JP6667367B2 - 真空排気方法 - Google Patents
真空排気方法 Download PDFInfo
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- JP6667367B2 JP6667367B2 JP2016103607A JP2016103607A JP6667367B2 JP 6667367 B2 JP6667367 B2 JP 6667367B2 JP 2016103607 A JP2016103607 A JP 2016103607A JP 2016103607 A JP2016103607 A JP 2016103607A JP 6667367 B2 JP6667367 B2 JP 6667367B2
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- vacuum
- processing container
- getter material
- evaporable getter
- module
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- 238000000034 method Methods 0.000 title claims description 70
- 238000012545 processing Methods 0.000 claims description 94
- 239000000463 material Substances 0.000 claims description 76
- 230000008569 process Effects 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 24
- 229910000986 non-evaporable getter Inorganic materials 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 230000004913 activation Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 33
- 235000012431 wafers Nutrition 0.000 description 25
- 239000010408 film Substances 0.000 description 21
- 230000032258 transport Effects 0.000 description 19
- 238000012546 transfer Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/52—Means for absorbing or adsorbing the gas mixture, e.g. by gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/46—Connecting or feeding means, e.g. leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J21/00—Vacuum tubes
- H01J21/02—Tubes with a single discharge path
- H01J21/18—Tubes with a single discharge path having magnetic control means; having both magnetic and electrostatic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J41/00—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas; Discharge tubes for evacuation by diffusion of ions
- H01J41/12—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps
- H01J41/14—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps with ionisation by means of thermionic cathodes
- H01J41/16—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps with ionisation by means of thermionic cathodes using gettering substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
- H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
- H01J7/186—Getter supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J21/00—Vacuum tubes
- H01J21/02—Tubes with a single discharge path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J41/00—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas; Discharge tubes for evacuation by diffusion of ions
- H01J41/12—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Separation Of Gases By Adsorption (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Description
本発明の一実施形態に係る基板処理システムについて説明する。図1は、一実施形態に係る基板処理システムを示す概略構成図である。
本発明の一実施形態の成膜装置について説明する。図2は、一実施形態に係る成膜装置を示す概略構成図である。図2に示す成膜装置は、前述の基板処理システムにおけるプロセスモジュールPM1、PM2として用いることができる装置である。
本発明の一実施形態に係る真空排気方法について説明する。図3は、一実施形態に係る真空排気方法を示すフローチャートである。
20 排気装置
40 載置台
W ウエハ
Claims (8)
- 基板を載置する載置台を有する処理容器内を排気装置により減圧する真空排気方法であって、
前記処理容器とは別に設けられ、内部の圧力を真空雰囲気と大気雰囲気との間で切り替えることが可能なモジュール内に、大気雰囲気で保管された非蒸発型ゲッター材(NEG材)を搬送し、該モジュール内で該非蒸発型ゲッター材を第1の温度に加熱して活性化させる活性化工程と、
前記載置台に前記活性化工程において活性化した前記非蒸発型ゲッター材を載置する載置工程と、
前記処理容器内の活性ガスを前記載置台に載置された前記非蒸発型ゲッター材に吸着させる吸着工程と、
を有し、
前記吸着工程では、前記非蒸発型ゲッター材の温度を、前記第1の温度よりも低い温度であり、前記活性ガスを吸着することが可能な第2の温度に調整することを特徴とする真空排気方法。 - 前記吸着工程の後に、前記非蒸発型ゲッター材を前記処理容器内から搬出する搬出工程を更に有し、
前記搬出工程は、前記吸着工程において前記処理容器内の圧力が所定の圧力以下となった後に行われることを特徴とする請求項1に記載の真空排気方法。 - 前記処理容器内を前記排気装置により減圧した状態で、前記処理容器内の真空度が所定の真空度に到達しない場合、前記載置工程を行うことを特徴とする請求項1又は2に記載の真空排気方法。
- 前記所定の真空度は、前記排気装置の種類に応じて定められる真空度であることを特徴とする請求項3に記載の真空排気方法。
- 前記排気装置は、クライオポンプまたはウォーターポンプを含むことを特徴とする請求項1乃至4のいずれか一項に記載の真空排気方法。
- 前記非蒸発型ゲッター材は、ウエハ形状に形成されていることを特徴とする請求項1乃至5のいずれか一項に記載の真空排気方法。
- 前記非蒸発型ゲッター材は、前記処理容器内において所定の処理が行われる基板における前記載置台に載置される側と反対側の面に接合されていることを特徴とする請求項1乃至6のいずれか一項に記載の真空排気方法。
- 前記非蒸発型ゲッター材は、ZrVFe合金により形成されていることを特徴とする請求項1乃至7のいずれか一項に記載の真空排気方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016103607A JP6667367B2 (ja) | 2016-05-24 | 2016-05-24 | 真空排気方法 |
US15/595,290 US10014145B2 (en) | 2016-05-24 | 2017-05-15 | Vacuum exhaust method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016103607A JP6667367B2 (ja) | 2016-05-24 | 2016-05-24 | 真空排気方法 |
Publications (2)
Publication Number | Publication Date |
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JP2017210643A JP2017210643A (ja) | 2017-11-30 |
JP6667367B2 true JP6667367B2 (ja) | 2020-03-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016103607A Active JP6667367B2 (ja) | 2016-05-24 | 2016-05-24 | 真空排気方法 |
Country Status (2)
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US (1) | US10014145B2 (ja) |
JP (1) | JP6667367B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2605163A (en) * | 2021-03-24 | 2022-09-28 | Leybold Gmbh | Getter pump |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041147A (en) * | 1989-07-14 | 1991-08-20 | The United States Of America As Represented By The United States Department Of Energy | Hydrogen isotope separation utilizing bulk getters |
US5161955A (en) * | 1991-08-20 | 1992-11-10 | Danielson Associates, Inc. | High vacuum pump using bulk getter material |
JP3419414B2 (ja) | 1993-04-23 | 2003-06-23 | アネルバ株式会社 | スパッタリング装置の排気機構 |
JP2002517893A (ja) * | 1998-06-05 | 2002-06-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ディスプレイデバイス |
JP2006066265A (ja) * | 2004-08-27 | 2006-03-09 | Canon Inc | 画像表示装置 |
US7789949B2 (en) * | 2005-11-23 | 2010-09-07 | Integrated Sensing Systems, Inc. | Getter device |
US9901900B2 (en) * | 2014-11-13 | 2018-02-27 | Samsung Electronics Co., Ltd. | Gas-adsorbing material and vacuum insulation material including the same |
-
2016
- 2016-05-24 JP JP2016103607A patent/JP6667367B2/ja active Active
-
2017
- 2017-05-15 US US15/595,290 patent/US10014145B2/en active Active
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Publication number | Publication date |
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US20170345609A1 (en) | 2017-11-30 |
US10014145B2 (en) | 2018-07-03 |
JP2017210643A (ja) | 2017-11-30 |
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