JP6635263B2 - Electronic component transfer method and device - Google Patents

Description

  The present invention relates to a method and an apparatus for transferring electronic components. The present invention is particularly suitable for use in the manufacturing process of a quartz oscillator, but can also be used for transferring electronic components other than a quartz oscillator. Hereinafter, a crystal oscillator will be mainly described as an example of the electronic component.

  In the manufacturing process of the element having the crystal oscillator, a step of final adjusting the frequency after fixing the crystal piece provided with the electrode in the crystal oscillator container (hereinafter, referred to as a “frequency adjustment step”), Thereafter, a step of attaching and sealing a lid (cover) in a vacuum or nitrogen atmosphere (hereinafter, referred to as a “sealing step”) is included. In general, a vacuum chuck is used for transferring the crystal unit from the work site of the frequency adjustment process to the work site of the sealing process (for example, see Patent Document 1). In general, a “crystal unit” refers to a unit in which a quartz piece provided with electrodes is sealed in a container. In the following, for the sake of explanation, the quartz piece is fixed in the container. An unsealed one is also called a quartz oscillator.

JP 2001-179670 A

  It has been considered that the frequency adjustment step and the sealing step are performed continuously in the same vacuum atmosphere. In this case, it is necessary to transfer at least either the container or the lid under a vacuum atmosphere. However, a vacuum chuck conventionally used for such electronic component transfer purposes sucks air into the interior through an opening of a suction nozzle to suck a target object, and cannot be used in a vacuum. It is conceivable to use an adhesive in the atmosphere, but the adhesive causes gas generation, and if the adhesive component is adsorbed on the device due to evaporation and adsorption of the adhesive, the performance of the device may be degraded. Therefore, use in a vacuum atmosphere is difficult.

  An object of the present invention is to solve such a problem and to provide a method and an apparatus for transferring an electronic component under a vacuum atmosphere.

  According to a first aspect of the present invention, there is provided a method for transferring an electronic component having an electronic circuit element housed in an element container and having an external connection electrode provided outside the container in a vacuum atmosphere, the method comprising: A method of transferring an electronic component, comprising: bringing an external connection electrode into electrostatic contact by bringing the external connection electrode close to a surface of the external connection electrode and applying a voltage between the external connection electrode and the electrostatic adsorption electrode. You. The transfer of electronic components is performed, for example, between a first tray used at one work site and a second tray used at another work site.

  As an external connection electrode, it has a ground or floating electrode in addition to the two electrodes connected to the electronic circuit element in the container, and it can be electrostatically attracted by bringing an electrostatic attraction electrode close to at least the surface of the ground or the floating electrode. desirable.

  Using an electrostatic attraction pin having a dielectric film provided on the surface of the electrostatic attraction electrode, bringing the dielectric film of the electrostatic attraction pin into contact with the external connection electrode, and forming a gap between the electrostatic attraction electrode and the external connection electrode. Electronic components can be attracted by Coulomb force or Johnson-Rahbek force. In addition, a convex portion is provided on the surface of the electrostatic chucking electrode for contacting a portion other than the external connection electrode on the surface on which the external connection electrode is provided, corresponding to the external connection electrode of the electronic component to be transferred. Is provided, and the projection of the electrostatic attraction pin is brought into contact with a portion of the element container where the external connection electrode is not provided, so that the portion between the projection and the external connection electrode is Electronic components can also be attracted by Coulomb force.

  As an electronic component, the element container has a substantially rectangular shape, and two electrodes arranged on one surface outside the element container and connected to an internal electronic circuit element at one diagonal of the rectangular shape; A component having two other diagonally arranged grounds or floating electrodes, in particular a quartz oscillator, can be used. In this case, two electrostatic attraction pins having a dielectric film provided on the surface of the electrostatic attraction electrode are used, and each of the dielectric films is brought into contact with two grounds or floating electrodes, respectively, to perform electrostatic attraction. . In the case of using an electrostatic attraction pin provided with a convex portion, a convex portion having a cross shape is used, and two electrodes and two grounds or floating electrodes are respectively formed at four portions divided by the cross shape. Can be electrostatically attracted.

  According to a second aspect of the present invention, in a transfer device for transferring an electronic component in which an electronic circuit element is accommodated in an element container and an external connection electrode is provided outside the element container, a static device having an electrostatic attraction electrode is provided. An electroadhesive pin and a manipulator for operating the electrostatic attracting pin are provided. The electrostatic attracting pin and the manipulator are arranged in a vacuum vessel communicating with the above-mentioned two work sites. An electronic component transfer device characterized in that the external connection electrode is electrostatically attracted by applying a voltage between the external connection electrode and the electrostatic attraction electrode in proximity to the surface of the connection electrode. .

  The electrostatic attraction pin has a dielectric film on the surface of the electrostatic attraction electrode close to the external connection electrode for making contact with the surface of the external connection electrode. Separately, the electrostatic attraction pins correspond to portions of the surface of the electrostatic attraction electrode other than the external connection electrodes of the surface on which the external connection electrodes of the electronic component to be transferred are provided, It is also possible to have a convex portion that contacts a portion other than the external connection electrode and maintains the other portion of the surface of the electrostatic attraction electrode and the external connection electrode of the electronic component without making contact with each other.

  The electronic component to be transferred has a substantially rectangular element container of the electronic component, and is disposed on one surface outside the element container at one diagonal of the rectangular shape and connected to an internal electronic circuit element. In the case of a component having two set electrodes and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape, the protrusion of the electrostatic attraction pin includes two electrodes and two grounds. Alternatively, it is desirable to provide a cross shape corresponding to the shape between the floating electrodes.

  The electronic component to be transferred is a crystal oscillator in which a crystal piece is fixed in an element container, and the manipulator sends a crystal oscillator from a frequency adjustment site that adjusts the frequency of the crystal piece fixed in the crystal resonator container. The crystal oscillator container can be transferred to a sealing site where the lid is attached to the child container and sealed.

  According to the present invention, electronic components can be transferred under a vacuum atmosphere. By using the present invention particularly in the manufacturing process of the crystal resonator, the frequency adjusting process and the sealing process can be performed continuously in a vacuum atmosphere.

FIG. 1 is a diagram for explaining the configuration of a quartz oscillator to be transferred. FIG. 2 is a diagram illustrating a transfer method according to the embodiment of the present invention. FIG. 3 is a diagram for explaining a manufacturing process of the quartz oscillator. FIG. 4 is a perspective view of the element container in the step shown in FIG. FIG. 5 is a block diagram showing an electronic component transfer apparatus according to the embodiment of the present invention. FIG. 6 is a diagram for explaining in more detail the transfer of the crystal unit by the transfer device. FIG. 7 is a plan view schematically illustrating the frequency adjustment device. FIG. 8 is a side view illustrating the outline of the frequency adjustment device. FIG. 9 is a diagram illustrating an outline of the operation of the transfer device. FIG. 10 is a schematic explanatory view of the sealing device. FIG. 11 is a view for explaining a transfer method according to another embodiment of the present invention, and shows a method using an electrostatic suction pin different from FIG. FIG. 12 is a perspective view showing an example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. FIG. 13 is a perspective view showing another example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG.

  The present invention will be described below in detail with reference to the drawings. In the following description, a quartz oscillator is described as an example of an electronic component to be transferred.

  FIG. 1 is a diagram for explaining the configuration of a quartz oscillator to be transferred. In this crystal resonator 10, a crystal blank 11 as an electronic circuit element is accommodated in an element container 12. Outside the element container 12, electrode pads 13, 14, 15, and 16 are provided as external connection electrodes. The electrode pads 13 and 14 are connected to the crystal blank 11 in the element container 12, and the electrode pads 15 and 16 are ground or floating electrodes. The element container 12 has a substantially rectangular shape, and the electrode pads 13, 14, 15, and 16 are provided on one surface outside the element container 12. The electrode pads 13 and 14 are arranged at one diagonal of the rectangular shape, and the electrode pads 15 and 16 are arranged at the other diagonal of the rectangular shape.

  FIG. 2 is a diagram illustrating a method of transferring the crystal resonator 10 shown in FIG. Here, an example in which two electrostatic suction pins 21 and 22 are used is shown.

  The electrostatic attraction pins 21 and 22 have rod-like electrostatic attraction electrodes 23 and 24, respectively. Dielectric films 25 and 26 are provided on the surfaces of the tip portions of the electrostatic chucking electrodes 23 and 24, respectively, in order to contact the external connection electrodes of the crystal unit 10 to be transferred, particularly the surfaces of the electrode pads 15 and 16. Have been. DC power supplies 31 and 32 are connected to the electrostatic attraction electrodes 23 and 24, respectively. In this example, the electrode pads 15 and 16 are grounded. It is also assumed that voltages of different polarities are applied to the electrostatic attraction electrodes 23 and 24, that is, a positive voltage is applied to the electrostatic attraction electrode 23 and a negative voltage is applied to the electrostatic attraction electrode 24.

In FIG. 2, it is assumed that the crystal unit 10 and the electrostatic chuck pins 21 and 22 are placed in a vacuum atmosphere, and the crystal unit 10 is moved from one work site to another work site, for example, a frequency adjustment process. It shall be transferred from a work site (frequency adjustment site) to be performed to a work site (sealed site) for performing the sealing step. To this end, the electrostatic films 21 and 22 are operated to bring the dielectric films 25 and 26 into contact with the surfaces of the electrode pads 15 and 16, respectively. As a result, the electrostatic attraction electrodes 23 and 24 are brought into a state of being close to the surfaces of the electrode pads 15 and 16, respectively. In this state, a voltage is applied between the electrostatic attraction electrode 23 and the electrode pad 15 from the power supply 31, and at the same time, a voltage is applied between the electrostatic attraction electrode 24 and the electrode pad 16 from the power supply 32. Thereby, a Coulomb force is generated between the electrostatic attraction electrode 23 and the electrode pad 15 and between the electrostatic attraction electrode 24 and the electrode pad 16. With this Coulomb force, the quartz oscillator 10 can be attracted. The material of the dielectric film may be appropriately selected. For example, a dielectric film having a volume resistivity of 10 ¹⁰ to 10 ¹² Ω · cm is provided on the surface of the electrostatic chucking electrode, and the quartz oscillator 10 is sucked by the Johnson-Rahbek force. May be. By moving the electrostatic attraction pins 21 and 22 while the crystal unit 10 is being sucked, the work site can be moved, and the crystal unit 10 can be transferred to another work site.

  The manufacturing process of the crystal unit 10 will be described in more detail, and transfer of the crystal unit 10 in the process will be described.

  FIG. 3 is a diagram for explaining a manufacturing process of the quartz oscillator. Here, a surface mount type crystal unit will be described as an example. First, as shown in FIG. 3A, a crystal blank 11 processed to a size that can obtain a desired frequency is prepared. As shown in FIG. 3B, a metal film is formed by vapor deposition on both surfaces of the crystal blank 11 to form excitation electrodes 41 and 42, respectively. In FIG. 3B, the excitation electrode 42 on the back surface is indicated by a broken line. Subsequently, as shown in FIG. 3C, the crystal blank 11 on which the excitation electrodes 41 and 42 are formed is fixed in the element container main body 12a. As shown in FIG. 4, electrode pads 13, 14, 15, and 16 are provided on the front surface (the back surface in the figure) of the element container main body 12a. The excitation electrodes 41 and 42 provided on the crystal blank 11 are electrically connected to the electrode pads 13 and 14, respectively. In this state, that is, in the state shown in FIG. 3D, the frequency adjustment step is performed. After the frequency adjustment step, as shown in FIG. 3E, the element container main body 12a is sealed with the lid 12b. In FIG. 3, for the sake of explanation, the vertical relationship between the crystal blank 11, the element container body 12a, and the lid 12b is reversed.

  FIG. 4 is a perspective view of the element container, particularly the element container main body 12a, in the manufacturing process shown in FIG. After the frequency adjustment step shown in FIG. 3D, the element container main body 12a is sucked by the electrostatic suction pins 21 and 22 shown in FIG. 2, and a work site (sealing site) where the lid 5 is placed. Transport to Then, the sealing step shown in FIG.

  It is desirable that the electrodes (electrode pads 15 and 16) to be attracted are connected to the ground from the viewpoint of the attracting force, but the floating electrodes may be targeted for the attraction. Furthermore, as long as the electronic circuit elements housed in the element container are not affected, electrodes (electrode pads 13 and 14) connected to the electronic circuit elements can be used.

  In the above description, a crystal unit having four electrode pads as shown in FIG. 4 has been described as an example. However, the electronic circuit element to be suctioned may have at least one or more electrode pads. It is not limited to the example shown in FIG. In addition, the number of the electrostatic suction pins may be appropriately set, and one electrostatic suction pin may be configured to simultaneously contact and suction a plurality of electrode pads. For example, a tuning-fork type crystal resonator has two electrode pads, and two electrostatic suction pins may be brought into contact with each of the two electrode pads, or one electrostatic suction pin may be connected to two electrode pads. , And may be suction-conveyed by one electrostatic suction pin. FIG. 4 illustrates the case where there are two electrode pads 15 and 16 to be sucked, but one electrode to be sucked may be used. In addition, electronic components provided with more electrodes can be similarly transferred. When there are a plurality of electrodes that can be suctioned, only one or a part of them can be used as the suction target, or all of them can be used as the suction target. Further, even when the electrodes are provided in a wide range of the container, the electrodes can be similarly transferred. In the case of a crystal resonator having a form other than the surface-mount type crystal resonator or an electronic component other than the crystal resonator, for example, if the electrodes are provided in a plane on the outside of the container, it can be similarly transferred. it can.

  FIG. 5 is a block diagram showing a crystal oscillator transfer device according to an embodiment of the present invention. The transfer device 50 is a device that transfers the crystal unit 10 shown in FIG. 1 from a frequency adjustment site to a sealing site. A frequency adjustment device 51 is provided at the frequency adjustment site. A sealing device 52 is provided at the sealing site. The transfer device 50 includes electrostatic attraction pins 21 and 22 having electrostatic attraction electrodes 23 and 24 (FIG. 2), and a manipulator 53 that operates the electrostatic attraction pins 21 and 22. It is arranged in the same vacuum container 54 as the sealing device 52. The manipulator 53 brings the electrostatic attraction electrodes 23 and 24 of the electrostatic attraction pins 21 and 22 close to the surfaces of the electrode pads 15 and 16 (FIG. 1) of the crystal unit 10 to be transferred, and the electrode pads 15 and 16. By applying a voltage between the electrode pads 15 and 16, the electrode pads 15 and 16 are electrostatically attracted. The frequency adjustment device 51, the sealing device 52, and the manipulator 53 are connected to a control device 55 outside the vacuum vessel 54 via control wiring. In order to apply a voltage between the electrode pads 15, 16 of the element container 12 and the electrostatic attraction electrodes 23, 24 of the electrostatic attraction pins 21, 22, the DC power supplies 31, 32 of FIG. Provided. The transfer device 50, the frequency adjusting device 51, and the sealing device 52 are not limited to being arranged in the same vacuum vessel 54, and may be configured by connecting independent vacuum vessels.

  FIG. 6 is a diagram for explaining the transfer of the crystal unit by the transfer device 50 in further detail. In actuality, the transfer from the frequency adjustment site to the sealing site is performed by transferring the frequency adjustment tray 511 used by the frequency adjustment device 51 to a transfer room, which is a work site of the transfer device 50, where the crystal oscillation is performed. The child is transferred to a sealing tray 521 used by the sealing device 52. The transfer of the frequency adjustment tray 511 and the sealing tray 521 is performed by the tray transfer mechanism 56. Although only the transfer between the frequency adjustment device 51 and the transfer chamber and the transfer between the transfer chamber and the sealing device 52 are shown in FIG. 511 is carried in, the frequency adjustment tray 511 is moved in the frequency adjustment device 51, the sealing tray 521 is moved in the sealing device 52, and the sealing tray 521 is carried out of the sealing device 52. In the embodiment, the tray transport means is generally described as a tray transport mechanism 56, but an independent tray transport means may be provided at each site.

  7 and 8 are schematic explanatory diagrams of the frequency adjusting device 51. FIG. 7 is a plan view and FIG. 8 is a side view. The crystal oscillator 10 shown in FIG. 1 is housed in a concave portion of the frequency adjustment tray 511 and is carried into the frequency adjustment device 51 by the tray transport mechanism 56. An opening is provided on the bottom surface of the frequency adjustment tray 511, and the opening of the element container main body 12a is accommodated in a direction facing the bottom surface, so that the excitation electrode 41 is exposed from the opening on the bottom surface of the frequency adjustment tray 511. An ion gun 512 for irradiating an ion beam and a shutter 513 for shielding the ion beam are provided inside the frequency adjustment device 51, and the frequency of the crystal resonator 10 is adjusted by irradiating the excitation electrode 41 with the ion beam. The quartz oscillators 10 are arranged in a matrix on the frequency adjustment tray 511, and the tray transport mechanism 56 transports the tray so that an arbitrary row on the frequency adjustment tray 511 is located in the ion beam irradiation area of the ion gun 512. The frequency of the crystal unit 10 is measured by a frequency measuring unit (not shown), and the shutter is closed when the frequency reaches a desired frequency, thereby completing the frequency adjustment. When the processing of all the crystal units 10 on the frequency adjustment tray 511 is completed, the frequency adjustment tray 511 is carried out of the frequency adjustment room, and is carried into the transfer device 50 by the tray transport mechanism 56.

  FIG. 9 is a diagram illustrating an outline of the operation of the transfer device 50. The transfer device 50 is a device that transfers the crystal unit 10 from the frequency adjustment tray 511 to the sealing tray 521 as described above. The element container main body 12a is transferred onto the lid 12b of the sealing tray 521 in which the lid 12b has been stored in advance.

  FIG. 10 is a schematic explanatory diagram of the sealing device 52. The tray transport mechanism 56 carries the sealing tray 521 on which the lid 12b and the element container main body 12a are mounted into the sealing device 52. The sealing device 52 is provided with heating blocks 521 and 522 so as to sandwich the sealing tray 521, and the lid 12b and the element container body 12a are joined by heating the sealing tray 521 between the heating blocks 522 and 523. .

  FIG. 11 is a diagram for explaining a transfer method according to another embodiment of the present invention, and shows a method using an electrostatic suction pin 61 different from FIG. The electrostatic attraction pin 61 has an electrostatic attraction electrode 62, and has a projection 63 on the surface of the electrostatic attraction electrode 62. The convex portion 63 is provided corresponding to a portion other than the external connection electrode on the surface of the electronic component to be transferred (for example, the crystal unit 10) on which the external connection electrode is provided, and a portion other than the external connection electrode. Then, the portion other than the convex portion 63 on the surface of the electrostatic chuck electrode 62 is opposed to the external connection electrode of the electronic component to be transferred without contact, and is maintained at a distance d, for example.

  Referring to FIG. 4, the protrusion 62 of the electrostatic attraction pin 61 is brought into contact with a portion other than the electrode pads 13, 14, 15, and 16 of the element container main body 12a, so that a portion around the protrusion is formed. The distance to the electrode pads 13, 14, 15, 16 is maintained at d, and the Coulomb force between them allows the crystal resonator 10 to be attracted.

  FIG. 12 is a perspective view showing an example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. In this example, a cross-shaped convex portion 63a is provided at the tip of the cylindrical electrostatic attraction electrode 62a. For example, the cross-shaped convex portion 63a is brought into contact with the element container main body 12a of the crystal unit 10 shown in FIG. 4 so as not to be in contact with the electrode pads 13, 14, 15, and 16. Thus, the electrode pads 13, 14, 15, and 16 can be electrostatically attracted to the four portions divided by the cross-shaped convex portion 63a at the tip of the electrostatic attracting electrode 62a.

  FIG. 13 is a perspective view showing another example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. In this example, a cross-shaped convex portion 63b is provided at the tip of a quadrangular prism-shaped electrostatic attraction electrode 62b. The square shape at the tip of the electrostatic attraction electrode 62b corresponds to the shape of the electronic component to be transferred. For example, with respect to the crystal unit 10 shown in FIG. 4, the cross-shaped convex portion 63b is brought into contact with the element container main body 12a by making the square shape of the tip of the electrostatic chucking electrode 62b correspond to the square shape of the element container main body 12a. As a result, the four portions divided by the cross-shaped convex portion 63b at the tip of the electrostatic attraction electrode 62b do not contact the electrostatic attraction electrode 62b with the electrode pads 13, 14, 15, and 16, respectively. , 14, 15, and 16 can be electrostatically attracted.

  Here, a cross-shaped convex portion is shown assuming that the electrode pad sucks four electronic components, but the shape of the convex portion is arbitrarily designed depending on the shape and number of the electrode pads of the electronic component to be transferred. be able to. For example, in the case of a tuning-fork type quartz resonator, when the element is elongated and electrodes are provided at both ends, one convex portion is provided at the center, and the electrodes can be electrostatically attracted on both sides. In FIGS. 11 to 13, the convex portion 63 is provided and the space between the electrostatic attraction electrode and the electrode pad is set as a space of the distance d. For example, a dielectric film is formed on the electrostatic attraction electrode 62 and a part of the space at the distance d is formed. May be filled with a dielectric material.

11 crystal blank 12 element container 13, 14, 15, 16 electrode pad (external connection electrode)
21, 22, 61 Electrostatic attraction pins 23, 24, 62, 62a, 62b Electrostatic attraction electrodes 25, 26 Dielectric films 31, 32 DC power supplies 41, 42 Excitation electrodes 12 Element container 12a Element container body 12b Lid 50 Transfer Device 51 Frequency adjusting device 511 Frequency adjusting tray 512 Ion gun 513 Shutter 52 Sealing device 521 Sealing tray 522, 523 Heating block 53 Manipulator 54 Vacuum container 55 Control device 56 Tray transport mechanism 63, 63a, 63b Projection

Claims (13)

In a method of transferring an electronic component in which an electronic circuit element is housed in an element container and an external connection electrode is provided outside the element container under a vacuum atmosphere,
An electron, wherein an electrostatic attraction electrode is brought close to the surface of the external connection electrode, and a voltage is applied between the external connection electrode and the electrostatic attraction electrode to electrostatically attract the external connection electrode. How to transfer parts. The method for transferring electronic components according to claim 1,
As the external connection electrode, a ground or floating electrode in addition to the two electrodes connected to the electronic circuit element in the container,
A method for transferring an electronic component, comprising: bringing at least the electrostatic attraction electrode close to at least the surface of the ground or floating electrode to perform electrostatic attraction. The method for transferring electronic components according to claim 1 or 2,
Using an electrostatic attraction pin provided with a dielectric film on the surface of the electrostatic attraction electrode,
Bringing the dielectric film into contact with the external connection electrode and adsorbing the electronic component by Coulomb force or Johnson-Rahbek force between the electrostatic attraction electrode and the external connection electrode. Transfer method. The method for transferring electronic components according to claim 1 or 2,
On the surface of the electrostatic chucking electrode, a projection for contacting a portion other than the external connection electrode on the surface on which the external connection electrode is provided, corresponding to the external connection electrode of the electronic component to be transferred. Using an electrostatic suction pin provided with
Contacting the convex portion with a portion of the element container where the external connection electrode is not provided, and adsorbing the electronic component by Coulomb force between a portion around the convex portion and the external connection electrode. Characteristic electronic component transfer method. The method for transferring electronic components according to claim 3,
In the electronic component, the element container has a substantially rectangular shape, and the electronic circuit element disposed on one surface outside the element container at one diagonal of the rectangular shape as the external connection electrode. A component having two electrodes connected to the other, and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
A method of transferring an electronic component, comprising using two of said electrostatic chuck pins and bringing each dielectric film into contact with said two grounds or floating electrodes to perform electrostatic chuck. The method for transferring electronic components according to claim 4,
In the electronic component, the element container has a substantially rectangular shape, and the electronic circuit element disposed on one surface outside the element container at one diagonal of the rectangular shape as the external connection electrode. A component having two electrodes connected to the other, and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
As the electrostatic suction pin, a cross-shaped protrusion is used,
An electronic component transfer method, wherein the two electrodes and the two ground or floating electrodes are electrostatically attracted to the four portions divided by the cross shape, respectively. The method for transferring an electronic component according to any one of claims 1 to 6,
The method of transferring an electronic component, wherein the electronic component is a crystal resonator in which a crystal piece is fixed in the element container. The method for transferring electronic components according to claim 1, wherein:
A method for transferring electronic components, comprising transferring the electronic components between a first tray used at one work site and a second tray used at another work site. In a transfer device for transferring an electronic component in which an electronic circuit element is housed in an element container and an external connection electrode is provided outside the element container,
An electrostatic attraction pin having an electrostatic attraction electrode, and a manipulator for operating the electrostatic attraction pin,
The electrostatic suction pin and the manipulator are arranged in a vacuum vessel communicating with the one work site and the another work site,
The manipulator causes the electrostatic attraction electrode to approach the surface of the external connection electrode, and applies a voltage between the external connection electrode and the electrostatic attraction electrode to electrostatically attract the external connection electrode. An electronic component transfer device, characterized in that: The electronic component transfer device according to claim 9,
The electronic component transfer device, wherein the electrostatic suction pin has a dielectric film on a surface of the electrostatic suction electrode for making contact with a surface of an external connection electrode of an electronic component to be transferred. The electronic component transfer device according to claim 9,
The electrostatic attraction pin is provided on the surface of the electrostatic attraction electrode, the external connection electrode corresponding to a portion other than the external connection electrode of the surface on which the external connection electrode of the electronic component to be transferred is provided. An electronic component transfer device, comprising: a convex portion that contacts and maintains other portions of the surface and the external connection electrodes of the electronic component without contacting the external connection electrodes. The electronic component transfer device according to claim 11,
The electronic component to be transferred has a substantially rectangular element container, and is disposed on one surface outside the element container at one diagonal of the rectangular shape and connected to an internal electronic circuit element. Having two electrodes and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
The electronic component transfer device, wherein the convex portion is provided in a cross shape corresponding to a shape between the two electrodes and the two grounds or floating electrodes. The electronic component transfer device according to any one of claims 9 to 12,
The electronic component to be transferred is a crystal unit in which a crystal piece is fixed in the element container.
Wherein the manipulator transfers the element container from a frequency adjustment site that adjusts the frequency of the crystal blank to a sealing site that attaches and seals a lid to the element container. apparatus.

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