JP2019152677A - Radiographic imaging apparatus and radiographic imaging system - Google Patents

Abstract

To provide a technique for reducing deformation and damage of a housing due to shocks on a radiographic imaging apparatus.SOLUTION: Provided is a radiographic imaging apparatus having a radiation detection panel, a housing that accommodates the radiation detection panel, and a shock absorbing member. The housing has openings at corners. The shock absorbing member comprises a first portion located inside the housing and second portions protruding outward from the openings of the housing. The second portions of the shock absorbing member have an elasticity modulus lower than that of portions of the housing constituting the openings. The first portion of the shock absorbing member is bonded to an inner surface of the housing so as not to be taken out of the housing.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a radiation imaging apparatus and a radiation imaging system.

  A portable radiation imaging apparatus called an electronic cassette has been put into practical use. When a portable radiation imaging device is dropped, the housing of the radiation imaging device may be damaged or deformed due to an impact on the radiation imaging device. Various measures have been proposed to reduce such damage and deformation. Patent Document 1 proposes that a casing is constituted by an outer shell and an inner shell, and that a shock absorber is filled between the outer shell and the inner shell. Patent Document 2 proposes chamfering a corner of a housing and attaching a detachable shock absorber to the surface.

Japanese Patent No. 4248940 JP 2013-257198 A

  The outer surface of the housing of Patent Document 1 is composed only of an outer shell. When the outer shell is made of a material having a high elastic modulus, the deformation of the entire casing at the time of dropping can be reduced. However, stress concentrates on the outer shell, and the outer shell may be damaged. On the other hand, when the elastic modulus of the outer shell is lowered, it becomes difficult to reduce the deformation of the entire casing. Further, as in Patent Document 2, when the shock absorbing material is attached to the outer surface of the housing, the shock due to the fall of the radiation imaging apparatus is transmitted to the housing through the shock absorbing material. As a result, the housing may be distorted or deformed as a whole. As described above, it is difficult to reduce both the breakage and the deformation of the housing by the existing method. An object of this invention is to provide the technique for reducing the deformation | transformation and damage of a housing | casing by the impact to a radiation imaging device.

  In view of the above problem, a radiation imaging apparatus including a radiation detection panel, a housing that houses the radiation detection panel, and a buffer member, the housing having an opening at a corner, A first portion inside the housing and a second portion protruding from the opening of the housing to the outside of the housing, and an elastic modulus of the second portion of the buffer member is determined by the housing Radiation characterized by being lower in elasticity than the part of the body that constitutes the opening, wherein the first part of the buffer member is coupled to the inner surface of the housing so that it cannot be removed from the housing. An imaging device is provided.

  The above means provides a technique for reducing deformation and breakage of the casing due to an impact on the radiation imaging apparatus.

The figure explaining the radiation imaging device of some embodiments of the present invention. The figure explaining the buffer member of some embodiments of the present invention. The figure explaining the buffer member of other some embodiments of the present invention. The figure explaining the buffer member of other some embodiments of the present invention. The figure explaining the buffer member of other some embodiments of the present invention. The figure explaining the buffer member of other some embodiments of the present invention. The figure explaining the radiation imaging device of other one part embodiment of this invention. The figure explaining the radiation imaging device of other one part embodiment of this invention. The figure explaining the radiation imaging system of some embodiments of the present invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. Throughout the various embodiments, similar elements are given the same reference numerals, and redundant descriptions are omitted. In addition, each embodiment can be appropriately changed and combined.

  With reference to FIG. 1, the structure of the radiation imaging device 100 which concerns on some embodiment of this invention is demonstrated. 1A is a perspective view of the radiation imaging apparatus 100, and FIG. 1B is a cross-sectional view taken along the line AA of FIG. 1A. The radiation imaging apparatus 100 includes a housing 101 and components housed in the housing 101. In the following description, in the radiation imaging apparatus 100, a surface irradiated with radiation (upper surface in FIG. 1B) is referred to as an incident surface, and a surface on the opposite side (lower in FIG. 1B). The surface connecting the incident surface and the back surface is called a side surface. The incident surface, the back surface, and the side surface of the radiation imaging apparatus 100 correspond to the incident surface, the back surface, and the side surface of the housing 101, respectively. Of the housing 101, a portion constituting the incident surface is referred to as a front side portion, a portion constituting the back surface is referred to as a back side portion, and a portion constituting the side surface is referred to as a side wall. The side wall connects the front side portion and the back side portion. The radiation imaging apparatus 100 has four corners 100a. A corner 100 a of the radiation imaging apparatus 100 corresponds to a corner of the housing 101.

  The casing 101 includes an upper exterior member 102a, a lower exterior member 102b, and a radiation transmission plate 103. The upper exterior member 102a and the lower exterior member 102b constitute the housing exterior 102. The upper exterior member 102 a and the lower exterior member 102 b are in contact with each other on the side surface of the radiation imaging apparatus 100. The upper exterior member 102a and the lower exterior member 102b may be coupled to each other on the side surface of the radiation imaging apparatus 100 or may be coupled at other portions. The upper exterior member 102a has a frame shape, and the radiation transmitting plate 103 is fitted into the opening thereof. The radiation transmitting plate 103 and a part of the upper exterior member 102a constitute a front side member of the housing 101. A part of the lower exterior member 102b constitutes a back surface portion of the housing 101. A side wall of the housing 101 is constituted by a part of the upper exterior member 102a and a part of the lower exterior member 102b.

  The radiation imaging apparatus 100 includes components described below such as a sensor substrate 107 and a scintillator layer 106 inside a housing 101. The scintillator layer 106 is located between the sensor substrate 107 and the radiation transmitting plate 103. The scintillator layer 106 converts the radiation that has entered the housing 101 through the radiation transmitting plate 103 into light. The sensor substrate 107 includes a sensor that converts light converted by the scintillator layer 106 into an electric signal (for example, a photoelectric conversion element that converts light into electric charge), and a switch element for reading out the electric signal to the outside of the sensor substrate 107. (For example, TFT). The sensor substrate 107 may include a plurality of pixels configured by sensors and switch elements. The plurality of pixels may be arranged in a two-dimensional array. The sensor substrate 107 and the scintillator layer 106 constitute a detection panel that detects radiation (that is, a radiation detection panel). The surface of the scintillator layer 106 is covered with a protective layer 105 having moisture resistance. The radiation imaging apparatus 100 in the example of FIG. 1 has a so-called indirect detection panel, but instead may have a direct detection panel that directly converts radiation into an electrical signal.

  The sensor board 107 is connected to the circuit board 113 through the flexible cable 114. The circuit board 113 is connected to the circuit board 111 through the flexible cable 112. Circuit boards 111 and 113 are provided with a circuit for reading signals from the sensor board 107 and processing the read signals and a circuit for controlling the operation of the sensor board 107. Electric power is supplied from the battery 110 to the sensor board 107 and the circuit boards 111 and 113. The radiation imaging apparatus 100 may include a power supply circuit that supplies external power to each component instead of including the battery 110.

  The detection panel (specifically, the sensor substrate 107) is supported by the base 108. The base 108 is fixed or brought into contact with the lower exterior member 102 b through the support column 109. The circuit boards 111 and 113 and the battery 110 are arranged on the back side of the base 108 (the side opposite to the detection panel). A buffer layer 104 made of a foaming agent or the like is disposed between the detection panel (specifically, the protective layer 105) and the radiation transmitting plate 103.

  The structure of the corner 100a of the radiation imaging apparatus 100 will be described with reference to FIG. 2A is a perspective view of a corner 100a of the radiation imaging apparatus 100, and FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A. As shown in FIG. 2B, a surface of the upper exterior member 102a facing the outside of the housing 101 is called an outer surface 102d, and a surface facing the inside of the housing 101 is called an inner surface 102e. Of the lower exterior member 102b, the surface facing the outside of the housing 101 is called an outer surface 102g, and the surface facing the inside of the housing 101 is called an inner surface 102f.

  As shown in FIG. 2, the housing 101 has an opening 102c at a corner 100a. In FIG.2 (b), the opening 102c is shown with a broken line for reference. The opening 102c is disposed across the upper exterior member 102a and the lower exterior member 102b. The radiation imaging apparatus 100 further includes a buffer member 200 at the corner 100a. The buffer member 200 includes a portion inside the housing 101 (hereinafter referred to as an inner portion 200a) and a portion protruding from the opening 102c of the housing 101 to the outside of the housing 101 (hereinafter referred to as an outer portion 200b). including.

  The inner portion 200a of the buffer member 200 is coupled to at least one of the inner surface 102e of the upper exterior member 102a and the inner surface 102f of the lower exterior member 102b so as not to be detached from the housing 101. The inner portion 200a may be bonded to at least one of the inner surface 102e and the inner surface 102f by, for example, bonding with an adhesive or a pressure-sensitive adhesive. Alternatively, the inner portion 200a may be joined by being integrally formed with either the upper exterior member 102a or the lower exterior member 102b.

  The outer portion 200b of the buffer member 200 does not include a portion that contacts the outer surfaces 102d and 102g of the exterior 102. In addition, the outer portion 200b has a step 200c that faces the portion of the housing 101 that forms the opening 102c with an interval. The step 200c has a shape corresponding to the opening 102c and is formed on the entire periphery of the outer portion 200b. The step 200c is located away from the opening 102c.

  The exterior 102 is formed of a material having a high elastic modulus (and therefore high rigidity) such as an aluminum alloy, a magnesium alloy, a fiber reinforced resin, or a fiber reinforced metal. The upper exterior member 102a and the lower exterior member 102b may be formed of the same material, or may be formed of different materials. Thus, the overall deformation of the housing 101 is reduced by forming the exterior 102 with a material having a high elastic modulus. Therefore, due to the deformation of the casing 101, light enters the radiation imaging apparatus 100 and a good image cannot be acquired, or the external shape of the radiation imaging apparatus 100 changes, and it becomes a stand or the like. It can suppress that it becomes impossible to store.

  The buffer member 200 is formed of a material having a lower elastic modulus than that of the exterior 102, for example, a resin. Since the outer portion 200b of the buffer member 200 projects from the housing 101 at the corner 100a of the housing 101, when the radiation imaging apparatus 100 falls, the projecting buffer member 200 first collides with the floor or the like. Thereby, the impact to the exterior 102 can be suppressed. Further, since the buffer member 200 is coupled to the inner surfaces 102e and 102f of the exterior 102, the influence of the impact on the exterior 102 through the cushion member 200 is reduced.

  For example, when the exterior 102 is formed of a sheet-like fiber reinforced resin using a long fiber such as a prepreg, in order to make the material into a substantially rectangular shape, a corner is formed by cutting the material. There is. When such a cut portion receives an impact, it can become a starting point of destruction, but according to the configuration of the present embodiment, it is possible to suppress the impact to the cut portion.

  When the exterior 102 is formed of a fiber reinforced resin, the buffer member 200 may be formed of a resin that can be easily molded integrally with the exterior 102. For example, when the exterior 102 is formed of a carbon fiber reinforced resin using epoxy, the buffer member 200 may be formed of a resin containing a resin compatible with epoxy or a carbon fiber of short fibers. By forming in this way, the exterior 102 and the buffer member 200 can be configured as a so-called integrally molded product having a higher interface strength than that of adhesion. When the exterior 102 is formed of a metal alloy, the buffer member 200 may be formed of a resin or other material. Moreover, in order to improve the adhesive strength between the metal and the resin, a mechanical or chemical surface treatment may be applied to the bonding surface.

  The radiation imaging apparatus 100 may have the buffer members 200 at all four corners 100a, or may have the buffer members 200 at some corners 100a. When the buffer member 200 is provided at some corners 100a, impact resistance is enhanced at the corners 100a.

  A modification of the radiation imaging apparatus 100 will be described with reference to FIG. 3A is a perspective view of the corner 100a of the radiation imaging apparatus 100, and FIG. 3B is a cross-sectional view taken along the line CC of FIG. 3A. This modification has a buffer member 300 in place of the buffer member 200. Since the other points may be the same, redundant description is omitted. The buffer member 300 is different in shape from the buffer member 200, and may be the same as the buffer member 200 in other points such as the material and the method of coupling with the exterior 102. The buffer member 300 also includes an inner portion 300 a inside the housing 101 and an outer portion 300 b that protrudes outside the housing 101 from the opening 102 c of the housing 101.

  The outer portion 300 b of the buffer member 300 does not include a portion that contacts the outer surfaces 102 d and 102 g of the exterior 102. The outer portion 300b has a step 300c that faces the portion of the housing 101 that forms the opening 102c with a gap. The step 300c has a shape corresponding to a portion on the incident surface side of the opening 102c, and is formed on the incident surface side of the outer portion 300b. The step 300c is located away from the opening 102c.

  The outer portion 300 b of the buffer member 300 extends farther from the housing 101 on the incident surface side than the back surface side of the housing 101. Further, the inner portion 300 a of the buffer member 300 extends to the inside of the housing 101 on the incident surface side as compared to the back surface side of the housing 101. When the radiation imaging apparatus 100 falls, there is a high possibility that the portion of the outer portion 300b that extends far from the housing 101 will first collide with the floor or the like. When the extending portion first collides, a large force is applied to the coupling portion between the buffer member 300 and the upper exterior member 102a. Therefore, the possibility that the buffer member 300 is detached from the housing 101 can be reduced by increasing the area of the coupling portion.

  In another modification of the radiation imaging apparatus 100, the buffer member 300 may be exchanged up and down. That is, the outer portion 300 b of the buffer member 300 extends farther from the housing 101 on the back surface side than the incident surface side of the housing 101, and the inner portion 300 a of the buffer member 300 extends on the incident surface side of the housing 101. In contrast, the back surface may extend to the inside of the housing 101.

  A modification of the radiation imaging apparatus 100 will be described with reference to FIG. 4A is a perspective view of the corner 100a of the radiation imaging apparatus 100, and FIG. 4B is a cross-sectional view taken along the line DD in FIG. 4A. This modification has a buffer member 400 instead of the buffer member 200. Since the other points may be the same, redundant description is omitted. The buffer member 400 is different in shape from the buffer member 200, and may be the same as the buffer member 200 in other points such as the material and the method of coupling with the exterior 102. The buffer member 400 also includes an inner portion 400 a inside the housing 101 and an outer portion 400 b that protrudes outside the housing 101 from the opening 102 c of the housing 101.

  The outer portion 400b of the buffer member 400 does not include a portion that contacts the outer surfaces 102d and 102g of the exterior 102. Further, the outer portion 300b has a step 400c that faces the portion of the housing 101 that forms the opening 102c with an interval. The step 400c has a shape corresponding to a portion on the incident surface side and a portion on the back surface side of the opening 102c, and is formed on the incident surface side and the back surface side of the outer portion 400b. The step 400c is located away from the opening 102c.

  The outer portion 400b of the buffer member 400 has a recess between a portion on the incident surface side and a portion on the back surface side. Accordingly, the weight of the buffer member 400 can be reduced, and a bending moment that swells the housing 101 is hardly applied to the housing 101.

  A modification of the radiation imaging apparatus 100 will be described with reference to FIG. 5A is a perspective view of the corner 100a of the radiation imaging apparatus 100, and FIG. 5B is a cross-sectional view taken along line EE of FIG. 5A. This modification has a buffer member 500 in place of the buffer member 200. Since the other points may be the same, redundant description is omitted. The buffer member 500 has a shape different from that of the buffer member 200, and may be the same as the buffer member 200 in other points such as a material and a coupling method with the exterior 102. The buffer member 500 also includes an inner portion 500 a inside the housing 101 and an outer portion 500 b that protrudes outside the housing 101 from the opening 102 c of the housing 101.

  The outer portion 500 b of the buffer member 500 has the same shape as the outer portion 400 b of the buffer member 400. Instead, the outer portion 500b of the buffer member 500 may have the same shape as the outer portions of the other buffer members described above. The inner portion 500 a of the buffer member 500 has a recess on a surface that is not in contact with the housing 101 (that is, a surface facing the inside of the housing 101). Accordingly, it is possible to reduce the weight of the buffer member 500 while maintaining the coupling force between the buffer member 500 and the housing 101.

  A modification of the radiation imaging apparatus 100 will be described with reference to FIG. 6A is a plan view focusing on the corner 100a of the radiation imaging apparatus 100, FIG. 6B is a cross-sectional view taken along line FF in FIG. 6A, and FIG. FIG. 6 is a view showing a state where a second member 602 is removed from the first member 601. This modification has a buffer member 600 in place of the buffer member 200. The buffer member 600 includes an inner portion inside the housing 101 and an outer portion that protrudes outside the housing 101 from the opening 102 c of the housing 101.

  The outer portion of the buffer member 600 does not include a portion that contacts the outer surfaces 102 d and 102 g of the exterior 102. In addition, the outer portion of the buffer member 600 has a step 600 c that faces the portion of the housing 101 that forms the opening 102 c with a space therebetween. The step 600c has a shape corresponding to the opening 102c, and is formed on the entire periphery of the outer portion 600b. The step 600c is located away from the opening 102c.

  The buffer member 600 includes a first member 601 and a second member 602. The first member 601 is formed of the same material as the buffer member 200, and can be detached from the housing 101 on at least one of the inner surface 102 a of the upper exterior member 102 a and the inner surface 102 f of the lower exterior member 102 b, similar to the buffer member 200. There is no binding. The outer portion of the buffer member 600 is constituted by a part of the first member 601 and a part of the second member 602. The second member 602 is formed of a material having a lower elastic modulus than that of the first member 601, for example, foam or gel. The second member 602 has a convex portion 602a having a shape corresponding to the concave portion 601a of the first member 601, and the second member 602 is attached to the first member 601 by inserting the convex portion 602a into the concave portion 601a. It is done. The second member 602 may be adhered to the first member 601 with an adhesive or a pressure-sensitive adhesive, or may be simply mechanically attached. When the radiation imaging apparatus 100 falls, the second member 602 of the buffer member 600 first collides with the floor or the like. Since the second member 602 has a lower elastic modulus than the first member 601, the buffering capacity of the buffer member 600 is further increased.

  With reference to FIG. 7, a configuration of a radiation imaging apparatus 700 according to some embodiments of the present invention will be described. Fig.7 (a) is a top view of the radiation imaging device 700, FIG.7 (b) is sectional drawing in the GG line | wire of Fig.7 (a). The radiation imaging apparatus 700 is different from the radiation imaging apparatus 100 in that it has a buffer member 701 instead of the buffer member 200, and other points may be the same. The buffer member 701 is different in shape from the buffer member 200, and may be the same as the buffer member 200 in other points such as a material and a method of coupling with the exterior 102. The buffer member 701 also includes an inner portion inside the housing 101 and an outer portion protruding outside the housing 101 from the opening 102c of the housing 101. The shape of the outer portion of the buffer member 701 may be the same as any outer portion of the buffer member described above.

  The buffer member 701 has a frame shape surrounding a detection panel constituted by the sensor substrate 107 and the scintillator layer 106. The buffer member 701 may be an integral member or a combination of a plurality of members. Further, the buffer member 701 may have a portion cut into a part of the frame shape. An inner portion of the buffer member 701 is along the side wall 102h of the exterior 102 (that is, the side wall of the housing 101). Since the buffer member 701 is positioned by the exterior 102, it may be coupled to the exterior 102 or may not be coupled. Since the buffer member 701 has a frame shape, not only can the deformation of the radiation imaging apparatus 700 due to an impact at the time of dropping be suppressed, but also the bending rigidity of the entire radiation imaging apparatus 700 can be improved.

  As illustrated in FIG. 7B, the base 108 may be in contact with the buffer member 701. Thereby, the radiation imaging apparatus 700 can be reduced in size. The buffer member 701 may have a recess on a surface that is not in contact with the housing 101 (that is, a surface facing the inside of the housing 101). The recess may be disposed over the entire circumference of the frame-shaped buffer member 701. The edge of the base 108 may enter the recess of the buffer member 701.

  The buffer member 701 may include a conductor such as metal in a part thereof, or the buffer member 701 may be formed of a conductive material such as a fiber reinforced resin. By disposing the conductive member in a frame shape surrounding the radiation detection panel, noise to the radiation detection panel coming from the outside of the radiation imaging apparatus 700 can be reduced.

  With reference to FIG. 8, the configuration of a radiation imaging apparatus 800 according to some embodiments of the present invention will be described. The housing of the radiation imaging apparatus 800 has a hexagonal shape and has a grip portion. The radiation imaging apparatus 800 includes any of the above-described buffer members, and the buffer member includes a portion protruding from an opening in at least one of the corners 800a of the radiation imaging apparatus 800.

  FIG. 9 is a diagram showing an application example of the radiation imaging apparatus according to the present invention to an X-ray diagnostic system (radiation imaging system). X-ray 6060 as radiation generated by the X-ray tube 6050 (radiation source) passes through the chest 6062 of the subject or patient 6061 and enters the detection device 6040 which is one of the above-described radiation imaging devices. This incident X-ray includes information inside the body of the patient 6061. The scintillator emits light in response to the incidence of X-rays, and this is photoelectrically converted to obtain electrical information. This information is converted into a digital signal, image-processed by an image processor 6070 serving as a signal processing unit, and can be observed on a display 6080 serving as a display unit of a control room. Note that the radiation imaging system includes at least a detection device and a signal processing unit that processes a signal from the detection device.

  This information can be transferred to a remote location by a transmission processing unit such as a telephone line 6090, displayed on a display 6081 serving as a display unit such as a doctor room in another location, or stored in a recording unit such as an optical disc. It is also possible for a doctor to make a diagnosis. Moreover, it can also record on the film 6110 used as a recording medium by the film processor 6100 used as a recording part.

DESCRIPTION OF SYMBOLS 100 Radiation imaging device, 101 Case, 102c Opening, 200 Buffer member

In view of the above problems, a radiation detection panel, a rectangular parallelepiped housing configured to accommodate the radiation detection panel, and a plurality of corner members disposed separately at corners of the housing are provided. A radiation imaging apparatus is provided, wherein a material of the corner member is different from a material of the casing .

Claims (12)

A radiation detection panel;
A housing for housing the radiation detection panel;
A radiation imaging apparatus comprising a buffer member,
The housing has an opening at a corner;
The buffer member includes a first portion inside the housing, and a second portion protruding outside the housing from the opening of the housing,
The elastic modulus of the second part of the buffer member is lower than the elastic modulus of the part constituting the opening in the housing,
The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member is coupled to an inner surface of the casing so as not to be detached from the casing.   The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member is bonded to an inner surface of the housing.   The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member is integrally formed with the housing.   4. The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member has a frame shape surrounding the radiation detection panel. 5. A radiation detection panel;
A housing for housing the radiation detection panel;
A radiation imaging apparatus comprising a buffer member,
The housing has an opening at a corner;
The buffer member includes a first portion inside the housing, and a second portion protruding outside the housing from the opening of the housing,
The elastic modulus of the second part of the buffer member is lower than the elastic modulus of the part constituting the opening in the housing,
The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member has a frame shape surrounding the radiation detection panel.   The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member is along a side wall of the housing.   The radiation imaging apparatus according to claim 1, wherein the first portion of the buffer member has a recess on a surface that is not in contact with the housing.   The radiation according to any one of claims 1 to 7, wherein the second portion of the buffer member has a step that faces the portion of the housing that forms the opening with a space therebetween. Imaging device.   The radiation imaging apparatus according to claim 8, wherein the step has a shape corresponding to at least a part of the opening. Further comprising a base for supporting the radiation detection panel;
The radiation imaging apparatus according to claim 1, wherein the base is in contact with the buffer member. The buffer member includes a first member and a second member having a lower elastic modulus than the first member,
The first member is coupled to the inner surface of the housing;
The radiation imaging apparatus according to claim 1, wherein the second portion of the buffer member includes at least a part of the second member. The radiation imaging apparatus according to any one of claims 1 to 11,
A radiation imaging system comprising signal processing means for processing a signal obtained by the radiation imaging apparatus.

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