JP6598449B2 - Radiation imaging apparatus and radiation imaging system - Google Patents

Description

  The present invention relates to an imaging apparatus and a radiation imaging system applied to a medical diagnostic imaging apparatus, a nondestructive inspection apparatus, an analysis apparatus using radiation, and the like.

  In recent years, as a radiation imaging apparatus used in a radiation imaging system such as medical image diagnosis and nondestructive inspection, the apparatus has been reduced in size and weight, and a portable radiation imaging apparatus has been used. The portable radiation imaging apparatus can perform radiation imaging in an arbitrary posture and can be used for radiation imaging in a hospital room or outdoors. In a portable radiation imaging apparatus, in addition to portability due to weight reduction, a strength that prevents damage due to deformation of the apparatus due to external force is required. Therefore, in addition to low specific gravity and high strength alloys such as aluminum and magnesium, the device casing has recently been made of a carbon fiber reinforced resin composite material (hereinafter referred to as carbon fiber reinforced resin) such as CFRP (carbon fiber reinforced plastic). Can be used. In Patent Document 1, in order to suppress the deformation of the cylindrical housing due to external stress while securing portability, the fiber direction of the carbon fiber reinforced resin on the radiation incident surface of the housing and the opposite surface is the radiation incident surface. An apparatus that is inclined with respect to the side surface between the opposing surfaces and has different inclination directions is disclosed. The carbon fiber reinforced resin has anisotropy in the stretching ratio between the fiber direction and a direction different from the fiber direction, and the two fiber directions are different from the side surfaces so that the fiber directions of the two opposing surfaces are different. By inclining, durability against external stress is improved.

  On the other hand, the radiation imaging apparatus contains therein an integrated circuit for controlling the operation of the radiation sensor panel and processing signals from the pixel array of the radiation sensor panel, and this integrated circuit can generate heat by the operation. Since the integrated circuit is locally arranged in the device, the temperature distribution of the pixel array is uneven due to the local temperature rise inside the device by the integrated circuit, and the image based on the signal obtained from the pixel array has a temperature. Unevenness reflecting the distribution may occur. Therefore, in order to suppress unevenness in the temperature distribution of the device, it is necessary to efficiently conduct heat generated by the integrated circuit to the outside of the pixel array. When a carbon fiber reinforced resin composite material is used for the housing, the thermal conductivity is lower than that of the alloy material, and the thermal conductivity of the carbon fiber reinforced resin composite material shows higher thermal conductivity in the direction of the carbon fiber. Since it has anisotropy, it is necessary to devise countermeasures against heat generated inside the apparatus. In Patent Document 2, in order to reduce image unevenness caused by heat, a device in which the fiber direction of the carbon fiber reinforced resin on the radiation incident surface and the opposing surface of the housing is a direction in which a plurality of integrated circuits are arranged is disclosed. An apparatus in which a carbon fiber reinforced resin is disposed along a direction parallel to a side surface is disclosed.

International Publication No. 2009/122808 JP 2013-002828 A

  However, in any of the patent documents, there is room for study in order to ensure both high rigidity and high thermal uniformity. In the device of Patent Document 1, since heat generated in the device is conducted in an inclined direction, the distance to the outside of the pixel array is longer than that of the device of Patent Document 2, so that the outside of the pixel array. It is disadvantageous in the efficiency of exhausting heat. On the other hand, the device of Patent Document 2 has a lower rigidity with respect to the direction inclined with respect to the side surface, that is, the oblique direction, compared to the direction parallel to the side surface, and compared with the device of Patent Document 1 for torsional deformation and the like. Then it is disadvantageous.

  Accordingly, an object of the present invention is to provide a radiation imaging apparatus capable of ensuring both high rigidity and high thermal uniformity.

A radiation imaging apparatus according to the present invention includes a radiation sensor panel having a first surface having a pixel array in which a plurality of pixels are two-dimensionally arranged and a second surface facing the first surface, and the radiation sensor panel An electrically connected integrated circuit, a square or rectangle having a surface wider than a region in which the radiation sensor panel is orthogonally projected, a shape partially lacking the corners, and the corners being rounded A radiation imaging apparatus including a substantially square plate-like member having a shape including a shape and including a housing that houses the radiation sensor panel and the integrated circuit, wherein the plate-like member is a first member. A carbon fiber reinforced resin; a second carbon fiber reinforced resin; and a third carbon fiber reinforced resin disposed between the first carbon fiber reinforced resin and the second carbon fiber reinforced resin. Fiber method of fiber reinforced resin And at least one of the fiber directions of the second carbon fiber reinforced resin has a smaller angle with respect to the second direction parallel to the pair of diagonal lines of the plate-like member than an angle with respect to the first direction perpendicular to one side of the plate-like member. The first carbon fiber reinforced resin, the second carbon fiber reinforced resin, and the first carbon fiber reinforced resin, the fiber direction of the third carbon fiber reinforced resin, and the second carbon fiber reinforced resin and the second carbon fiber reinforced resin, so 3 carbon fiber reinforced resin is disposed, the radiation sensor panel is provided with a scintillator on the first surface, constitutes a part of the housing , and is on the second surface side of the radiation sensor panel The plate-shaped member is the support member.

  According to the present invention, it is possible to provide a radiation imaging apparatus capable of ensuring both high rigidity and high thermal uniformity.

It is the top view and cross-sectional schematic diagram of the radiation imaging device which concern on 1st Embodiment. It is the cross-sectional schematic diagram and cross-sectional perspective view of the radiation imaging device which concern on 1st Embodiment. It is the disassembled perspective view and top view for demonstrating the layer structure of the radiation imaging device which concerns on 1st Embodiment. It is the disassembled perspective view and top view for demonstrating the layer structure of the radiation imaging device which concerns on 1st Embodiment. It is the top view and cross-sectional schematic diagram of the radiation imaging device which concern on 2nd Embodiment. It is a schematic diagram explaining the structure of the support member of a radiation imaging device. It is a cross-sectional schematic diagram of the radiation imaging device which concerns on 3rd Embodiment. It is a conceptual diagram explaining the radiation imaging system using a radiation imaging device.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. In the present specification, radiation includes α rays, β rays, γ rays, X rays, particle rays, and cosmic rays.

(First embodiment)
A radiation imaging apparatus according to the first embodiment will be described with reference to FIGS. 1A, 1 </ b> B, 2 </ b> A, and 2 </ b> B. FIG. 1A is a plan view of the radiation imaging apparatus according to the first embodiment, and FIG. 1B is a schematic cross-sectional view taken along a line AA in FIG. 2A is a schematic cross-sectional view taken along the line BB in FIG. 1A, and FIG. 2B is a cylindrical housing 130 that constitutes the radiation imaging apparatus according to the first embodiment. It is a cross-sectional perspective view for demonstrating the structure of this.

  The radiation imaging apparatus 100 according to the first embodiment includes a radiation sensor panel 140, integrated circuits 144 and 145, and a housing 101. The radiation sensor panel 140 has a pixel array in which a plurality of pixels are two-dimensionally arranged. The integrated circuits 144 and 145 are electrically connected to the radiation sensor panel 140. The housing 101 includes a substantially square plate-like member having a surface wider than a region where the radiation sensor panel 140 is orthogonally projected, and accommodates at least the radiation sensor panel 140 and the integrated circuits 144 and 145. The plate-like member included in the housing 101 has high thermal uniformity by efficiently exhausting heat generated in the integrated circuits 144 and 145 to the outside of the pixel array of the radiation sensor panel 140, and high destruction due to external impact. It is necessary to provide rigidity for ensuring strength. Therefore, the plate member of the present invention has a configuration in which at least three or more layers of carbon fiber reinforced resin are laminated. That is, the plate-like member of the present invention includes a first carbon fiber reinforced resin, a second carbon fiber reinforced resin, and a third carbon fiber reinforced resin disposed between the first carbon fiber reinforced resin and the two carbon fiber reinforced resin. And including. Here, as a result of sincerity studies, when the structure is formed by laminating three or more layers of carbon fiber reinforced resin, the rigidity of the plate member is strongly influenced by the rigidity of the outermost layer, and the exhaust heat of the plate member is in the inner layer. It was found that it can be controlled by thermal conductivity. Therefore, the plate-like member of the present invention has the following configuration. At least one of the first carbon fiber reinforced resin and the second carbon fiber reinforced resin has higher rigidity in the second direction parallel to the diagonal of the plate member than the rigidity in the first direction perpendicular to one side of the plate member. Are arranged as follows. Therefore, at least one of the fiber direction of the first carbon fiber reinforced resin and the fiber direction of the second carbon fiber reinforced resin is a diagonal line of the plate member rather than an angle with respect to the first direction perpendicular to one side of the plate member. The first carbon fiber reinforced resin and the second carbon fiber reinforced resin are arranged so that the angle with respect to the second direction parallel to the first direction becomes smaller. Preferably, both the first carbon fiber reinforced resin and the second carbon fiber reinforced resin are rigid in the second direction parallel to the diagonal of the plate member rather than in the first direction perpendicular to one side of the plate member. Is arranged to be higher. That is, the second direction in which the fiber direction of the first carbon fiber reinforced resin and the fiber direction of the second carbon fiber reinforced resin are parallel to the diagonal of the plate member rather than the angle to the first direction perpendicular to one side of the plate member. 1st carbon fiber reinforced resin and 2nd carbon fiber reinforced resin are arrange | positioned so that the angle with respect to may become small. On the other hand, the third carbon fiber reinforced resin is arranged such that the thermal conductivity in the first direction perpendicular to one side of the plate-like member is higher than the thermal conductivity in the second direction parallel to the diagonal line of the plate-like member. The Therefore, the third carbon fiber reinforced resin has a third direction so that the fiber direction of the third carbon fiber reinforced resin is larger than the angle of the first direction perpendicular to one side of the plate-shaped member and the second direction parallel to the diagonal line of the plate-shaped member. Carbon fiber reinforced resin is disposed. With such a configuration, high rigidity is ensured by the outermost surface layer while high thermal uniformity is ensured by the inner layer, and a radiation imaging apparatus capable of ensuring both high rigidity and high thermal uniformity is provided. It becomes possible to do.

  The configuration of the first embodiment will be specifically described below. Each pixel constituting the pixel array of the radiation sensor panel 140 includes, for example, a photoelectric conversion element such as a photodiode and a switch element such as a TFT. A scintillator 141 that converts radiation into light that can be sensed by the photoelectric conversion element may be disposed on the photoelectric conversion element disposed on an insulating substrate such as a glass substrate. However, the pixel array is not limited thereto, and instead of the photoelectric conversion element and scintillator 141 of each pixel, a conversion element that directly converts radiation into electric charges may be used for each pixel. A plurality of such pixels are arranged in a two-dimensional matrix to form a pixel array. That is, a pixel array is arranged on the first surface of the radiation sensor panel 140. The integrated circuit 144 is provided on the printed circuit board 143, and performs at least one of processing of an image signal from the pixel array and control of the pixel array. The integrated circuit 145 is mounted on the printed circuit board 143, and outputs an image signal obtained by converting an analog signal from the pixel array from the pixel array into a digital signal. The printed circuit board 143 is electrically connected to the radiation sensor panel 140 via the flexible printed circuit board 142 and is disposed on the second surface side facing the first surface of the radiation sensor panel 140. That is, the integrated circuits 144 and 145 are mounted on a printed circuit board disposed on the side opposite to the first plate member side of the radiation sensor panel 140 described later.

The casing 101 of the radiation imaging apparatus 100 includes a cylindrical casing 130 formed into a cylindrical shape using a carbon fiber reinforced resin member (hereinafter referred to as CFRP), and a side member 120 serving as a side surface of the casing 101. . Of the cylindrical member 130, the first region on the side facing the first surface of the radiation sensor panel 140 and / or the side facing the second surface facing the first surface of the radiation sensor panel 140, that is, the first The 1st area | region and the 2nd area | region on the opposite side correspond to a plate-shaped member. In the present embodiment, the first region of the cylindrical housing 130 corresponds to the first plate member, and the second region corresponds to the second plate member. The first plate-like member and the second plate-like member have a substantially square shape corresponding to the shape of the pixel array. Here, the substantially square shape is a shape including a square or a rectangle, a shape lacking a part of those corners, and a shape where those corners are rounded. By using CFRP for the cylindrical housing 130 that occupies most of the housing, it is possible to achieve both strength securing for dropping and impact and weight reduction for the purpose of reducing the burden during transportation. In addition, since CFRP has high radiation transparency, an image with low radiation attenuation can be acquired even if it is disposed on the radiation incident surface side of the radiation sensor panel 140. On the radiation incident surface side of the radiation imaging apparatus 100, an index 133 that indicates the reading center (center of the pixel array) of the radiation sensor panel 140 and an index 134 that indicates the reading range (pixel array arrangement range) are written. The radiation imaging apparatus 100 includes a support member 110 that supports the second surface side of the radiation sensor panel 140. The support member 110 is coupled to the second plate-shaped member of the cylindrical housing 130 via the buffer member 160, that is, the support member 110 can constitute a part of the housing. The radiation sensor panel 140 has a rigid support member 110 fixed to the second surface side so as not to be deformed or cracked by an external load or vibration during transportation. For the support member 110, CFRP can be used to achieve both strength and weight reduction. Further, if necessary, a radiation shielding member (not shown) having a role of suppressing radiation deterioration of the integrated circuits 144 and 145 or removing scattered radiation from the rear of the radiation imaging apparatus 100 is provided with the support member 110 and the radiation sensor panel 140. Can be provided between. For the radiation shielding member, for example, a high specific gravity material such as molybdenum, iron, or lead can be used. The buffer member 160 is appropriately provided between the housing 101 and each of the internal members, for example, between the scintillator provided on the first surface of the radiation sensor panel 140 and the first plate member, and the effect of dispersing the load from the outside In addition, a shock absorbing effect against impact can be obtained. The buffer member 160 is made of, for example, silicon or urethane-based foam material, silicon gel, an air sac enclosing gas, or the like.

  Next, with reference to FIGS. 3A to 3C and FIGS. 4A to 4C, a detailed configuration of the plate-like member used for the cylindrical housing 130 and / or the support member 110 will be described. . Here, FIG. 3 (a) is an exploded perspective view for explaining the layer structure of CFRP used for the cylindrical member 130 as an example, and FIG. 3 (b) is the first and second carbon fiber reinforcements constituting the CFRP. A plan view of the resin 131 and FIG. 3C are plan views of the third carbon fiber reinforced resin 132. 4A is an exploded perspective view for explaining a layer structure of CFRP used for the support member 110 as an example, and FIG. 4B is a first and second carbon fiber reinforced resin 111 constituting the CFRP. FIG. 4C is a plan view of the third carbon fiber reinforced resin 112.

  First, the structure of the plate-like member that can be used for the cylindrical housing 130 will be described with reference to FIGS. The CFRP shown in FIG. 3A is obtained by laminating four layers of a thin sheet-like material called a prepreg (hereinafter referred to as a carbon fiber reinforced resin) in which carbon fibers are impregnated with a matrix resin, and then heat-curing them. The cylindrical housing 130 is obtained by winding a carbon fiber reinforced resin into a mold in a plurality of layers, in this embodiment, four layers, heat curing, and molding. As shown in FIG. 3B, here, the first and second carbon fiber reinforced resins 131 constituting the outermost surface layer of the CFRP are arranged such that the fiber direction is inclined with respect to the side. . For example, the angle θa-c with respect to the second direction 131c parallel to the pair of diagonal lines of the plate member is smaller than the angle θa-b with respect to the first direction 131b perpendicular to the one side of the plate member. First and second carbon fiber reinforced resins 131 are disposed. More preferably, the fiber directions of the first and second carbon fiber reinforced resins 131 are parallel to a second direction 131c that is a direction parallel to the pair of diagonal lines of the plate-like member. The carbon fiber reinforced resin exhibits high rigidity along the fiber direction, and the carbon fiber reinforced resin in the outermost surface layer contributes most to the rigidity of the plate-like member. Therefore, the cylindrical housing 130 having high rigidity with respect to the deformation of the plate member in the oblique direction is obtained. Moreover, since it is a cylindrical housing | casing, in the 1st plate-shaped member and the 2nd plate-shaped member, the inclination of the fiber direction becomes reverse direction. Therefore, the first plate-like member and the second plate-like member have opposite directions of inclination showing high rigidity, so that it is possible to give high rigidity against twisting in the opposite direction, and higher rigidity. A cylindrical housing 130 having the above is obtained. On the other hand, although the material rigidity in the first direction is weak, the side faces of the casing formed by the cylindrical casing 130 and the side member 120 ensure the rigidity in the respective directions. Thereby, it is possible to obtain a frame structure having sufficient rigidity.

  On the other hand, as shown in FIG.3 (c), the 3rd carbon fiber reinforced resin 132 has a fiber direction orthogonal to the side. For example, the angle θa-b with respect to the first direction 132b perpendicular to one side of the plate-like member is smaller than the angle θa-c with respect to the second direction 132c parallel to the diagonal line of the plate-like member. A third carbon fiber reinforced resin 132 is disposed. The fiber direction of the third carbon fiber reinforced resin 132 is more preferably parallel to the first direction 132b perpendicular to one side of the plate-like member. The carbon fiber reinforced resin exhibits high thermal conductivity along the fiber direction, and the carbon fiber reinforced resin in the inner layer can control the thermal conductivity of the plate-like member. Therefore, heat generated in the integrated circuit 144 and the like can be efficiently exhausted outside the pixel array at a distance closer to the side than in the second direction.

  It is preferable to use PAN-based carbon fibers for at least one of the first and second carbon fiber reinforced resins 131 and pitch-based carbon fibers for the third carbon fiber reinforced resin 132. Since the PAN-based carbon fiber has a higher breaking strength than the pitch-based carbon fiber, it is suitable for placement on the outermost surface layer where a large stress is generated during deformation or the like. In addition, since pitch-based carbon fibers have higher thermal conductivity than PAN-based carbon fibers, they are suitable for placement in an inner layer that requires an exhaust heat function. 3A to 3C are not limited to being applied to the cylindrical housing 130, and may be applied to the support member 110.

  Next, the structure of the plate-like member that can be used for the support member 110 will be described with reference to FIGS. The CFRP shown in FIG. 4A is obtained by laminating five layers of carbon fiber reinforced resin and heat-curing them. As the first and second carbon fiber reinforced resins 111 which are the outermost surface layers of the support member 110, a resin called a cross prepreg in which carbon fibers are crossed and woven is used. Therefore, high rigidity is shown in two directions parallel to the two intersecting fiber directions. As shown in FIG. 4 (b), here, the first and second carbon fiber reinforced resins 111 constituting the outermost surface layer of the CFRP are arranged so that the two fiber directions are inclined with respect to the side. ing. For example, the first fiber direction 111a has a smaller angle θa-c with respect to the second direction 111c parallel to the pair of diagonal lines of the plate-like member than the angle θa-b with respect to the first direction 111b perpendicular to one side of the plate-like member. Thus, the 1st and 2nd carbon fiber reinforced resin 111 is arrange | positioned. In addition, the second fiber direction 111a ′ has an angle θa ′ with respect to the third direction 111c ′ parallel to the other diagonal line of the plate member, rather than an angle θa′−b with respect to the first direction 111b perpendicular to one side of the plate member. The first and second carbon fiber reinforced resins 111 are arranged so that −c ′ becomes small. The fiber direction 111a is parallel to the second direction 131c, which is a direction parallel to the diagonal line of the plate member, and the fiber direction 111a 'is the third direction 131c', which is a direction parallel to the other diagonal line of the plate member. It is more preferable that the With such a configuration, it is possible to obtain a housing structure including a support member having sufficient rigidity.

  On the other hand, as shown in FIG.4 (c), the 3rd carbon fiber reinforced resin 112 has a fiber direction orthogonal to the side. For example, the angle θa-b with respect to the first direction 111b perpendicular to one side of the plate member is smaller than the angle θa-c with respect to the second direction 112c in which the fiber direction 112a is parallel to the diagonal line of the plate member. A third carbon fiber reinforced resin 132 is disposed. The fiber direction of the third carbon fiber reinforced resin 112 is more preferably parallel to the first direction 112b perpendicular to one side of the plate-like member. Therefore, heat generated in the integrated circuit 144 and the like can be efficiently exhausted outside the pixel array at a distance closer to the side than in the second direction. 4A to 4C are not limited to being applied to the support member 110, and may be applied to the cylindrical housing 130. If the fiber direction of the third carbon fiber reinforced resin of the first plate member or the second plate member and the fiber direction of the third carbon fiber reinforced resin of the support member 110 are arranged so as to intersect, all It can become the composition which can exhaust heat efficiently to a neighborhood. Further, the fiber direction of the third carbon fiber reinforced resin 112 of the support member 110 may be arranged so as to intersect the fiber direction of the third carbon fiber reinforced resin 132 of the first plate member or the second plate member. preferable. Thereby, the exhaust heat by a plate-shaped member is made more efficient, and the rigidity of the whole apparatus is also improved. In particular, the fiber direction of the third carbon fiber reinforced resin 112 of the support member 110 may be arranged so as to be orthogonal to the fiber direction of the third carbon fiber reinforced resin 132 of the first plate member or the second plate member. More preferred.

(Second Embodiment)
Next, a radiation imaging apparatus according to the second embodiment will be described with reference to FIGS. 5 (a) and 5 (b). FIG. 5A is a plan view of the radiation imaging apparatus according to the second embodiment, and FIG. 5B is a schematic cross-sectional view taken along the line CC in FIG. 5A. The second embodiment is different from the first embodiment in the following points, and the same parts as those in the second embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  A housing 201 of the radiation imaging apparatus according to the second embodiment includes a first plate member 230, a second plate member 250, and a frame member 220. CFRP is used for the first plate member 230 and the second plate member 250 as in the first embodiment, but in the first embodiment, the first plate member and the second plate member are integrally configured. However, the second embodiment is different from the first embodiment in that the second embodiment is a separate member. The frame member 220 is formed of, for example, aluminum, magnesium, or a resin material. Compared to the first embodiment in which the side surfaces of the radiation imaging apparatus 100 other than the side member 120 are formed of CFRP, it becomes easier to mold a complicated shape on the side surfaces. Further, since the first plate-like member 230 and the second plate-like member 250 are separate members, the CFRP layer configuration can be changed between the first plate-like member 230 and the second plate-like member 250. Therefore, it is possible to make a structure having a good balance between strength and thermal diffusivity.

  In the present embodiment, the heat conducting member 260 is disposed between the integrated circuit 144 on the printed circuit board 143 and the second plate member 250. As the heat conductive member 260, for example, heat conductive silicon rubber or the like is used. By transferring the heat generated in the integrated circuit 144 to the second plate member 250 side, the heat transfer to the side where the radiation sensor panel 140 is present can be reduced, and the temperature rise of the radiation sensor panel 140 can be suppressed. Here, since the heat of the integrated circuit 144 is directly transferred to the second plate-like member 250, a heat spot can be easily formed on the second plate-like member 250. For this reason, the second plate-like member 250 is required to have a higher thermal diffusibility than the second plate-like member of the first embodiment. The layer configuration of the second plate-like member 250 increases the number of third carbon fiber reinforced resins as compared to the first embodiment, and the first and second carbon fiber reinforced resins are arranged on the side surfaces in the same manner as in the first embodiment. Inclined with respect to the heat dispersibility. That is, 2 or more 3rd carbon fiber reinforced resin is further increased to 3 or more, and it is preferable that 2 or more 3rd carbon fiber reinforced resin is included in this invention. Further, in the present embodiment, pitch-based carbon fibers having high thermal conductivity may be used for the first and second carbon fiber reinforced resins. Further, the frame member 220 is formed of a metal having high thermal conductivity, and is joined to the second plate-like member 250 so that heat can be transferred, thereby further diffusing the heat transferred by the inner layer of the second plate-like member 250. Effect is obtained. The same applies to the support member 210. If the heat conduction member 260 is disposed between the support member 210 and the frame member 220, the heat exhaust effect can be enhanced.

  One of the first plate-like member 230 and the second plate-like member 250 on the side irradiated with radiation does not adopt the above-described CFRP configuration with priority given to suppression of radiation irradiation. Good. For example, in the configuration of FIG. 5B, the heat generation of the integrated circuit 144 is rarely transferred to the first plate-like member 230 side, and therefore the first plate-like member 230 does not need much thermal diffusibility. Therefore, the 1st plate-shaped member 230 is comprised only in any one of 1st and 2nd carbon fiber reinforced resin, and shall make the rigidity of diagonal direction stronger. However, since the heat diffusibility of the first plate-like member 230 is low, when the subject touches from the first plate-like member 230 side, the heat of the subject is transferred to the radiation sensor panel 140 to the radiation sensor panel 140. There is a risk of uneven temperature. Therefore, it is more preferable to arrange a heat insulating member 270 that also serves as a buffer member between the first plate-like member 230 and the sensor panel 140 so that heat is not transmitted.

  Next, the arrangement of the support member 210 and the printed circuit board 143 will be described with reference to FIG. The integrated circuit 144 mounted on the printed circuit board 143 is disposed at a position closer to the side surface than the center of the support member 210. The fiber direction of the third carbon fiber reinforced resin of the support member 210 is a direction orthogonal to the side surface of the four sides of the support member 210 that is closest to the integrated circuit 144. As a result, since the heat generated by the integrated circuit 144 can be transferred to the side surface at a short distance, efficient exhaust heat can be obtained. The printed circuit board 143 is mounted with a plurality of integrated circuits 145 that amplify image signals obtained by the photoelectric conversion elements on the radiation sensor panel 140 and perform A / D conversion. If a temperature difference occurs in each of the integrated circuits 145, there is a risk that unevenness occurs in the image due to the difference in temperature characteristics. Therefore, by arranging a plurality of integrated circuits 145 in parallel with the fiber direction of the third carbon fiber reinforced resin of the support member 210, the thermal conductivity between the integrated circuits is improved, so that the temperature difference is reduced. Is possible. Note that not only the support member 210 but also the fiber direction of the second plate member 250 can be the same as that of the support member 210. Further, not only the support member 210 but also the support member 110 used in the first embodiment can be the same.

  According to the present embodiment, it is possible to exhaust heat generated in the integrated circuit more efficiently than in the first embodiment.

(Third embodiment)
Next, a radiation imaging apparatus according to the third embodiment will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view of a radiation imaging apparatus according to the third embodiment. Note that the third embodiment is different from the second embodiment in the following points, and the same parts as those in the second embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  The radiation imaging apparatus according to the present embodiment has a configuration in which the radiation sensor panel 140 is attached to the first plate member 330. The first plate-like member 330 plays a role of suppressing the deformation of the radiation sensor panel 140, and the support member 310 does not require high rigidity, which contributes to reduction in thickness and weight of the apparatus. The radiation imaging apparatus of this embodiment is particularly effective when the scintillator 141 is configured on the opposite side of the radiation incident surface of the radiation sensor panel 140. This is because the radiation sensor panel 140 can be directly attached to the first plate-like member 330 without using the scintillator 141, so that the strength can be ensured regardless of the peel strength of the scintillator 141 or the like. In such a configuration, the pixel array is disposed on the second surface of the radiation sensor panel.

  When the subject touches from the first plate-like member 330 side, since the buffer member and the scintillator are not interposed as in the first embodiment, the heat of the subject is transferred to the radiation sensor panel 140, and the radiation sensor panel 140 Temperature unevenness may occur. Therefore, the first plate-like member 330 is required to have a high thermal diffusivity compared to the first plate-like member of the first embodiment. The layer configuration of the first plate-like member 330 increases the number of third carbon fiber reinforced resins compared to the first plate-like member of the first embodiment, and the first and second carbon fiber reinforced resins are the first embodiment. Arranging in the same manner as the form makes it possible to further increase the thermal diffusibility. Furthermore, it is more preferable to use pitch-based carbon fibers having high thermal conductivity for the first and second carbon fiber reinforced resins.

  According to the present embodiment, it is possible to provide a radiation imaging apparatus capable of ensuring both high rigidity and high thermal uniformity even in the configuration in which the radiation sensor panel 140 is attached to the first plate member 330. It becomes possible.

  In each of the above-described embodiments, the first plate member, the second plate member, and the support member are all formed of CFRP. However, the present invention is not limited to this. Absent. Only one of the first plate member, the second plate member, and the support member may be formed of CFRP, and can be variously modified without departing from the scope of the claims. is there.

(Application embodiment)
Next, a radiation imaging system using the radiation imaging apparatus of the present invention will be described with reference to FIG.

  X-rays 6060 emitted from the X-ray tube 6050 serving as a radiation source pass through the chest 6062 of the patient or subject 6061 and enter each conversion element included in the radiation imaging apparatus 6040 of the present invention. This incident X-ray includes information inside the body of the patient 6061. Corresponding to the incidence of X-rays, the conversion element converts radiation into electric charge to obtain electrical information. This information is converted into digital data, and an image signal which is digital data is subjected to image processing by an image processor 6070 serving as a signal processing means. An image based on the image-processed signal can be displayed and observed on a display 6080 serving as a display unit in the control room. Further, this information can be transferred to a remote place by transmission processing means such as a telephone line 6090, and can be displayed on a display 6081 serving as a display means such as a doctor room in another place or stored in a recording means such as an optical disk. It is also possible for a doctor to make a diagnosis. Moreover, it can also record on the film 6110 used as a recording medium by the film processor 6100 used as a recording means.

DESCRIPTION OF SYMBOLS 100 Radiation imaging device 101 Case 140 Radiation sensor panel 144 Integrated circuit 145 Integrated circuit 131 1st carbon fiber reinforced resin, 2nd carbon fiber reinforced resin 132 3rd carbon fiber reinforced resin

Claims (17)

A radiation sensor panel having a pixel array in which a plurality of pixels are two-dimensionally arranged;
An integrated circuit electrically connected to the radiation sensor panel;
The radiation sensor panel has a surface wider than an orthogonally projected region, a square or a rectangle, a shape in which those corners are partially omitted, and a shape including a shape in which those corners are rounded. A housing containing a rectangular plate-shaped member and housing the radiation sensor panel and the integrated circuit;
A radiation imaging apparatus comprising:
The plate member includes a first carbon fiber reinforced resin, a second carbon fiber reinforced resin, a third carbon fiber reinforced resin disposed between the first carbon fiber reinforced resin and the second carbon fiber reinforced resin. Including,
The diagonal line of the plate member is at least one of the fiber direction of the first carbon fiber reinforced resin and the fiber direction of the second carbon fiber reinforced resin with respect to a first direction perpendicular to one side of the plate member. And the first carbon fiber reinforced resin so that the angle of the third carbon fiber reinforced resin with respect to the second direction is smaller than the angle with respect to the first direction. The second carbon fiber reinforced resin and the third carbon fiber reinforced resin are arranged,
The radiation sensor panel has a first surface having the pixel array, and a second surface facing the first surface, and a scintillator is provided on the first surface,
Further comprising a support member that forms part of the housing and supports the second surface side of the radiation sensor panel;
The radiation imaging apparatus, wherein the plate-like member is the support member.   The first carbon fiber reinforced resin and the first carbon fiber reinforced resin so that the fiber direction of the first carbon fiber reinforced resin and the fiber direction of the second carbon fiber reinforced resin have a smaller angle with respect to the second direction than the angle with respect to the first direction. The radiation imaging apparatus according to claim 1, wherein the second carbon fiber reinforced resin is disposed. At least one of the first carbon fiber reinforced resin and the second carbon fiber reinforced resin has a first fiber direction in which an angle with respect to the second direction is smaller than an angle with respect to the first direction, and another diagonal line different from the diagonal line. A carbon fiber reinforced resin in which carbon fibers are knitted so as to have a second fiber direction having a smaller angle with respect to the second direction than an angle with respect to a third direction parallel to the first direction,
The third carbon fiber reinforced resin is disposed such that a fiber direction of the third carbon fiber reinforced resin has an angle with respect to the second direction larger than an angle with respect to the first direction. The radiation imaging apparatus according to 1 or 2.   4. The radiation imaging apparatus according to claim 1, wherein a fiber direction of the third carbon fiber reinforced resin is parallel to the first direction. 5.   The radiation imaging according to any one of claims 1 to 4, wherein a fiber direction of the first carbon fiber reinforced resin and a fiber direction of the second carbon fiber reinforced resin are parallel to the second direction. apparatus.   6. The radiation imaging apparatus according to claim 1, comprising two or more of the third carbon fiber reinforced resins.   The said housing | casing has a 1st plate-shaped member facing the said 1st surface, and a 2nd plate-shaped member facing the said 2nd surface, The any one of Claim 1 to 6 characterized by the above-mentioned. Radiation imaging device.   The radiation imaging apparatus according to claim 7, wherein the plate-like member is adopted for the support member and the second plate-like member, and is not adopted for the first plate-like member. .   The radiation imaging apparatus according to claim 8, wherein a heat insulating member that also serves as a buffer member is disposed between the first plate-like member and the first surface. A printed circuit board disposed on the opposite side of the radiation sensor panel from the first plate-like member side, and a flexible printed circuit board that electrically connects the radiation sensor panel and the printed circuit board;
The integrated circuit is mounted on the printed circuit board;
The plate member is the second plate member,
A heat conducting member is disposed between the integrated circuit and the second plate member;
10. The radiation imaging apparatus according to claim 7, wherein a plurality of the integrated circuits are arranged side by side in parallel with a fiber direction of the third carbon fiber reinforced resin. A printed circuit board disposed on the opposite side of the radiation sensor panel from the first plate-like member side, and a flexible printed circuit board that electrically connects the radiation sensor panel and the printed circuit board;
The integrated circuit is mounted on the flexible printed circuit board,
The radiation imaging apparatus according to claim 7, wherein a plurality of the flexible printed circuit boards are arranged along a direction parallel to one side of the plate-like member.   12. The system according to claim 1, wherein at least one of the first carbon fiber reinforced resin and the second carbon fiber reinforced resin is a PAN system, and the third carbon fiber reinforced resin is a pitch system. A radiation imaging apparatus according to claim 1. A radiation sensor panel having a pixel array in which a plurality of pixels are two-dimensionally arranged;
An integrated circuit electrically connected to the radiation sensor panel;
The radiation sensor panel has a surface wider than an orthographically projected area, is a square or rectangle, a shape that partially lacks the corners thereof, and a shape that includes a shape in which the corners are rounded. A housing containing a rectangular plate-shaped member and housing the radiation sensor panel and the integrated circuit;
A radiation imaging apparatus comprising:
The plate member includes a first carbon fiber reinforced resin, a second carbon fiber reinforced resin, and a third carbon fiber reinforced resin disposed between the first carbon fiber reinforced resin and the second carbon fiber reinforced resin. Including,
At least one of the first carbon fiber reinforced resin and the second carbon fiber reinforced resin is a second parallel to the diagonal line of the plate member rather than the rigidity in the first direction perpendicular to one side of the plate member. It is arranged so that the rigidity to the direction is high,
The third carbon fiber reinforced resin is disposed such that the thermal conductivity with respect to the first direction is higher than the thermal conductivity with respect to the second direction,
The radiation sensor panel has a first surface having the pixel array, and a second surface facing the first surface, and a scintillator is provided on the first surface,
Further comprising a support member that forms part of the housing and supports the second surface side of the radiation sensor panel;
The radiation imaging apparatus, wherein the plate-like member is the support member.   The said 1st carbon fiber reinforced resin and the said 2nd carbon fiber reinforced resin are arrange | positioned so that the rigidity with respect to the said 2nd direction may become higher than the rigidity with respect to the said 1st direction. Radiation imaging device. The housing includes a first plate member facing the first surface and a second plate member facing the second surface,
The radiation according to claim 13 or 14, wherein the plate-like member is adopted for the support member and the second plate-like member, and is not adopted for the first plate-like member. Imaging device.   The radiation imaging apparatus according to claim 15, wherein a heat insulating member that also serves as a buffer member is disposed between the first plate-like member and the first surface. A radiation imaging apparatus according to any one of claims 1 to 16,
A processing device for processing signals from the radiation imaging device;
A display device for displaying an image based on the signal processed by the processing device;
A radiation imaging system comprising:

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