JP6602725B2 - ワークの板厚計測用窓構造 - Google Patents

ワークの板厚計測用窓構造 Download PDF

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Publication number
JP6602725B2
JP6602725B2 JP2016103410A JP2016103410A JP6602725B2 JP 6602725 B2 JP6602725 B2 JP 6602725B2 JP 2016103410 A JP2016103410 A JP 2016103410A JP 2016103410 A JP2016103410 A JP 2016103410A JP 6602725 B2 JP6602725 B2 JP 6602725B2
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JP
Japan
Prior art keywords
plate
workpiece
window
cylindrical portion
window structure
Prior art date
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Application number
JP2016103410A
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English (en)
Japanese (ja)
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JP2017209744A5 (ko
JP2017209744A (ja
Inventor
喜雄 小池
裕介 井上
秀明 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2016103410A priority Critical patent/JP6602725B2/ja
Priority to KR1020170060433A priority patent/KR102318327B1/ko
Priority to CN201710352370.5A priority patent/CN107414666B/zh
Priority to TW106117069A priority patent/TWI707742B/zh
Publication of JP2017209744A publication Critical patent/JP2017209744A/ja
Publication of JP2017209744A5 publication Critical patent/JP2017209744A5/ja
Application granted granted Critical
Publication of JP6602725B2 publication Critical patent/JP6602725B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2016103410A 2016-05-24 2016-05-24 ワークの板厚計測用窓構造 Active JP6602725B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造
KR1020170060433A KR102318327B1 (ko) 2016-05-24 2017-05-16 워크의 판 두께 계측용 창 구조
CN201710352370.5A CN107414666B (zh) 2016-05-24 2017-05-18 工件的板厚计测用窗结构
TW106117069A TWI707742B (zh) 2016-05-24 2017-05-23 工件之板厚測量用窗結構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Publications (3)

Publication Number Publication Date
JP2017209744A JP2017209744A (ja) 2017-11-30
JP2017209744A5 JP2017209744A5 (ko) 2019-01-10
JP6602725B2 true JP6602725B2 (ja) 2019-11-06

Family

ID=60425135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016103410A Active JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Country Status (4)

Country Link
JP (1) JP6602725B2 (ko)
KR (1) KR102318327B1 (ko)
CN (1) CN107414666B (ko)
TW (1) TWI707742B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034785B2 (ja) * 2018-03-20 2022-03-14 株式会社東京精密 研磨装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7466964B1 (ja) 2023-07-03 2024-04-15 株式会社多聞 基板厚測定装置及び基板厚測定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160420A (ja) * 1996-12-03 1998-06-19 Tokyo Seimitsu Co Ltd ウェーハの厚さ及び厚さ変化量測定装置
JPH10199951A (ja) * 1997-01-14 1998-07-31 Tokyo Seimitsu Co Ltd ウェーハの研磨面位置測定装置
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
EP1176630B1 (en) * 1999-03-31 2007-06-27 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20030114076A1 (en) * 2001-12-14 2003-06-19 Hui-Chun Chang Apparatus for chemical mechanical polishing
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
KR100889084B1 (ko) * 2007-07-06 2009-03-17 두산메카텍 주식회사 반도체 웨이퍼 표면연마공정을 위한 연마 종말점 검출 장치
KR101587226B1 (ko) * 2008-07-31 2016-01-20 신에쯔 한도타이 가부시키가이샤 웨이퍼의 연마 방법 및 양면 연마 장치
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
TWI583495B (zh) * 2014-01-10 2017-05-21 Ｓｕｍｃｏ股份有限公司 工件厚度的測定裝置、測定方法及工件的硏磨裝置
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置

Also Published As

Publication number Publication date
CN107414666A (zh) 2017-12-01
KR102318327B1 (ko) 2021-10-28
CN107414666B (zh) 2020-12-08
TWI707742B (zh) 2020-10-21
KR20170132667A (ko) 2017-12-04
JP2017209744A (ja) 2017-11-30
TW201741072A (zh) 2017-12-01

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