JP6524968B2 - Workpiece warpage measuring method and warpage measuring apparatus - Google Patents

Description

  The present invention relates to a technique for measuring the amount of warpage of a workpiece.

  Conventionally, in the manufacturing process of automobiles and other industrial products, the amount of warpage in the thickness direction of a work is measured to control the quality of a plate-like member (hereinafter referred to as "work"). Patent Document 1 below discloses a specific measuring method for measuring the amount of warpage of this type of work. This measurement method (hereinafter referred to as “first measurement method”) detects the three-dimensional shape of the work surface using moire interferometry or laser focusing, and the thickness of the work based on the detected three-dimensional shape. The amount of warpage in the direction is calculated.

JP, 2015-129703, A

However, the first measurement method described above has the following problems.
That is, this first measurement method detects the three-dimensional shape of the upper surface of the workpiece from above, and does not detect the position of the lower surface of the workpiece directly related to the amount of warp, so the amount of warpage of the workpiece Can not be measured accurately. In addition, in a structure in which another element is stacked on the upper surface of the workpiece, when it is desired to measure the amount of warpage of the workpiece located on the lower side, measuring the three-dimensional shape of the upper surface of the workpiece by another element being in the way Is difficult. Furthermore, the laser measuring instrument used in the laser focusing method is expensive.

  Therefore, in place of the first measurement method, in a state where illumination light is applied to the side surface of the work placed on the upper surface of the surface plate, a measurement method of capturing the work from the side with the camera (hereinafter referred to as “second method Measurement method) can be used. In the case of this second measurement method, the amount of warpage is determined by measuring the vertical distance from the top surface of the platen to the end of the workpiece. This second measurement method has the advantage that the position of the end of the workpiece can be detected directly without using expensive equipment such as a laser measuring device for measuring the amount of warpage of the workpiece. .

  However, in the second measurement method described above, when the entire workpiece end surface or the lower surface of the workpiece is recognized as white light by the illumination light, the workpiece end can not be distinguished from other parts in the photographed image, and the workpiece end is It can be assumed that the position of the is misrecognized. Also, if the side surface of the platen is recognized as white light by the illumination light, when the actual amount of warping of the workpiece is small or zero, the difference in brightness between the platen and the workpiece in the photographed image disappears, making it difficult to understand the boundary. It is difficult to correctly detect the position of the workpiece end. Then, if the position of the end of the workpiece can not be detected correctly, the amount of warpage of the workpiece can not be measured accurately.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a technique effective for accurately measuring the amount of warpage of a plate-like work.

One aspect of the present invention is
A workpiece warpage measuring device that measures the amount of warping of a plate-like workpiece, and
A surface plate, an illumination device for emitting illumination light, and a camera for photographing a corner portion of the work placed on the upper surface of the surface plate together with the side surface of the surface plate from a side view point,
The side surface of the surface plate is connected to the upper surface, and a first detection surface located below the corner of the workpiece, and a second detection surface connected to the upper surface and adjacent to the first detection surface in the horizontal direction The corner is the highest among the workpieces and the luminance of the workpiece and the surface plate are both viewed from the side point of view in the irradiation state of the illumination device while being divided into the detection surface. It is an apparatus for measuring the amount of warpage of a work, wherein the second detection surface is higher than the first detection surface and higher than the first detection surface.

In addition, another aspect of the present invention is
It is a method of measuring the amount of warpage of a work which measures the amount of warpage of a plate-like work,
Prepare a platen, an illumination device for emitting illumination light, and a camera for photographing the corner of the work placed on the upper surface of the platen together with the side surface of the platen from a side view point; A first detection surface connected to the upper surface and located below the corner of the work; and a second detection surface connected to the upper surface and adjacent to the first detection surface in the horizontal direction In the irradiation state of the illumination device, the corner is the highest in the work and the first detection surface with respect to the brightness when both the work and the surface plate are viewed from the side point of view in the irradiation state of the illumination device Setting the second detection surface to be higher than the first detection surface,
A photographing step of photographing with the camera in the irradiation state of the illumination device;
In the method of measuring the amount of warpage of a work.

  According to the above-described workpiece warpage measuring device and method, the plate-like workpiece placed on the upper surface of the surface plate is photographed from the side point of view by the camera in a state in which illumination light is applied by the lighting device. Be done. At this time, the corner portion of the workpiece is detected in a state in which the luminance is relatively high with respect to other portions of the workpiece and the first detection surface of the platen. For this reason, in the captured image captured by the camera, the position of the corner used to obtain the amount of warpage of the workpiece can be correctly detected due to the difference in brightness (brightness / dark difference) with the other part. On the other hand, if the luminance of the first detection surface of the platen is relatively lowered to detect the corner of the workpiece, the position of the corner of the workpiece is incorrect when the actual amount of warping of the workpiece is small or zero. It may be recognized.

  Therefore, the second detection surface of the surface plate is set to be photographed by the camera in a state where the luminance is higher than the luminance of the first detection surface. Therefore, the second detection surface can be easily detected on the basis of the difference in luminance (brightness and darkness difference) with the first detection surface in the captured image captured by the camera. At this time, since the position of the upper side of the second detection surface coincides with the position of the upper surface of the surface plate, the position of the upper surface of the surface plate used to obtain the amount of warpage of the work is also detected by correctly detecting the position of the upper side. It can detect correctly. Then, the amount of warpage of the work can be accurately determined by using the position information of both the position of the corner of the work and the position of the upper surface of the surface plate, both of which are correctly detected. In addition, it is not necessary to use an expensive device such as a laser measuring instrument to measure the amount of warpage of a workpiece.

  As mentioned above, according to each above-mentioned mode, it becomes possible to measure the amount of curvature of a plate-like work precisely.

The figure which shows the curvature amount measuring apparatus of this embodiment. The top view which shows a mode that the corner part of a workpiece | work is image | photographed with a camera from a side view. The top view which shows a mode that the side surface of a surface plate is image | photographed with a camera from a side viewpoint. The flowchart of workpiece | work curvature amount measurement. The figure which shows typically the picked-up image of the workpiece | work in FIG. The figure which shows typically the picked-up image of the workpiece | work whose curvature amount is zero. The figure which shows typically the picked-up image of the workpiece | work in which another member was laminated | stacked on the workpiece | work upper surface. The figure which shows the 1st example of a change of the form which divides the side of a platen. The figure which shows the 2nd example of a change of the form which divides the side of a surface plate. The figure which shows the 3rd example of a change of the form which divides the side of a surface plate.

  In the above warpage measuring device, the illumination device is configured to emit illumination light in the normal direction of the R surface of the corner of the workpiece, and the surface plate has the second detection surface that is the second It is preferable to be comprised by the raw material whose said brightness | luminance is higher than the raw material of 1 detection surface. In this case, the corner of the workpiece is configured to have a higher luminance than the other parts of the workpiece and the first detection surface of the platen by setting the irradiation direction of the illumination device. The second detection surface is configured to have a higher luminance than the first detection surface by selection of the material. By this, it is possible to easily set the brightness of the portion to be recognized in each of the work and the surface plate. In particular, with regard to the luminance at the corner of the workpiece, the luminance can be set only by adjusting the direction of the illumination device, and there is no need to modify the workpiece itself for luminance setting.

  Further, the warpage amount measuring device includes a processing device that calculates the warpage amount of the work from the photographed image captured by the camera, and the processing device calculates the warpage of the work based on the contrast of the photographed image. A first position where the corner portion is located and a second position where an upper side connected to the upper surface of the second detection surface of the surface plate is located are detected, and from the second position to the first position It is preferable to calculate the amount of warpage using the distance in the vertical direction of. According to this processing apparatus, it is possible to automatically calculate the amount of warping of the work from the image captured by the camera.

  In the setting step of the warpage amount measuring method, illumination light is set to be irradiated in the normal direction of the R surface of the corner of the workpiece by the illumination device, and the second detection surface is the first It is preferable to prepare the above-described surface plate made of a material whose luminance is higher than that of the material of the detection surface. By this, it is possible to easily set the brightness of the portion to be recognized in each of the work and the surface plate.

  In the method of measuring the amount of warpage, a first position where the corner of the work is located, and a second position of the surface plate, based on the contrast of the photographed image photographed by the camera in the photographing step. It has a processing step of detecting the second position where the upper side connected to the upper surface is located among the detection surface, and calculating the warping amount using the distance in the vertical direction from the second position to the first position. Is preferred. According to this processing step, it is possible to easily calculate the amount of warpage of the work from the photographed image photographed by the camera.

  Hereinafter, an embodiment of a technique for measuring the amount of warpage of a plate-like work will be described with reference to the drawings.

  In the drawings for describing the present embodiment, the first direction (horizontal direction) along the side surface of the platen for placing the work is indicated by an arrow X, and the second direction perpendicular to the side surface of the platen is an arrow A third direction (height direction of the platen) indicated by Y and perpendicular to both the first direction and the second direction is indicated by an arrow Z.

  As FIG. 1 shows, the curvature amount measuring apparatus 1 of this embodiment is an apparatus which measures the curvature amount of the plate | board thickness direction (3rd direction Z) of the work W of plate shape. The warpage measuring device 1 includes a surface plate 10, an illumination device 20, a camera 30, and a processing device 40.

  The planar shape of the work W is a rectangle having four corners. An R-surface process is applied to one corner Wa of the work W.

  The platen 10 is configured as a horizontal pedestal having an upper surface 11 for placing the workpiece W thereon. The upper surface 11 is a plane (reference plane) defined by both the first direction X and the second direction Y. The “warpage amount” mentioned here is defined as a floating amount in the vertical direction (the third direction Z) of the end portion of the workpiece with respect to the upper surface 11 which is the reference surface, for the workpiece W placed on the upper surface 11 of the platen 10. The side surface 12 of the platen 10 is a plane defined by both the first direction X and the third direction Z, and is configured as an opposing surface that faces the illumination device 20 and the camera 30.

  The illumination device 20 has a function of emitting illumination light. In the present embodiment, an LED is used as a light source of the lighting device 20. The illumination device 20 is oblique illumination disposed so as to apply illumination light to both the workpiece W as a target and the surface plate 10 from an oblique direction with respect to the imaging surface of the camera 30. That is, the illumination device for illuminating the workpiece W and the illumination device for illuminating the surface plate 10 are combined by one illumination device 20. Thereby, the number of lighting devices can be reduced.

  Note that an illumination device for applying illumination light to the work W and an illumination device for applying illumination light to the surface plate 10 may be provided separately. In addition to the LED, a halogen lamp, a fluorescent lamp, a tungsten lamp, a metal halide, a xenon lamp or the like can be used as a light source of the lighting device 20.

  The camera 30 is an imaging unit disposed at a predetermined set position P on the side of the platen 10. The camera 30 has a function of photographing the corner Wa of the workpiece W placed on the upper surface 11 of the surface plate 10 together with the side surface 12 of the surface plate 10 from a predetermined side viewpoint 31. The image of the object included in the field of view 32 is detected by the CCD element (not shown) by photographing by the camera 30. The field of view 32 of the camera 30 includes at least the corner Wa of the work W and at least the side 12 of the platen 10. Thereby, each captured image of the corner Wa of the workpiece W and the side surface 12 of the surface plate 10 can be simultaneously obtained by one shooting by the camera 30.

  The processing device 40 is a device that calculates the amount of warpage of the workpiece W from the image captured by the camera 30, and includes an image processing unit 41, a calculation unit 42, an output unit 43, and a memory 44. Preferably, a personal computer (PC) connected to the camera 30 constantly or temporarily is used as the processing device 40.

  The image processing unit 41 has a function of detecting one corner Wa of the four corners of the workpiece W from the captured image captured by the camera 30 and detecting the second detection surface 14 of the platen 10. Have. Although specifically described later, the calculation unit 42 has a function of calculating the amount of warpage of the workpiece W based on the information obtained by the image processing unit 41. The output unit 43 has a function of outputting the calculation result of the calculation unit 42. The memory 44 has a function of storing each of the processing information processed by the image processing unit 41 and the operation information calculated by the operation unit 42, and reading out the stored information as necessary.

  The side surface 12 of the surface plate 10 described above is divided into a first detection surface 13 and two second detection surfaces 14, 14. The height in the third direction Z is the same as the side surface 12 in each of the first detection surface 13 and the second detection surface 14. The first detection surface 13 is configured as a surface connected to the upper surface 11 of the side surface 12 and located below the corner Wa of the workpiece W. In the first detection surface 13, the length in the first direction X, which is the horizontal direction, exceeds the length in the first direction X of the work W, and both end positions in the first direction X are outside the both end positions of the work W It is configured to be deployed. In the case of this configuration, when the virtual line H is drawn vertically downward from the position of the corner Wa of the work W toward the side surface 12 of the surface plate 10, the virtual line H always passes through the area of the first detection surface 13 . Each second detection surface 14 is configured as a surface connected to the upper surface 11 of the side surface 12 and adjacent to the first detection surface 13 in the horizontal direction (first direction X).

  The warpage measuring device 1 is the first among the workpieces W with the highest corner portion Wa with respect to the luminance when both the workpiece W and the platen 10 are viewed from the side viewpoint 31 in the irradiation state of the illumination device 20. It has a structure (hereinafter referred to as “brightness setting structure”) which is set to be higher than the detection surface 13 and to make the second detection surface 14 higher than the first detection surface 13.

  Here, “brightness” refers to relative brightness when the object in a state where illumination is applied from the lighting device 20 is viewed from the side viewpoint 31. Therefore, when the object viewed from the side viewpoint 31 is brighter than the surroundings, the brightness of the object is high, and when the object viewed from the side viewpoint 31 is darker than the surroundings, the brightness is low. be able to.

  In order to realize the above-described brightness setting structure, the warpage amount measuring apparatus 1 of the present embodiment has the following two features.

  As a first feature of the warpage measuring device 1, as shown in FIG. 2, the illumination device 20 is configured to emit illumination light in the irradiation direction D toward the corner portion Wa of the work W . The irradiation direction D coincides with the normal direction of the R surface of the corner portion Wa (the direction perpendicular to the tangent to the R surface) with respect to the work W. Therefore, according to the present configuration, in the irradiation state of the illumination device 20, the corner portion Wa of the work W is photographed by the camera 30 in a state where the luminance is higher than that of the other portion of the work W. As a result, in the photographed image obtained by the camera 30, the corner Wa of the work W is emphasized as the brightest part (white part) and recognized.

  As a second feature of the warpage measuring device 1, the surface structure of the side surface 12 of the platen 10 is configured to be different between the first detection surface 13 and the second detection surface 14. Specifically, while the first detection surface 13 is made of a reflective material, the second detection surface 14 is made of a diffuse material (also referred to as "diffuse reflective material").

  The reflective material of the first detection surface 13 is a material having a high regular reflectance and a low diffuse reflectance with respect to the illumination light of the illumination device 20. The regular reflectance accounts for most of the total reflectance of this reflective material. That is, most of the illumination light is specularly reflected in this reflective material. In the present embodiment, a plate member made of a metal material (reflective material) whose surface is polished is joined to a region corresponding to the first detection surface 13 in the side surface 12 of the platen 10.

  On the other hand, the diffusion material of the second detection surface 14 is a material having high diffuse reflectance and low regular reflectance with respect to the illumination light of the illumination device 20. The diffuse reflectance accounts for most of the total reflectance of the diffuse material. That is, most of the illumination light is diffusely reflected in this diffusion material. In the present embodiment, a plate material made of a resin material (diffusion material) is joined to a region corresponding to the second detection surface 14 in the side surface 12 of the platen 10.

  Therefore, the surface plate 10 is made of a material whose second detection surface 14 has a luminance higher than that of the first detection surface 13 with respect to the luminance when the side surface 12 is viewed from the side viewpoint 31 in the irradiation state of the illumination device 20. It is done.

  As shown in FIG. 3, the irradiation direction D of the illumination device 20 is an oblique direction forming an inclination angle θ with the second direction Y with respect to the side surface 12 of the platen 10. In this case, the reflected light reflected by the first detection surface 13 travels in a direction away from the camera 30, while part of the diffused light diffused by the second detection surface 14 travels toward the camera 30.

  Therefore, in the irradiation state of the illumination device 20, the side surface 12 of the surface plate 10 is photographed by the camera 30 in a state in which the second detection surface 14 has a higher luminance than the first detection surface 13. As a result, in the photographed image obtained by the camera 30, the first detection surface 13 is recognized as a relatively dark portion (black portion) and the second detection surface 14 is relatively bright. It will be emphasized and recognized as a part (white part).

  Here, the method of measuring the amount of warpage using the above-described warpage amount measuring apparatus 1 will be specifically described. This method of measuring the amount of warpage is a method of measuring the amount of warpage in the thickness direction (third direction Z) of the plate-like work W, and sequentially executes the processes from step S101 to step S103 in the flowchart shown in FIG. Is achieved by Note that another step may be added to the flowchart as needed, or one step may be divided into a plurality of steps.

  Step S101 is a setting step of preparing the surface plate 10, the illumination device 20, and the camera 30, and setting the brightness of the workpiece W and the surface plate 10 to the illumination device 20 as described above. In this step S101, the side surface 12 of the platen 10 is divided into the first detection surface 13 and the second detection surface 14. Further, in this step S101, with respect to the luminance when both the workpiece W and the platen 10 are viewed from the side viewpoint 31 in the irradiation state of the illumination device 20, the corner Wa is the highest among the workpiece W and the first detection surface 13 The luminance setting is performed such that the second detection surface 14 is higher than the first detection surface 13.

  In this step S101, the worker prepares the platen 10 in which the first detection surface 13 is made of a reflective material and the second detection surface 14 is made of a diffusion material for the above-mentioned brightness setting. Further, the worker places the work W on the upper surface 11 of the surface plate 10 and illuminates the illumination light in the normal direction (irradiation direction D) of the R surface of the corner Wa of the workpiece W placed on the upper surface 11 of the surface plate 10 The direction of the lighting device 20 is adjusted so that At this time, the position of the workpiece W is adjusted such that the corner Wa of the workpiece W is within the area of the top surface 11 of the platen 10 corresponding to the second detection surface 14 of the side surface 12. The side surface of the workpiece W is the side surface 12 of the platen 10 with the workpiece W placed on the upper surface 11 of the platen 10 so that the platen 10 and the workpiece W are in focus when shooting with the camera 30. Preferably, the position is set to be flush with the

  According to step S101, the corner portion Wa of the workpiece W has a luminance higher than that of other portions of the workpiece W and the first detection surface 13 of the platen 10 by setting of the irradiation direction D of the illumination device 20. It is set. Further, the second detection surface 14 is set to have a higher luminance than the first detection surface 13 by the selection of the material. For this reason, it is possible to easily set the luminance of a portion to be recognized on each of the work W and the surface plate 10. In particular, with regard to the luminance of the corner portion Wa of the workpiece W, the luminance can be set only by adjusting the direction of the illumination device 20, and there is no need to modify the workpiece W itself for luminance setting.

  Step S102 is performed after execution of step S101. This step S102 is a photographing step of photographing with the camera 30 in the irradiation state of the illumination device 20. In this step S 102, the corner Wa of the workpiece W placed on the upper surface 11 of the platen 10 is photographed by the camera 30 from the side viewpoint 31 together with the side surface 12 of the platen 10. This step S102 is performed by the worker.

  According to this step 102, a photographed image obtained by photographing the workpiece W and the platen 10 for which the above-mentioned luminance setting has been made by the camera 30 is obtained.

  Step S103 is performed after execution of step S102. This step S103 is a processing step which calculates the amount of warpage of the work W based on the contrast of the image taken by the camera 30 in step S102. This step S103 is executed by the image processing unit 41 and the calculation unit 42 of the processing device 40.

  In step S103, first, the image processing unit 41 executes a process of black and white binarization (also referred to as "two-gradation processing") of a color image which is a photographed image obtained by the camera 30. According to this process, all pixels brighter than the preset threshold value are converted to white, and all pixels darker than the threshold value are converted to black and white. As a result, only the corner Wa is converted to white, and the other parts are converted to black. On the other hand, in the side surface 12 of the platen 10, only the second detection surface 14 is converted to white, and the first detection surface 13 is converted to black.

At this time, a desired result can be obtained for black and white binarization in a black and white image by the effect of the luminance setting in step S101. That is, a black and white image is obtained in which the corner portion Wa of the work W is emphasized as a white portion, and the second detection surface 14 is emphasized as a white portion on the side surface 12 of the platen 10.
In addition, the black-and-white binarization here is a well-known process, and the further detailed description about this process is abbreviate | omitted.

  Next, the image processing unit 41 executes processing for detecting the corner Wa of the workpiece W and the second detection surface 14 of the platen 10 based on the contrast of the photographed image. Refer to FIG. 5 for this process.

  As shown in FIG. 5, in the black and white image, the corner Wa of the workpiece W is a white portion, and is displayed with emphasis on the other portion (black portion) of the workpiece W. Therefore, it is possible to correctly detect the first position Q1 (XZ coordinate (x1, z1)) where the corner portion Wa is located. In FIG. 5, the white part (white point group) of the corner Wa of the work W is indicated by “o”.

  At this time, the lowest point of the white portion (white point group) in the third direction Z is set as the first position Q1, and the boundary point of the corner portion Wa of the workpiece W with the lower surface of the workpiece is detected as the first position Q1. Is preferred. On the other hand, the uppermost point of the white portion (white point group) in the third direction Z may be set as the first position Q1. In this case, a boundary point with the upper surface of the work in the corner Wa of the work W is detected as the first position Q1.

  Further, in the black and white image, the second detection surface 14 is a white portion, and is displayed with emphasis on the first detection surface 13 which is a black portion. Here, the position immediately below the first position Q1 on the reference line L in FIG. 5 can be correctly detected as the second position Q2 (XZ coordinate (x1, z2)). The second position Q2 is located at the boundary between the first detection surface 13 and the upper surface 11, and is defined as an intersection point of a straight line in the third direction Z passing through the first position Q1 and the reference line L. In this case, a straight line in the horizontal direction (first direction X) passing through the upper side 14a is determined from at least two points P1 and P2 of the upper side 14a of the second detection surface 14 connected to the upper surface 11 It can be done. Alternatively, a straight line connecting a point on the upper side 14a of one second detection surface 14 (on the left in FIG. 5) and a point on the upper side 14a of the other second detection surface 14 (on the right in FIG. 5) It may be a line L.

  After that, the computing unit 42 uses the distance in the vertical direction from the second position Q2 to the first position Q1 to determine the warp amount d of the workpiece W (that is, the floating amount of the corner Wa of the workpiece W in the third direction Z). Calculate At this time, when the boundary point between the workpiece W and the lower surface of the workpiece W is detected as the first position Q1, the distance in the vertical direction is the thickness direction of the workpiece W (third direction Z). Amount of warpage. On the other hand, when the boundary point between the workpiece W and the upper surface of the workpiece is detected as the first position Q1, the value obtained by subtracting the thickness of the workpiece W from the distance in the vertical direction is The amount of warpage in the thickness direction (third direction Z) of the work W is obtained. The calculation result by the calculation unit 42 is displayed on the screen by the output unit 43 and stored in the memory 44 as needed.

  Therefore, according to the process of step S103 using the processing device 40, it is possible to automatically and easily calculate the amount of warpage of the work W from the image captured by the camera 30.

  In addition, it is preferable that the above-mentioned process which measures the curvature amount of the workpiece | work W is implemented not only about one corner | angular part Wa but about all four corner | angular parts for quality control of the workpiece | work W.

  According to the above-described warpage amount measuring apparatus 1 and the warpage amount measuring method, the following effects can be obtained.

  The plate-like work W placed on the upper surface 11 of the platen 10 is photographed from the side viewpoint 31 by the camera 30 in a state where illumination light is applied by the illumination device 20. At this time, the corner portion Wa of the workpiece W is detected in a state in which the luminance is relatively high with respect to the other portion of the workpiece W and the first detection surface 13 of the platen 10. For this reason, in the photographed image taken by the camera 30, the position (first position Q1 in FIG. 5) of the corner Wa used to obtain the amount of warpage of the work W is detected as the other part of the work W and the first Correct detection is possible due to the difference in brightness with the surface 13 (brightness / dark difference).

  On the other hand, when the luminance of the first detection surface 13 of the platen 10 is relatively lowered to detect the corner Wa of the workpiece W, the actual amount of warpage of the workpiece W is small or zero (for example, FIG. 6) In the case of the state shown in), the position of the corner Wa of the workpiece W may be erroneously recognized.

  Therefore, in the present embodiment, the second detection surface 14 of the surface plate 10 is set to be photographed by the camera 30 in a state where the luminance thereof is higher than the luminance of the first detection surface 13. For this reason, the second detection surface 14 can be easily detected due to the difference in brightness (brightness / dark difference) with the first detection surface 13 in the captured image captured by the camera 30.

  At this time, since the position of the upper side 14a of the second detection surface 14 coincides with the position of the upper surface 11 of the surface plate 10, the position used to determine the amount of warpage of the workpiece W by correctly detecting the position of the upper side 14a. The position of the upper surface 11 of the board 10 can also be detected correctly. Then, by using both position information of the position of the corner Wa of the workpiece W and the position of the upper surface 11 of the platen 10 which are both correctly detected, the amount of warpage of the workpiece W can be accurately determined.

  As a result, it is possible to measure the amount of warpage of the plate-like work W with high accuracy. In particular, even when the actual amount of warpage of the workpiece W is small or zero, the position of the corner Wa of the workpiece W can be detected correctly. In addition, it is not necessary to use an expensive device such as a laser measuring instrument to measure the amount of warpage of the workpiece W, and an inexpensive measuring system can be constructed.

  Further, as shown in FIG. 7, in the structure in which another element A is stacked on the upper surface Wb of the work, when it is desired to measure the amount of warpage of the work W located on the lower side, the other element A is in the way It is difficult to measure the amount of warpage of the workpiece W from the three-dimensional shape of the workpiece top surface Wb. On the other hand, this embodiment adopts a method of directly detecting the position of the corner Wa of the workpiece W, and accurately detects the amount of warpage of the workpiece W without the other element A being in the way It is effective to

  As an embodiment in which the side surface 12 of the platen 10 is divided into the first detection surface 13 and the second detection surface 14, for example, each of the modifications shown in FIGS. 8 to 10 is adopted in addition to the embodiment shown in FIG. You can also.

(First Modification)
In the first modification shown in FIG. 8, the platen 10 has both the first detection surface 13 and the two second detection surfaces 14 and 14 connected to the upper surface 11 and the height in the third direction Z is a side surface. It is configured to be less than twelve.

(Second change example)
In the second modification shown in FIG. 9, the number of each of the first detection surface 13 and the second detection surface 14 is one, and any one of the first detection surface 13 and the second detection surface 14 is used as the surface plate 10. It is also connected to the upper surface 11 and is configured such that the height in the third direction Z coincides with the side surface 12.

(Third Modification)
In the third modification shown in FIG. 10, both the first detection surface 13 and the second detection surface 14 connect to the upper surface 11 and the height in the third direction Z falls below the side surface 12. Is configured.

  That is, if the first detection surface 13 is disposed below the corner Wa of the workpiece W, and the first detection surface 13 and the second detection surface 14 are both connected to the upper surface 11 of the platen 10, The size and number of detection planes can be changed to the definition.

The present invention is not limited to the above-described embodiment, and various applications and modifications can be considered without departing from the object of the present invention. For example, the following embodiments to which this embodiment is applied can be implemented.

  Although the above embodiment exemplifies the setting of the luminance of the corner Wa of the workpiece W by adjusting the direction of the illumination device 20, the luminance may be increased at the corner Wa of the workpiece W instead. The following members may be adhered.

  In the above embodiment, in the case of setting the luminance in the two detection surfaces 13 and 14 by selecting the material that configures each of the first detection surface 13 and the second detection surface 14 of the side surface 12 of the surface plate 10 Although illustrated, the setting of the luminance may be performed by another structure. As another structure, for example, a configuration in which the first detection surface 13 is coated in black and the second detection surface 14 is coated in white, a configuration in which the direction of the lighting device 20, the number of installation, etc. are changed Be

  Although the above embodiment exemplifies the case where a metal material is used as the reflective material constituting the first detection surface 13, if a desired regular reflectance can be obtained, a material other than the metal material is used as the reflective material. May be Similarly, although the case of using a resin material as the diffusion material constituting the second detection surface 14 has been illustrated, materials other than resin materials may be used as the diffusion material as long as a desired diffuse reflectance can be obtained. .

  Although the above embodiment exemplifies the case where the warpage measuring device 1 includes the processing device 40, the processing device 40 may be omitted as necessary, and processing performed by the processing device 40, ie, a work from a photographed image by the camera 30. The operator may perform processing for obtaining the amount of warpage of W.

  Although the above embodiment exemplifies the case where the workpiece W to be measured has four corner portions, a plate-like workpiece having at least one corner portion can be a measurement target.

DESCRIPTION OF SYMBOLS 1 Warpage measuring device 10 surface plate 11 upper surface 12 side 13 1st detection surface 14 2nd detection surface 14a upper side 20 illumination device 30 camera 31 side view point 40 processing device d warpage amount Q1 1st position Q2 2nd position W work Wa Corner S101 setting step S102 shooting step S103 processing step

Claims (6)

A workpiece warpage measuring device that measures the amount of warping of a plate-like workpiece, and
A surface plate, an illumination device for emitting illumination light, and a camera for photographing a corner portion of the work placed on the upper surface of the surface plate together with the side surface of the surface plate from a side view point,
The side surface of the surface plate is connected to the upper surface, and a first detection surface located below the corner of the workpiece, and a second detection surface connected to the upper surface and adjacent to the first detection surface in the horizontal direction The corner is the highest among the workpieces and the luminance of the workpiece and the surface plate are both viewed from the side point of view in the irradiation state of the illumination device while being divided into the detection surface. A device for measuring the amount of warpage of a work, wherein the second detection surface is higher than the first detection surface and higher than the first detection surface.   The illumination device is configured to emit illumination light in the normal direction of the R surface of the corner portion of the work, and the surface plate has the second detection surface that is larger than the material of the first detection surface. The workpiece warpage measuring device according to claim 1, wherein the workpiece is made of a material having high luminance.   The processing apparatus includes a processing device that calculates the amount of warpage of the workpiece from the captured image captured by the camera, and the processing device determines a first position at which the corner of the workpiece is located, based on the contrast of the captured image. And detecting a second position at which an upper side connected to the upper surface of the second detection surface of the surface plate is located, and using the distance in the vertical direction from the second position to the first position. The device for measuring the amount of warpage of a work according to claim 1 or 2, wherein the amount is calculated. It is a method of measuring the amount of warpage of a work which measures the amount of warpage of a plate-like work,
Prepare a platen, an illumination device for emitting illumination light, and a camera for photographing the corner of the work placed on the upper surface of the platen together with the side surface of the platen from a side view point; A first detection surface connected to the upper surface and located below the corner of the work; and a second detection surface connected to the upper surface and adjacent to the first detection surface in the horizontal direction In the irradiation state of the illumination device, the corner is the highest in the work and the first detection surface with respect to the brightness when both the work and the surface plate are viewed from the side point of view in the irradiation state of the illumination device Setting the second detection surface to be higher than the first detection surface,
A photographing step of photographing with the camera in the irradiation state of the illumination device;
A method of measuring the amount of warpage of a workpiece.   In the setting step, the illumination device is set to emit illumination light in the normal direction of the R surface of the corner of the work by the illumination device, and the second detection surface is more than the material of the first detection surface. The method for measuring the amount of warpage of a work according to claim 4, wherein the surface plate made of a material having high luminance is prepared.   A first position at which the corner of the work is located and an upper side connected to the upper surface of the second detection surface of the platen based on the contrast of the captured image captured by the camera in the capturing step. The method according to claim 4 or 5, further comprising the step of: detecting a second position at which is located, and calculating the warpage amount using a vertical distance from the second position to the first position, Workpiece warpage measuring method.

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