JP6552161B2 - 薄膜トランジスタアレイ基板、それを含む表示装置 - Google Patents
薄膜トランジスタアレイ基板、それを含む表示装置 Download PDFInfo
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- JP6552161B2 JP6552161B2 JP2014090585A JP2014090585A JP6552161B2 JP 6552161 B2 JP6552161 B2 JP 6552161B2 JP 2014090585 A JP2014090585 A JP 2014090585A JP 2014090585 A JP2014090585 A JP 2014090585A JP 6552161 B2 JP6552161 B2 JP 6552161B2
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- 239000010409 thin film Substances 0.000 title claims description 104
- 239000000758 substrate Substances 0.000 title claims description 15
- 239000003990 capacitor Substances 0.000 claims description 33
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- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 101150037603 cst-1 gene Proteins 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 235000017060 Arachis glabrata Nutrition 0.000 description 3
- 241001553178 Arachis glabrata Species 0.000 description 3
- 235000010777 Arachis hypogaea Nutrition 0.000 description 3
- 235000018262 Arachis monticola Nutrition 0.000 description 3
- 102100027094 Echinoderm microtubule-associated protein-like 1 Human genes 0.000 description 3
- 101001057941 Homo sapiens Echinoderm microtubule-associated protein-like 1 Proteins 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
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- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- -1 region Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Description
20 走査駆動部、
30 データ駆動部、
40 発光制御駆動部、
50 制御部、
60 電源供給部、
100 表示装置、
101 基板、
102 第1絶縁層、
103 第2絶縁層、
110 第1導電層、
120 第2導電層、
130 ノードコンタクトホール、
131 第1コンタクトホール部、
132 第2コンタクトホール部、
133 連結部、
140 連結ノード、
150 第3導電層。
Claims (12)
- アクティブ層、ゲート電極、ソース電極及びドレイン電極を含む薄膜トランジスタと、
前記アクティブ層、前記ゲート電極、前記ソース電極及び前記ドレイン電極のうち選択されたいずれか一つの電極と同じ層に配置された第1導電層と、
前記第1導電層と異なる層に配置された第2導電層と、
前記第1導電層を露出させる第1コンタクトホール部、前記第2導電層を露出させる第2コンタクトホール部、及び前記第1コンタクトホール部と前記第2コンタクトホール部とを連結し、前記第1コンタクトホール部の幅、及び前記第2コンタクトホール部の幅よりも狭い幅を有する連結ホール部を含むノードコンタクトホールと、
前記ノードコンタクトホールに形成され、前記第1導電層と前記第2導電層とを電気的に連結する連結ノードと、を備え、
前記第1コンタクトホール部および前記第2コンタクトホール部は、前記連結ホール部よりも深いことを特徴とする薄膜トランジスタアレイ基板。 - 前記第1導電層と、前記第2導電層とが重畳する部分の少なくとも一部は、前記連結ホール部と重畳することを特徴とする請求項1に記載の薄膜トランジスタアレイ基板。
- 前記連結ホール部の前記第1コンタクトホール部から、前記第2コンタクトホール部に延びる方向の長さは、1.5μm以下であることを特徴とする請求項1または2に記載の薄膜トランジスタアレイ基板。
- 一つ以上の薄膜トランジスタと、一つ以上のキャパシタとを含み、複数の配線に連結された画素回路、及び前記画素回路と連結された表示素子を含む複数の画素と、
前記画素に位置し、前記薄膜トランジスタに含まれたアクティブ層、ゲート電極、ソース電極及びドレイン電極のうち選択されたいずれか一つの電極と同じ層に配置された第1導電層と、
前記第1導電層と異なる層に配置された第2導電層と、
前記第1導電層を露出させる第1コンタクトホール部、前記第2導電層を露出させる第2コンタクトホール部、及び前記第1コンタクトホール部と前記第2コンタクトホール部とを連結し、前記第1コンタクトホール部の幅、及び前記第2コンタクトホール部の幅よりも狭い幅を有する連結ホール部を含むノードコンタクトホールと、
前記ノードコンタクトホールに形成され、前記第1導電層と前記第2導電層とを電気的に連結する連結ノードと、を備え、
前記第1コンタクトホール部および前記第2コンタクトホール部は、前記連結ホール部よりも深いことを特徴とする表示装置。 - 前記第1導電層と、前記第2導電層とが重畳する部分の少なくとも一部は、前記連結ホール部と重畳することを特徴とする請求項4に記載の表示装置。
- 前記連結ホール部の前記第1コンタクトホール部から、前記第2コンタクトホール部に延びる方向の長さは、1.5μm以下であることを特徴とする請求項4または5に記載の表示装置。
- 前記第1導電層と前記第2導電層との間に配置された第1絶縁層をさらに備え、前記第1導電層と前記第2導電層は、前記第1絶縁層により分離されていることを特徴とする請求項4〜6のいずれか一つに記載の表示装置。
- 前記第2導電層上に配置された第2絶縁層をさらに備え、前記第2絶縁層の一領域は、前記第1コンタクトホール部と、前記第2コンタクトホール部との間に配置されたことを特徴とする請求項4〜7のいずれか一つに記載の表示装置。
- 前記第1コンタクトホール部と、前記第2コンタクトホール部との間に配置された前記第2絶縁層上には、前記第1コンタクトホール部と、前記第2コンタクトホール部とを連結する前記連結ホール部が配置されることを特徴とする請求項8に記載の表示装置。
- 前記薄膜トランジスタは、第1アクティブ層、第1ゲート電極、第1ソース電極及び第1ドレイン電極を含む駆動薄膜トランジスタと、第2アクティブ層、第2ゲート電極、第2ソース電極及び第2ドレイン電極を含むスイッチング薄膜トランジスタとを備え、前記第1ゲート電極と前記第2ゲート電極は、異なる層に配置されたことを特徴とする請求項4〜9のいずれか一つに記載の表示装置。
- 前記キャパシタの下部電極は、前記第2ゲート電極と同じ層に配置され、前記キャパシタの上部電極は、前記第1ゲート電極と同じ層に配置され、前記第1導電層は、前記第1アクティブ層及び前記第2アクティブ層と同じ層に配置され、前記第2導電層は、前記キャパシタの前記下部電極または前記上部電極と同じ層に配置されたことを特徴とする請求項10に記載の表示装置。
- 前記表示素子は、第1電極、第2電極、及び前記第1電極と第2電極との間に配置された有機発光層を備える有機発光素子であることを特徴とする請求項4〜11のいずれか一つに記載の表示装置。
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KR1020130099243A KR102114315B1 (ko) | 2013-08-21 | 2013-08-21 | 박막 트랜지스터 어레이 기판, 이를 포함하는 표시 장치, 및 박막 트랜지스터 어레이 기판의 제조 방법 |
KR10-2013-0099243 | 2013-08-21 |
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JP2015041102A JP2015041102A (ja) | 2015-03-02 |
JP6552161B2 true JP6552161B2 (ja) | 2019-07-31 |
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US (1) | US9293482B2 (ja) |
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US9472605B2 (en) * | 2014-11-17 | 2016-10-18 | Apple Inc. | Organic light-emitting diode display with enhanced aperture ratio |
JP6855004B2 (ja) * | 2015-12-25 | 2021-04-07 | 天馬微電子有限公司 | 表示装置及び表示装置の製造方法 |
KR20210002287A (ko) * | 2019-06-28 | 2021-01-07 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
KR20210079468A (ko) * | 2019-12-19 | 2021-06-30 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2024031240A1 (zh) * | 2022-08-08 | 2024-02-15 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
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JPH08306774A (ja) * | 1995-05-01 | 1996-11-22 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
KR100273703B1 (ko) * | 1997-12-12 | 2001-03-02 | 윤종용 | 콘택관련 결함 및 콘택저항을 감소하기 위한 반도체 장치의 콘택구조 및 그 제조 방법 |
KR100637433B1 (ko) * | 2004-05-24 | 2006-10-20 | 삼성에스디아이 주식회사 | 발광 표시 장치 |
JP3666305B2 (ja) | 1999-06-14 | 2005-06-29 | セイコーエプソン株式会社 | 半導体装置、電気光学装置及び半導体装置の製造方法 |
JP2002176179A (ja) | 2000-12-08 | 2002-06-21 | Seiko Epson Corp | 電気光学装置および電気光学装置の製造方法、並びに半導体装置 |
JP4102734B2 (ja) * | 2003-10-03 | 2008-06-18 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
JP5078288B2 (ja) | 2005-06-28 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 発光装置 |
US7737442B2 (en) | 2005-06-28 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8232598B2 (en) * | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
JP5286992B2 (ja) * | 2008-07-09 | 2013-09-11 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
KR20120079351A (ko) * | 2011-01-04 | 2012-07-12 | 삼성모바일디스플레이주식회사 | 유기발광 표시장치 및 그 제조방법 |
CN103003861B (zh) * | 2011-07-19 | 2015-07-01 | 株式会社日本有机雷特显示器 | 显示装置以及显示装置的制造方法 |
KR101846411B1 (ko) * | 2011-11-03 | 2018-04-09 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
KR20140029992A (ko) * | 2012-08-31 | 2014-03-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 이를 포함하는 표시 장치 |
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US9293482B2 (en) | 2016-03-22 |
KR102114315B1 (ko) | 2020-05-25 |
KR20150021818A (ko) | 2015-03-03 |
JP2015041102A (ja) | 2015-03-02 |
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