JP6536306B2 - 鉛フリーはんだ合金と車載電子回路 - Google Patents

鉛フリーはんだ合金と車載電子回路 Download PDF

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Publication number
JP6536306B2
JP6536306B2 JP2015178438A JP2015178438A JP6536306B2 JP 6536306 B2 JP6536306 B2 JP 6536306B2 JP 2015178438 A JP2015178438 A JP 2015178438A JP 2015178438 A JP2015178438 A JP 2015178438A JP 6536306 B2 JP6536306 B2 JP 6536306B2
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Prior art keywords
solder
solder alloy
mass
electronic circuit
crack
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Japanese (ja)
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JP2016047555A5 (enrdf_load_stackoverflow
JP2016047555A (ja
Inventor
俊策 吉川
俊策 吉川
尚子 平井
尚子 平井
賢 立花
賢 立花
芳恵 立花
芳恵 立花
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2015178438A 2015-09-10 2015-09-10 鉛フリーはんだ合金と車載電子回路 Active JP6536306B2 (ja)

Priority Applications (1)

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JP2015178438A JP6536306B2 (ja) 2015-09-10 2015-09-10 鉛フリーはんだ合金と車載電子回路

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JP2015178438A JP6536306B2 (ja) 2015-09-10 2015-09-10 鉛フリーはんだ合金と車載電子回路

Related Parent Applications (1)

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JP2015510145A Division JP5811304B2 (ja) 2013-04-02 2014-04-03 鉛フリーはんだ合金と車載電子回路

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2015251535A Division JP6052381B2 (ja) 2015-12-24 2015-12-24 鉛フリーはんだ合金
JP2015251689A Division JP2016107343A (ja) 2015-12-24 2015-12-24 鉛フリーはんだ合金と車載電子回路
JP2018101283A Division JP2018171656A (ja) 2018-05-28 2018-05-28 鉛フリーはんだ合金と車載電子回路
JP2018228464A Division JP2019072770A (ja) 2018-12-05 2018-12-05 鉛フリーはんだ合金と車載電子回路

Publications (3)

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JP2016047555A JP2016047555A (ja) 2016-04-07
JP2016047555A5 JP2016047555A5 (enrdf_load_stackoverflow) 2017-04-20
JP6536306B2 true JP6536306B2 (ja) 2019-07-03

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JP2015178438A Active JP6536306B2 (ja) 2015-09-10 2015-09-10 鉛フリーはんだ合金と車載電子回路

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6828880B2 (ja) * 2016-10-06 2021-02-10 株式会社弘輝 はんだペースト、はんだ合金粉
TWI725664B (zh) * 2018-12-14 2021-04-21 日商千住金屬工業股份有限公司 焊料合金、焊料膏、焊料預形體及焊料接頭
JP6624322B1 (ja) 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
JP2024013585A (ja) * 2022-07-20 2024-02-01 日立Astemo株式会社 半導体装置
CN119820173B (zh) * 2025-02-19 2025-08-08 大连理工大学 一种适用于SoC芯片封装的高强度高塑性Sn基无铅钎料合金

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353662B2 (ja) * 1997-08-07 2002-12-03 富士電機株式会社 はんだ合金
JP3353640B2 (ja) * 1997-04-16 2002-12-03 富士電機株式会社 はんだ合金
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP2005340275A (ja) * 2004-05-24 2005-12-08 Denso Corp 電子部品接合体、その製造方法、およびそれを含む電子装置
JP2007237252A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 自動車搭載電子部材用鉛フリーハンダ合金、ハンダボール及び電子部材
EP2578350B1 (en) * 2010-06-01 2018-10-03 Senju Metal Industry Co., Ltd No-clean lead-free solder paste
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
KR101455967B1 (ko) * 2012-06-30 2014-10-31 센주긴조쿠고교 가부시키가이샤 납프리 땜납 볼
WO2014013632A1 (ja) * 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP5893528B2 (ja) * 2012-07-27 2016-03-23 新日鉄住金マテリアルズ株式会社 無鉛はんだバンプ接合構造

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