JP6608908B2 - Resin material and multilayer printed wiring board - Google Patents

Description

  The present invention relates to a resin material containing an epoxy compound, an inorganic filler, and a curing agent. Moreover, this invention relates to the multilayer printed wiring board using the said resin material.

  Conventionally, various resin compositions have been used to obtain electronic components such as semiconductor devices, laminates, and printed wiring boards. For example, in a multilayer printed wiring board, a resin composition is used in order to form an insulating layer for insulating inner layers or to form an insulating layer located in a surface layer portion. On the surface of the insulating layer, a wiring generally made of metal is laminated. Moreover, in order to form the said insulating layer, the resin film in which the said resin composition was filmed may be used. The resin composition and the resin film are used as insulating materials for multilayer printed wiring boards including build-up films.

  Patent Document 1 below discloses an epoxy resin composition for electronic materials containing an epoxy resin having two or more epoxy groups, di (α-naphthyl) isophthalate, and a curing accelerator.

JP 2003-82063 A

  An insulating layer formed on a multilayer printed wiring board or the like is required to have a low dielectric loss tangent. For the purpose of lowering the dielectric loss tangent, an inorganic filler may be blended with the resin composition. However, when the amount of the inorganic filler is large, undulation may occur on the surface of the insulating layer formed of the resin composition, and as a result, wiring formation may be difficult. .

  In the conventional resin composition as described in Patent Document 1, although the dielectric loss tangent can be lowered to some extent, undulation occurs, and as a result, wiring formation may be difficult.

  The objective of this invention is providing the resin material which can suppress generation | occurrence | production of an undulation. Moreover, this invention is providing the multilayer printed wiring board using the said resin material.

  According to a wide aspect of the present invention, an epoxy compound, an inorganic filler, and a curing agent are included. The curing agent includes a first curing agent represented by the following formula (1). A resin material is provided in which the content of the first curing agent is 40% by weight or less in a total of 100% by weight.

  In the formula (1), R1, R2 and R3 each represents an organic group having an aromatic skeleton, and in the formula (1), the number of ester bonds is 3 or less.

  In a specific aspect of the resin material according to the present invention, in the formula (1), R1 represents a phenyl group, a naphthyl group, or a biphenyl group, R2 represents a phenylene group, a naphthylene group, or a biphenylene group, and R3 represents Represents a phenyl group, a naphthyl group, or a biphenyl group.

  On the specific situation with the resin material which concerns on this invention, the molecular weight of a said 1st hardening | curing agent is 1000 or less.

  On the specific situation with the resin material which concerns on this invention, 100 weight% of components except the solvent in resin material, and content of the said inorganic filler are 50 weight% or more.

  On the specific situation with the resin material which concerns on this invention, the said resin material is a resin film.

  The resin material according to the present invention is suitably used for forming an insulating layer in a multilayer printed wiring board.

  According to a wide aspect of the present invention, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a plurality of metal layers disposed between the insulating layers, the plurality of insulating layers are provided. A multilayer printed wiring board is provided in which at least one of the layers is a cured product of the resin material described above.

  The resin material according to the present invention includes an epoxy compound, an inorganic filler, and a curing agent. In the resin material according to the present invention, the curing agent includes the first curing agent represented by the formula (1), and the total content of the curing agent (1) is 100% by weight of the curing agent. 40% by weight or less. In the present invention, since the above configuration is provided, occurrence of undulation can be suppressed.

FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.

  Hereinafter, the present invention will be described in detail.

  The resin material according to the present invention includes an epoxy compound, an inorganic filler, and a curing agent. In the resin material which concerns on this invention, the said hardening | curing agent contains the 1st hardening | curing agent represented by following formula (1), and content of the said hardening | curing agent (1) is in 100 weight% of the total of the said hardening | curing agent. 40% by weight or less.

  In the formula (1), R1, R2 and R3 each represent an organic group having an aromatic skeleton, and in the formula (1), the number of ester bonds is 3 or less.

  In the present invention, since the above configuration is provided, occurrence of undulation can be suppressed. As a result, the wiring formability can be improved.

  In conventional resin materials, it is difficult to suppress the occurrence of undulation. As a result, the conventional resin material may have poor wiring formability. In particular, when the amount of inorganic filler is small, it is difficult to suppress the occurrence of undulation when the amount of inorganic filler is large even though the occurrence of undulation can be suppressed. . On the other hand, in this invention, even if there are many compounding quantities of an inorganic filler, generation | occurrence | production of undulation can be suppressed and wiring formation property can be made favorable.

  In the present invention, since the above configuration is provided, it is possible to suppress the remaining of metal (such as copper) in the etched portion after etching.

  Furthermore, in the present invention, since the above-described configuration is provided, the dielectric loss tangent can be lowered.

  The resin material according to the present invention may be a resin composition or a resin film. The resin composition has fluidity. The resin composition may be in the form of a paste. The paste form includes liquid. The resin material according to the present invention is preferably a resin film because it is excellent in handleability.

  Hereinafter, the detail of each component used for the resin material which concerns on this invention, the use of the resin material which concerns on this invention, etc. are demonstrated.

[Epoxy compound]
The resin material includes an epoxy compound. A conventionally well-known epoxy compound can be used as said epoxy compound. The epoxy compound refers to an organic compound having at least one epoxy compound. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.

  Examples of the epoxy compound include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, biphenyl novolac type epoxy resin, biphenol type epoxy resin, and naphthalene type epoxy resin. Fluorene type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, anthracene type epoxy resin, epoxy resin having adamantane skeleton, epoxy resin having tricyclodecane skeleton, and triazine ring Examples thereof include an epoxy resin having a skeleton.

  From the viewpoint of further suppressing the occurrence of undulation and further lowering the dielectric loss tangent, the epoxy compound preferably includes an epoxy compound having an aromatic skeleton, and includes an epoxy compound having a naphthalene skeleton or a phenyl skeleton. It is preferable.

  From the viewpoint of further suppressing the occurrence of undulation and improving the physical properties such as the linear expansion coefficient (CTE) and dielectric loss tangent of the cured product, the epoxy compound is a liquid epoxy compound at 25 ° C. and 25 ° C. And a solid epoxy compound.

  The viscosity of the epoxy compound that is liquid at 25 ° C. at 25 ° C. is preferably 1000 mPa · s or less, and more preferably 500 mPa · s or less.

  When measuring the viscosity of the epoxy compound, for example, a dynamic viscoelasticity measuring device (“VAR-100” manufactured by Rheologicala Instruments) or the like is used.

  The molecular weight of the epoxy compound is more preferably 1000 or less. In this case, a resin material with high fluidity can be obtained when the insulating layer is formed even if the component in the resin material is 100% by weight excluding the solvent and the content of the inorganic filler is 50% by weight or more. For this reason, when the uncured product or B-stage product of the resin composition is laminated on the circuit board, the occurrence of undulation can be further suppressed.

  The molecular weight of the epoxy compound means a molecular weight that can be calculated from the structural formula when the epoxy compound is not a polymer and when the structural formula of the epoxy compound can be specified. Moreover, when the said epoxy compound is a polymer, a weight average molecular weight is meant.

[Inorganic filler]
The resin material includes an inorganic filler. Use of the inorganic filler further reduces the dimensional change due to heat of the cured product. Moreover, the dielectric loss tangent of hardened | cured material becomes still lower by use of an inorganic filler. Furthermore, the use of the inorganic filler further increases the adhesive strength between the cured product and the metal layer.

  Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

  The surface roughness of the cured product is reduced, the adhesive strength between the cured product and the metal layer is further increased, finer wiring is formed on the surface of the cured product, and better insulation reliability is achieved by the cured product. From the viewpoint of imparting the above, the inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica. By using silica, the thermal expansion coefficient of the cured product is further lowered, and the dielectric loss tangent of the cured product is further reduced. In addition, the use of silica effectively reduces the surface roughness of the cured product and effectively increases the adhesive strength between the cured product and the metal layer. The shape of silica is preferably spherical.

  Regardless of the curing environment, the inorganic filler is spherical silica from the viewpoint of promoting the curing of the resin, effectively increasing the glass transition temperature of the cured product, and effectively reducing the thermal linear expansion coefficient of the cured product. It is preferable.

  The average particle size of the inorganic filler is preferably 50 nm or more, more preferably 100 nm or more, further preferably 500 nm or more, preferably 1.5 μm or less, more preferably 1.3 μm or less, and further preferably 1.0 μm or less. is there. When the average particle size of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the occurrence of undulation can be further suppressed and the wiring formability can be further improved. Moreover, the adhesive strength of hardened | cured material and a metal layer becomes it still higher that the average particle diameter of the said inorganic filler is more than the said minimum and below the said upper limit.

  A median diameter (d50) value of 50% is employed as the average particle diameter of the inorganic filler. The average particle size can be measured using a laser diffraction / scattering particle size distribution measuring apparatus.

  Each of the inorganic fillers is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased. When each of the inorganic fillers is spherical, the aspect ratio of each of the inorganic fillers is preferably 2 or less, more preferably 1.5 or less.

  The inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent. Thereby, the surface roughness of the surface of the roughened cured product is further reduced, the adhesive strength between the cured product and the metal layer is further increased, and finer wiring is formed on the surface of the cured product, and more Better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the cured product.

  Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents. Examples of the silane coupling agent include methacryl silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.

  In 100 parts by weight of the component excluding the solvent in the resin material, the content of the inorganic filler is preferably 50% by weight or more, more preferably 55% by weight or more, still more preferably 60% by weight or more, and particularly preferably 63%. % By weight or more, most preferably 65% by weight or more. In 100 parts by weight of the component excluding the solvent in the resin material, the content of the inorganic filler is preferably 85% by weight or less, more preferably 83% by weight or less, still more preferably 80% by weight or less, and particularly preferably 78%. % By weight or less. Generation | occurrence | production of an undulation can be suppressed further as content of the said inorganic filler is below the said upper limit. Further, when the content of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased, Further, finer wiring is formed on the surface of the cured product. Furthermore, with this amount of inorganic filler, it is possible to improve the smear removability as well as lowering the coefficient of thermal expansion of the cured product. When the content of the inorganic filler is not less than the above lower limit, the dielectric loss tangent is effectively lowered. When the content of the inorganic filler is not more than the above upper limit, the remaining metal after etching can be further suppressed.

[Curing agent]
In the resin material, the curing agent includes a first curing agent represented by the formula (1). The resin material includes a curing agent. The resin material includes a first curing agent represented by the formula (1) as the curing agent. The first curing agent has 3 or less ester groups. As for the said 1st hardening | curing agent, only 1 type may be used and 2 or more types may be used together.

  The first curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.

  The first curing agent has one, two, or three ester bonds. From the viewpoint of further suppressing the occurrence of undulation and further suppressing the remaining of the metal after etching, in the above formula (1), the number of ester bonds is preferably 2 or less.

  In the above formula (1), R1 and R3 may be organic groups having the same aromatic skeleton, or may be organic groups having different aromatic skeletons. In the above formula (1), R 1, R 2 and R 3 may have the same aromatic skeleton, or may have different aromatic skeletons. Further, two of R1, R2, and R3 may be organic groups having the same aromatic skeleton. The R1 and R3 may be organic groups having the same aromatic skeleton.

  Examples of the organic group having an aromatic skeleton include an aromatic ring group having no substituent and an aromatic ring group having a substituent. When the organic group having an aromatic skeleton is an aromatic ring having a substituent, examples of the substituent include an alkyl group, a halogeno group, and an alkoxy group.

  In the above formula (1), R1 preferably represents a phenyl group, a naphthyl group, or a biphenyl group. In the above formula (1), R2 preferably represents a phenylene group, a naphthylene group, or a biphenylene group. In the above formula (1), R3 preferably represents a phenyl group, a naphthyl group, or a biphenyl group.

  The first curing agent has 3 or less ester groups. The first curing agent preferably has two ester groups.

  The molecular weight of the first curing agent is preferably 1000 or less. In this case, a resin material with high fluidity can be obtained when the insulating layer is formed even if the component in the resin material is 100% by weight excluding the solvent and the content of the inorganic filler is 50% by weight or more. For this reason, when the uncured product or B-stage product of the resin composition is laminated on the substrate, the inorganic filler can be uniformly present, and the occurrence of undulation can be further suppressed.

  The molecular weight of the first curing agent means a molecular weight that can be calculated from the structural formula when the first curing agent is not a polymer and when the structural formula of the first curing agent can be specified. Moreover, when the said 1st hardening | curing agent is a polymer, a weight average molecular weight is meant.

  In the resin material, the curing agent includes a second curing agent different from the curing agent represented by the following formula (X). The resin material includes a second curing agent different from the curing agent represented by the following formula (X) as the curing agent. Since the second curing agent does not correspond to the curing agent represented by the following formula (X), it does not correspond to the first curing agent represented by the formula (1). As for the said 2nd hardening | curing agent, only 1 type may be used and 2 or more types may be used together.

  In the above formula (X), R11, R12 and R13 each represent an organic group having an aromatic skeleton, and in the above formula (X), the number of ester bonds is 3 or less.

  Examples of the second curing agent include a cyanate ester compound (cyanate ester curing agent), a phenol compound (phenol curing agent), an amine compound (amine curing agent), a thiol compound (thiol curing agent), an imidazole compound, a phosphine compound, and an acid. Anhydrides, active ester compounds, dicyandiamide and the like can be mentioned. It is preferable that the said 2nd hardening | curing agent has a functional group which can react with the epoxy group of the said epoxy compound.

  Examples of the cyanate ester compound include novolac-type cyanate ester resins, bisphenol-type cyanate ester resins, and prepolymers in which these are partially trimerized. As said novolak-type cyanate ester resin, a phenol novolak-type cyanate ester resin, an alkylphenol-type cyanate ester resin, etc. are mentioned. Examples of the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.

  Commercially available products of the above-mentioned cyanate ester compounds include phenol novolac type cyanate ester resins (Lonza Japan "PT-30" and "PT-60"), and prepolymers (Lonza Japan) in which bisphenol type cyanate ester resins are trimerized. "BA-230S", "BA-3000S", "BTP-1000S", and "BTP-6020S") manufactured by the company.

  Examples of the phenol compound include novolak type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol, dicyclopentadiene type phenol and the like.

  Examples of commercially available phenol compounds include novolak type phenol (“TD-2091” manufactured by DIC), biphenyl novolac type phenol (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), and aralkyl type phenol compound (“MEH manufactured by Meiwa Kasei Co., Ltd.). -7800 "), and phenols having an aminotriazine skeleton (" LA1356 "and" LA3018-50P "manufactured by DIC).

  From the viewpoint of reducing the dielectric tangent of the insulating layer, the second curing agent preferably contains an active ester compound. The active ester compound refers to a compound containing at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond. Preferable examples of the active ester compound include a compound represented by the following formula (11).

  In the formula (11), X1 and X2 each represent a group containing an aromatic ring. Preferable examples of the group containing an aromatic ring include a benzene ring which may have a substituent and a naphthalene ring which may have a substituent. A hydrocarbon group is mentioned as said substituent. The carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.

  Examples of the combination of X1 and X2 include the following combinations. A combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent. A combination of a benzene ring which may have a substituent and a naphthalene ring which may have a substituent. A combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.

  The active ester compound is not particularly limited. As a commercial item of the said active ester compound, "HPC-8000-65T", "EXB-9416-70BK", "EXB8100-65T" by DIC, etc. are mentioned.

  In a total of 100% by weight of the curing agent, the content of the first curing agent is 40% by weight or less. The content of the first curing agent in the total of 100% by weight of the curing agent is preferably 0.5% by weight or more, more preferably 1% by weight or more, still more preferably 2% by weight or more, and particularly preferably 2%. 0.5% by weight or more, preferably 35% by weight or less, more preferably 30% by weight or less, and further preferably 25% by weight or less. When the content of the first curing agent exceeds 40% by weight, undulation is likely to occur and the metal tends to remain after etching. When the content of the first curing agent is not less than the above lower limit and not more than the above upper limit, the occurrence of undulation can be further suppressed, and the remaining of the metal after etching can be further suppressed.

  In the total of 100% by weight of the curing agent, the content of the second curing agent is 60% by weight or more. The content of the second curing agent in the total 100% by weight of the curing agent is preferably 65% by weight or more, more preferably 70% by weight or more, further preferably 75% by weight or more, preferably 99.5% by weight. % Or less, more preferably 99% by weight or less, still more preferably 98% by weight or less, and particularly preferably 97.5% by weight or less. When the content of the second curing agent is less than 60% by weight, undulation is likely to occur and the metal tends to remain after etching. When the content of the second curing agent is not less than the above lower limit and not more than the above upper limit, the occurrence of undulation can be further suppressed, and the remaining of the metal after etching can be further suppressed.

  The total of 100% by weight of the curing agent is the total content of the first curing agent represented by the formula (1) and the second curing agent different from the curing agent represented by the formula (X). is there.

  The weight ratio of the total content of the curing agents to the content of the epoxy compound (total content of curing agents / content of the epoxy compound) is preferably 0.25 or more, more preferably 0.3 or more. More preferably, it is 0.5 or more, preferably 2 or less, more preferably 1.75 or less, and still more preferably 1.5 or less. When the weight ratio (total content of curing agent / content of epoxy compound) is not less than the above lower limit and not more than the above upper limit, a better cured product can be obtained, and undulation due to poor curing can be further generated. Can be suppressed.

[Thermoplastic resin]
The resin material preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be used together.

  Regardless of the curing environment, the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring. By using the phenoxy resin, deterioration of the embedding property of the resin film with respect to the holes or irregularities of the circuit board and non-uniformity of the inorganic filler can be suppressed. In addition, since the melt viscosity can be adjusted by using the phenoxy resin, the dispersibility of the inorganic filler is improved, and the resin composition or the B-staged product is difficult to wet and spread in an unintended region during the curing process.

  The phenoxy resin contained in the resin material is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin. As for the said phenoxy resin, only 1 type may be used and 2 or more types may be used together.

  Examples of the phenoxy resin include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolac skeleton, a naphthalene skeleton, and an imide skeleton.

  Examples of commercially available phenoxy resins include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40” manufactured by Mitsubishi Chemical Corporation, “ 4275 "," YX6954BH30 "," YX8100BH30 ", and the like.

  From the viewpoint of obtaining a more excellent resin material due to storage stability, the weight average molecular weight of the thermoplastic resin and the phenoxy resin is preferably 5,000 or more, more preferably 10,000 or more, preferably 100,000 or less, more preferably 50,000 or less. It is.

  The weight average molecular weights of the thermoplastic resin and the phenoxy resin indicate the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

  Content of the said thermoplastic resin and the said phenoxy resin is not specifically limited. The content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) in 100% by weight of the component excluding the inorganic filler and the solvent in the resin material is preferably 1 weight. % Or more, more preferably 2% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less. When the content of the thermoplastic resin is not less than the above lower limit and not more than the above upper limit, the embedding property of the resin material in the holes or irregularities of the circuit board becomes good. When the content of the thermoplastic resin is not less than the above lower limit, the resin film can be formed more easily, and a better insulating layer can be obtained. When the content of the thermoplastic resin is not more than the above upper limit, the thermal expansion coefficient of the cured product is further reduced. When the content of the thermoplastic resin is not more than the above upper limit, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.

[Curing accelerator]
The resin material preferably contains a curing accelerator. By using the curing accelerator, the curing rate is further increased. By quickly curing the resin material, the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups is reduced, and as a result, the crosslinking density is increased. The said hardening accelerator is not specifically limited, A conventionally well-known hardening accelerator can be used. As for the said hardening accelerator, only 1 type may be used and 2 or more types may be used together.

  Examples of the curing accelerator include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.

  Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ′ -Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole Can be mentioned.

  Examples of the phosphorus compound include triphenylphosphine.

  Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.

  Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).

  The content of the curing accelerator is not particularly limited. In 100% by weight of the component excluding the inorganic filler and the solvent in the resin material, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 5% by weight. % Or less, more preferably 3% by weight or less. When the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the resin material is efficiently cured. If content of the said hardening accelerator is a more preferable range, the storage stability of a resin material will become still higher and a much better hardened | cured material will be obtained.

[solvent]
The resin material does not contain or contains a solvent. By using the solvent, the viscosity of the resin material can be controlled within a suitable range, and the coatability of the resin material can be improved. Moreover, the said solvent may be used in order to obtain the slurry containing the said inorganic filler. As for the said solvent, only 1 type may be used and 2 or more types may be used together.

  Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples thereof include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha as a mixture.

  Most of the solvent is preferably removed when the resin composition is formed into a film. Therefore, the boiling point of the solvent is preferably 200 ° C. or lower, more preferably 180 ° C. or lower. The content of the solvent in the resin composition is not particularly limited. The content of the solvent can be appropriately changed in consideration of the coating property of the resin composition.

[Other ingredients]
For the purpose of improving impact resistance, heat resistance, resin compatibility and workability, etc., the above resin materials include leveling agents, flame retardants, coupling agents, colorants, antioxidants, UV degradation inhibitors, A thermosetting resin other than a foaming agent, a thickener, a thixotropic agent, and an epoxy compound may be added.

  Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents. Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.

  Examples of the other thermosetting resins include polyphenylene ether resins, divinyl benzyl ether resins, polyarylate resins, diallyl phthalate resins, polyimide resins, benzoxazine resins, benzoxazole resins, bismaleimide resins, and acrylate resins.

(Resin film)
A resin film (B-staged product / B-stage film) is obtained by molding the resin composition described above into a film. The resin film is preferably a B stage film.

  Examples of a method for forming a resin composition into a film to obtain a resin film include the following methods. An extrusion molding method in which a resin composition is melt-kneaded and extruded using an extruder, and then molded into a film shape by a T die or a circular die. A casting molding method in which a resin composition containing a solvent is cast to form a film. Other known film forming methods. The extrusion molding method or the casting molding method is preferable because it can cope with the reduction in thickness. The film includes a sheet.

  A resin film which is a B stage film can be obtained by forming the resin composition into a film and heating and drying the resin composition at 50 to 150 ° C. for 1 to 10 minutes, for example, to such an extent that curing by heat does not proceed excessively.

  The film-like resin composition that can be obtained by the drying process as described above is referred to as a B-stage film. The B-stage film is in a semi-cured state. The semi-cured product is not completely cured and curing can proceed further.

  The resin film may not be a prepreg. When the resin film is not a prepreg, migration does not occur along the glass cloth or the like. Further, when laminating or precuring the resin film, the surface is not uneven due to the glass cloth. The said resin film can be used with the form of a laminated film provided with metal foil or a base material, and the resin film laminated | stacked on the surface of this metal foil or base material. The metal foil is preferably a copper foil.

  Examples of the substrate of the laminated film include polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide resin film. The surface of the base material may be subjected to a release treatment as necessary.

  From the viewpoint of more uniformly controlling the degree of cure of the resin film, the thickness of the resin film is preferably 5 μm or more, and preferably 200 μm or less. When using the said resin film as an insulating layer of a circuit, it is preferable that the thickness of the insulating layer formed with the said resin film is more than the thickness of the conductor layer (metal layer) which forms a circuit. The thickness of the insulating layer is preferably 5 μm or more, and preferably 200 μm or less.

(Semiconductor devices, printed wiring boards, copper-clad laminates and multilayer printed wiring boards)
The resin material is used to form a mold resin for embedding a semiconductor chip in a semiconductor device.

  The resin material is suitably used for forming an insulating layer in a printed wiring board.

  The printed wiring board can be obtained, for example, by heat-pressing the resin material.

  A metal foil can be laminated on one side or both sides of the resin film. The method for laminating the resin film and the metal foil is not particularly limited, and a known method can be used. For example, the resin film can be laminated on the metal foil using an apparatus such as a parallel plate press or a roll laminator while applying pressure while heating or without heating.

  The resin material is suitably used for obtaining a copper clad laminate. An example of the copper-clad laminate includes a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil.

  The thickness of the copper foil of the copper clad laminate is not particularly limited. The thickness of the copper foil is preferably in the range of 1 to 50 μm. Moreover, in order to increase the adhesive strength between the cured product of the resin material and the copper foil, the copper foil preferably has fine irregularities on the surface. The method for forming the unevenness is not particularly limited. Examples of the method for forming the unevenness include a formation method by a treatment using a known chemical solution.

  The resin material is preferably used for obtaining a multilayer substrate.

  As an example of the multilayer substrate, a multilayer substrate including a circuit substrate and an insulating layer stacked on the circuit substrate can be given. The insulating layer of the multilayer substrate is formed of the resin material. Moreover, the insulating layer of the multilayer substrate may be formed of the resin film of the laminated film using a laminated film. The insulating layer is preferably laminated on the surface of the circuit board on which the circuit is provided. A part of the insulating layer is preferably embedded between the circuits.

  In the multilayer substrate, it is preferable that the surface of the insulating layer opposite to the surface on which the circuit substrate is laminated is roughened.

  As the roughening treatment method, a conventionally known roughening treatment method can be used, and it is not particularly limited. The surface of the insulating layer may be subjected to a swelling treatment before the roughening treatment.

  Moreover, it is preferable that the said multilayer substrate is further equipped with the copper plating layer laminated | stacked on the surface by which the roughening process of the said insulating layer was carried out.

  As another example of the multilayer board, the circuit board, the insulating layer laminated on the surface of the circuit board, and the surface of the insulating layer opposite to the surface on which the circuit board is laminated are laminated. And a multilayer substrate provided with copper foil. The insulating layer is preferably formed by curing the resin film using a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil. Furthermore, it is preferable that the copper foil is etched and is a copper circuit.

  Another example of the multilayer substrate is a multilayer substrate including a circuit board and a plurality of insulating layers stacked on the surface of the circuit board. At least one of the plurality of insulating layers disposed on the circuit board is formed using the resin material. It is preferable that the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.

  Among multilayer substrates, multilayer printed wiring boards are required to have a low dielectric loss tangent and to have high insulation reliability due to an insulating layer. In the resin material according to the present invention, it is possible to effectively increase the insulation reliability by reducing the dielectric loss tangent and preventing the occurrence of cracks or cracks in the bent resin material. Therefore, the resin material according to the present invention is suitably used for forming an insulating layer in a multilayer printed wiring board.

  The multilayer printed wiring board includes, for example, a circuit board, a plurality of insulating layers arranged on the surface of the circuit board, and a metal layer arranged between the plurality of insulating layers. At least one of the insulating layers is a cured product of the resin material.

   FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.

  In the multilayer printed wiring board 11 shown in FIG. 1, a plurality of insulating layers 13 to 16 are laminated on the upper surface 12 a of the circuit board 12. Insulating layers 13-16 are hardened material layers. A metal layer 17 is formed in a partial region of the upper surface 12 a of the circuit board 12. Among the plurality of insulating layers 13 to 16, the metal layer 17 is formed in a partial region of the upper surface of the insulating layers 13 to 15 other than the insulating layer 16 located on the outer surface opposite to the circuit board 12 side. Has been. The metal layer 17 is a circuit. Metal layers 17 are respectively disposed between the circuit board 12 and the insulating layer 13 and between the stacked insulating layers 13 to 16. The lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via hole connection and through hole connection (not shown).

  In the multilayer printed wiring board 11, the insulating layers 13 to 16 are formed of a cured product of the resin material. In this embodiment, since the surfaces of the insulating layers 13 to 16 are roughened, fine holes (not shown) are formed on the surfaces of the insulating layers 13 to 16. Further, the metal layer 17 reaches the inside of the fine hole. Moreover, in the multilayer printed wiring board 11, the width direction dimension (L) of the metal layer 17 and the width direction dimension (S) of the part in which the metal layer 17 is not formed can be made small. In the multilayer printed wiring board 11, good insulation reliability is imparted between an upper metal layer and a lower metal layer that are not connected by via-hole connection and through-hole connection (not shown).

(Roughening treatment and swelling treatment)
The resin material is preferably used in order to obtain a cured product that is roughened or desmeared. The cured product includes a precured product that can be further cured.

  In order to form fine irregularities on the surface of the cured product obtained by precuring the resin material, the cured product is preferably roughened. Prior to the roughening treatment, the cured product is preferably subjected to a swelling treatment. The cured product is preferably subjected to a swelling treatment after preliminary curing and before the roughening treatment, and is further cured after the roughening treatment. However, the cured product is not necessarily subjected to the swelling treatment.

  As a method for the swelling treatment, for example, a method of treating a cured product with an aqueous solution or an organic solvent dispersion of a compound mainly composed of ethylene glycol or the like is used. The swelling liquid used for the swelling treatment generally contains an alkali as a pH adjuster or the like. The swelling liquid preferably contains sodium hydroxide. Specifically, for example, the swelling treatment is performed by treating the cured product with a 40 wt% ethylene glycol aqueous solution at a treatment temperature of 30 to 85 ° C. for 1 to 30 minutes. The swelling treatment temperature is preferably in the range of 50 to 85 ° C. When the temperature of the swelling treatment is too low, it takes a long time for the swelling treatment, and the adhesive strength between the cured product and the metal layer tends to be low.

  For the roughening treatment, for example, a chemical oxidizing agent such as a manganese compound, a chromium compound, or a persulfuric acid compound is used. These chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added. The roughening liquid used for the roughening treatment generally contains an alkali as a pH adjuster or the like. The roughening solution preferably contains sodium hydroxide.

  Examples of the manganese compound include potassium permanganate and sodium permanganate. Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate. Examples of the persulfate compound include sodium persulfate, potassium persulfate, and ammonium persulfate.

  The arithmetic average roughness Ra of the surface of the cured product is preferably 10 nm or more, preferably less than 300 nm, more preferably less than 200 nm, and even more preferably less than 150 nm. In this case, the adhesive strength between the cured product and the metal layer is increased, and further finer wiring is formed on the surface of the insulating layer. Furthermore, conductor loss can be suppressed and signal loss can be suppressed low.

(Desmear treatment)
Through holes may be formed in a cured product obtained by precuring the resin material. In the multilayer substrate or the like, a via or a through hole is formed as a through hole. For example, the via can be formed by irradiation with a laser such as a CO ₂ laser. The diameter of the via is not particularly limited, but is about 60 to 80 μm. Due to the formation of the through hole, a smear, which is a resin residue derived from the resin component contained in the cured product, is often formed at the bottom of the via.

  In order to remove the smear, the surface of the cured product is preferably desmeared. The desmear process may also serve as a roughening process.

  In the desmear treatment, for example, a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound is used in the same manner as the roughening treatment. These chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added. The desmear treatment liquid used for the desmear treatment generally contains an alkali. The desmear treatment liquid preferably contains sodium hydroxide.

  By using the resin material, the surface roughness of the surface of the cured product subjected to the desmear treatment is sufficiently reduced.

  Hereinafter, the present invention will be specifically described by giving examples and comparative examples. The present invention is not limited to the following examples.

(Epoxy compound)
Bisphenol A type epoxy resin (DIC-made "850-S", epoxy equivalent 187)
Ester type epoxy resin (“EX-721P” manufactured by Nagase ChemteX Corporation, epoxy equivalent 150)
Biphenyl novolac type epoxy resin (Nippon Kayaku "NC-3000", epoxy equivalent 275)

(Inorganic filler)
Silica (manufactured by Admatechs "C4 silica", average particle size 1 µm, solid content 75 wt%)

(First curing agent)
Compound 1A represented by the following formula (1A) (molecular weight 320, number of ester bonds 2)
Compound 1B represented by the following formula (1B) (molecular weight 473, number of ester bonds 2)
Compound 1C represented by the following formula (1C) (molecular weight 418, number of ester bonds: 2)
Compound 1D represented by the following formula (1D) (molecular weight 381, number of ester bonds: 2)

  Compounds 1A to 1D were synthesized as follows.

(Method for Synthesizing Compound 1A)
Under a nitrogen stream, 9.4 g of phenol, 350 g of tetrahydrofuran (THF) and 12.1 g of triethylamine were added to a three-necked flask and stirred until uniform. Next, 9.1 g of isophthaloyl chloride was slowly added dropwise while the three-necked flask was cooled in an ice bath. After the dropwise addition, the reaction was allowed to proceed by stirring at room temperature for 1 hour. After the reaction, ethyl acetate was added to the reaction solution, washed with 1M nitric acid aqueous solution, and further washed with water. The organic layer after washing was dried using anhydrous magnesium sulfate, and the solution was distilled off under reduced pressure to obtain Compound 1A.

(Synthesis Method of Compound 1B)
Compound 1B was obtained in the same manner as in the synthesis method of Compound 1A, except that 9.4 g of phenol was changed to 17.0 g of 3-phenylphenol.

(Synthesis Method of Compound 1C)
Compound 1C was obtained in the same manner as in the synthesis method of Compound 1A, except that 9.4 g of phenol was changed to 14.4 g of 1-naphthol.

(Synthesis Method of Compound 1D)
Compound 1D was obtained in the same manner as in the synthesis method of Compound 1A, except that 9.4 g of phenol was changed to 12.4 g of 3-methoxyphenol.

(Second curing agent)
Active ester curing agent (“HPC-8000-65T” manufactured by DIC)
Active ester curing agent (“EXB-9416-70BK” manufactured by DIC)
Compound 2A represented by the following formula (2A) (a curing agent similar to the first curing agent, molecular weight 561, number of ester bonds 4)
Compound 2B represented by the following formula (2B) (a curing agent similar to the first curing agent, molecular weight 326, number of ester bonds 2)

  Compounds 2A and 2B were synthesized as follows.

(Synthesis Method of Compound 2A)
Compound 2A was obtained in the same manner as Compound 1A except that 9.4 g of phenol was changed to 21.4 g of 3-hydroxyphenol benzoate.

(Synthesis Method of Compound 2B)
Under a nitrogen stream, 17.3 g of 1,3-cyclohexanedicarboxylic acid, 130 g of N, N-dimethylformamide (DMF) and 385 g of dichloromethane were added to a three-necked flask and stirred until uniform, and then further stirred. The temperature of the solution was raised to reflux. Next, 35.6 g of thionyl chloride was added dropwise to the three-necked flask little by little. After dropping, the reaction was allowed to proceed under reflux for 3 hours. After the reaction, the reaction solution was washed with ice water, the obtained organic layer was dried using anhydrous magnesium sulfate, and the solution was distilled off under reduced pressure to obtain Compound (2B1).

  Compound 2B was obtained in the same manner as in the synthesis method of Compound 1A, except that 9.1 g of isophthaloyl chloride was changed to 8.9 g of Compound (2B1).

(Curing accelerator)
Imidazole compound (“2P4MZ” manufactured by Shikoku Chemicals)

(Thermoplastic resin)
Phenoxy resin-containing liquid ("YX6954BH30" manufactured by Mitsubishi Chemical Corporation)

(Examples 1-7, Comparative Examples 1-4)
The components shown in Table 1 below were blended in the blending amounts shown in Table 1 below, and stirred at room temperature until a uniform solution was obtained, to obtain a resin composition.

Production of resin film:
Using an applicator, after applying the resin composition obtained on the release-treated surface of the release-treated PET film (“XG284” manufactured by Toray Industries Inc., thickness 25 μm), 3 in a gear oven at 100 ° C. Drying for 5 minutes allowed the solvent to evaporate. In this way, a resin film (laminated film of PET film and resin film) having a thickness of 40 μm was obtained on the PET film.

Lamination process (production of lamination sample A):
A copper clad laminate (a laminate of a 150 μm thick glass epoxy substrate and a 35 μm thick copper foil) was prepared. The copper foil was etched to produce 10 copper patterns having an L / S of 2 mm / 2 mm and a length of 5 cm, thereby producing an undulation evaluation substrate.

  Both surfaces of the obtained substrate for undulation evaluation were dipped in a copper surface roughening agent (“MEC etch bond CZ-8100” manufactured by MEC) to roughen the copper surface.

  The obtained sheet-like resin film is overlaid on the roughened copper surface of the substrate for undulation evaluation, and a laminating pressure is obtained using a vacuum pressure laminator machine (“MVLP-500” manufactured by Meiki Seisakusho Co., Ltd.). Lamination was performed at 0.4 MPa and a laminating temperature of 100 ° C. for 40 seconds, and further, pressing was performed at a pressing pressure of 1.0 MPa and a pressing temperature of 100 ° C. for 40 seconds. Thus, the laminated body by which the resin film was laminated | stacked on the board | substrate for undulation evaluation was produced. In the obtained laminate, the PET film was peeled off and then cured at 180 ° C. for 30 minutes to cure the uncured resin material (resin film), thereby forming an insulating layer. In this way, a laminated sample A in which a cured product of a resin material (resin film) was laminated on an undulation evaluation substrate was produced.

  Next, the obtained wiring sample A was subjected to the following wiring formation process.

Swelling process:
The above laminated sample A is put in a swelling liquid at 60 ° C. (an aqueous solution containing “Swelling Dip Securigant P” manufactured by Atotech Japan Co., Ltd.) and “sodium hydroxide” manufactured by Wako Pure Chemical Industries, Ltd., and the swelling temperature is 60 ° C. Rocked for 20 minutes. Thereafter, it was washed with pure water.

Roughening treatment (permanganate treatment):
The above-mentioned swollen laminated sample A is put into a roughened aqueous solution of sodium permanganate at 80 ° C. (“Concentrate Compact CP” manufactured by Atotech Japan, “Sodium hydroxide” manufactured by Wako Pure Chemical Industries, Ltd.), and roughened. The rocking was performed at a temperature of 80 ° C. for 20 minutes. Then, after washing | cleaning for 10 minutes with a 40 degreeC washing | cleaning liquid ("Reduction securigant P" by the Atotech Japan company, "Sulfuric acid" by Wako Pure Chemical Industries Ltd.), it wash | cleaned further with the pure water. In this way, a roughened cured product was formed on the glass epoxy substrate on which the inner layer circuit was formed by etching.

Electroless plating process:
The surface of the roughened cured product was treated with a 60 ° C. alkali cleaner (“Cleaner Securigant 902” manufactured by Atotech Japan) for 5 minutes and degreased and washed. After washing, the cured product was treated with a 25 ° C. pre-dip solution (“Pre-Dip Neogant B” manufactured by Atotech Japan) for 2 minutes. Thereafter, the cured product was treated with an activator solution at 40 ° C. (“Activator Neo Gantt 834” manufactured by Atotech Japan) for 5 minutes to attach a palladium catalyst. Next, the cured product was treated with a reducing solution at 30 ° C. (“Reducer Neogant WA” manufactured by Atotech Japan) for 5 minutes.

  Next, the cured product is put into a chemical copper solution (all manufactured by Atotech Japan “Basic Print Gantt MSK-DK”, “Copper Print Gantt MSK”, “Stabilizer Print Gantt MSK”, “Reducer Cu”). Was carried out until the plating thickness reached about 0.5 μm. After the electroless plating, annealing was performed at a temperature of 120 ° C. for 30 minutes in order to remove the remaining hydrogen gas. All the processes up to the electroless plating process were performed with a treatment liquid of 2 L on a beaker scale and while the cured product was rocked.

DFR (dry film resist) lamination process:
On the electroless copper plating layer, an alkali-soluble DFR (“RY-3525” manufactured by Hitachi Chemical Co., Ltd.) on a PET film as a support is used using a roll laminator (“VA-700SH” manufactured by Taisei Laminator Co., Ltd.) Lamination was performed under conditions of a temperature of 100 ° C., a pressure of 0.4 MPa, and a speed of 1.5 m / s to obtain a laminated structure.

Exposure and development process:
Using the obtained laminated structure, 10 patterns with an L / S of 2 mm / 2 mm and a length of 5 cm, and an undulation substrate, using a UV exposure machine (“EXA-1201” manufactured by Oak Manufacturing Co., Ltd.) The DFR was irradiated with UV through a pattern mask arranged perpendicular to the copper pattern under irradiation conditions of 100 mJ / cm ² . Thereafter, after holding at 25 ° C. for 60 minutes, the PET film as the DFR support was peeled off. The surface of the DFR was sprayed with a 1% by weight aqueous sodium carbonate solution at 30 ° C. for 20 seconds at a spray pressure of 1.0 kg / cm ² , developed, and unexposed portions were removed. Then, the negative pattern by DFR was formed by performing 20-second water washing at 20 degreeC and the spray pressure of 1.0 kg / cm < ² >, and drying.

Electrolytic copper plating process:
After the DFR wiring was formed, electrolytic copper plating was performed until the plating thickness became 25 μm, and an electrolytic copper plating layer was formed. As an electrolytic copper plating, an aqueous copper sulfate solution (“copper sulfate pentahydrate” manufactured by Wako Pure Chemical Industries, Ltd., “sulfuric acid” manufactured by Wako Pure Chemical Industries, Ltd., “basic leveler kaparaside HL” manufactured by Atotech Japan Co., Ltd., “ A current of 0.6 A / cm ² was applied using the corrector Kaparaside GS ”).

DFR stripping and quick etching:
By immersing the laminated structure after electrolytic copper plating in an aqueous caustic soda solution at 40 ° C., the DFR remaining between the copper plating wirings was peeled off. Further, the electroless plating remaining in the fine roughened holes on the surface of the insulating layer below the DFR was removed with a hydrogen peroxide-sulfuric acid-based quick etching solution (“SAC” manufactured by JCU).

Main curing process:
The laminated body after the quick etching was heated in a gear oven at 180 ° C. for 60 minutes to be fully cured, thereby producing a laminated body sample B.

(Evaluation)
(1) Undulation In the obtained laminated sample A, the value of undulation was measured by observing the surface of the cured product opposite to the substrate for undulation evaluation using “WYKO” manufactured by Veeco. . Specifically, the maximum value of the difference in height between the adjacent concave and convex portions on the surface of the cured product was adopted as the undulation value. Undulation was determined according to the following criteria.

[Criteria for undulation]
○○: Undulation value is 1.5 μm or less ○: Undulation value is over 1.5 μm, 2.0 μm or less ×: Undulation value is over 2.0 μm

(2) Copper residue In the obtained laminated body sample B, the surface was observed using a microscope (Olympus "SZ61"), and the copper residue on the cured product between the copper layers (copper wiring) was evaluated. . The copper residue was determined according to the following criteria. In addition, the copper residue counted only the thing which 5 micrometers or more and copper protruded from the wiring.

[Criteria for remaining copper]
○○: No copper residue is generated ○: Copper residue is generated by 1 or more and 3 or less ×: Copper residue is generated by 4 or more

  The composition and results are shown in Table 1 below.

DESCRIPTION OF SYMBOLS 11 ... Multilayer printed wiring board 12 ... Circuit board 12a ... Upper surface 13-16 ... Insulating layer 17 ... Metal layer

Claims (6)

Including an epoxy compound, an inorganic filler, and a curing agent;
The curing agent includes a first curing agent represented by the following formula (1),
During a total of 100 wt% of the curing agent, the content of the first curing agent state, and are 40 wt% or less,
Component 100 wt%, excluding the solvent in the resin material, the content of the inorganic filler, Ru der least 50 wt%, the resin material.

In the formula (1), R1, R2 and R3 each represents an organic group having an aromatic skeleton, and in the formula (1), the number of ester bonds is 3 or less.   In the formula (1), R1 represents a phenyl group, a naphthyl group, or a biphenyl group, R2 represents a phenylene group, a naphthylene group, or a biphenylene group, and R3 represents a phenyl group, a naphthyl group, or a biphenyl group, Item 4. The resin material according to Item 1.   The resin material according to claim 1 or 2, wherein the molecular weight of the first curing agent is 1000 or less. The resin material according to any one of claims 1 to 3 , which is a resin film. The resin material according to any one of claims 1 to 4 , which is used for forming an insulating layer in a multilayer printed wiring board. A circuit board;
A plurality of insulating layers disposed on a surface of the circuit board;
A metal layer disposed between the plurality of insulating layers,
The multilayer printed wiring board whose at least 1 layer of the said some insulating layers is the hardened | cured material of the resin material of any one of Claims 1-5 .

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