JP6636543B2 - スミア検出装置、レーザビア加工装置およびレーザビア加工方法 - Google Patents
スミア検出装置、レーザビア加工装置およびレーザビア加工方法 Download PDFInfo
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- 238000001514 detection method Methods 0.000 title claims description 65
- 238000003672 processing method Methods 0.000 title claims description 6
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- 230000005284 excitation Effects 0.000 claims description 59
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
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- 238000005286 illumination Methods 0.000 description 8
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- 239000010949 copper Substances 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Analytical Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
9 基板
31 レーザ
32 レーザ光学系
33 励起光出射部
34 受光部
42 強度検出部
43 終点検出部
91,91a,91b 配線層
92 絶縁層
93 ビアホール
322 対物レンズ
J1 経路
S11〜S16 ステップ
Claims (5)
- 配線層と絶縁層とが交互に積層される多層基板の製造におけるレーザビア加工において、ビアホールにおけるスミアの存在を検出するスミア検出装置であって、
製造途上の多層基板の絶縁層を形成する樹脂に蛍光を発生させる励起光を出射し、対物レンズから前記多層基板の主面へと至るとともに前記主面に垂直なレーザビア加工用のレーザ光の経路に沿って、前記励起光が前記主面に照射される励起光出射部と、
前記樹脂にて発生する蛍光を前記対物レンズを介して受光することにより、前記レーザ光による形成途上のビアホールにおける前記絶縁層の存在を検出する絶縁層検出部と、
前記経路に沿って前記主面に照射される前記レーザ光の反射光を前記対物レンズを介して受光することにより、前記形成途上のビアホールにおける配線層の存在を検出する配線層検出部と、
を備え、
前記絶縁層検出部および前記配線層検出部が同一の受光部を共有し、
前記レーザ光および前記励起光が、所定の順序にて切り替えられて前記主面に照射される。 - 請求項1に記載のスミア検出装置であって、
前記絶縁層検出部および前記配線層検出部の出力に基づいて、前記ビアホールの形成の終点を検出する終点検出部をさらに備える。 - 配線層と絶縁層とが交互に積層される多層基板の製造におけるレーザビア加工を行うレーザビア加工装置であって、
レーザビア加工用のレーザ光を出射するレーザと、
前記レーザ光を製造途上の多層基板の主面へと導く光学系と、
請求項1または2に記載のスミア検出装置と、
を備える。 - 配線層と絶縁層とが交互に積層される多層基板の製造におけるレーザビア加工方法であって、
a)レーザビア加工用のレーザ光を、対物レンズから製造途上の多層基板の主面へと至るとともに前記主面に垂直な経路に沿って前記主面に照射する工程と、
b)前記多層基板の絶縁層を形成する樹脂に蛍光を発生させる励起光を、前記経路に沿って前記主面に照射する工程と、
c)前記b)工程に並行して、前記樹脂にて発生する蛍光を前記対物レンズを介して絶縁層検出部にて受光することにより、前記レーザ光による形成途上のビアホールにおける前記絶縁層の存在を検出する工程と、
d)前記経路に沿って前記主面に照射される前記レーザ光の反射光を前記対物レンズを介して配線層検出部にて受光することにより、前記形成途上のビアホールにおける配線層の存在を検出する工程と、
を備え、
前記絶縁層検出部および前記配線層検出部が同一の受光部を共有し、
前記a)工程における前記レーザ光、および、前記b)工程における前記励起光が、所定の順序にて切り替えられて前記主面に照射される。 - 請求項4に記載のレーザビア加工方法であって、
前記絶縁層検出部および前記配線層検出部の出力に基づいて、前記ビアホールの形成の終点を検出する工程をさらに備える。
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JP2016015294 | 2016-01-29 | ||
JP2016015294 | 2016-01-29 | ||
PCT/JP2016/085367 WO2017130555A1 (ja) | 2016-01-29 | 2016-11-29 | スミア検出装置、レーザビア加工装置およびレーザビア加工方法 |
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JPWO2017130555A1 JPWO2017130555A1 (ja) | 2018-09-06 |
JP6636543B2 true JP6636543B2 (ja) | 2020-01-29 |
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JP2017563717A Active JP6636543B2 (ja) | 2016-01-29 | 2016-11-29 | スミア検出装置、レーザビア加工装置およびレーザビア加工方法 |
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JP (1) | JP6636543B2 (ja) |
CN (1) | CN108449974A (ja) |
WO (1) | WO2017130555A1 (ja) |
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JP7142197B2 (ja) * | 2017-09-11 | 2022-09-27 | パナソニックIpマネジメント株式会社 | レーザ加工ヘッド、光ファイバ検査装置及び光ファイバ検査方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07128247A (ja) * | 1993-10-29 | 1995-05-19 | Hoya Corp | 材料識別装置並びにレーザ加工装置及びレーザ成膜配線装置 |
JPH11166903A (ja) * | 1997-12-03 | 1999-06-22 | Fujitsu Ltd | バイアホール検査装置 |
JP3488614B2 (ja) * | 1998-01-09 | 2004-01-19 | 三菱電機株式会社 | 積層材料の凹設部検査装置及びレーザ加工装置 |
JP2000013027A (ja) * | 1998-06-26 | 2000-01-14 | Matsushita Electric Ind Co Ltd | 多層基板の製造方法 |
KR100423714B1 (ko) * | 1998-08-10 | 2004-03-18 | 미쓰비시덴키 가부시키가이샤 | 프린트기판의 검사장치 |
JP3530129B2 (ja) * | 2000-11-16 | 2004-05-24 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
JP3980289B2 (ja) * | 2001-03-27 | 2007-09-26 | 住友重機械工業株式会社 | レーザ加工装置 |
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- 2016-11-29 JP JP2017563717A patent/JP6636543B2/ja active Active
- 2016-11-29 WO PCT/JP2016/085367 patent/WO2017130555A1/ja active Application Filing
- 2016-11-29 CN CN201680074173.5A patent/CN108449974A/zh active Pending
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CN108449974A (zh) | 2018-08-24 |
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