JP6555485B2 - Polymerizable resin composition containing reactive silicone compound - Google Patents
Polymerizable resin composition containing reactive silicone compound Download PDFInfo
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- JP6555485B2 JP6555485B2 JP2016513840A JP2016513840A JP6555485B2 JP 6555485 B2 JP6555485 B2 JP 6555485B2 JP 2016513840 A JP2016513840 A JP 2016513840A JP 2016513840 A JP2016513840 A JP 2016513840A JP 6555485 B2 JP6555485 B2 JP 6555485B2
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- 150000001875 compounds Chemical class 0.000 title claims description 114
- 229920001296 polysiloxane Polymers 0.000 title claims description 39
- 239000011342 resin composition Substances 0.000 title description 2
- -1 diaryl silicate Chemical compound 0.000 claims description 203
- 239000000203 mixture Substances 0.000 claims description 78
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 63
- 125000004432 carbon atom Chemical group C* 0.000 claims description 57
- 125000000217 alkyl group Chemical group 0.000 claims description 42
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 32
- 229920000642 polymer Polymers 0.000 claims description 28
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 24
- 229940126062 Compound A Drugs 0.000 claims description 21
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims description 21
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 17
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 17
- 238000006068 polycondensation reaction Methods 0.000 claims description 17
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000178 monomer Substances 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 claims description 13
- 229930185605 Bisphenol Natural products 0.000 claims description 12
- 125000006267 biphenyl group Chemical group 0.000 claims description 12
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 claims description 12
- 125000001624 naphthyl group Chemical group 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 239000004611 light stabiliser Substances 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 150000003464 sulfur compounds Chemical class 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 4
- 125000001207 fluorophenyl group Chemical group 0.000 claims description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 4
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims 1
- 239000000047 product Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- 239000003505 polymerization initiator Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 11
- 238000005227 gel permeation chromatography Methods 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000004793 Polystyrene Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 238000004383 yellowing Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 229920002223 polystyrene Polymers 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 238000012719 thermal polymerization Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- IDJPKRIELSFBPE-UHFFFAOYSA-N 1-(decyldisulfanyl)decane Chemical compound CCCCCCCCCCSSCCCCCCCCCC IDJPKRIELSFBPE-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 229940117969 neopentyl glycol Drugs 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- YSQZSPCQDXHJDJ-UHFFFAOYSA-N 1-(pentyldisulfanyl)pentane Chemical compound CCCCCSSCCCCC YSQZSPCQDXHJDJ-UHFFFAOYSA-N 0.000 description 2
- DLKQHBOKULLWDQ-UHFFFAOYSA-N 1-bromonaphthalene Chemical compound C1=CC=C2C(Br)=CC=CC2=C1 DLKQHBOKULLWDQ-UHFFFAOYSA-N 0.000 description 2
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 2
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- ZHBOFZNNPZNWGB-UHFFFAOYSA-N 9,10-bis(phenylethynyl)anthracene Chemical compound C1=CC=CC=C1C#CC(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C#CC1=CC=CC=C1 ZHBOFZNNPZNWGB-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- CETBSQOFQKLHHZ-UHFFFAOYSA-N Diethyl disulfide Chemical compound CCSSCC CETBSQOFQKLHHZ-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- HAXFWIACAGNFHA-UHFFFAOYSA-N aldrithiol Chemical compound C=1C=CC=NC=1SSC1=CC=CC=N1 HAXFWIACAGNFHA-UHFFFAOYSA-N 0.000 description 2
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 2
- 229910001863 barium hydroxide Inorganic materials 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GVPWHKZIJBODOX-UHFFFAOYSA-N dibenzyl disulfide Chemical compound C=1C=CC=CC=1CSSCC1=CC=CC=C1 GVPWHKZIJBODOX-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
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- 239000006185 dispersion Substances 0.000 description 2
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- 150000002019 disulfides Chemical class 0.000 description 2
- AUZONCFQVSMFAP-UHFFFAOYSA-N disulfiram Chemical compound CCN(CC)C(=S)SSC(=S)N(CC)CC AUZONCFQVSMFAP-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 2
- 150000004673 fluoride salts Chemical class 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZLDHYRXZZNDOKU-UHFFFAOYSA-N n,n-diethyl-3-trimethoxysilylpropan-1-amine Chemical compound CCN(CC)CCC[Si](OC)(OC)OC ZLDHYRXZZNDOKU-UHFFFAOYSA-N 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
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- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
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- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
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Description
本発明は、反応性シリコーン化合物を含む重合性樹脂組成物に関し、詳細には、優れた光学特性(高屈折率、低アッベ数)、高い耐熱性(耐熱黄変性、クラック耐性)を有する硬化物を形成することができる、重合性組成物に関する。 The present invention relates to a polymerizable resin composition containing a reactive silicone compound, and in particular, a cured product having excellent optical properties (high refractive index, low Abbe number) and high heat resistance (heat yellowing resistance, crack resistance). It is related with polymerizable composition which can form.
プラスチックレンズは、携帯電話カメラ、デジタルカメラ、車載カメラ用などに用いられており、その機器の目的に応じた、優れた光学特性を有するものであることが求められる。また、使用態様に合わせて、高い耐久性、例えば耐熱性、耐候性等と、歩留まり良く成形できる高い生産性とが求められている。 Plastic lenses are used for mobile phone cameras, digital cameras, vehicle-mounted cameras, and the like, and are required to have excellent optical characteristics according to the purpose of the device. Moreover, high durability, for example, heat resistance, weather resistance, and the like, and high productivity that can be molded with a high yield are required in accordance with the usage mode.
近年、実装コスト低減の目的で、カメラモジュールをはんだリフローにて一括実装する方法が提案されており、それに用いるプラスチックレンズ材料としては、はんだリフロー工程での高温熱履歴(例えば260℃)に耐え得るものが求められている。しかしながら、従来のプラスチックレンズでは耐熱性が低く、リフロープロセスに満足に適応することは困難となっていた。 In recent years, for the purpose of reducing the mounting cost, a method of mounting camera modules in a batch by solder reflow has been proposed, and the plastic lens material used therefor can withstand a high temperature thermal history (eg, 260 ° C.) in the solder reflow process. Things are sought. However, conventional plastic lenses have low heat resistance, and it has been difficult to satisfactorily adapt to the reflow process.
特に、高解像度カメラモジュールには複数枚のレンズが用いられるが、この中の一枚の波長補正レンズとして、高屈折率かつ低アッベ数を有する光学材料が必要とされている。しかし、高屈折率かつ低アッベ数を特長として提案されている従来材料は、特許文献1に示されているとおり、耐熱性を改良しても200℃以下のものが殆どである。
In particular, a plurality of lenses are used in a high-resolution camera module, and an optical material having a high refractive index and a low Abbe number is required as one wavelength correction lens. However, as shown in
また、樹脂レンズの製造にあたり、歩留まりや生産効率向上のために熱可塑性樹脂の射出成形から、室温で液状の硬化性樹脂を使った押し付け成形に移行しつつある。特に押し付け成形では、レンズをウェハー状に多数に敷き詰めて多数個取りすることが可能であり、その有用性は非常に高い。その一方式であるキャスティングレンズ成形は、高価な光学ガラスを用いず硬化性樹脂のみでレンズ成形を行うため、安価、高生産効率といった押し付け成形の長所を最大限に発揮できる方式といえる。また、このガラス支持体を用いず硬化性樹脂のみで成形したレンズは、モノリシックレンズと呼ばれ、レンズの薄肉化が可能となるため近年着目されている。 Further, in the production of resin lenses, in order to improve yield and production efficiency, there is a shift from injection molding of thermoplastic resin to pressing molding using a liquid curable resin at room temperature. In particular, in press molding, it is possible to spread a large number of lenses in a wafer shape and take a large number of them, which is very useful. Casting lens molding, which is one of the methods, can be said to be a method that can maximize the advantages of pressing molding such as low cost and high production efficiency because lens molding is performed using only a curable resin without using expensive optical glass. In addition, a lens molded using only a curable resin without using the glass support is called a monolithic lens, and has recently been attracting attention because the lens can be thinned.
しかしながら、高解像度カメラモジュール用レンズとして用いられる上述のモノリシックレンズは800μm程度の厚さを有するものであるが、特許文献1に示されるような従来知られているレンズ材料は、200℃以上の温度に耐える耐熱性を保証するには至っておらず、はんだリフロー工程での高温熱履歴(例えば260℃)でクラックが発生してしまう虞がある。
このように、モノリシックレンズ、殊に高解像度カメラモジュール用レンズとして使用し得る光学特性(高屈折率、低アッベ数)、並びにはんだリフロー等の実装プロセスに適合する耐熱性(耐熱黄変性、クラック耐性)を満足する硬化性樹脂材料は未だなく、その開発が望まれていた。However, although the above-described monolithic lens used as a lens for a high-resolution camera module has a thickness of about 800 μm, a conventionally known lens material as shown in
In this way, optical characteristics (high refractive index, low Abbe number) that can be used as monolithic lenses, especially lenses for high-resolution camera modules, and heat resistance (heat yellowing resistance, crack resistance) suitable for mounting processes such as solder reflow No curable resin material satisfying (1) has yet been developed.
本発明は、このような事情に鑑みてなされたものであり、硬化物が高い屈折率と低いアッベ数を維持し、さらに高温熱履歴によって生じる変色(熱黄変)及びクラックを抑制することができる成形物を作るのに好適な重合性組成物を提供することを課題とする。 The present invention has been made in view of such circumstances, and the cured product maintains a high refractive index and a low Abbe number, and further suppresses discoloration (thermal yellowing) and cracks caused by high-temperature thermal history. It is an object of the present invention to provide a polymerizable composition suitable for making a molded product.
本発明者らは、上記の課題を解決すべく鋭意検討を行った結果、ジアリールケイ酸化合物及びアルコキシケイ素化合物等の重縮合により得られる反応性シリコーン化合物と、フルオレン構造、ビスフェノール構造等の特定の(メタ)アクリレート化合物と、フェニルエチレン、ナフチルエチレン、又はビフェニルエチレン構造を単位構造として有する特定のポリマーとを含む組成物を構成することにより、その硬化物(光学レンズ)が、高い屈折率と低アッベ数を維持し、さらに高温熱履歴によって生じる熱黄変性及びクラックを有効に抑制することができることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that reactive silicone compounds obtained by polycondensation such as diaryl silicic acid compounds and alkoxy silicon compounds, and specific fluorene structures, bisphenol structures, etc. By forming a composition containing a (meth) acrylate compound and a specific polymer having a phenylethylene, naphthylethylene, or biphenylethylene structure as a unit structure, the cured product (optical lens) has a high refractive index and a low refractive index. The inventors have found that the Abbe number can be maintained and that thermal yellowing and cracks caused by high-temperature heat history can be effectively suppressed, and the present invention has been completed.
すなわち本発明は、第一観点として、(a)式[1]で表されるジアリールケイ酸化合物Aと、式[2]で表されるアルコキシケイ素化合物Bとを少なくとも含む重縮合性化合物を、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、
(b)(メタ)アクリレート化合物1〜200質量部、及び
(c)5,000〜100,000の重量平均分子量を有するポリマー0.1〜50質量部
を含む重合性組成物に関する。
第2観点として、前記(c)ポリマーが、少なくとも式[3]で表されるモノマー単位を有するポリマーである、第1観点に記載の重合性組成物に関する。
第3観点として、前記(c)ポリマーが、さらに式[4]で表されるモノマー単位を有するポリマーである、第2観点に記載の重合性組成物に関する。
第4観点として、前記(c)ポリマーがポリ(スチレン−co−(メタ)アクリル酸メチル)である、第3観点に記載の重合性組成物に関する。
第5観点として、前記(b)(メタ)アクリレート化合物が、式[5]で表されるフルオレン化合物D、及び式[6]で表されるビスフェノール化合物Eからなる群から選ばれる少なくとも一種である、第1観点乃至第4観点のうち何れか一つに記載の重合性組成物に関する。
第6観点として、前記(b)(メタ)アクリレート化合物として、前記フルオレン化合物D及び前記ビスフェノール化合物Eの二種を少なくとも含む、第5観点に記載の重合性組成物に関する。
第7観点として、さらに(d)式[7]で表される基を有する化合物である光安定剤F、及び式[8]で表される基を有する化合物である酸化防止剤Gからなる群から選ばれる少なくとも一種の安定化剤0.01〜5質量部を含む、第1観点乃至第6観点のうち何れか一つに記載の重合性組成物に関する。
第8観点として、さらに(e)チオール化合物H及びジスルフィド化合物Iからなる群から選ばれる少なくとも一種の硫黄化合物0.01〜5質量部を含む、第1観点乃至第7観点のうち何れか一つに記載の重合性組成物に関する。
第9観点として、前記(a)反応性シリコーン化合物が、式[1]で表されるジアリールケイ酸化合物Aと、式[2]で表されるアルコキシケイ素化合物Bと、さらに式[9]で表されるアルコキシケイ素化合物Cとを少なくとも含む重縮合性化合物を、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物である、第1観点乃至第8観点のうち何れか一つに記載の重合性組成物に関する。
第10観点として、第1観点乃至第9観点のうち何れか一つに記載の重合性組成物を重合して得られる、硬化物に関する。
第11観点として、第1観点乃至第9観点のうち何れか一つに記載の重合性組成物を重合して得られる、光学レンズに関する。
第12観点として、第1観点乃至第9観点のうち何れか一つに記載の重合性組成物からなる高屈折率樹脂レンズ用材料に関する。That is, as a first aspect, the present invention provides (a) a polycondensable compound containing at least a diaryl silicate compound A represented by the formula [1] and an alkoxysilicon compound B represented by the formula [2]. 100 parts by mass of a reactive silicone compound obtained by polycondensation in the presence of an acid or a base,
The present invention relates to a polymerizable composition comprising (b) 1 to 200 parts by mass of a (meth) acrylate compound and (c) 0.1 to 50 parts by mass of a polymer having a weight average molecular weight of 5,000 to 100,000.
As a second aspect, the present invention relates to the polymerizable composition according to the first aspect, in which the polymer (c) is a polymer having at least a monomer unit represented by the formula [3].
As a third aspect, the present invention relates to the polymerizable composition according to the second aspect, in which the polymer (c) is a polymer further having a monomer unit represented by the formula [4].
As a fourth aspect, the present invention relates to the polymerizable composition according to the third aspect, in which the polymer (c) is poly (styrene-co- (methyl) acrylate).
As a fifth aspect, the (b) (meth) acrylate compound is at least one selected from the group consisting of a fluorene compound D represented by the formula [5] and a bisphenol compound E represented by the formula [6]. Further, the present invention relates to the polymerizable composition according to any one of the first aspect to the fourth aspect.
As a sixth aspect, the present invention relates to the polymerizable composition according to the fifth aspect, which includes at least two of the fluorene compound D and the bisphenol compound E as the (b) (meth) acrylate compound.
As a seventh aspect, the group consisting of (d) a light stabilizer F that is a compound having a group represented by formula [7] and an antioxidant G that is a compound having a group represented by formula [8]. The polymerizable composition according to any one of the first to sixth aspects, comprising 0.01 to 5 parts by mass of at least one stabilizer selected from:
As an eighth aspect, any one of the first aspect to the seventh aspect further includes 0.01 to 5 parts by mass of at least one sulfur compound selected from the group consisting of (e) a thiol compound H and a disulfide compound I. The polymerizable composition as described in 1. above.
As a ninth aspect, the (a) reactive silicone compound includes a diaryl silicic acid compound A represented by the formula [1], an alkoxysilicon compound B represented by the formula [2], and a formula [9]. Any one of the first to eighth aspects, which is a reactive silicone compound obtained by polycondensation of a polycondensable compound containing at least an alkoxysilicon compound C represented in the presence of an acid or a base. It relates to the polymerizable composition described.
As a tenth aspect, the present invention relates to a cured product obtained by polymerizing the polymerizable composition according to any one of the first to ninth aspects.
As an 11th viewpoint, it is related with the optical lens obtained by superposing | polymerizing the polymeric composition as described in any one among a 1st viewpoint thru | or a 9th viewpoint.
As a 12th viewpoint, it is related with the material for high refractive index resin lenses which consists of a polymeric composition as described in any one among a 1st viewpoint thru | or a 9th viewpoint.
本発明の重合性組成物は、その硬化物が、光学デバイス、例えば高解像度カメラモジュール用のレンズとして望ましい光学特性(高屈折率、低アッベ数)を有するだけでなく、高解像度カメラモジュールの実装プロセスに適し得る耐熱性(耐黄変性、クラック耐性)をも有する。特にキャスティングレンズ成形工程により得られる膜厚のモノリシックレンズであっても光学特性を有し、且つ、高解像度カメラモジュールの実装プロセスに適する耐熱性を有する。
したがって、上記重合性組成物からなる本発明の高屈折率樹脂レンズ用材料は、高解像用モジュール用のレンズとして好適に使用することができる。The polymerizable composition of the present invention has not only the cured product having desirable optical characteristics (high refractive index, low Abbe number) as an optical device, for example, a lens for a high-resolution camera module, but also a high-resolution camera module. It also has heat resistance (yellowing resistance, crack resistance) that can be suitable for the process. In particular, even a monolithic lens having a film thickness obtained by a casting lens molding process has optical characteristics and heat resistance suitable for a mounting process of a high-resolution camera module.
Therefore, the high refractive index resin lens material of the present invention comprising the polymerizable composition can be suitably used as a lens for a high resolution module.
<<重合性組成物>>
本発明は、(a)上記式[1]で表されるジアリールケイ酸化合物Aと、上記式[2]で表されるアルコキシケイ素化合物Bとを少なくとも含む重縮合性化合物を、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物100質量部、(b)(メタ)アクリレート化合物1〜200質量部、及び(c)5,000〜100,000の重量平均分子量を有するポリマー0.1〜50質量部を含む重合性組成物に関する。<< Polymerizable composition >>
The present invention provides (a) a polycondensable compound containing at least a diaryl silicic acid compound A represented by the above formula [1] and an alkoxysilicon compound B represented by the above formula [2]. 100 parts by weight of a reactive silicone compound obtained by polycondensation in the presence, 1 to 200 parts by weight of (b) (meth) acrylate compound, and (c) a polymer having a weight average molecular weight of 5,000 to 100,000. The present invention relates to a polymerizable composition containing 1 to 50 parts by mass.
<(a)反応性シリコーン化合物>
本発明に用いられる(a)反応性シリコーン化合物は、特定構造のジアリールケイ酸化合物Aと、特定構造のアルコキシケイ素化合物Bとを少なくとも含む重縮合性化合物を、酸又は塩基の存在下重縮合して得られる化合物である。
以下、各成分の詳細を説明する。<(A) Reactive silicone compound>
The reactive silicone compound (a) used in the present invention is obtained by polycondensing a polycondensable compound containing at least a diaryl silicate compound A having a specific structure and an alkoxysilicon compound B having a specific structure in the presence of an acid or a base. It is a compound obtained.
Hereinafter, details of each component will be described.
[重縮合性化合物]
[ジアリールケイ酸化合物A]
前記ジアリールケイ酸化合物Aは、下記式[1]で表される化合物である。
[Diaryl Silicic Acid Compound A]
The diaryl silicate compound A is a compound represented by the following formula [1].
Ar1及びAr2が表す炭素原子数1乃至6のアルキル基で置換されていてもよいフェニル基としては、例えば、フェニル基、o−トリル基、m−トリル基、p−トリル基、4−エチルフェニル基、4−イソプロピルフェニル基、4−tert−ブチルフェニル基、3,5−ジメチルフェニル基、3,5−ジエチルフェニル基、3,5−ジイソプロピルフェニル基、2,4,6−トリメチルフェニル基等が挙げられる。
Ar1及びAr2が表す炭素原子数1乃至6のアルキル基で置換されていてもよいナフチル基としては、例えば、1−ナフチル基、2−ナフチル基、4−メチルナフタレン−1−イル基、6−メチルナフタレン−2−イル基等が挙げられる。
Ar1及びAr2が表す炭素原子数1乃至6のアルキル基で置換されていてもよいビフェニル基としては、例えば、[1,1’−ビフェニル]−2−イル基、[1,1’−ビフェニル]−3−イル基、[1,1’−ビフェニル]−4−イル基、が挙げられる。Examples of the phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms represented by Ar 1 and Ar 2 include a phenyl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, 4- Ethylphenyl group, 4-isopropylphenyl group, 4-tert-butylphenyl group, 3,5-dimethylphenyl group, 3,5-diethylphenyl group, 3,5-diisopropylphenyl group, 2,4,6-trimethylphenyl Groups and the like.
Examples of the naphthyl group optionally substituted with an alkyl group having 1 to 6 carbon atoms represented by Ar 1 and Ar 2 include a 1-naphthyl group, a 2-naphthyl group, a 4-methylnaphthalen-1-yl group, Examples include 6-methylnaphthalen-2-yl group.
Examples of the biphenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms represented by Ar 1 and Ar 2 include [1,1′-biphenyl] -2-yl group, [1,1′- Biphenyl] -3-yl group and [1,1′-biphenyl] -4-yl group.
上記式[1]で表される化合物の具体例としては、ジフェニルシランジオール、ジ−p−トリルシランジオール、ビス(4−エチルフェニル)シランジオール、ビス(4−イソプロピルフェニル)シランジオール、ジナフチルシランジオール、ビス([1,1’−ビフェニル]−4−イル)シランジオール等が挙げられるが、これらに限定されるものではない。 Specific examples of the compound represented by the above formula [1] include diphenylsilanediol, di-p-tolylsilanediol, bis (4-ethylphenyl) silanediol, bis (4-isopropylphenyl) silanediol, dinaphthyl. Silane diol, bis ([1,1′-biphenyl] -4-yl) silane diol, and the like are exemplified, but the silane diol is not limited thereto.
[アルコキシケイ素化合物B]
前記アルコキシケイ素化合物Bは、下記式[2]で表される化合物である。
The alkoxysilicon compound B is a compound represented by the following formula [2].
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するフェニル基としては、例えば、2−ビニルフェニル基、3−ビニルフェニル基、4−ビニルフェニル基、4−ビニルオキシフェニル基、4−アリルフェニル基、4−アリルオキシフェニル基、4−イソプロペニルフェニル基等が挙げられる。
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するナフチル基としては、例えば、4−ビニルナフタレン−1−イル基、5−ビニルナフタレン−1−イル基、6−ビニルナフタレン−2−イル基、4−アリルナフタレン−1−イル基、4−アリルオキシナフタレン−1−イル基、5−アリルオキシナフタレン−1−イル基、8−アリルオキシナフタレン−1−イル基、5−ビニルオキシナフタレン−1−イル基、5−アリルナフタレン−1−イル基、5−イソプロペニルナフタレン−1−イル基、6−ビニルナフタレン−2−イル基、6−アリルナフタレン−2−イル基等が挙げられる。
Ar3が表す重合性二重結合を有する基を少なくとも1つ有するビフェニル基としては、例えば、4’−ビニル−[1,1’−ビフェニル]−2−イル基、4’−ビニル−[1,1’−ビフェニル]−3−イル基、4’−ビニル−[1,1’−ビフェニル]−4−イル基、4’−ビニルオキシ−[1,1’−ビフェニル]−4−イル基、4’−アリル−[1,1’−ビフェニル]−4−イル基、4’−アリルオキシ−[1,1’−ビフェニル]−4−イル基、4’−イソプロペニル−[1,1’−ビフェニル]−4−イル基等が挙げられる。Examples of the phenyl group having at least one group having a polymerizable double bond represented by Ar 3 include 2-vinylphenyl group, 3-vinylphenyl group, 4-vinylphenyl group, 4-vinyloxyphenyl group, 4 -An allylphenyl group, 4-allyloxyphenyl group, 4-isopropenylphenyl group, etc. are mentioned.
Examples of the naphthyl group having at least one group having a polymerizable double bond represented by Ar 3 include 4-vinylnaphthalen-1-yl group, 5-vinylnaphthalen-1-yl group, and 6-vinylnaphthalene-2. -Yl group, 4-allylnaphthalen-1-yl group, 4-allyloxynaphthalen-1-yl group, 5-allyloxynaphthalen-1-yl group, 8-allyloxynaphthalen-1-yl group, 5-vinyl Oxynaphthalen-1-yl group, 5-allylnaphthalen-1-yl group, 5-isopropenylnaphthalen-1-yl group, 6-vinylnaphthalen-2-yl group, 6-allylnaphthalen-2-yl group, etc. Can be mentioned.
As a biphenyl group having at least one group having a polymerizable double bond represented by Ar 3 , for example, a 4′-vinyl- [1,1′-biphenyl] -2-yl group, 4′-vinyl- [1 , 1′-biphenyl] -3-yl group, 4′-vinyl- [1,1′-biphenyl] -4-yl group, 4′-vinyloxy- [1,1′-biphenyl] -4-yl group, 4'-allyl- [1,1'-biphenyl] -4-yl group, 4'-allyloxy- [1,1'-biphenyl] -4-yl group, 4'-isopropenyl- [1,1'- And biphenyl] -4-yl group.
上記式[2]で表される化合物の具体例としては、例えば、トリメトキシ(4−ビニルフェニル)シラン、トリエトキシ(4−ビニルフェニル)シラン、(4−イソプロペニルフェニル)トリメトキシシラン、ジメトキシ(メチル)(4−ビニルフェニル)シラン、ジメトキシビス(4−ビニルフェニル)シラン、トリメトキシ(4−ビニル−1−ナフチル)シラン、トリメトキシ(5−ビニル−1−ナフチル)シラン、トリメトキシ(6−ビニル−2−ナフチル)シラン、トリメトキシ(4’−ビニル−[1,1’−ビフェニル]−4−イル)シラン等が挙げられるが、これらに限定されるものではない。 Specific examples of the compound represented by the formula [2] include, for example, trimethoxy (4-vinylphenyl) silane, triethoxy (4-vinylphenyl) silane, (4-isopropenylphenyl) trimethoxysilane, and dimethoxy (methyl). ) (4-vinylphenyl) silane, dimethoxybis (4-vinylphenyl) silane, trimethoxy (4-vinyl-1-naphthyl) silane, trimethoxy (5-vinyl-1-naphthyl) silane, trimethoxy (6-vinyl-2) -Naphtyl) silane, trimethoxy (4'-vinyl- [1,1'-biphenyl] -4-yl) silane, and the like, but are not limited thereto.
[アルコキシケイ素化合物C]
本発明で使用する(a)反応性シリコーン化合物に用いる重縮合性化合物は、前述のジアリールケイ酸化合物A及びアルコキシケイ素化合物Bに加えて、特定構造のアルコキシケイ素化合物Cが含まれていてもよい。[Alkoxysilicon compound C]
The polycondensable compound used in the reactive silicone compound (a) used in the present invention may contain an alkoxysilicon compound C having a specific structure in addition to the aforementioned diaryl silicate compound A and alkoxysilicon compound B. .
前記アルコキシケイ素化合物Cは、下記式[9]で表される化合物である。
中でも、Rfが式[10]で表される基であることが好ましい。
Especially, it is preferable that Rf is group represented by Formula [10].
Rfが表す炭素原子数1乃至12のフルオロアルキル基としては、トリフルオロメチル基、ペンタフルオロエチル基、ヘプタフルオロプロピル基、パーフルオロブチル基、パーフルオロペンチル基、パーフルオロヘキシル基、2,2,2−トリフルオロエチル基、2,2,3,3,3−ペンタフルオロプロピル基、3,3,3−トリフルオロプロピル基、2−(パーフルオロブチル)エチル基、2−(パーフルオロヘキシル)エチル基、2−(パーフルオロオクチル)エチル基、2−(パーフルオロデシル)エチル基、2−(パーフルオロ−3−メチルブチル)エチル基、2−(パーフルオロ−5−メチルヘキシル)エチル基、2−(パーフルオロ−7−メチルオクチル)エチル基、1H,1H,3H−テトラフルオロプロピル基、1H,1H,4H−ヘキサフルオロブチル基、1H,1H,5H−オクタフルオロペンチル基、1H,1H,7H−ドデカフルオロヘプチル基、1H,1H,9H−ヘキサデカフルオロノニル基、1H−1−(トリフルオロメチル)トリフルオロエチル基等が挙げられる。 Examples of the fluoroalkyl group having 1 to 12 carbon atoms represented by Rf include a trifluoromethyl group, a pentafluoroethyl group, a heptafluoropropyl group, a perfluorobutyl group, a perfluoropentyl group, a perfluorohexyl group, 2, 2, 2-trifluoroethyl group, 2,2,3,3,3-pentafluoropropyl group, 3,3,3-trifluoropropyl group, 2- (perfluorobutyl) ethyl group, 2- (perfluorohexyl) Ethyl group, 2- (perfluorooctyl) ethyl group, 2- (perfluorodecyl) ethyl group, 2- (perfluoro-3-methylbutyl) ethyl group, 2- (perfluoro-5-methylhexyl) ethyl group, 2- (perfluoro-7-methyloctyl) ethyl group, 1H, 1H, 3H-tetrafluoropropyl group, 1H, 1 , 4H-hexafluorobutyl group, 1H, 1H, 5H-octafluoropentyl group, 1H, 1H, 7H-dodecafluoroheptyl group, 1H, 1H, 9H-hexadecafluorononyl group, 1H-1- (trifluoromethyl ) Trifluoroethyl group and the like.
Rfが表すフルオロフェニル基としては、2−フルオロフェニル基、3−フルオロフェニル基、4−フルオロフェニル基、2,4,6−トリフルオロフェニル基、パーフルオロフェニル基等が挙げられる。 Examples of the fluorophenyl group represented by Rf include 2-fluorophenyl group, 3-fluorophenyl group, 4-fluorophenyl group, 2,4,6-trifluorophenyl group, perfluorophenyl group and the like.
上記式[9]で表される化合物の具体例としては、例えば、トリメトキシ(トリフルオロメチル)シラン、トリメトキシ(3,3,3−トリフルオロプロピル)シラン、トリエトキシ(3,3,3−トリフルオロプロピル)シラン、ジメトキシ(メチル)(3,3,3−トリフルオロプロピル)シラン、ジメトキシ(3,3,3−トリフルオロプロピル)(4−ビニルフェニル)シラン等が挙げられるが、これらに限定されるものではない。 Specific examples of the compound represented by the above formula [9] include, for example, trimethoxy (trifluoromethyl) silane, trimethoxy (3,3,3-trifluoropropyl) silane, triethoxy (3,3,3-trifluoro). Propyl) silane, dimethoxy (methyl) (3,3,3-trifluoropropyl) silane, dimethoxy (3,3,3-trifluoropropyl) (4-vinylphenyl) silane, and the like. It is not something.
[その他の重縮合性化合物]
本発明で使用する(a)反応性シリコーン化合物に用いる重縮合性化合物は、前述のジアリールケイ酸化合物A、アルコキシケイ素化合物B及びアルコキシケイ素化合物C以外の、その他の重縮合性化合物が含まれていてもよい。
その他の重縮合性化合物としては、上記化合物A乃至化合物C以外の加水分解性シラン化合物など、これら化合物と重縮合可能な化合物であれば特に限定されない。
その他の重縮合性化合物としては、例えば、テトラメトキシシラン、テトラエトキシシラン、トリメトキシ(メチル)シラン、トリメトキシ(ビニル)シラン、3−(メタ)アクリロイルオキシプロピル(トリメトキシ)シラン、トリメトキシ(フェニル)シラン、トリメトキシ(1−ナフチル)シラン、ジメトキシ(ジメチル)シラン、ジメトキシ(ジフェニル)シラン、ジメトキシ(メチル)(ビニル)シラン、3−(メタ)アクリロイルオキシプロピル(ジメトキシ)(メチル)シラン、ジメトキシ(メチル)(フェニル)シラン等が挙げられる。[Other polycondensable compounds]
The polycondensable compound used in the reactive silicone compound (a) used in the present invention includes other polycondensable compounds other than the aforementioned diaryl silicic acid compound A, alkoxysilicon compound B and alkoxysilicon compound C. May be.
Other polycondensable compounds are not particularly limited as long as they are compounds capable of polycondensation with these compounds, such as hydrolyzable silane compounds other than the above-mentioned compounds A to C.
Other polycondensable compounds include, for example, tetramethoxysilane, tetraethoxysilane, trimethoxy (methyl) silane, trimethoxy (vinyl) silane, 3- (meth) acryloyloxypropyl (trimethoxy) silane, trimethoxy (phenyl) silane, Trimethoxy (1-naphthyl) silane, dimethoxy (dimethyl) silane, dimethoxy (diphenyl) silane, dimethoxy (methyl) (vinyl) silane, 3- (meth) acryloyloxypropyl (dimethoxy) (methyl) silane, dimethoxy (methyl) ( Phenyl) silane and the like.
[反応性シリコーン化合物の好適例]
上記(a)反応性シリコーン化合物としては、ジアリールケイ酸化合物Aとしてジフェニルシランジオールと、アルコキシケイ素化合物Bとして下記式[2a]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物が好ましい。また、ジアリールケイ酸化合物Aとしてジフェニルシランジオールと、アルコキシケイ素化合物Bとして下記式[2a]で表される化合物と、アルコキシケイ素化合物Cとして下記式[9a]で表される化合物とを、酸又は塩基の存在下重縮合して得られる反応性シリコーン化合物が好ましい。
As the reactive silicone compound (a), diphenylsilane diol as diaryl silicic acid compound A and a compound represented by the following formula [2a] as alkoxy silicon compound B are polycondensed in the presence of an acid or a base. The resulting reactive silicone compound is preferred. In addition, diphenylsilanediol as the diaryl silicate compound A, a compound represented by the following formula [2a] as the alkoxysilicon compound B, and a compound represented by the following formula [9a] as the alkoxysilicon compound C A reactive silicone compound obtained by polycondensation in the presence of a base is preferred.
[ジアリールケイ酸化合物Aとアルコキシケイ素化合物Bの配合割合]
上述の反応性シリコーン化合物に用いる式[1]で表されるジアリールケイ酸化合物Aと、式[2]で表されるアルコキシケイ素化合物Bの重縮合反応にかかる配合モル比は特に限定されないが、ブロックコポリマー化を防ぐ目的から、通常、ジアリールケイ酸化合物A:アルコキシケイ素化合物B=2:1〜1:2の範囲が好ましい。より好ましくは1.1:0.9〜0.9:1.1の間で配合される範囲である。
なお、重縮合性化合物として上記化合物A及び化合物Bに加えて、式[9]で表されるアルコキシケイ素化合物Cを含む場合、その配合モル比は特に限定されないが、上記目的から、通常、ジアリールケイ酸化合物A:アルコキシケイ素化合物B及びC=2:1〜1:2の範囲が好ましい。より好ましくは1.1:0.9〜0.9:1.1の間で配合される範囲である。また、通常、アルコキシケイ素化合物B:アルコキシケイ素化合物C=99.9:0.1〜90:10の範囲が好ましい。
さらに、重縮合性化合物として上記化合物A乃至化合物C以外の、その他の重縮合性化合物を含む場合、その配合割合は特に限定されないが、通常、アルコキシケイ素化合物Bに対して50モル%以下が好ましい。[Blending ratio of diaryl silicate compound A and alkoxy silicon compound B]
Although the compounding molar ratio concerning the polycondensation reaction of the diaryl silicic acid compound A represented by the formula [1] and the alkoxysilicon compound B represented by the formula [2] used for the reactive silicone compound is not particularly limited, In order to prevent block copolymerization, the range of diaryl silicic acid compound A: alkoxy silicon compound B = 2: 1 to 1: 2 is usually preferable. More preferably, it is the range mix | blended between 1.1: 0.9-0.9: 1.1.
When the polycondensable compound includes the alkoxysilicon compound C represented by the formula [9] in addition to the compound A and the compound B, the molar ratio of the compound is not particularly limited. The range of silicic acid compound A: alkoxysilicon compound B and C = 2: 1 to 1: 2 is preferred. More preferably, it is the range mix | blended between 1.1: 0.9-0.9: 1.1. Usually, the range of alkoxysilicon compound B: alkoxysilicon compound C = 99.9: 0.1 to 90:10 is preferred.
Further, when the polycondensable compound includes other polycondensable compounds other than the above compounds A to C, the blending ratio is not particularly limited, but is usually preferably 50 mol% or less with respect to the alkoxysilicon compound B. .
上述のジアリールケイ酸化合物A、アルコキシケイ素化合物B及びアルコキシケイ素化合物Cは、必要に応じて適宜化合物を選択して用いることができ、また、複数種を併用することもできる。この場合のモル比も、ジアリールケイ酸化合物A、アルコキシケイ素化合物B及びアルコキシケイ素化合物Cそれぞれの総計の比が上記の範囲となる。 The above-mentioned diaryl silicic acid compound A, alkoxy silicon compound B and alkoxy silicon compound C can be used by appropriately selecting compounds as necessary, and a plurality of types can be used in combination. In this case, the molar ratio of the diaryl silicate compound A, the alkoxy silicon compound B, and the alkoxy silicon compound C is in the above range.
[酸又は塩基性触媒]
式[1]で表されるジアリールケイ酸化合物Aと、式[2]で表されるアルコキシケイ素化合物B(及び所望により、式[9]で表されるアルコキシケイ素化合物C及び/又はその他の重縮合性化合物)との重縮合反応は、酸又は塩基性触媒の存在下で好適に実施される。
重縮合反応に用いる触媒は、後述の溶媒に溶解する、又は均一分散する限りにおいては特にその種類は限定されず、必要に応じて適宜選択して用いることができる。
用いることのできる触媒としては、例えば、酸性化合物として、B(OR)3、Al(OR)3、Ti(OR)4、Zr(OR)4等;塩基性化合物として、アルカリ金属水酸化物、アルカリ土類金属水酸化物、アンモニウム塩、アミン類等;フッ化物塩として、NH4F、NR4F等が挙げられる。なお、ここでRは、水素原子、炭素原子数1乃至12の直鎖状アルキル基、炭素原子数3乃至12の分枝状アルキル基、炭素原子数3乃至12の環状アルキル基からなる群から選ばれる一種以上の基である。[Acid or basic catalyst]
The diaryl silicate compound A represented by the formula [1] and the alkoxysilicon compound B represented by the formula [2] (and optionally the alkoxysilicon compound C represented by the formula [9] and / or other heavy compounds. The polycondensation reaction with the condensable compound) is preferably carried out in the presence of an acid or basic catalyst.
The type of the catalyst used for the polycondensation reaction is not particularly limited as long as it is dissolved or uniformly dispersed in the solvent described later, and can be appropriately selected and used as necessary.
Examples of the catalyst that can be used include B (OR) 3 , Al (OR) 3 , Ti (OR) 4 , Zr (OR) 4, etc. as acidic compounds; alkali metal hydroxides as basic compounds, Alkaline earth metal hydroxides, ammonium salts, amines, etc .; Examples of fluoride salts include NH 4 F, NR 4 F, and the like. Here, R represents a hydrogen atom, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, or a cyclic alkyl group having 3 to 12 carbon atoms. One or more selected groups.
上記酸性化合物としては、例えば、ホウ酸、トリメトキシボロン、トリエトキシボロン、トリ−n−プロポキシボロン、トリイソプロポキシボロン、トリ−n−ブトキシボロン、トリイソブトキシボロン、トリ−sec−ブトキシボロン、トリ−tert−ブトキシボロン、トリメトキシアルミニウム、トリエトキシアルミニウム、トリ−n−プロポキシアルミニウム、トリイソプロポキシアルミニウム、トリ−n−ブトキシアルミニウム、トリイソブトキシアルミニウム、トリ−sec−ブトキシアルミニウム、トリ−tert−ブトキシアルミニウム、テトラメトキシチタン、テトラエトキシチタン、テトラ−n−プロポキシチタン、テトライソプロポキシチタン(チタンテトライソプロポキシド)、テトラ−n−ブトキシチタン、テトライソブトキシチタン、テトラ−sec−ブトキシチタン、テトラ−tert−ブトキシチタン、テトラメトキシジルコニウム、テトラエトキシジルコニウム、テトラ−n−プロポキシジルコニウム、テトライソプロポキシジルコニウム、テトラ−n−ブトキシジルコニウム、テトライソブトキシジルコニウム、テトラ−sec−ブトキシジルコニウム、テトラ−tert−ブトキシジルコニウム等が挙げられる。 Examples of the acidic compound include boric acid, trimethoxyboron, triethoxyboron, tri-n-propoxyboron, triisopropoxyboron, tri-n-butoxyboron, triisobutoxyboron, tri-sec-butoxyboron, Tri-tert-butoxyboron, trimethoxyaluminum, triethoxyaluminum, tri-n-propoxyaluminum, triisopropoxyaluminum, tri-n-butoxyaluminum, triisobutoxyaluminum, tri-sec-butoxyaluminum, tri-tert- Butoxyaluminum, tetramethoxytitanium, tetraethoxytitanium, tetra-n-propoxytitanium, tetraisopropoxytitanium (titanium tetraisopropoxide), tetra-n-butoxytitanium, tet Isobutoxy titanium, tetra-sec-butoxy titanium, tetra-tert-butoxy titanium, tetramethoxy zirconium, tetraethoxy zirconium, tetra-n-propoxy zirconium, tetraisopropoxy zirconium, tetra-n-butoxy zirconium, tetraisobutoxy zirconium, Tetra-sec-butoxyzirconium, tetra-tert-butoxyzirconium and the like can be mentioned.
上記塩基性化合物としては、例えば、水酸化ナトリウム、水酸化カリウム、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、水酸化バリウム、水酸化アンモニウム、水酸化テトラメチルアンモニウム、水酸化テトラブチルアンモニウム、トリエチルアミン等が挙げられる。 Examples of the basic compound include sodium hydroxide, potassium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, ammonium hydroxide, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, triethylamine. Etc.
上記フッ化物塩としては、例えば、フッ化アンモニウム、フッ化テトラメチルアンモニウム、フッ化テトラブチルアンモニウム等を挙げることができる。 Examples of the fluoride salt include ammonium fluoride, tetramethylammonium fluoride, and tetrabutylammonium fluoride.
これら触媒のうち、好ましく用いられるのは、テトライソプロポキシチタン(チタンテトライソプロポキシド)、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、及び水酸化バリウムからなる群から選ばれる一種以上である。
触媒の使用量は、上記ジアリールケイ酸化合物とアルコキシケイ素化合物との合計質量に対し、0.01〜10質量%、好ましくは0.1〜5質量%である。触媒の使用量を0.01質量%以上とすることで反応がより良好に進行する。また、経済性を考慮すれば、10質量%以下の使用で十分である。Among these catalysts, one or more selected from the group consisting of tetraisopropoxy titanium (titanium tetraisopropoxide), magnesium hydroxide, calcium hydroxide, strontium hydroxide, and barium hydroxide is preferably used.
The usage-amount of a catalyst is 0.01-10 mass% with respect to the total mass of the said diaryl silicate compound and an alkoxy silicon compound, Preferably it is 0.1-5 mass%. The reaction proceeds more favorably when the amount of the catalyst used is 0.01% by mass or more. In consideration of economy, the use of 10% by mass or less is sufficient.
[重縮合反応]
本発明にかかる反応性シリコーン化合物は、アルコキシケイ素化合物の構造が一つの特徴となっている。本発明に用いられるアルコキシケイ素化合物に含まれる反応性基(重合性二重結合)は、ラジカル的又はイオン(アニオン、カチオン)的に容易に重合し、重合後(硬化後)は高い耐熱性を示す。
このようなアルコキシケイ素化合物とジアリールケイ酸化合物とを重縮合させ、耐熱性の高いシリコーン化合物とするとき、生成物が液体状態を保つよう、適度な重合度で反応を停止させる必要がある。なお本発明で用いるアルコキシケイ素化合物は積極的に加水分解しないことから、ジアリールケイ酸化合物との重縮合反応が穏やかであり、重合度を制御しやすい特徴がある。
アルコキシケイ素化合物とジアリールケイ酸化合物の脱アルコールによる重縮合反応は、無溶媒下で行うことも可能だが、後述するトルエンなどのアルコキシケイ素化合物に対して不活性な溶媒を反応溶媒として用いることも可能である。無溶媒の場合は、反応副生成物であるアルコールの留去が容易になるという利点がある。一方、反応溶媒を用いる場合は、反応系を均一にしやすく、より安定した重縮合反応を行えるという利点がある。[Polycondensation reaction]
The reactive silicone compound according to the present invention is characterized by the structure of the alkoxysilicon compound. The reactive group (polymerizable double bond) contained in the alkoxysilicon compound used in the present invention is easily polymerized radically or ionically (anion, cation), and has high heat resistance after polymerization (after curing). Show.
When such an alkoxysilicon compound and a diarylsilicate compound are polycondensed to obtain a silicone compound having high heat resistance, it is necessary to stop the reaction at an appropriate degree of polymerization so that the product maintains a liquid state. Since the alkoxysilicon compound used in the present invention does not actively hydrolyze, the polycondensation reaction with the diaryl silicate compound is gentle, and the degree of polymerization is easily controlled.
The polycondensation reaction of the alkoxy silicon compound and the diaryl silicate compound by dealcoholization can be performed in the absence of a solvent, but it is also possible to use a solvent inert to the alkoxy silicon compound such as toluene described later as the reaction solvent. It is. When there is no solvent, there is an advantage that the alcohol as a reaction by-product can be easily distilled off. On the other hand, when a reaction solvent is used, there are advantages that the reaction system can be easily made uniform and a more stable polycondensation reaction can be performed.
反応性シリコーン化合物の合成反応は、前述のように無溶媒で行ってもよいが、より均一化させるために溶媒を使用しても問題ない。溶媒は、ジアリールケイ酸化合物及びアルコキシケイ素化合物と反応せず、その縮合物を溶解するものであれば特に限定されない。
このような反応溶媒としては、例えば、アセトン、メチルエチルケトン(MEK)等のケトン類;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;エチレングリコール、プロピレングリコール、ヘキシレングリコール等のグリコール類;エチルセロソルブ、ブチルセロソルブ、エチルカルビトール、ブチルカルビトール、ジエチルセロソルブ、ジエチルカルビトール等のグリコールエーテル類;N−メチル−2−ピロリドン(NMP)、N,N−ジメチルホルムアミド(DMF)等のアミド類などが挙げられる。これら溶媒は、一種単独で、又は二種以上を混合して用いてもよい。これらの中でも、トルエンが好ましい。The reactive reaction of the reactive silicone compound may be performed without a solvent as described above, but there is no problem even if a solvent is used in order to make it more uniform. The solvent is not particularly limited as long as it does not react with the diaryl silicate compound and the alkoxysilicon compound and dissolves the condensate thereof.
Examples of such a reaction solvent include ketones such as acetone and methyl ethyl ketone (MEK); aromatic hydrocarbons such as benzene, toluene and xylene; glycols such as ethylene glycol, propylene glycol and hexylene glycol; ethyl cellosolve , Glycol ethers such as butyl cellosolve, ethyl carbitol, butyl carbitol, diethyl cellosolve, diethyl carbitol; amides such as N-methyl-2-pyrrolidone (NMP) and N, N-dimethylformamide (DMF) It is done. These solvents may be used alone or in combination of two or more. Among these, toluene is preferable.
本発明で用いる反応性シリコーン化合物は、式[1]で表されるジアリールケイ酸化合物Aと、式[2]で表されるアルコキシケイ素化合物B(及び所望により、式[9]で表されるアルコキシケイ素化合物C及び/又はその他の重縮合性化合物)とを、酸又は塩基性触媒の存在下で、脱アルコール縮合させることにより得られる。重縮合反応は積極的に水を添加せず行うことが好ましく、水分の混入を防ぐ目的から、窒素ガス等の不活性ガス雰囲気中で行うことが望ましい。反応温度は20〜150℃、より好ましくは30〜120℃である。
反応時間は、重縮合物の分子量増加が終了し、分子量分布が安定するのに必要な時間以上なら、特に制限は受けず、より具体的には数時間から数日間である。The reactive silicone compound used in the present invention is represented by the diaryl silicate compound A represented by the formula [1] and the alkoxysilicon compound B represented by the formula [2] (and optionally represented by the formula [9]. It is obtained by subjecting the alkoxysilicon compound C and / or other polycondensable compound) to dealcoholization condensation in the presence of an acid or a basic catalyst. The polycondensation reaction is preferably carried out without positively adding water, and is preferably carried out in an inert gas atmosphere such as nitrogen gas for the purpose of preventing water contamination. The reaction temperature is 20 to 150 ° C, more preferably 30 to 120 ° C.
The reaction time is not particularly limited as long as it is longer than the time necessary for the molecular weight distribution of the polycondensate to increase and to stabilize the molecular weight distribution, and more specifically, several hours to several days.
重縮合反応の終了後、得られた反応性シリコーン化合物をろ過、溶媒留去等の任意の方法で回収し、必要に応じて適宜精製処理を行うことが好ましい。 After completion of the polycondensation reaction, the obtained reactive silicone compound is preferably collected by any method such as filtration and solvent distillation, and appropriately subjected to purification treatment as necessary.
このような反応によって得られた重縮合物は、ゲル浸透クロマトグラフィー(GPC)によるポリスチレン換算で測定される重量平均分子量Mwが500〜10,000であり、分散度Mw(重量平均分子量)/Mn(数平均分子量)は1.0〜10である。 The polycondensate obtained by such a reaction has a weight average molecular weight Mw measured in terms of polystyrene by gel permeation chromatography (GPC) of 500 to 10,000, and a dispersity Mw (weight average molecular weight) / Mn. (Number average molecular weight) is 1.0-10.
<(b)(メタ)アクリレート化合物>
本発明の重合性組成物に含まれる(b)(メタ)アクリレート化合物は、好ましくは下記式[5]で表されるフルオレン化合物D、及び下記式[6]で表されるビスフェノール化合物Eからなる群から選ばれる少なくとも一種である。なお、本明細書において(メタ)アクリレートとは、アクリレートとメタクリレートの双方を指す。<(B) (Meth) acrylate compound>
The (b) (meth) acrylate compound contained in the polymerizable composition of the present invention preferably comprises a fluorene compound D represented by the following formula [5] and a bisphenol compound E represented by the following formula [6]. It is at least one selected from the group. In this specification, (meth) acrylate refers to both acrylate and methacrylate.
[フルオレン化合物D]
前記フルオレン化合物Dは、下記式[5]で表される化合物である。
The fluorene compound D is a compound represented by the following formula [5].
L1及びL2が表す置換基を有していてもよいフェニレン基としては、例えば、o−フェニレン基、m−フェニレン基、p−フェニレン基、2−メチルベンゼン−1,4−ジイル基、2−クロロベンゼン−1,4−ジイル基、2−ブロモベンゼン−1,4−ジイル基、2−アミノベンゼン−1,4−ジイル基、2−メチルベンゼン−1,5−ジイル基、2−クロロベンゼン−1,5−ジイル基、2−ブロモベンゼン−1,5−ジイル基、2−アミノベンゼン−1,5−ジイル基等が挙げられる。中でも、p−フェニレン基が好ましい。
L1及びL2が表す置換基を有していてもよいナフタレンジイル基としては、例えば、ナフタレン−1,4−ジイル基、ナフタレン−1,5−ジイル基、ナフタレン−2,6−ジイル基等が挙げられる。Examples of the phenylene group optionally having a substituent represented by L 1 and L 2 include an o-phenylene group, an m-phenylene group, a p-phenylene group, a 2-methylbenzene-1,4-diyl group, 2-chlorobenzene-1,4-diyl group, 2-bromobenzene-1,4-diyl group, 2-aminobenzene-1,4-diyl group, 2-methylbenzene-1,5-diyl group, 2-chlorobenzene -1,5-diyl group, 2-bromobenzene-1,5-diyl group, 2-aminobenzene-1,5-diyl group and the like. Of these, a p-phenylene group is preferable.
Examples of the naphthalenediyl group optionally having a substituent represented by L 1 and L 2 include a naphthalene-1,4-diyl group, a naphthalene-1,5-diyl group, and a naphthalene-2,6-diyl group. Etc.
L3及びL4が表す炭素原子数1乃至6のアルキレン基としては、例えば、メチレン基、エチレン基、トリメチレン基、メチルエチレン基、テトラメチレン基、1−メチルトリメチレン基、2−メチルトリメチレン基、1,1−ジメチルエチレン基、ペンタメチレン基、1−メチルテトラメチレン基、2−メチルテトラメチレン基、1,1−ジメチルトリメチレン基、1,2−ジメチルトリメチレン基、2,2−ジメチルトリメチレン基、1−エチルトリメチレン基、ヘキサメチレン基、1−メチルペンタメチレン基、2−メチルペンタメチレン基、3−メチルペンタメチレン基、1,1−ジメチルテトラメチレン基、1,2−ジメチルテトラメチレン基、2,2−ジメチルテトラメチレン基、1−エチルテトラメチレン基、1,1,2−トリメチルトリメチレン基、1,2,2−トリメチルトリメチレン基、1−エチル−1−メチルトリメチレン基、1−エチル−2−メチルトリメチレン基等が挙げられる。中でも、エチレン基、メチルエチレン基が好ましい。Examples of the alkylene group having 1 to 6 carbon atoms represented by L 3 and L 4 include a methylene group, an ethylene group, a trimethylene group, a methylethylene group, a tetramethylene group, a 1-methyltrimethylene group, and a 2-methyltrimethylene group. Group, 1,1-dimethylethylene group, pentamethylene group, 1-methyltetramethylene group, 2-methyltetramethylene group, 1,1-dimethyltrimethylene group, 1,2-dimethyltrimethylene group, 2,2- Dimethyltrimethylene group, 1-ethyltrimethylene group, hexamethylene group, 1-methylpentamethylene group, 2-methylpentamethylene group, 3-methylpentamethylene group, 1,1-dimethyltetramethylene group, 1,2- Dimethyltetramethylene group, 2,2-dimethyltetramethylene group, 1-ethyltetramethylene group, 1,1,2-trimethyl Examples thereof include a methyltrimethylene group, 1,2,2-trimethyltrimethylene group, 1-ethyl-1-methyltrimethylene group, 1-ethyl-2-methyltrimethylene group and the like. Of these, an ethylene group and a methylethylene group are preferable.
式[5]で表される化合物において、m及びnは、m+nが0乃至30となる場合が好ましく、m+nが2乃至20となる場合がより好ましい。 In the compound represented by the formula [5], m and n are preferably such that m + n is 0 to 30, and more preferably m + n is 2 to 20.
このようなフルオレン化合物Dの具体例としては、例えば、9,9−ビス(4−(2−(メタ)アクリロイルオキシ)フェニル)−9H−フルオレン、9,9−ビス(4−(2−(メタ)アクリロイルオキシエトキシ)フェニル)−9H−フルオレン、エトキシ化(エチレンオキシド変性)(9H−フルオレン−9,9−ジイル)ビス(4,1−フェニレン)ジ(メタ)アクリレート、プロポキシ化(プロピレンオキシド変性)(9H−フルオレン−9,9−ジイル)ビス(4,1−フェニレン)ジ(メタ)アクリレート、9,9−ビス(6−(2−(メタ)アクリロイルオキシ)ナフタレン−2−イル)−9H−フルオレン、9,9−ビス(6−(2−(メタ)アクリロイルオキシエトキシ)ナフタレン−2−イル)−9H−フルオレン、オグソール(登録商標)EA−0200、同EA−0300、同EA−F5003、同EA−F5503、同EA−F5510、同EA−F5710、同GA−5000[以上、大阪ガスケミカル(株)製]、NKエステルA−BPEF[新中村化学工業(株)製]等が挙げられるが、これらに限定されるものではない。 Specific examples of such fluorene compound D include, for example, 9,9-bis (4- (2- (meth) acryloyloxy) phenyl) -9H-fluorene, 9,9-bis (4- (2- ( (Meth) acryloyloxyethoxy) phenyl) -9H-fluorene, ethoxylated (ethylene oxide modified) (9H-fluorene-9,9-diyl) bis (4,1-phenylene) di (meth) acrylate, propoxylated (propylene oxide modified) ) (9H-fluorene-9,9-diyl) bis (4,1-phenylene) di (meth) acrylate, 9,9-bis (6- (2- (meth) acryloyloxy) naphthalen-2-yl)- 9H-fluorene, 9,9-bis (6- (2- (meth) acryloyloxyethoxy) naphthalen-2-yl) -9H-fluorene, Gusol (registered trademark) EA-0200, EA-0300, EA-F5003, EA-F5503, EA-F5510, EA-F5710, GA-5000 [above, manufactured by Osaka Gas Chemical Co., Ltd.] NK ester A-BPEF [manufactured by Shin-Nakamura Chemical Co., Ltd.] and the like are exemplified, but not limited thereto.
[ビスフェノール化合物E]
前記ビスフェノール化合物Eは、下記式[6]で表される化合物である。
The bisphenol compound E is a compound represented by the following formula [6].
L5及びL6が表す炭素原子数1乃至6のアルキレン基としては、上述の式[5]中のL3及びL4として例示したものと同様の基が挙げられる。中でも、エチレン基、メチルエチレン基が好ましい。Examples of the alkylene group having 1 to 6 carbon atoms represented by L 5 and L 6 include the same groups as those exemplified as L 3 and L 4 in the above formula [5]. Of these, an ethylene group and a methylethylene group are preferable.
式[6]で表される化合物において、p及びqは、p+qが0乃至30となる場合が好ましく、p+qが2乃至20となる場合がより好ましい。 In the compound represented by the formula [6], p and q are preferably such that p + q is 0 to 30, and more preferably p + q is 2 to 20.
このようなビスフェノール化合物Eの具体例としては、例えば、ビスフェノールAジ(メタ)アクリレート、エトキシ化(エチレンオキシド変性)ビスフェノールAジ(メタ)アクリレート(エトキシ基2.3mol付加、2.6mol付加、3mol付加、4mol付加、6mol付加、10mol付加、17mol付加、30mol付加など)、プロポキシ化(プロピレンオキシド変性)ビスフェノールAジ(メタ)アクリレート(プロポキシ基3mol付加など)、エトキシ/プロポキシ化(エチレンオキシド/プロピレンオキシド変性)ビスフェノールAジ(メタ)アクリレート(エトキシ基6mol/プロポキシ基12mol付加など)、エトキシ化(エチレンオキシド変性)ビスフェノールFジ(メタ)アクリレート(エトキシ基4mol付加など)、エトキシ化(エチレンオキシド変性)ビスフェノールAFジ(メタ)アクリレート、NKエステルA−B1206PE、同ABE−300、同A−BPE−10、同A−BPE−20、同A−BPE−30、同A−BPE−4、同A−BPP−3、同BPE−80N、同BPE−100、同BPE−200、同BPE−500、同BPE−900、同BPE−1300N[以上、新中村化学工業(株)製]、ブレンマー(登録商標)PDBE−200、同PDBE−250、同PDBE−450、同PDBE−1300[以上、日油(株)製]、KAYARAD(登録商標)R−712[日本化薬(株)製]等が挙げられる。中でも、エトキシ化(エチレンオキシド変性)ビスフェノールAジ(メタ)アクリレート、プロポキシ化(プロピレンオキシド変性)ビスフェノールAジ(メタ)アクリレートが好ましい。 Specific examples of such bisphenol compound E include, for example, bisphenol A di (meth) acrylate, ethoxylated (ethylene oxide modified) bisphenol A di (meth) acrylate (2.3 mol addition of ethoxy groups, 2.6 mol addition, 3 mol addition) 4 mol addition, 6 mol addition, 10 mol addition, 17 mol addition, 30 mol addition, etc.), propoxylation (propylene oxide modification) bisphenol A di (meth) acrylate (propoxy group 3 mol addition, etc.), ethoxy / propoxylation (ethylene oxide / propylene oxide modification) ) Bisphenol A di (meth) acrylate (6 mol of ethoxy group / 12 mol of propoxy group added, etc.), ethoxylated (ethylene oxide modified) bisphenol F di (meth) acrylate (ethoxy) 4 mol addition, etc.), ethoxylated (ethylene oxide modified) bisphenol AF di (meth) acrylate, NK ester A-B1206PE, ABE-300, A-BPE-10, A-BPE-20, A-BPE-30 A-BPE-4, A-BPP-3, BPE-80N, BPE-100, BPE-200, BPE-500, BPE-900, BPE-1300N [above, Shin-Nakamura Chemical Industrial Co., Ltd.], Blemmer (registered trademark) PDBE-200, PDBE-250, PDBE-450, PDBE-1300 [above, manufactured by NOF Corporation], KAYARAD (registered trademark) R-712 [ Nippon Kayaku Co., Ltd.]. Among them, ethoxylated (ethylene oxide modified) bisphenol A di (meth) acrylate and propoxylated (propylene oxide modified) bisphenol A di (meth) acrylate are preferable.
本発明の重合性組成物において、(b)(メタ)アクリレート化合物の配合量は、(a)反応性シリコーン化合物100質量部に対して1〜200質量部が好ましく、25〜150質量部がより好ましく、50〜100質量部が特に好ましい。
本発明の重合性組成物に含まれる(b)(メタ)アクリレート化合物は、前述のフルオレン化合物D、及びビスフェノール化合物Eからなる群から選ばれる少なくとも一種を単独で、また二種以上を混合して用いてもよい。
(b)(メタ)アクリレート化合物として上記化合物D乃びEの二種以上を混合して用いる場合、前述のフルオレン化合物Dを必須の化合物として含むことが好ましく、フルオレン化合物Dとビスフェノール化合物Eの二種を少なくとも含みて用いることが好ましい。
二種以上を混合して用いる場合、例えばフルオレン化合物Dとビスフェノール化合物Eとを混合して用いる場合、これらは質量比で、フルオレン化合物D:ビスフェノール化合物E=20:1〜1:1とすることが好ましく、10:1〜2:1とすることがより好ましい。In the polymerizable composition of the present invention, the blending amount of the (b) (meth) acrylate compound is preferably 1 to 200 parts by weight and more preferably 25 to 150 parts by weight with respect to 100 parts by weight of the (a) reactive silicone compound. Preferably, 50-100 mass parts is especially preferable.
The (b) (meth) acrylate compound contained in the polymerizable composition of the present invention is a mixture of at least one selected from the group consisting of the fluorene compound D and the bisphenol compound E, and a mixture of two or more. It may be used.
(B) When two or more of the above-mentioned compounds D and E are used as a (meth) acrylate compound, it is preferable that the above-mentioned fluorene compound D is contained as an essential compound, and the fluorene compound D and the bisphenol compound E It is preferable to use at least the species.
When two or more kinds are mixed and used, for example, when fluorene compound D and bisphenol compound E are mixed and used, these should be fluorene compound D: bisphenol compound E = 20: 1 to 1: 1. Is preferable, and 10: 1 to 2: 1 is more preferable.
<(c)ポリマー>
本発明の重合性組成物に含まれる(c)ポリマーは、ゲル浸透クロマトグラフィー(GPC)によるポリスチレン換算で測定される重量平均分子量Mwが5,000〜100,000、好ましくは10,000〜80,000、より好ましくは20,000〜60,000のポリマーである。
また、少なくとも式[3]で表されるモノマー単位又は式[4]で表されるモノマー単位を有するポリマーが好ましく、少なくとも式[3]で表されるモノマー単位及び式[4]で表されるモノマー単位を有するポリマーがより好ましい。<(C) Polymer>
The polymer (c) contained in the polymerizable composition of the present invention has a weight average molecular weight Mw measured in terms of polystyrene by gel permeation chromatography (GPC) of 5,000 to 100,000, preferably 10,000 to 80. 20,000, more preferably 20,000-60,000 polymers.
In addition, a polymer having at least a monomer unit represented by the formula [3] or a monomer unit represented by the formula [4] is preferable, and is represented by at least the monomer unit represented by the formula [3] and the formula [4]. A polymer having monomer units is more preferred.
Ar4が表す炭素原子数1乃至6のアルキル基で置換されていてもよいフェニル基、炭素原子数1乃至6のアルキル基で置換されていてもよいナフチル基、及び炭素原子数1乃至6のアルキル基で置換されていてもよいビフェニル基としては、上述の式[1]中のAr1及びAr2として例示したものと同様の基が挙げられる。Ar 4 represents a phenyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms, a naphthyl group which may be substituted with an alkyl group having 1 to 6 carbon atoms, and an alkyl group having 1 to 6 carbon atoms. Examples of the biphenyl group optionally substituted with an alkyl group include the same groups as those exemplified as Ar 1 and Ar 2 in the above formula [1].
上記式[3]で表されるモノマー単位の具体例としては、例えば、1−フェニルエチレン基、1−メチル−1−フェニルエチレン基、1−(ナフタレン−1−イル)エチレン基、1−([1,1’−ビフェニル]−2−イル)エチレン基、1−([1,1’−ビフェニル]−3−イル)エチレン基、1−([1,1’−ビフェニル]−4−イル)エチレン基等が挙げられる。中でも、1−フェニルエチレン基が好ましい。 Specific examples of the monomer unit represented by the formula [3] include, for example, 1-phenylethylene group, 1-methyl-1-phenylethylene group, 1- (naphthalen-1-yl) ethylene group, 1- ( [1,1′-biphenyl] -2-yl) ethylene group, 1-([1,1′-biphenyl] -3-yl) ethylene group, 1-([1,1′-biphenyl] -4-yl ) Ethylene group and the like. Of these, a 1-phenylethylene group is preferable.
R5が表す炭素原子数1乃至12のアルキル基としては、例えば、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、n−ペンチル基、イソアミル基、ネオペンチル基、tert−アミル基、sec−イソアミル基、シクロペンチル基、n−ヘキシル基、シクロヘキシル基、n−ヘプチル基、n−オクチル基、2−エチルヘキシル基、n−ノニル基、n−デシル基、n−ドデシル基、ベンジル基、フェネチル基等が挙げられる。Examples of the alkyl group having 1 to 12 carbon atoms represented by R 5 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isoamyl group, neopentyl group, tert-amyl group, sec-isoamyl group, cyclopentyl group, n-hexyl group, cyclohexyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl Group, n-decyl group, n-dodecyl group, benzyl group, phenethyl group and the like.
上記式[4]で表されるモノマー単位の具体例としては、例えば、1−メトキシカルボニルエチレン基、1−メトキシカルボニル−1−メチルエチレン基等が挙げられる。 Specific examples of the monomer unit represented by the above formula [4] include 1-methoxycarbonylethylene group, 1-methoxycarbonyl-1-methylethylene group and the like.
このようなポリマーの具体例としては、例えば、ポリスチレン、アクリロニトリル−塩素化ポリエチレン−スチレン共重合体(ACS)、アクリロニトリル−ブタジエン−スチレン共重合体(ABS)、アクリロニトリル−EPDM(エチレン−プロピレン−ジエンターポリマ)−スチレン共重合体(AES)、アクリロニトリル−スチレン共重合体(AS)、アクリロニトリル−スチレン−アクリレート共重合体(ASA)、メタクリル酸メチル−ブタジエン−スチレン共重合体(MBS)、メタクリル酸メチル−スチレン共重合体(MS)、シリコーン−アクリロニトリル−スチレン共重合体(SAS)、スチレン−ブタジエン共重合体(SBC)、スチレン−無水マレイン酸共重合体(SMA)等のスチレン系ポリマー;ポリ(アクリル酸メチル)、ポリ(メタクリル酸メチル)(PMMA)等の(メタ)アクリルポリマー;ポリエチレン(PE)、ポリプロピレン(PP)等のポリオレフィン;ポリアミド(PA);ポリカーボネート(PC);ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)等のポリエステル;環状ポリオレフィン(COP);ポリアリールエーテル;ポリエーテルエーテルケトン(PEEK);ポリエーテルスルホン(PES);ポリウレタン(PU);フルオレン・ポリエステル樹脂(例えば、大阪ガスケミカル(株)製 OKP4)などが挙げられる。
中でも、スチレン系ポリマーが好ましく、ポリスチレン、メタクリル酸メチル−スチレン共重合体がより好ましい。Specific examples of such a polymer include, for example, polystyrene, acrylonitrile-chlorinated polyethylene-styrene copolymer (ACS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-EPDM (ethylene-propylene-dienter). Polymer) -styrene copolymer (AES), acrylonitrile-styrene copolymer (AS), acrylonitrile-styrene-acrylate copolymer (ASA), methyl methacrylate-butadiene-styrene copolymer (MBS), methyl methacrylate -Styrene polymers such as styrene copolymer (MS), silicone-acrylonitrile-styrene copolymer (SAS), styrene-butadiene copolymer (SBC), styrene-maleic anhydride copolymer (SMA); poly ( Acry (Meth acid), (meth) acrylic polymers such as poly (methyl methacrylate) (PMMA); polyolefins such as polyethylene (PE) and polypropylene (PP); polyamide (PA); polycarbonate (PC); polyethylene terephthalate (PET), Polybutylene terephthalate (PBT) and other polyesters; cyclic polyolefin (COP); polyaryl ethers; polyether ether ketone (PEEK); polyether sulfone (PES); polyurethane (PU); fluorene polyester resin (for example, Osaka Gas Chemical) (Okp4 manufactured by Co., Ltd.).
Of these, styrene polymers are preferable, and polystyrene and methyl methacrylate-styrene copolymers are more preferable.
(c)ポリマーとして共重合体を用いる場合、共重合体を構成する各モノマー単位のモル比は特に制限されない。例えば、上記式[3]で表されるモノマー単位及び式[4]で表されるモノマー単位を有する共重合体の場合、これらはモル比で、式[3]で表されるモノマー単位:式[4]で表されるモノマー単位=99:1〜10:90とすることが好ましい。 (C) When using a copolymer as a polymer, the molar ratio of each monomer unit constituting the copolymer is not particularly limited. For example, in the case of a copolymer having a monomer unit represented by the above formula [3] and a monomer unit represented by the formula [4], these are molar ratios of the monomer unit represented by the formula [3]: formula The monomer unit represented by [4] is preferably 99: 1 to 10:90.
本発明の重合性組成物において、(c)ポリマーは一種単独で、又は二種以上を混合して用いてもよい。また、その配合量は、(a)反応性シリコーン化合物100質量部に対して0.1〜50質量部が好ましく、0.5〜30質量部がより好ましく、1〜20質量部が特に好ましい。 In the polymerizable composition of the present invention, the polymer (c) may be used alone or in combination of two or more. Moreover, 0.1-50 mass parts is preferable with respect to 100 mass parts of (a) reactive silicone compound, its 0.5-30 mass parts is more preferable, and its 1-20 mass parts is especially preferable.
<(d)安定化剤>
本発明の重合性組成物には、前述の(a)反応性シリコーン化合物、(b)(メタ)アクリレート化合物及び(c)ポリマーに加えて、(d)成分として、光安定剤F及び酸化防止剤Gからなる群から選ばれる少なくとも一種の安定化剤を含んでいてもよい。<(D) Stabilizer>
In addition to the above-mentioned (a) reactive silicone compound, (b) (meth) acrylate compound and (c) polymer, the polymerizable composition of the present invention includes a light stabilizer F and an antioxidant as a component (d). At least one stabilizer selected from the group consisting of the agent G may be included.
[光安定剤F]
本発明に用いられる(d)成分のうち、光安定剤Fは下記式[7]で表される基を有する化合物である。
Among the components (d) used in the present invention, the light stabilizer F is a compound having a group represented by the following formula [7].
R12が表す炭素原子数1乃至10のアルキル基としては、例えば、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、n−ペンチル基、イソアミル基、ネオペンチル基、tert−アミル基、sec−イソアミル基、シクロペンチル基、n−ヘキシル基、シクロヘキシル基、n−ヘプチル基、n−オクチル基、n−ノニル基、n−デシル基等が挙げられる。Examples of the alkyl group having 1 to 10 carbon atoms represented by R 12 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isoamyl group, neopentyl group, tert-amyl group, sec-isoamyl group, cyclopentyl group, n-hexyl group, cyclohexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl Groups and the like.
R12が表す炭素原子数1乃至12のアルコキシ基としては、例えば、メトキシ基、エトキシ基、n−プロポキシ基、イソプロポキシ基、n−ブトキシ基、イソブトキシ基、sec−ブトキシ基、tert−ブトキシ基、n−ペンチルオキシ基、イソアミルオキシ基、ネオペンチルオキシ基、tert−アミルオキシ基、sec−イソアミルオキシ基、シクロペンチルオキシ基、n−ヘキシルオキシ基、シクロヘキシルオキシ基、n−ヘプチルオキシ基、n−オクチル基オキシ、n−ノニルオキシ基、n−デシルオキシ基、n−ウンデシルオキシ基等が挙げられる。Examples of the alkoxy group having 1 to 12 carbon atoms represented by R 12 include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a sec-butoxy group, and a tert-butoxy group. , N-pentyloxy group, isoamyloxy group, neopentyloxy group, tert-amyloxy group, sec-isoamyloxy group, cyclopentyloxy group, n-hexyloxy group, cyclohexyloxy group, n-heptyloxy group, n-octyl And group oxy, n-nonyloxy, n-decyloxy, n-undecyloxy and the like.
これらの中でも、R12としては、水素原子、メチル基、シクロヘキシルオキシ基、n−オクチルオキシ基が好ましい。Among these, R 12 is preferably a hydrogen atom, a methyl group, a cyclohexyloxy group, or an n-octyloxy group.
このような光安定剤Fとしては、例えば、TINUVIN(登録商標)123、同144、同152、同292、同770[以上、BASFジャパン(株)製]、アデカスタブ(登録商標)LA−52、同LA−57、同LA−63P、同LA−68、同LA−72、同LA−77Y、同LA−77G、同LA−81、同LA−82、同LA−87[以上、(株)ADEKA製]等が挙げられる。 As such a light stabilizer F, for example, TINUVIN (registered trademark) 123, 144, 152, 292, 770 [above, manufactured by BASF Japan Ltd.], ADK STAB (registered trademark) LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87 [above, Co., Ltd.] ADEKA] and the like.
[酸化防止剤G]
本発明に用いられる(d)成分のうち、酸化防止剤Gは下記式[8]で表される基を有する化合物である。
Among the components (d) used in the present invention, the antioxidant G is a compound having a group represented by the following formula [8].
R13及びR14乃至R16が表す炭素原子数1乃至10のアルキル基としては、上述の式[7]中のR12として例示したものと同様の基が挙げられる。中でも、R13としては、tert−ブチル基が好ましい。
このような式[8]で表される基としては、例えば、3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル基、3−tert−ブチル−4−ヒドロキシ−6−メチルフェニル基、3,5−ジ−tert−ブチル−4−ヒドロキシフェニル基等が挙げられる。Examples of the alkyl group having 1 to 10 carbon atoms represented by R 13 and R 14 to R 16 include the same groups as those exemplified as R 12 in the above formula [7]. Among them, R 13 is preferably a tert-butyl group.
Examples of such a group represented by the formula [8] include 3-tert-butyl-4-hydroxy-5-methylphenyl group, 3-tert-butyl-4-hydroxy-6-methylphenyl group, 3 , 5-di-tert-butyl-4-hydroxyphenyl group and the like.
このような酸化防止剤Gとしては、例えば、IRGANOX(登録商標)245、同1010、同1035、同1076、同1135[以上、BASFジャパン(株)製]、スミライザー(登録商標)GA−80、同GP、同MDP−S、同BBM−S、同WX−R[以上、住友化学(株)製]、アデカスタブ(登録商標)AO−20、同AO−30、同AO−40、同AO−50、同AO−60、同AO−80、同AO−330[以上、(株)ADEKA製]等が挙げられる。 Examples of such an antioxidant G include IRGANOX (registered trademark) 245, 1010, 1035, 1076, 1135 [above, manufactured by BASF Japan Ltd.], Sumilizer (registered trademark) GA-80, GP, MDP-S, BBM-S, WX-R [above, manufactured by Sumitomo Chemical Co., Ltd.], ADK STAB (registered trademark) AO-20, AO-30, AO-40, AO- 50, the same AO-60, the same AO-80, the same AO-330 [above, manufactured by ADEKA Corporation] and the like.
本発明の重合性組成物において(d)成分が配合される場合、前記(a)成分の100質量部に対して、(d)成分は0.01〜5質量部にて含むことが好ましく、より好ましくは0.05〜1質量部である。
なお本発明において、(d)成分は光安定剤Fを一種単独で又は二種以上を混合して用いてよく、或いは酸化防止剤Gを一種単独で又は二種以上を混合して用いてよく、或いは
一種以上の光安定剤Fと一種以上の酸化防止剤Gとを混合して用いてもよい。(d)成分として複数種の化合物を用いる場合、上記配合量は用いた複数種の化合物の合計が上記の範囲となる。When (d) component is mix | blended in the polymeric composition of this invention, it is preferable to contain (d) component in 0.01-5 mass parts with respect to 100 mass parts of said (a) component, More preferably, it is 0.05-1 mass part.
In the present invention, as the component (d), the light stabilizer F may be used alone or in combination of two or more, or the antioxidant G may be used alone or in combination of two or more. Alternatively, one or more light stabilizers F and one or more antioxidants G may be mixed and used. When a plurality of types of compounds are used as the component (d), the total amount of the plurality of types of compounds used is within the above range.
<(e)硫黄化合物>
本発明の重合性組成物には、前述の(a)反応性シリコーン化合物、(b)(メタ)アクリレート化合物及び(c)ポリマー、又は上記(a)成分乃至(d)成分に加えて、(e)成分としてチオール化合物H、及びジスルフィド化合物Iからなる群から選ばれる少なくとも一種の硫黄化合物を含んでいてもよい。<(E) Sulfur compound>
In addition to the above-mentioned (a) reactive silicone compound, (b) (meth) acrylate compound and (c) polymer, or the above-mentioned components (a) to (d), the polymerizable composition of the present invention comprises: e) The component may contain at least one sulfur compound selected from the group consisting of the thiol compound H and the disulfide compound I.
[チオール化合物H]
本発明に用いられる(e)成分のうち、チオール化合物Hとしては、例えば、メルカプト酢酸メチル、3−メルカプトプロピオン酸メチル、3−メルカプトプロピオン酸=4−メトキシブチル、3−メルカプトプロピオン酸=2−エチルヘキシル、3−メルカプトプロピオン酸n−オクチル、3−メルカプトプロピオン酸ステアリル、1,4−ビス(3−メルカプトプロピオニルオキシ)ブタン、1,4−ビス(3−メルカプトブチリルオキシ)ブタン、トリメチロールエタントリス(3−メルカプトプロピオネート)、トリメチロールエタントリス(3−メルカプトブチレート)、トリメチロールプロパントリス(3−メルカプトプロピオネート)、トリメチロールプロパントリス(3−メルカプトブチレート)、ペンタエリトリトールテトラキス(3−メルカプトプロピオネート)、ペンタエリトリトールテトラキス(3−メルカプトブチレート)、ジペンタエリトリトールヘキサキス(3−メルカプトプロピオネート)、ジペンタエリトリトールヘキサキス(3−メルカプトブチレート)、トリス〔2−(3−メルカプトプロピオニルオキシ)エチル〕イソシアヌレート、トリス〔2−(3−メルカプトブチリルオキシ)エチル〕イソシアヌレート等のメルカプトカルボン酸エステル類;エチルメルカプタン、1,2−ジメルカプトエタン、1,3−ジメルカプトプロパン、tert−ブチルメルカプタン、n−ドデカンチオール、tert−ドデカンチオール等のメルカプトアルカン類;2−メルカプトエタノール、4−メルカプト−1−ブタノール等のメルカプトアルコール類;チオフェノール、ベンジルチオール、m−トルエンチオール、p−トルエンチオール、2−ナフタレンチオール、2−ピリジルチオール、2−メルカプトベンゾイミダゾール、2−メルカプトベンゾチアゾール等の含芳香環メルカプタン類;(γ―メルカプトプロピル)トリメトキシシラン、(γ―メルカプトプロピル)トリエトキシシラン等のシラン含有チオール類などが挙げられる。中でも、メルカプトアルカン類が好ましく、n−ドデカンチオールがより好ましい。[Thiol Compound H]
Among the components (e) used in the present invention, examples of the thiol compound H include, for example, methyl mercaptoacetate, methyl 3-mercaptopropionate, 3-mercaptopropionic acid = 4-methoxybutyl, 3-mercaptopropionic acid = 2− Ethylhexyl, n-octyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, 1,4-bis (3-mercaptopropionyloxy) butane, 1,4-bis (3-mercaptobutyryloxy) butane, trimethylolethane Tris (3-mercaptopropionate), trimethylolethane tris (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol te Lakis (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate), dipentaerythritol hexakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptobutyrate), tris [ Mercaptocarboxylic acid esters such as 2- (3-mercaptopropionyloxy) ethyl] isocyanurate and tris [2- (3-mercaptobutyryloxy) ethyl] isocyanurate; ethyl mercaptan, 1,2-dimercaptoethane, 1 Mercaptoalkanes such as 1,3-dimercaptopropane, tert-butyl mercaptan, n-dodecanethiol, tert-dodecanethiol; mercaptoalcos such as 2-mercaptoethanol and 4-mercapto-1-butanol Aromatic ring mercaptans such as thiophenol, benzylthiol, m-toluenethiol, p-toluenethiol, 2-naphthalenethiol, 2-pyridylthiol, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole; Silane-containing thiols such as (mercaptopropyl) trimethoxysilane and (γ-mercaptopropyl) triethoxysilane. Among these, mercaptoalkanes are preferable, and n-dodecanethiol is more preferable.
[ジスルフィド化合物I]
本発明に用いられる(e)成分のうち、ジスルフィド化合物Iとしては、例えば、ジエチルジスルフィド、ジプロピルジスルフィド、ジイソプロピルジスルフィド、ジブチルジスルフィド、ジ−tert−ブチルジスルフィド、ジペンチルジスルフィド、ジイソペンチルジスルフィド、ジヘキシルジスルフィド、ジシクロヘキシルジスルフィド、ジデシルジスルフィド、ジ−tert−ドデシルジスルフィド、ビス(2−ヒドロキシエチル)ジスルフィド、ビス(2,2−ジエトキシエチル)ジスルフィド等のアルキルジスルフィド類;ジフェニルジスルフィド、ジトリルジスルフィド、ジベンジルジスルフィド、2,2’−ジピリジルジスルフィド、2,2’−ジベンゾイミダゾリルジスルフィド、2,2’−ジベンゾチアゾリルジスルフィド等の含芳香環ジスルフィド類;テトラメチルチウラムジスルフィド、テトラエチルチウラムジスルフィド、テトラブチルチウラムジスルフィド、ジペンタメチレンチウラムジスルフィド等のチウラムジスルフィド類などが挙げられる。中でも、アルキルジスルフィド類が好ましく、ジデシルジスルフィドがより好ましい。[Disulfide Compound I]
Among the components (e) used in the present invention, the disulfide compound I includes, for example, diethyl disulfide, dipropyl disulfide, diisopropyl disulfide, dibutyl disulfide, di-tert-butyl disulfide, dipentyl disulfide, diisopentyl disulfide, dihexyl disulfide , Dicyclohexyl disulfide, didecyl disulfide, di-tert-dodecyl disulfide, bis (2-hydroxyethyl) disulfide, bis (2,2-diethoxyethyl) disulfide, and other alkyl disulfides; diphenyl disulfide, ditolyl disulfide, dibenzyl Disulfide, 2,2'-dipyridyl disulfide, 2,2'-dibenzimidazolyl disulfide, 2,2'-dibenzothiazolyl disulfide含芳 incense ring disulfides of; tetramethyl thiuram disulfide, tetraethyl thiuram disulfide, tetrabutyl thiuram disulfide, thiuram disulfides such as di-pentamethylene thiuram disulfide and the like. Of these, alkyl disulfides are preferable, and didecyl disulfide is more preferable.
本発明の重合性組成物において(e)成分が配合される場合、前記(a)成分の100質量部に対して、(e)成分は0.01〜5質量部にて含むことが好ましく、より好ましくは0.1〜1質量部である。
なお本発明において、(e)成分はチオール化合物Hを一種単独で又は二種以上を混合して用いてよく、或いはジスルフィド化合物Iを一種単独で又は二種以上を混合して用いてよく、或いは一種以上のチオール化合物Hと一種以上のジスルフィド化合物Iとを混合して用いてもよい。(e)成分として複数種の化合物を用いる場合、上記配合量は用いた複数種の化合物の合計が上記の範囲となる。When (e) component is mix | blended in the polymeric composition of this invention, it is preferable to contain (e) component in 0.01-5 mass parts with respect to 100 mass parts of said (a) component, More preferably, it is 0.1-1 mass part.
In the present invention, as the component (e), the thiol compound H may be used alone or in combination of two or more, or the disulfide compound I may be used alone or in combination of two or more, or A mixture of one or more thiol compounds H and one or more disulfide compounds I may be used. When a plurality of types of compounds are used as the component (e), the total amount of the plurality of types of compounds used is within the above range.
<(f)重合開始剤>
本発明の重合性組成物には、上記(a)成分乃至(c)成分、又は上記(a)成分乃至(e)成分に加えて、(f)重合開始剤を含んでいてもよい。重合開始剤としては、熱重合開始剤及び光重合開始剤の何れも使用することができる。<(F) Polymerization initiator>
The polymerizable composition of the present invention may contain (f) a polymerization initiator in addition to the components (a) to (c) or the components (a) to (e). As the polymerization initiator, either a thermal polymerization initiator or a photopolymerization initiator can be used.
熱重合開始剤としては、例えば、アゾ類、有機過酸化物類等が挙げられる。
市販されているアゾ系熱重合開始剤としては、例えば、V−30、V−40、V−59、V−60、V−65、V−70[以上、和光純薬工業(株)製]等を挙げることができる。
また市販されている有機過酸化物系熱重合開始剤としては、例えば、パーカドックス(登録商標)CH、同BC−FF、同14、同16、トリゴノックス(登録商標)22、同23、同121、カヤエステル(登録商標)P、同O、カヤブチル(登録商標)B[以上、化薬アクゾ(株)製]、パーヘキサ(登録商標)HC、パークミル(登録商標)H、パーオクタ(登録商標)O、パーヘキシル(登録商標)O、同Z、パーブチル(登録商標)O、同Z[以上、日油(株)製]等を挙げることができるが、これらに限定されるものではない。Examples of the thermal polymerization initiator include azos and organic peroxides.
Examples of commercially available azo-based thermal polymerization initiators include V-30, V-40, V-59, V-60, V-65, and V-70 [above, manufactured by Wako Pure Chemical Industries, Ltd.] Etc.
Examples of commercially available organic peroxide thermal polymerization initiators include Parkadox (registered trademark) CH, BC-FF, 14, 16 and Trigonox (registered trademark) 22, 23, 121. , Kayaester (registered trademark) P, O, Kayabutyl (registered trademark) B [above, manufactured by Kayaku Akzo Co., Ltd.], Perhexa (registered trademark) HC, Parkmill (registered trademark) H, Perocta (registered trademark) O Perhexyl (registered trademark) O, Z, perbutyl (registered trademark) O, Z [above, manufactured by NOF Corporation] and the like, but is not limited thereto.
光重合開始剤としては、例えば、アルキルフェノン類、ベンゾフェノン類、アシルホスフィンオキシド類、ミヒラーのベンゾイルベンゾエート類、オキシムエステル類、テトラメチルチウラムモノスルフィド類、チオキサントン類等が挙げられる。
特に、光開裂型の光ラジカル重合開始剤が好ましい。光開裂型の光ラジカル重合開始剤については、最新UV硬化技術(159頁、発行人:高薄一弘、発行所:(株)技術情報協会、1991年発行)に記載されているものが挙げられる。
また市販されている光ラジカル重合開始剤としては、例えば、IRGACURE(登録商標)184、同369、同651、同500、同819、同907、同784、同2959、同CGI1700、同CGI1750、同CGI1850、同CG24−61、同TPO、Darocur(登録商標)1116、同1173[以上、BASFジャパン(株)製]、ESACURE KIP150、同KIP65LT、同KIP100F、同KT37、同KT55、同KTO46、同KIP75[以上、ランベルティ社製]等を挙げることができる。Examples of the photopolymerization initiator include alkylphenones, benzophenones, acylphosphine oxides, Michler's benzoylbenzoates, oxime esters, tetramethylthiuram monosulfides, and thioxanthones.
In particular, photocleavable photoradical polymerization initiators are preferred. Examples of the photocleavable photoradical polymerization initiator include those described in the latest UV curing technology (p. 159, publisher: Kazuhiro Takahisa, publisher: Technical Information Association, published in 1991). .
Examples of commercially available radical photopolymerization initiators include IRGACURE (registered trademark) 184, 369, 651, 500, 819, 907, 784, 2959, CGI 1700, CGI 1750, CGI1850, CG24-61, TPO, Darocur (registered trademark) 1116, 1173 [above, manufactured by BASF Japan Ltd.], ESACURE KIP150, KIP65LT, KIP100F, KT37, KT55, KTO46, KIP75 [Above, manufactured by Lamberti Co., Ltd.].
重合開始剤を添加する場合、重合開始剤は一種単独で、又は二種以上を混合して用いてもよい。また、その添加量としては、(a)反応性シリコーン化合物100質量部に対して0.1〜20質量部、さらに好ましくは0.3〜10質量部である。 When adding a polymerization initiator, you may use a polymerization initiator individually by 1 type or in mixture of 2 or more types. Moreover, as the addition amount, it is 0.1-20 mass parts with respect to 100 mass parts of (a) reactive silicone compound, More preferably, it is 0.3-10 mass parts.
<(g)希釈剤>
本発明の重合性組成物には、重合性組成物のハンドリングを向上させる目的で、前述の(a)反応性シリコーン化合物、(b)(メタ)アクリレート化合物及び(c)ポリマー、又は上記(a)成分乃至(f)成分に加えて、(g)成分として、希釈剤を含んでいてもよい。前記希釈剤としては、重合性二重結合を有する基を少なくとも1つ有し、かつ、25℃における粘度が500mPa・s以下、より好ましくは100mPa・s以下の化合物を使用することが好ましい。<(G) Diluent>
In the polymerizable composition of the present invention, the aforementioned (a) reactive silicone compound, (b) (meth) acrylate compound and (c) polymer, or the above (a), for the purpose of improving the handling of the polymerizable composition. In addition to the components) to (f), a diluent may be included as the component (g). As the diluent, it is preferable to use a compound having at least one group having a polymerizable double bond and having a viscosity at 25 ° C. of 500 mPa · s or less, more preferably 100 mPa · s or less.
このような希釈剤としては、例えば、スチレン、ジビニルベンゼン等のビニル化合物;メチル(メタ)アクリレート、エチル(メタ)アクリレート、2,2,2−トリフルオロエチル(メタ)アクリレート、n−プロピル(メタ)アクリレート、イソプロピル(メタ)アクリレート、n−ブチル(メタ)アクリレート、sec−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、tert−ブチル(メタ)アクリレート、n−ヘキシル(メタ)アクリレート、n−オクチル(メタ)アクリレート、イソボルニル(メタ)アクリレート、アダマンチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、2−(ジシクロペンタニルオキシ)エチル(メタ)アクリレート、2−(ジシクロペンテニルオキシ)エチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、2−ヒドロキシ−3−フェノキシプロピル(メタ)アクリレート、エトキシ化フェニル(メタ)アクリレート、エトキシ化o−フェニルフェノール(メタ)アクリレート等の単官能(メタ)アクリレート類;エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、ジプロピレングリコールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、1,3−ブタンジオールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、プロポキシ化ネオペンチルグリコールジ(メタ)アクリレート、ネオペンチルグリコールモノ(ヒドロキシピバリン酸)エステルジ(メタ)アクリレート、3−メチル−1,5−ペンタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、2−(3−ヒドロキシ−2−メチルプロピル−2−イル)−5−エチル−5−ヒドロキシメチル−1,3−ジオキサンジ(メタ)アクリレート(ジオキサングリコールジ(メタ)アクリレートとも呼ぶ)、トリシクロ[5.2.1.02,6]デカンジメタノールジ(メタ)アクリレート等の二官能(メタ)アクリレート類;トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、エトキシ化トリメチロールプロパントリ(メタ)アクリレート、プロポキシ化トリメチロールプロパントリ(メタ)アクリレート、ペンタエリトリトールテトラ(メタ)アクリレート、エトキシ化ペンタエリトリトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ジペンタエリトリトールヘキサ(メタ)アクリレート等の三官能以上(メタ)アクリレート類などが挙げられる。Examples of such a diluent include vinyl compounds such as styrene and divinylbenzene; methyl (meth) acrylate, ethyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, n-propyl (meth) ) Acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, n-hexyl (meth) acrylate, n-octyl (Meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, 2- (dicyclopentanyloxy) ethyl (meth) acrylate 2- (dicyclopentenyloxy) ethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, ethoxylation Monofunctional (meth) acrylates such as phenyl (meth) acrylate and ethoxylated o-phenylphenol (meth) acrylate; ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene Glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate Relate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, neopentyl glycol mono (Hydroxypivalic acid) ester di (meth) acrylate, 3-methyl-1,5-pentanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2- (3-hydroxy-2-methylpropyl) -2-yl) -5-ethyl-5-hydroxymethyl-1,3-dioxane di (meth) acrylate (also referred to as dioxane glycol di (meth) acrylate), tricyclo [5.2.1.0 2,6 ] Bifunctional such as decanedimethanol di (meth) acrylate (Meth) acrylates; trimethylolethane tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) ) Acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate and other trifunctional or higher (meth) acrylates.
これらの中でも、単官能(メタ)アクリレート類、二官能(メタ)アクリレート類、三官能以上(メタ)アクリレート類の(メタ)アクリレート化合物が好ましく、ネオペンチルグリコールジ(メタ)アクリレートがより好ましい。 Among these, monofunctional (meth) acrylates, bifunctional (meth) acrylates, trifunctional or higher (meth) acrylate (meth) acrylate compounds are preferable, and neopentyl glycol di (meth) acrylate is more preferable.
希釈剤を添加する場合、希釈剤は一種単独で、又は二種以上を混合して用いてもよい。また、その添加量としては、(c)ポリマー100質量部に対して10〜300質量部、さらに好ましくは50〜200質量部である。 When adding a diluent, you may use a diluent individually by 1 type or in mixture of 2 or more types. Moreover, as the addition amount, it is 10-300 mass parts with respect to 100 mass parts of (c) polymers, More preferably, it is 50-200 mass parts.
<その他添加剤>
さらに、本発明の重合性組成物には、本発明の効果を損なわない限りにおいて、必要に応じて、反応性希釈剤、連鎖移動剤、酸化防止剤、紫外線吸収剤、界面活性剤、レベリング剤、消泡剤、密着性向上剤等のその他の成分を適宜添加してもよい。<Other additives>
Furthermore, in the polymerizable composition of the present invention, a reactive diluent, a chain transfer agent, an antioxidant, an ultraviolet absorber, a surfactant, and a leveling agent are added as necessary as long as the effects of the present invention are not impaired. Other components such as an antifoaming agent and an adhesion improver may be added as appropriate.
<重合性組成物の調製方法>
本実施の形態の重合性組成物の調製方法は、特に限定されない。調製法としては、例えば、(a)成分乃至(c)成分及び必要に応じて(d)成分乃至(g)成分を所定の割合で混合し、所望によりその他添加剤をさらに添加して混合し、均一な溶液とする方法、又はこれらの成分に加え更に慣用の溶剤を使用する方法等が挙げられる。<Method for Preparing Polymerizable Composition>
The method for preparing the polymerizable composition of the present embodiment is not particularly limited. As a preparation method, for example, the components (a) to (c) and, if necessary, the components (d) to (g) are mixed at a predetermined ratio, and other additives are further added as desired. , A method of forming a uniform solution, or a method of using a conventional solvent in addition to these components.
溶剤を使用する場合、重合性組成物における固形分の割合は、各成分が溶剤に均一に溶解している限りは特に限定はないが、例えば1〜50質量%であり、又は、1〜30質量%であり、又は1〜25質量%である。ここで固形分とは、重合性組成物の全成分から溶剤成分を除いたものである。 When using a solvent, the ratio of the solid content in the polymerizable composition is not particularly limited as long as each component is uniformly dissolved in the solvent, but is, for example, 1 to 50% by mass, or 1 to 30. % By mass or 1 to 25% by mass. Here, the solid content is obtained by removing the solvent component from all components of the polymerizable composition.
また、重合性組成物の溶液は、孔径が0.05〜5μmのフィルタなどを用いてろ過した後、使用することが好ましい。 In addition, the solution of the polymerizable composition is preferably used after being filtered using a filter having a pore size of 0.05 to 5 μm.
<<硬化物>>
本発明は、また上記重合性組成物を熱又は光重合して得られる硬化物に関する。
熱重合における加熱条件としては、特に限定されないが、通常、50〜300℃、1〜120分間の範囲から適宜選択される。また、加熱手段としては、特に限定されないが、例えば、ホットプレート、オーブン等が挙げられる。
光重合に用いる活性光線としては、例えば、紫外線、電子線、X線等が挙げられる。紫外線照射に用いる光源としては、太陽光線、ケミカルランプ、低圧水銀灯、高圧水銀灯、メタルハライドランプ、キセノンランプ、UV−LED等が使用できる。また、光重合後、必要に応じてポストベークを行うことにより、具体的にはホットプレート、オーブン等を用いて、通常、50〜300℃で1〜120分間加熱することにより重合を完結させることができる。<< cured product >>
The present invention also relates to a cured product obtained by heat or photopolymerization of the polymerizable composition.
Although it does not specifically limit as heating conditions in thermal polymerization, Usually, it selects suitably from the range of 50-300 degreeC and 1-120 minutes. Moreover, it does not specifically limit as a heating means, For example, a hotplate, oven, etc. are mentioned.
Examples of actinic rays used for photopolymerization include ultraviolet rays, electron beams, and X-rays. As a light source used for ultraviolet irradiation, sunlight, a chemical lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a UV-LED, or the like can be used. In addition, after the photopolymerization, post-bake is performed as necessary. Specifically, the polymerization is usually completed by heating at 50 to 300 ° C. for 1 to 120 minutes using a hot plate, an oven or the like. Can do.
本発明の硬化物は、波長589nmにおける屈折率が1.55以上と高いものであり、また、加熱による黄変及びクラックの発生が抑制され、寸法安定性を有するものであるから、硬化レリーフパターン材料、特に光学レンズ等の高屈折率樹脂レンズ用材料として有用である。 The cured product of the present invention has a refractive index as high as 1.55 or more at a wavelength of 589 nm, and also has a dimensional stability by suppressing yellowing and cracking due to heating. It is useful as a material for a high refractive index resin lens such as an optical lens.
<<成形体>>
本発明の重合性組成物は、例えば、圧縮成形(インプリント等)、注型、射出成形、ブロー成形などの慣用の成形法を使用することによって、硬化物の形成と並行して各種成形体を容易に製造することができる。こうして得られる成形体(例えば光学レンズ)も本発明の対象である。
成形体を製造する方法としては、例えば、下面モールド又は支持体と、上面モールドとの間に前述の本発明の重合性組成物を充填する工程、当該充填された組成物を加熱して熱重合する工程、熱重合物をモールドから離型する工程、を含む製造方法が好ましい。
上記加熱して熱重合する工程は、前述の<<硬化物>>に示す条件を適用して実施することができる。
このような方法によって製造された成形体は、カメラ用モジュールレンズとして好適に使用することができる。<< Molded Article >>
The polymerizable composition of the present invention can be formed into various molded products in parallel with the formation of a cured product by using a conventional molding method such as compression molding (imprinting, etc.), casting, injection molding, blow molding and the like. Can be easily manufactured. A molded body (for example, an optical lens) thus obtained is also an object of the present invention.
As a method for producing a molded body, for example, a step of filling the above-described polymerizable composition of the present invention between a lower surface mold or a support and an upper surface mold, and heating the filled composition for thermal polymerization. The manufacturing method including the step of performing and the step of releasing the thermal polymer from the mold is preferable.
The heating and thermal polymerization step can be performed by applying the conditions shown in the above << cured product >>.
The molded body produced by such a method can be suitably used as a camera module lens.
以下、実施例を挙げて、本発明をより具体的に説明するが、本発明は下記の実施例に限定されるものではない。
なお、実施例において、試料の調製及び物性の分析に用いた装置及び条件は、以下の通りである。EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to the following Example.
In the examples, the apparatus and conditions used for sample preparation and physical property analysis are as follows.
(1)1H NMRスペクトル
装置:日本電子(株)製 JNM−ECX300
測定溶媒:CDCl3
基準物質:テトラメチルシラン(0.00ppm)
(2)ゲル浸透クロマトグラフィー(GPC)
装置:(株)島津製作所製 GPCシステム
カラム:昭和電工(株)製 Shodex(登録商標)GPC KF−804L、GPC KF−803L
カラム温度:40℃
溶媒:テトラヒドロフラン
検出器:UV(254nm)
検量線:標準ポリスチレン
(3)ミックスローター
装置:アズワン(株)製 MRC−5
(4)撹拌脱泡機
装置:(株)シンキー製 自転・公転ミキサー あわとり練太郎(登録商標)ARE−310
(5)屈折率nD、アッベ数νD
装置:(株)アタゴ製 多波長アッベ屈折計DR−M4
測定温度:20℃
中間液:モノブロモナフタレン
(6)ヘーズ
装置:(有)東京電色製 分光式測色ヘーズメーターTC−1800H
リファレンス:空気
(7)リフロー炉
装置:(株)シンアペックス製 卓上型リフロー炉STR−3100
(8)光線透過率
装置:(株)島津製作所製 紫外可視分光光度計UV−3100(1) 1 H NMR spectrum apparatus: JNM-ECX300 manufactured by JEOL Ltd.
Measuring solvent: CDCl 3
Reference substance: Tetramethylsilane (0.00ppm)
(2) Gel permeation chromatography (GPC)
Apparatus: GPC system manufactured by Shimadzu Corporation Column: Shodex (registered trademark) GPC KF-804L, GPC KF-803L manufactured by Showa Denko K.K.
Column temperature: 40 ° C
Solvent: Tetrahydrofuran Detector: UV (254 nm)
Calibration curve: Standard polystyrene (3) Mix rotor Device: MRC-5 manufactured by AS ONE
(4) Agitating and defoaming machine: Rotating / revolving mixer manufactured by Shinky Co., Ltd. Nertaro Awatori (registered trademark) ARE-310
(5) Refractive index n D , Abbe number ν D
Apparatus: Multi-wavelength Abbe refractometer DR-M4 manufactured by Atago Co., Ltd.
Measurement temperature: 20 ° C
Intermediate liquid: Monobromonaphthalene (6) Haze Equipment: (Existing) Tokyo Denshoku spectrophotometric colorimetric haze meter TC-1800H
Reference: Air (7) Reflow Oven Device: Desktop Reflow Oven STR-3100, manufactured by Thin Apex Co., Ltd.
(8) Light transmittance device: UV-visible spectrophotometer UV-3100 manufactured by Shimadzu Corporation
また、略記号は以下の意味を表す。
BnA:ベンジルアクリレート[大阪有機化学工業(株)製 ビスコート#160]
BPEA:エトキシ化ビスフェノールAジアクリレート(エトキシ基4mol付加)[新中村化学工業(株)製 NKエステルA−BPE−4]
FDA:ビスアリールフルオレンジアクリレート[大阪ガスケミカル(株)製 オグソール(登録商標)EA−F5503]
HDDA:1,6−ヘキサンジオールジアクリレート[大阪有機化学工業(株)製 ビスコート#230]
NPGDA:ネオペンチルグリコールジアクリレート[日本化薬(株)製 KAYARAD(登録商標)NPGDA]
TMP3A:トリメチロールプロパントリアクリレート[新中村化学工業(株)製 NKエステルA−TMPT]
MS37:メタクリル酸メチル−スチレン共重合体[根上工業(株)製 MS3703、共重合モル比:メタクリル酸メチル/スチレン=30/70、Mw:36,000]
MS55:メタクリル酸メチル−スチレン共重合体[根上工業(株)製 MS5503、共重合モル比:メタクリル酸メチル/スチレン=50/50、Mw:40,000]
MS82:メタクリル酸メチル−スチレン共重合体[根上工業(株)製 MS8203、共重合モル比:メタクリル酸メチル/スチレン=80/20、Mw:40,000]
PS:ポリスチレン[根上工業(株)製 MS0103、Mw:32,000]Abbreviations represent the following meanings.
BnA: benzyl acrylate [Osaka Organic Chemical Co., Ltd. Viscoat # 160]
BPEA: Ethoxylated bisphenol A diacrylate (addition of 4 mol of ethoxy group) [NK Nakano Chemical Co., Ltd. NK ester A-BPE-4]
FDA: Bisaryl full orange acrylate [Ogsol (registered trademark) EA-F5503 manufactured by Osaka Gas Chemical Co., Ltd.]
HDDA: 1,6-hexanediol diacrylate [Biscoat # 230, manufactured by Osaka Organic Chemical Industry Co., Ltd.]
NPGDA: Neopentylglycol diacrylate [Kyarad (registered trademark) NPGDA manufactured by Nippon Kayaku Co., Ltd.]
TMP3A: Trimethylolpropane triacrylate [Shin Nakamura Chemical Co., Ltd. NK Ester A-TMPT]
MS37: methyl methacrylate-styrene copolymer [manufactured by Negami Kogyo Co., Ltd. MS3703, copolymerization molar ratio: methyl methacrylate / styrene = 30/70, Mw: 36,000]
MS55: Methyl methacrylate-styrene copolymer [manufactured by Negami Kogyo Co., Ltd. MS5503, copolymerization molar ratio: methyl methacrylate / styrene = 50/50, Mw: 40,000]
MS82: Methyl methacrylate-styrene copolymer [manufactured by Negami Kogyo Co., Ltd. MS8203, copolymerization molar ratio: methyl methacrylate / styrene = 80/20, Mw: 40,000]
PS: Polystyrene [manufactured by Negami Kogyo Co., Ltd. MS0103, Mw: 32,000]
[製造例1]反応性含フッ素シリコーン化合物(F−SC)の製造
凝縮器を備えた200mLのナス型フラスコに、ジフェニルシランジオール[東京化成工業(株)製]43.3g(0.200mol)、トリメトキシ(4−ビニルフェニル)シラン[信越化学工業(株)製]44.0g(0.196mol)、トリメトキシ(3,3,3−トリフルオロプロピル)シラン[信越化学工業(株)製]0.873g(0.004mol)、及びトルエン35gを仕込み、窒素バルーンを用いてフラスコ中の空気を窒素で置換した。この反応混合物を50℃に加熱後、水酸化バリウム一水和物[アルドリッチ社製]38mg(0.2mmol)を添加した。そのまま50℃で1時間撹拌した後、さらに85℃で5時間撹拌して脱アルコール縮合を行った。反応混合物を室温(およそ25℃)まで冷却し、孔径0.2μmのメンブレンフィルターを用いて不溶物を除去した。ロータリーエバポレーターを用いて、この反応混合物からトルエン及び副生成物のメタノールを50℃で減圧留去することで、無色透明油状物の反応性含フッ素シリコーン化合物74.9gを得た。
得られた反応性含フッ素シリコーン化合物の1H NMRスペクトルを図1に示す。また、GPCによるポリスチレン換算で測定される重量平均分子量Mwは1,400、分散度Mw(重量平均分子量)/Mn(数平均分子量)は1.3であった。[Production Example 1] Production of reactive fluorine-containing silicone compound (F-SC) In a 200 mL eggplant type flask equipped with a condenser, 43.3 g (0.200 mol) of diphenylsilanediol [manufactured by Tokyo Chemical Industry Co., Ltd.] , Trimethoxy (4-vinylphenyl) silane [Shin-Etsu Chemical Co., Ltd.] 44.0 g (0.196 mol), trimethoxy (3,3,3-trifluoropropyl) silane [Shin-Etsu Chemical Co., Ltd.] 0 .873 g (0.004 mol) and 35 g of toluene were charged, and the air in the flask was replaced with nitrogen using a nitrogen balloon. The reaction mixture was heated to 50 ° C., and 38 mg (0.2 mmol) of barium hydroxide monohydrate [manufactured by Aldrich] was added. The mixture was stirred at 50 ° C. for 1 hour as it was, and then further stirred at 85 ° C. for 5 hours to carry out dealcoholization condensation. The reaction mixture was cooled to room temperature (approximately 25 ° C.), and insoluble matters were removed using a membrane filter having a pore size of 0.2 μm. Using a rotary evaporator, toluene and by-product methanol were distilled off from the reaction mixture under reduced pressure at 50 ° C., thereby obtaining 74.9 g of a colorless, transparent oily reactive fluorine-containing silicone compound.
The 1 H NMR spectrum of the obtained reactive fluorine-containing silicone compound is shown in FIG. Moreover, the weight average molecular weight Mw measured by polystyrene conversion by GPC was 1,400, and dispersion degree Mw (weight average molecular weight) / Mn (number average molecular weight) was 1.3.
[製造例2]反応性シリコーン化合物(SC)の製造
凝縮器を備えた1Lのナス型フラスコに、ジフェニルシランジオール[東京化成工業(株)製]177g(0.80mol)、トリメトキシ(4−ビニルフェニル)シラン[信越化学工業(株)製]179g(0.80mol)、及びトルエン141gを仕込み、窒素バルーンを用いてフラスコ中の空気を窒素で置換した。この反応混合物を50℃に加熱後、水酸化バリウム一水和物[アルドリッチ社製]0.303g(1.6mmol)を添加し、さらに50℃で2日間撹拌して脱アルコール縮合を行った。反応混合物を室温(およそ25℃)まで冷却し、孔径0.2μmのメンブレンフィルターを用いて不溶物を除去した。ロータリーエバポレーターを用いて、この反応混合物からトルエン及び副生成物のメタノールを50℃で減圧留去することで、無色透明油状物の反応性シリコーン化合物305gを得た。
得られた反応性シリコーン化合物の1H NMRスペクトルを図2に示す。また、GPCによるポリスチレン換算で測定される重量平均分子量Mwは1,500、分散度Mw/Mnは1.3であった。[Production Example 2] Production of Reactive Silicone Compound (SC) Into a 1 L eggplant-shaped flask equipped with a condenser, 177 g (0.80 mol) of diphenylsilanediol [manufactured by Tokyo Chemical Industry Co., Ltd.], trimethoxy (4-vinyl) Phenyl) silane [manufactured by Shin-Etsu Chemical Co., Ltd.] 179 g (0.80 mol) and toluene 141 g were charged, and the air in the flask was replaced with nitrogen using a nitrogen balloon. This reaction mixture was heated to 50 ° C., 0.303 g (1.6 mmol) of barium hydroxide monohydrate [manufactured by Aldrich] was added, and the mixture was further stirred at 50 ° C. for 2 days for dealcohol condensation. The reaction mixture was cooled to room temperature (approximately 25 ° C.), and insoluble matters were removed using a membrane filter having a pore size of 0.2 μm. Using a rotary evaporator, toluene and by-product methanol were distilled off from this reaction mixture under reduced pressure at 50 ° C. to obtain 305 g of a colorless transparent oily reactive silicone compound.
The 1 H NMR spectrum of the obtained reactive silicone compound is shown in FIG. Moreover, the weight average molecular weight Mw measured by polystyrene conversion by GPC was 1,500, and dispersion degree Mw / Mn was 1.3.
[実施例1]重合性組成物の調製
(メタ)アクリレート化合物としてFDA 32.5質量部、及びBPEA 10質量部、ポリマーとしてMS82 3質量部、安定化剤として3,9−ビス(2−(3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ)−1,1−ジメチルエチル)−2,4,8,10−テトラオキソスピロ[5.5]ウンデカン[住友化学(株)製 SUMILIZER(登録商標)GA−80]0.5質量部、並びに希釈剤としてNPGDA 4.5質量部を、ミックスローターを使用して50℃で均一になるまで混合した(およそ24時間)。この混合物へ、反応性シリコーン化合物として実施例1で製造したF−SC 50質量部、硫黄化合物としてジデシルジスルフィド[東京化成工業(株)製]0.5質量部、並びに重合開始剤として2,4,4−トリメチルペンタン−2−イル=ペルオキシ−2−エチルヘキサノエート[日本油脂(株)製 パーオクタ(登録商標)O]3質量部を加え、均一になるまでおよそ30分間2000rpmで撹拌脱泡することで重合性組成物1を調製した。[Example 1] Preparation of polymerizable composition FDA 32.5 parts by mass as a (meth) acrylate compound and BPEA 10 parts by mass,
[実施例2乃至8、比較例1]
各組成を表1に記載のように変更した以外は実施例1と同様に操作し、重合性組成物2乃至9を調製した。[Examples 2 to 8, Comparative Example 1]
[実施例9乃至16、比較例2]硬化物の作製及び評価
[硬化物の作製]
表2に記載の重合性組成物を、800μm厚のシリコーンゴム製スペーサーとともに、離型処理したガラス基板2枚で挟み込んだ。この挟み込んだ重合性組成物を、130℃のオーブンで15分間加熱し、室温(およそ25℃)まで冷却後、硬化物をガラス基板から剥離することで、直径30mm、厚さ800μmの硬化物を作製した。
[光学特性評価]
得られた硬化物のD線(波長589nm)における屈折率nD、アッベ数νD及びヘーズ(HAZE)を測定した。また、得られた硬化物について、リフロー炉を用いた加熱試験前後の波長400nmの光線透過率をそれぞれ測定し、加熱による透過率の低下を評価した。なお、加熱試験は、1)260℃まで3分間で昇温、2)260℃で20秒間保持、3)50℃まで放冷、の3ステップを3回繰り返した。結果を表2に併せて示す。
[クラック耐性評価]
上記[硬化物の作製]に記載の方法に準じ、直径5mm、厚さ800μmの硬化物を作製した。この硬化物5つをリフロー炉で加熱し、加熱後にクラックの入った硬化物の数でクラック耐性を評価した。なお、加熱は、1)260℃まで3分間で昇温、2)260℃で20秒間保持、3)50℃まで放冷、の3ステップで行った。結果を表2に併せて示す。[Examples 9 to 16, Comparative Example 2] Production and evaluation of cured product [Production of cured product]
The polymerizable composition shown in Table 2 was sandwiched between two glass substrates subjected to release treatment together with a spacer made of silicone rubber having a thickness of 800 μm. The sandwiched polymerizable composition is heated in an oven at 130 ° C. for 15 minutes, cooled to room temperature (approximately 25 ° C.), and then the cured product is peeled off from the glass substrate, whereby a cured product having a diameter of 30 mm and a thickness of 800 μm is obtained. Produced.
[Optical characteristics evaluation]
The obtained cured product was measured for refractive index n D , Abbe number ν D and haze (HAZE) at D line (wavelength 589 nm). Moreover, about the obtained hardened | cured material, the light transmittance of wavelength 400nm before and behind the heating test using a reflow furnace was measured, respectively, and the fall of the transmittance | permeability by heating was evaluated. In the heating test, three steps of 1) heating up to 260 ° C. in 3 minutes, 2) holding at 260 ° C. for 20 seconds, and 3) cooling to 50 ° C. were repeated three times. The results are also shown in Table 2.
[Crack resistance evaluation]
A cured product having a diameter of 5 mm and a thickness of 800 μm was produced in accordance with the method described in [Production of Cured Product]. Five of these cured products were heated in a reflow furnace, and the crack resistance was evaluated by the number of cured products having cracks after heating. The heating was performed in three steps: 1) heating up to 260 ° C. over 3 minutes, 2) holding at 260 ° C. for 20 seconds, and 3) cooling to 50 ° C. The results are also shown in Table 2.
表2に示すように、本発明の重合性組成物から得られた硬化物(実施例9〜16)は、何れも、HAZE値が1未満と低く、また、光透過率が高く、かつ加熱の前後(260℃のはんだリフロー工程等)においてほとんど光透過率が変化しない(黄変しない)という非常に有利な耐熱黄変性を有していることが確認された。さらに、本発明の重合性組成物から得られた硬化物は、何れも、モノリシックレンズのサイズである直径5mm、厚さ800μmであっても、加熱後(260℃のはんだリフロー工程等)において全くクラックが発生せず、非常に優れたクラック耐性を有していることが確認された。
一方、特定のポリマーを添加しない硬化物(比較例2)にあっては、クラック耐性が低くはんだリフロー工程に耐えられないことが確認された。As shown in Table 2, all of the cured products (Examples 9 to 16) obtained from the polymerizable composition of the present invention had a low HAZE value of less than 1, a high light transmittance, and heating. It was confirmed that the film had very advantageous heat-resistant yellowing in which the light transmittance hardly changed (no yellowing) before and after (a solder reflow process at 260 ° C.). Furthermore, the cured products obtained from the polymerizable composition of the present invention are all monolithic lens sizes having a diameter of 5 mm and a thickness of 800 μm after heating (such as a solder reflow process at 260 ° C.). It was confirmed that no cracks were generated and the crack resistance was excellent.
On the other hand, it was confirmed that the cured product to which no specific polymer was added (Comparative Example 2) had low crack resistance and could not withstand the solder reflow process.
本発明の重合性組成物は、その硬化物が高解像度カメラモジュール用レンズに必要とされる高い屈折率及び低いアッベ数を有している。また、本発明の重合性組成物から得られる硬化物は、例えば260℃といったはんだリフロー工程での高温熱履歴においても黄変及びクラックを生じさせないという耐熱性を有しているものである。
このように、本発明の重合性組成物は、優れた光学活性及び耐熱性を兼ね備えた硬化物を得ることができることから、例えばキャスティング成形による厚いカメラ用モジュールレンズの材料として、特に好適に使用できる。The polymerizable composition of the present invention has a high refractive index and a low Abbe number that are required for the cured product of the lens for a high resolution camera module. Moreover, the hardened | cured material obtained from the polymeric composition of this invention has heat resistance which does not produce yellowing and a crack also in the high temperature heat history in a solder reflow process, such as 260 degreeC, for example.
As described above, the polymerizable composition of the present invention can obtain a cured product having both excellent optical activity and heat resistance, and thus can be used particularly suitably as a material for a thick camera module lens by, for example, casting molding. .
Claims (11)
(b)(メタ)アクリレート化合物1〜200質量部、及び
(c)5,000〜100,000の重量平均分子量を有し、式[3]で表されるモノマー単位と式[4]で表されるモノマー単位を、モル比で100:0〜20:80の割合で含むポリマー0.1〜50質量部
を含む重合性組成物。
Table with (b) (meth) acrylate compound 1-200 parts by weight, and (c) have a weight average molecular weight of 5,000 to 100,000 monomer units of formula represented by the formula [3] [4] A polymerizable composition containing 0.1 to 50 parts by mass of a polymer containing the monomer unit in a molar ratio of 100: 0 to 20:80 .
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