,
A plate-shaped member having a first main surface and a second main surface facing each other in the horizontal direction, the groove extending along the first main surface and the second main surface and in which a refrigerant is enclosed. A base that is formed inside and that closes the opening in a direction in which the first main surface faces the inside of the housing, the electronic component is attached to the first main surface, and is attached to the housing. ,
A plurality of heat dissipating portions that are joined to the second main surface with a space between each other;
The groove is an annular groove having an annular shape with a central axis in a direction in which the first main surface and the second main surface face each other,
A plurality of the annular grooves are formed side by side in the horizontal direction,
In the first main surface, the electronic component is attached to a portion facing a part of each of the plurality of annular grooves that are horizontally adjacent to each other.
Vehicle power converter. 前記ベースおよび前記放熱部の材質はアルミニウムである、
請求項１に記載の車両用電力変換装置。 The material of the base and the heat dissipation portion is aluminum,
The vehicle power converter according to claim 1 . 前記放熱部は、前記第２の主面にろう付けされる、
請求項２に記載の車両用電力変換装置。 The heat dissipation part is brazed to the second main surface,
The electric power converter for a vehicle according to claim 2 . 前記電子部品は、炭化ケイ素、窒化ガリウム系材料、またはダイヤモンドを用いたワイドバンドギャップ半導体によって形成される電子素子を有する、
請求項１から３のいずれか１項に記載の車両用電力変換装置。 The electronic component has an electronic element formed of a wide band gap semiconductor using silicon carbide, a gallium nitride-based material, or diamond.
The electric power converter for vehicles according to any one of claims 1 to 3 .
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