TW201339247A - Glass fiber composite resin substrate - Google Patents

Glass fiber composite resin substrate Download PDF

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TW201339247A
TW201339247A TW101148985A TW101148985A TW201339247A TW 201339247 A TW201339247 A TW 201339247A TW 101148985 A TW101148985 A TW 101148985A TW 101148985 A TW101148985 A TW 101148985A TW 201339247 A TW201339247 A TW 201339247A
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glass fiber
fiber composite
resin composition
curable resin
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Masatoshi Yuasa
Yuko Murakami
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Nippon Steel & Sumikin Chem Co
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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    • C08F230/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
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    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
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    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
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    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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    • C08J2383/07Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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Abstract

A glass fiber composite resin substrate comprising a curable resin composition and glass fibers, wherein the curable resin composition contains (A) a cage-type silsesquioxane resin having at least one functional group selected from the group consisting of (meth)acryloyol groups, glycidyl groups, and vinyl groups, (B) an unsaturated compound other than the aforementioned cage-type silsesquioxane resin, having two or more unsaturated functional groups selected from the group consisting of functional groups represented by the following general formulas (1) and (2): -R1-CR2=CH2 (1) -CR2=CH2 (2) [In formula (1), R1 represents a functional group selected from the group consisting of alkylene groups, alkylidene groups, and -OCO- groups, and in formulas (1) and (2), R2 independently represent a hydrogen atom or an alkyl group.], and (C) a curing catalyst, the amount of the cage-type silsesquioxane resin (A) being 5 to 90 mass % with respect to the total amount of the curable resin composition.

Description

玻璃纖維複合化樹脂基板 Glass fiber composite resin substrate

本發明係關於玻璃纖維複合化樹脂基板。 The present invention relates to a glass fiber composite resin substrate.

玻璃具有透明性、耐熱性、低熱膨脹性、化學安定性等優異特徵,過去以來,已廣泛利用作為鏡片、光碟、及顯示器基板等之光學玻璃,而有助於產業發展。近年來,隨著各種光學設備之輕量化,已檢討使比重大的光學玻璃薄型化且輕量化。然而,玻璃具有為對衝擊弱而容易破裂之缺點,由於若薄型化則會使其機械強度更降低,故有製造製程時因破裂造成良率下降之問題。 Glass has excellent characteristics such as transparency, heat resistance, low thermal expansion property, and chemical stability. In the past, optical glass, such as lenses, optical disks, and display substrates, has been widely used to contribute to industrial development. In recent years, with the lightening of various optical devices, it has been reviewed to reduce the thickness and weight of optical glass having a large specific gravity. However, glass has a drawback that it is easy to break due to weak impact, and if it is thinned, its mechanical strength is further lowered, so that there is a problem that the yield is lowered due to cracking during the manufacturing process.

因此,作為柔軟性與耐熱性優異,且以改善易破裂為目的之薄膜基板,於例如特開2004-50565號公報(專利文獻1)中記載有將以含有機基之金屬氧化物聚合物作為主成分之樹脂層層合於玻璃基板表面之薄膜片狀基板。然而,該薄膜片狀基板中由於使用板狀玻璃,故有難以進一步輕量化,且機械強度尚不充分之問題。 For this reason, as a film substrate which is excellent in flexibility and heat resistance and which is intended to be easy to be ruptured, for example, JP-A-2004-50565 (Patent Document 1) discloses that a metal oxide polymer containing a machine base is used. The resin layer of the main component is laminated on the film sheet substrate on the surface of the glass substrate. However, since the sheet-like glass is used in the film sheet substrate, it is difficult to further reduce the weight and the mechanical strength is not sufficient.

且,近年來基於輕量化或薄型化容易且加工性優異之觀點,作為可取代玻璃之光學構件,透明塑膠係受到矚目。該種透明塑膠列舉為聚甲基丙烯酸甲酯(PMMA)、脂環式聚烯烴、環氧樹脂、聚矽氧樹脂等,其中PMMA或脂環式聚烯烴由於具有特別優異之透明性故稱為有機玻璃,於光學鏡片或液晶顯示器之導光板、光碟等用途中被 大量使用。然而,相對於例如於可撓性基板上形成低電阻之透明電極而形成TFT等主動元件時至少需要300℃~350℃之溫度,PMMA等樹脂由於耐熱性比玻璃低故難以採用作為可撓性基板。再者,由該樹脂組成之材料由於線膨脹係數大,故與透明電極或TFT等元件材料之線膨脹係數差較大,會有出現起因於此所致之龜裂或斷線之問題。 In recent years, in view of the fact that it is easy to reduce the weight and thickness, and the workability is excellent, the transparent plastic is attracting attention as an optical member that can replace glass. The transparent plastic is exemplified by polymethyl methacrylate (PMMA), alicyclic polyolefin, epoxy resin, polyoxynoxy resin, etc., wherein PMMA or alicyclic polyolefin is called because of its excellent transparency. Plexiglass, used in optical lenses or liquid crystal display light guides, optical discs, etc. Use a lot. However, when forming an active element such as a TFT by forming a transparent electrode having a low resistance on a flexible substrate, for example, a temperature of at least 300 ° C to 350 ° C is required, and a resin such as PMMA is difficult to be used as a flexible one because heat resistance is lower than that of glass. Substrate. Further, since the material composed of the resin has a large coefficient of linear expansion, the linear expansion coefficient difference between the material of the element such as a transparent electrode or a TFT is large, and there is a problem that cracking or disconnection due to this occurs.

因此,作為改善材料之耐熱性及線膨脹係數之方法,已開發出使樹脂與玻璃纖維複合化之方法。例如,特開2004-231934號公報(專利文獻2)及特開2004-51960號公報(專利文獻3)中,分別記載使玻璃布等玻璃纖維與阿貝(Abbe’s)數或折射率接近前述玻璃纖維之環氧樹脂或丙烯酸酯樹脂等之硬化性樹脂複合化而得之複合化樹脂。 Therefore, as a method of improving the heat resistance and coefficient of linear expansion of a material, a method of combining a resin with a glass fiber has been developed. For example, JP-A-2004-231934 (Patent Document 2) and JP-A-2004-51960 (Patent Document 3) disclose that glass fibers such as glass cloth and Abbe's or refractive index are close to the glass. A composite resin obtained by compounding a curable resin such as an epoxy resin or an acrylate resin.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

專利文獻1:特開2004-50565號公報 Patent Document 1: JP-A-2004-50565

專利文獻2:特開2004-231934號公報 Patent Document 2: JP-A-2004-231934

專利文獻3:特開2004-51960號公報 Patent Document 3: JP-A-2004-51960

然而,本發明者發現如專利文獻2及3所記載之複合化樹脂,雖然對於達到250℃左右之熱之耐熱性稍獲改 善,但玻璃轉移溫度未達300℃,在玻璃轉移溫度以上之高溫下加熱由該種過去之複合化樹脂所成之基板時,其彈性模數下降而產生基板之膨脹或變形,故仍難以安定且均一地層合元件材料等無機物層。 However, the present inventors have found that the composite resin described in Patent Documents 2 and 3 is slightly modified in heat resistance to heat of about 250 ° C. Good, but the glass transition temperature is less than 300 ° C. When the substrate made of the past composite resin is heated at a high temperature above the glass transition temperature, the elastic modulus of the substrate is lowered to cause expansion or deformation of the substrate, so it is still difficult. An inorganic layer such as a component material is laminated in a stable and uniform manner.

本發明係鑑於上述過去技術既有之課題而完成者,其目的係提供一種具有高水準之耐熱性及透明性,且熱膨脹係數充分小之玻璃纖維複合化樹脂基板。 The present invention has been made in view of the problems of the prior art described above, and an object thereof is to provide a glass fiber composite resin substrate having a high level of heat resistance and transparency and having a sufficiently small thermal expansion coefficient.

本發明人等為達成上述目的而積極研究之結果,發現藉由使用由硬化性樹脂組成物與玻璃纖維所成之玻璃纖維複合化樹脂基板中,含有具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成群組選出之至少任一種基之特定籠型倍半矽氧烷樹脂、及具有兩個以上之含有碳-碳雙鍵之不飽和官能基之特定不飽和化合物及硬化觸媒,且前述籠型倍半矽氧烷樹脂之含量在特定範圍內之硬化性樹脂組成物作為前述硬化性樹脂組成物,可獲得具有高水準之耐熱性及透明性,且熱膨脹係數充分小的玻璃纖維複合化樹脂基板,因而完成本發明。 As a result of active research to achieve the above object, the present inventors have found that a glass fiber composite resin substrate composed of a curable resin composition and a glass fiber contains a (meth) acrylonitrile group and shrinkage. a specific cage type sesquiterpene oxide resin selected from the group consisting of a glyceryl group and a vinyl group, and a specific unsaturated compound having two or more unsaturated functional groups containing a carbon-carbon double bond and hardening A curable resin composition having a catalyst and a content of the cage sesquioxane resin in a specific range is used as the curable resin composition, and a high level of heat resistance and transparency can be obtained, and a thermal expansion coefficient is sufficiently small. The glass fiber composite resin substrate, thus completing the present invention.

亦即,本發明之玻璃纖維複合化樹脂基板係由硬化性樹脂組成物與玻璃纖維所成之玻璃纖維複合化樹脂基板,其中前述硬化性樹脂組成物含有(A)具有由(甲基)丙烯醯基、縮水甘油基及乙烯 基所組成之群組選出之至少一種基之籠型倍半矽氧烷樹脂,(B)具有兩個以上之由下述通式(1)~(2)表示之基所組成之群組選出之不飽和官能基之前述籠型倍半矽氧烷以外之不飽和化合物,-R1-CR2=CH2...(1) In other words, the glass fiber composite resin substrate of the present invention is a glass fiber composite resin substrate made of a curable resin composition and a glass fiber, wherein the curable resin composition contains (A) having (meth) propylene. a cage-type sesquiterpene oxide resin selected from the group consisting of a mercapto group, a glycidyl group and a vinyl group, and (B) having two or more of the following formulas (1) to (2) An unsaturated compound other than the aforementioned cage sesquioxane having an unsaturated functional group selected from the group consisting of -R 1 -CR 2 =CH 2 . . . (1)

-CR2=CH2...(2)〔式(1)中,R1表示由伸烷基、亞烷基及-OCO-基所組成之群組選出之任一者,且式(1)~(2)中,R2各獨立表示氫原子或烷基〕,及(C)硬化觸媒且前述(A)籠型倍半矽氧烷樹脂之含量相對於前述硬化性樹脂組成物全體為5~90質量%。 -CR 2 =CH 2 . . . (2) In the formula (1), R 1 represents any one selected from the group consisting of an alkylene group, an alkylene group and an -OCO- group, and in the formulae (1) to (2), each of R 2 The content of the (A) cage sesquioxane resin is 5 to 90% by mass based on the entire curable resin composition, and the (C) curing catalyst is independently represented by the hydrogen atom or the alkyl group.

至於前述本發明之玻璃纖維複合化樹脂基板,前述(A)籠型倍半矽氧烷樹脂較好為以下述通式(3)表示之籠型倍半矽氧烷樹脂,〔R3SiO3/2n〔R4SiO3/2m...(3){式(3)中,R3表示具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成之群組選出之基之有機基,R4表示由氫原子、碳數1~20之烴基、碳數1~20之烷氧基、及碳數 1~20之烷基矽氧基所組成之群組選出之任一者,n及m表示滿足以下述式(i)~(iii)表示之條件之整數,n≧1...(i) In the above-mentioned glass fiber composite resin substrate of the present invention, the (A) cage type sesquiterpene oxide resin is preferably a cage type sesquiterpene oxide resin represented by the following formula (3), [R 3 SiO 3 /2n [R 4 SiO 3/2 ] m . . . (3) In the formula (3), R 3 represents an organic group having a group selected from the group consisting of a (meth) acryl fluorenyl group, a glycidyl group, and a vinyl group, and R 4 represents a hydrogen atom and a carbon number. Any one selected from the group consisting of a hydrocarbon group of 1 to 20, an alkoxy group having 1 to 20 carbon atoms, and an alkyloxy group having 1 to 20 carbon atoms, and n and m are satisfied to satisfy the following formula (i) ~(iii) an integer representing the condition, n≧1. . . (i)

m≧0...(ii) m≧0. . . (ii)

n+m=h...(iii) n+m=h. . . (iii)

〔式(iii)中,h表示由8、10、12及14所組成之群組選出之整數〕,n及m分別為2以上時R3及R4可分別相同亦可不同}。 [In the formula (iii), h represents an integer selected from the group consisting of 8, 10, 12 and 14], and when n and m are each 2 or more, R 3 and R 4 may be the same or different.

又,本發明之玻璃纖維複合化樹脂基板,較好前述通式(3)中,n與m之比(n:m)為10:0~4:6,而且,以前述通式(3)表示之籠型倍半矽氧烷樹脂相對於前述(A)籠型倍半矽氧烷樹脂全體較好為50質量%以上。 Further, in the glass fiber composite resin substrate of the present invention, in the above formula (3), the ratio of n to m (n:m) is from 10:0 to 4:6, and the above formula (3) The cage-type sesquiterpene oxide resin is preferably 50% by mass or more based on the entire (A) cage sesquioxane resin.

且,本發明之玻璃纖維複合化樹脂基板,前述(B)不飽和化合物具有之前述不飽和官能基較好為由丙烯醯基、甲基丙烯醯基、烯丙基及乙烯基所組成之群組選出之至少一種基,而且,前述(B)不飽和化合物具有之前述不飽和官能基之數較好每一化合物分子為2~10個。 Further, in the glass fiber composite resin substrate of the present invention, the unsaturated functional group of the (B) unsaturated compound preferably has a group consisting of an acrylonitrile group, a methacryl group, an allyl group and a vinyl group. At least one group selected from the group, and the number of the aforementioned unsaturated functional groups of the (B) unsaturated compound is preferably from 2 to 10 per compound molecule.

另外,本發明之玻璃纖維複合化樹脂基板較好係將前述硬化性樹脂組成物含浸於前述玻璃纖維之後,使前述硬化性樹脂組成物硬化者。而且,前述硬化性樹脂組成物之硬化物與前述玻璃纖維之質量比(硬化物之質量:玻璃纖 維之質量)較好為20:80~70:30,厚度較好為0.03~0.5mm。 Moreover, it is preferable that the glass fiber composite resin substrate of the present invention is obtained by impregnating the above-mentioned glass fiber with the curable resin composition, and curing the curable resin composition. Further, the mass ratio of the cured product of the curable resin composition to the aforementioned glass fiber (the quality of the cured product: glass fiber The quality of the dimension is preferably from 20:80 to 70:30, and the thickness is preferably from 0.03 to 0.5 mm.

依據本發明可提供具有高水準之耐熱性及透明性、且熱膨脹係數充分小之玻璃纖維複合化樹脂基板。 According to the present invention, it is possible to provide a glass fiber composite resin substrate having a high level of heat resistance and transparency and having a sufficiently small thermal expansion coefficient.

以下,以較佳實施形態詳細說明本發明。本發明之玻璃纖維複合化樹脂基板為由硬化性樹脂組成物與玻璃纖維所組成之玻璃纖維複合化樹脂基板,其中前述硬化性樹脂組成物含有(A)具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成之群組選出之至少一種基之籠型倍半矽氧烷樹脂,(B)具有兩個以上之由以上述通式(1)表示之基、及以上述通式(2)表示之基所組成之群組選出之不飽和官能基之前述籠型倍半矽氧烷樹脂以外之不飽和化合物,及(C)硬化觸媒且前述(A)籠型倍半矽氧烷樹脂之含量相對於前述硬化性樹脂組成物全體為5~90質量%。 Hereinafter, the present invention will be described in detail with reference to preferred embodiments. The glass fiber composite resin substrate of the present invention is a glass fiber composite resin substrate composed of a curable resin composition and glass fibers, wherein the curable resin composition contains (A) a (meth) acrylonitrile group, a cage-type sesquiterpene oxide resin selected from the group consisting of a glycidyl group and a vinyl group, (B) having two or more groups represented by the above formula (1), and The compound (2) represents an unsaturated compound other than the above-mentioned cage sesquioxane resin selected from the group of unsaturated functional groups, and (C) a hardening catalyst and the aforementioned (A) cage half The content of the siloxane resin is 5 to 90% by mass based on the entire curable resin composition.

〈(A)籠型倍半矽氧烷樹脂〉 <(A) Cage sesquioxane resin>

本發明中,所謂籠型倍半矽氧烷樹脂係指完全封閉之多面體構造之倍半矽氧烷或前述多面體構造中之-Si-O-Si-鍵之一部分開裂之矽氧烷,亦可為以兩個以上之籠型倍半矽氧烷樹脂作為單體而聚合之寡聚物。本發明之籠型倍半矽氧烷樹脂具有由(甲基)丙烯醯基、縮水甘油基及乙烯基(以下依情況統稱為硬化性官能基)所組成群組選出之至少一種基。至於前述硬化性官能基較好直接或介隔二價有機基鍵結於配置在籠型倍半矽氧烷骨架之多面體頂點的矽原子上。前述二價有機基列舉為伸烷基、伸苯基。又,本發明中,所謂(甲基)丙烯醯基意指甲基丙烯醯基及丙烯醯基。 In the present invention, the cage sesquioxane resin refers to a sesquioxane having a completely closed polyhedral structure or a partially decomposed azepine of a -Si-O-Si- bond in the above polyhedral structure, or An oligomer polymerized by using two or more cage type sesquiterpene oxide resins as a monomer. The cage type sesquiterpene oxide resin of the present invention has at least one selected from the group consisting of a (meth) acrylonitrile group, a glycidyl group, and a vinyl group (hereinafter collectively referred to as a curable functional group). The aforementioned hardenable functional group is preferably bonded directly or via a divalent organic group to a ruthenium atom disposed at the apex of the polyhedron of the cage sesquiterpene skeleton. The aforementioned divalent organic group is exemplified by an alkyl group and a phenyl group. Further, in the present invention, the (meth)acryl fluorenyl group means a methacryl fluorenyl group and an acryl fluorenyl group.

本發明之籠型倍半矽氧烷樹脂,基於更提高硬化性樹脂組成物之交聯密度,且更提高玻璃纖維複合化樹脂基板之耐熱性之傾向之觀點而言,較好於籠型倍半矽氧烷骨架之多面體頂點全部鍵結前述硬化性官能基,且分子量分佈及分子構造獲得控制,但前述硬化性官能基中之一部分亦可置換為烷基、苯基等之其他基。前述硬化性官能基中之一部分置換為其他基時,就避免交聯密度下降之觀點而言,本發明之籠型倍半矽氧烷樹脂中之前述硬化性官能基與前述其他基之莫耳比(〔硬化性官能基之平均莫耳數〕:〔其他基之平均莫耳數〕)較好為10:0~6:4。又,本發明中,前述籠型倍半矽氧烷樹脂中之硬化性官能基之數與其他基之數的比可由使用1H-NMR(儀器名:JNM-ECA400(日本電子股份有限公司製造)、溶劑:氯 仿-d、溫度:22.7℃、400MHz)測定之硬化性官能基及其他基之波峰的積分比求得。 The cage type sesquioxane resin of the present invention is preferably a cage type based on the viewpoint of further increasing the crosslinking density of the curable resin composition and further improving the heat resistance of the glass fiber composite resin substrate. The apex of the polyhedral skeleton of the hemidecane skeleton is all bonded to the curable functional group, and the molecular weight distribution and molecular structure are controlled. However, one of the curable functional groups may be replaced with another group such as an alkyl group or a phenyl group. When one of the hardening functional groups is partially substituted with another group, the aforementioned curable functional group in the cage sesquioxane resin of the present invention and the aforementioned other moir are used from the viewpoint of avoiding a decrease in crosslinking density. The ratio ([the average number of moles of the curable functional group]: [the average number of moles of the other groups]) is preferably from 10:0 to 6:4. Further, in the present invention, the ratio of the number of the curable functional groups in the cage sesquioxane resin to the number of other groups can be 1 H-NMR (instrument name: JNM-ECA400 (manufactured by JEOL Ltd.) ), Solvent: chloroform-d, temperature: 22.7 ° C, 400 MHz) The integrated ratio of the curable functional groups and the peaks of other groups was determined.

又,本發明之籠型倍半矽氧烷樹脂,為了形成具有剛直構造之交聯構造,基於更提高所得玻璃纖維複合化樹脂基板之耐熱性,且更減小熱膨脹係數之傾向之觀點而言,較好為以下述通式(3)表示之封閉多面體構造之籠型倍半矽氧烷樹脂。 Further, in the case of forming a crosslinked structure having a rigid structure, the cage sesquioxane resin of the present invention is based on the viewpoint of further improving the heat resistance of the obtained glass fiber composite resin substrate and further reducing the thermal expansion coefficient. It is preferably a cage sesquiterpene oxide resin having a closed polyhedral structure represented by the following general formula (3).

〔R3SiO3/2n〔R4SiO3/2m...(3) [R 3 SiO 3/2 ] n [R 4 SiO 3/2 ] m . . . (3)

前述式(3)中,R3表示具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成之群組選出之任一種基之有機基。該有機基列舉為(甲基)丙烯醯基;縮水甘油基;乙烯基;(甲基)丙烯醯基、縮水甘油基或乙烯基與伸烷基、伸苯基等二價烴基鍵結之基。前述伸烷基可為直鏈狀亦可為分支鏈狀,基於鍵結距離短,則有更提高所得玻璃纖維複合化樹脂基板之耐熱性之傾向之觀點而言,碳數較好為1~3。前述伸苯基列舉為例如未取代之伸苯基、具有低級烷基之1,2-伸苯基等。該等中,前述二價烴基就原料取得容易之觀點而言,更好為碳數1~3之伸烷基,就獲得更高交聯密度之玻璃纖維複合化樹脂基板之觀點而言,較好為伸丙基。 In the above formula (3), R 3 represents an organic group having any one selected from the group consisting of a (meth) acryl fluorenyl group, a glycidyl group, and a vinyl group. The organic group is exemplified by a (meth) acrylonitrile group; a glycidyl group; a vinyl group; a (meth) acryl fluorenyl group, a glycidyl group or a vinyl group bonded to a divalent hydrocarbon group such as an alkylene group or a phenyl group; . The alkylene group may be linear or branched, and the carbon number is preferably 1 to 1 because the bonding distance is short and the heat resistance of the glass fiber composite resin substrate is further improved. 3. The above-mentioned phenylene group is exemplified by, for example, an unsubstituted phenyl group, a 1,2-phenyl group having a lower alkyl group, and the like. In the above, the divalent hydrocarbon group is more preferably an alkylene group having 1 to 3 carbon atoms from the viewpoint of obtaining a raw material, and a glass fiber composite resin substrate having a higher crosslinking density. Good for stretching propyl.

又,R3具體而言列舉為甲基丙烯氧基丙基、縮水甘油氧基丙基、環氧基環己基,其中就原料取得容易且聚合反 應性高之觀點而言,較好為甲基丙烯醯氧基丙基。 Further, R 3 is specifically a methacryloxypropyl group, a glycidoxy propyl group or an epoxycyclohexyl group, and among them, a methyl group is preferred because the raw material is easily obtained and the polymerization reactivity is high. Acryloxypropyl.

前述式(3)中,R4表示由氫原子、碳數1~20之烴基、碳數1~20之烷氧基及碳數1~20之烷基矽氧基所組成群組選出之任一種。前述碳數1~20之烴基可為直鏈狀亦可為分支鏈狀,亦可為環狀,列舉為碳數1~20之烷基、碳數3~20之環烷基、碳數3~20之環烯基、苯基、苯乙烯基。前述碳數1~20之烷基可為直鏈狀亦可為分支鏈狀,就容易獲得籠型倍半矽氧烷之骨架之觀點而言,較好為碳數2~10之鏈狀烷基。前述碳數3~20之環烷基列舉為例如環丁基、環戊基、環己基、環庚基、環辛基、環己基等,其中就取得容易之觀點而言,較好為環己基。前述碳數3~20之環烯基列舉為例如環戊烯基、環己烯基等,其中,就取得容易之觀點而言,以環戊烯基較佳。另外,前述碳數1~20之烷氧基列舉為例如甲氧基、乙氧基、異丙基等,其中,就提高反應性之觀點而言,以甲氧基較佳。再者,前述碳數1~20之烷基矽氧基列舉為三甲基矽氧基、三乙基矽氧基、三苯基矽氧基、二甲基矽氧基、第三丁基二甲基矽氧基等。該等中,就容易獲得籠型倍半矽氧烷骨架之觀點而言,R4更好為碳數2~10之烷基、苯基。 In the above formula (3), R 4 represents a group selected from the group consisting of a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and an alkyloxy group having 1 to 20 carbon atoms. One. The hydrocarbon group having 1 to 20 carbon atoms may be linear or branched, or may be cyclic, and is exemplified by an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, and a carbon number of 3. ~20 cycloalkenyl, phenyl, styryl. The alkyl group having 1 to 20 carbon atoms may be linear or branched, and from the viewpoint of easily obtaining a skeleton of the cage sesquiterpene oxide, a chain alkane having 2 to 10 carbon atoms is preferred. base. The cycloalkyl group having 3 to 20 carbon atoms is exemplified by, for example, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclohexyl group, etc., and among them, a cyclohexyl group is preferred from the viewpoint of easiness. . The cycloalkenyl group having 3 to 20 carbon atoms is exemplified by, for example, a cyclopentenyl group or a cyclohexenyl group. Among them, a cyclopentenyl group is preferred from the viewpoint of availability. Further, the alkoxy group having 1 to 20 carbon atoms is exemplified by, for example, a methoxy group, an ethoxy group, an isopropyl group or the like. Among them, a methoxy group is preferred from the viewpoint of improving reactivity. Further, the alkyl decyloxy group having 1 to 20 carbon atoms is exemplified by trimethyl decyloxy group, triethyl decyloxy group, triphenyl decyloxy group, dimethyl decyloxy group, and tert-butyl group. Methyl decyloxy and the like. In the above, from the viewpoint of easily obtaining a cage sesquiterpene skeleton, R 4 is more preferably an alkyl group having 2 to 10 carbon atoms or a phenyl group.

再者,前述式(3)中,n及m表示滿足以下述式(i)~(iii)表示之條件之整數,n≧1...(i) Further, in the above formula (3), n and m represent integers satisfying the conditions expressed by the following formulas (i) to (iii), n ≧ 1. . . (i)

m≧0...(ii) m≧0. . . (ii)

n+m=h...(iii) n+m=h. . . (iii)

〔式(iii)中,h表示由8、10、12及14所組成之群組選出之整數〕。藉由使n滿足以前述式(i)表示之條件,本發明之籠型倍半矽氧烷樹脂由於具有一個以上之硬化性官能基,故藉由與本發明之(B)不飽和化合物進行自由基聚合,可獲得具有高水準之耐熱性及透明性、且熱膨脹係數充分小的玻璃纖維複合化樹脂基板。且,藉由使n及m滿足以前述式(iii)表示之條件,使本發明之籠型倍半矽氧烷樹脂幾乎完全縮合成為籠型構造,且由於利用由自由基聚合而形成具有剛直構造之交聯構造,故玻璃纖維複合化樹脂基板可達成高水準之耐熱性及透明性以及充分小的熱膨脹係數。又,n及m分別為2以上時R3及R4可彼此相同亦可不同。 [in the formula (iii), h represents an integer selected from the group consisting of 8, 10, 12 and 14]. By satisfying the condition expressed by the above formula (i), the cage type sesquiterpene oxide resin of the present invention has at least one hardening functional group, and is carried out by the (B) unsaturated compound of the present invention. By radical polymerization, a glass fiber composite resin substrate having a high level of heat resistance and transparency and having a sufficiently small thermal expansion coefficient can be obtained. Further, by satisfying the conditions expressed by the above formula (iii), n and m satisfy the condition that the cage type sesquiterpene oxide resin of the present invention is almost completely condensed into a cage structure, and is formed by radical polymerization. Since the structure of the crosslinked structure is structured, the glass fiber composite resin substrate can achieve high level of heat resistance and transparency and a sufficiently small coefficient of thermal expansion. Further, when n and m are each 2 or more, R 3 and R 4 may be the same or different from each other.

又,本發明之籠型倍半矽氧烷樹脂中,n及m之比(n:m)較好為10:0~4:6,更好為10:0~5:5。相對於n之m的數超過前述上限時,會有玻璃纖維複合化樹脂基板之交聯密度減少、耐熱性降低且熱膨脹係數變大之傾向。 Further, in the cage type sesquioxane resin of the present invention, the ratio of n to m (n: m) is preferably from 10:0 to 4:6, more preferably from 10:0 to 5:5. When the number of m of n exceeds the above upper limit, the crosslinking density of the glass fiber composite resin substrate tends to decrease, the heat resistance decreases, and the thermal expansion coefficient tends to increase.

又,本發明中,n與m之比(n:m),亦即,鍵結於前述籠型半倍係氧烷樹脂之多面體頂點之硬化性官能基之數與其他基之數之比可藉與前述相同之方法求得。 Further, in the present invention, the ratio of n to m (n: m), that is, the ratio of the number of hardening functional groups bonded to the apex of the polyhedron of the above-mentioned cage type hemi-oxyalkylene resin to the number of other groups may be It is obtained by the same method as described above.

又,本發明之籠型倍半矽氧烷樹脂,為了形成具有剛直構造之交聯構造,基於更提高所得玻璃纖維複合化樹脂 基板之耐熱性,更減小熱膨脹係數之傾向之觀點而言,以前述式(3)表示之籠型倍半矽氧烷樹脂相對於本發明之籠型倍半矽氧烷樹脂全體較好為50質量%以上,更好為70質量%以上。 Further, in the cage type sesquioxane resin of the present invention, in order to form a crosslinked structure having a rigid structure, the obtained glass fiber composite resin is further improved. The cage type sesquiterpene oxide resin represented by the above formula (3) is preferably the same as the cage type sesquiterpene oxide resin of the present invention from the viewpoint of the heat resistance of the substrate and the tendency to further reduce the coefficient of thermal expansion. 50% by mass or more, more preferably 70% by mass or more.

獲得此籠型倍半矽氧烷樹脂之方法可例如藉由在水、有機極性溶劑及鹼性觸媒存在下,使以下述通式(4)表示之矽化合物(a),及視需要之以下述通式(5)表示之矽化合物(b)水解而獲得:R3SiX3...(4) The method for obtaining the cage-type sesquiterpene oxide resin can be carried out, for example, by using the hydrazine compound (a) represented by the following formula (4) in the presence of water, an organic polar solvent and a basic catalyst, and optionally The hydrazine compound (b) represented by the following formula (5) is hydrolyzed to obtain: R 3 SiX 3 . . . (4)

〔式(4)中,R3與上述通式(3)中之R3同義,X表示由烷氧基、乙醯氧基、鹵原子及羥基所組成群組選出之任一種之水解性基〕,R4SiX3...(5) [Formula (4), R 3 in the general formula (3) in the same meaning as R 3, X represents any one of the alkoxy group, an acetyl group, a halogen atom and a hydroxy group consisting of hydrolyzable group selected ], R 4 SiX 3 . . . (5)

〔式(5)中,R4與上述通式(3)中之R4同義,X與上述通式(4)中之X同義〕。 [In the formula (5), R 4 in the general formula (3) in the same meaning as R 4, X is synonymous with X in the general formula (4)] of.

前述式(4)及(5)中,X各獨立為由烷氧基、乙醯氧基、鹵原子及羥基所組成群組選出之水解性基。前述水解性基較好為烷氧基。前述烷氧基列舉為甲氧基、乙氧基、正-及異-丙氧基、正-、異-及第三丁氧基等,就提高反應性之觀點而言,以甲氧基較佳。 In the above formulae (4) and (5), each of X is independently a hydrolyzable group selected from the group consisting of an alkoxy group, an ethenyloxy group, a halogen atom and a hydroxyl group. The hydrolyzable group is preferably an alkoxy group. The alkoxy group is exemplified by a methoxy group, an ethoxy group, a n- and an iso-propoxy group, a n-, an iso- and a tert-butoxy group, and the like, in terms of improving the reactivity, a methoxy group is used. good.

前述矽化合物(a)列舉為例如甲基丙烯醯氧基甲基三乙氧基矽烷、甲基丙烯醯氧基甲基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、烯丙基三甲氧基矽烷、烯丙基三乙氧基矽烷、對-苯乙烯基三甲氧基矽烷、對-苯乙烯基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷。該等中,就原料取得容易之觀點而言,前述矽化合物(a)較好為3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷。又,前述矽化合物(a)可單獨使用一種,亦可組合兩種以上使用。 The above hydrazine compound (a) is exemplified by, for example, methacryloxymethyltriethoxydecane, methacryloxymethyltrimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane. , 3-methacryloxypropyltriethoxydecane, 3-propenyloxypropyltrimethoxydecane, allyltrimethoxydecane, allyltriethoxydecane, p-benzene Vinyl trimethoxy decane, p-styryl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, 3-glycidoxy propyl trimethoxy decane, 3-glycidol Oxypropyl triethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane. Among these, the ruthenium compound (a) is preferably 3-methylpropenyloxypropyltrimethoxydecane or 3-propenyloxypropyltrimethoxydecane from the viewpoint of easy availability of the raw material. Further, the ruthenium compound (a) may be used alone or in combination of two or more.

前述矽化合物(b)列舉為例如苯基三甲氧基矽烷、苯基三乙氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷、正丙基三甲氧基矽烷、正丙基三乙氧基矽烷、正丁基三甲氧基矽烷、正丁基三乙氧基矽烷、第三丁基三甲氧基矽烷、第三丁基三乙氧基矽烷、正辛基三甲氧基矽烷、正辛基三乙氧基矽烷等。且,前述矽化合物(b)可單獨使用一種,亦可組合兩種以上使用。 The above hydrazine compound (b) is exemplified by, for example, phenyltrimethoxydecane, phenyltriethoxydecane, methyltrimethoxydecane, ethyltrimethoxydecane, n-propyltrimethoxydecane, n-propyltri Ethoxy decane, n-butyl trimethoxy decane, n-butyl triethoxy decane, tert-butyl trimethoxy decane, tert-butyl triethoxy decane, n-octyl trimethoxy decane, positive Octyl triethoxy decane, and the like. Further, the above-mentioned hydrazine compound (b) may be used alone or in combination of two or more.

前述矽化合物(a)及前述矽化合物(b)之混合比,以混合莫耳比(a:b)較好滿足以下述式(vi)表示之條件, a:b=n:m...(vi) The mixing ratio of the hydrazine compound (a) and the hydrazine compound (b) preferably satisfies the conditions expressed by the following formula (vi) with a mixed molar ratio (a: b). a:b=n:m. . . (vi)

〔式(vi)中,n及m係與上述式(3)中之n及m同義〕。 [In the formula (vi), n and m are synonymous with n and m in the above formula (3)].

前述水只要是使前述矽化合物(a)及(b)之水解性基水解之充分質量以上即可,較好為相當於由前述矽化合物(a)及(b)之質量算出之水解性基之數的理論量(莫耳)之1.0~1.5倍莫耳之質量。又,前述水可直接使用後述之鹼性觸媒之水溶液中所含有之水。 The water may be at least a sufficient mass to hydrolyze the hydrolyzable groups of the ruthenium compounds (a) and (b), and is preferably a hydrolyzable group calculated from the mass of the ruthenium compounds (a) and (b). The theoretical quantity of the number (mole) is 1.0 to 1.5 times the mass of the mole. Further, the water may be directly used as the water contained in the aqueous solution of the alkaline catalyst described later.

前述有機極性溶劑列舉為甲醇、乙醇、2-丙醇等醇類;丙酮;四氫呋喃等,可單獨使用該等中之一種,亦可組合兩種以上使用。其中,就有效形成籠型倍半矽氧烷骨架之觀點而言,較好使用與水具溶解性之碳數1~6之低級醇類,更好使用2-丙醇。 The organic polar solvent is exemplified by an alcohol such as methanol, ethanol or 2-propanol; acetone; tetrahydrofuran or the like, and one of these may be used alone or in combination of two or more. Among them, from the viewpoint of effectively forming a cage type sesquiterpene skeleton, it is preferred to use a lower alcohol having a carbon number of 1 to 6 which is soluble in a water tool, and it is preferable to use 2-propanol.

前述鹼性觸媒列舉為氫氧化鉀、氫氧化鈉、氫氧化銫等之鹼金屬氫氧化物;氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丁基銨、氫氧化苄基三甲基銨、氫氧化苄基三乙基銨等之氫氧化銨鹽。本發明之鹼性觸媒可單獨使用該等中之一種,亦可組合兩種以上使用。其中,就提高觸媒活性之觀點而言,較好使用氫氧化四甲基銨。該鹼性觸媒之量相對於前述矽化合物(a)及(b)之合計質量較好為0.1~10質量%。又,前述鹼性觸媒通常以水溶液使用,故亦可使用該鹼性觸媒之水溶液中所含有之水作為前述水。 The alkaline catalyst is exemplified by an alkali metal hydroxide such as potassium hydroxide, sodium hydroxide or barium hydroxide; tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide or benzyl hydroxide; An ammonium hydroxide salt such as trimethylammonium or benzyltriethylammonium hydroxide. The alkaline catalyst of the present invention may be used alone or in combination of two or more. Among them, tetramethylammonium hydroxide is preferably used from the viewpoint of improving the activity of the catalyst. The amount of the basic catalyst is preferably from 0.1 to 10% by mass based on the total mass of the above ruthenium compounds (a) and (b). Further, since the alkaline catalyst is usually used in an aqueous solution, water contained in an aqueous solution of the basic catalyst may be used as the water.

前述水解中,反應時間較好為2小時以上,反應溫度較好為0~50℃,更好為20~40℃。前述反應時間及反應溫度未達前述下限時,會有水解性基以未反應之狀態殘留之傾向。另外,反應溫度超過前述上限時,由於反應速度過快而進行複雜之縮合反應,結果促進了水解產物之高分子量化故而不佳。 In the above hydrolysis, the reaction time is preferably 2 hours or more, and the reaction temperature is preferably 0 to 50 ° C, more preferably 20 to 40 ° C. When the reaction time and the reaction temperature are not at the lower limit, the hydrolyzable group tends to remain in an unreacted state. Further, when the reaction temperature exceeds the above upper limit, a complicated condensation reaction is carried out because the reaction rate is too fast, and as a result, the polymerization of the hydrolyzed product is promoted, which is not preferable.

以該方法可獲得含有本發明之籠型倍半矽氧烷樹脂之反應組成物。又,該反應組成物中,除本發明之籠型倍半矽氧烷樹脂(完全縮合籠型倍半矽氧烷樹脂(例如以前述式(3)表示之樹脂)、一部分開裂籠型倍半矽氧烷樹脂)以外,亦含有複數種梯型倍半矽氧烷樹脂、無規型倍半矽氧烷樹脂等作為反應副產物。該反應組成物中,本發明之籠型倍半矽氧烷樹脂之含量,就直接使用反應組成物作為本發明之硬化性樹脂組成物之原料之觀點而言,相對於前述反應組成物全體較好為50質量%以上。又,所得籠型倍半矽氧烷樹脂中,以前述式(3)表示之籠型倍半矽氧烷樹脂之含量,相對於前述籠型倍半矽氧烷樹脂全體較好為50質量%以上,更好為70質量%以上。 A reaction composition containing the cage type sesquiterpene oxide resin of the present invention can be obtained by this method. Further, in the reaction composition, in addition to the cage type sesquiterpene oxide resin of the present invention (completely condensed cage type sesquiterpene oxide resin (for example, the resin represented by the above formula (3)), a part of the cracking cage type half In addition to the decane resin, a plurality of ladder type sesquiterpene alkane resins and a random sesquioxane resin are also included as reaction by-products. In the reaction composition, the content of the cage sesquioxane resin of the present invention is directly compared with the above-mentioned reaction composition from the viewpoint of directly using the reaction composition as a raw material of the curable resin composition of the present invention. It is preferably 50% by mass or more. In addition, the content of the cage sesquioxane resin represented by the above formula (3) in the obtained cage sesquioxane resin is preferably 50% by mass based on the entire cage sesquioxane resin. The above is more preferably 70% by mass or more.

又,本發明中,組成物中之本發明籠型倍半矽氧烷樹脂之合計含量,及以前述式(3)表示之籠型倍半矽氧烷樹脂之含量,可由組成物之液體層析質量分析(LC-MS,HPLC:Agilent 1100 Series Systems(Agilent Technology公司製造),MS:QSTARR XL Hybrid LC/MS/MS System(AB SCIEX公司製造),管柱:SunFire C18管柱,移動 相:H2O-CH3CN(30-70),速度:1ml/min,溫度:40℃,檢測器:UV(254nm))求得之籠型倍半矽氧烷樹脂之構造,及由以凝膠滲透層析儀(儀器名:HLC-8320GPC(TOSOH公司製造),溶劑:THF,管柱:超高速SemiMicro SEC管柱SuperH系列,溫度:40℃,速度:0.6ml/min)測定之分子量(數平均分子量)求得。 Further, in the present invention, the total content of the cage type sesquioxane resin of the present invention in the composition, and the content of the cage sesquioxane resin represented by the above formula (3) may be a liquid layer of the composition. Analytical mass analysis (LC-MS, HPLC: Agilent 1100 Series Systems (manufactured by Agilent Technology), MS: QSTAR R XL Hybrid LC/MS/MS System (manufactured by AB SCIEX), column: SunFire C18 column, mobile phase :H 2 O-CH 3 CN (30-70), speed: 1 ml/min, temperature: 40 ° C, detector: UV (254 nm)) The structure of the cage sesquioxane resin was obtained, and Gel permeation chromatography instrument (instrument name: HLC-8320GPC (manufactured by TOSOH), solvent: THF, column: super high speed SemiMicro SEC column SuperH series, temperature: 40 ° C, speed: 0.6 ml / min) (number average molecular weight) is obtained.

本發明中可單獨使用該籠型倍半矽氧烷樹脂中之一種,亦可組合兩種以上使用。 In the present invention, one of the cage sesquioxaxane resins may be used alone or in combination of two or more.

〈(B)不飽和化合物〉 <(B) Unsaturated Compound>

本發明之不飽和化合物為具有兩個以上由以下述通式(1)~(2)表示之基所組成群組選出之不飽和官能基之前述籠型倍半矽氧烷樹脂以外之化合物,-R1-CR2=CH2...(1) The unsaturated compound of the present invention is a compound other than the above-mentioned cage sesquiterpene oxide resin having two or more unsaturated functional groups selected from the group consisting of the groups represented by the following general formulae (1) to (2). -R 1 -CR 2 =CH 2 . . . (1)

-CR2=CH2...(2) -CR 2 =CH 2 . . . (2)

〔式(1)中,R1表示由伸烷基、亞烷基及-OCO-基所組成群組選出之任一種,式(1)~(2)中,R2各獨立表示氫原子或烷基〕。且自以前述式(2)表示之基所含之基中排除以前述式(1)表示之基。 [In the formula (1), R 1 represents any one selected from the group consisting of an alkylene group, an alkylene group and an -OCO- group, and in the formulae (1) to (2), R 2 each independently represents a hydrogen atom or an alkane. base〕. Further, the group represented by the above formula (1) is excluded from the group contained in the group represented by the above formula (2).

前述式(1)中,R1表示由伸烷基、亞烷基及-OCO-基所組成群組選出之任一種。前述伸烷基及亞烷基可為直鏈狀亦可為分支鏈狀,基於結合距離短,可更提高所得玻 璃纖維複合化樹脂基板之耐熱性傾向之觀點而言,碳數較好為1~6。另外,該等中,就提高自由基聚合之反應性傾向之觀點而言,R1較好為-OCO-基。 In the above formula (1), R 1 represents any one selected from the group consisting of an alkylene group, an alkylene group and an -OCO- group. The alkylene group and the alkylene group may be linear or branched, and the carbon number is preferably 1 in view of the fact that the bonding distance is short and the heat resistance of the glass fiber composite resin substrate is further improved. ~6. Further, in these terms, R 1 is preferably an -OCO- group from the viewpoint of improving the reactivity tendency of radical polymerization.

式(1)及(2)中,R2各獨立表示氫原子或烷基。至於前述烷基可為直鏈狀亦可為分支鏈狀,就自由基聚合之反應性更優異之觀點而言,以碳數1~3較佳。就自由基聚合之反應性更為優異之觀點而言,該R2較好為氫原子或甲基。 In the formulae (1) and (2), R 2 each independently represents a hydrogen atom or an alkyl group. The alkyl group may be linear or branched, and the carbon number is preferably from 1 to 3 from the viewpoint of further excellent reactivity of the radical polymerization. From the viewpoint of further excellent reactivity of radical polymerization, the R 2 is preferably a hydrogen atom or a methyl group.

該不飽和官能基具體而言列舉為丙烯醯基、甲基丙烯醯基、烯丙基及乙烯基。本發明之不飽和化合物藉由具有該種不飽和官能基,而可與具有前述硬化性官能基之前述(A)籠型倍半矽氧烷樹脂進行自由基聚合,可獲得具有高水準之耐熱性及透明性、且熱膨脹係數充分小的本發明之玻璃纖維複合化樹脂基板。 Specific examples of the unsaturated functional group are a acrylonitrile group, a methacryl group, an allyl group, and a vinyl group. The unsaturated compound of the present invention can be free-radically polymerized with the aforementioned (A) cage sesquiterpene oxide resin having the aforementioned curable functional group by having such an unsaturated functional group, and a high level of heat resistance can be obtained. The glass fiber composite resin substrate of the present invention is excellent in transparency and transparency and has a small thermal expansion coefficient.

本發明之不飽和化合物為每一分子化合物具有兩個以上之前述不飽和官能基。前述不飽和官能基之數未達前述下限時,由於與前述籠型倍半矽氧烷樹脂進行自由基聚合亦無法形成充分之交聯構造,故玻璃纖維複合化樹脂基板在高溫時之彈性模數變低且耐熱性降低。且,就更提高前述彈性模數及耐熱性之觀點而言,前述不飽和官能基之數較好為2~10個。又,本發明之不飽和化合物可為單體亦可為聚合物,前述不飽和化合物為聚合物時,前述不飽和官能基之數為每一分子化合物之平均值。又,每一分子化合物之不飽和官能基之數(或平均數)係由以1H-NMR (儀器名:JNM-ECA400(日本電子股份有限公司製造),溶劑:氯仿-d,溫度:22.7℃,400MHz)測定之不飽和官能基之基之波鋒面積及以凝膠滲透層析儀(GPC,(儀器名:HLC-8320GPC(TOSOH公司製造),溶劑:THF,管柱:超高速SemiMicro SEC管柱SuperH系列,溫度:40℃,速度:0.6ml/min)測定之分子量(或數平均分子量)求得。 The unsaturated compound of the present invention has two or more of the aforementioned unsaturated functional groups per molecule of the compound. When the number of the unsaturated functional groups is less than the lower limit, a sufficient cross-linking structure cannot be formed by radical polymerization with the above-mentioned cage type sesquiterpene oxide resin, so that the elastic mode of the glass fiber composite resin substrate at a high temperature is obtained. The number becomes low and the heat resistance is lowered. Further, from the viewpoint of further improving the elastic modulus and heat resistance, the number of the unsaturated functional groups is preferably from 2 to 10. Further, the unsaturated compound of the present invention may be a monomer or a polymer, and when the unsaturated compound is a polymer, the number of the unsaturated functional groups is an average value of each molecule of the compound. Further, the number (or average) of the unsaturated functional groups per molecule of the compound is determined by 1 H-NMR (instrument name: JNM-ECA400 (manufactured by JEOL Ltd.), solvent: chloroform-d, temperature: 22.7 °C, 400MHz) Determination of the wave front area of the unsaturated functional group and gel permeation chromatography (GPC, (instrument name: HLC-8320GPC (manufactured by TOSOH), solvent: THF, column: ultra-high speed SemiMicro The molecular weight (or number average molecular weight) of the SEC column SuperH series, temperature: 40 ° C, speed: 0.6 ml / min) was determined.

本發明之不飽和化合物只要是每一分子化合物具有兩個以上之前述不飽和官能基即無特別限制,但分子量(於聚合物之情況為重量平均分子量)較好為80~5000。分子量未達前述下限時,於硬化性樹脂組成物之硬化中殘留未反應之不飽和化合物之情況,會有熱處理等加熱處理中未反應不飽和化合物成為揮發成分而引起硬化後之重量變化或尺寸變化之虞,另一方面,超過前述上限時,與籠型倍半矽氧烷樹脂之溶解性下降,有使所得硬化性樹脂組成物之黏度變高而難以操作之傾向。 The unsaturated compound of the present invention is not particularly limited as long as it has two or more of the above-mentioned unsaturated functional groups per molecule of the compound, but the molecular weight (weight average molecular weight in the case of a polymer) is preferably from 80 to 5,000. When the molecular weight is less than the lower limit, the unreacted unsaturated compound remains in the curing of the curable resin composition, and the unreacted unsaturated compound becomes a volatile component in the heat treatment such as heat treatment, and the weight change or size after hardening is caused. On the other hand, when the above-mentioned upper limit is exceeded, the solubility with the cage sesquioxane resin is lowered, and the viscosity of the obtained curable resin composition tends to be high, which tends to be difficult to handle.

該不飽和化合物列舉為例如二環戊基二丙烯酸酯、三丙二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、雙酚A二縮水甘油醚二丙烯酸酯、雙酚茀二丙烯酸酯、四乙二醇二丙烯酸酯、羥基特戊酸新戊二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯。其中,就提高與籠型倍半矽氧烷樹脂之溶解性,且更提高所得玻璃纖維複合化樹脂基板之耐熱性之傾向之觀點而言,較好為於碳數1~30之烴 化合物上鍵結兩個以上之前述不飽和官能基之化合物,更好為二環戊基二丙烯酸酯、雙酚茀二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯。另外,本發明之不飽和化合物可單獨使用一種亦可組合兩種以上。 The unsaturated compound is exemplified by, for example, dicyclopentyl diacrylate, tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, bisphenol A diglycidyl ether diacrylate, bisphenol fluorene diacrylate, Tetraethylene glycol diacrylate, hydroxypivalic acid neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate. Among them, from the viewpoint of improving the solubility with the cage sesquioxane resin and improving the heat resistance of the obtained glass fiber composite resin substrate, it is preferably a hydrocarbon having 1 to 30 carbon atoms. The compound having two or more of the aforementioned unsaturated functional groups bonded to the compound is more preferably dicyclopentyl diacrylate, bisphenol fluorene diacrylate, trimethylolpropane triacrylate or pentaerythritol tetraacrylate. Further, the unsaturated compounds of the present invention may be used alone or in combination of two or more.

〈(C)硬化觸媒〉 <(C) Hardening Catalyst>

本發明之硬化觸媒為促進前述(A)籠型倍半矽氧烷樹脂與前述(B)不飽和化合物之硬化反應(自由基聚合反應)之觸媒。該硬化觸媒列舉為自由基聚合起始劑,前述自由基聚合起始劑列舉為光自由基聚合起始劑及熱自由基聚合起始劑。 The curing catalyst of the present invention is a catalyst for promoting the hardening reaction (radical polymerization) of the above (A) cage sesquioxane resin and the above (B) unsaturated compound. The curing catalyst is exemplified by a radical polymerization initiator, and the radical polymerization initiator is exemplified by a photoradical polymerization initiator and a thermal radical polymerization initiator.

前述光自由基聚合起始劑列舉為苯乙酮系、苯偶因系、二苯甲酮系、噻噸酮(thioxanthone)系、醯基氧化膦系之光聚合起始劑,具體而言列舉為三氯苯乙酮、二乙氧基苯乙酮、1-苯基-2-羥基-2-甲基丙-1-酮、1-羥基環己基苯基酮、2-甲基-1-(4-甲基噻吩)-2-嗎啉基丙-1-酮、苯偶因甲基醚、苄基二甲基縮酮、二苯甲酮、噻噸酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、甲基苯基乙醇酸酯、樟腦醌、聯苯醯、蒽醌、米氏(Michael)酮等。又,前述熱自由基聚合起始劑列舉為例如酮過氧化物系、過氧基縮酮系、過氧化氫系、二烷基過氧化物系、二醯基過氧化物系、過氧基二碳酸酯系、過氧基酯系之熱聚合起始劑。本發明之硬化觸媒可單獨使用該等中之一種,亦可組合兩種以上使用,亦可組合前述光自由基聚合起始劑與 前述熱自由基聚合起始劑而使用。 The photoradical polymerization initiator is exemplified by an acetophenone-based, benzoin-based, benzophenone-based, thioxanthone-based, fluorenylphosphine oxide-based photopolymerization initiator, and specifically Is trichloroacetophenone, diethoxyacetophenone, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophene)-2-morpholinylpropan-1-one, benzoin methyl ether, benzyldimethylketal, benzophenone, thioxanthone, 2,4,6-three Methyl benzhydryl diphenyl phosphine oxide, methyl phenyl glycolate, camphorquinone, biphenyl hydrazine, hydrazine, Michael ketone, and the like. Further, the thermal radical polymerization initiator is, for example, a ketone peroxide system, a peroxyketal system, a hydrogen peroxide system, a dialkyl peroxide system, a dimercapto peroxide system, or a peroxy group. A dicarbonate-based or peroxyester-based thermal polymerization initiator. The curing catalyst of the present invention may be used alone or in combination of two or more. The photoradical polymerization initiator may be combined with the above. The above thermal radical polymerization initiator is used.

〈硬化性樹脂組成物〉 <Curable resin composition>

本發明之硬化性樹脂組成物含有前述(A)籠型倍半矽氧烷樹脂與前述(B)不飽和化合物與前述(C)硬化觸媒。 The curable resin composition of the present invention contains the above (A) cage sesquiterpene oxide resin and the above (B) unsaturated compound and the above (C) curing catalyst.

本發明之硬化性樹脂組成物中,前述籠型倍半矽氧烷樹脂之含量相對於前述硬化性樹脂組成物全體需為5~90質量%。前述籠型倍半矽氧烷樹脂之含量未達前述下限時,由於玻璃纖維複合化樹脂基板之玻璃轉移溫度下降,且熱膨脹係數變大,故耐熱性變得不足。另外,超過前述上限時,硬化物之交聯密度增加且玻璃纖維複合化樹脂基板變脆,故處理變困難。 In the curable resin composition of the present invention, the content of the cage sesquioxane resin is required to be 5 to 90% by mass based on the total amount of the curable resin composition. When the content of the cage sesquioxane resin is less than the above lower limit, the glass transition temperature of the glass fiber composite resin substrate is lowered, and the thermal expansion coefficient is increased, so that heat resistance is insufficient. Further, when the ratio is more than the above upper limit, the crosslinking density of the cured product increases and the glass fiber composite resin substrate becomes brittle, so that handling becomes difficult.

又,就更提高玻璃纖維複合化樹脂基板之耐熱性,且更提高強度之觀點而言,前述籠型倍半矽氧烷樹脂之含量較好為8~80質量%。另外,基於與前述相同之觀點,前述籠型倍半矽氧烷樹脂中之50質量%以上(更好為70質量%以上)較好為以前述式(3)表示之籠型倍半矽氧烷樹脂,至於本發明之硬化性樹脂組成物,以前述式(3)表示之籠型倍半矽氧烷樹脂之含量相對於前述硬化性樹脂組成物全體較好為2.5~90質量%,更好為5~80質量%。 In addition, from the viewpoint of further improving the heat resistance of the glass fiber composite resin substrate and further improving the strength, the content of the cage sesquioxane resin is preferably from 8 to 80% by mass. In addition, it is preferable that the cage type sesquiterpene oxide is 50% by mass or more (more preferably 70% by mass or more) based on the above-mentioned formula (3). In the curable resin composition of the present invention, the content of the cage sesquioxane resin represented by the above formula (3) is preferably from 2.5 to 90% by mass based on the total amount of the curable resin composition. Good for 5~80% by mass.

又,本發明之硬化性樹脂組成物中,前述不飽和化合物之含量,相對於前述硬化性樹脂組成物全體較好為5~90質量%,更好為10~70質量%。前述不飽和化合物之含量 未達前述下限時,由於硬化性樹脂組成物之溶解性降低,溶液黏度增加,故有對玻璃纖維之含浸性降低之傾向,另外,超過前述上限時,會有硬化性樹脂組成物之硬化物的玻璃轉移溫度降低,所得玻璃纖維複合化樹脂基板之耐熱性降低之傾向。 In the curable resin composition of the present invention, the content of the unsaturated compound is preferably from 5 to 90% by mass, more preferably from 10 to 70% by mass, based on the total amount of the curable resin composition. The content of the aforementioned unsaturated compound When the lower limit is not reached, the solubility of the curable resin composition is lowered, and the viscosity of the solution is increased. Therefore, the impregnation property to the glass fiber tends to be lowered, and when the upper limit is exceeded, the cured resin composition is cured. The glass transition temperature is lowered, and the heat resistance of the obtained glass fiber composite resin substrate tends to decrease.

再者,本發明之硬化性樹脂組成物中,前述硬化觸媒之含量,相對於前述硬化性樹脂組成物較好為0.1~5.0質量%,更好為0.1~3.0質量%。前述硬化觸媒之含量未達前述下限時,會有硬化反應變得不足,所得硬化物之強度、剛性降低之傾向,另外,超過前述上限時會有硬化物出現著色之虞。 In the curable resin composition of the present invention, the content of the curing catalyst is preferably from 0.1 to 5.0% by mass, more preferably from 0.1 to 3.0% by mass, based on the curable resin composition. When the content of the curing catalyst is less than the lower limit, the curing reaction tends to be insufficient, and the strength and rigidity of the obtained cured product tend to be lowered. When the content exceeds the upper limit, the cured product may be colored.

且,本發明之硬化性樹脂組成物可進而含有前述(A)籠型倍半矽氧烷樹脂及前述(B)不飽和化合物以外之可硬化之化合物(以下依情況稱為硬化性化合物)。該硬化性化合物只要是可藉加熱或活性能量線之照射而硬化之化合物即可,並無特別限制,但較好為與前述籠型倍半矽氧烷樹脂具有相溶性及反應性之化合物。 Further, the curable resin composition of the present invention may further contain the above-mentioned (A) cage sesquioxane resin and the hardenable compound other than the above (B) unsaturated compound (hereinafter referred to as a curable compound). The curable compound is not particularly limited as long as it can be cured by irradiation with heat or an active energy ray, but is preferably a compound having compatibility and reactivity with the cage sesquioxane resin.

該種硬化性化合物列舉為例如構造單位之重複數為2~20左右之聚合物的反應性寡聚物、低分子量且低黏度的反應性單體。前述反應性寡聚物具體而言列舉為環氧基丙烯酸酯、環氧化油丙烯酸酯、胺基甲酸酯丙烯酸酯、不飽和聚酯、聚酯丙烯酸酯、聚醚丙烯酸酯、乙烯基丙烯酸酯、聚烯/硫醇、聚矽氧丙烯酸酯、聚丁二烯、聚苯乙烯甲基丙烯酸乙酯。又,前述反應性單體具體而言列舉為苯 乙烯、乙酸乙烯酯、N-乙烯基吡咯烷酮、丙烯酸丁酯、丙烯酸2-乙基己酯、丙烯酸正己酯、丙烯酸環己酯、丙烯酸正癸酯、丙烯酸異冰片酯、丙烯酸二環戊烯醯氧基乙基酯、丙烯酸苯氧基乙基酯、甲基丙烯酸三氟乙酯等單官能單體。該種硬化性化合物可單獨使用一種,亦可組合兩種以上使用。 Such a curable compound is exemplified by a reactive oligomer of a polymer having a repeating number of about 2 to 20 in a structural unit, and a low molecular weight and low viscosity reactive monomer. The aforementioned reactive oligomers are specifically exemplified by epoxy acrylate, epoxidized oil acrylate, urethane acrylate, unsaturated polyester, polyester acrylate, polyether acrylate, vinyl acrylate. , polyene/thiol, polyoxy acrylate, polybutadiene, polystyrene ethyl methacrylate. Further, the aforementioned reactive monomer is specifically exemplified as benzene Ethylene, vinyl acetate, N-vinylpyrrolidone, butyl acrylate, 2-ethylhexyl acrylate, n-hexyl acrylate, cyclohexyl acrylate, n-decyl acrylate, isobornyl acrylate, dicyclopentene acrylate A monofunctional monomer such as benzyl ethyl ester, phenoxyethyl acrylate or trifluoroethyl methacrylate. The curable compound may be used alone or in combination of two or more.

本發明之硬化性樹脂組成物含有前述硬化性化合物時,其含量相對於前述硬化性樹脂組成物全體較好為40質量%以下。前述硬化性化合物之含量超過前述上限時,難以形成充分之交聯構造,會有所得玻璃纖維複合化樹脂基板之耐熱性降低之傾向。 When the curable resin composition of the present invention contains the curable compound, the content thereof is preferably 40% by mass or less based on the entire curable resin composition. When the content of the curable compound exceeds the above upper limit, it is difficult to form a sufficient crosslinked structure, and the heat resistance of the obtained glass fiber composite resin substrate tends to be lowered.

又,本發明之硬化性樹脂組成物在不妨礙本發明效果之範圍內可進而含有各種添加劑。至於前述添加劑列舉為例如有機/無機填充劑、可塑劑、難燃劑、熱安定劑、抗氧化劑、光安定劑、紫外線吸收劑、滑劑、抗靜電劑、脫模劑、發泡劑、核劑、著色劑、交聯劑、分散助劑等。含有該等添加劑時,其含量相對於前述硬化性樹脂組成物全體較好為30質量%以下。 Moreover, the curable resin composition of the present invention may further contain various additives insofar as the effects of the present invention are not impaired. As for the aforementioned additives, for example, organic/inorganic fillers, plasticizers, flame retardants, heat stabilizers, antioxidants, light stabilizers, ultraviolet absorbers, slip agents, antistatic agents, mold release agents, foaming agents, cores Agents, colorants, crosslinking agents, dispersing aids, and the like. When the additives are contained, the content thereof is preferably 30% by mass or less based on the total amount of the curable resin composition.

再者,本發明之硬化性樹脂組成物,為了調整其黏度等,亦可進而含有甲基乙基酮、甲苯、乙酸乙酯等溶劑,但由於溶劑之揮發去除步驟需要時間故生產效率低,且會有溶劑殘留在所得玻璃纖維複合化樹脂基板之內部使基板之特性降低之虞,故前述溶劑之含量相對於前述硬化性樹脂組成物全體較好為5質量%以下,更好不含溶劑。 In addition, the curable resin composition of the present invention may further contain a solvent such as methyl ethyl ketone, toluene or ethyl acetate in order to adjust the viscosity, etc., but the solvent is removed in a volatile removal step, so that the production efficiency is low. In addition, the solvent remains in the interior of the obtained glass fiber composite resin substrate, and the properties of the substrate are lowered. Therefore, the content of the solvent is preferably 5% by mass or less based on the total amount of the curable resin composition, and more preferably no solvent.

〈玻璃纖維〉 <glass fiber>

本發明之玻璃纖維之形態列舉為絲狀紗、玻璃布、不織布等。該等中,就提高熱膨脹係數減低效果之觀點而言,以玻璃布較佳。前述玻璃布之原料依據玻璃之組成列舉為E玻璃、C玻璃、A玻璃、S玻璃、D玻璃、NE玻璃、T玻璃、石英玻璃等,該等中,藉由使折射率之範圍落在較佳範圍內,且基於容易取得之觀點而言,以E玻璃、S玻璃、T玻璃、NE玻璃較佳。 The form of the glass fiber of the present invention is exemplified by a filament yarn, a glass cloth, a nonwoven fabric or the like. Among these, a glass cloth is preferable from the viewpoint of improving the effect of reducing the coefficient of thermal expansion. The raw material of the glass cloth is exemplified by E glass, C glass, A glass, S glass, D glass, NE glass, T glass, quartz glass, etc., in which the refractive index range is reduced. In the preferred range, E glass, S glass, T glass, and NE glass are preferable from the viewpoint of easy availability.

又,本發明之玻璃纖維,以提高前述硬化性樹脂組成物與前述玻璃纖維之界面之潤濕性、親和性、密著性為目的,亦可使用施以矽烷偶合劑、各種界面活性劑、藉無機酸之洗淨;電暈放電處理;紫外線照射處理;電漿處理等之表面處理者。 Moreover, in order to improve the wettability, affinity, and adhesion of the interface between the curable resin composition and the glass fiber, the glass fiber of the present invention may be a decane coupling agent or various surfactants. By surface treatment of inorganic acid; corona discharge treatment; ultraviolet irradiation treatment; plasma treatment.

另外,本發明之玻璃纖維之折射率與前述硬化性樹脂組成物之硬化物之折射率之差較好在-0.02~+0.02之範圍內,更好在-0.01~+0.01之範圍內。前述折射率之差在前述範圍外時,由於硬化性樹脂組成物之硬化物與玻璃纖維之界面散射增大,使玻璃纖維複合化樹脂基板之透明性降低,故有難以使用作為可撓性顯示器或太陽能電池用玻璃之替代基板之傾向。 Further, the difference between the refractive index of the glass fiber of the present invention and the refractive index of the cured product of the curable resin composition is preferably in the range of -0.02 to +0.02, more preferably in the range of -0.01 to +0.01. When the difference in refractive index is outside the above range, the interface scattering between the cured product of the curable resin composition and the glass fiber is increased, and the transparency of the glass fiber composite resin substrate is lowered, so that it is difficult to use it as a flexible display. Or the tendency of solar cells to replace substrates.

又,本發明之玻璃纖維之形態為玻璃布、不織布等時,其厚度可依據使用玻璃纖維複合化樹脂基板之目的而適當選擇,但就提高硬化性樹脂組成物對玻璃纖維之含浸 性傾向之觀點而言,較好為30~100μm。 Further, when the form of the glass fiber of the present invention is glass cloth, non-woven fabric or the like, the thickness thereof can be appropriately selected depending on the purpose of using the glass fiber composite resin substrate, but the impregnation of the glass fiber by the curable resin composition is improved. From the viewpoint of sexual tendency, it is preferably from 30 to 100 μm.

〈玻璃纖維複合化樹脂基板〉 <Glass fiber composite resin substrate>

本發明之玻璃纖維複合化樹脂基板為使前述硬化性樹脂組成物與前述玻璃纖維複合化者。該種玻璃纖維複合化樹脂基板之製造方法並無特別限制,但列舉為例如將前述硬化性樹脂組成物含浸於前述玻璃纖維中後,使前述硬化性樹脂組成物硬化之方法。 The glass fiber composite resin substrate of the present invention is a composite of the curable resin composition and the glass fiber. The method for producing the glass fiber composite resin substrate is not particularly limited, and examples thereof include a method of curing the curable resin composition after impregnating the glass fiber with the curable resin composition.

該等方法中,首先在室溫(20~25℃)下混合前述(A)籠型倍半矽氧烷樹脂、前述(B)不飽和化合物、前述(C)硬化觸媒、及視需要之其他化合物或溶劑等,獲得本發明之硬化性樹脂組成物。接著,將前述硬化性樹脂組成物滴加於前述玻璃纖維中,以浸漬等方法含浸,且視需要去除溶劑。接著,對含浸前述硬化性樹脂組成物之玻璃纖維施以加熱處理及/或活性能量線照射處理,使前述硬化性樹脂組成物硬化,獲得本發明之玻璃纖維複合化樹脂基板。 In these methods, first, the (A) cage sesquiterpene oxide resin, the (B) unsaturated compound, the (C) hardening catalyst, and the like are mixed at room temperature (20 to 25 ° C). A curable resin composition of the present invention is obtained from another compound, a solvent or the like. Next, the curable resin composition is dropped onto the glass fibers, impregnated by a method such as immersion, and the solvent is removed as necessary. Then, the glass fiber impregnated with the curable resin composition is subjected to a heat treatment and/or an active energy ray irradiation treatment to cure the curable resin composition, thereby obtaining a glass fiber composite resin substrate of the present invention.

本發明之玻璃纖維複合化樹脂基板較好每1m2之前述硬化性樹脂組成物之硬化物與前述玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為20:80~70:30,更好為40:60~60:40。相對於前述硬化物之玻璃纖維比例未達前述下限時,會有玻璃纖維複合化樹脂基板之耐熱性降低,且熱膨脹係數超過20ppm/K之傾向,另外,超過前述上限時,對玻璃纖維之含浸變不充分,有纖維間殘留空隙 而使玻璃纖維複合化樹脂基板之透明性降低(濁度增加)之傾向。因此,前述含浸中,較好以使硬化後之前述硬化性樹脂組成物之質量與前述玻璃纖維之質量之比成為前述範圍內之方式含浸。 In the glass fiber composite resin substrate of the present invention, the mass ratio of the cured product of the curable resin composition per 1 m 2 to the glass fiber (the mass of the cured product: the mass of the glass fiber) is preferably 20:80 to 70:30. More preferably 40:60~60:40. When the ratio of the glass fiber to the cured product is less than the lower limit, the heat resistance of the glass fiber composite resin substrate is lowered, and the thermal expansion coefficient tends to exceed 20 ppm/K, and when the upper limit is exceeded, the glass fiber is impregnated. It is insufficient, and there is a tendency that the transparency of the glass fiber composite resin substrate is lowered (the turbidity is increased) by leaving voids between the fibers. Therefore, in the impregnation, it is preferred to impregnate the ratio of the mass of the curable resin composition after curing to the mass of the glass fiber within the above range.

另外,前述含浸中,可依據使用玻璃纖維之種類或玻璃纖維複合化樹脂基板之目的而適當調整,但就應用玻璃纖維複合化樹脂基板之液晶顯示器或有機EL顯示器之厚度或對應製造製程(輥對輥)之觀點而言,較好以使所得玻璃纖維複合化樹脂基板之厚度成為0.03~0.5mm,較好成為0.05~0.2mm之方式含浸。 Further, the impregnation may be appropriately adjusted depending on the type of the glass fiber or the glass fiber composite resin substrate, but the thickness of the liquid crystal display or the organic EL display using the glass fiber composite resin substrate or the corresponding manufacturing process (roller) From the viewpoint of the roll), the thickness of the obtained glass fiber composite resin substrate is preferably from 0.03 to 0.5 mm, preferably from 0.05 to 0.2 mm.

且,前述加熱處理中之加熱溫度可依據前述硬化性樹脂組成物適當調整,但較好為50~200℃,更好為80~180℃。加熱溫度未達前述下限時,會有硬化反應之進行不充分,無法形成充分交聯構造之傾向,另外,超過前述上限時,會產生在硬化性樹脂組成物硬化前即變質、揮發之缺陷之傾向。再者,前述加熱處理之加熱時間係隨前述加熱溫度或前述硬化性樹脂組成物而異而無法一概而論,但較好為30~60分鐘。又,基於抑制因硬化性樹脂組成物之自由基聚合反應之氧所致之阻礙、可形成更充分交聯構造之傾向之觀點而言,前述加熱處理較好在氮氣等惰性氣體環境下進行。 Further, the heating temperature in the heat treatment may be appropriately adjusted depending on the curable resin composition, but is preferably 50 to 200 ° C, more preferably 80 to 180 ° C. When the heating temperature is less than the lower limit, the progress of the curing reaction may be insufficient, and a sufficient cross-linking structure may not be formed. When the temperature exceeds the upper limit, defects such as deterioration and volatilization before curing of the curable resin composition may occur. tendency. Further, the heating time of the heat treatment may not be generalized depending on the heating temperature or the curable resin composition, but is preferably from 30 to 60 minutes. In addition, the heat treatment is preferably carried out in an inert gas atmosphere such as nitrogen, from the viewpoint of suppressing the inhibition by oxygen in the radical polymerization reaction of the curable resin composition and forming a more sufficient crosslinked structure.

另外,前述活性能量線照射處理中之活性能量線照射之條件較好係照射波長10~400nm之紫外線、波長400~700nm之可見光,更好照射波長200~400nm之近紫外 線。又,累積曝光量較好為2000~10000mJ/cm2。前述活性能量線之發生源列舉為低壓水銀燈(輸出:0.4~4W/cm)、高壓水銀燈(40~160W/cm)、超高壓水銀燈(173~435 W/cm)、金屬鹵素燈(80~160W/cm)、脈衝氙氣燈(80~120W/cm)、無電極放電燈(80~120W/cm)等。 Further, the conditions of the active energy ray irradiation in the active energy ray irradiation treatment are preferably ultraviolet rays having a wavelength of from 10 to 400 nm, visible light having a wavelength of from 400 to 700 nm, and more preferably ultraviolet rays having a wavelength of from 200 to 400 nm. Further, the cumulative exposure amount is preferably from 2,000 to 10,000 mJ/cm 2 . The sources of the aforementioned active energy rays are listed as low-pressure mercury lamps (output: 0.4~4W/cm), high-pressure mercury lamps (40~160W/cm), ultra-high pressure mercury lamps (173~435 W/cm), and metal halide lamps (80~160W). /cm), pulsed xenon lamp (80~120W/cm), electrodeless discharge lamp (80~120W/cm), etc.

本發明之玻璃纖維複合化樹脂基板,為使表面平滑化,亦可在前述玻璃纖維複合化樹脂基板之一表面或二表面上進而具備由樹脂所成之塗覆層。前述樹脂較好為具有耐熱性、透明性、耐藥品性者,最好使用本發明之前述硬化性樹脂組成物。又,本發明之玻璃纖維複合化樹脂基板亦可視需要進而具備對氧或水蒸氣之氣體障壁層。 In the glass fiber composite resin substrate of the present invention, in order to smooth the surface, a coating layer made of a resin may be further provided on one surface or both surfaces of the glass fiber composite resin substrate. The resin is preferably one having heat resistance, transparency, and chemical resistance, and the curable resin composition of the present invention is preferably used. Further, the glass fiber composite resin substrate of the present invention may further include a gas barrier layer for oxygen or water vapor as needed.

實施例 Example

以下,基於實施例及比較例更具體說明本發明,但本發明並不受限於以下之實施例。又,各調製例、實施例及比較例中,折射率測定、全光線透射率測定、耐熱性評價係分別藉以下所示之方法進行。 Hereinafter, the present invention will be specifically described based on examples and comparative examples, but the present invention is not limited to the following examples. Further, in each of the preparation examples, the examples, and the comparative examples, the refractive index measurement, the total light transmittance measurement, and the heat resistance evaluation were carried out by the methods described below.

(折射率測定) (refractive index measurement)

使用輥塗佈器,以成為厚度0.1mm之方式澆鑄(流延)各調製例中獲得之硬化性樹脂組成物,且使用80W/cm之高壓水銀燈,以2000 mJ/cm2之累積曝光量使之硬化,獲得薄片狀之硬化物。針對所得硬化物,使用折 射率計(DR-M2,Atago公司製),分別測定於589nm之折射率。 The curable resin composition obtained in each of the preparation examples was cast (cast) by a roll coater so as to have a thickness of 0.1 mm, and a high-pressure mercury lamp of 80 W/cm was used, and the cumulative exposure amount of 2000 mJ/cm 2 was used . Hardening to obtain a flaky cured product. A refractive index (DR-M2, manufactured by Atago Co., Ltd.) was used for the obtained cured product, and the refractive index at 589 nm was measured.

(全光線透射率測定) (total light transmittance measurement)

針對各實施例及比較例中獲得之玻璃纖維複合化樹脂基板,使用濁度計(NDH2000,日本電色製),測定全光線透射率(%)。 For the glass fiber composite resin substrate obtained in each of the examples and the comparative examples, a total light transmittance (%) was measured using a turbidimeter (NDH2000, manufactured by Nippon Denshoku Co., Ltd.).

(耐熱性評價) (heat resistance evaluation)

.玻璃轉移溫度測定、動黏彈性降低率測定 . Glass transition temperature measurement, dynamic viscoelasticity reduction rate determination

針對各實施例及比較例中獲得之玻璃纖維複合化樹脂基板,使用動黏彈性測定裝置(商品名:DVE-V4,製造公司名:UBM公司製),以升溫速度5℃/min之條件,在溫度30~300℃之範圍內進行動黏彈性測定,且以溫度30~300℃之範圍內之Tanδ之峰值溫度作為玻璃轉移溫度(Tg(℃))。又,動黏彈性降低率(△E’(%))係由下式求得:△E’(%)=(E’30-E’300)/E’30 For the glass fiber composite resin substrate obtained in each of the examples and the comparative examples, a dynamic viscoelasticity measuring device (trade name: DVE-V4, manufactured by UBM Co., Ltd.) was used, and the temperature was raised at a rate of 5 ° C/min. The dynamic viscoelasticity measurement was carried out at a temperature of 30 to 300 ° C, and the peak temperature of Tan δ in the range of 30 to 300 ° C was used as the glass transition temperature (Tg (° C)). Moreover, the dynamic viscoelasticity reduction rate (ΔE'(%)) is obtained by the following equation: ΔE'(%)=(E' 30 -E' 300 )/E' 30

〔式中,E’30表示於30℃之動黏彈性,E’300表示於300℃之動黏彈性〕。又,玻璃轉移溫度愈高及/或動黏彈性降低率愈小,表示玻璃纖維複合化樹脂基板之耐熱性愈高。 [wherein E' 30 represents the dynamic viscoelasticity at 30 ° C, and E' 300 represents the dynamic viscoelasticity at 300 ° C]. Further, the higher the glass transition temperature and/or the smaller the dynamic viscoelasticity reduction rate, the higher the heat resistance of the glass fiber composite resin substrate.

.熱膨脹係數(線熱膨脹係數)測定 . Thermal expansion coefficient (linear thermal expansion coefficient)

針對各實施例及比較例中獲得之玻璃纖維複合化樹脂基板,使用熱機械分析裝置(TMA,商品名:TMA4000SA,製造公司名:BRUKER公司製),以升溫速度5℃/min,壓縮荷重0.1N之條件,求得溫度30~200℃之範圍內之玻璃纖維複合化樹脂基板(0.1mm厚)之面方向(X方向)之伸長率的平均值,由該值求得玻璃纖維複合化樹脂基板之面方向(X方向)之熱膨脹係數(ppm/K)。又,熱膨脹係數愈小,表示玻璃纖維複合化樹脂基板之耐熱性愈高。 For the glass fiber composite resin substrate obtained in each of the examples and the comparative examples, a thermomechanical analyzer (TMA, trade name: TMA4000SA, manufactured by BRUKER) was used, and the temperature was increased by 5 ° C/min, and the compression load was 0.1. Under the condition of N, the average value of the elongation in the plane direction (X direction) of the glass fiber composite resin substrate (0.1 mm thick) in the range of 30 to 200 ° C was obtained, and the glass fiber composite resin was determined from the value. Thermal expansion coefficient (ppm/K) of the surface direction (X direction) of the substrate. Further, the smaller the coefficient of thermal expansion, the higher the heat resistance of the glass fiber composite resin substrate.

(合成例1:籠型倍半矽氧烷樹脂(I)) (Synthesis Example 1: Cage sesquioxane resin (I))

籠型倍半矽氧烷樹脂(I)係依據特開2004-143449號公報中所記載之方法製造。首先,於具備攪拌器、滴加漏斗及溫度計之反應容器中裝入作為溶劑之2-丙醇(IPA)40ml、作為鹼性觸媒之5%氫氧化四甲基銨水溶液(TMAH水溶液)3.1g。又,將IPA 15ml與3-甲基丙烯醯氧基丙基三甲氧基矽烷12.7g裝入滴加漏斗中而調製3-甲基丙烯醯氧基丙基三甲氧基矽烷之IPA溶液,邊在室溫下攪拌邊在30分鐘內將其滴加於前述反應容器中。滴加結束後,不加熱再攪拌2小時。攪拌後,在減壓下去除IPA,獲得含籠型倍半矽氧烷樹脂(I)之組成物7.5g。所得組成物中,本發明之籠型倍半矽氧烷樹脂(I)相對於前述組成 物全體為97質量%,其中,以式(3)表示之籠型倍半矽氧烷樹脂相對於前述籠型倍半矽氧烷樹脂(I)全體為90質量%,液體層析儀分離後之質量分析之結果,式(3)中之n為8、10、12。 The cage sesquioxane resin (I) is produced according to the method described in JP-A-2004-143449. First, 40 ml of 2-propanol (IPA) as a solvent and 5% aqueous solution of tetramethylammonium hydroxide (TMAH aqueous solution) as a basic catalyst were placed in a reaction vessel equipped with a stirrer, a dropping funnel and a thermometer. g. Further, 15 ml of IPA and 12.7 g of 3-methacryloxypropyltrimethoxydecane were placed in a dropping funnel to prepare an IPA solution of 3-methylpropenyloxypropyltrimethoxydecane. It was added dropwise to the above reaction vessel over 30 minutes while stirring at room temperature. After the completion of the dropwise addition, the mixture was stirred for 2 hours without heating. After stirring, IPA was removed under reduced pressure to obtain 7.5 g of a composition containing a cage-type sesquiterpene oxide resin (I). In the obtained composition, the cage type sesquioxane resin (I) of the present invention is relative to the aforementioned composition The amount of the cage-type sesquiterpene oxide resin represented by the formula (3) is 90% by mass based on the entire cage sesquioxane resin (I), and the liquid chromatograph is separated. As a result of the mass analysis, n in the formula (3) is 8, 10, and 12.

(合成例2:籠型倍半矽氧烷樹脂(II)) (Synthesis Example 2: cage type sesquioxanes resin (II))

將IPA 15ml、3-甲基丙烯醯氧基丙基三甲氧基矽烷7.2g及苯基三甲氧基矽烷5.7g裝入滴加漏斗中,調製3-甲基丙烯醯氧基丙基三甲氧基矽烷及苯基三甲氧基矽烷之IPA溶液,使用其代替3-甲基丙烯醯氧基丙基三甲氧基矽烷之IPA溶液以外,餘與合成例1同樣,獲得含籠型倍半矽氧烷樹脂(II)之組成物8.7g。所得組成物中,本發明之籠型倍半矽氧烷樹脂(II)相對於前述組成物全體為96質量%,其中,以式(3)表示之籠型倍半矽氧烷樹脂相對於前述籠型倍半矽氧烷樹脂(II)全體為92質量%,液體層析儀分離後之質量分析之結果,式(3)中之n+m為8、10、12。且,n:m為4:4。 15 ml of IPA, 7.2 g of 3-methacryloxypropyltrimethoxydecane and 5.7 g of phenyltrimethoxydecane were placed in a dropping funnel to prepare 3-methylpropenyloxypropyltrimethoxy. The IPA solution of decane and phenyltrimethoxydecane was used in the same manner as in Synthesis Example 1 except that the IPA solution of 3-methylpropenyloxypropyltrimethoxydecane was used instead, and the cage-containing sesquiterpene oxide was obtained. The composition of the resin (II) was 8.7 g. In the obtained composition, the cage sesquiterpene oxide resin (II) of the present invention is 96% by mass based on the entire composition, and the cage sesquioxane resin represented by the formula (3) is relative to the foregoing. The cage sesquioxane resin (II) was 92% by mass in total, and as a result of mass analysis after separation by a liquid chromatograph, n+m in the formula (3) was 8, 10, and 12. And, n:m is 4:4.

(調製例1:硬化性樹脂組成物(I)) (Preparation Example 1: Curable resin composition (I))

混合合成例1中獲得之籠型倍半矽氧烷樹脂(I):60質量份(換算成籠型倍半矽氧烷樹脂)、三羥甲基丙烷三丙烯酸酯:25質量份、二環戊基二丙烯酸酯:15質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(I)。針對該硬化 性樹脂組成物(I)進行折射率測定,折射率為1.529,確認獲得透明之硬化物。所得硬化性樹脂組成物(I)之組成示於表1。 The cage type sesquiterpene oxide resin (I) obtained in the synthesis example 1 was mixed: 60 parts by mass (calculated as a cage sesquioxane resin), trimethylolpropane triacrylate: 25 parts by mass, two rings Pentyl diacrylate: 15 parts by mass and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (I). For the hardening The resin composition (I) was measured for refractive index, and the refractive index was 1.529, and it was confirmed that a transparent cured product was obtained. The composition of the obtained curable resin composition (I) is shown in Table 1.

(調製例2:硬化性樹脂組成物(II)) (Preparation Example 2: Curable resin composition (II))

混合合成例1中獲得之籠型倍半矽氧烷樹脂(I):30質量份(換算成籠型倍半矽氧烷樹脂)、二環戊基二丙烯酸酯:35質量份、季戊四醇四丙烯酸酯:35質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(II)。針對該硬化性樹脂組成物(II)進行折射率測定,折射率為1.531,確認獲得透明之硬化物。所得硬化性樹脂組成物(II)之組成示於表1。 The cage type sesquiterpene oxide resin (I) obtained in Synthesis Example 1 was mixed: 30 parts by mass (calculated as a cage sesquioxane resin), dicyclopentyl diacrylate: 35 parts by mass, pentaerythritol tetraacrylic acid Ester: 35 parts by mass and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (II). The refractive index of the curable resin composition (II) was measured, and the refractive index was 1.531, and it was confirmed that a transparent cured product was obtained. The composition of the obtained curable resin composition (II) is shown in Table 1.

(調製例3:硬化性樹脂組成物(III)) (Preparation Example 3: Curable resin composition (III))

混合合成例1中獲得之籠型倍半矽氧烷樹脂(I):10質量份(換算成籠型倍半矽氧烷樹脂)、三羥甲基丙烷三丙烯酸酯:65質量份、二環戊基二丙烯酸酯:35質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(III)。針對該硬化性樹脂組成物(III)進行折射率測定,折射率為1.531,確認獲得透明之硬化物。所得硬化性樹脂組成物(III)之組成示於表1。 The cage type sesquiterpene oxide resin (I) obtained in Synthesis Example 1 was mixed: 10 parts by mass (calculated as a cage sesquioxane resin), trimethylolpropane triacrylate: 65 parts by mass, two rings Pentyl diacrylate: 35 parts by mass and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (III). The refractive index of the curable resin composition (III) was measured, and the refractive index was 1.531, and it was confirmed that a transparent cured product was obtained. The composition of the obtained curable resin composition (III) is shown in Table 1.

(調製例4:硬化性樹脂組成物(IV)) (Preparation Example 4: Curable resin composition (IV))

混合合成例2中獲得之籠型倍半矽氧烷樹脂(II):15質量份(換算成籠型倍半矽氧烷樹脂)、三羥甲基丙烷三丙烯酸酯:50質量份、雙酚茀二丙烯酸酯:35質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(IV)。針對該硬化性樹脂組成物(IV)進行折射率測定,折射率為1.558,確認獲得透明之硬化物。所得硬化性樹脂組成物(IV)之組成示於表1。 The cage type sesquiterpene oxide resin (II) obtained in Synthesis Example 2: 15 parts by mass (calculated as a cage sesquioxane resin), trimethylolpropane triacrylate: 50 parts by mass, bisphenol Toluene diacrylate: 35 parts by mass and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (IV). The refractive index of the curable resin composition (IV) was measured, and the refractive index was 1.558, and it was confirmed that a transparent cured product was obtained. The composition of the obtained curable resin composition (IV) is shown in Table 1.

(調製例5:硬化性樹脂組成物(V)) (Preparation Example 5: Curable resin composition (V))

混合合成例2中獲得之籠型倍半矽氧烷樹脂(II):35質量份(換算成籠型倍半矽氧烷樹脂)、季戊四醇四丙烯酸酯:25質量份、雙酚茀二丙烯酸酯:40質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(V)。針對該硬化性樹脂組成物(V)進行折射率測定,折射率為1.560,確認獲得透明之硬化物。所得硬化性樹脂組成物(V)之組成示於表1。 The cage type sesquiterpene oxide resin (II) obtained in Synthesis Example 2 was mixed: 35 parts by mass (calculated as a cage sesquioxane resin), pentaerythritol tetraacrylate: 25 parts by mass, bisphenol fluorene diacrylate 40 parts by mass and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (V). The refractive index of the curable resin composition (V) was measured, and the refractive index was 1.560, and it was confirmed that a transparent cured product was obtained. The composition of the obtained curable resin composition (V) is shown in Table 1.

(調製例6:硬化性樹脂組成物(VI)) (Preparation Example 6: Curable resin composition (VI))

混合二環戊基二丙烯酸酯:35質量份、季戊四醇四丙烯酸酯:65質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物 (VI)。所得硬化性樹脂組成物(VI)之組成示於表1。 Mixed dicyclopentyl diacrylate: 35 parts by mass, pentaerythritol tetraacrylate: 65 parts by mass, and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin Composition (VI). The composition of the obtained curable resin composition (VI) is shown in Table 1.

(調製例7:硬化性樹脂組成物(VII)) (Preparation Example 7: Curable resin composition (VII))

混合季戊四醇四丙烯酸酯:25質量份、雙酚茀二丙烯酸酯:40質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(VII)。所得硬化性樹脂組成物(VII)之組成示於表1。 Mixed pentaerythritol tetraacrylate: 25 parts by mass, bisphenol fluorene diacrylate: 40 parts by mass, and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by mass to obtain a liquid curable resin composition (VII). The composition of the obtained curable resin composition (VII) is shown in Table 1.

(調製例8:硬化性樹脂組成物(VIII)) (Preparation Example 8: Curable resin composition (VIII))

混合合成例1中獲得之籠型倍半矽氧烷樹脂(I):5質量份、二環戊基二丙烯酸酯:40質量份、季戊四醇四丙烯酸酯:55質量份、及作為光聚合起始劑之1-羥基環己基苯基酮:2.5質量份,獲得液狀之硬化性樹脂組成物(VIII)。所得硬化性樹脂組成物(VIII)組成示於表1。 The cage type sesquiterpene oxide resin (I) obtained in Synthesis Example 1 was mixed: 5 parts by mass, dicyclopentyl diacrylate: 40 parts by mass, pentaerythritol tetraacrylate: 55 parts by mass, and as a photopolymerization initiation 1-hydroxycyclohexyl phenyl ketone of the agent: 2.5 parts by mass to obtain a liquid curable resin composition (VIII). The composition of the obtained curable resin composition (VIII) is shown in Table 1.

(實施例1) (Example 1)

首先,將調製例1中獲得之硬化性樹脂組成物(I)滴加於設置在玻璃板上之T玻璃系玻璃布(商品名:T Glass Yarn(日東紡績公司製),折射率1.530,厚度96μm),以玻璃板覆蓋上面,自上下面以玻璃板夾持,邊施加壓力邊將硬化性樹脂組成物含浸於玻璃布中。接著,以使該玻璃布含浸物夾持於玻璃板中之狀態,使用80W/cm之高壓水銀燈,以2000mJ/cm2之累積曝光量照射紫外線(波長:365nm),使硬化性樹脂組成物硬化。接著,在氮氣環境下於250℃加熱10分鐘,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維 之質量比(硬化物之質量:玻璃纖維之質量)為46:54之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 First, the curable resin composition (I) obtained in Preparation Example 1 was dropped on a T glass-based glass cloth (trade name: T Glass Yarn (manufactured by Nitto Bose Co., Ltd.), which was placed on a glass plate, and had a refractive index of 1.530. 96 μm), the upper surface was covered with a glass plate, and the glass plate was sandwiched from the upper and lower sides, and the curable resin composition was impregnated into the glass cloth while applying pressure. Then, the glass cloth impregnated material was placed in a glass plate, and a high-pressure mercury lamp of 80 W/cm was used to irradiate ultraviolet rays (wavelength: 365 nm) at a cumulative exposure amount of 2000 mJ/cm 2 to harden the curable resin composition. . Subsequently, the mixture was heated at 250 ° C for 10 minutes in a nitrogen atmosphere to obtain a mass ratio of the cured product of the curable resin composition per 1 m 2 to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 46: A glass fiber composite resin substrate of 54. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(實施例2) (Example 2)

除使用調製例2中獲得之硬化性樹脂組成物(II)代替硬化性樹脂組成物(I)以外,餘與實施例1同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為48:52之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 Prepared in Example 2 except that the obtained curable resin composition (II) in place of curable resin composition (I) except that I and Example 1, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the material to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 48:52. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(實施例3) (Example 3)

除使用調製例3中獲得之硬化性樹脂組成物(III)代替硬化性樹脂組成物(I)以外,餘與實施例1同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為44:56之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 Preparation Example 3 except for using the obtained curable resin composition (III) in place of curable resin composition (I) except that I and Example 1, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the object to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 44:56. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(實施例4) (Example 4)

除使用調製例4中獲得之硬化性樹脂組成物(IV)代替硬化性樹脂組成物(I),且使用E玻璃系玻璃布(商品名:2116/AS887AW(旭化成E材料公司製造)、折射率1.558、厚度96μm)代替T玻璃系玻璃布以外,餘與實施例1同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為52:48之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 The curable resin composition (IV) obtained in Preparation Example 4 was used instead of the curable resin composition (I), and an E glass-based glass cloth (trade name: 2116/AS887AW (manufactured by Asahi Kasei E Materials Co., Ltd.), refractive index was used. 1.558 and a thickness of 96 μm, in addition to the T glass-based glass cloth, the mass ratio of the cured product of the curable resin composition per 1 m 2 and the glass fiber was obtained in the same manner as in Example 1 (mass of the cured product: glass) The fiber mass is a 52:48 glass fiber composite resin substrate. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(實施例5) (Example 5)

除使用調製例5中獲得之硬化性樹脂組成物(V)代替硬化性樹脂組成物(IV)以外,餘與實施例4同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為48:52之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 The modulation obtained in Example 5 except that the curable resin composition (V) in place of curable resin composition (IV) except that the same I Example 4, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the material to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 48:52. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(比較例1) (Comparative Example 1)

除使用調製例6中獲得之硬化性樹脂組成物(VI)代替硬化性樹脂組成物(I)以外,餘與實施例1同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為 47:53之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 Prepared in Example 6 except that the obtained curable resin composition (VI) in place of curable resin composition (I) except that I and Example 1, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the material to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 47:53. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(比較例2) (Comparative Example 2)

除使用調製例7中獲得之硬化性樹脂組成物(VII)代替硬化性樹脂組成物(I)以外,餘與實施例4同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為49:51之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 Preparation Example 7 except that the obtained curable resin composition (VII) in place of curable resin composition (I) except that in Example 4 with the same I, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the material to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 49:51. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

(比較例3) (Comparative Example 3)

除使用調製例8中獲得之硬化性樹脂組成物(VIII)代替硬化性樹脂組成物(I)以外,餘與實施例1同樣,獲得厚度0.1mm、每1m2之硬化性樹脂組成物之硬化物與玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為47:53之玻璃纖維複合化樹脂基板。針對所得玻璃纖維複合化樹脂基板進行全光線透射率測定及耐熱性評價之結果示於表2。 Preparation Example 8 except that the obtained curable resin composition (VIII) in place of curable resin composition (I) except that I and Example 1, to obtain a thickness of 0.1mm, the cured composition per 1m 2 of the curable resin A glass fiber composite resin substrate having a mass ratio of the material to the glass fiber (the mass of the cured product: the mass of the glass fiber) of 47:53. The results of the total light transmittance measurement and the heat resistance evaluation of the obtained glass fiber composite resin substrate are shown in Table 2.

由表2所示之結果了解,本發明之玻璃纖維複合化樹脂基板之全光線透射率均為90%以上,且玻璃轉移溫度充分大,動黏彈性降低率亦維持在20%以下,確認具有高水準之耐熱性及透明性。又,熱膨脹係數為15ppm/K以下,亦確認熱膨脹係數相當小。相對於此,過去之玻璃纖維複合化樹脂基板(比較例1、2)中,全光線透射率雖為90%以上,但確認玻璃轉移溫度低,動黏彈性率降低率及熱膨脹係數亦差。 As is clear from the results shown in Table 2, the total light transmittance of the glass fiber composite resin substrate of the present invention is 90% or more, and the glass transition temperature is sufficiently large, and the dynamic viscoelasticity reduction rate is also maintained at 20% or less. High level of heat resistance and transparency. Further, the coefficient of thermal expansion was 15 ppm/K or less, and it was confirmed that the coefficient of thermal expansion was relatively small. On the other hand, in the conventional glass fiber composite resin substrate (Comparative Examples 1 and 2), although the total light transmittance was 90% or more, it was confirmed that the glass transition temperature was low, and the dynamic viscoelasticity reduction rate and the thermal expansion coefficient were also inferior.

〔產業上之可利用性〕 [Industrial Applicability]

如以上之說明,依據本發明可提供具有高水準之耐熱性及透明性,且熱膨脹係數充分小之玻璃纖維複合化樹脂基板。如此本發明之玻璃纖維複合化樹脂基板尤其在高溫時彈性模數亦未降低而具有高水準之耐熱性,故作為例如可撓性顯示器、觸控面板、太陽能電池等之用途所使用之玻璃替代基板非常有用。 As described above, according to the present invention, it is possible to provide a glass fiber composite resin substrate having a high level of heat resistance and transparency and having a sufficiently small thermal expansion coefficient. The glass fiber composite resin substrate of the present invention has a high level of heat resistance even at a high temperature, and has high heat resistance. Therefore, it is used as a glass for use in applications such as flexible displays, touch panels, and solar cells. The substrate is very useful.

Claims (9)

一種玻璃纖維複合化樹脂基板,其係由硬化性樹脂組成物與玻璃纖維所成之玻璃纖維複合化樹脂基板,其中前述硬化性樹脂組成物含有(A)具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成之群組選出之至少一種基之籠型倍半矽氧烷樹脂,(B)具有兩個以上之由下述通式(1)~(2)表示之基所組成之群組選出之不飽和官能基之前述籠型倍半矽氧烷樹脂以外之不飽和化合物,-R1-CR2=CH2...(1) -CR2=CH2...(2)〔式(1)中,R1表示由伸烷基、亞烷基及-OCO-基所組成之群組選出之任一者,且式(1)~(2)中,R2各獨立表示氫原子或烷基〕,及(C)硬化觸媒且前述(A)籠型倍半矽氧烷樹脂之含量相對於前述硬化性樹脂組成物全體為5~90質量%。 A glass fiber composite resin substrate comprising a glass fiber composite resin substrate made of a curable resin composition and a glass fiber, wherein the curable resin composition contains (A) a (meth) acrylonitrile group, a cage-type sesquiterpene oxide resin selected from the group consisting of a glycidyl group and a vinyl group, and (B) having two or more bases represented by the following general formulae (1) to (2) An unsaturated compound other than the aforementioned cage sesquioxane resin selected from the group consisting of unsaturated functional groups, -R 1 -CR 2 =CH 2 . . . (1) -CR 2 =CH 2 . . . (2) In the formula (1), R 1 represents any one selected from the group consisting of an alkylene group, an alkylene group and an -OCO- group, and in the formulae (1) to (2), each of R 2 The content of the (A) cage sesquioxane resin is 5 to 90% by mass based on the entire curable resin composition, and the (C) curing catalyst is independently represented by the hydrogen atom or the alkyl group. 如請求項1之玻璃纖維複合化樹脂基板,其中前述(A)籠型倍半矽氧烷樹脂為以下述通式(3)表示之籠型倍半矽氧烷樹脂, 〔R3SiO3/2n〔R4SiO3/2m...(3){式(3)中,R3表示具有由(甲基)丙烯醯基、縮水甘油基及乙烯基所組成之群組選出之基之有機基,R4表示由氫原子、碳數1~20之烴基、碳數1~20之烷氧基、及碳數1~20之烷基矽氧基所組成之群組選出之任一者,n及m表示滿足下述式(i)~(iii)所示條件之整數:n≧1...(i) m≧0...(ii) n+m=h...(iii)〔式(iii)中,h表示由8、10、12及14所組成之群組選出之整數〕,n及m分別為2以上時R3及R4可分別相同亦可不同}。 The glass fiber composite resin substrate according to claim 1, wherein the (A) cage type sesquiterpene oxide resin is a cage type sesquiterpene oxide resin represented by the following formula (3), [R 3 SiO 3 / 2 ] n [R 4 SiO 3/2 ] m . . . (3) In the formula (3), R 3 represents an organic group having a group selected from the group consisting of a (meth) acryl fluorenyl group, a glycidyl group, and a vinyl group, and R 4 represents a hydrogen atom and a carbon number. Any one selected from the group consisting of a hydrocarbon group of 1 to 20, an alkoxy group having 1 to 20 carbon atoms, and an alkyloxy group having 1 to 20 carbon atoms, n and m are represented by the following formula (i) An integer of the condition shown in ~(iii): n≧1. . . (i) m≧0. . . (ii) n+m=h. . . (iii) [in the formula (iii), h represents an integer selected from the group consisting of 8, 10, 12 and 14], and when n and m are respectively 2 or more, R 3 and R 4 may be the same or different. . 如請求項2之玻璃纖維複合化樹脂基板,其中前述通式(3)中,n與m之比(n:m)為10:0~4:6。 The glass fiber composite resin substrate according to claim 2, wherein a ratio (n: m) of n to m in the above formula (3) is from 10:0 to 4:6. 如請求項2或3項之玻璃纖維複合化樹脂基板,其中以前述通式(3)表示之籠型倍半矽氧烷樹脂相對於前述(A)籠型倍半矽氧烷樹脂全體為50質量%以上。 The glass fiber composite resin substrate according to claim 2 or 3, wherein the cage type sesquiterpene oxide resin represented by the above formula (3) is 50 with respect to the entire (A) cage sesquioxane resin. More than % by mass. 如請求項1~4中任一項之玻璃纖維複合化樹脂基板,其中前述(B)不飽和化合物具有之前述不飽和官能基為由丙烯醯基、甲基丙烯醯基、烯丙基及乙烯基所組成 之群組選出之至少一種基。 The glass fiber composite resin substrate according to any one of claims 1 to 4, wherein the (B) unsaturated compound has the aforementioned unsaturated functional group from an acrylonitrile group, a methacryl oxime group, an allyl group and an ethylene group. Base composition At least one basis selected by the group. 如請求項1~5中任一項之玻璃纖維複合化樹脂基板,其中前述(B)不飽和化合物具有之前述不飽和官能基之數每一化合物分子為2~10個。 The glass fiber composite resin substrate according to any one of claims 1 to 5, wherein the (B) unsaturated compound has a number of the unsaturated functional groups of from 2 to 10 per compound molecule. 如請求項1~6中任一項之玻璃纖維複合化樹脂基板,其係將前述硬化性樹脂組成物含浸於前述玻璃纖維之後,使前述硬化性樹脂組成物硬化者。 The glass fiber composite resin substrate according to any one of claims 1 to 6, wherein the curable resin composition is cured by impregnating the glass fiber with the curable resin composition. 如請求項7之玻璃纖維複合化樹脂基板,其中前述硬化性樹脂組成物之硬化物與前述玻璃纖維之質量比(硬化物之質量:玻璃纖維之質量)為20:80~70:30。 The glass fiber composite resin substrate according to claim 7, wherein the mass ratio of the cured product of the curable resin composition to the glass fiber (the mass of the cured product: the mass of the glass fiber) is 20:80 to 70:30. 如請求項1~8中任一項之玻璃纖維複合化樹脂基板,其厚度為0.03~0.5mm。 The glass fiber composite resin substrate according to any one of claims 1 to 8, which has a thickness of 0.03 to 0.5 mm.
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