JP6700161B2 - 液体封止led - Google Patents
液体封止led Download PDFInfo
- Publication number
- JP6700161B2 JP6700161B2 JP2016236671A JP2016236671A JP6700161B2 JP 6700161 B2 JP6700161 B2 JP 6700161B2 JP 2016236671 A JP2016236671 A JP 2016236671A JP 2016236671 A JP2016236671 A JP 2016236671A JP 6700161 B2 JP6700161 B2 JP 6700161B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- led chip
- led
- space
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims description 61
- 230000004308 accommodation Effects 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 6
- 230000036544 posture Effects 0.000 description 13
- 239000012071 phase Substances 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000002775 capsule Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
その他の実施形態に係る液体封止LED200は、前記液体封止LED100における本体10の形状及び蓋体30の構成を変更したものである。具体的には、図6及び図7に示すように、本体10が円筒状に形成され、蓋体30が本体10の開口縁に固定される円環状の枠体34と該枠体34の開口を塞ぐ円板状の透光体33とから構成されており、前記枠体34の収容空間20側に位置する面に前記透光体33が固定されている。よって、前記透光体33全体が、前記実施形態におけるLEDチップ50側に突出した透光部32となり、前記枠体34が、前記実施形態における枠部31となる。なお、透光体33の周面は、LEDチップ50の光軸Y(図6中、一点鎖線にて示す)と平行になっている。
10 本体
20 収容空間
30 蓋体
31 枠部
32 透光部
40 封止ケース
50 LEDチップ
60 液体
70 気体
Claims (4)
- LEDチップと、
前記LEDチップを設置する収容空間を有する封止ケースと、
前記封止ケースの収容空間に封入される液体とを備え、
前記封止ケースが、前記LEDチップの光軸上に設けられ、該LEDチップ側へ突出する透光部を有し、
前記LEDチップの光軸を鉛直方向上向きに向けた状態において、前記透光部の先端側が前記収容空間の液体内又は液体表面に接するように配置されると共に、基端側の少なくとも一部が前記収容空間の液体で満たされていない空間に配置されることを特徴とする液体封止LED。 - 前記封止ケースが、所定方向に開口する有底穴が形成された本体と、該本体の開口を閉じる蓋体とを備え、前記蓋体に前記透光部が設けられている請求項1記載の液体封止LED。
- 前記蓋体が、透光性を有する材料からなっている請求項2記載の液体封止LED。
- 前記収容空間の前記LEDチップの光軸と直交する断面形状が矩形状である請求項1乃至3のいずれかに記載の液体封止LED。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236671A JP6700161B2 (ja) | 2016-12-06 | 2016-12-06 | 液体封止led |
PCT/JP2017/043679 WO2018105619A1 (ja) | 2016-12-06 | 2017-12-05 | 液体封止led |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236671A JP6700161B2 (ja) | 2016-12-06 | 2016-12-06 | 液体封止led |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018093105A JP2018093105A (ja) | 2018-06-14 |
JP6700161B2 true JP6700161B2 (ja) | 2020-05-27 |
Family
ID=62491137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016236671A Active JP6700161B2 (ja) | 2016-12-06 | 2016-12-06 | 液体封止led |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6700161B2 (ja) |
WO (1) | WO2018105619A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001036149A (ja) * | 1999-07-23 | 2001-02-09 | Matsushita Electric Works Ltd | 光源装置 |
JP3656715B2 (ja) * | 1999-07-23 | 2005-06-08 | 松下電工株式会社 | 光源装置 |
JP3700482B2 (ja) * | 1999-07-23 | 2005-09-28 | 松下電工株式会社 | 光源装置 |
JP2003347601A (ja) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | 発光ダイオード照明装置 |
JP2005093701A (ja) * | 2003-09-17 | 2005-04-07 | Seiko Epson Corp | 光源装置およびプロジェクタ |
US7737634B2 (en) * | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
TW201511369A (zh) * | 2013-09-02 | 2015-03-16 | Ind Tech Res Inst | 發熱元件之液體封裝結構 |
-
2016
- 2016-12-06 JP JP2016236671A patent/JP6700161B2/ja active Active
-
2017
- 2017-12-05 WO PCT/JP2017/043679 patent/WO2018105619A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2018093105A (ja) | 2018-06-14 |
WO2018105619A1 (ja) | 2018-06-14 |
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