JP6636728B2 - 境界潤滑状態となる高温で動作する堆積物のコーティングおよびその方法 - Google Patents
境界潤滑状態となる高温で動作する堆積物のコーティングおよびその方法 Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims description 88
- 239000011248 coating agent Substances 0.000 title claims description 69
- 238000000034 method Methods 0.000 title claims description 43
- 238000005461 lubrication Methods 0.000 title claims description 23
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 claims description 77
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 51
- 238000004544 sputter deposition Methods 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 229910052750 molybdenum Inorganic materials 0.000 claims description 39
- 229910052799 carbon Inorganic materials 0.000 claims description 37
- 229910002804 graphite Inorganic materials 0.000 claims description 36
- 239000010439 graphite Substances 0.000 claims description 36
- 229910052721 tungsten Inorganic materials 0.000 claims description 33
- 150000002500 ions Chemical class 0.000 claims description 24
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 22
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 11
- 239000003921 oil Substances 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 238000005513 bias potential Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 238000004663 powder metallurgy Methods 0.000 claims description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 238000007667 floating Methods 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 3
- 239000012300 argon atmosphere Substances 0.000 claims description 2
- 238000010891 electric arc Methods 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 230000003116 impacting effect Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 230000002123 temporal effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229910021385 hard carbon Inorganic materials 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000010406 cathode material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000010724 circulating oil Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000004792 oxidative damage Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M103/00—Lubricating compositions characterised by the base-material being an inorganic material
- C10M103/04—Metals; Alloys
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C23C14/025—Metallic sublayers
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- Plasma & Fusion (AREA)
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- Physical Vapour Deposition (AREA)
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Description
A)処理チャンバ内でのHIPIMS放電により生成された、WおよびCイオン、MoおよびCイオンおよびW,MoおよびCイオンの少なくとも1つの加速されたイオンで同時にワークピースの表面を衝撃するステップ、
B)20nm〜1000nmの範囲の厚さの少なくともWおよびMoの1つである金属および/または窒化物遷移層を、HIPIMSスパッタリング、またはHIPIMSスパッタリングを含むマグネトロン・スパッタリングにより堆積させるステップ、
C)下記カソード構成、
a)W,MoおよびCを含むHIPIMSスパッタリング・カソードであって、それぞれの成分であるW,MoおよびCからの粉末冶金による焼結、または鋳造、または機械的なセグメント化のいずれかにより形成されるHIPIMSスパッタリング・カソード、およびこれに伴うHIPIMS電源、
b)WおよびMoの1つを含むHIPIMS電源カソードおよび構成するHIPIMSスパッタリング・カソード、およびこれに伴うHIPIMS電源、
c)WおよびWCの1つを含む第1のHIPIMSカソード、およびMoを含む第2のHIPIMSカソードであって、それぞれのカソードが、連合するHIPIMS電源を持つそれぞれのカソードを構成する第2のHIPIMSスパッタリング・カソードおよびこれらに伴い、それぞれが共通の電源に接続されるHIPIMS電源、
d)前記カソード構成a),b)およびc)のいずれかと、それぞれが共通の電源に接続されたDCスパッタリング電源を伴う1またはそれ以上のグラファイト・カソード、
のうちの1つを使用するHIPIMSスパッタリングまたはHIPIMSスパッタリングを含むマグネトロン・スパッタリングによりMe−ドープされたCコーティングを含む主層を堆積するステップ。
Claims (16)
- 機械またはエンジンの潤滑における境界潤滑条件での動作のための物体であって、前記物体は、第1および第2の金属Meと、MeドープされたC−コーティングを形成するための炭素Cとの混合物を含む金属ドープされたカーボン・コーティングを有し、前記C−コーティング中に金属Meが5〜20原子%存在し、前記第1の金属および前記第2の金属が、それぞれ潤滑中に潤滑剤に存在する硫黄と金属硫化物を形成することが可能なタングステンおよびモリブデンであり、前記タングステンおよび前記モリブデンが、前記混合物中に原子%で、モリブデンに対するタングステンの比で0.5:1〜4:1で存在し、前記C−コーティングが水素を含有しないDLCである物体。
- 前記物体は、グラファイト・ターゲットからのDC−マグネトロン・スパッタリングにより堆積されたta−C−コーティングであることを特徴とする、請求項1に記載の物体。
- 前記金属Meは、HIPIMSスパッタリングにより堆積される、請求項1に記載の物体。
- 前記C−コーティングは、グラファイト・カソードからのDCマグネトロン・スパッタリングまたはグラファイト・カソードからのHIPIMSスパッタリングにより堆積されることを特徴とする、請求項1〜3のいずれか1項に記載の物体。
- 精製油または添加物を含む精製油と共に使用されることを特徴とする、請求項1〜4のいずれか1項に記載の物体。
- 0〜500℃の範囲の温度で利用されることを特徴とする、請求項1〜5いずれか1項に記載の物体。
- 前記金属ドープされたC−コーティングは、500nm〜10μmの範囲の厚さを有することを特徴とする、請求項1〜6のいずれか1項に記載の物体。
- 前記金属ドープされたC−コーティングは、12GPaから20GPaの範囲の硬度を有することを特徴とする、請求項1〜7のいずれか1項に記載の物体。
- 前記金属ドープされたC−コーティングは、ta―C:Mo:Woの組成を有することを特徴とする、請求項1〜8のいずれか1項に記載の物体。
- 請求項1〜9のいずれか1項に記載の金属ドープされたカーボン・コーティングを、物体上に堆積する方法であって、
A)処理チャンバ内でのHIPIMS放電により生成された、WおよびCイオン、MoおよびCイオンおよびW,MoおよびCイオンの少なくとも1つの加速されたイオンで同時にワークピースの表面を衝撃するステップと、
B)20nm〜1000nmの範囲の厚さの少なくともWおよびMoの1つである金属および/または窒化物遷移層を、HIPIMSスパッタリング、またはHIPIMSスパッタリングを含むマグネトロン・スパッタリングにより堆積させるステップと、
C)下記カソード構成、
a)W,MoおよびCを含むHIPIMSスパッタリング・カソードであって、それぞれの成分であるW,MoおよびCからの粉末冶金による焼結、または鋳造、または機械的なセグメント化のいずれかにより形成されるHIPIMSスパッタリング・カソード、およびこれに伴うHIPIMS電源、
b)WおよびMoの1つを含むHIPIMS電源カソードおよび構成するHIPIMSスパッタリング・カソード、およびこれに伴うHIPIMS電源、
c)WおよびWCの1つを含む第1のHIPIMSカソード、およびMoを含む第2のHIPIMSカソードであって、それぞれのカソードが、連合するHIPIMS電源を持つそれぞれのカソードを構成する第2のHIPIMSスパッタリング・カソードおよびこれらに伴い、それぞれが共通の電源に接続されるHIPIMS電源、
d)カソード構成a),b)およびc)のいずれかと、それぞれが共通の電源に接続されたDCスパッタリング電源を伴う1またはそれ以上のグラファイト・カソード、
のうちの1つを使用するHIPIMSスパッタリングまたはHIPIMSスパッタリングを含むマグネトロン・スパッタリングによりMe−ドープされたCコーティングを含む主層を堆積するステップと
を含むことを特徴とする、金属ドープされたカーボン・コーティングを、ワークピース上に堆積する方法。 - 前記堆積ステップC)の少なくとも1つまたは処理ステップA)およびステップB)を含む全部が、1×10−3ミリバールから10−1ミリバール、好ましくは3×10−3ミリバールの範囲のアルゴン圧力下、真空処理チャンバ内でのアルゴン雰囲気内で行われることを特徴とする、請求項10に記載の方法。
- 前記処理ステップA)は、HIPIMS電源およびカソード構成a),b)およびc)のいずれかを使用し、―500V以上、好ましくは―1000V以上のワークピース・バイアス電圧により行われ、および/またはステップB)および/またはC)の方法ステップが、前記ワークピースに印加する別のバイアス電位を使用せずに、−30〜−40Vのフローティング・バイアス電位となるようにするか、または前記ワークピースにバイアス電源を接続して、前記ワークピースに−30ボルト〜−200ボルトの範囲のバイアス電位を供給することを特徴とする、請求項10または11に記載の方法。
- マグネトロン・スパッタリング電源が、1cm2あたり1〜3ワットの範囲のカソードにおける平均電力密度となるようにした1つ、またはそれ以上のグラファイト・カソードに接続されることを特徴とする、請求項10〜12のいずれか1項に記載の方法。
- 前記HIPIMSカソードまたは複数のカソードに接続された前記HIPIMS電源が、1cm2あたり1〜3ワットの範囲のカソードにおける平均電力密度を与え、かつ、パルスのパルス間隔に対する時間的なデューティ・サイクルが、0.5%〜4%であることを特徴とする、請求項10〜13のいずれか1項に記載の方法。
- グラファイト・カソードの全面積が、1つまたはそれ以上のHIPIMSカソードの面積の2〜4倍、好ましくは3倍の範囲であることを特徴とする、請求項10〜14のいずれか1項に記載の方法。
- 請求項1〜9のいずれか1項に記載の金属ドープされたカーボン・コーティングを、ワークピース上に堆積する方法であって、
A)処理チャンバ内でのHIPIMS放電、またはDCマグネトロン放電、またはアーク放電によって生成されたWおよびCイオン、MoおよびCイオンおよびW,MoおよびCイオンの少なくとも1つの加速されたイオンで同時にワークピースの表面を衝撃するステップと、
B)20nm〜1000nmの範囲の厚さの少なくともWおよびMoの1つである金属および/または窒化物遷移層を、HIPIMSスパッタリング、またはHIPIMSスパッタリングを含むマグネトロン・スパッタリングにより堆積させるステップと、
C)少なくとも1つのグラファイト・カソードおよび前記グラファイト・カソードに加えてMo原子、W原子、およびまたC原子が、下記カソード構成のいずれか1つから生成されることによりMe−ドープされたCコーティングを含む主層を堆積するステップと
を含み、
前記カソード構成が、
a)W,MoおよびCを含むカソードであって、それぞれの成分であるW,MoおよびCからの粉末冶金による焼結、または鋳造、または機械的なセグメント化のいずれかにより形成されるカソード、
b)WおよびMoの1つを含むカソード、
c)WおよびWCの1つを含むカソードおよびMoを含むカソード
である堆積させるステップと
を含むことを特徴とする、金属ドープされたカーボン・コーティングを、ワークピース上に堆積する方法。
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US10519539B2 (en) * | 2017-03-24 | 2019-12-31 | City University Of Hong Kong | Method for hydrogen-free diamond-like coatings having isolated carbon particle embedded within |
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