JP6539390B2 - 化学および電解の少なくとも一方の表面処理のための分布システム - Google Patents

化学および電解の少なくとも一方の表面処理のための分布システム Download PDF

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Publication number
JP6539390B2
JP6539390B2 JP2018139053A JP2018139053A JP6539390B2 JP 6539390 B2 JP6539390 B2 JP 6539390B2 JP 2018139053 A JP2018139053 A JP 2018139053A JP 2018139053 A JP2018139053 A JP 2018139053A JP 6539390 B2 JP6539390 B2 JP 6539390B2
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Japan
Prior art keywords
process fluid
distribution
substrate
channel
surface treatment
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JP2018139053A
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English (en)
Japanese (ja)
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JP2019049046A (ja
Inventor
エツリンゲル，ヘルベルト
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Semsysco GmbH
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Semsysco GmbH
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP2018139053A 2017-07-27 2018-07-25 化学および電解の少なくとも一方の表面処理のための分布システム Active JP6539390B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1712064.3 2017-07-27
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019105194A Division JP7161445B2 (ja) 2017-07-27 2019-06-05 化学および電解の少なくとも一方の表面処理のための分布システム

Publications (2)

Publication Number Publication Date
JP2019049046A JP2019049046A (ja) 2019-03-28
JP6539390B2 true JP6539390B2 (ja) 2019-07-03

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018139053A Active JP6539390B2 (ja) 2017-07-27 2018-07-25 化学および電解の少なくとも一方の表面処理のための分布システム
JP2019105194A Active JP7161445B2 (ja) 2017-07-27 2019-06-05 化学および電解の少なくとも一方の表面処理のための分布システム

Family Applications After (1)

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JP2019105194A Active JP7161445B2 (ja) 2017-07-27 2019-06-05 化学および電解の少なくとも一方の表面処理のための分布システム

Country Status (4)

Country Link
JP (2) JP6539390B2 (es)
CN (1) CN109306474A (es)
GB (1) GB2564893B (es)
TW (2) TWI800356B (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3825445A1 (en) * 2019-11-22 2021-05-26 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3828316B1 (en) * 2019-11-26 2023-09-13 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (ja) * 1983-05-11 1984-11-26 Hitachi Ltd 貴金属メツキ法
JPS6393897A (ja) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd めつき液噴射式めつき処理装置
WO1995031590A1 (de) * 1994-05-11 1995-11-23 Siemens S.A. Vorrichtung zur behandlung von leiterplatten
JP4560181B2 (ja) * 2000-06-30 2010-10-13 アイシン高丘株式会社 燃料電池セパレータの製造方法および製造装置
JP3924537B2 (ja) 2001-03-28 2007-06-06 富士通株式会社 電解めっき槽
KR101027489B1 (ko) * 2002-07-18 2011-04-06 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법
DE10255884B4 (de) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh Düsenanordnung
CN100436643C (zh) * 2003-03-11 2008-11-26 株式会社荏原制作所 镀覆装置
JP4624738B2 (ja) * 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
JP2006111976A (ja) * 2006-01-19 2006-04-27 Ebara Udylite Kk 酸性銅めっき方法および酸性銅めっき装置
KR100906662B1 (ko) * 2007-09-14 2009-07-07 강원대학교산학협력단 스러스트 자기베어링 시스템
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (it) 2015-01-30 2016-08-15 Acrom S A Procedimento ecologico per la cromatura in continuo di barre e relativa apparecchiatura.
CN104862767B (zh) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 镀铜槽

Also Published As

Publication number Publication date
TW201911408A (zh) 2019-03-16
GB201712064D0 (en) 2017-09-13
TW202230507A (zh) 2022-08-01
JP7161445B2 (ja) 2022-10-26
JP2019049046A (ja) 2019-03-28
GB2564893A (en) 2019-01-30
TWI759514B (zh) 2022-04-01
GB2564893B (en) 2020-12-16
CN109306474A (zh) 2019-02-05
TWI800356B (zh) 2023-04-21
JP2019167628A (ja) 2019-10-03

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