JP6636961B2 - 太陽電池製造のための改善されたエッチングプロセス - Google Patents
太陽電池製造のための改善されたエッチングプロセス Download PDFInfo
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- JP6636961B2 JP6636961B2 JP2016575679A JP2016575679A JP6636961B2 JP 6636961 B2 JP6636961 B2 JP 6636961B2 JP 2016575679 A JP2016575679 A JP 2016575679A JP 2016575679 A JP2016575679 A JP 2016575679A JP 6636961 B2 JP6636961 B2 JP 6636961B2
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- 238000000034 method Methods 0.000 title claims description 189
- 230000008569 process Effects 0.000 title claims description 143
- 238000005530 etching Methods 0.000 title claims description 124
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002019 doping agent Substances 0.000 claims description 165
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 150
- 229910052710 silicon Inorganic materials 0.000 claims description 150
- 239000010703 silicon Substances 0.000 claims description 150
- 239000000758 substrate Substances 0.000 claims description 98
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 38
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
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Description
[項目1]
太陽電池を製造する方法であって、上記方法は、
シリコン基板の上方に第1のドーパント領域を形成することと、
上記第1のドーパント領域の上方に酸化物領域を形成することであって、上記第1のドーパント領域を第1のエッチングプロセスから保護する上記酸化物領域を形成することと、
上記シリコン基板の上方に第2のドーパント領域を形成することと、
上記第2のドーパント領域の第1の部分の上方にマスクを形成することであって、上記第2のドーパント領域の上記第1の部分を上記第1のエッチングプロセスから保護する上記マスクを形成することと、
上記シリコン基板の部分を露出させるために上記第1のエッチングプロセスを実行することと、を含む方法。
[項目2]
上記シリコン基板の部分を露出させるために上記第1のエッチングプロセスを実行することが、時限酸化物エッチングを実行することを含む、項目1に記載の方法。
[項目3]
上記シリコン基板の部分を露出させるために上記第1のエッチングプロセスを実行することが、フッ酸又は硝酸のうちの少なくとも1つを用いたエッチングを含む、項目1に記載の方法。
[項目4]
酸化物領域を形成することが、上記第1のドーパント領域上に非ドープ酸化物領域を形成することを含む、項目1に記載の方法。
[項目5]
上記シリコン基板の上方に上記第1のドーパントを形成することが、上記シリコン基板の上方にホウ素を形成することを含む、項目1に記載の方法。
[項目6]
第1のエッチングプロセスを実行する前に、
上記シリコン基板内又はその上方に第1のドープ領域及び第2のドープ領域を形成するために、上記第1のドーパント領域及び上記第2のドーパント領域からのドーパントのドライブを行うことを更に含む、項目1に記載の方法。
[項目7]
ドーパントのドライブを行う前に、
上記シリコン基板の上方に誘電体領域を形成することと、
上記誘電体領域の上方にシリコン領域を形成することと、を更に含み、ドーパントのドライブを行うことが、上記シリコン領域内に第1のドープ領域及び第2のドープ領域を形成することを含む、項目6に記載の方法。
[項目8]
上記誘電体領域の上方に上記シリコン領域を形成することが、上記誘電体領域の上方にアモルファスシリコン領域を形成することを含む、項目7に記載の方法。
[項目9]
上記シリコン基板の上方に上記第2のドーパント領域を形成することが、上記第1のドーパント領域、酸化物領域及び上記シリコン基板の上方に上記第2のドーパント領域を形成することを含む、項目1に記載の方法。
[項目10]
太陽電池を製造する方法であって、上記方法は、
上記シリコン基板の上方にシリコン領域を形成することと、
上記シリコン領域上に第1のドーパント領域を形成することと、
上記第1のドーパント領域上に酸化物領域を形成することであって、上記酸化物領域の第1の部分は上記第1のドーパント領域を第1のエッチングプロセスから保護し、上記酸化物領域の第2の部分は上記第1のドーパント領域を第2のエッチングプロセスから保護する上記酸化物領域を形成することと、
上記シリコン領域上に第2のドーパント領域を形成することと、
上記第1のドーパント領域及び上記第2のドーパント領域から、ドーパントの上記シリコン領域へのドライブを行うことであって、上記ドライブを行うことは、上記シリコン領域内に第1のドープ領域及び第2のドープ領域を形成する上記ドライブを行うことと、
上記第2のドーパント領域の第1の部分上にマスクを形成することであって、上記第2のドーパント領域の上記第1の部分を上記第1のエッチングプロセスから保護する上記マスクを形成することと、
上記シリコン領域の部分を露出させるために上記第1のエッチングプロセスを実行することと、
上記第1のドープ領域と上記第2のドープ領域とを分離するトレンチ領域を形成するために、上記第2のエッチングプロセスを実行することと、を含む方法。
[項目11]
上記シリコン領域の部分を露出させるために上記第1のエッチングプロセスを実行することが、時限酸化物エッチングを実行することを含む、項目10に記載の方法。
[項目12]
上記シリコン領域の部分を露出させるために上記第1のエッチングプロセスを実行することが、フッ酸又は硝酸のうちの少なくとも1つを用いたエッチングを含む、項目10に記載の方法。
[項目13]
上記シリコン基板の上方に上記第1のドーパント領域を形成することが、上記シリコン基板の上方にホウ素を形成することを含む、項目10に記載の方法。
[項目14]
上記酸化物領域を除去するために第3のエッチングプロセスを実行することを更に含む、項目10に記載の方法。
[項目15]
上記酸化物領域を除去するために第3のエッチングプロセスを実行することが、金属洗浄プロセスを実行することを含む、項目14に記載の方法。
[項目16]
第3のエッチングプロセスを実行することが、フッ酸、オゾン又は塩酸のうちの少なくとも1つを用いたエッチングを含む、項目14に記載の方法。
[項目17]
太陽電池を製造する方法であって、上記方法は、
上記シリコン基板の上方にシリコン領域を形成することと、
上記シリコン領域上に第1のドーパント領域を形成することと、
上記第1のドーパント領域上に酸化物領域を形成することであって、上記酸化物領域の第1の部分は上記第1のドーパント領域を第1のエッチングプロセスから保護し、上記酸化物領域の第2の部分は上記第1のドーパント領域を第2のエッチングプロセスから保護する上記酸化物領域を形成することと、
上記シリコン領域上に第2のドーパント領域を形成することと、
上記第1のドーパント領域及び上記第2のドーパント領域から、ドーパントの上記シリコン領域へのドライブを行うことであって、上記ドライブを行うことは、上記シリコン領域内に第1のドープ領域及び第2のドープ領域を形成する上記ドライブを行うことと、
上記第2のドーパント領域の第1の部分上にマスクを形成することであって、上記第2のドーパント領域の上記第1の部分を上記第1のエッチングプロセスから保護する上記マスクを形成することと、
上記シリコン領域の部分を露出させ、上記酸化物領域の第1の部分、及び上記マスクを除去するために、上記第1のエッチングプロセスを実行することと、
上記第1のドープ領域と上記第2のドープ領域とを分離するトレンチ領域を形成するために、上記第2のエッチングプロセスを実行することと、
上記シリコン基板の露出領域上にテクスチャ加工領域を形成するためにテクスチャ加工プロセスを実行することと、
上記酸化物領域及び汚染物質を上記シリコン基板から除去するために第3のエッチングプロセスを実行することと、
上記シリコン基板上に乾燥プロセスを実行することと、を含む方法。
[項目18]
上記シリコン基板の部分を露出させるために上記第1のエッチングプロセスを実行することが、フッ酸及び硝酸のうちの少なくとも1つを用いたエッチングを含む、項目17に記載の方法。
[項目19]
第3のエッチングプロセスを実行することが、フッ酸、オゾン又は塩酸のうちの少なくとも1つを用いたエッチングを含む、項目17に記載の方法。
[項目20]
上記シリコン基板の上方に上記第2のドーパント領域を形成することが、上記第1のドーパント領域、酸化物領域及び上記シリコン基板の上方に上記第2のドーパント領域を形成することを含む、項目17に記載の方法。
Claims (11)
- 太陽電池を製造する方法であって、前記方法は、
シリコン基板の上方に第1のドーパント領域を形成することと、
前記第1のドーパント領域の上方に酸化物領域を形成することであって、第1の部分と、前記酸化物領域の前記第1の部分の下方にある第2の部分とを有し、前記第1のドーパント領域を第1のエッチングプロセスから保護する前記酸化物領域を形成することと、
前記シリコン基板の上方に第2のドーパント領域を形成することと、
前記第2のドーパント領域の第1の部分の上方にマスクを形成することであって、前記第2のドーパント領域の前記第1の部分を前記第1のエッチングプロセスから保護する前記マスクを形成することと、
前記シリコン基板の部分を露出させるために前記第1のエッチングプロセスを実行することと、を含み、
前記第1のエッチングプロセスは、前記酸化物領域の前記第1の部分を除去し、前記酸化物領域の前記第2の部分を前記第1のドーパント領域の上方に残す、方法。 - 前記第2のドーパント領域の第1の部分の上方にマスクを形成することは、前記第2のドーパント領域の前記第1の部分の上方にマスクを形成し、前記第1のドーパント領域の上方にマスクを形成しないことを含む、請求項1に記載の方法。
- 前記シリコン基板の部分を露出させるために前記第1のエッチングプロセスを実行することが、時限酸化物エッチングを実行することを含む、請求項1または2に記載の方法。
- 前記シリコン基板の部分を露出させるために前記第1のエッチングプロセスを実行することが、フッ酸又は硝酸のうちの少なくとも1つを用いたエッチングを含む、請求項1から3のいずれか一項に記載の方法。
- 酸化物領域を形成することが、前記第1のドーパント領域上に非ドープ酸化物領域を形成することを含む、請求項1から4のいずれか一項に記載の方法。
- 前記シリコン基板の上方に前記第1のドーパント領域を形成することが、前記シリコン基板の上方にホウ素を形成することを含む、請求項1から5のいずれか一項に記載の方法。
- 第1のエッチングプロセスを実行する前に、
前記シリコン基板内又はその上方に第1のドープ領域及び第2のドープ領域を形成するために、前記第1のドーパント領域及び前記第2のドーパント領域からのドーパントのドライブを行うことを更に含む、請求項1から6のいずれか一項に記載の方法。 - ドーパントのドライブを行う前に、
前記シリコン基板の上方に誘電体領域を形成することと、
前記誘電体領域の上方にシリコン領域を形成することと、を更に含み、ドーパントのドライブを行うことが、前記シリコン領域内に第1のドープ領域及び第2のドープ領域を形成することを含む、請求項7に記載の方法。 - 前記誘電体領域の上方に前記シリコン領域を形成することが、前記誘電体領域の上方にアモルファスシリコン領域を形成することを含む、請求項8に記載の方法。
- 前記第1のドープ領域及び前記第2のドープ領域を分離するトレンチ領域を形成するために第2のエッチングプロセスを実行することを更に含む、請求項8または9に記載の方法。
- 前記シリコン基板の上方に前記第2のドーパント領域を形成することが、前記第1のドーパント領域、酸化物領域及び前記シリコン基板の上方に前記第2のドーパント領域を形成することを含む、請求項1から10のいずれか一項に記載の方法。
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