JP6678233B2 - スポットの２ｄアレイによる斜め入射走査のシステムおよび方法 - Google Patents
スポットの２ｄアレイによる斜め入射走査のシステムおよび方法 Download PDFInfo
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- JP6678233B2 JP6678233B2 JP2018510315A JP2018510315A JP6678233B2 JP 6678233 B2 JP6678233 B2 JP 6678233B2 JP 2018510315 A JP2018510315 A JP 2018510315A JP 2018510315 A JP2018510315 A JP 2018510315A JP 6678233 B2 JP6678233 B2 JP 6678233B2
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- 238000000034 method Methods 0.000 title claims description 15
- 230000003287 optical effect Effects 0.000 claims description 104
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
- G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
- G02B21/0052—Optical details of the image generation
- G02B21/006—Optical details of the image generation focusing arrangements; selection of the plane to be imaged
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1086—Beam splitting or combining systems operating by diffraction only
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/12—Beam splitting or combining systems operating by refraction only
- G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
- G02B27/425—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application in illumination systems
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/33—Acousto-optical deflection devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8848—Polarisation of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/063—Illuminating optical parts
- G01N2201/0635—Structured illumination, e.g. with grating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/105—Purely optical scan
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/106—Acousto-optical scan
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Nonlinear Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562159173P | 2015-05-08 | 2015-05-08 | |
| US62/159,173 | 2015-05-08 | ||
| US14/982,747 US9891175B2 (en) | 2015-05-08 | 2015-12-29 | System and method for oblique incidence scanning with 2D array of spots |
| US14/982,747 | 2015-12-29 | ||
| PCT/US2016/030838 WO2016182820A1 (en) | 2015-05-08 | 2016-05-04 | Systems and methods for oblique incidence scanning with 2d array of spots |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018523133A JP2018523133A (ja) | 2018-08-16 |
| JP2018523133A5 JP2018523133A5 (enExample) | 2019-05-30 |
| JP6678233B2 true JP6678233B2 (ja) | 2020-04-08 |
Family
ID=57221839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018510315A Active JP6678233B2 (ja) | 2015-05-08 | 2016-05-04 | スポットの２ｄアレイによる斜め入射走査のシステムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9891175B2 (enExample) |
| EP (1) | EP3295477B1 (enExample) |
| JP (1) | JP6678233B2 (enExample) |
| KR (1) | KR102374253B1 (enExample) |
| CN (1) | CN107580677B (enExample) |
| IL (1) | IL255084B (enExample) |
| TW (1) | TWI683102B (enExample) |
| WO (1) | WO2016182820A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10732424B2 (en) * | 2018-02-15 | 2020-08-04 | Kla Corporation | Inspection-beam shaping on a sample surface at an oblique angle of incidence |
| US10818005B2 (en) * | 2018-03-12 | 2020-10-27 | Kla-Tencor Corp. | Previous layer nuisance reduction through oblique illumination |
| US10679066B2 (en) * | 2018-03-22 | 2020-06-09 | General Electric Company | Best image grab from video with digital grid assistance for aviation engine borescope inspection |
| US12416580B2 (en) | 2018-05-07 | 2025-09-16 | Unm Rainforest Innovations | Method and system for in-line optical scatterometry |
| US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
| KR20210018925A (ko) * | 2018-06-07 | 2021-02-18 | 바라자 피티와이 엘티디 | 광학 빔 지향기 |
| KR20210024556A (ko) * | 2018-06-21 | 2021-03-05 | 바라자 피티와이 엘티디 | 광학 빔 지향기 |
| US11118903B2 (en) * | 2018-10-17 | 2021-09-14 | Kla Corporation | Efficient illumination shaping for scatterometry overlay |
| JP7595599B2 (ja) | 2019-02-14 | 2024-12-06 | ケーエルエー コーポレイション | トポグラフィ半導体デバイスウェハの製造における位置ずれの測定方法 |
| WO2021087345A1 (en) * | 2019-11-01 | 2021-05-06 | Unm Rainforest Innovations | In-line angular optical multi-point scatterometry for nanomanufacturing systems |
| US11397153B2 (en) * | 2019-12-03 | 2022-07-26 | Kla Corporation | Apparatus and method for gray field imaging |
| CN111624757B (zh) * | 2020-06-15 | 2025-09-05 | 苏州智立洁医疗器械有限公司 | 一种三镜头扫描显微装置 |
| JP7554064B2 (ja) * | 2020-06-30 | 2024-09-19 | 株式会社ヴィーネックス | 異物・欠陥検査装置、異物・欠陥検査における画像生成装置、及び異物・欠陥検査方法 |
| JP7608089B2 (ja) * | 2020-08-11 | 2025-01-06 | 株式会社ヴィーネックス | 異物・欠陥検査装置、異物・欠陥検査における画像生成装置、及び異物・欠陥検査方法 |
| TWI779357B (zh) * | 2020-09-23 | 2022-10-01 | 南亞科技股份有限公司 | 偵測物品表面缺陷的方法及其系統 |
| US11748871B2 (en) | 2020-09-28 | 2023-09-05 | KLA Corp. | Alignment of a specimen for inspection and other processes |
| US11526086B2 (en) * | 2021-03-08 | 2022-12-13 | Kla Corporation | Multi-field scanning overlay metrology |
| CN113552725A (zh) * | 2021-07-20 | 2021-10-26 | 中国工程物理研究院激光聚变研究中心 | 一种激光束同轴同波面控制系统及方法 |
| WO2024048800A1 (ko) * | 2022-08-29 | 2024-03-07 | (주)구일엔지니어링 | 웨이퍼 검사 시스템 |
| US20240310292A1 (en) * | 2023-03-14 | 2024-09-19 | Kla Corporation | Oblique uniform illumination for imaging systems |
| DE102023204171A1 (de) * | 2023-05-05 | 2024-11-07 | Carl Zeiss Smt Gmbh | Optisches System für ein Metrologiesystem sowie Metrologiesystem mit einem derartigen optischen System |
| US20250219284A1 (en) * | 2023-12-27 | 2025-07-03 | Serguei Matitsine | Multi-Beam Mimo Antenna Systems And Methods |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5864394A (en) | 1994-06-20 | 1999-01-26 | Kla-Tencor Corporation | Surface inspection system |
| US6341006B1 (en) | 1995-04-07 | 2002-01-22 | Nikon Corporation | Projection exposure apparatus |
| EP0979398B1 (en) * | 1996-06-04 | 2012-01-04 | KLA-Tencor Corporation | Optical scanning system for surface inspection |
| US6236454B1 (en) | 1997-12-15 | 2001-05-22 | Applied Materials, Inc. | Multiple beam scanner for an inspection system |
| TW539845B (en) * | 2000-07-27 | 2003-07-01 | Ebara Corp | Sheet beam-type inspection device |
| ATE535834T1 (de) | 2001-05-03 | 2011-12-15 | Kla Tencor Tech Corp | Systeme und verfahren zum scannen einer probe mit einem lichtstrahl |
| US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
| US7489393B2 (en) | 2005-03-02 | 2009-02-10 | Kla-Tencor Technologies Corporation | Enhanced simultaneous multi-spot inspection and imaging |
| US7385688B1 (en) * | 2005-06-22 | 2008-06-10 | Kla-Tencor Technologies Corp. | Multi-spot illumination and collection optics for highly tilted wafer planes |
| US7705331B1 (en) | 2006-06-29 | 2010-04-27 | Kla-Tencor Technologies Corp. | Methods and systems for providing illumination of a specimen for a process performed on the specimen |
| US7728969B2 (en) | 2006-12-05 | 2010-06-01 | Kla-Tencor Technologies Corp. | Methods and systems for identifying defect types on a wafer |
| US8194301B2 (en) * | 2008-03-04 | 2012-06-05 | Kla-Tencor Corporation | Multi-spot scanning system and method |
| JP2009236819A (ja) | 2008-03-28 | 2009-10-15 | Topcon Corp | 光学装置、フォトマスク検査装置および露光装置 |
| WO2010093903A2 (en) | 2009-02-13 | 2010-08-19 | Kla-Tencor Corporation | Optical pumping to sustain hot plasma |
| EP2534672B1 (en) | 2010-02-09 | 2016-06-01 | Energetiq Technology Inc. | Laser-driven light source |
| CN102269858A (zh) * | 2010-06-02 | 2011-12-07 | 北京智朗芯光科技有限公司 | 自动聚焦系统和自动聚焦方法 |
| US8462329B2 (en) | 2010-07-30 | 2013-06-11 | Kla-Tencor Corp. | Multi-spot illumination for wafer inspection |
| US9599805B2 (en) | 2011-10-19 | 2017-03-21 | National Synchrotron Radiation Research Center | Optical imaging system using structured illumination |
| US9927094B2 (en) | 2012-01-17 | 2018-03-27 | Kla-Tencor Corporation | Plasma cell for providing VUV filtering in a laser-sustained plasma light source |
| US9390892B2 (en) | 2012-06-26 | 2016-07-12 | Kla-Tencor Corporation | Laser sustained plasma light source with electrically induced gas flow |
| US8796652B2 (en) | 2012-08-08 | 2014-08-05 | Kla-Tencor Corporation | Laser sustained plasma bulb including water |
| US9945792B2 (en) | 2012-12-19 | 2018-04-17 | Kla-Tencor Corporation | Generating an array of spots on inclined surfaces |
| US8995746B2 (en) | 2013-03-15 | 2015-03-31 | KLA—Tencor Corporation | Image synchronization of scanning wafer inspection system |
| US9395340B2 (en) * | 2013-03-15 | 2016-07-19 | Kla-Tencor Corporation | Interleaved acousto-optical device scanning for suppression of optical crosstalk |
| WO2015055387A1 (en) | 2013-10-17 | 2015-04-23 | Asml Netherlands B.V. | Photon source, metrology apparatus, lithographic system and device manufacturing method |
-
2015
- 2015-12-29 US US14/982,747 patent/US9891175B2/en active Active
-
2016
- 2016-05-04 CN CN201680025753.5A patent/CN107580677B/zh active Active
- 2016-05-04 EP EP16793208.6A patent/EP3295477B1/en active Active
- 2016-05-04 KR KR1020177035244A patent/KR102374253B1/ko active Active
- 2016-05-04 JP JP2018510315A patent/JP6678233B2/ja active Active
- 2016-05-04 WO PCT/US2016/030838 patent/WO2016182820A1/en not_active Ceased
- 2016-05-06 TW TW105114193A patent/TWI683102B/zh active
-
2017
- 2017-10-17 IL IL255084A patent/IL255084B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL255084B (en) | 2021-06-30 |
| KR20180004239A (ko) | 2018-01-10 |
| TWI683102B (zh) | 2020-01-21 |
| KR102374253B1 (ko) | 2022-03-16 |
| US9891175B2 (en) | 2018-02-13 |
| EP3295477A1 (en) | 2018-03-21 |
| EP3295477B1 (en) | 2021-12-15 |
| CN107580677B (zh) | 2020-12-04 |
| IL255084A0 (en) | 2017-12-31 |
| EP3295477A4 (en) | 2019-01-30 |
| CN107580677A (zh) | 2018-01-12 |
| US20160327493A1 (en) | 2016-11-10 |
| WO2016182820A1 (en) | 2016-11-17 |
| JP2018523133A (ja) | 2018-08-16 |
| TW201643413A (zh) | 2016-12-16 |
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