JP6506417B2 - Electronic device and electronic module - Google Patents

Description

  The present invention relates to an electronic device and an electronic module.

  Since a power electronic device such as a power MOSFET is a device which causes a large current to flow to a connected load, the power electronic device itself may generate heat and become hot when operated. An electronic apparatus provided with a temperature detection component for detecting a temperature rise of such a power electronic device (heat generation component) is conventionally known (see, for example, Patent Document 1).

  In the conventional electronic device 800, as shown in FIG. 15, the temperature detection components (thermistor, varistor) 850a and 850b mounted on the sub-substrate 831 are replaced with heat-generating components (power amplification transistors) 810a mounted on the main substrate 830. , And 810b via the compounds 870a and 870b, respectively.

  According to the conventional electronic device 800, since the heat generating components 810a, 810b and the temperature detection components 850a, 850b are thermally coupled via the compounds 870a, 870b, the temperature detection components 850a, 850b are of the heat generating components 810a, 810b. Temperature can be detected.

Unexamined-Japanese-Patent No. 8-293739 gazette

  However, in the conventional electronic device, since the contact pins 862 and 863 and the main substrate 830 and the sub substrate 831 are fixed by soldering while the main substrate 830 is pressed against the sub substrate 831, depending on the degree of pressing. There is a problem that the contact area between the temperature detection parts 850a and 850b and the compounds 870a and 870b varies and the heat conduction path is not stable, so that the temperature of the heat generation part can not be accurately detected.

  Another conventional electronic device 900 has also been proposed for such a problem (see FIG. 16). Another conventional electronic device 900 has a lead terminal 912 and has a heat generating component 910 sealed by a sealing member 914, a multilayer substrate 930 having a surface wiring layer and an inner layer wiring layer, and a temperature of the heat generating component 910. The upper surface of the heat generating component 910 is in close contact with the lower surface of the multilayer substrate 930, and the lead terminals 912 of the heat generating component 910 are provided with predetermined wiring patterns 936 provided in the inner layer wiring layer (here In the above, the wiring pattern 936 is described in the example provided in the inner layer wiring layer, but it may be provided in the surface layer wiring layer), and the temperature detection component 950 is It is mounted on the surface wiring pattern 932 provided in the surface wiring layer at a position immediately above the heat generating component 910.

  According to another conventional electronic device 900, the temperature detection component 950 is mounted independently on the surface wiring pattern 932 provided in the surface wiring layer of the multilayer substrate 930 without receiving a pressing force, as described above. As in the electronic device 800, the temperature detection component 950 generates heat at a position relatively close to the heat generation component 910 (a position immediately above the heat generation component 910) while solving the problem that the heat conduction path is unstable due to the degree of pressing. The temperature of part 910 can be detected.

  However, recently, with respect to systems using electronic devices, there has been an increasing demand for precise control based on accurate temperature detection of heat-generating components and highly responsive control based on temperature detection with good tracking. The temperature detection of the heat-generating component by the other conventional electronic device 900 described above does not sufficiently meet such a demand.

  The present invention has been made in view of the above-described circumstances, and it is an object of the present invention to provide an electronic device capable of detecting the temperature of a heat-generating component more accurately and with better follow-up characteristics as compared with a conventional electronic device. Do. Another object of the present invention is to provide an electronic module provided with the electronic device of the present invention.

[1] An electronic device according to the present invention detects a temperature of a heat generating component having a lead terminal and sealed with a sealing member, a multilayer substrate having a surface wiring layer and an inner wiring layer, and the heat generating component. An electronic device comprising a temperature detection component, wherein the upper surface of the heat generation component is in close contact with the lower surface of the multilayer substrate, and the lead terminal of the heat generation component is a heat conduction wiring pattern provided in the inner layer wiring layer And the heat conductive wiring pattern extends at least in an overlapping state on the heat-generating component in plan view, and the temperature detection component is a lower surface of the multilayer substrate in cross-section It mounts on the surface layer wiring pattern provided in the said surface layer wiring layer in the position in the area | region enclosed by the said sealing member, the said lead terminal, and the said heat conductive wiring pattern.

[2] In the electronic device according to the present invention, the multilayer substrate has a plurality of inner layer wiring layers, and the heat conduction wiring pattern is closest to the lower surface side of the multilayer substrate among the plurality of inner layer wiring layers. Preferably, it is formed in the wiring layer of the layer.

[3] In the electronic device of the present invention, the heat conduction wiring pattern overlaps with the heat generating component in an area of 10% or more of the area corresponding to the sealing member of the heat generating component when viewed in plan Is preferred.

[4] In the electronic device of the present invention, it is preferable that the lead terminal is connected to a node from which current is taken out of the plurality of nodes included in the heat-generating component.

[5] In the electronic device of the present invention, when viewed in cross section, the temperature detection component is a position (hereinafter referred to as J1) at which the lead terminal and the heat conduction wiring pattern are connected, and the heat generation component. It is preferable to be mounted at a central position between the end of and the end on the J1 side.

[6] In the electronic device of the present invention, the temperature detection component is preferably a surface mount type thermistor.

[7] In the electronic device of the present invention, the heat-generating component is preferably a power transistor.

[8] In the electronic device of the present invention, the surface of the lead terminal is preferably covered with an insulating material.

[9] In the electronic device of the present invention, preferably the heat-generating component is fixed to the multilayer substrate by an engagement member.

[10] The electronic module of the present invention includes a metal case and the electronic device according to the above [9], the engagement member is a screw or a plate spring, and the multilayer substrate is a screw or a co-clamping with a screw. It is characterized in that it is fixed to the metal case via the heat-generating component by engagement by a leaf spring.

[11] In the electronic module of the present invention, it is preferable that a heat dissipating sheet or a heat dissipating grease be interposed between the heat generating component and the multilayer substrate.

[12] In the electronic module of the present invention, it is preferable that a heat dissipation sheet be interposed between the heat generating component and the metal case.

  According to the electronic device of the present invention, the lead terminals of the heat generating component are connected to the heat conductive wiring pattern provided in the inner layer wiring layer, and the heat conductive wiring pattern at least overlaps the heat generating component when viewed in plan The temperature detection component is a surface layer provided on the surface wiring layer at a position within the region surrounded by the sealing member, the lead terminal, and the heat conduction wiring pattern, which is the lower surface of the multilayer substrate when viewed in cross section. Since the temperature detection component is mounted on the wiring pattern, the heat of the heat generating component is conducted by (i) the lead terminal and the heat conduction path from J1 in the heat conduction wiring pattern to just above the temperature detection component ii) heat conduction by the path from the top surface of the heat generating component to the bottom surface of the multilayer substrate and from the tip of the heat conduction wiring pattern to just above the temperature detection component, (iii) sealing member and lead end It may be received from various fields radiation or conduction, by from. For this reason, the electronic device of the present invention can detect the temperature of the heat-generating component more accurately and more easily than the conventional electronic device.

  Further, according to the electronic module of the present invention, the metal case and the electronic device of the present invention are provided, the engagement member is a screw or a plate spring, and the multilayer substrate is formed by co-clamping by a screw or engagement by a plate spring. Because the heat generating component and the multilayer substrate are fixed to the metal case by the engaging member, the heat generating component and the multilayer substrate are fixed in a state where a pressing force is applied to the interface between them. The conduction is further promoted, and the temperature of the heat-generating component can be detected more accurately and more easily, as compared with the conventional electronic module.

FIG. 2 is a diagram for explaining the electronic device 100 according to the first embodiment. FIG. 1A is a cross-sectional view of an essential part of the electronic device 100, and is a view showing a cross section taken along the line C-C in FIG. FIG. 1B is a plan view of an essential part of the electronic device 100, and FIG. 1C is a cross-sectional view for explaining the electronic module 500 provided with the electronic device 100. FIG. 3 is a view for explaining a power MOSFET as an example of the heat-generating component 110 in the first embodiment. FIG. 2 (a) is a circuit symbol of the power MOSFET, and FIG. 2 (b) is a plan view for explaining the state of wiring in the power MOSFET. FIG. 3 is a view for explaining an example of the configuration of a multilayer substrate 130 used in the electronic device 100 according to the first embodiment. FIG. 3A is a cross-sectional view of the multilayer substrate 130, and FIG. 3B illustrates an example of the heat conduction wiring pattern 134 formed in the inner wiring layer and the surface wiring pattern 132 formed in the surface wiring layer. Is a perspective view shown in FIG. FIG. 2 is a cross-sectional view for explaining heat conduction paths and radiation paths in the electronic device 100 according to the first embodiment. FIG. 7 is a plan view of each wiring layer shown to explain an example of the heat conduction wiring pattern 134 and the surface wiring pattern 132 in the first embodiment. 5 (a) shows the first wiring layer, FIG. 5 (b) shows the second wiring layer, FIG. 5 (c) shows the third wiring layer, and FIG. 5 (d) shows the fourth wiring layer. FIG. In each of the drawings, the wiring pattern formed in the wiring layer is indicated by oblique lines, and the heat generating component 110 and the lead terminals 112 and the fixing holes 120 included in the heat generating component 110 show the positional relationship with the wiring pattern. It is indicated by a solid line. FIG. 7 is a cross-sectional view shown as an example for explaining the position of the wiring layer in which the heat conduction wiring pattern 134 is arranged in the first embodiment. 5 is a cross-sectional view shown to explain a mounting position of a temperature detection component 150 in Embodiment 1. FIG. 7A shows that the temperature detection component 150 is disposed at the center between the connected position J1 of the lead terminal 112 and the heat conductive wiring pattern 134 and the end E1 of the heat generating component 110 on the J1 side. It is a sectional view showing. FIG. 7B is a cross-sectional view showing an example in which the temperature detection component 150 is disposed closer to the J1 side than the center. FIG. 6 is a cross-sectional view shown to explain an insulating material 160 disposed on the surface of the lead terminal 112 in Embodiment 1. FIG. 13 is a cross-sectional view shown to explain a modification of fixing of the heat-generating component 110 and the multilayer substrate 130 by another engagement method in the first embodiment. FIG. 6 is a view for explaining an electronic module 500 according to a second embodiment. FIG. 10A is a cross-sectional view of an essential part of the electronic module 500, and FIG. 10B is a perspective view showing a modification of the electronic module according to another engagement method. FIG. 18 is a cross-sectional view of main parts shown in the electronic module 500 according to the second embodiment, for illustrating how the heat dissipation sheet 182a and the heat dissipation grease 182b are disposed. It is a figure which shows the structure of the temperature detection test of the heat-emitting component 110 in Experimental example 1 and 2. FIG. Fig.12 (a) is a block diagram which shows typically the connection relation of the electronic device 100 which concerns on Embodiment 1, FIG.12 (b) is a block diagram which shows typically the connection relation of the electronic device of a comparative example. . FIG. 12C is a perspective view for explaining the measurement position of the MP 2 and the supply of the test signal to the heat-generating component (the multilayer substrate, the metal case, etc. are omitted). It is a graph which shows the result of having confirmed the accuracy of temperature detection in example 1 of an experiment. The horizontal axis represents elapsed time, and the vertical axis represents temperature. 13 (a) is a graph showing the result of temperature detection by the conventional electronic device 900, and FIG. 13 (b) is a graph showing the result of temperature detection by the electronic device 100 according to the first embodiment. It is a graph which shows the result of having checked the flattery nature of temperature detection in example 2 of an experiment. The horizontal axis represents elapsed time, and the vertical axis represents temperature. FIG. 14 (a) is a graph showing the result of temperature detection by the conventional electronic device 900, and FIG. 14 (b) is a graph showing the result of temperature detection by the electronic device 100 according to the first embodiment. It is a sectional view shown in order to explain the conventional electronic device 800. FIG. 10 is a cross-sectional view shown to explain another conventional electronic device 900. 16 (a) is a cross-sectional view of an essential part of the electronic device 900, and FIG. 16 (b) is a cross-sectional view for explaining an electronic module 990 provided with the electronic device 900.

Hereinafter, the electronic device and the electronic device of the present invention will be described based on the embodiments shown in the drawings.
In the present specification, “the lower surface of the multilayer substrate” refers to the surface on the heat generating component side of the multilayer substrate (indicated by B in FIG. 1; the same applies to the other drawings). Further, the “upper surface of the multilayer substrate” refers to the surface of the multilayer substrate opposite to the “lower surface” (shown by A in FIG. 1; the same applies to other drawings). In the present specification, the relationship between the "upper surface" and the "lower surface" is for convenience, and does not necessarily have to coincide with the direction of gravity.
Further, all the drawings showing the configuration etc. are schematic views, and do not necessarily reflect the actual size, thickness and the like.

Embodiment 1
1. Configuration of Electronic Device 100 As shown in FIG. 1, the electronic device 100 according to the first embodiment includes a heat generating component 110, a multilayer substrate 130, and a temperature detection component 150. The details of each component and the relationship between the components will be described below.

The heat-generating component 110 is an electronic component that generates heat by operation, and has a lead terminal 112 and is sealed by a sealing member 114 as shown in FIG.
As the heat generating component 110 in the first embodiment, a power electronic device such as a power MOSFET or an IGBT can be applied.
The configuration of a power MOSFET as an example of the heat generating component 110 will be described below. The heat generating component 110 includes a heat generating element 116 which is a semiconductor chip, a die pad 122 partially including a base 118, a lead terminal 112, and a sealing member 114. The heating element 116 is mounted on the base 118, and the drain of the heating element 116 is connected to the lead terminal 112b for drain via the base 118. On the other hand, the gate and the source of the heater element 116 are respectively connected to the lead terminals 112a and 112c through the wires 124 from the corresponding bonding pads (FIGS. 1 (a), 1 (b) and 2). reference.).
The lead terminals 112 (112a, 112b, 112c) are made of a conductive material, such as copper, a copper alloy or the like. In the present invention, a material having a high thermal conductivity is preferable.
As described below, the lead terminal 112 forms a circuit by connecting its tip to the multilayer substrate 130 once and further connecting it to another circuit component, element, terminal or the like (not shown).

The multilayer substrate 130 is formed of a multilayer wiring layer having a surface wiring layer and an inner wiring layer.
For example, when the multilayer substrate 130 is a wiring layer of four layers, as shown in FIG. 1A and FIG. 3, the first wiring layer 141, the second wiring layer 142, the A third wiring layer 143 and a fourth wiring layer 144 are provided. Among the plurality of wiring layers, the wiring layer on the uppermost surface side of the multilayer substrate 130 (here, the first wiring layer 141) and the wiring layer on the lower surface side (here, the fourth wiring layer 144) It is also called. The wiring layers (the second wiring layer 142 and the third wiring layer 143 in this case) sandwiched by the surface wiring layers are also referred to as “inner wiring layers”.
In the present specification, “wiring layer” refers to a unit handled as the same layer when designing and manufacturing a wiring pattern.
The “wiring pattern” is formed in any wiring layer, and is formed as a dummy that does not have a function as a part of the circuit as a part forming a circuit, or as an alignment mark or the like for various purposes.
As a member to be a base of the multilayer substrate 130, a glass epoxy substrate can be used. Moreover, copper foil etc. can be used as a member of a wiring pattern. An interlayer insulating member 147 is interposed between the wiring layers when stacking the wiring layers (so-called layup).

The heat conduction wiring pattern 134 is provided in the inner wiring layer of the multilayer substrate 130 in the first embodiment (see, for example, FIG. 1A, FIG. 3B, and FIG. 5C).
The “heat conductive wiring pattern 134” is a wiring pattern which is planarly patterned in a predetermined wiring layer, and is a wiring pattern having a function of conducting heat.
In addition to the heat conduction wiring pattern, the wiring layer to which the heat conduction wiring pattern belongs may further include a wiring pattern or the like for forming a circuit.
The heat conduction wiring pattern 134 may be formed in one inner wiring layer or may be formed in a plurality of wiring layers.
Also, the heat conduction wiring pattern 134 may constitute an electrical circuit or may be a dummy pattern which does not constitute an electrical circuit. Here, “a pattern forming an electric circuit” means, for example, a pattern in which the wiring connects the lead terminal 112 of the heat-generating component 110 to another circuit component, an element, a terminal or the like.

In the surface layer wiring layer on the lower surface side of the multilayer substrate 130 in the first embodiment, a surface layer wiring pattern 132 including at least lands and through holes is provided, and the temperature detection component 150 may be mounted by soldering or the like. It can be done (see FIG. 1 (a), FIG. 3 (b), FIG. 5 (c), etc.). For example, when the temperature detection component 150 is a surface mount type component, as shown in FIG. 5D, the surface layer wiring pattern 132 is connected to a terminal (not shown) of the temperature detection component 150. It is preferable that lands 133 be provided.
Among the surface layer wiring patterns 132, patterns other than the lands 133 are covered and protected by a resist 148 or the like, and it is preferable that the withstand voltage against the outside of the multilayer substrate 130 is enhanced (see FIG. 3A). .

The temperature detection component 150 is a component that detects the temperature of the heat-generating component 110 and converts the temperature into an electrical signal. For example, a thermistor or the like can be used. As the temperature detection component 150, one having a surface mounted type, a disk type, a bead type, a cylinder type, or the like can be used, but mounting variation (for example, variation in contact degree between the temperature detection component 150 and the multilayer substrate 130) In consideration of the mounting cost and the like, it is preferable to use the surface mounting type.
The temperature detection component 150 is mounted on the surface layer wiring pattern provided in the surface layer wiring layer of the multilayer substrate 130 as described below, and the temperature detection circuit, various control circuits based on temperature detection, etc. (not shown) through the surface layer wiring pattern. It is connected.

  In the electronic device 100 according to the first embodiment, the upper surface of the heat generating component 110 is in close contact with the lower surface of the multilayer substrate 130, and the lead terminals 112 of the heat generating component 110 are connected to the heat conduction wiring pattern 134 provided in the inner layer wiring layer. The heat conduction wiring pattern 134 extends in a state of overlapping at least on the heat generating component 110 when viewed in plan (see FIG. 1A, FIG. 3 and the like).

  By closely attaching the upper surface of the heat generating component 110 to the lower surface of the multilayer substrate 130, the height of the electronic device 100 (the upper and lower directions toward the cross-sectional view of FIG. 1A and the like) can be suppressed. The heat of the heat-generating component 110 can be transferred directly to the multilayer substrate 130 (see the route of R2 shown in FIG. 4).

  Further, the lead terminals 112 of the heat generating component 110 are connected to the heat conductive wiring pattern 134 provided in the inner layer wiring layer, and the heat conductive wiring pattern 134 extends in a state of overlapping at least on the heat generating component 110 in plan view. It has the existing configuration. For this reason, the heat generated from the heat generating component 110 can be conducted in the path of the heat conduction wiring pattern 134 and the temperature detection component 150 via the heat generating component 110, the lead terminals 112 and J1 (shown in FIG. 4) See route R1).

  In the electronic device 100 according to the first embodiment, the temperature detection component 150 is a lower surface of the multilayer substrate 130 when viewed in cross section and is a region surrounded by the sealing member 114, the lead terminal 112, and the heat conduction wiring pattern 134. It is mounted on the surface wiring pattern 132 provided in the surface wiring layer at an inner position (see FIG. 1).

As described above, since the temperature detection component 150 is disposed in the above-described enclosed region, (i) heat conduction by the route of R1 described above, (ii) the route of R2 described above (heat generation component 110, the heat generation component Heat conduction by the lower surface of the multilayer substrate 130 in close contact with the upper surface 110, the tip of the heat conductive wiring pattern 134 extending on the heat generating component 110, and the path of the temperature detection component 150; The heat of the heat generating component 110 can be received by radiation or heat conduction from the lead terminal 112 (see FIG. 4).
As a result, the electronic device 100 according to the first embodiment can detect the temperature of the heat-generating component 110 more accurately and with better follow-up ability, as compared with the conventional electronic device.

The heat conduction wiring pattern 134 may be a dummy pattern that does not constitute an electrical circuit as described above, but it is highly likely that a large current will flow by being connected to the node from which the current of the heating element 116 is taken out. Therefore, the dielectric breakdown voltage is increased between the heat conduction wiring pattern 134 and the temperature detection component 150 and the surface wiring pattern 132 (in particular, the land 133 exposed for connection with the terminal of the heat generating component 110). It is necessary to secure (so-called insulation distance).
If the heat conduction wiring pattern 134 and the surface wiring pattern 132 are formed in the same wiring layer (for example, the fourth wiring layer 144), the heat conduction wiring pattern 134 and the land 133 of the surface wiring pattern 132 are In order to secure the insulation withstand voltage, it is necessary to design the pattern while securing a gap of at least more than, for example, 2 to 3 mm, and the area is increased accordingly.
On the other hand, in the electronic device 100 according to the first embodiment, the heat conduction wiring pattern 134, the temperature detection component 150, and the surface wiring pattern 132 (in particular, the lands 133) are provided in different wiring layers. The insulation withstand voltage (insulation distance) is secured by the interlayer insulating member 147 which spans. In other words, insulation withstand voltage (insulation distance) is secured in the thickness direction (approximately 0.2 to 1.0 mm or more) of the multilayer substrate 130.
By the way, the heat conduction wiring pattern 134 extends in a state where the heat conduction wiring pattern 134 overlaps the temperature detection component 150 in plan view, and the heat conduction wiring pattern 134 and the temperature detection component 150 are physically different only in the wiring layer. In fact, they are placed at an extremely close distance. For this reason, the electronic device 100 according to the first embodiment has a convenient configuration also in terms of heat transfer.
As described above, in the electronic device 100 according to the first embodiment, heat can be exchanged at a physically close distance while securing a necessary insulation distance, and these can be compatible.

In the electronic device 100 according to the first embodiment, the multilayer substrate 130 has a plurality of inner layer wiring layers, and the heat conduction wiring pattern 134 is a wiring of a layer closest to the lower surface side of the multilayer substrate 130 among the plurality of inner layer wiring layers. Preferably, it is formed in a layer (the third wiring layer 143 in FIG. 6) (see FIG. 6).
In this way, the heat conducted via the heat conduction wiring pattern 134 can be conducted from the closer wiring layer to the temperature detection component 150, and the temperature of the heat generation component 110 can be detected more accurately and with better followability. be able to.

The heat conduction wiring pattern 134 may be provided not only in the wiring layer of the layer closest to the lower surface side of the multilayer substrate 130 but also in the other inner wiring layers.
By doing this, it is possible to strengthen the path (the path of R1 in FIG. 4) for conducting the heat of the heat generating component 110, and it is possible to detect the temperature of the heat generating component 110 more accurately and with better followability.

The heat conductive wiring pattern 134 preferably overlaps the heat generating component 110 in an area of 10% or more of the area corresponding to the sealing member 114 of the heat generating component 110 when viewed in plan. For example, as shown in FIG. 5C, the area of the heat conduction wiring pattern 134 (indicated by hatching) formed in the third wiring layer is the sealing member 114 of the heat generating component 110 (the outline of the sealing member Overlapping at 10% or more of the area corresponding to solid line) (approximately 25% to 55% in FIG. 5 (c), but it may be more than this).
By doing this, the heat conduction wiring pattern overlapping by at least 10% can take in the heat of the heat generating component 110 at the upper side and can conduct it to the vicinity of the temperature detection component 150 along the route R2 shown in FIG. The electronic device 100 according to the first embodiment can detect the temperature of the heat-generating component 110 more accurately and more easily.

The lead terminal 112 is preferably connected to a node from which current is taken out of the plurality of nodes included in the heat-generating component 110.
The “node from which current is taken out” corresponds to, for example, the source or the drain when the heat generating component 110 is a power MOSFET, and corresponds to the emitter or the collector in the case of an IGBT. Furthermore, in the case of a power MOSFET, the node from which current is taken out is more preferably a drain (see FIG. 2, FIG. 5C, etc.).
The drain as a node from which current is taken out is a central heat source at a portion where a large amount of current flows among the power MOSFETs, and the drain is connected to the base 118 at the entire back surface of the chip, and the gate or source is The large area of the base 118 compared to the connected post 119 allows more heat to be conducted.
Also, the lead terminal connected to the node from which current is extracted is generally a wider terminal than the lead terminals connected to other nodes, and can conduct more heat. (For example, as shown in FIG. 1B, FIG. 5 and FIG. 2B, the width of the lead terminal 112b is wider than the width of the lead terminals 112a and 112c).
As described above, the node from which the current is taken out has an environment in which the heat of the heat generating component 110 can be conducted more, and the heat generating component 110 is conducted by heat conduction from the lead terminal 112 connected thereto. Temperature can be detected more accurately and more easily.

Further, in plan view, it is preferable that the temperature detection component 150 and the lead terminals connected to the nodes from which current is taken out of the plurality of nodes included in the heat generating component 110 be disposed so as to overlap with each other. . Specifically, it is preferable that the temperature detection component 150 be disposed on the terminal 112 b corresponding to the drain of the power MOSFET in plan view.
As described above, since the drain terminal 112b conducts more heat, by disposing the temperature detection component 150 thereon, the heat can be received directly above, and the temperature of the heat-generating component 110 can be more accurately , Can be detected more easily.

In the electronic device 100 according to the first embodiment, when the temperature detection component 150 is viewed in cross section, a position (a position indicated by J1 in FIG. 7) at which the lead terminal 112 and the heat conduction wiring pattern 134 are connected; It is preferable to be mounted at a central position between the end of the and the end on the J1 side (the position shown by E1 in FIG. 7).
Here, the “central position” is not a strictly central position, but may be a position that can achieve the object of the present invention, and a position of approximately 40% to 60% between J1 and E1. Also included.
Since the temperature detection component 150 has a certain thickness, if the temperature detection component 150 is to be mounted at the time of J1 (square), it is necessary to have a design that secures a clearance so as not to interfere with the bent portion of the lead terminal 112. Become. Further, as shown in FIG. 8A, when the temperature detection component 150 is mounted at the time of J1 when the lead terminal 112 is not covered with the insulating material 160 which will be described later and is exposed, as shown in FIG. It is also assumed that a sufficient insulation distance between the temperature detection component 150 (and the land 133 exposed for connection to the terminal of the heat generating component 110 as shown in FIG. 5D) and the lead terminal 112 can not be secured. Ru. From this, it is preferable that the temperature detection component 150 be mounted at a central position between J1 and E1.

In the electronic device 100 according to the first embodiment, the temperature detection component 150 is preferably a surface mount type thermistor.
When a disk-shaped, bead-shaped, cylinder-shaped or other component is used as the temperature detection component 150, the bending angle variation of the lead wire performed individually for each component when mounting such component on the multilayer substrate 130, temperature detection The degree of contact between the temperature detection component 150 and the multilayer substrate 130 fluctuates under the influence of the degree of interposition of the adhesive between the component 150 and the multilayer substrate 130 and the like, and the degree of thermal conduction varies, which is accurate Temperature detection may cause problems, and in order to solve this, more strict manufacturing control and quality control are required.
In addition, when these parts are used, parts (screws etc.) for fixing to the multilayer board 130 are separately required, and the cost of such parts (screws etc.) and the number of screw fastening and the number of soldering steps to the multilayer board Implementation cost increases.
On the other hand, when a surface mount type thermistor is used as the temperature detection component 150, the lead wire bending operation is unnecessary, and no additional component for fixing to the multilayer substrate 130 is required, and many soldering operations are automated. As a result, the above-mentioned mounting variation and mounting cost can be suppressed.
Therefore, in consideration of these circumstances, it is preferable that the temperature detection component 150 be a surface mount type thermistor.

In the electronic device 100 according to the first embodiment, the heat generating component 110 is preferably a power transistor.
A power transistor such as a power MOSFET or IGBT is a device that passes a large current, and there is a high demand for prevention / stop of thermal runaway based on temperature detection of the transistor, various controls based on temperature detection, etc. It is suitable to apply as 110.

In the electronic device 100 according to the first embodiment, the surface of the lead terminal 112 is preferably covered with the insulating material 160 (see FIG. 8).
As the insulating material 160, a heat-shrinkable tube or the like can be used. By covering the lead terminal 112 with the insulating material 160, insulation between the lead terminal 112 with a high possibility of large current flow and the temperature detection component 150 (and the land 133 exposed for connection with the terminal of the heat generating component 110) The withstand voltage can be further enhanced.
If, as shown in FIG. 8 (b), the insulating material 160 is covered to the point near the tip of the lead terminal 112 just before being connected to the multilayer substrate 130, the temperature detection component 150 is as shown in FIG. It is also possible to move the arrangement position from the central position shown to a position closer to J1 shown in FIG. 8B, so that the temperature of the heat generating component 110 can be more accurately and more accurately at a position on the heat conduction path closer to the heat generating component 110. It can be detected with good tracking.

For reference, in the electronic device 100 according to the first embodiment, the heat-generating component 110 is preferably fixed to the multilayer substrate 130 by the engagement member 162 (see FIG. 1).
As the "engaging member 162", a screw 162a, a plate spring 162b or the like can be used. In consideration of heat conduction, the engagement member 162 is preferably made of metal.
By fixing the heat generating component 110 and the multilayer substrate 130 by the engagement member 162, the degree of close contact between the upper surface of the heat generating component 110 and the lower surface of the multilayer substrate 130 can be increased, and the heat of the heat generating component 110 is made more efficient. Can be conducted to the multilayer substrate 130 (see the route R2 shown in FIG. 4), and the heat of the heat generating component 110 can also be conducted to the side of the temperature detection component 150 through the engagement member 162 (shown in FIG. See the path of R3.) The temperature of the heat-generating component 110 can be detected more accurately and with better tracking.

2. Operation of Electronic Device 100 Next, the operation (operation, heat conduction) of the electronic device 100 according to the first embodiment will be described with reference to FIG. .

As described above, in the power MOSFET, the lead terminal 112a connected to the gate, the lead terminal 112b connected to the drain, and the lead terminal 112c connected to the source are respectively connected to the multilayer substrate 130, and a predetermined drive circuit (for example, , Part of the inverter circuit etc.).
Similarly, the temperature detection component 150 is connected to a temperature detection circuit or the like (not shown) through the surface layer wiring pattern 132, and constitutes a part of the detection circuit.

  The gate of the power MOSFET is switching-controlled by the above-described predetermined drive circuit, and a current is intermittently taken out from between the source and drain according to the switching control to drive a load. For example, a large current (for example, 5A to 80A, depending on the rating of the power MOSFET) flows intermittently through the drain which is the current extraction node.

(1) Path of R1 As the driving by the above-mentioned large current is continued, the node related to the drain generates heat and becomes high temperature. Then, the heat of the node is conducted from the entire back surface of the heat generating element 116 (semiconductor chip) to the base 118, from the base 118 to the lead terminal 112b, and from the lead terminal 112b to J1. The heat is conducted to the heat detection wiring 150 from the heat conduction wiring pattern 134 to the temperature detection component 150 (path of R1; see FIG. 4).
The base 118, the lead terminal 112b, and the heat conduction wiring pattern 134 constituting the path of R1 are made of a resin or the like used for the sealing member 114 or a copper or the like having a thermal conductivity higher than that of a glass epoxy resin used for the multilayer substrate 130. The temperature of the base 118, the lead terminal 112b, and the heat conduction wiring pattern 134 when the heat conduction occurs is approximately the same as the temperature of the node related to the drain (so-called the temperature of the heat generating component 110). It will be the temperature. Therefore, the temperature detection component 150 in the vicinity of the heat conduction wiring pattern 134 detects the temperature due to the heat conducted from the path of R1, thereby more accurately detecting the temperature of the heat generation component 110 with better followability. Do.

(2) Path of R 2 In addition to the path of R 1 described above, the heat generating component 110, the lower surface of the multilayer substrate 130 in close contact with the upper surface of the heat generating component 110, and the heat conduction wiring pattern 134 extending over the heat generating component 110. The heat of the heat generating component 110 is also conducted by the tip and the path of the temperature detection component 150 (see the route of R2 shown in FIG. 4). Therefore, the heat conducted from the R2 path is also taken into the temperature detection component 150.

(3) Route of R3 In addition to the routes of R1 and R2 described above, the route of the heat generating component 110, the engagement member 162, the tip of the heat conduction wiring pattern 134, and the route of the temperature detection component 150 (route of R3 shown in FIG. The heat of the heat generating component 110 is also conducted by the reference. Therefore, the heat conducted from the R3 path is also taken into the temperature detection component 150.

(4) Other Paths In addition to the paths of R1, R2 and R3 described above, the temperature detection component 150 is (i) surrounded by, for example, the sealing member 114, the lead terminal 112 and the heat conduction wiring pattern 134. When the area is an air gap, the heat radiated from the sealing member 114 and the lead terminal 112 is also (ii) an area surrounded by, for example, the sealing member 114, the lead terminal 112 and the heat conduction wiring pattern 134 In the case of being sealed with a resin or the like, the heat conducted from the sealing member 114 and the lead terminal 112 through the resin or the like is also taken into the temperature detection component 150 (see FIG. 4).

3. (1) According to the electronic device 100 of the first embodiment, the lead terminals 112 of the heat generating component 110 are connected to the heat conduction wiring pattern 134 provided in the inner layer wiring layer, and the heat conduction wiring pattern 134 is When viewed in a plan view, the temperature detection component 150 extends in a state of overlapping at least on the heat generating component 110, and the temperature detection component 150 is the lower surface of the multilayer substrate 130 in cross section and the sealing member 114, the lead terminal 112, and the heat. Since the temperature detection component 150 is mounted on the surface wiring pattern 132 provided in the surface wiring layer at a position within the region surrounded by the conductive wiring pattern 134, the heat of the heat generating component 110 is (i) lead terminal 112, and heat conduction by a path (path of R1) from J1 to directly above the temperature detection component 150 in the heat conduction wiring pattern 134, (ii) Heat conduction by a path (path of R2) from the top surface of the upper surface of the thermal component 110, the lower surface of the multilayer substrate 130, and the tip of the heat conduction wiring pattern 134 to just above the temperature detection component 150; It can be received from many directions by radiation or conduction from the lead terminal 112.
As a result, according to the electronic device 100 according to the first embodiment, the temperature of the heat-generating component 110 can be detected more accurately and with better follow-up characteristics, as compared with the conventional electronic device.

(2) In the electronic device 100 according to the first embodiment, the lead terminals of the heat generating component 110 are connected to the heat conductive wiring pattern 134 provided in the inner layer wiring layer, and the heat conductive wiring pattern 134 is formed on the heat generating component 110 The temperature detection component 150 extends in an overlapping state, and is mounted on the surface wiring pattern 132 provided in the surface wiring layer. That is, although the wiring layer is different between the wiring layer provided with the heat conduction wiring pattern 134 and the surface wiring pattern 132 on which the temperature detection component 150 is mounted, both (the heat conduction wiring pattern 134 and the temperature detection component 150) are physically It is placed at a close distance. With such a configuration, heat can be exchanged at a physically close distance while securing a necessary insulation distance between the two, and while the two are compatible, they are compared with the conventional electronic device. Thus, the temperature of the heat-generating component 110 can be detected more accurately and more easily.

(3) The electronic device 100 according to the first embodiment can perform temperature detection more accurately and more easily as compared to the conventional electronic device, so the heat generating component 110 (electronic device such as a power MOSFET) has thermal runaway. When the temperature rises abnormally, control such as stopping the operation of the system can be realized immediately. Also, even before the thermal runaway, if the temperature of the heat generating component 110 becomes higher than the temperature at the time of normal operation under temperature detection with accuracy and good followability, for example, As a system, it is possible to realize a control with a small difference in target value and good response, such as rotating the cooling fan / speeding the rotation, sending a warning signal, and reducing the load. As described above, by applying the electronic device 100 according to the first embodiment, a request for precise control based on accurate temperature detection of heat-generating components, highly responsive control based on temperature detection with good followability, and the like is also satisfied. be able to.

Second Embodiment
1. The electronic module 500 according to the second embodiment basically has the same configuration as the electronic device 100 according to the first embodiment, but includes a metal case 180, and the engagement member 162 is a screw 162a or a plate spring 162b. The multilayer substrate 130 is different from the electronic device 100 according to the first embodiment in that the multilayer substrate 130 is fixed to the metal case 180 via the heat generating component 110 by co-clamping with the screw 162 a or engagement with the plate spring 162 b (see FIG. 10)).

For example, as shown in FIG. 10A, the electronic module 500 according to the second embodiment includes a metal case 180 and the electronic device 100 according to the first embodiment, and the engagement member 162 is a screw 162a. The multilayer substrate 130 is fixed to the metal case 180 via the heat-generating component 110 by co-tightening with the screws 162a.
For example, as shown in FIG. 10B, the metal case 180 and the electronic device 100 according to the first embodiment are provided, the engagement member 162 is a plate spring 162b, and the multilayer substrate 130 is a plate spring 162b. May be fixed to the metal case 180 via the heat-generating component 110 by the engagement according to FIG.

  With such a configuration, the heat generating component 110 and the multilayer substrate 130 are fixed to each other in a state in which a pressing force is applied to the interface between them by the engagement member 162, and the heat conduction by the route of the heat generating component 110 and the multilayer substrate 130 is also The temperature of the heat-generating component 110 can be detected more accurately and more easily as compared with the conventional electronic module. In addition, by utilizing and engaging a generally circulating engaging member such as a screw or a leaf spring, the number of parts can be reduced, and the electronic module 500 can be manufactured at low cost. In addition, inspection, maintenance, etc. can be performed by removing the screw 162a or the plate spring 162b.

Here, the metal case 180 may be made of, for example, aluminum. Also, a gap may remain as it is from the bottom surface of the metal case 180 to the lower surfaces of the lead terminals 112 and the multilayer substrate 130, or may be sealed with a resin or the like.
The electronic module 500 according to the second embodiment includes, for example, a heat generating component 110 such as a power system device such as a power MOSFET, and may be used in a circuit such as a power supply device, a generator, or an AC inverter. One of the heat generating components 110 may be included in the heat sink, but a plurality (for example, four pieces) may be included.

  As described above, the electronic module 500 according to the second embodiment includes the metal case 180, and the multilayer substrate 130 is fixed to the metal case 180 via the heat-generating component 110 by the engagement by the engagement member 162. Although different from the electronic device 100 according to the first embodiment, since the electronic device 100 is used, the effects of the electronic device 100 according to the first embodiment are provided as they are.

2. Further, in the electronic module 500 according to the second embodiment, in addition to the above, as shown in FIG. 11, a heat dissipation sheet 182 a or a heat dissipation grease 182 b may be interposed between the heat generating component 110 and the multilayer substrate 130. .
By doing this, the heat conduction between the heat generating component 110 and the multilayer substrate 130 is improved, and the temperature of the heat generating component 110 can be detected more accurately with good followability.

3. Further, in the electronic module 500 according to the second embodiment, in addition to the above, as shown in FIG. 11, a heat dissipation sheet 182a may be interposed between the heat-generating component 110 and the metal case 180.
By so doing, the heat dissipation sheet 182 a or the heat dissipation grease 182 b can relieve the stress due to the difference between the thermal expansion coefficient of the heat-generating component 110 and the thermal expansion coefficient of the multilayer substrate 130.

[Example of experiment]
1. Experimental Example 1
In order to confirm the accuracy of temperature detection, the electronic device 100 according to the first embodiment was evaluated together with the conventional electronic device 900 (comparative example). The experimental example will be described below.

(1) Experimental configuration a) As a sample, the electronic device 100 according to the first embodiment was used for the experiment as it was. A power MOSFET was used as the heat generating component 110. As the multilayer substrate 130, a general glass epoxy substrate was used, and a four-layered multilayer substrate in which the thickness of the wiring layer was 35 μm in the surface layer and 75 μm in the inner layer was used. The heat conduction wiring pattern 134 was formed in the third wiring layer 143, and the heat conduction wiring pattern 134 in which approximately 25% of the area of the heat generating component 110 corresponding to the sealing member 114 overlapped was used. As the temperature detection component 150, a surface mount type thermistor (“NCP18XH103F0SRB” manufactured by Tamura Corporation) was used. At the same time, the multilayer substrate 130 and the heat-generating component 110 were fixed to the aluminum metal case 180 using the screw 162 a as the engagement member 162.

  With respect to the electronic device 100, as shown in FIG. 12B, the temperature detection signal from the temperature detection component 150 is extracted through the surface layer wiring pattern 132 and connected to the MP1 input of the temperature recording unit 200. The second temperature detection component 152 is brought into contact with the side surface of the (see FIG. 12C), and is connected to the MP2 input of the temperature recording unit 200. The second temperature detection component 152 used a thermocouple.

Further, the signal lines from the test signal supply unit 210 were connected to the lead terminals 112a, 112b and 112c respectively corresponding to the gate, drain and source of the heat generating component 110 (power MOSFET). The test signal supply unit 210 includes the load of the heat generating component 110.
B) As a comparative example, the conventional electronic device 900 was used as it was in the experiment. The experimental configuration is basically the same as the configuration of the experiment using the electronic device 100 described above, as shown in FIG. 12A, but the temperature detection component 950 is mounted on the upper surface of the multilayer substrate 930. Therefore, the difference is that the signal from the temperature detection component 950 is taken out through the surface wiring pattern 932 on the upper surface.

(2) Experimental conditions The test signal supply unit 210 applies a current (for example, 30 A) slightly lower than the maximum rated current which is stopped by the overcurrent to the heat generating components (power MOSFETs) 110 and 910 for about 7 minutes ( The load conditions immediately before the over current stop), the temperature detected by the temperature detection components 150 and 950 mounted on the multilayer substrate 130 and 930, and the temperature of the heat generation components 110 and 910 themselves were simultaneously measured.
Note that no active measures (measures such as turning on a cooling fan) for cooling the heat generating components (power MOSFETs) 110 and 910 are performed.

(3) Experimental Results FIG. 13 is a graph showing the results of Experimental Example 1. In the graph, the abscissa represents the elapsed time and the ordinate represents the temperature, MP1 represents the temperature detected by the temperature detection components 150 and 950 mounted on the multilayer substrate 130 and 930, and MP2 represents the temperature of the heat generation components 110 and 910 themselves. Indicates the temperature. 13 (a) shows the result of temperature detection by the conventional electronic device 900, and FIG. 13 (b) shows the result of temperature detection by the electronic device 100 according to the first embodiment.

  In the conventional electronic device 900, as can be seen from FIG. 13A, the temperature (MP1) detected by the temperature detection component 950 is about 20 ° C. lower than the temperature (MP2) of the heat-generating component 910 itself. And there is a divergence between the two data. On the other hand, in the electronic device 100 according to the first embodiment, as can be seen from FIG. 13B, the temperature (MP1) detected by the temperature detection component 150 is substantially the same as the temperature (MP2) of the heat-generating component 110 itself. (The initial deviation is within 4 ° C, and the deviation after 7 minutes is almost 0 ° C), and it is possible to detect the temperature of the heat-generating component 110 more accurately as compared with the conventional electronic device 900. confirmed.

2. Experimental Example 2
The evaluation of the electronic device 100 according to the first embodiment was performed along with the conventional electronic device 900 (comparative example) in order to confirm the goodness of the followability of temperature detection. The experimental example will be described below.

(1) Experimental Configuration The configuration is the same as that of the above-described Experimental Example 1.

(2) Experimental conditions Although the contents are basically in accordance with Experimental Example 1, Experimental Example 2 is different from Experimental Example 1 in the way of supplying a test signal. That is, the test signal supply unit 210 supplies a predetermined current (for example, 40 A) for a first time (for example, 4 seconds) between the source and the drain of the heat generating component (power MOSFET) 110 and 910 for a second time (for example For example, for 10 seconds, a signal is provided to repeatedly interrupt the current (open and close). The open / close operation was continued for at least 7 minutes, and the temperature detected by the temperature detection components 150 and 950 mounted on the multilayer substrate 130 and 930 between them and the temperature of the heat generation components 110 and 910 themselves were simultaneously measured.

(3) Experimental Results FIG. 14 is a graph showing the results of Experimental Example 2. The axes of the graph, MP1 and MP2 are the same as in FIG. 13 of Experimental Example 1. FIG. 14A shows the result of temperature detection by the conventional electronic device 900, and FIG. 14B shows the result of temperature detection by the electronic device 100 according to the first embodiment.

  In the conventional electronic device 900, as can be seen from FIG. 14 (a), the temperature graph (MP2) of the heat-generating component 910 itself shows clear turning up and down with the opening and closing between the source and drain. The temperature graph (MP1) detected by the temperature detection component 950 can not follow the folding of the graph of MP2. On the other hand, in the electronic device 100 according to the first embodiment, as can be seen from FIG. 14B, when looking at the temperature graph (MP1) detected by the temperature detection component 150, the temperature graph (MP2) of the heat generating component 110 itself It has been confirmed that the temperature of the heat-generating component 110 can be detected with better follow-up performance as compared with the conventional electronic device 900.

  As described above, it is confirmed from the experimental example 1 and the experimental example 2 that the electronic device 100 of the present invention can detect the temperature of the heat-generating component more accurately and with better follow-up property as compared with the conventional electronic device. did it.

  As mentioned above, although the present invention was explained based on the above-mentioned embodiment, the present invention is not limited to the above-mentioned embodiment. It is possible to implement in the range which does not deviate from the meaning, for example, the following modifications are also possible.

(1) In each of the above embodiments, although the case where the heat generating component 110 is a power MOSFET has been described as an example, the present invention is not limited to this. Any electronic component that generates heat by operation is generally applicable to the present invention, and in particular, a power electronic device such as an IGBT that drives a large current to a connected load while switching the gate by opening and closing the gate It is suitable.

(2) Although the example which used the glass epoxy substrate as the multilayer substrate 130 was demonstrated in said each embodiment, it is not restricted to this. For example, substrates such as paper phenol, paper epoxy, Teflon (registered trademark) and alumina can be used for this, as long as the present invention can be practiced.

(3) In the above embodiments, the multilayer substrate 130 is described using a multilayer substrate having four wiring layers, but the present invention is not limited to this. For example, a multilayer substrate such as three or six layers can be used for this.

(4) In the first embodiment, the fixing hole 120 provided in the sealing member 114 of the heat-generating component 110 is penetrated by using the screw 162a as an engaging member, and the heat-generating component 110 and the multilayer substrate 130 are tightened together. Although the example which engaged with was demonstrated, it is not restricted to this. For example, as shown in FIG. 9, the multilayer substrate 130 and the heat generating component 110 can be engaged with each other using a screw 162 a at a portion of the heat generating component 110 which is not the sealing member 114.

DESCRIPTION OF SYMBOLS 100, 800, 900 ... Electronic device, 110, 810a, 810b, 910 ... Heating part, 112, 112a, 112b, 112c, 912 ... Lead terminal, 114, 914 ... Sealing member, 116 ... Heating element, 118 ... Base, 119: post, 120: hole for fixing, 122: die pad, 124: wire, 130, 930: multilayer substrate, 130 ′: bare substrate, 132, 932: surface wiring pattern, 133: land, 134: thermal conductive wiring pattern, 141: first wiring layer 142: second wiring layer 143: third wiring layer 144: fourth wiring layer 147: interlayer insulating member 148: resist 150, 850a, 850b, 950 temperature detection component 152 ... second temperature detection part, 160 ... insulating material, 162 ... engaging member, 162 a ... screw, 162 b ... leaf spring, 180 ... Metal case, 182 a ... Heat dissipation sheet, 182 b ... Heat dissipation grease, 200 ... Temperature recording part, 210 ... Test signal supply part, 500, 990 ... Electronic module, 830 ... Main board, 831 ... Sub board, 870 a, 870 b ... Compound, 936 ... Wiring pattern

Claims (12)

A heat generating component having a lead terminal and sealed by a sealing member;
A multilayer substrate having a surface wiring layer and an inner layer wiring layer,
An electronic device comprising: a temperature detection component for detecting a temperature of the heat generation component;
The upper surface of the heat generating component is in close contact with the lower surface of the multilayer substrate, and the lead terminal of the heat generating component is connected to a heat conduction wiring pattern provided in the inner layer wiring layer,
The heat conductive wiring pattern extends in an overlapping state at least on the heat generating component when viewed in plan view,
The temperature detection component is provided on the surface wiring layer at a position within a region surrounded by the sealing member, the lead terminal, and the heat conduction wiring pattern, which is a lower surface of the multilayer substrate when viewed in cross section. Mounted on the surface wiring pattern,
When viewed in a plan view, the temperature detection component and a lead terminal connected to a node from which current is taken out of the plurality of nodes of the heat generation component are disposed so as to overlap with each other. machine. In the electronic device according to claim 1,
The multilayer substrate has a plurality of the inner wiring layers,
The electronic device, wherein the heat conduction wiring pattern is formed in a wiring layer of a layer closest to the lower surface side of the multilayer substrate among the plurality of inner layer wiring layers. In the electronic device according to claim 1 or 2,
The electronic device according to claim 1, wherein the heat conduction wiring pattern overlaps the heat generating component in an area of 10% or more of the area corresponding to the sealing member of the heat generating component in plan view. In the electronic device according to any one of claims 1 to 3,
The electronic device, wherein the lead terminal is connected to a node from which current is taken out among a plurality of nodes included in the heat-generating component. In the electronic device according to any one of claims 1 to 4,
The temperature detection component is a position where the lead terminal and the heat conduction wiring pattern are connected (hereinafter referred to as J1) when viewed in cross section, and an end portion of the heat generation component on the J1 side An electronic device characterized in that it is mounted at a central position between the unit and the unit. In the electronic device according to any one of claims 1 to 5,
The electronic device, wherein the temperature detection component is a surface mount type thermistor. In the electronic device according to any one of claims 1 to 6,
The electronic device, wherein the heat generating component is a power transistor. In the electronic device according to any one of claims 1 to 7,
The surface of the lead terminal is covered with an insulating material. In the electronic device according to any one of claims 1 to 8,
The electronic device, wherein the heat generating component is fixed to the multilayer substrate by an engagement member. With metal case,
And the electronic device according to claim 9.
The engagement member is a screw or a leaf spring,
The electronic module, wherein the multilayer substrate is fixed to the metal case via the heat-generating component by co-clamping with a screw or engagement with a plate spring. In the electronic module according to claim 10,
A heat dissipation sheet or a heat dissipation grease is interposed between the heat generating component and the multilayer substrate. In the electronic module according to claim 10 or 11,
A heat dissipation sheet is interposed between the heat generating component and the metal case.

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