JP6594615B2 - 蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法 - Google Patents

蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法 Download PDF

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Publication number
JP6594615B2
JP6594615B2 JP2014205457A JP2014205457A JP6594615B2 JP 6594615 B2 JP6594615 B2 JP 6594615B2 JP 2014205457 A JP2014205457 A JP 2014205457A JP 2014205457 A JP2014205457 A JP 2014205457A JP 6594615 B2 JP6594615 B2 JP 6594615B2
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Japan
Prior art keywords
insulator
vapor deposition
mask
opening
deposition mask
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JP2014205457A
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Japanese (ja)
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JP2016074938A5 (https=
JP2016074938A (ja
Inventor
敏浩 佐藤
健 大河原
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Japan Display Inc
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Japan Display Inc
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Priority to JP2014205457A priority Critical patent/JP6594615B2/ja
Priority to PCT/JP2015/078237 priority patent/WO2016056515A1/ja
Priority to US15/512,107 priority patent/US10023950B2/en
Publication of JP2016074938A publication Critical patent/JP2016074938A/ja
Publication of JP2016074938A5 publication Critical patent/JP2016074938A5/ja
Priority to US16/010,549 priority patent/US10450646B2/en
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Publication of JP6594615B2 publication Critical patent/JP6594615B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • H10P50/695—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/04—Treatment of selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2042—Photolithographic processes using lasers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2014205457A 2014-10-06 2014-10-06 蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法 Active JP6594615B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014205457A JP6594615B2 (ja) 2014-10-06 2014-10-06 蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法
PCT/JP2015/078237 WO2016056515A1 (ja) 2014-10-06 2015-10-05 蒸着用マスク及び有機ｅｌ表示装置
US15/512,107 US10023950B2 (en) 2014-10-06 2015-10-05 Vapor deposition mask and organic el display device
US16/010,549 US10450646B2 (en) 2014-10-06 2018-06-18 Vapor deposition mask and organic EL display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014205457A JP6594615B2 (ja) 2014-10-06 2014-10-06 蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法

Publications (3)

Publication Number Publication Date
JP2016074938A JP2016074938A (ja) 2016-05-12
JP2016074938A5 JP2016074938A5 (https=) 2017-11-16
JP6594615B2 true JP6594615B2 (ja) 2019-10-23

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JP2014205457A Active JP6594615B2 (ja) 2014-10-06 2014-10-06 蒸着用マスク及びそれを用いた有機ｅｌ表示装置の製造方法、並びに、蒸着用マスクの製造方法

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US (2) US10023950B2 (https=)
JP (1) JP6594615B2 (https=)
WO (1) WO2016056515A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017056656A1 (ja) * 2015-09-30 2017-04-06 フォックスコン日本技研株式会社 微細パターンを有する樹脂フィルムの製造方法および有機ｅｌ表示装置の製造方法ならびに微細パターン形成用基材フィルムとサポート部材付き樹脂フィルム
CN108884555B (zh) * 2015-12-25 2021-02-09 鸿海精密工业股份有限公司 蒸镀掩模、蒸镀掩模的制造方法及有机半导体元件的制造方法
JP6430668B2 (ja) * 2016-02-10 2018-11-28 鴻海精密工業股▲ふん▼有限公司 蒸着マスクの製造方法、蒸着マスク、および有機半導体素子の製造方法
JP6949507B2 (ja) * 2016-08-05 2021-10-13 日鉄ケミカル＆マテリアル株式会社 蒸着マスク及びその製造方法並びに蒸着マスク用積層体及びその製造方法
FR3075180B1 (fr) * 2017-12-14 2020-01-03 Trixell Cassette radiologique numerique portable
WO2020194630A1 (ja) * 2019-03-27 2020-10-01 シャープ株式会社 表示装置及び蒸着マスク
US11239134B2 (en) * 2020-01-17 2022-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of fabricating the same
JP7589010B2 (ja) * 2020-10-28 2024-11-25 キヤノン株式会社 蒸着マスク、蒸着マスクを用いたデバイスの製造方法
CN112859507A (zh) * 2021-03-11 2021-05-28 深圳市华星光电半导体显示技术有限公司 光罩、显示面板
JP2024050251A (ja) * 2022-09-29 2024-04-10 大日本印刷株式会社 マスクの製造方法及びマスク
KR102753428B1 (ko) * 2024-07-03 2025-01-13 위폼스 주식회사 Oled cvd 마스크 아킹방지성을 높인 단계별 코팅을 통한 대면적 멀티(분할) 마스크 다중 코팅방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839003B2 (ja) * 1996-04-05 1998-12-16 日本電気株式会社 真空蒸着装置
JP3024641B1 (ja) * 1998-10-23 2000-03-21 日本電気株式会社 シャドウマスク及びその製造方法並びにシャドウマスクを用いた有機ｅｌディスプレイの製造方法
CN103797149B (zh) 2011-09-16 2017-05-24 株式会社V技术 蒸镀掩膜、蒸镀掩膜的制造方法及薄膜图案形成方法
JP5958804B2 (ja) 2012-03-30 2016-08-02 株式会社ブイ・テクノロジー 蒸着マスク、蒸着マスクの製造方法及び有機ｅｌ表示装置の製造方法
TWI526562B (zh) * 2012-01-12 2016-03-21 Dainippon Printing Co Ltd A manufacturing method of a vapor deposition mask, and a method of manufacturing an organic semiconductor device
JP2013245392A (ja) 2012-05-29 2013-12-09 V Technology Co Ltd 蒸着マスク及び蒸着マスクの製造方法
JP2014067500A (ja) * 2012-09-24 2014-04-17 Dainippon Printing Co Ltd 蒸着マスク用材料の製造方法、蒸着マスクの製造方法

Also Published As

Publication number Publication date
US20180298482A1 (en) 2018-10-18
JP2016074938A (ja) 2016-05-12
US10023950B2 (en) 2018-07-17
US20170275749A1 (en) 2017-09-28
US10450646B2 (en) 2019-10-22
WO2016056515A1 (ja) 2016-04-14

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