JP6635263B2

JP6635263B2 - Electronic component transfer method and device

Info

Publication number: JP6635263B2
Application number: JP2016053810A
Authority: JP
Inventors: 塩野　忠久; 忠久塩野; 広宣森; 範佳松岡
Original assignee: 株式会社昭和真空
Priority date: 2016-03-17
Filing date: 2016-03-17
Publication date: 2020-01-22
Anticipated expiration: 2036-03-17
Also published as: JP2017168724A

Description

本発明は、電子部品の移載方法および装置に関する。本発明は、特に水晶振動子の製造工程での利用に適するが、水晶振動子以外の電子部品の移載にも同様に利用できる。以下では、電子部品として、主に水晶振動子を例に説明する。 The present invention relates to a method and an apparatus for transferring electronic components. The present invention is particularly suitable for use in the manufacturing process of a quartz oscillator, but can also be used for transferring electronic components other than a quartz oscillator. Hereinafter, a crystal oscillator will be mainly described as an example of the electronic component.

水晶振動子を有する素子の製造工程には、電極が設けられた水晶片を水晶振動子容器内に固定した後に周波数を最終調整する工程（以下、「周波数調整工程」という）と、この工程の後に、真空あるいは窒素雰囲気下でリッド（蓋）を取り付けて封止する工程（以下、「封止工程」という）が含まれる。周波数調整工程の作業サイトから封止工程の作業サイトへの水晶振動子の移載には、一般に、真空チャックが用いられる（例えば、特許文献１参照）。なお、通常、「水晶振動子」とは、電極が設けられた水晶片が容器内に封入されたものをいうが、以下では、説明のため、水晶片が容器内に固定されてはいるがまだ封止されていない状態のものも水晶振動子という。 In the manufacturing process of the element having the crystal oscillator, a step of final adjusting the frequency after fixing the crystal piece provided with the electrode in the crystal oscillator container (hereinafter, referred to as a “frequency adjustment step”), Thereafter, a step of attaching and sealing a lid (cover) in a vacuum or nitrogen atmosphere (hereinafter, referred to as a “sealing step”) is included. In general, a vacuum chuck is used for transferring the crystal unit from the work site of the frequency adjustment process to the work site of the sealing process (for example, see Patent Document 1). In general, a “crystal unit” refers to a unit in which a quartz piece provided with electrodes is sealed in a container. In the following, for the sake of explanation, the quartz piece is fixed in the container. An unsealed one is also called a quartz oscillator.

特開２００１−１７９６７０号公報JP 2001-179670 A

周波数調整工程と封止工程とを、同じ真空雰囲気下で連続して行ことが考えられている。この場合、少なくとも容器かリッドのいずれかを真空雰囲気下で移載する必要がある。しかし、このような電子部品の移載用途で従来から用いられてきた真空チャックは、吸着ノズルの開口部から内部に空気を吸い込んで対象物を吸着するものであり、真空中では利用できない。大気中であれば粘着剤を用いることも考えられるが、粘着剤はガス発生の原因となり、また、粘着材の蒸発、吸着によって、粘着剤成分がデバイスに吸着すると、デバイスの性能が悪化するおそれがあることから、真空雰囲気下での利用は困難である。 It has been considered that the frequency adjustment step and the sealing step are performed continuously in the same vacuum atmosphere. In this case, it is necessary to transfer at least either the container or the lid under a vacuum atmosphere. However, a vacuum chuck conventionally used for such electronic component transfer purposes sucks air into the interior through an opening of a suction nozzle to suck a target object, and cannot be used in a vacuum. It is conceivable to use an adhesive in the atmosphere, but the adhesive causes gas generation, and if the adhesive component is adsorbed on the device due to evaporation and adsorption of the adhesive, the performance of the device may be degraded. Therefore, use in a vacuum atmosphere is difficult.

本発明は、このような課題を解決し、真空雰囲気下で電子部品を移載する方法および装置を提供することを目的とする。 An object of the present invention is to solve such a problem and to provide a method and an apparatus for transferring an electronic component under a vacuum atmosphere.

本発明の第１の側面によると、電子回路素子が素子容器内に収容されその容器の外側に外部接続電極が設けられた電子部品を、真空雰囲気下で移載する方法において、静電吸着電極を外部接続電極の表面に近接させ、外部接続電極と静電吸着電極との間に電圧を印加することで外部接続電極を静電吸着することを特徴とする電子部品の移載方法が提供される。電子部品の移載は、例えば、ひとつの作業サイトで使用される第１のトレーと別の作業サイトで使用される第２のトレーとの間で行われる。 According to a first aspect of the present invention, there is provided a method for transferring an electronic component having an electronic circuit element housed in an element container and having an external connection electrode provided outside the container in a vacuum atmosphere, the method comprising: A method of transferring an electronic component, comprising: bringing an external connection electrode into electrostatic contact by bringing the external connection electrode close to a surface of the external connection electrode and applying a voltage between the external connection electrode and the electrostatic adsorption electrode. You. The transfer of electronic components is performed, for example, between a first tray used at one work site and a second tray used at another work site.

外部接続電極として、容器内の電子回路素子に接続される２つの電極に加えグランドまたはフローティング電極を有し、少なくともグランドまたはフローティング電極の表面に静電吸着電極を近接させて静電吸着することが望ましい。 As an external connection electrode, it has a ground or floating electrode in addition to the two electrodes connected to the electronic circuit element in the container, and it can be electrostatically attracted by bringing an electrostatic attraction electrode close to at least the surface of the ground or the floating electrode. desirable.

静電吸着電極の表面に誘電体膜が設けられた静電吸着ピンを用い、静電吸着ピンの誘電体膜を外部接続電極に接触させて、静電吸着電極と外部接続電極との間のクーロン力またはジョンソンラーベック力により電子部品を吸着することができる。また、静電吸着電極の表面に、移載対象となる電子部品の外部接続電極に対応して、その外部接続電極が設けられている面の外部接続電極以外の部分に接触させるための凸部が設けられた静電吸着ピンを用い、素子容器の外部接続電極が設けられていない部分に静電吸着ピンの凸部を接触させて、凸部の周囲の部分と外部接続電極との間のクーロン力により電子部品を吸着することもできる。 Using an electrostatic attraction pin having a dielectric film provided on the surface of the electrostatic attraction electrode, bringing the dielectric film of the electrostatic attraction pin into contact with the external connection electrode, and forming a gap between the electrostatic attraction electrode and the external connection electrode. Electronic components can be attracted by Coulomb force or Johnson-Rahbek force. In addition, a convex portion is provided on the surface of the electrostatic chucking electrode for contacting a portion other than the external connection electrode on the surface on which the external connection electrode is provided, corresponding to the external connection electrode of the electronic component to be transferred. Is provided, and the projection of the electrostatic attraction pin is brought into contact with a portion of the element container where the external connection electrode is not provided, so that the portion between the projection and the external connection electrode is Electronic components can also be attracted by Coulomb force.

電子部品として、素子容器が実質的に長方形状であり、素子容器の外側の１つの面に、長方形状の１つの対角に配置され内部の電子回路素子に接続された２つの電極と、長方形状の他の対角に配置された２つのグランドまたはフローティング電極とを有する部品、特に水晶振動子を用いることができる。この場合、静電吸着電極の表面に誘電体膜が設けられた静電吸着ピンを２本用い、各々の誘電体膜をそれぞれ２つのグランドまたはフローティング電極に接触させて静電吸着することができる。また、凸部が設けられた静電吸着ピンを用いる場合には、凸部が十字形のものを用い、十字形で分割された４つの部分でそれぞれ、２つの電極および２つのグランドまたはフローティング電極を静電吸着することができる。 As an electronic component, the element container has a substantially rectangular shape, and two electrodes arranged on one surface outside the element container and connected to an internal electronic circuit element at one diagonal of the rectangular shape; A component having two other diagonally arranged grounds or floating electrodes, in particular a quartz oscillator, can be used. In this case, two electrostatic attraction pins having a dielectric film provided on the surface of the electrostatic attraction electrode are used, and each of the dielectric films is brought into contact with two grounds or floating electrodes, respectively, to perform electrostatic attraction. . In the case of using an electrostatic attraction pin provided with a convex portion, a convex portion having a cross shape is used, and two electrodes and two grounds or floating electrodes are respectively formed at four portions divided by the cross shape. Can be electrostatically attracted.

本発明の第２の側面によると、電子回路素子が素子容器内に収容され素子容器の外側に外部接続電極が設けられた電子部品を移載する移載装置において、静電吸着電極を有する静電吸着ピンと、この静電吸着ピンを操作するマニピュレータとを備え、静電吸着ピンおよびマニピュレータが、上記の２つの作業サイトに連通する真空容器内に配置され、マニピュレータは、静電吸着電極を外部接続電極の表面に近接させ、外部接続電極と静電吸着電極との間に電圧を印加することで、外部接続電極を静電吸着することを特徴とする電子部品の移載装置が提供される。 According to a second aspect of the present invention, in a transfer device for transferring an electronic component in which an electronic circuit element is accommodated in an element container and an external connection electrode is provided outside the element container, a static device having an electrostatic attraction electrode is provided. An electroadhesive pin and a manipulator for operating the electrostatic attracting pin are provided. The electrostatic attracting pin and the manipulator are arranged in a vacuum vessel communicating with the above-mentioned two work sites. An electronic component transfer device characterized in that the external connection electrode is electrostatically attracted by applying a voltage between the external connection electrode and the electrostatic attraction electrode in proximity to the surface of the connection electrode. .

静電吸着ピンは、静電吸着電極の外部接続電極に近接する面に、外部接続電極の表面に接触させるための誘電体膜を有する。また、これとは別に、静電吸着ピンは、静電吸着電極の表面に、移載対象となる電子部品の外部接続電極が設けられている面の外部接続電極以外の部分に対応して、外部接続電極以外の部分に接触して静電吸着電極の表面のそれ以外の部分と電子部品の外部接続電極とを接触させずに対向させて維持する凸部を有することもできる。 The electrostatic attraction pin has a dielectric film on the surface of the electrostatic attraction electrode close to the external connection electrode for making contact with the surface of the external connection electrode. Separately, the electrostatic attraction pins correspond to portions of the surface of the electrostatic attraction electrode other than the external connection electrodes of the surface on which the external connection electrodes of the electronic component to be transferred are provided, It is also possible to have a convex portion that contacts a portion other than the external connection electrode and maintains the other portion of the surface of the electrostatic attraction electrode and the external connection electrode of the electronic component without making contact with each other.

移載対象の電子部品が、その電子部品の素子容器が実質的に長方形状であり、素子容器の外側の１つの面に、長方形状の１つの対角に配置され内部の電子回路素子に接続された２つの電極と、長方形状の他の対角に配置された２つのグランドまたはフローティング電極とを有する部品である場合には、静電吸着ピンの凸部は、２つの電極および２つのグランドまたはフローティング電極の間の形状に対応して、十字形に設けられることが望ましい。 The electronic component to be transferred has a substantially rectangular element container of the electronic component, and is disposed on one surface outside the element container at one diagonal of the rectangular shape and connected to an internal electronic circuit element. In the case of a component having two set electrodes and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape, the protrusion of the electrostatic attraction pin includes two electrodes and two grounds. Alternatively, it is desirable to provide a cross shape corresponding to the shape between the floating electrodes.

移載対象の電子部品が、水晶片が素子容器内に固定された水晶振動子であり、マニピュレータは、水晶振動子容器内に固定された水晶片の周波数を調整する周波数調整サイトから、水晶振動子容器にリッドを取り付けて封止する封止サイトに、水晶振動子容器を移載することができる。 The electronic component to be transferred is a crystal oscillator in which a crystal piece is fixed in an element container, and the manipulator sends a crystal oscillator from a frequency adjustment site that adjusts the frequency of the crystal piece fixed in the crystal resonator container. The crystal oscillator container can be transferred to a sealing site where the lid is attached to the child container and sealed.

本発明によると、真空雰囲気下で、電子部品を移載することができる。本発明を特に水晶振動子の製造工程で利用することで、周波数調整工程と封止工程を真空雰囲気下で連続して行うことができる。 According to the present invention, electronic components can be transferred under a vacuum atmosphere. By using the present invention particularly in the manufacturing process of the crystal resonator, the frequency adjusting process and the sealing process can be performed continuously in a vacuum atmosphere.

図１は、移載対象となる水晶振動子の構成を説明する図である。FIG. 1 is a diagram for explaining the configuration of a quartz oscillator to be transferred. 図２は、本発明の実施形態に係る移載方法を説明する図である。FIG. 2 is a diagram illustrating a transfer method according to the embodiment of the present invention. 図３は、水晶振動子の製造工程を説明する図である。FIG. 3 is a diagram for explaining a manufacturing process of the quartz oscillator. 図４は、図３に示す工程における素子容器を、図３と上下反転した方向から見た斜視図である。FIG. 4 is a perspective view of the element container in the step shown in FIG. 図５は、本発明の実施形態に係る電子部品の移載装置を示すブロック構成図である。FIG. 5 is a block diagram showing an electronic component transfer apparatus according to the embodiment of the present invention. 図６は、移載装置による水晶振動子の移載をさらに詳しく説明する図である。FIG. 6 is a diagram for explaining in more detail the transfer of the crystal unit by the transfer device. 図７は、周波数調整装置の概略を説明する平面図である。FIG. 7 is a plan view schematically illustrating the frequency adjustment device. 図８は、周波数調整装置の概略を説明する側面図である。FIG. 8 is a side view illustrating the outline of the frequency adjustment device. 図９は、移載装置の動作の概略を説明する図である。FIG. 9 is a diagram illustrating an outline of the operation of the transfer device. 図１０は、封止装置の概略説明図である。FIG. 10 is a schematic explanatory view of the sealing device. 図１１は、本発明の別の実施形態に係る移載方法を説明する図であり、図２とは異なる静電吸着ピンを用いる方法を示す。FIG. 11 is a view for explaining a transfer method according to another embodiment of the present invention, and shows a method using an electrostatic suction pin different from FIG. 図１２は、図１１に示す方法で用いられる静電吸着ピンの先端の構成の一例を示す斜視図である。FIG. 12 is a perspective view showing an example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. 図１３は、図１１に示す方法で用いられる静電吸着ピンの先端の構成の別の例を示す斜視図である。FIG. 13 is a perspective view showing another example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG.

本発明について以下に図面を参照して詳しく説明する。以下の説明では、移載の対象となる電子部品として、水晶振動子を例に説明する。 The present invention will be described below in detail with reference to the drawings. In the following description, a quartz oscillator is described as an example of an electronic component to be transferred.

図１は、移載対象となる水晶振動子の構成を説明する図である。この水晶振動子１０は、電子回路素子としての水晶片１１が、素子容器１２内に収容されている。素子容器１２の外側には、外部接続電極として、電極パッド１３，１４，１５および１６が設けられる。電極パッド１３，１４は、素子容器１２内の水晶片１１に接続され、電極パッド１５，１６は、グランドまたはフローティングの電極である。素子容器１２は実質的に長方形状であり、電極パッド１３，１４，１５および１６は、素子容器１２の外側の１つの面に設けられる。電極パッド１３，１４は長方形状の１つの対角に配置され、電極パッド１５，１６は長方形状の他の対角に配置されている。 FIG. 1 is a diagram for explaining the configuration of a quartz oscillator to be transferred. In this crystal resonator 10, a crystal blank 11 as an electronic circuit element is accommodated in an element container 12. Outside the element container 12, electrode pads 13, 14, 15, and 16 are provided as external connection electrodes. The electrode pads 13 and 14 are connected to the crystal blank 11 in the element container 12, and the electrode pads 15 and 16 are ground or floating electrodes. The element container 12 has a substantially rectangular shape, and the electrode pads 13, 14, 15, and 16 are provided on one surface outside the element container 12. The electrode pads 13 and 14 are arranged at one diagonal of the rectangular shape, and the electrode pads 15 and 16 are arranged at the other diagonal of the rectangular shape.

図２は、図１に示す水晶振動子１０を移載する方法を説明する図である。ここでは、２本の静電吸着ピン２１，２２を用いる例を示す。 FIG. 2 is a diagram illustrating a method of transferring the crystal resonator 10 shown in FIG. Here, an example in which two electrostatic suction pins 21 and 22 are used is shown.

静電吸着ピン２１，２２はそれぞれ、棒状の静電吸着電極２３，２４を有する。静電吸着電極２３，２４の先端部の表面にはそれぞれ、移載対象の水晶振動子１０の外部接続電極、特に電極パッド１５，１６の表面に接触させるため、誘電体膜２５，２６が設けられている。静電吸着電極２３，２４には、それぞれ直流電源３１，３２が接続される。この例では、電極パッド１５，１６がグランドとなっているものとしている。また、静電吸着電極２３，２４には互いに別極性の電圧、すなわち、静電吸着電極２３には正電圧、静電吸着電極２４には負電圧が、それぞれ印加されるものとする。 The electrostatic attraction pins 21 and 22 have rod-like electrostatic attraction electrodes 23 and 24, respectively. Dielectric films 25 and 26 are provided on the surfaces of the tip portions of the electrostatic chucking electrodes 23 and 24, respectively, in order to contact the external connection electrodes of the crystal unit 10 to be transferred, particularly the surfaces of the electrode pads 15 and 16. Have been. DC power supplies 31 and 32 are connected to the electrostatic attraction electrodes 23 and 24, respectively. In this example, the electrode pads 15 and 16 are grounded. It is also assumed that voltages of different polarities are applied to the electrostatic attraction electrodes 23 and 24, that is, a positive voltage is applied to the electrostatic attraction electrode 23 and a negative voltage is applied to the electrostatic attraction electrode 24.

図２において、水晶振動子１０および静電吸着ピン２１，２２は、真空雰囲気下に置かれているものとし、水晶振動子１０を１つの作業サイトから別の作業サイト、例えば、周波数調整工程を実施する作業サイト（周波数調整サイト）から封止工程を実施する作業サイト（封止サイト）に移載するものとする。このためには、静電吸着ピン２１，２２を操作して、誘電体膜２５，２６をそれぞれ電極パッド１５，１６の表面に接触させる。これにより、静電吸着電極２３，２４がそれぞれ電極パッド１５，１６の表面に近接した状態となる。この状態で、静電吸着電極２３と電極パッド１５の間に電源３１から電圧を印加し、同時に、静電吸着電極２４と電極パッド１６の間に電源３２から電圧を印加する。これにより、静電吸着電極２３と電極パッド１５の間、および静電吸着電極２４と電極パッド１６の間に、それぞれクーロン力が生じる。このクーロン力により、水晶振動子１０を吸着することができる。誘電体膜の材料は適宜選択すればよく、例えば静電吸着電極の表面に体積抵抗率１０^１０〜１０^１２Ω・ｃｍの誘電体膜を設けて、ジョンソンラーベック力により水晶振動子１０を吸着してもよい。水晶振動子１０が吸着された状態で静電吸着ピン２１，２２を移動し、作業サイトを移動して、水晶振動子１０を別の作業サイトに移載することができる。 In FIG. 2, it is assumed that the crystal unit 10 and the electrostatic chuck pins 21 and 22 are placed in a vacuum atmosphere, and the crystal unit 10 is moved from one work site to another work site, for example, a frequency adjustment process. It shall be transferred from a work site (frequency adjustment site) to be performed to a work site (sealed site) for performing the sealing step. To this end, the electrostatic films 21 and 22 are operated to bring the dielectric films 25 and 26 into contact with the surfaces of the electrode pads 15 and 16, respectively. As a result, the electrostatic attraction electrodes 23 and 24 are brought into a state of being close to the surfaces of the electrode pads 15 and 16, respectively. In this state, a voltage is applied between the electrostatic attraction electrode 23 and the electrode pad 15 from the power supply 31, and at the same time, a voltage is applied between the electrostatic attraction electrode 24 and the electrode pad 16 from the power supply 32. Thereby, a Coulomb force is generated between the electrostatic attraction electrode 23 and the electrode pad 15 and between the electrostatic attraction electrode 24 and the electrode pad 16. With this Coulomb force, the quartz oscillator 10 can be attracted. The material of the dielectric film may be appropriately selected. For example, a dielectric film having a volume resistivity of 10 ¹⁰ to 10 ¹² Ω · cm is provided on the surface of the electrostatic chucking electrode, and the quartz oscillator 10 is sucked by the Johnson-Rahbek force. May be. By moving the electrostatic attraction pins 21 and 22 while the crystal unit 10 is being sucked, the work site can be moved, and the crystal unit 10 can be transferred to another work site.

水晶振動子１０の製造工程をさらに詳しく説明し、その工程における水晶振動子１０の移載について説明する。 The manufacturing process of the crystal unit 10 will be described in more detail, and transfer of the crystal unit 10 in the process will be described.

図３は、水晶振動子の製造工程を説明する図である。ここでは、表面実装型水晶振動子を例に説明する。まず、図３（Ａ）に示すように、所望の周波数が得られるサイズに加工された水晶片１１を用意する。この水晶片１１の両面に、図３（Ｂ）に示すように、蒸着により金属膜を形成して、それぞれ励振電極４１，４２とする。図３（Ｂ）において、裏面の励振電極４２は破線で示す。続いて、図３（Ｃ）に示すように、励振電極４１，４２が形成された水晶片１１を、素子容器本体１２ａ内に固定する。素子容器本体１２ａの表面（図では裏面になっている）には、図４に示すように、電極パッド１３，１４，１５，１６が設けられている。水晶片１１に設けられた励振電極４１，４２は、それぞれ電極パッド１３，１４に電気的に接続される。この状態、すなわち図３（Ｄ）に示す状態で、周波数調整工程が実施される。周波数調整工程後、図３（Ｅ）に示すように、素子容器本体１２ａをリッド１２ｂで封止する。なお、図３においては、説明のため、水晶片１１、素子容器本体１２ａおよびリッド１２ｂの上下関係を逆にしている。 FIG. 3 is a diagram for explaining a manufacturing process of the quartz oscillator. Here, a surface mount type crystal unit will be described as an example. First, as shown in FIG. 3A, a crystal blank 11 processed to a size that can obtain a desired frequency is prepared. As shown in FIG. 3B, a metal film is formed by vapor deposition on both surfaces of the crystal blank 11 to form excitation electrodes 41 and 42, respectively. In FIG. 3B, the excitation electrode 42 on the back surface is indicated by a broken line. Subsequently, as shown in FIG. 3C, the crystal blank 11 on which the excitation electrodes 41 and 42 are formed is fixed in the element container main body 12a. As shown in FIG. 4, electrode pads 13, 14, 15, and 16 are provided on the front surface (the back surface in the figure) of the element container main body 12a. The excitation electrodes 41 and 42 provided on the crystal blank 11 are electrically connected to the electrode pads 13 and 14, respectively. In this state, that is, in the state shown in FIG. 3D, the frequency adjustment step is performed. After the frequency adjustment step, as shown in FIG. 3E, the element container main body 12a is sealed with the lid 12b. In FIG. 3, for the sake of explanation, the vertical relationship between the crystal blank 11, the element container body 12a, and the lid 12b is reversed.

図４は、図３に示す製造工程における素子容器、特に素子容器本体１２ａを、図３と上下反転した方向から見た斜視図である。この素子容器本体１２ａを、図３（Ｄ）に示す周波数調整工程の後、図２に示す静電吸着ピン２１，２２で吸着し、リッド５が置かれている作業サイト（封止サイト）場所に搬送する。そして、その場所で、図３（Ｄ）に示す封止工程を実行する。 FIG. 4 is a perspective view of the element container, particularly the element container main body 12a, in the manufacturing process shown in FIG. After the frequency adjustment step shown in FIG. 3D, the element container main body 12a is sucked by the electrostatic suction pins 21 and 22 shown in FIG. 2, and a work site (sealing site) where the lid 5 is placed. Transport to Then, the sealing step shown in FIG.

吸着力の点からは、吸着される電極（電極パッド１５，１６）はグランドに接続されていることが望ましいが、フローティング電極を吸着の対象としてもよい。さらには、素子容器内に収容される電子回路素子に影響がないものであれば、その電子回路素子に接続される電極（電極パッド１３，１４）を利用することもできる。 It is desirable that the electrodes (electrode pads 15 and 16) to be attracted are connected to the ground from the viewpoint of the attracting force, but the floating electrodes may be targeted for the attraction. Furthermore, as long as the electronic circuit elements housed in the element container are not affected, electrodes (electrode pads 13 and 14) connected to the electronic circuit elements can be used.

以上の説明では、図４に示すような４つの電極パッドを有する水晶振動子を例に説明したが、吸着対象となる電子回路素子は少なくとも１つ以上の電極パッドを有していればよく、図４に示す例に限定されない。また、静電吸着ピンの数も適宜設定すればよく、１つの静電吸着ピンが複数の電極パッドに同時に接触して吸着する構成としてもよい。例えば音叉型水晶振動子は２つの電極パッドを有しており、２本の静電吸着ピンを２つの電極パッド夫々に接触させてもよいし、１本の静電吸着ピンを２つの電極パッドに接触させて１本の静電吸着ピンで吸着搬送してもよい。図４では吸着の対象となる電極パッド１５，１６が２つある場合を説明したが、吸着の対象となる電極は１つでもよい。また、より多くの電極が設けられている電子部品についても、同様にして移載することができる。吸着対象となりうる複数の電極がある場合に、その１つあるいは一部だけを吸着の対象とすることもでき、全てを吸着の対象とすることもできる。また、電極が容器の広い範囲に設けられている場合にも、同様に移載することができる。表面実装型水晶振動子以外の形態の水晶振動子や、水晶振動子以外の電子部品でも、例えば容器の外側に電極が平面的に設けられているものであれば、同様に移載することができる。 In the above description, a crystal unit having four electrode pads as shown in FIG. 4 has been described as an example. However, the electronic circuit element to be suctioned may have at least one or more electrode pads. It is not limited to the example shown in FIG. In addition, the number of the electrostatic suction pins may be appropriately set, and one electrostatic suction pin may be configured to simultaneously contact and suction a plurality of electrode pads. For example, a tuning-fork type crystal resonator has two electrode pads, and two electrostatic suction pins may be brought into contact with each of the two electrode pads, or one electrostatic suction pin may be connected to two electrode pads. , And may be suction-conveyed by one electrostatic suction pin. FIG. 4 illustrates the case where there are two electrode pads 15 and 16 to be sucked, but one electrode to be sucked may be used. In addition, electronic components provided with more electrodes can be similarly transferred. When there are a plurality of electrodes that can be suctioned, only one or a part of them can be used as the suction target, or all of them can be used as the suction target. Further, even when the electrodes are provided in a wide range of the container, the electrodes can be similarly transferred. In the case of a crystal resonator having a form other than the surface-mount type crystal resonator or an electronic component other than the crystal resonator, for example, if the electrodes are provided in a plane on the outside of the container, it can be similarly transferred. it can.

図５は、本発明の実施形態に係る水晶振動子の移載装置を示すブロック構成図である。この移載装置５０は、図１に示す水晶振動子１０を、周波数調整サイトから封止サイトに移載する装置である。周波数調整サイトには、周波数調整装置５１が設けられる。封止サイトには、封止装置５２が設けられる。移載装置５０は、静電吸着電極２３，２４（図２）を有する静電吸着ピン２１，２２と、この静電吸着ピン２１，２２を操作するマニピュレータ５３とを備え、周波数調整装置５１および封止装置５２と同じ真空容器５４内に配置される。マニピュレータ５３は、静電吸着ピン２１，２２の静電吸着電極２３，２４を、移載対象の水晶振動子１０の電極パッド１５，１６（図１）の表面に近接させ、電極パッド１５，１６と静電吸着電極２３，２４との間に電圧を印加することで、電極パッド１５，１６を静電吸着する。周波数調整装置５１、封止装置５２およびマニピュレータ５３は、真空容器５４外の制御装置５５に制御配線を介して接続される。制御装置５５には、素子容器１２の電極パッド１５，１６と静電吸着ピン２１，２２の静電吸着電極２３，２４との間に電圧を印加するため、図２の直流電源３１，３２が設けられる。移載装置５０、周波数調整装置５１、および封止装置５２は同一の真空容器５４内に配置される場合に限らず、独立した真空容器を連結して構成されるものであってもよい。 FIG. 5 is a block diagram showing a crystal oscillator transfer device according to an embodiment of the present invention. The transfer device 50 is a device that transfers the crystal unit 10 shown in FIG. 1 from a frequency adjustment site to a sealing site. A frequency adjustment device 51 is provided at the frequency adjustment site. A sealing device 52 is provided at the sealing site. The transfer device 50 includes electrostatic attraction pins 21 and 22 having electrostatic attraction electrodes 23 and 24 (FIG. 2), and a manipulator 53 that operates the electrostatic attraction pins 21 and 22. It is arranged in the same vacuum container 54 as the sealing device 52. The manipulator 53 brings the electrostatic attraction electrodes 23 and 24 of the electrostatic attraction pins 21 and 22 close to the surfaces of the electrode pads 15 and 16 (FIG. 1) of the crystal unit 10 to be transferred, and the electrode pads 15 and 16. By applying a voltage between the electrode pads 15 and 16, the electrode pads 15 and 16 are electrostatically attracted. The frequency adjustment device 51, the sealing device 52, and the manipulator 53 are connected to a control device 55 outside the vacuum vessel 54 via control wiring. In order to apply a voltage between the electrode pads 15, 16 of the element container 12 and the electrostatic attraction electrodes 23, 24 of the electrostatic attraction pins 21, 22, the DC power supplies 31, 32 of FIG. Provided. The transfer device 50, the frequency adjusting device 51, and the sealing device 52 are not limited to being arranged in the same vacuum vessel 54, and may be configured by connecting independent vacuum vessels.

図６は、移載装置５０による水晶振動子の移載をさらに詳しく説明する図である。周波数調整サイトから封止サイトへの移載は、実際には、周波数調整装置５１で使用された周波数調整トレー５１１を移載装置５０による作業サイトである移載室に搬送し、そこで、水晶振動子を封止装置５２で使用する封止トレー５２１に移載する。周波数調整トレー５１１および封止トレー５２１の搬送は、トレー搬送機構５６により行われる。トレー搬送機構５６は、図６では周波数調整装置５１と移載室との間、および移載室と封止装置５２との間の搬送しか示していないが、周波数調整装置５１への周波数調整トレー５１１の搬入、周波数調整装置５１内での周波数調整トレー５１１の移動、封止装置５２内での封止トレー５２１の移動、および封止装置５２からの封止トレー５２１の搬出も行う。実施例ではトレー搬送手段を総括してトレー搬送機構５６として説明するが、各サイトで独立のトレー搬送手段を設けてもよい。 FIG. 6 is a diagram for explaining the transfer of the crystal unit by the transfer device 50 in further detail. In actuality, the transfer from the frequency adjustment site to the sealing site is performed by transferring the frequency adjustment tray 511 used by the frequency adjustment device 51 to a transfer room, which is a work site of the transfer device 50, where the crystal oscillation is performed. The child is transferred to a sealing tray 521 used by the sealing device 52. The transfer of the frequency adjustment tray 511 and the sealing tray 521 is performed by the tray transfer mechanism 56. Although only the transfer between the frequency adjustment device 51 and the transfer chamber and the transfer between the transfer chamber and the sealing device 52 are shown in FIG. 511 is carried in, the frequency adjustment tray 511 is moved in the frequency adjustment device 51, the sealing tray 521 is moved in the sealing device 52, and the sealing tray 521 is carried out of the sealing device 52. In the embodiment, the tray transport means is generally described as a tray transport mechanism 56, but an independent tray transport means may be provided at each site.

図７および図８は周波数調整装置５１の概略説明図であり、図７は平面図、図８は側面図である。図１に示す水晶振動子１０は、周波数調整トレー５１１の凹部に収容され、トレー搬送機構５６により周波数調整装置５１に搬入される。周波数調整トレー５１１の底面には開口が設けられ、素子容器本体１２ａの開口が底面に対面する向きで収容されるため、周波数調整トレー５１１底面の開口から励振電極４１が露出する。周波数調整装置５１内部には、イオンビームを照射するイオンガン５１２、イオンビームを遮蔽するシャッター５１３が設けられ、励振電極４１にイオンビームを照射することで、水晶振動子１０の周波数を調整する。水晶振動子１０は周波数調整トレー５１１上にマトリクス配列され、トレー搬送機構５６は、周波数調整トレー５１１上の任意の列がイオンガン５１２のイオンビーム照射エリアに位置するようトレーを搬送する。図示しない周波数測定手段により水晶振動子１０の周波数を測定し、所望の周波数となる時点でシャッターを閉じて、周波数調整を終了する。周波数調整トレー５１１上の全ての水晶振動子１０の処理が完了すると、周波数調整トレー５１１は周波数調整室から搬出され、トレー搬送機構５６により移載装置５０に搬入される。 7 and 8 are schematic explanatory diagrams of the frequency adjusting device 51. FIG. 7 is a plan view and FIG. 8 is a side view. The crystal oscillator 10 shown in FIG. 1 is housed in a concave portion of the frequency adjustment tray 511 and is carried into the frequency adjustment device 51 by the tray transport mechanism 56. An opening is provided on the bottom surface of the frequency adjustment tray 511, and the opening of the element container main body 12a is accommodated in a direction facing the bottom surface, so that the excitation electrode 41 is exposed from the opening on the bottom surface of the frequency adjustment tray 511. An ion gun 512 for irradiating an ion beam and a shutter 513 for shielding the ion beam are provided inside the frequency adjustment device 51, and the frequency of the crystal resonator 10 is adjusted by irradiating the excitation electrode 41 with the ion beam. The quartz oscillators 10 are arranged in a matrix on the frequency adjustment tray 511, and the tray transport mechanism 56 transports the tray so that an arbitrary row on the frequency adjustment tray 511 is located in the ion beam irradiation area of the ion gun 512. The frequency of the crystal unit 10 is measured by a frequency measuring unit (not shown), and the shutter is closed when the frequency reaches a desired frequency, thereby completing the frequency adjustment. When the processing of all the crystal units 10 on the frequency adjustment tray 511 is completed, the frequency adjustment tray 511 is carried out of the frequency adjustment room, and is carried into the transfer device 50 by the tray transport mechanism 56.

図９は、移載装置５０の動作の概略を説明する図である。移載装置５０は、上述したように、周波数調整トレー５１１から封止トレー５２１に水晶振動子１０を移載する装置である。予めリッド１２ｂが収容された封止トレー５２１のリッド１２ｂ上に、素子容器本体１２ａを移載する。 FIG. 9 is a diagram illustrating an outline of the operation of the transfer device 50. The transfer device 50 is a device that transfers the crystal unit 10 from the frequency adjustment tray 511 to the sealing tray 521 as described above. The element container main body 12a is transferred onto the lid 12b of the sealing tray 521 in which the lid 12b has been stored in advance.

図１０は、封止装置５２の概略説明図である。トレー搬送機構５６は、リッド１２ｂおよび素子容器本体１２ａを搭載する封止トレー５２１を、封止装置５２に搬入する。封止装置５２には封止トレー５２１を挟むように加熱ブロック５２１，５２２が設けられ、封止トレー５２１を加熱ブロック５２２，５２３間で加熱することで、リッド１２ｂおよび素子容器本体１２ａが接合する。 FIG. 10 is a schematic explanatory diagram of the sealing device 52. The tray transport mechanism 56 carries the sealing tray 521 on which the lid 12b and the element container main body 12a are mounted into the sealing device 52. The sealing device 52 is provided with heating blocks 521 and 522 so as to sandwich the sealing tray 521, and the lid 12b and the element container body 12a are joined by heating the sealing tray 521 between the heating blocks 522 and 523. .

図１１は、本発明の別の実施形態に係る移載方法を説明する図であり、図２とは異なる静電吸着ピン６１を用いる方法を示す。この静電吸着ピン６１は、静電吸着電極６２を有し、この静電吸着電極６２の表面に凸部６３を有する。この凸部６３は、移載対象となる電子部品（例えば水晶振動子１０）の外部接続電極が設けられている面の外部接続電極以外の部分に対応して設けられ、外部接続電極以外の部分に接触して静電吸着電極６２の表面の凸部６３以外の部分と移載対象となる電子部品の外部接続電極とを接触させずに対向させて、例えば距離ｄに維持する。 FIG. 11 is a diagram for explaining a transfer method according to another embodiment of the present invention, and shows a method using an electrostatic suction pin 61 different from FIG. The electrostatic attraction pin 61 has an electrostatic attraction electrode 62, and has a projection 63 on the surface of the electrostatic attraction electrode 62. The convex portion 63 is provided corresponding to a portion other than the external connection electrode on the surface of the electronic component to be transferred (for example, the crystal unit 10) on which the external connection electrode is provided, and a portion other than the external connection electrode. Then, the portion other than the convex portion 63 on the surface of the electrostatic chuck electrode 62 is opposed to the external connection electrode of the electronic component to be transferred without contact, and is maintained at a distance d, for example.

図４を参照して説明すると、静電吸着ピン６１の凸部６２を、素子容器本体１２ａの電極パッド１３，１４，１５，１６以外の部分に接触させることで、凸部の周囲の部分と電極パッド１３，１４，１５，１６との距離をｄに維持し、それらの間のクーロン力により、水晶振動子１０を吸着することができる。 Referring to FIG. 4, the protrusion 62 of the electrostatic attraction pin 61 is brought into contact with a portion other than the electrode pads 13, 14, 15, and 16 of the element container main body 12a, so that a portion around the protrusion is formed. The distance to the electrode pads 13, 14, 15, 16 is maintained at d, and the Coulomb force between them allows the crystal resonator 10 to be attracted.

図１２は、図１１に示す方法で用いられる静電吸着ピンの先端の構成の一例を示す斜視図である。この例では、円筒形の静電吸着電極６２ａの先端に、十字形凸部６３ａが設けられている。例えば図４の水晶振動子１０の素子容器本体１２ａに対して、十字形凸部６３ａを、電極パッド１３，１４，１５，１６に接しないように接触させる。これにより、静電吸着電極６２ａの先端の十字形凸部６３ａで分割された４つの部分でそれぞれ、電極パッド１３，１４，１５，１６を静電吸着することができる。 FIG. 12 is a perspective view showing an example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. In this example, a cross-shaped convex portion 63a is provided at the tip of the cylindrical electrostatic attraction electrode 62a. For example, the cross-shaped convex portion 63a is brought into contact with the element container main body 12a of the crystal unit 10 shown in FIG. 4 so as not to be in contact with the electrode pads 13, 14, 15, and 16. Thus, the electrode pads 13, 14, 15, and 16 can be electrostatically attracted to the four portions divided by the cross-shaped convex portion 63a at the tip of the electrostatic attracting electrode 62a.

図１３は、図１１に示す方法で用いられる静電吸着ピンの先端の構成の別の例を示す斜視図である。この例では、四角柱状の静電吸着電極６２ｂの先端に、十字形凸部６３ｂが設けられている。静電吸着電極６２ｂの先端の四角形状は、移載対象となる電子部品の形状に対応している。例えば図４の水晶振動子１０に対して、静電吸着電極６２ｂの先端の四角形状と素子容器本体１２ａの四角形状とを対応させて、十字形凸部６３ｂを素子容器本体１２ａに接触させる。これにより、静電吸着電極６２ｂを電極パッド１３，１４，１５，１６に接触させることなく、静電吸着電極６２ｂの先端の十字形凸部６３ｂで分割された４つの部分でそれぞれ、電極パッド１３，１４，１５，１６を静電吸着することができる。 FIG. 13 is a perspective view showing another example of the configuration of the tip of the electrostatic suction pin used in the method shown in FIG. In this example, a cross-shaped convex portion 63b is provided at the tip of a quadrangular prism-shaped electrostatic attraction electrode 62b. The square shape at the tip of the electrostatic attraction electrode 62b corresponds to the shape of the electronic component to be transferred. For example, with respect to the crystal unit 10 shown in FIG. 4, the cross-shaped convex portion 63b is brought into contact with the element container main body 12a by making the square shape of the tip of the electrostatic chucking electrode 62b correspond to the square shape of the element container main body 12a. As a result, the four portions divided by the cross-shaped convex portion 63b at the tip of the electrostatic attraction electrode 62b do not contact the electrostatic attraction electrode 62b with the electrode pads 13, 14, 15, and 16, respectively. , 14, 15, and 16 can be electrostatically attracted.

ここでは、電極パッドが４つの電子部品を吸着するものとして、十字形の凸部を示したが、移載対象の電子部品の電極パッドの形状や個数によって、凸部の形状を任意に設計することができる。例えば、音叉形の水晶振動子の場合、素子が細長く、その両端に電極が設けられている場合には、中央に一つの凸部を設け、その両側で電極を静電吸着することができる。図１１乃至図１３では凸部６３を設け、静電吸着電極と電極パッド間を距離ｄの空間としているが、例えば静電吸着電極６２に誘電膜を形成し、距離ｄの空間内の一部を誘電体材料で満たしてもよい。 Here, a cross-shaped convex portion is shown assuming that the electrode pad sucks four electronic components, but the shape of the convex portion is arbitrarily designed depending on the shape and number of the electrode pads of the electronic component to be transferred. be able to. For example, in the case of a tuning-fork type quartz resonator, when the element is elongated and electrodes are provided at both ends, one convex portion is provided at the center, and the electrodes can be electrostatically attracted on both sides. In FIGS. 11 to 13, the convex portion 63 is provided and the space between the electrostatic attraction electrode and the electrode pad is set as a space of the distance d. For example, a dielectric film is formed on the electrostatic attraction electrode 62 and a part of the space at the distance d is formed. May be filled with a dielectric material.

１１水晶片
１２素子容器
１３，１４，１５，１６電極パッド（外部接続電極）
２１，２２，６１静電吸着ピン
２３，２４，６２，６２ａ，６２ｂ静電吸着電極
２５，２６誘電体膜
３１，３２直流電源
４１，４２励振電極
１２素子容器
１２ａ素子容器本体
１２ｂリッド
５０移載装置
５１周波数調整装置
５１１周波数調整トレー
５１２イオンガン
５１３シャッター
５２封止装置
５２１封止トレー
５２２，５２３加熱ブロック
５３マニピュレータ
５４真空容器
５５制御装置
５６トレー搬送機構
６３，６３ａ，６３ｂ凸部 11 crystal blank 12 element container 13, 14, 15, 16 electrode pad (external connection electrode)
21, 22, 61 Electrostatic attraction pins 23, 24, 62, 62a, 62b Electrostatic attraction electrodes 25, 26 Dielectric films 31, 32 DC power supplies 41, 42 Excitation electrodes 12 Element container 12a Element container body 12b Lid 50 Transfer Device 51 Frequency adjusting device 511 Frequency adjusting tray 512 Ion gun 513 Shutter 52 Sealing device 521 Sealing tray 522, 523 Heating block 53 Manipulator 54 Vacuum container 55 Control device 56 Tray transport mechanism 63, 63a, 63b Projection

Claims

In a method of transferring an electronic component in which an electronic circuit element is housed in an element container and an external connection electrode is provided outside the element container under a vacuum atmosphere,
An electron, wherein an electrostatic attraction electrode is brought close to the surface of the external connection electrode, and a voltage is applied between the external connection electrode and the electrostatic attraction electrode to electrostatically attract the external connection electrode. How to transfer parts.

The method for transferring electronic components according to claim 1,
As the external connection electrode, a ground or floating electrode in addition to the two electrodes connected to the electronic circuit element in the container,
A method for transferring an electronic component, comprising: bringing at least the electrostatic attraction electrode close to at least the surface of the ground or floating electrode to perform electrostatic attraction.

The method for transferring electronic components according to claim 1 or 2,
Using an electrostatic attraction pin provided with a dielectric film on the surface of the electrostatic attraction electrode,
Bringing the dielectric film into contact with the external connection electrode and adsorbing the electronic component by Coulomb force or Johnson-Rahbek force between the electrostatic attraction electrode and the external connection electrode. Transfer method.

The method for transferring electronic components according to claim 1 or 2,
On the surface of the electrostatic chucking electrode, a projection for contacting a portion other than the external connection electrode on the surface on which the external connection electrode is provided, corresponding to the external connection electrode of the electronic component to be transferred. Using an electrostatic suction pin provided with
Contacting the convex portion with a portion of the element container where the external connection electrode is not provided, and adsorbing the electronic component by Coulomb force between a portion around the convex portion and the external connection electrode. Characteristic electronic component transfer method.

The method for transferring electronic components according to claim 3,
In the electronic component, the element container has a substantially rectangular shape, and the electronic circuit element disposed on one surface outside the element container at one diagonal of the rectangular shape as the external connection electrode. A component having two electrodes connected to the other, and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
A method of transferring an electronic component, comprising using two of said electrostatic chuck pins and bringing each dielectric film into contact with said two grounds or floating electrodes to perform electrostatic chuck.

The method for transferring electronic components according to claim 4,
In the electronic component, the element container has a substantially rectangular shape, and the electronic circuit element disposed on one surface outside the element container at one diagonal of the rectangular shape as the external connection electrode. A component having two electrodes connected to the other, and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
As the electrostatic suction pin, a cross-shaped protrusion is used,
An electronic component transfer method, wherein the two electrodes and the two ground or floating electrodes are electrostatically attracted to the four portions divided by the cross shape, respectively.

The method for transferring an electronic component according to any one of claims 1 to 6,
The method of transferring an electronic component, wherein the electronic component is a crystal resonator in which a crystal piece is fixed in the element container.

The method for transferring electronic components according to claim 1, wherein:
A method for transferring electronic components, comprising transferring the electronic components between a first tray used at one work site and a second tray used at another work site.

In a transfer device for transferring an electronic component in which an electronic circuit element is housed in an element container and an external connection electrode is provided outside the element container,
An electrostatic attraction pin having an electrostatic attraction electrode, and a manipulator for operating the electrostatic attraction pin,
The electrostatic suction pin and the manipulator are arranged in a vacuum vessel communicating with the one work site and the another work site,
The manipulator causes the electrostatic attraction electrode to approach the surface of the external connection electrode, and applies a voltage between the external connection electrode and the electrostatic attraction electrode to electrostatically attract the external connection electrode. An electronic component transfer device, characterized in that:

The electronic component transfer device according to claim 9,
The electronic component transfer device, wherein the electrostatic suction pin has a dielectric film on a surface of the electrostatic suction electrode for making contact with a surface of an external connection electrode of an electronic component to be transferred.

The electronic component transfer device according to claim 9,
The electrostatic attraction pin is provided on the surface of the electrostatic attraction electrode, the external connection electrode corresponding to a portion other than the external connection electrode of the surface on which the external connection electrode of the electronic component to be transferred is provided. An electronic component transfer device, comprising: a convex portion that contacts and maintains other portions of the surface and the external connection electrodes of the electronic component without contacting the external connection electrodes.

The electronic component transfer device according to claim 11,
The electronic component to be transferred has a substantially rectangular element container, and is disposed on one surface outside the element container at one diagonal of the rectangular shape and connected to an internal electronic circuit element. Having two electrodes and two grounds or floating electrodes arranged at the other diagonal of the rectangular shape,
The electronic component transfer device, wherein the convex portion is provided in a cross shape corresponding to a shape between the two electrodes and the two grounds or floating electrodes.

The electronic component transfer device according to any one of claims 9 to 12,
The electronic component to be transferred is a crystal unit in which a crystal piece is fixed in the element container.
Wherein the manipulator transfers the element container from a frequency adjustment site that adjusts the frequency of the crystal blank to a sealing site that attaches and seals a lid to the element container. apparatus.