JP6517918B2 - 導電性パターン形成用組成物、これを用いた導電性パターン形成方法と、導電性パターンを有する樹脂構造体 - Google Patents
導電性パターン形成用組成物、これを用いた導電性パターン形成方法と、導電性パターンを有する樹脂構造体 Download PDFInfo
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- JP6517918B2 JP6517918B2 JP2017506851A JP2017506851A JP6517918B2 JP 6517918 B2 JP6517918 B2 JP 6517918B2 JP 2017506851 A JP2017506851 A JP 2017506851A JP 2017506851 A JP2017506851 A JP 2017506851A JP 6517918 B2 JP6517918 B2 JP 6517918B2
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- metal
- conductive pattern
- resin
- forming
- conductive
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- 229920005989 resin Polymers 0.000 title claims description 112
- 239000011347 resin Substances 0.000 title claims description 112
- 239000000203 mixture Substances 0.000 title claims description 71
- 238000000034 method Methods 0.000 title claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 243
- 239000002184 metal Substances 0.000 claims description 243
- 150000002736 metal compounds Chemical class 0.000 claims description 86
- 239000002952 polymeric resin Substances 0.000 claims description 60
- 229920003002 synthetic resin Polymers 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 28
- 150000002500 ions Chemical class 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 18
- 150000002739 metals Chemical class 0.000 claims description 16
- 238000006722 reduction reaction Methods 0.000 claims description 15
- 239000003638 chemical reducing agent Substances 0.000 claims description 14
- 229910021645 metal ion Inorganic materials 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 12
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- 238000007772 electroless plating Methods 0.000 claims description 10
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- 239000012744 reinforcing agent Substances 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- HUQOFZLCQISTTJ-UHFFFAOYSA-N diethylaminoboron Chemical compound CCN([B])CC HUQOFZLCQISTTJ-UHFFFAOYSA-N 0.000 claims description 6
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000314 lubricant Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
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- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
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- 239000004431 polycarbonate resin Substances 0.000 description 7
- 239000006229 carbon black Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
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- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 3
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- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
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- 229910052709 silver Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003017 thermal stabilizer Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
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- 229920006375 polyphtalamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 229910052717 sulfur Chemical group 0.000 description 2
- 239000011593 sulfur Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- C08K2003/2293—Oxides; Hydroxides of metals of nickel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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Description
本出願は、2014年9月11日付の韓国特許出願第10−2014−0120234号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
あるいはP63/mmc空間群構造を有するものと定義される。
[化学式1]
A3(BC2)X6
前記化学式1において、A、BおよびCは、それぞれ独立に第1金属、第2金属および第3金属を示し、Aは、Cu、Ag、およびAuからなる群より選択された1種以上の金属であり、Bは、Ni、Co、およびFeからなる群より選択された1種以上の金属であり、Cは、Vであり、Xは、酸素、窒素、または硫黄である。
第1金属、第2金属および第3金属を含む非導電性金属化合物であって、
前記第1金属、第2金属および第3金属のうち2種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層(edge−shared octahedral layer)と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物を含み、
電磁波照射によって、前記非導電性金属化合物から前記第1金属、第2金属または第3金属やそのイオンを含む金属核が形成される、電磁波照射による導電性パターン形成用組成物が提供される。
あるいはP63/mmc空間群構造と定義される層状立体構造からなるとよい。このような層状立体構造により、非層状立体構造などに比べて前記第2層のvacancy formation energyがより低くなり得る。したがって、前記第2層に含まれている金属やそのイオンがより簡単に放出される。また、前記非導電性金属化合物は、3種の金属陽イオンと1種の陰イオンが複合固溶体をなして層状構造を有するが、複数の第1層が2種の金属をそれぞれ1/3と2/3の原子分率で含む複合構造を有し、第2層が他の1種の金属を含む構造を有することによって、特定波長のレーザ等電磁波に対してより高い吸収率および敏感度を示すことができる。そのため、このような層状立体構造および特定の組み合わせの金属成分を有する非導電性金属化合物を含む組成物を用いることは、前記非導電性金属化合物の使用量をさらに低減しながらも金属核などの形成を可能にし、導電性金属層(導電性パターン)をより良好に形成可能にする主な要因の一つになり得る。
[化学式1]
A3(BC2)X6
前記化学式1において、A、BおよびCは、それぞれ独立に第1金属、第2金属および第3金属を示し、Aは、Cu、Ag、およびAuからなる群より選択された1種以上の金属であり、Bは、Ni、Co、およびFeからなる群より選択された1種以上の金属であり、Cは、Vであり、Xは、酸素、窒素、または硫黄を示す。
原材料Cu、NiOとV2O5を3:1:1のモル比率で均一に混合(mixing)した後、ペレット化(pelletizing)した。以降、Fumed silica tubeにペレットを挿入し、真空雰囲気を作った後密封した。
基本樹脂のポリカーボネート樹脂と、製造例1で得られた非導電性金属化合物粉末[Cu3(NiV2)O6]を使用し、工程および安定化のための添加剤を共に使用して、電磁波照射による導電性パターン形成用組成物を製造した。
実施例1で射出成形された基板形態の樹脂構造体に対して、Nd−YAG laser装置を用いて、40kHz、5Wの条件下、1064nm波長帯のレーザを照射して表面を活性化させたことを除いて、実施例1と同様の方法で導電性パターンを有する樹脂構造体を製造した。
実施例1の導電性パターン形成用組成物に、全体組成物に対して0.5重量%に相当するcarbon blackを追加的に添加したことを除いて、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。
実施例1の導電性パターン形成用組成物に、全体組成物に対して5重量%に相当するTiO2を追加的に添加したことを除いて、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。
非導電性金属化合物として、Cu3(NiV2)O6の代わりにCuNiO2を使用したことを除いて、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。
以降、実施例1と同様の方法でメッキを進行させて導電性パターンを形成した後、実施例1と同様の方法で、ポリカーボネート樹脂基板に対する導電性パターンの接着性および良好性を測定および評価した(下記の試験例および表1参照)。これによれば、比較例1では、ポリカーボネート樹脂基板上に接着性の不良な導電性パターンが形成されたことが確認される。
実施例1で射出成形された基板形態の樹脂構造体に対して、Nd−YAG laser装置を用いて、40kHz、3Wの条件下、1064nm波長帯のレーザを照射したことを除いて、実施例1と同様の方法で導電性パターンを有する樹脂構造体を製造した。
前記実施例1〜4および比較例1〜2で導電性パターンを形成した後、ISO2409標準方法によるCross−cut testによって、各導電性パターンの接着性を評価し、その結果を下記表1に示した。
Claims (13)
- 高分子樹脂;および
第1金属、第2金属および第3金属を含む非導電性金属化合物であって、
前記第1金属、第2金属および第3金属のうち2種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物を含み、
前記非導電性金属化合物は、Cu 3 (NiV 2 )O 6 、Ag 3 (NiV 2 )O 6 、Au 3 (NiV 2 )O 6 、Cu 3 (CoV 2 )O 6 、Cu 3 (FeV 2 )O 6 、Ag 3 (CoV 2 )O 6 、Ag 3 (FeV 2 )O 6 、Au 3 (CoV 2 )O 6 、およびAu 3 (FeV 2 )O 6 からなる群より選択された1種以上の化合物を含み、
電磁波照射によって、前記非導電性金属化合物から前記第1金属、第2金属または第3金属やそのイオンを含む金属核が形成される、電磁波照射による導電性パターン形成用組成物。 - 前記非導電性金属化合物の第2層に含まれている金属は、互いに隣接する第1層の間で、前記八面体の頂点を互いに結んで前記2次元的連結構造を互いに結合させるものである、請求項1に記載の電磁波照射による導電性パターン形成用組成物。
- 前記非導電性金属化合物は、
あるいはP63/mmc空間群構造を有する、請求項1に記載の電磁波照射による導電性パターン形成用組成物。 - 前記高分子樹脂は、熱硬化性樹脂または熱可塑性樹脂を含む、請求項1に記載の電磁波照射による導電性パターン形成用組成物。
- 前記非導電性金属化合物は、全体組成物に対して1〜10重量%含まれる、請求項1に記載の電磁波照射による導電性パターン形成用組成物。
- 熱安定剤、UV安定剤、難燃剤、滑剤、抗酸化剤、無機充填剤、色添加剤、衝撃補強剤、および機能性補強剤からなる群より選択された1種以上の添加剤をさらに含む、請求項1に記載の電磁波照射による導電性パターン形成用組成物。
- 請求項1に記載の導電性パターン形成用組成物を樹脂製品に成形するか、他の製品に塗布して樹脂層を形成する段階と、
前記樹脂製品または樹脂層の所定領域に電磁波を照射して、前記非導電性金属化合物から第1金属、第2金属または第3金属やそのイオンを含む金属核を発生させる段階と、
前記金属核を発生させた領域を化学的に還元またはメッキさせて、導電性金属層を形成する段階とを含む、電磁波の直接照射による導電性パターン形成方法。 - 前記金属核発生段階において、200nm〜11,000nmの波長を有するレーザ電磁波が3〜20Wの平均パワーで照射される、請求項7に記載の電磁波の直接照射による導電性パターン形成方法。
- 前記導電性金属層は、前記金属核に含まれている第1金属、第2金属または第3金属イオンの化学的還元、またはこれに対する無電解メッキによって、接着活性表面上に形成される、請求項7に記載の電磁波の直接照射による導電性パターン形成方法。
- 前記還元またはメッキ段階では、前記金属核を発生させた領域を、還元剤を含む酸性または塩基性溶液で処理する、請求項7に記載の電磁波の直接照射による導電性パターン形成方法。
- 前記還元剤は、ホルムアルデヒド、次亜リン酸塩、ジメチルアミノボラン(DMAB)、ジエチルアミノボラン(DEAB)、およびヒドラジンからなる群より選択された1種以上を含む、請求項10に記載の電磁波の直接照射による導電性パターン形成方法。
- 高分子樹脂基材;
第1金属、第2金属および第3金属を含み、高分子樹脂基材に分散している非導電性金属化合物であって、
前記第1金属、第2金属および第3金属のうち2種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物;
所定領域の高分子樹脂基材の表面に露出した第1金属、第2金属または第3金属やそのイオンを含む金属核を含む接着活性表面;および
前記接着活性表面上に形成された導電性金属層を含み、
前記非導電性金属化合物は、Cu 3 (NiV 2 )O 6 、Ag 3 (NiV 2 )O 6 、Au 3 (NiV 2 )O 6 、Cu 3 (CoV 2 )O 6 、Cu 3 (FeV 2 )O 6 、Ag 3 (CoV 2 )O 6 、Ag 3 (FeV 2 )O 6 、Au 3 (CoV 2 )O 6 、およびAu 3 (FeV 2 )O 6 からなる群より選択された1種以上の化合物を含む、導電性パターンを有する樹脂構造体。 - 前記接着活性表面および導電性金属層が形成された所定領域は、前記高分子樹脂基材に電磁波の照射された領域に対応する、請求項12に記載の導電性パターンを有する樹脂構造体。
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