JP6598780B2 - Ac電力コネクタ、スパッタリング装置、及びそのための方法 - Google Patents
Ac電力コネクタ、スパッタリング装置、及びそのための方法 Download PDFInfo
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- JP6598780B2 JP6598780B2 JP2016541122A JP2016541122A JP6598780B2 JP 6598780 B2 JP6598780 B2 JP 6598780B2 JP 2016541122 A JP2016541122 A JP 2016541122A JP 2016541122 A JP2016541122 A JP 2016541122A JP 6598780 B2 JP6598780 B2 JP 6598780B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/04—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode
- H01G5/12—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode due to rotation of part-cylindrical, conical, or spherical electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/004—Capacitive coupling circuits not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/04—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20214—Rotation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
Description
Claims (11)
- AC電源をスパッタリング装置の真空チャンバ内に配置された回転ターゲットに接続するためのAC電力コネクタであって、
前記AC電力コネクタは、前記AC電源に接続可能な少なくとも1つの第1の要素及び前記回転ターゲットに接続可能な少なくとも1つの第2の要素であって、前記少なくとも1つの第1の要素と前記少なくとも1つの第2の要素が、互いに対して回転可能であり、前記少なくとも1つの第1の要素及び前記少なくとも1つの第2の要素が、前記少なくとも1つの第1の要素と前記少なくとも1つの第2の要素との間でAC電力を移送するように構成される、少なくとも1つの第1の要素と少なくとも1つの第2の要素を含み、
前記少なくとも1つの第1要素及び前記少なくとも1つの第2の要素は、入れ子状に提供される、合計で少なくとも3つの側部要素を、(i)前記少なくとも1つの第1の要素が少なくとも1つの側部要素を含み、前記少なくとも1つの第2の要素が少なくとも2つの側部要素を含む、または、
(ii)前記少なくとも1つの第2の要素が少なくとも1つの側部要素を含み、前記少なくとも1つの第1の要素が少なくとも2つの側部要素を含むように備え、
前記少なくとも1つの第1の要素の側部要素と前記少なくとも1つの第2の要素の側部要素とは、電気容量を規定するようにお互いに対して第1の距離を隔てて配置され、
前記少なくとも1つの第1の要素及び前記少なくとも1つの第2の要素が、前記真空チャンバ内に配置されており、
前記少なくとも1つの第1の要素及び/又は前記少なくとも1つの第2の要素が、板要素を含み、
前記AC電力コネクタは、外被をさらに含み、前記少なくとも1つの第1の要素及び前記少なくとも1つの第2の要素が、前記外被内に配置され、前記外被が、真空外被、又は保護ガス若しくは不活性ガスを含む外被である、
AC電力コネクタ。 - 前記少なくとも1つの第1の要素の側部要素が円筒形状の要素であり、及び/又は前記少なくとも1つの第2の要素の側部要素が円筒形状の要素である、請求項1に記載のAC電力コネクタ。
- 前記少なくとも1つの第1の要素の側部要素が中空の円筒形状の要素であり、及び/又は前記少なくとも1つの第2の要素の側部要素が中空の円筒形状の要素である、請求項2に記載のAC電力コネクタ。
- 前記電気容量が、1〜5000nFの範囲、10〜2000nFの範囲、100〜1000nFの範囲、400〜600nFの範囲の4つの範囲のうちのいずれか1つの範囲内にある、請求項1から3のいずれか一項に記載のAC電力コネクタ。
- 前記少なくとも1つの第1の要素と前記少なくとも1つの第2の要素が、互いに対して同軸状に回転可能である、請求項1から4のいずれか一項に記載のAC電力コネクタ。
- 前記少なくとも1つの第1の要素及び/又は前記少なくとも1つの第2の要素が、Ag、Cu、及びAuのうちの少なくとも1つを含む、請求項1から5のいずれか一項に記載のAC電力コネクタ。
- 前記少なくとも1つの第1の要素及び前記少なくとも1つの第2の要素が、絶縁部材によって少なくとも部分的に包囲される、請求項1から6のいずれか一項に記載のAC電力コネクタ。
- 前記AC電力コネクタが、チャンバの中へ電力を送信するための、回転フィードスルーとして構成される、請求項1から7のいずれか一項に記載のAC電力コネクタ。
- 前記少なくとも1つの第1の要素の側部要素と前記少なくとも1つの第2の要素の側部要素との重なり面積が変更可能である、請求項1から8のいずれか一項に記載のAC電力コネクタ。
- 真空チャンバ内でのスパッタ堆積のためのスパッタリング装置であって、
壁部を有する真空チャンバ、
前記真空チャンバ内の回転ターゲット、
前記回転ターゲットにAC電力を提供するためのAC電源、及び
前記壁部内に提供された請求項1から9のいずれか一項に記載のAC電力コネクタを備え、
前記少なくとも1つの第1の要素が前記AC電源に接続され、前記少なくとも1つの第2の要素が前記回転ターゲットに接続される、スパッタリング装置。 - AC電源からスパッタリング装置の真空チャンバ内に配置された回転ターゲットへ請求項1に記載のAC電力コネクタを用いてAC電力を提供するための方法であって、
少なくとも1つの第1の要素を介して、前記AC電源から少なくとも1つの第2の要素へAC電力を移送すること、及び
前記少なくとも1つの第1の要素と前記少なくとも1つの第2の要素のうちの少なくとも1つを互いに対して回転させることを含む、
方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2013/077106 WO2015090380A1 (en) | 2013-12-18 | 2013-12-18 | Ac power connector, sputtering apparatus and method therefor |
Related Child Applications (1)
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JP2018170462A Division JP2019014972A (ja) | 2018-09-12 | 2018-09-12 | Ac電力コネクタ、スパッタリング装置、及びそのための方法 |
Publications (3)
Publication Number | Publication Date |
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JP2017503074A JP2017503074A (ja) | 2017-01-26 |
JP2017503074A5 JP2017503074A5 (ja) | 2017-03-02 |
JP6598780B2 true JP6598780B2 (ja) | 2019-10-30 |
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JP2016541122A Active JP6598780B2 (ja) | 2013-12-18 | 2013-12-18 | Ac電力コネクタ、スパッタリング装置、及びそのための方法 |
Country Status (7)
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US (1) | US10818475B2 (ja) |
EP (1) | EP3084803B1 (ja) |
JP (1) | JP6598780B2 (ja) |
KR (1) | KR102114019B1 (ja) |
CN (2) | CN105830194A (ja) |
TW (1) | TWI690974B (ja) |
WO (1) | WO2015090380A1 (ja) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60152674U (ja) * | 1984-03-19 | 1985-10-11 | 日本ビクター株式会社 | スパツタ用カソ−ド構造 |
JPH01305523A (ja) * | 1988-06-03 | 1989-12-08 | Nec Yamagata Ltd | リアクティブ・イオン・エッチング装置 |
JPH05198390A (ja) * | 1992-01-22 | 1993-08-06 | Jeol Ltd | 高周波プラズマ装置 |
JPH0778729A (ja) * | 1993-09-08 | 1995-03-20 | Meidensha Corp | 真空コンデンサ |
JP3565309B2 (ja) | 1997-11-28 | 2004-09-15 | アルプス電気株式会社 | プラズマ処理装置 |
US6155202A (en) * | 1997-11-28 | 2000-12-05 | Alps Electric Co., Ltd. | Plasma processing apparatus, matching box, and feeder |
JP4286404B2 (ja) * | 1999-10-15 | 2009-07-01 | 東京エレクトロン株式会社 | 整合器およびプラズマ処理装置 |
ES2333300T3 (es) * | 2000-02-24 | 2010-02-19 | C.C.R. Gmbh, Beschichtungstechnologie | Red de adaptacion de alta frecuencia. |
JP3889918B2 (ja) * | 2000-08-25 | 2007-03-07 | 富士通株式会社 | プラズマエッチング方法、プラズマエッチング装置及びプラズマ処理装置 |
JP2003179045A (ja) | 2001-12-13 | 2003-06-27 | Tokyo Electron Ltd | プラズマ処理装置及びその制御方法 |
JP2005187830A (ja) | 2003-12-24 | 2005-07-14 | Cyg Gijutsu Kenkyusho Kk | スパッタ装置 |
JP4449574B2 (ja) * | 2004-05-28 | 2010-04-14 | 株式会社明電舎 | 真空可変コンデンサ |
JP5198390B2 (ja) | 2009-08-21 | 2013-05-15 | シャープ株式会社 | 窒化物半導体素子及びその製造方法、並びに、半導体装置 |
CA2791288A1 (en) * | 2010-03-31 | 2011-10-06 | Mustang Vacuum Systems, Llc | Cylindrical rotating magnetron sputtering cathode device and method of depositing material using radio frequency emissions |
JP5844169B2 (ja) * | 2012-01-31 | 2016-01-13 | 住友重機械工業株式会社 | シンクロサイクロトロン |
EP2810287B1 (en) | 2012-02-03 | 2019-01-23 | Comet AG | Variable vacuum capacitor |
CA2897979C (en) | 2013-01-15 | 2021-01-26 | Siemens Healthcare Diagnostics Inc. | Automation tube positioning methodology |
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2013
- 2013-12-18 JP JP2016541122A patent/JP6598780B2/ja active Active
- 2013-12-18 EP EP13808035.3A patent/EP3084803B1/en active Active
- 2013-12-18 CN CN201380081666.8A patent/CN105830194A/zh active Pending
- 2013-12-18 WO PCT/EP2013/077106 patent/WO2015090380A1/en active Application Filing
- 2013-12-18 US US15/105,894 patent/US10818475B2/en active Active
- 2013-12-18 KR KR1020167019453A patent/KR102114019B1/ko active IP Right Grant
- 2013-12-18 CN CN201911292689.9A patent/CN110942971A/zh active Pending
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2014
- 2014-12-09 TW TW103142746A patent/TWI690974B/zh active
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Publication number | Publication date |
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US20160336151A1 (en) | 2016-11-17 |
WO2015090380A1 (en) | 2015-06-25 |
EP3084803A1 (en) | 2016-10-26 |
CN110942971A (zh) | 2020-03-31 |
TW201541499A (zh) | 2015-11-01 |
JP2017503074A (ja) | 2017-01-26 |
EP3084803B1 (en) | 2018-08-15 |
US10818475B2 (en) | 2020-10-27 |
CN105830194A (zh) | 2016-08-03 |
KR102114019B1 (ko) | 2020-05-22 |
KR20160101107A (ko) | 2016-08-24 |
TWI690974B (zh) | 2020-04-11 |
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