JP6663545B1 - Press apparatus and method for manufacturing circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressing device and a pressing method for suppressing protrusion of a heat transfer member embedded in a circuit board. A press device (1) in which a heat transfer member (11) is embedded in a through hole (12) provided in a circuit board (10), and a pedestal part (3) on which the circuit board (10) is placed, and a movable up and down with respect to the pedestal part (3). An elevating part 4 that is provided and presses while contacting the heat transfer member 11 during pressing; a spring structure 5 that presses the circuit board 10 against the pedestal part 3 before the elevating part 4 contacts the heat transfer member 11; A press device equipped with.

Description

  The present invention relates to a press device for embedding a heat transfer member in a circuit board, and a method for manufacturing a circuit board.

  When an electronic component that generates heat during operation is mounted on one surface of the circuit board, a through hole is provided at a position on the circuit board where the electronic component is mounted, and a heat transfer member is embedded in the through hole. There is known a heat dissipation board that transmits heat generated by an electronic component to the other surface of a circuit board and dissipates heat.

  For example, in the related art described in Patent Document 1, a heat transfer member is press-fitted into a through hole formed in an insulating substrate and metal plating is performed on both surfaces of the heat transfer member, so that the heat transfer member is mounted on one metal plating. The heat of the electronic component is radiated to the other metal plating side. In such a heat dissipation board, a heat dissipation fin is often provided on the other metal plating side in order to improve heat dissipation.

JP-A-5-304223

  However, the circuit board is not necessarily flat on the board surface. For example, the board may be warped or the thickness of the board may be slightly different for each part. For this reason, when the heat transfer member is embedded in the through-hole with the board surface warped, the heat transfer member protrudes from the through-hole without fitting into the through-hole, and mounts electronic components and radiation fins. May be obstructed.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a press device that suppresses protrusion of a heat transfer member embedded in a circuit board, and a method of manufacturing the circuit board. It is in.

<First embodiment of the present invention>
A first aspect of the present invention is a press device for embedding a heat transfer member in a through-hole provided in a circuit board, wherein the pedestal section on which the circuit board is mounted, and a vertically movable table with respect to the pedestal section. A press provided with an elevating part that presses while contacting the heat transfer member during pressing, and a pressing part that presses the circuit board against the pedestal part before the elevating part comes into contact with the heat transfer member. Device.

  The press device includes a pedestal portion on which the circuit board is mounted, and an elevating portion that moves up and down with respect to the pedestal portion, whereby the elevating portion presses the heat transfer member, and the heat transfer member is inserted into the through hole of the circuit board. Can be embedded. Here, the press device includes a pressing portion that presses the circuit board against the pedestal portion, and is configured such that the pressing portion can press the circuit board against the pedestal portion before the elevating portion presses the heat transfer member. . Therefore, the heat transfer member can be embedded in the through-hole in a state where the circuit board is pressed against the pedestal around the through-hole on the pressing surface of the elevating unit. Thus, according to the press device according to the first aspect of the present invention, even if the circuit board is warped, it is possible to suppress the circuit board from rising from the pedestal portion, and to prevent the transfer from being embedded in the circuit board. The protrusion of the heat member can be suppressed.

<Second embodiment of the present invention>
According to a second aspect of the present invention, in the first aspect of the present invention, the pressing portion presses the circuit board at a constant pressure at least during a period in which the elevating portion presses the heat transfer member. It is a press device comprising an actuator for pressing.

  According to the press apparatus according to the second aspect of the present invention, the circuit board is pressed against the pedestal section at a constant pressure by the actuator during a period from before the elevating section presses the heat transfer member until press processing is completed. Therefore, the circuit board can be stably pressed in the process of processing the heat transfer member.

<Third embodiment of the present invention>
According to a third aspect of the present invention, in the above-described first aspect of the present invention, the pressing portion comprises a spring structure provided to be able to expand and contract in the elevating direction of the elevating portion, and the spring structure has one end. A press device, wherein a part is fixed to the elevating part, and the other end is located at a height between the pressing surface of the elevating part and the circuit board before pressing.

  According to the press device according to the third aspect of the present invention, since the pressing portion is formed by the spring structure provided in the elevating portion, the circuit board can be pressed in conjunction with the pressing of the heat transfer member. Therefore, a control mechanism for controlling the pressing section is not required.

<Fourth aspect of the present invention>
A fourth aspect of the present invention is the press device according to any one of the first to third aspects of the present invention, wherein the pressing portion presses the circuit board at a position sandwiching the through hole.

  According to the press device according to the fourth aspect of the present invention, the edge of the through hole in the circuit board can be securely fixed to the pedestal, and the area for pressing the circuit board can be minimized at this time. Even when other components are mounted on the circuit board, it becomes easy to press the circuit board while avoiding the other components.

<Fifth aspect of the present invention>
A fifth aspect of the present invention is the press device according to any one of the first to fourth aspects of the present invention, wherein the pressing portion presses the circuit board at a position surrounding the periphery of the through hole.

  According to the press apparatus according to the fifth aspect of the present invention, it is possible to stably suppress the circuit board from rising from the pedestal portion regardless of the direction of the warpage generated in the circuit board.

<Sixth aspect of the present invention>
According to a sixth aspect of the present invention, in the press apparatus according to any one of the first to fifth aspects of the present invention, the pressing portion includes a support made of a resin material on a contact surface with the circuit board. is there.

  According to the press device according to the sixth aspect of the present invention, when the pressing portion presses the circuit board against the pedestal portion, it is possible to reduce the risk of damaging the circuit board.

<Seventh aspect of the present invention>
A seventh aspect of the present invention is the press device according to the above-described sixth aspect of the present invention, wherein the support is provided on a part of the bottom surface of the pressing portion on the lifting / lowering portion side.

  According to the press device of the seventh aspect of the present invention, the circuit board is pressed in the vicinity of the through-hole via the support provided on a part of the bottom surface of the pressing portion near the lifting / lowering portion. Therefore, even when a plurality of heat transfer members are embedded in the circuit board at a gorge pitch, the risk of interference with other heat transfer members when the circuit board is pressed can be further reduced.

<Eighth aspect of the present invention>
An eighth aspect of the present invention is a method for manufacturing a circuit board in which a heat transfer member is embedded in a through-hole, wherein the circuit board is placed on a pedestal, and the pedestal is provided inside the through-hole. A mounting step of mounting the heat transfer member, a pressing step of pressing the circuit board against the pedestal portion, and after the pressing step, pressing the heat transfer member with a press jig to thereby form the heat transfer member. Press-fitting into the through-hole.

  According to the method for manufacturing a circuit board according to the eighth aspect of the present invention, the pressing portion presses the circuit board against the pedestal portion before starting to caulk the heat transfer member into the through hole provided in the circuit board. Therefore, even if the circuit board is warped, it is possible to suppress the circuit board from rising from the pedestal portion, and to manufacture a circuit board in which the protrusion of the heat transfer member embedded in the through hole is suppressed. it can.

  ADVANTAGE OF THE INVENTION According to this invention, the press apparatus which suppresses the protrusion of the heat transfer member embedded in a circuit board, and the manufacturing method of a circuit board can be provided.

It is a side view in a main part of a press device concerning a 1st embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a state before and after the lifting unit and the circuit board of the press device according to the present invention are pressed. FIG. 2 is a cross-sectional view illustrating a state in which the lifting unit of the press device according to the present invention and the circuit board are being pressed in the middle. FIG. 3 is a cross-sectional view illustrating a state in which pressing of the circuit board and the lifting unit of the press device according to the present invention is completed. It is sectional drawing showing the elevating part of the press apparatus which concerns on a prior art, and the state at the time of completion of the press of a circuit board. It is a side view in the principal part of the press device concerning a 2nd embodiment of the present invention. It is a sectional view showing the elevating part of the press device concerning a 2nd embodiment, and the state before pressing of the circuit board. It is a sectional view showing the elevating part of the press device concerning a 2nd embodiment, and the state at the time of pressing completion of a circuit board. It is a side view in the principal part of the press device concerning a 3rd embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the contents described below, and can be arbitrarily changed and implemented without departing from the gist thereof. In addition, the drawings used in the description of the embodiments each schematically show constituent members, and partial emphasis, enlargement, reduction, or omission is performed for better understanding. In some cases, the scale or shape is not accurately represented.

<First embodiment>
FIG. 1 is a side view of a main part of a press device 1 according to a first embodiment of the present invention. The press device 1 includes a frame 2, a pedestal portion 3, an elevating portion 4, and a spring structure 5 as a "pressing portion". In the present embodiment, the press device 1 is a C-frame type press machine, and when the elevating unit 4 moves up and down with respect to the pedestal unit 3, heat transfer of a circuit board 10 mounted on the pedestal unit 3 will be described later. The member 11 is pressed. The frame shape is not limited to the C frame type.

  The frame 2 is a housing of the press device 1, and includes a control device that integrally controls operations in the press process, a servomotor that generates power for the press process, and a link mechanism that transmits the power of the servomotor to the lifting unit 4. (Both not shown) are included inside.

  In the present embodiment, the pedestal portion 3 is a planar pedestal on which the circuit board 10 to be processed is placed, and is fixed to the frame 2 so that the pedestal surface is parallel to a horizontal plane.

  The elevating unit 4 protrudes vertically downward from the ceiling surface of the work opening of the frame 2 and is provided so as to be able to move up and down with respect to the pedestal unit 3 from the ceiling surface. The lifting unit 4 includes a slide 6 and a press jig 7. The slide 6 is a columnar movable portion that moves up and down by a driving force generated by a servomotor via a link mechanism (not shown) in the frame 2. The press jig 7 is a cylindrical metal member having a smaller horizontal cross section diameter than the slide 6, one end of the upper part in the vertical direction is fixed to the tip of the slide 6, and the other end of the lower part in the vertical direction is pressed. Is a pressing surface 7a (not shown in FIG. 1) for pressing a processing object.

  The spring structure 5 includes a coil spring 8 and a support 9, and is provided so as to be able to expand and contract in the elevating direction of the elevating unit 4. The inner diameter of the coil spring 8 is slightly larger than the diameter of the horizontal cross section of the press jig 7, one end vertically upward is fixed to the tip of the slide 6, and is disposed so as to surround the press jig 7. . The support 9 is an annular member made of a resin material, and is connected to the coil spring 8 at the other lower end in the vertical direction of the coil spring 8 so that the bottom surface is parallel to the surface of the pedestal portion 3. ing. Here, the support 9 is set so that the outer diameter is smaller than the outer diameter of the coil spring 8. The spring structure 5 is arranged so as not to contact the press jig 7 regardless of the expansion / contraction state.

  Next, a method of manufacturing the circuit board 10 in which the heat transfer member 11 is embedded will be described while describing the operation of the press device 1 described above. FIG. 2 is a cross-sectional view illustrating a state before and after pressing of the lifting unit 4 and the circuit board 10 of the press device 1 according to the present invention.

  Before pressing, the circuit board 10 is placed on the pedestal 3 so that the through hole 12 in which the heat transfer member 11 made of, for example, copper is embedded is directly below the pressing jig 7. In the present embodiment, the heat transfer member 11, the through-hole 12, and the press jig 7 are all formed in a columnar shape having a circular horizontal section, and the diameter of the horizontal section increases in this order. Is set to The heat transfer member 11 is formed so as to be slightly higher than the thickness of the circuit board 10 by a height H1 before pressing. Then, the heat transfer member 11 is mounted on the pedestal 3 in the through hole 12 of the circuit board 10 (mounting step).

  Before pressing, the coil spring 8 has a natural length. In this state, the height difference between the other end of the spring structure 5, that is, the bottom surface of the support 9 and the pressing surface 7 a of the pressing jig 7 by the height H 2. Is set. The height H2 is set to be larger than the height H1 described above.

  FIG. 3 is a cross-sectional view illustrating a state in which the lifting unit 4 of the press device 1 and the circuit board 10 are being pressed during the pressing according to the present invention. More specifically, FIG. 3 shows that as the elevating unit 4 descends, the bottom surface of the support 9 contacts the circuit board 10, while the pressing surface 7 a of the pressing jig 7 still contacts the heat transfer member 11. It is not in the state.

  In the state of FIG. 3, the circuit board 10 is pressed against the pedestal portion 3 by the urging force of the coil spring 8 via the support 9 (pressing step). For this reason, even when the periphery of the through hole 12 rises from the pedestal portion 3 due to the warpage of the substrate surface (see FIG. 5), for example, the heat transfer member 11 The lifting of the substrate surface is suppressed before the caulking starts. When the lifting unit 4 of the press device 1 further descends, the pressing surface 7a of the pressing jig 7 comes into contact with the heat transfer member 11 and presses while the coil spring 8 contracts and the lifting of the substrate surface is suppressed while the coil spring 8 is suppressed. Is started (pressing process). Here, since the support 9 is formed of a resin material, the possibility of damaging the circuit board 10 to be pressed can be reduced.

  FIG. 4 is a cross-sectional view illustrating a state when the pressing of the elevating unit 4 and the circuit board 10 of the press device 1 according to the present invention is completed. Here, the pressing device 1 determines that the pressing is completed by detecting the load received when the pressing surface 7a of the pressing jig 7 comes into contact with the surface of the circuit board 10 around the through hole 12 and determines that the pressing is completed. The pressing on the heat member 11 is stopped.

  At this time, the heat transfer member 11 is deformed by being sandwiched between the surface of the pedestal portion 3 and the pressing surface 7 a of the press jig 7, and is in a state of being crimped into the through hole 12. Then, the metal pieces of the embedded heat transfer member 11 of the circuit board 10 are suppressed from protruding from the bottom surface of the circuit board 10.

  Here, a press operation according to the related art will be described as a comparison object with the present invention. FIG. 5 is a cross-sectional view illustrating a state when the pressing of the lifting unit 4 of the press device 20 and the circuit board 10 according to the related art is completed. The press device 20 according to the prior art differs from the press device 1 according to the present invention in that the press device 20 according to the present invention does not include the spring structure 5 described above. Here, parts common to the above-described press apparatus 1 according to the present invention are denoted by the same reference numerals.

  As shown in FIG. 5, the press device 20 according to the related art does not include the above-described spring structure 5, and therefore, the periphery of the through hole 12 rises from the pedestal portion 3 due to the warpage of the circuit board 10. Even in this case, it is not possible to suppress the lifting of the substrate surface. Therefore, for example, when the bottom surface of the circuit board 10 is separated from the surface of the pedestal portion 3 by the height H3, there is a possibility that the metal pieces of the heat transfer member 11 project from the bottom surface of the circuit board 10 by the height H3. Occurs.

  Next, the effects of the present invention will be described. Table 1 shows an experiment showing the amount of protrusion of a metal piece from the bottom surface of the circuit board 10 when the heat transfer member 11 is embedded in the circuit board 10 by the press apparatus 20 according to the related art and the press apparatus 1 according to the present invention. Data. More specifically, Table 1 shows the case where the spring load of the coil spring 8 according to the present invention was set to 5 kgf, 10 kgf, and 20 kgf, and the case of the prior art without a spring structure (when the spring load was 0 kgf, FIG. 5) shows the results of measuring the distance (μm) in which the metal piece of the heat transfer member 11 protrudes from the bottom surface of the circuit board 10 when the heat transfer member 11 is embedded in the circuit board 10 five times. .

  Here, the circuit board 10 in which the heat transfer member 11 is swaged under each condition is set to have a thickness of 1.6 mm and a diameter of the through hole of φ6 mm.

  As shown in Table 1, in the related art without the spring structure 5 (spring load is 0 kgf), the amount of protrusion of the metal piece from the circuit board 10 reaches 50 μm on average. On the other hand, in the present invention in which the spring load is set to 5 kgf and 10 kgf, the protrusion amount of the metal piece from the circuit board 10 is suppressed to 2 μm on average. In the present invention in which the spring load is set to 20 kgf, although the effect is sufficiently exerted as compared with the related art, it is considered that the pressing force on the circuit board 10 is too strong.

  As described above, the press device 1 according to the present invention is configured such that the circuit board 10 is pressed against the pedestal portion 3 by the spring structure 5 provided in the elevating portion 4 before the heat transfer member 11 is caulked. Have been. Thus, according to the press device 1 of the present invention, even when the circuit board 10 is warped, the protrusion of the heat transfer member 11 embedded in the circuit board 10 can be suppressed.

  Further, the press device 1 according to the present invention has a stable structure irrespective of the direction of warpage generated in the circuit board 10 because the spring structure 5 is constituted by the coil spring 8 arranged so as to surround the press jig 7. The lifting of the circuit board 10 from the pedestal 3 can be suppressed. Furthermore, according to the press device 1 of the present invention, the horizontal width of the spring structure 5 can be limited to the vicinity of the through-hole. For example, when the plurality of heat transfer members 11 are embedded in the circuit board 10 at a pitch. Also, it is possible to reduce the risk of interference with other heat transfer members 11 when the circuit board 10 is pressed.

  Further, the press device 1 according to the present invention presses the circuit board 10 in the vicinity of the through hole 12 via the support 9 having a smaller outer diameter than the coil spring 8. Accordingly, the press device 1 according to the present invention can be mounted on the circuit board 10 even when the outer diameter of the coil spring 8 is increased with an increase in the diameter of the through hole 12 or the thickness of the circuit board 10, for example. Even when the plurality of heat transfer members 11 are embedded at the pitch of the gorge, the risk of interference with other heat transfer members 11 when the circuit board 10 is pressed can be further reduced.

<Second embodiment>
Subsequently, a second embodiment of the present invention will be described. The press device 30 according to the second embodiment is different from the press device 1 according to the first embodiment in that an air cylinder 40 as a “pressing portion” is provided instead of the spring structure 5. Hereinafter, portions different from the first embodiment will be described, and the same components as those in the first embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted.

  FIG. 6 is a side view of a main part of a press device 30 according to the second embodiment of the present invention. The press device 30 includes two air cylinders 40 that protrude vertically downward from the ceiling surface at the working opening of the frame 2 on both sides of the lifting unit 4.

  The air cylinder 40 includes a cylinder portion 41 fixed to the frame 2, a piston rod 42 that expands and contracts from the cylinder portion 41, and a support 43 provided on the bottom surface of the piston rod 42. Here, in the present embodiment, the air cylinders 40 are provided at positions sandwiching the elevating unit 4, respectively, but the number and arrangement can be variously changed. Although the pneumatic type air cylinder 40 is illustrated as the "pressing portion", another hydraulic or electric actuator may be used.

  The cylinder portion 41 expands and contracts the piston rod 42 in the vertical direction by adjusting the internal pressure based on a control signal from a control device (not shown) built in the frame 2.

  In the mounting step of mounting the circuit board 10 and the heat transfer member 11 on the pedestal 3, the piston rod 42 is maintained in a state of being separated upward from the circuit board 10. In addition, the piston rod 42 extends vertically downward in the pressing step of caulking the heat transfer member 11 into the through hole 12 of the circuit board 10, and thereby the circuit is formed via the support 43 provided on the contact surface with the circuit board 10. The substrate 10 is pressed against the pedestal 3.

  The support 43 is made of a resin material, and is provided on the bottom surface of the piston rod 42 such that the bottom surface is parallel to the surface of the pedestal portion 3. Here, the support 43 is preferably provided on a part of the bottom surface of the piston rod 42 on the side of the elevating part 4, whereby the pitch of the heat transfer member 11 in caulking can be reduced.

  FIG. 7 is a cross-sectional view illustrating a state before the pressing of the lifting unit 4 of the press device 30 and the circuit board 10 according to the second embodiment. More specifically, FIG. 7 shows that the bottom surface of the support 9 presses the circuit board 10 against the pedestal portion 3 by lowering the piston rod 42, while the pressing surface 7 a of the press jig 7 is in contact with the heat transfer member 11. It represents a state that is not present. That is, the air cylinder 40 presses the circuit board 10 against the pedestal portion 3 before the press jig 7 contacts the heat transfer member 11 even if the circuit surface of the circuit board 10 is warped, Floating of the circuit board 10 from the pedestal 3 can be suppressed.

  FIG. 8 is a cross-sectional view illustrating a state when the pressing of the elevating unit 4 of the press device 30 and the circuit board 10 according to the second embodiment is completed. The heat transfer member 11 is deformed by being sandwiched between the surface of the pedestal portion 3 and the pressing surface 7 a of the press jig 7, and is crimped into the through hole 12. At this time, since the floating of the circuit board 10 from the pedestal portion 3 is suppressed, the metal pieces of the embedded heat transfer member 11 are suppressed from protruding from the bottom surface of the circuit board 10.

  As described above, the press device 30 according to the present embodiment moves the circuit board 10 to the pedestal portion 3 before the caulking of the heat transfer member 11 by the air cylinder 40 provided adjacent to the elevating unit 4. It is configured to press. Thereby, according to the press device 30 according to the present embodiment, even when the circuit board 10 is warped, the protrusion of the heat transfer member 11 embedded in the circuit board 10 can be suppressed.

  In addition, the press device 30 according to the present embodiment can stably press the circuit board 10 with a constant pressure by the air cylinder 40 at least during a period in which the elevating unit 4 presses the heat transfer member 11. The circuit board 10 can be held down.

  Further, the press device 30 according to the present embodiment can press the circuit board 10 at a position sandwiching the through hole 12 because the two air cylinders 40 are provided at positions sandwiching the elevating unit 4. As a result, the press device 30 according to the present embodiment can securely fix the edge of the through hole 12 in the circuit board 10 to the pedestal portion 3, and at this time, the area for pressing the circuit board 10 can be minimized. Therefore, even when another component is mounted on the circuit board 10, it becomes easy to press the circuit board 10 while avoiding the other component.

<Third embodiment>
Next, a third embodiment of the present invention will be described. The press device 50 according to the third embodiment differs from the press device 30 according to the second embodiment in the shape of the actuator. Hereinafter, portions different from the second embodiment will be described, and components common to the second embodiment will be assigned the same reference numerals and detailed description thereof will be omitted.

  FIG. 9 is a side view of a main part of a press device 50 according to the third embodiment. The press device 50 includes an air cylinder 60 that projects vertically downward from the ceiling surface at the working opening of the frame 2 so as to surround the lifting unit 4.

  The air cylinder 60 of the present embodiment includes an outer cylinder 61 fixed to the frame 2, an inner cylinder 62 extending and contracting from the outer cylinder 61, and a support 63 provided on the bottom surface of the inner cylinder 62. Here, the air cylinder 60 of the pneumatic type is illustrated as the “pressing portion”, but another actuator of a hydraulic type or an electric type may be used.

  The air cylinder 60 of the present embodiment has a columnar space inside, and the elevating unit 4 is arranged in the space. Both the inner diameter and the outer diameter of the inner cylinder portion 62 in the horizontal cross section are larger than the inner diameter of the outer cylinder portion 61 and smaller than the outer diameter of the outer cylinder portion 61.

  The support 63 of the present embodiment is formed in an annular shape, like the support 9 of the first embodiment.

  Then, the air cylinder 60 of the present embodiment presses the circuit board 10 against the pedestal portion 3 before caulking the heat transfer member 11, similarly to the air cylinder 40 according to the above-described second embodiment. Thus, according to the press device 50 according to the present embodiment, similarly to the above-described first and second embodiments, even if the circuit board 10 is warped, the transmission embedded in the circuit board 10 can be performed. The protrusion of the heat member 11 can be suppressed. Further, since the air cylinder 60 of the present embodiment can hold down the circuit board 10 via the support 63 formed in an annular shape, the air cylinder 60 can be stably mounted irrespective of the direction of warpage generated in the circuit board 10. 3 can be prevented from rising.

DESCRIPTION OF SYMBOLS 1, 30, 50 Press apparatus 2 Frame 3 Pedestal part 4 Elevating part 5 Spring structure 6 Slide 7 Press jig 7a Pressing surface 8 Coil spring 9, 43, 63 Support body 10 Circuit board 11 Heat transfer member 12 Through hole 40 60 air cylinder

Claims (8)

A press device for embedding a heat transfer member in a through hole provided in a circuit board,
A pedestal portion on which the circuit board is mounted,
An elevating unit that is provided so as to be able to move up and down with respect to the pedestal unit and presses while contacting the heat transfer member during pressing,
A press unit that presses the circuit board against the pedestal unit before the elevating unit comes into contact with the heat transfer member.   2. The press device according to claim 1, wherein the pressing unit includes an actuator that presses the circuit board with a constant pressure at least during a period in which the elevating unit presses the heat transfer member. 3. The pressing portion is made of a spring structure that is provided so as to be able to expand and contract in the elevating direction of the elevating portion,
The press according to claim 1, wherein one end of the spring structure is fixed to the elevating unit, and the other end is located at a height between a pressing surface of the elevating unit and the circuit board before pressing. apparatus.   The press device according to claim 1, wherein the pressing portion presses the circuit board at a position sandwiching the through hole.   The press device according to claim 1, wherein the pressing portion presses the circuit board at a position surrounding a periphery of the through hole.   The press device according to claim 1, wherein the pressing portion includes a support made of a resin material on a contact surface with the circuit board.   The press device according to claim 6, wherein the support is provided on a part of the bottom surface of the pressing unit on the elevation unit side. A method of manufacturing a circuit board in which a heat transfer member is embedded in a through hole,
A mounting step of mounting the circuit board on the pedestal portion and mounting the heat transfer member on the pedestal portion inside the through hole,
A pressing step of pressing the circuit board against the pedestal portion,
A pressing step of pressing the heat transfer member with a press jig after the pressing step to crimp the heat transfer member into the through hole.