JP6640854B2 - 化学機械研磨のためのコーティングされた圧縮サブパッド - Google Patents
化学機械研磨のためのコーティングされた圧縮サブパッド Download PDFInfo
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- JP6640854B2 JP6640854B2 JP2017527270A JP2017527270A JP6640854B2 JP 6640854 B2 JP6640854 B2 JP 6640854B2 JP 2017527270 A JP2017527270 A JP 2017527270A JP 2017527270 A JP2017527270 A JP 2017527270A JP 6640854 B2 JP6640854 B2 JP 6640854B2
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/0278—Polyurethane
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本出願は、2014年11月21日に出願された米国仮出願第62/083,101号の利益を主張する、2015年3月2日に出願された米国特許出願第14/635973号の利益を主張するものであり、それらの全内容は参照により本明細書に組み込まれる。
Claims (24)
- 基材を研磨するための研磨パッドスタックであって、前記研磨パッドスタックが、
研磨表面及び裏面を有する研磨パッドと、
第1の感圧性接着剤層が上にコーティングされた第1の表面を有する圧縮サブパッドとを備え、
前記圧縮サブパッドの前記第1の表面が、前記第1の感圧性接着剤層によって前記研磨パッドの前記裏面に直接結合され、前記圧縮サブパッドの前記第1の表面が、約30〜40dyne/cm 2 の範囲の表面エネルギーを有する、研磨パッドスタック。 - 前記圧縮サブパッドの第2の表面上にコーティングされた第2の感圧性接着剤層を更に備え、前記圧縮サブパッドの前記第2の表面が、前記第1の表面と反対側である、請求項1に記載の研磨パッドスタック。
- 前記第1の感圧性接着剤層が、恒久感圧性接着剤層であり、及び前記第2の感圧性接着剤層が、取り外し可能な感圧性接着剤層である、請求項2に記載の研磨パッドスタック。
- 前記取り外し可能な感圧性接着剤層が、前記研磨パッドスタックを化学機械研磨装置のプラテンに結合するためのものである、請求項3に記載の研磨パッドスタック。
- 前記取り外し可能な感圧性接着剤層上に配置された剥離ライナーを更に備える、請求項4に記載の研磨パッドスタック。
- 前記第1の感圧性接着剤層が、25℃で約4.5ポンド/インチを超える剥離強度を有し、及び前記第2の感圧性接着剤層が、25℃で約4ポンド/インチ未満の剥離強度を有する、請求項3に記載の研磨パッドスタック。
- 前記第2の感圧性接着剤層が、25℃で約2.5ポンド/インチ未満の剥離強度を有する、請求項6に記載の研磨パッドスタック。
- 前記圧縮サブパッドが、圧縮発泡体サブパッドである、請求項1に記載の研磨パッドスタック。
- 前記圧縮発泡体サブパッドが、エチレンビニルアセテート独立気泡発泡体材料、ポリエチレン独立気泡発泡体材料、及び大部分が独立気泡のポリウレタン発泡体材料からなる群から選択される材料を含む、請求項8に記載の研磨パッドスタック。
- 前記圧縮サブパッドが、約10ミル〜40ミルの範囲の厚さを有する、請求項1に記載の研磨パッドスタック。
- 前記圧縮サブパッドの前記第1の表面が、少なくとも3マイクロメートルの表面粗さを有し、及びある総表面積を有し、前記第1の感圧性接着剤層が、前記圧縮サブパッドの前記第1の表面の前記総表面積の少なくとも90%と直接接触している、請求項1に記載の研磨パッドスタック。
- 前記第1の感圧性接着剤層が、アクリル材料、ゴム、エチレンビニルアセテート、シリコーン材料、及びブロック共重合体からなる群から選択される材料を含む、請求項1に記載の研磨パッドスタック。
- 研磨パッドが、熱硬化性ポリウレタン材料を含む、請求項1に記載の研磨パッドスタック。
- 研磨パッドが、下地層に結合された研磨層を備え、及び前記研磨パッドの裏面が、前記下地層の表面である、請求項2に記載の研磨パッドスタック。
- 研磨パッドスタック用サブパッドであって、前記サブパッドが、
第1の表面、及び反対側の第2の表面を有する圧縮サブパッド材料と、
前記圧縮サブパッド材料の前記第1の表面上へコーティングされた第1の感圧性接着剤層、及び前記第1の感圧性接着剤層上に配置された第1の剥離ライナーと、
前記圧縮サブパッド材料の前記第2の表面上へコーティングされた第2の感圧性接着剤層とを備え、前記圧縮サブパッド材料が、圧縮発泡体サブパッド材料であり、及び前記圧縮発泡体サブパッド材料の前記第1及び第2の表面が、それぞれ約30〜40dyne/cm 2 の範囲の表面エネルギーを有する、サブパッド。 - 前記第2の感圧性接着剤層上に配置された第2の剥離ライナーを更に備える、請求項15に記載のサブパッド。
- 前記第1の感圧性接着剤層が、取り外し可能な感圧性接着剤層であり、及び前記第2の感圧性接着剤層が、恒久感圧性接着剤層である、請求項15に記載のサブパッド。
- 前記恒久感圧性接着剤層が、研磨パッドの裏面へ結合するためのものであり、及び前記取り外し可能な感圧性接着剤層が、前記サブパッドを化学機械研磨装置のプラテンへ結合するためのものである、請求項17に記載のサブパッド。
- 前記第2の感圧性接着剤層が、25℃で約4.5ポンド/インチを超える剥離強度を有し、及び前記第1の感圧性接着剤層が、25℃で約4ポンド/インチ未満の剥離強度を有する、請求項15に記載のサブパッド。
- 前記圧縮サブパッド材料が、エチレンビニルアセテート独立気泡発泡体材料、ポリエチレン独立気泡発泡体材料、及び大部分が独立気泡のポリウレタン発泡体材料からなる群から選択される材料を含む圧縮発泡体サブパッド材料である、請求項15に記載のサブパッド。
- 前記圧縮サブパッド材料が、約10ミル〜40ミルの範囲の厚さを有する、請求項15に記載のサブパッド。
- 前記第2の感圧性接着剤層が、アクリル材料、ゴム、エチレンビニルアセテート、シリコーン材料、及びブロック共重合体からなる群から選択される第1の材料を含み、前記第1の感圧性接着剤層が、アクリル材料、ゴム、エチレンビニルアセテート、シリコーン材料、及びブロック共重合体からなる群から選択される第2の材料を含む、請求項15に記載のサブパッド。
- 前記圧縮サブパッド材料の前記第1の表面が、少なくとも3マイクロメートルの表面粗さを有し、及びある総表面積を有し、前記第1の感圧性接着剤層が、前記圧縮サブパッド材料の前記第1の表面の前記総表面積の少なくとも90%と直接接触している、請求項15に記載のサブパッド。
- 前記圧縮サブパッド材料の前記第2の表面が、少なくとも3マイクロメートルの表面粗さを有し、及びある総表面積を有し、前記第2の感圧性接着剤層が、前記圧縮サブパッド材料の前記第2の表面の前記総表面積の少なくとも90%と直接接触している、請求項23に記載のサブパッド。
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US201462083101P | 2014-11-21 | 2014-11-21 | |
US62/083,101 | 2014-11-21 | ||
US14/635,973 US20160144477A1 (en) | 2014-11-21 | 2015-03-02 | Coated compressive subpad for chemical mechanical polishing |
US14/635,973 | 2015-03-02 | ||
PCT/US2015/060343 WO2016081272A1 (en) | 2014-11-21 | 2015-11-12 | Coated compressive subpad for chemical mechanical polishing |
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JP2017537801A JP2017537801A (ja) | 2017-12-21 |
JP6640854B2 true JP6640854B2 (ja) | 2020-02-05 |
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US (2) | US20160144477A1 (ja) |
EP (1) | EP3221085B1 (ja) |
JP (1) | JP6640854B2 (ja) |
KR (1) | KR102474501B1 (ja) |
CN (1) | CN107206569A (ja) |
MY (1) | MY182612A (ja) |
SG (1) | SG11201703778RA (ja) |
TW (1) | TWI583492B (ja) |
WO (1) | WO2016081272A1 (ja) |
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TWI626117B (zh) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
US10786885B2 (en) * | 2017-01-20 | 2020-09-29 | Applied Materials, Inc. | Thin plastic polishing article for CMP applications |
US20190212792A1 (en) * | 2018-01-05 | 2019-07-11 | Lander LLC | Thermally Resistive Electronics Case |
US20200206874A1 (en) * | 2018-12-28 | 2020-07-02 | Saint-Gobain Abrasives, Inc. | Lay flat coated abrasive discs |
WO2020223455A1 (en) * | 2019-04-30 | 2020-11-05 | Cabot Microelectronics Corporation | Chemical-mechanical polishing pad with textured platen adhesive |
TWI818029B (zh) * | 2019-05-31 | 2023-10-11 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法以及研磨方法 |
CN116847948A (zh) * | 2020-12-22 | 2023-10-03 | Cmc材料有限责任公司 | 具有带有聚合物型外壳的成孔剂的化学-机械抛光副垫 |
CN114227530B (zh) * | 2021-12-10 | 2022-05-10 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫及半导体器件的制造方法 |
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-
2015
- 2015-03-02 US US14/635,973 patent/US20160144477A1/en not_active Abandoned
- 2015-11-12 MY MYPI2017701638A patent/MY182612A/en unknown
- 2015-11-12 KR KR1020177016555A patent/KR102474501B1/ko active IP Right Grant
- 2015-11-12 CN CN201580063415.6A patent/CN107206569A/zh active Pending
- 2015-11-12 WO PCT/US2015/060343 patent/WO2016081272A1/en active Application Filing
- 2015-11-12 JP JP2017527270A patent/JP6640854B2/ja active Active
- 2015-11-12 EP EP15808296.6A patent/EP3221085B1/en active Active
- 2015-11-12 SG SG11201703778RA patent/SG11201703778RA/en unknown
- 2015-11-20 TW TW104138629A patent/TWI583492B/zh active
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2018
- 2018-01-19 US US15/875,773 patent/US11440158B2/en active Active
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US20160144477A1 (en) | 2016-05-26 |
EP3221085A1 (en) | 2017-09-27 |
TW201632304A (zh) | 2016-09-16 |
US11440158B2 (en) | 2022-09-13 |
US20180141183A1 (en) | 2018-05-24 |
KR102474501B1 (ko) | 2022-12-06 |
MY182612A (en) | 2021-01-27 |
EP3221085B1 (en) | 2024-05-29 |
CN107206569A (zh) | 2017-09-26 |
JP2017537801A (ja) | 2017-12-21 |
WO2016081272A1 (en) | 2016-05-26 |
TWI583492B (zh) | 2017-05-21 |
SG11201703778RA (en) | 2017-06-29 |
KR20170095871A (ko) | 2017-08-23 |
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