CN204789140U - A test fixture for metal electrode does not have a lead wire wrapper spare bending test - Google Patents
A test fixture for metal electrode does not have a lead wire wrapper spare bending test Download PDFInfo
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- CN204789140U CN204789140U CN201520504042.9U CN201520504042U CN204789140U CN 204789140 U CN204789140 U CN 204789140U CN 201520504042 U CN201520504042 U CN 201520504042U CN 204789140 U CN204789140 U CN 204789140U
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- circuit board
- printed circuit
- test
- pcb
- test fixture
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Abstract
The utility model provides a test fixture for metal electrode does not have a lead wire wrapper spare bending test. It includes: the base is provided with the test cavity that is used for holding printed circuit board, convex support, wherein set up in the bottom of a relative lateral wall of test cavity is provided with convex support, and the cambered surface of convex support is relative, in order to be used for the support printed circuit board, the center department of printed circuit board's lower surface installs the device. The crooked degree of depth that adopts this test fixture to come accurate control printed circuit board through the stroke that curved utensil was sent in the operation need not the stroke that complicated calculation can obtain to send curved utensil, improves bending test's efficiency.
Description
Technical field
The utility model relates to metal electrode non-leaded package device strength experimental technique field, particularly relates to a kind of test fixture for the test of metal electrode non-leaded package device bend.
Background technology
Metal electrode is the packing forms that highly reliable device generally adopts without lead-in wire glass-encapsulated, especially in military domain, the encapsulation of switching diode, commutation diode, voltage-reference diodes, voltage adjustment diode, transient voltage suppressor diode is widely used in.Compare compared to traditional axial lead diode, metal electrode has without lead-in wire glass-encapsulated diode that volume is little, lightweight, packing density high, meets the requirement of weaponry miniaturization and aerospace field to the requirement reducing system weight and volume.Metal electrode is metal electrode without the two ends of lead-in wire glass-encapsulated diode, and chip and binding post are protected by glass shell.
Usually before device dispatches from the factory, need analog device installing, the stress situation that is subject to when using and reprocess, examine device to bear the ability of these stress with this, the test completed required for device comprises tensile test, bending test and torsion test.
Wherein, when installing metal electrode without lead-in wire glass-encapsulated diode, by two exit welding on a printed circuit board, this belongs to surface mount manner.Metal electrode is without the glass resistance to stress ability of lead-in wire glass-encapsulated diode outside.Metal electrode is without going between glass-encapsulated diode in installation and use procedure, exit, even overall device can bear certain external stress, but because device is different with the thermal expansivity of printed circuit board, when device after installation in the course of the work and ambient temperature sharply changes, between device and printed circuit board, there is certain internal stress.The design of device, material or manufacturing process also can affect the intensity of device exit and the installation strength of overall device, after the stress that device bears reaches its ultimate value, glass shell there will be crack and even ruptures, and causes the electrical quantity of device to be degenerated and even loses efficacy.Therefore, in the application scenario of device high reliability, must metal electrode be evaluated without the exit intensity of lead-in wire glass-encapsulated diode and the installation strength of overall device and be examined, to guarantee the reliability of metal electrode without lead-in wire glass-encapsulated diode.
Currently used bending test is specially: be arranged on by device on the center of FR4 type printed circuit board of 51mm × 51mm × 1.6mm.The both sides of printed circuit board are fixed, applies a stress at the another side of installing device, the center of printed circuit board is departed from and moves axially 1.6mm and keep 1min.During actual enforcement, that printed circuit board two ends are placed on metal rod, utilize thrust test machine that printed circuit board center is pushed away the certain stroke of printed circuit board plane, need the center of printed circuit board to depart from during test to move axially 1.6mm, namely the bending degree of depth of printed circuit board is 1.6mm, and the stroke causing curved utensil is the bending degree of depth that A is not equal to printed circuit board.And the stroke causing curved utensil needs to carry out complicated calculations according to the bending degree of depth of the spacing between two metal rods and tonequality circuit board, there is larger workload.Therefore, a kind of test fixture for the test of metal electrode non-leaded package device bend is needed, to solve the above-mentioned technical matters existed in prior art.
Utility model content
The utility model provides a kind of test fixture for the test of metal electrode non-leaded package device bend.Adopting this test fixture accurately can control the bending degree of depth of printed circuit board by operating the stroke causing curved utensil, the stroke causing curved utensil can be obtained without the need to complicated calculations, improve the efficiency of bending test.
The technical solution adopted in the utility model is:
For a test fixture for metal electrode non-leaded package device bend test, it comprises: base, is provided with the test cavity for holding printed circuit board (PCB); Arc stent, is arranged at the bottom of an opposing sidewalls of described test cavity, and the cambered surface of described arc stent is relative, for the described printed circuit board (PCB) of support.
Preferably, the xsect of described arc stent is quadrant roller.
Preferably, the center of the lower surface of described printed circuit board (PCB) is provided with device, and described test fixture also comprises: fixed block, is configured to tabular, and the corresponding described device in center of described fixed block has sleeve joint hole; Pressurizing block, be socketed in described sleeve joint hole, and described pressurizing block can move along the direction perpendicular to described fixed block surface, when described printed circuit board (PCB) is contained in described test cavity, described fixed block is fastened in described test cavity, and described pressurizing block moves down the described printed circuit board (PCB) that bends.
Preferably, the thickness that described pressurizing block is greater than described fixed block along the thickness perpendicular to fixed block surface reaches predetermined distance.
Preferably, described predetermined distance is 1.6mm.
Preferably, the bottom of described test cavity is provided with the subsider of corresponding described pressurizing block, to hold described device in described pressurizing block to when pressing down described printed circuit board (PCB).
Preferably, another relative sidewall of described test cavity is provided with open ports.
Adopt technique scheme, the utility model at least has following advantages: printed circuit board (PCB) only has the lower side at two ends to contact with arc stent in the overall process of bending test, thus make the bending stroke of pressurizing block and the bending degree of depth of printed circuit board (PCB), namely printed circuit board (PCB) center position off-axis to displacement consistent, ensure that accurately carrying out of bending test, improve the efficiency of bending test.
Accompanying drawing explanation
Fig. 1 is the vertical view of the test fixture of a preferred embodiment of the present utility model;
Fig. 2 is the side view of test fixture shown in Fig. 1;
The bending schematic diagram of printed circuit board (PCB) when Fig. 3 is for adopting test fixture shown in Fig. 2 to carry out bending test.
Wherein, 1-base; 10-test cavity; 11-arc stent; 12-subsider; 13-open ports; 2-printed circuit board (PCB); 3-device; 4-fixed block; 40-sleeve joint hole; 41-pressurizing block.
Embodiment
For further setting forth the utility model for the technological means reaching predetermined object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, the utility model is described in detail as rear.
The test fixture (hereinafter referred to as test fixture) for metal electrode non-leaded package device 3 (hereinafter referred to as device 3) bending test that the utility model provides comprises base 1, and test fixture of the present utility model and all parts thereof will be described in detail belows.
As depicted in figs. 1 and 2, base 1, be provided with the test cavity 10 for holding printed circuit board (PCB) 2, wherein the bottom of an opposing sidewalls of test cavity 10 is provided with arc stent 11, and the cambered surface of arc stent 11 is relative, for supporting printing board 2.From in figure, printed circuit board (PCB) 2 is made into rectangle usually, when printed circuit board (PCB) 2 is supported on arc stent 11 as shown in the figure, the lower side at printed circuit board (PCB) 2 two ends contacts with arc stent 11, and in the process that printed circuit board (PCB) 2 is pressed downward, the lower side at printed circuit board (PCB) 2 two ends is contacted with arc stent 11 all the time, and also only have the lower side at printed circuit board (PCB) 2 two ends to contact with arc stent 11, guarantee that the downward bending degree of depth of printed circuit board (PCB) equals the bending stroke of printed circuit board (PCB) thus.The xsect of arc stent refers to one section of circular arc on a certain circle, and as preferably, as shown in Figure 3, the xsect of arc stent can be quarter circular arc.While ensureing that the lower side at printed circuit board (PCB) 2 two ends is contacted with arc stent 11 all the time, save timbering material.
As preferred embodiment, as depicted in figs. 1 and 2, the center of the lower surface of printed circuit board (PCB) 2 is provided with device 3, and fixed block 4, is configured to tabular, the center respective devices of fixed block has sleeve joint hole 40, be socketed with pressurizing block 41 in sleeve joint hole 40, and pressurizing block can move along the direction perpendicular to fixed block surface, when printed circuit board (PCB) 2 is contained in test cavity 10, fixed block 4 is fastened in test cavity 10, and pressurizing block 41 moves down the printed circuit board (PCB) that bends.The object arranging fixed block 4 is for pressurizing block 41 plays the effect of guiding, because fixed block 4 is buckled in test cavity 10, thus can perpendicular to the surface of fixed block 4 when pressurizing block 41 moves down, namely to bend downwards printed circuit board (PCB) perpendicular to the direction of printed circuit board (PCB), thus to pressing down, guide effect is played to pressurizing block 41.It should be noted that, pressurizing block 41 is socketed in sleeve joint hole 40 can adopt numerous embodiments, the sidewall of sleeve joint hole 40 such as, have pilot hole along the direction perpendicular to the surface of fixed block 4, and pressurizing block 41 is realized along the movement perpendicular to the direction on the surface of fixed block 4 by the lug boss coordinated with this pilot hole.This shows, pressurizing block 41 in sleeve joint hole be clearance fit, when fixed block 4 is positioned on printed circuit board (PCB), the lower surface of pressurizing block 41 fits in the upper surface of printed circuit board (PCB), and printed circuit board (PCB) just can bend downwards same distance by the distance moved down when pressurizing block 41.
As shown in Figure 2, as preferably, the thickness that pressurizing block 41 is greater than fixed block 4 along the thickness perpendicular to fixed block surface reaches predetermined distance, such structure is adopted to realize: when pressurizing block 41 being moved downward to the upper surface flush of the upper surface of pressurizing block 41 and fixed block 4, can determine that the bending stroke that printed circuit board (PCB) bends by pressurizing block 41 is above-mentioned predetermined distance downwards, and arc stent the bending degree of depth that the bending stroke that can realize printed circuit board (PCB) equals printed circuit board (PCB) is set, accurately can control the bending degree of depth of printed circuit board (PCB) thus.Further, predetermined distance is 1.6mm.Due to bending test standard regulation, the center off-axis of printed circuit board (PCB) should be made during test to 1.6mm and keep 1min.Therefore, in the utility model, pressurizing block 41 can move 1.6mm along the direction perpendicular to fixed block 4 surface, when carrying out bending test, employing causes curved utensil and exerts pressure to pressurizing block 41, while pressurizing block 41 moves down 1.6mm, bend printed circuit board (PCB) 2 downwards 1.6mm, thus the bending degree of depth obtaining printed circuit board (PCB) 2 is 1.6mm.Achieve bending realization thus simply, bending severity control is accurate.
In addition, as shown in Figure 2, the bottom of test cavity 10 is provided with the subsider 12 of corresponding pressurizing block 41, with the containment device 3 when pressurizing block 41 downward pressing printed circuit board 2.Thus, only in test cavity 10, the part corresponding with pressurizing block 41 is offered subsider, be all the same without the need to the degree of depth bottom test cavity 10, reduce the processing cost of test fixture.Preferably, another relative sidewall of test cavity 10 is provided with open ports 13.The setting of open ports 13 is the installations for the ease of test fixture, improves the efficiency that bending test is carried out.
By the explanation of embodiment, should to the utility model for the technological means reaching predetermined object and take and effect be able to more deeply and concrete understanding, but appended diagram is only to provide with reference to the use with explanation, is not used for being limited the utility model.
Claims (7)
1., for a test fixture for metal electrode non-leaded package device bend test, it is characterized in that, comprising:
Base, is provided with the test cavity for holding printed circuit board (PCB);
Arc stent, is arranged at the bottom of an opposing sidewalls of described test cavity, and the cambered surface of described arc stent is relative, for the described printed circuit board (PCB) of support.
2. test fixture according to claim 1, is characterized in that, the xsect of described arc stent is quadrant roller.
3. test fixture according to claim 1 and 2, is characterized in that, the center of the lower surface of described printed circuit board (PCB) is provided with device, and described test fixture also comprises:
Fixed block, is configured to tabular, and the corresponding described device in center of described fixed block has sleeve joint hole;
Pressurizing block, be socketed in described sleeve joint hole, and described pressurizing block can move along the direction perpendicular to described fixed block surface, when described printed circuit board (PCB) is contained in described test cavity, described fixed block is fastened in described test cavity, and described pressurizing block moves down the described printed circuit board (PCB) that bends.
4. test fixture according to claim 3, is characterized in that, the thickness that described pressurizing block is greater than described fixed block along the thickness perpendicular to fixed block surface reaches predetermined distance.
5. test fixture according to claim 4, is characterized in that, described predetermined distance is 1.6mm.
6. test fixture according to claim 3, is characterized in that, the bottom of described test cavity is provided with the subsider of corresponding described pressurizing block, to hold described device in described pressurizing block to when pressing down described printed circuit board (PCB).
7. test fixture according to claim 1, is characterized in that, another relative sidewall of described test cavity is provided with open ports.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520504042.9U CN204789140U (en) | 2015-07-13 | 2015-07-13 | A test fixture for metal electrode does not have a lead wire wrapper spare bending test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520504042.9U CN204789140U (en) | 2015-07-13 | 2015-07-13 | A test fixture for metal electrode does not have a lead wire wrapper spare bending test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204789140U true CN204789140U (en) | 2015-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520504042.9U Expired - Fee Related CN204789140U (en) | 2015-07-13 | 2015-07-13 | A test fixture for metal electrode does not have a lead wire wrapper spare bending test |
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| Country | Link |
|---|---|
| CN (1) | CN204789140U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760539A (en) * | 2018-07-17 | 2018-11-06 | 珠海格力电器股份有限公司 | Printed circuit board deformation test equipment |
| CN110779863A (en) * | 2019-11-06 | 2020-02-11 | 江苏集萃安泰创明先进能源材料研究院有限公司 | Method for evaluating residual thermal stress of amorphous alloy thin strip |
-
2015
- 2015-07-13 CN CN201520504042.9U patent/CN204789140U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760539A (en) * | 2018-07-17 | 2018-11-06 | 珠海格力电器股份有限公司 | Printed circuit board deformation test equipment |
| CN110779863A (en) * | 2019-11-06 | 2020-02-11 | 江苏集萃安泰创明先进能源材料研究院有限公司 | Method for evaluating residual thermal stress of amorphous alloy thin strip |
| CN110779863B (en) * | 2019-11-06 | 2022-03-29 | 江苏集萃安泰创明先进能源材料研究院有限公司 | Method for evaluating residual thermal stress of amorphous alloy thin strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20160713 |