JP6626977B2 - 膜形成装置及び膜形成方法 - Google Patents
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- 238000000926 separation method Methods 0.000 claims description 309
- 230000008569 process Effects 0.000 claims description 305
- 238000012545 processing Methods 0.000 claims description 285
- 239000000758 substrate Substances 0.000 claims description 61
- 230000003014 reinforcing effect Effects 0.000 claims description 24
- 239000010409 thin film Substances 0.000 claims description 13
- 238000002955 isolation Methods 0.000 claims description 7
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 5
- 238000000151 deposition Methods 0.000 description 77
- 230000008021 deposition Effects 0.000 description 73
- 239000007789 gas Substances 0.000 description 55
- 230000002787 reinforcement Effects 0.000 description 28
- 238000004804 winding Methods 0.000 description 25
- 238000007789 sealing Methods 0.000 description 17
- 238000012423 maintenance Methods 0.000 description 16
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- 238000005530 etching Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
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- 239000011888 foil Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
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- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- 238000009489 vacuum treatment Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
Claims (17)
- 基板上で薄膜を処理するための装置であって、
ハウジング、後部壁、及び取り外し可能な閉鎖プレートを備える、真空チャンバと、
前記真空チャンバの内部の前記後部壁と前記取り外し可能な閉鎖プレートとの間に配置されている処理ドラムであって、少なくとも部分的に処理領域によって取り囲まれている、処理ドラムと、
前記取り外し可能な閉鎖プレートに取り付けられた、第1のプロセス分離壁部と、
前記ハウジング又は前記後部壁に取り付けられた、第2のプロセス分離壁部であって、前記取り外し可能な閉鎖プレートが閉鎖位置にある時に、前記第2のプロセス分離壁部が、前記処理ドラムと前記第1のプロセス分離壁部との間のスペース内に配置され、前記第1のプロセス分離壁部と前記第2のプロセス分離壁部とが共に、前記処理領域を隣接する複数の処理区域に分けるプロセス分離壁を提供する、第2のプロセス分離壁部と、
前記取り外し可能な閉鎖プレートに取り付けられている少なくとも1つの処理ユニットと、
を備える、装置。 - 前記第1のプロセス分離壁部が、シールを備える、請求項1に記載の装置。
- 前記第1のプロセス分離壁部が、膨張可能シールを備える、請求項1に記載の装置。
- 前記シールが、前記第1のプロセス分離壁部と前記第2のプロセス分離壁部との間のシールを提供する、請求項2に記載の装置。
- 前記シールが、前記第1のプロセス分離壁部と前記第2のプロセス分離壁部との間、及び、前記第1のプロセス分離壁部と前記ハウジングとの間のシールを提供する、請求項2に記載の装置。
- 前記第2のプロセス分離壁部は、前記処理ドラムまで予め選択された距離に保たれ、前記第2のプロセス分離壁部から前記処理ドラムまでの前記距離が、間隙を画定する、請求項1から5のいずれか一項に記載の装置。
- 前記間隙が、1:100の、隣接する処理区域同士の間のガス分離係数を提供するよう構成される、請求項6に記載の装置。
- 少なくとも1つのガイドローラであって、前記少なくとも1つのガイドローラ及び前記処理ドラムの、前記取り外し可能な閉鎖プレートの方に面する端部が、軸受によって、前記ハウジングに接続された支持プレートに取り付けられる、少なくとも1つのガイドローラを更に備える、請求項1から5のいずれか一項に記載の装置。
- 前記真空チャンバの前記ハウジングが、凹部を有する上部壁を有し、少なくとも1つの真空ポンプが前記凹部の中に設けられる、請求項1から5のいずれか一項に記載の装置。
- 更なる第1のプロセス分離壁部を更に備え、前記第1のプロセス分離壁部と前記更なる第1のプロセス分離壁部とが補強要素で機械的に接続される、請求項1から5のいずれか一項に記載の装置。
- 前記第1のプロセス分離壁部に、前記少なくとも1つの処理ユニットの一端を支持する軸受プレートが設けられる、請求項1から5のいずれか一項に記載の装置。
- 前記ハウジング又は前記後部壁に固定的に取り付けられた単一部材として設けられた、更なるプロセス分離壁を更に備える、請求項1から5のいずれか一項に記載の装置。
- 前記更なるプロセス分離壁が、前記処理領域の上流側の一番端のプロセス分離壁、前記処理領域の下流側の別の一番端のプロセス分離壁、又は前記処理ドラムを支持するプロセス分離壁、のうちの1つである、請求項12に記載の装置。
- 開放位置において、前記取り外し可能な閉鎖プレートと前記第1のプロセス分離壁部とがひとまとめに動かされる、請求項1から5のいずれか一項に記載の装置。
- 基板上で薄膜を処理するための装置であって、
ハウジング、後部壁、及び取り外し可能な閉鎖プレートを備える、真空チャンバと、
前記真空チャンバの内部の前記後部壁と前記取り外し可能な閉鎖プレートとの間に配置されている処理ドラムであって、少なくとも部分的に処理領域によって取り囲まれている、処理ドラムと、
前記取り外し可能な閉鎖プレートに取り付けられた、二以上の第1のプロセス分離壁部と、
前記ハウジング又は前記後部壁に取り付けられた、二以上の第2のプロセス分離壁部と、
前記取り外し可能な閉鎖プレートに取り付けられた、少なくとも1つの処理ユニットと
を備え、2つの隣り合った第1のプロセス分離壁部同士が、補強要素で機械的に接続され、前記二以上の第1のプロセス分離壁部と、前記二以上の第2のプロセス分離壁部とが共に、前記処理領域を少なくとも2つの隣接する処理区域に分ける二以上のプロセス分離壁を提供する、装置。 - 真空チャンバ内の隣接する処理区域同士の間に気密のプロセス分離壁を提供するための方法であって、
取り外し可能な閉鎖プレートで前記真空チャンバを閉鎖することによって、第1のプロセス分離壁部を前記真空チャンバ内へと動かし、前記真空チャンバの処理ドラムと前記第1のプロセス分離壁部との間のスペース内に、前記真空チャンバの第2のプロセス分離壁部が配置されることであって、少なくとも1つの処理ユニットが前記取り外し可能な閉鎖プレートに取り付けられている、第2のプロセス分離壁部が配置されることと、
前記第1のプロセス分離壁部と前記第2のプロセス分離壁部との間の気密シールを作動させることとを含む、方法。 - 前記気密シールを作動させることが、膨張可能ガスケットを加圧することによって実施される、請求項16に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/EP2015/080841 WO2017108081A1 (en) | 2015-12-21 | 2015-12-21 | Film forming apparatus |
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JP2019502025A JP2019502025A (ja) | 2019-01-24 |
JP2019502025A5 JP2019502025A5 (ja) | 2019-04-25 |
JP6626977B2 true JP6626977B2 (ja) | 2019-12-25 |
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JP2018532098A Active JP6626977B2 (ja) | 2015-12-21 | 2015-12-21 | 膜形成装置及び膜形成方法 |
Country Status (7)
Country | Link |
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US (1) | US20180363130A1 (ja) |
EP (1) | EP3394313A1 (ja) |
JP (1) | JP6626977B2 (ja) |
KR (1) | KR20180096728A (ja) |
CN (1) | CN108474112B (ja) |
TW (1) | TWI647743B (ja) |
WO (1) | WO2017108081A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6681524B1 (ja) | 2019-03-12 | 2020-04-15 | 株式会社アルバック | 真空蒸着装置 |
KR20210136967A (ko) * | 2019-03-12 | 2021-11-17 | 가부시키가이샤 알박 | 진공 증착 장치 |
CN110791744A (zh) * | 2019-11-27 | 2020-02-14 | 无锡光润真空科技有限公司 | 分体式多工序真空镀膜装置 |
CN118497698B (zh) * | 2024-07-19 | 2024-09-17 | 成都国泰真空设备有限公司 | 一种多功能卷绕镀膜机 |
Family Cites Families (3)
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GB8309324D0 (en) * | 1983-04-06 | 1983-05-11 | Gen Eng Radcliffe | Vacuum coating apparatus |
EP0122092A3 (en) * | 1983-04-06 | 1985-07-10 | General Engineering Radcliffe Limited | Vacuum coating apparatus |
DE4207525C2 (de) * | 1992-03-10 | 1999-12-16 | Leybold Ag | Hochvakuum-Beschichtungsanlage |
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2015
- 2015-12-21 KR KR1020187020768A patent/KR20180096728A/ko not_active Application Discontinuation
- 2015-12-21 US US16/062,072 patent/US20180363130A1/en not_active Abandoned
- 2015-12-21 EP EP15820514.6A patent/EP3394313A1/en not_active Withdrawn
- 2015-12-21 CN CN201580085470.5A patent/CN108474112B/zh active Active
- 2015-12-21 WO PCT/EP2015/080841 patent/WO2017108081A1/en active Application Filing
- 2015-12-21 JP JP2018532098A patent/JP6626977B2/ja active Active
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2016
- 2016-12-20 TW TW105142199A patent/TWI647743B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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EP3394313A1 (en) | 2018-10-31 |
TWI647743B (zh) | 2019-01-11 |
TW201737318A (zh) | 2017-10-16 |
CN108474112B (zh) | 2020-06-19 |
KR20180096728A (ko) | 2018-08-29 |
US20180363130A1 (en) | 2018-12-20 |
CN108474112A (zh) | 2018-08-31 |
JP2019502025A (ja) | 2019-01-24 |
WO2017108081A1 (en) | 2017-06-29 |
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