JPH11251713A - Printed board and structure for mounting electronic component thereon - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a structure for mounting terminals on the onboard electronic equipment of a space satellite to efficiently radiate heat without generating any gas. SOLUTION: A diode CR10 is mounted on a printed board 40 in such a state that the L-shaped leads 21 and 22 of the diode CR10 are tightly inserted into the through holes of the board 40 and soldered by a solder 60 to terminal sections 46 and 47 on the lower surface of the board 40. The heat generated front the main body 20 of the diode CF10 is transferred to heat radiating lands 50 and 51 through the leads 21 and 22, and further transferred to a ground pattern 52 through applied adhesive sections 61 and 62 and insulating belt section 56 and 57, after the heat is conducted radially in the lands 50 and 51. Then the heat is transferred to the enclosure of electronic equipment after being conducted through the pattern 52 and, finally, radiated to a vacuum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting an electronic component on a printed board, and more particularly to a structure of an electronic component module incorporated in an electronic device mounted on a space satellite. Since the outer space is a vacuum, the electronic equipment mounted on the space satellite is also in a vacuum state, and the electronic component module built in the electronic equipment cannot be cooled by air convection, so it is exclusively conducted and radiated. Limited by cooling. Therefore, it is desired that the above-mentioned electronic component module be efficiently cooled under the condition that heat radiation is limited to conduction and radiation.

FIG. 10 shows a part of a circuit of the electronic component module. This circuit is a power supply circuit 10,
Power type bidirectional axial lead diodes CR9, CR10, etc. are connected. The power type bidirectional axial lead diodes CR9 and CR10 generate heat. Normally, one lead of the diode is set to the ground potential, but as can be seen from FIG. 10, the leads on both sides of the power type bidirectional axial lead diode are both at a high potential. In a structure for cooling a diode, it is necessary to consider that both leads of the diode are at a high potential.

[0003]

2. Description of the Related Art FIGS. 11A and 11B show a mounting structure of a power type bidirectional axial lead diode of a conventional power supply circuit. The power type bidirectional axial lead diode CR10 is
It comprises a substantially spherical main body 20 and L-shaped leads 21 and 22 protruding from the main body 20 on both sides. Diode CR10
Inserts the L-shaped leads 21 and 22 into the through holes of the printed board 23 and
4 and 25 are mounted by soldering. Wiring patterns 26 and 27 are formed on the lower surface of the printed board 23. The land 24 is at the end of the wiring pattern 26, and the land 25 is at the end of the wiring pattern 27, and both have a high potential.

A diode C is provided on the upper surface of the printed board 23.
A rectangular frame 28 is fixed so as to surround R10, and the diode CR10 is potted and buried in a silicone-based adhesive 29 filled in the frame 28. The heat generated by the diode CR10 is mainly due to the filled silicone adhesive 29 as indicated by reference numeral 30.
It is conducted through the inside and is radiated from the upper surface 29a as indicated by reference numeral 31 to be radiated.

[0005]

In the above-described diode mounting structure, since the amount of the silicone adhesive 29 used to fill each diode is used, the weight of the electronic component module is increased. This is disadvantageous when mounted on a space satellite for which weight reduction is required.

Further, when the potted silicone adhesive 29 is heated, gas may be generated from the silicone adhesive 29. When the gas is generated, the surface of the optical device mounted on the space satellite is contaminated, and the characteristics of the optical device deteriorate. Therefore, an object of the present invention is to provide a mounting structure of an electronic component on a printed board and a printed board that have solved the above-mentioned problems.

[0007]

According to a first aspect of the present invention, a printed board has a wiring pattern and a terminal portion at an end of the wiring pattern, and an electronic component is mounted with its terminal connected to the terminal portion. In the mounting structure for mounting an electronic component on a printed board, wherein the terminal portions to which the terminals of the electronic component are connected are both at a high potential, the printed board is separated from the terminal portion by a terminal of the electronic component. And a ground pattern surrounding the heat release land and electrically insulated from the heat release land. Is mounted so that the heat generated in the mounted electronic component is conducted to the ground pattern through the terminal and the heat-dissipating land, and is dissipated. It is.

[0008] Since the heat generated by the mounted electronic components is conducted and radiated through the terminals, the radiating lands, and the ground pattern, the weight is not particularly increased and gas is not generated. The heat generated by the mounted electronic components can be efficiently dissipated. According to a second aspect of the present invention, an adhesive portion having electrical insulation and a thermal conductivity higher than the thermal conductivity of the printed board main body is provided across the heat radiation land and the ground pattern. The configuration is as follows.

Since the adhesive portion is provided so as to straddle the heat radiation land and the ground pattern, the thermal resistance between the heat radiation land and the ground pattern is reduced. According to a third aspect of the present invention, the printed board has a wiring pattern, a terminal portion at an end of the wiring pattern, and an electronic component is mounted with the terminal connected to the terminal portion. In the mounting structure of an electronic component having a configuration in which both connected terminal portions are at a high potential, the printed board has a large-sized terminal portion larger than a normal terminal portion, and has a substantially solid shape. Having a ground pattern formed in a state in which it is not electrically connected to the terminal of the electronic component, between the portions in the thickness direction of the printed board,
The electronic component has its terminals connected to the large-sized terminal portion, and is mounted without being connected to the ground pattern, and the heat generated by the mounted electronic component is
The terminal, the large-sized terminal portion, and the portion of the printed board in the thickness direction are conducted to the ground pattern to dissipate heat.

The heat generated by the mounted electronic components is conducted and radiated through the terminals, the large-sized terminals, the portion in the thickness direction of the printed circuit board, and the ground pattern, so that the weight is special. The heat generated by the mounted electronic components can be efficiently dissipated without increasing the temperature and without generating gas. According to a fourth aspect of the present invention, there is provided a printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion. A structure having a heat-dissipating land to which terminals of electronic components are connected, and having a ground pattern surrounding the heat-dissipating land and electrically insulated from the heat-dissipating land. It is.

[0011] Apart from the terminal portion, there is a heat radiation land to which the terminal of the electronic component is connected, and the ground pattern is
Since the heat radiation land is provided so as to surround the heat radiation land and is electrically insulated from the heat radiation land, it is possible to improve heat radiation when an electronic component is mounted. According to a fifth aspect of the present invention, there is provided a printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion. A ground having a terminal portion and having a substantially solid shape, and being formed so as not to be electrically connected to the terminal of the electronic component with a portion in the thickness direction of the printed board therebetween. This is a configuration having a pattern.

The printed circuit board has a large-sized terminal portion larger than a normal terminal portion and has a substantially solid shape, and the terminal of the electronic component is electrically connected to the terminal in the thickness direction of the printed board. Since the configuration has the ground pattern formed so as not to be electrically connected, when the electronic component is mounted, the heat radiation can be improved.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG.
(B) shows the mounting structure of the diode on the printed board according to the first embodiment of the present invention. In the figure, FIG.
Portions corresponding to the components shown in (B) are given the same reference numerals, and description thereof is omitted. 2A and 2B show a part of the printed board 40. FIG. Figure 2 shows the actual printed circuit board
This is a configuration in which a large number of portions shown in (A) and (B) are arranged.

First, the structure of a portion of the printed board 40 on which a diode is mounted will be described. FIG. 2 (A),
Looking at the part shown in FIG.
It is a double-sided type, and through holes 42 and 43 are formed in a printed board main body 41. Printed board body 41
Are formed on the lower surface 41a of the wiring patterns 44, 45, and terminal portions 46, 47 at the ends of the wiring patterns 44, 45.
Are formed in conformity with the through holes 42 and 43.

On the upper surface 41b of the printed board main body 41, radiating lands 50 and 51, a ground pattern 52, and a ground pattern 53 are formed. Land for heat dissipation 5
Reference numerals 0 and 51 each have an a × b rectangular shape. The heat radiation lands 50 are located at positions corresponding to the terminal portions 46, and the heat radiation lands 51 are located at positions corresponding to the terminal portions 47. This heat release land 5
0 and 51 have a vertical dimension a of about 6 mm and a horizontal dimension b of about 10 mm
And the area is about 10 times larger than the terminal portions 46 and 47. The heat radiation lands 50 and 51 and the terminal portions 46 and 4
7 are electrically connected by through-hole plating 54, 55.

The ground pattern 52 has a size surrounding the heat-dissipating lands 50 and 51 arranged as described above, and has an outer shape of c × d rectangular shape. An opening 52a slightly larger than 51;
52b. Outer peripheral edge 50 of heat radiation lands 50 and 51
a, 51a and inner peripheral edges 52a1, 52a1, 52b of the openings 52a, 52b.
A band having a width dimension e is provided between the belt 52b1 and 52b1. That is, each of the heat radiation lands 50 and 51 and the ground pattern 52
Between them, there are formed rectangular frame-shaped insulating strips 56, 57 extending over the entire circumference of the heat radiation lands 50, 51. In other words, the ground pattern 52 is formed by the heat release land 5.
It surrounds 0 and 51.

Further, the ground pattern 52 has a crossing band portion 52c crossing between the heat radiation lands 50 and the heat radiation lands 51. In addition, the ground pattern 52 has plated through holes 58 at six locations around it. A diode is mounted on the printed board 40 as described later,
When the printed board 40 is incorporated in the electronic device, the ground pattern 52 is electrically connected to the housing of the electronic device via the plated through hole 58.

The basic structure of the printed board 40 is such that radiating lands 50 and 51 are provided separately from the terminal portions 46 and 47, and the radiating lands 50 and 51 and the ground pattern 52 are electrically connected. Is a structure that is insulated and thermally conductive. In the state of the electronic component module described later, the terminal portions 46 and 47 are both at a high potential.

Next, the structure (the structure of the electronic component module) in which the power type bidirectional axial lead diode CR10 is mounted on the printed board 40 is shown in FIGS. 1A and 1B.
This will be described with reference to FIG. The diode CR10 is mounted on the surface of the printed board 40 on which the radiating lands 50 and 51 and the ground pattern 52 are formed. That is, in the diode CR10, the L-shaped leads 21 and 22 protruding from both sides of the substantially spherical main body 20 are inserted into the through holes 42 and 43 of the printed board 40, and the terminal portions 46 on the lower surface of the printed board 40 are soldered. , 47, the through holes 42, 43, and the radiating lands 50, 51, and the main body 20 is mounted in contact with the transverse band portion 52c of the ground pattern 52. The leads 21 and the radiating lands 50 and the leads 22 and the radiating lands 51 are connected so as to conduct heat.

The diode CR10 is, for example, 1N5811 manufactured by Micro Semiconductor Co., Ltd.
0.3 to 0.4 W. Reference numeral 61 denotes a coating adhesive portion, which is applied over the insulating band portion 56 over the heat radiation land 50 and the ground pattern 52. Reference numeral 62 denotes a coating adhesive portion, which is applied across the insulating band portion 57 over the heat radiation land 51 and the ground pattern 52.
The application adhesive portions 61 and 62 are epoxy-based adhesives, specifically, for example, castle 1520 (trade name), have electrical insulation properties, and have a thermal conductivity of the printed board main body. 41, which has properties considerably higher than the thermal conductivity of the diode 41.
It serves to assist conduction to the body.

The presence of the insulating strips 56, 57 allows the leads 21, 2 of the mounted diode CR10 to be mounted.
2 and the ground pattern 52 are electrically insulated. Other diodes CR9 etc. are also the above diode CR.
The electronic component module is mounted in the same manner as 10.

Since the electronic component module does not have a silicone adhesive covering each diode, it is lighter in weight than the conventional one and there is no possibility of generating gas. Therefore,
The inconvenience that the surface of the optical device mounted on the space satellite is contaminated by the generated gas and the characteristics of the optical device are deteriorated does not occur. Next, in a state where the above-described electronic component module is incorporated in an electronic device, and the electronic device is mounted on a space satellite and is flying in outer space,
Regarding the heat radiation of the heat generated by the diode CR10, FIG.
This will be described with reference to FIGS.

The diode CR10 is connected to the leads 21 and 22.
Operate at a high potential and generate heat. Diode C
The heat generated in the main body 20 of the R10 is mainly conducted and radiated through the following paths. Conducting along the leads 21 and 22 as shown by the arrow 70, and then moving to the radiating lands 50 and 51, conducting radially through the radiating lands 50 and 51 as shown by the arrow 71, Most of the conductive band is conducted in the coating adhesive portions 61 and 62 as shown by the arrow 73 and moves to the ground pattern 52 beyond the insulating band portions 56 and 57, and the rest is as shown by the arrow 74. Then, the light passes through the inside of the printed board main body 41 to the ground pattern 52, and is radiated into a vacuum therefrom. Furthermore, as shown by an arrow 75, the electric current is conducted in the ground pattern 52, and finally, it is moved to a housing (not shown) of the electronic device, where it is radiated into a vacuum.

Consider the thermal resistance of the above path. First, let us consider a case where it is assumed that the applied adhesive portions 61 and 62 do not exist. The radiating lands 50 and 51 and the ground pattern 52 have a thickness t of 0.018 mm, which is much larger than that of the plating layer.
The thermal resistances R1 of the ground patterns 52 are small. Also, the width e of the insulating strips 56, 57
Is as small as 0.508 mm, the thermal resistance R3 of the printed board main body 41 at the insulating band portions 56 and 57 is also small. Therefore, the heat generated in the body 20 of the diode CR10 is efficiently conducted to the ground pattern 53. Therefore, even in the case of a configuration in which the coating adhesive portions 61 and 62 are not present, the heat generated in the diode CR10 is radiated more efficiently than in the related art.

Actually, most of the insulating strips 56 and 57 are covered with the coating adhesive portions 61 and 62, and the coating adhesive portions 61 and 62 between the heat radiation lands 50 and 51 and the ground pattern 52. The thermal resistance R4 of 62 is even smaller than the thermal resistance R3 of the printed board main body 41 described above. Therefore, the heat generated in the diode CR10 is surely and efficiently radiated as compared with the related art.

As shown by an arrow 80, the light is directly transmitted from the main body 20 to the transverse band portion 52 c of the ground pattern 52, and emitted from the main body 20 into a vacuum. Further, the light is further conducted in the ground pattern 52, and finally moves to a housing (not shown) of the electronic device, where it is radiated into a vacuum. As can be seen from the above, the diode CR10
The heat generated in the diode CR1 is conducted to the case (not shown) of the electronic device through the above-mentioned paths.
The heat generated at 0 is dissipated more efficiently than in the prior art.

[Second Embodiment] FIGS. 5A and 5B show a mounting structure of a diode according to a second embodiment of the present invention on a printed circuit board. The mounting structure of the diode on the printed board is a structure in which the surface on which the diode is mounted is opposite to the mounting structure of the diode on the printed board according to the first embodiment of the present invention. In the figure, portions corresponding to the components shown in FIG. 1 are denoted by the same reference numerals.

In the diode CR10, the leads 21 and 22 are inserted into the through holes 42 and 43 of the printed board 40 on the lower surface 41a of the printed board 40, and the radiating lands 50 and 51 on the upper face of the printed board 40 are soldered. Soldered and mounted. The heat generated in the diode CR10 is conducted and radiated through the above-described conduction path.

Third Embodiment FIGS. 6A and 6B show a mounting structure of a diode according to a third embodiment of the present invention on a printed circuit board. In the figure, portions corresponding to the components shown in FIG. 1 are denoted by the same reference numerals. The printed board 40A has a multi-layered structure, and radiates radiating lands 50 and 51 on the same layer as an inner layer.
And a ground pattern 52 are formed.

The diode CR10 has a substantially spherical main body 20.
L-shaped leads 21 and 22 protruding from both sides of the printed circuit board 40A are inserted into through holes 42 and 43 of the printed circuit board 40A, and solder terminals 60, 4
7 and soldered. Leads 21, 22
The heat radiation lands 50 and 51 are connected to each other so as to conduct heat.

The heat generated in the main body 20 of the diode CR10 is conducted along the leads 21 and 22, and then transferred to the radiating lands 50 and 51, where the lands 50 and 51 are radiated.
Inside, and then moves to the ground pattern 52 over the insulating strips 56 and 57 to form the ground pattern 5.
2, and finally move to a housing (not shown) of the electronic device, from which it is radiated into a vacuum.

Fourth Embodiment FIGS. 7A, 7B and 7
(C) shows a mounting structure of the diode according to the fourth embodiment of the present invention on a printed board. FIG. 7A is a plan view,
FIG. 7C is a bottom view. The printed board 40 </ b> B has a double-sided structure, and has an upper surface 41 a of the printed board main body 41.
Are formed with terminal portions 90 and 91 having the same size as the radiating lands 50 and 51 in FIG. Therefore, the terminal 9
The sizes of 0 and 91 are much larger than the size of a normal terminal portion (for example, the terminal portions 46 and 47 in FIG. 2). Terminal 9
The wiring patterns 44, 45 extend from 0, 91. Through holes 42 and 43 are formed at the centers of the terminal portions 90 and 91. A substantially solid ground pattern 92 is formed on the lower surface 41 b of the printed board main body 41. The ground pattern 92 has openings 92a and 92b slightly larger than the openings in the openings of the through holes 42 and 43 to the lower surface 41b of the printed board main body 41.

The diode CR10 is formed by connecting L-shaped leads 21 and 22 protruding from both sides of the main body 20 to the printed board 40.
B is inserted into the through holes 42 and 43 and soldered to the terminal portions 90 and 91 by solder 60 and mounted. The leads 21 and 22 and the ground pattern 92 are electrically insulated. Body 20 of diode CR10
As shown in FIG. 8, the heat generated in
Along, and then move to the terminal portions 90, 91,
Conducting radially in the terminal portions 90 and 91,
As shown by 00, within the area occupied by the terminal portions 90 and 91, conduction is performed in the thickness direction of the inside of the printed board main body 41, and then, it moves to the ground pattern 92, from which it is radiated into vacuum. Further, finally, the light is transferred to a housing (not shown) of the electronic device, and the light is radiated into the vacuum from here.

Fifth Embodiment FIGS. 9A, 9B,
(C) shows a mounting structure of the diode according to the fifth embodiment of the present invention on a printed circuit board. FIG. 9A is a plan view,
FIG. 9C is a cross-sectional view taken along line CC in FIG. 9B. The printed board 40C has a multilayer structure different from the printed board 40B. The ground pattern 92C is formed on the inner layer of the printed board 40C in a layer near the upper surface.

The diode CR10 is formed by connecting L-shaped leads 21 and 22 protruding from both sides of the main body 20 to the printed board 40.
C are inserted into the through holes 42 and 43 and soldered to the terminal portions 90 and 91 by solder 60 and mounted. The leads 21 and 22 and the ground pattern 92C are electrically insulated. Body 2 of diode CR10
The heat generated at zero conducts along leads 21 and 22,
Next, the operation moves to the terminal portions 90 and 91, and the terminal portions 90 and 91 are moved.
Inside, and as shown by the arrow 111, within the area occupied by the terminal portions 90, 91, the inside of the portion 110 between the terminal portions 90, 91 and the ground pattern 92C of the printed circuit board main body. Conducts through the thickness, then
Move to the ground pattern 92C and the ground pattern 92C.
Conducted in C and finally moved to the housing of the electronic device, from which it is radiated into a vacuum.

[Modification] Although the present invention is particularly effective when applied to an electronic component module incorporated in an electronic device mounted on a space satellite, it can be installed in a vacuum atmosphere even on the earth. It is also effective when applied to an electronic component module. The electronic components to be mounted are not limited to diodes, but may be applied to other electronic components as long as they generate heat during operation.

[0037]

As described above, according to the first aspect of the present invention, in the first aspect of the present invention, the printed board has, apart from the terminal portion, a heat radiation land to which the terminal of the electronic component is connected. And has a ground pattern surrounding the heat radiation land and electrically insulated from the heat radiation land, and the electronic component is mounted with its terminals connected to the heat radiation land. Yes, because the heat generated in the mounted electronic component is configured to be conducted to the ground pattern through the terminal and the radiating land and radiated,
When the electronic component is placed in a vacuum atmosphere with its respective terminals at a high potential and generated in the mounted electronic component without increasing the weight and generating gas when the device is installed in a vacuum atmosphere. Heat can be efficiently dissipated.

According to the second aspect of the present invention, since the adhesive portion having a higher thermal conductivity than the thermal conductivity of the main body of the printed circuit board is provided over the heat radiation land and the ground pattern,
The thermal resistance between the radiating land and the ground pattern is reduced. According to the invention of claim 3, the printed board has a large-sized terminal portion larger than a normal terminal portion, and has a substantially solid shape, and has a portion in the thickness direction of the printed board therebetween. The electronic component has a ground pattern formed so as not to be electrically connected to the terminal, and the electronic component connects the terminal to the large-sized terminal portion and does not connect to the ground pattern. In the configuration, the heat generated by the mounted electronic component is conducted to the ground pattern through the terminal, the large-sized terminal portion, and the portion in the thickness direction of the printed board, and is radiated. Since the heat generated by the mounted electronic components is conducted and radiated through the terminals, large-sized terminals, the portion in the thickness direction of the printed board, and the ground pattern, the electronic components are When the product is placed in a vacuum atmosphere with all its terminals at a high potential, the heat generated by the mounted electronic components without increasing the weight and without generating gas. Can be efficiently dissipated.

According to a fourth aspect of the present invention, there is provided a printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion. Separately, a structure having a heat radiation land to which the terminal of the electronic component is connected, and having a ground pattern surrounding the heat radiation land and electrically insulated from the heat radiation land Therefore, when the electronic component is mounted with its terminals all at a high potential and installed in a vacuum atmosphere, it is possible to achieve an improvement in heat dissipation.

According to a fifth aspect of the present invention, there is provided a printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion. It has a large large-sized terminal portion, and has a substantially solid shape, and is formed in a state in which the portion in the thickness direction of the printed board is not electrically connected to the terminal of the electronic component. When the electronic component is mounted with its terminals at a high potential, and installed in a vacuum atmosphere, the heat dissipation can be improved. Can be done.

[Brief description of the drawings]

FIG. 1 is a diagram showing a diode mounting structure according to a first embodiment of the present invention.

FIG. 2 is a view showing a printed board in FIG. 1;

FIG. 3 is a diagram showing a heat radiation state of heat generated in a diode.

FIG. 4 is a block diagram illustrating heat dissipation of heat generated in the diode.

FIG. 5 is a diagram showing a diode mounting structure according to a second embodiment of the present invention.

FIG. 6 is a diagram showing a diode mounting structure according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a diode mounting structure according to a fourth embodiment of the present invention.

FIG. 8 is a block diagram illustrating heat dissipation of heat generated in the diode.

FIG. 9 is a view showing a diode mounting structure according to a fifth embodiment of the present invention.

FIG. 10 is a circuit diagram of an electronic component module.

FIG. 11 is a diagram showing a conventional example.

[Explanation of symbols]

 40, 40A, 40B, 40C Printed board 42, 43 Through hole 44, 45 Wiring pattern 46, 47 Terminal part 50, 51 Heat radiating land 52, 92 Ground pattern 56, 57 Insulating strip part 61, 62 Coating adhesive part 90, 91 Large terminal

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshinori Usui 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Mitsugu Sato 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture No. 1 Inside Fujitsu Limited

Claims (5)

[Claims] A printed board has a wiring pattern and a terminal portion at an end of the wiring pattern, and an electronic component is mounted with the terminal connected to the terminal portion, and a terminal of the electronic component is connected to the printed circuit board. In the mounting structure of the electronic component having a configuration in which both of the terminal portions are at a high potential, the printed circuit board has, apart from the terminal portion, a heat-dissipating land to which the terminal of the electronic component is connected, And a ground pattern surrounding the heat radiation land and electrically insulated from the heat radiation land, wherein the electronic component is mounted with its terminals connected to the heat radiation land. Wherein the heat generated by the mounted electronic component is conducted to the ground pattern through the terminal and the radiating land to be dissipated to the printed circuit board. Mounting structure. 2. An adhesive portion having electrical insulation and a thermal conductivity higher than the thermal conductivity of the printed board main body is provided across the heat radiating land and the ground pattern. 2. The mounting structure according to claim 1, wherein said electronic component is mounted on a printed board. 3. The printed board has a wiring pattern and a terminal portion at an end of the wiring pattern, and an electronic component is mounted with the terminal connected to the terminal portion, and the terminal of the electronic component is connected to the printed circuit board. Wherein the printed circuit board has a large-sized terminal part larger than a normal terminal part, and has a substantially solid shape. And a ground pattern formed in a state where the printed circuit board is not electrically connected to a terminal of the electronic component with a portion in a thickness direction of the printed board therebetween, and the electronic component has a terminal having the large size. It is mounted so as to be connected to the terminal portion and not connected to the ground pattern, and the heat generated by the mounted electronic component is applied to the terminal, the large-sized terminal portion, and the portion in the thickness direction of the printed board. Through A structure for mounting an electronic component on a printed board, wherein the electronic component is configured to conduct heat to the ground pattern and dissipate heat. 4. A printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion, wherein the electronic component is provided separately from the terminal portion. Having a heat radiation land to which the terminal is connected, and surrounding the heat radiation land,
A printed circuit board having a ground pattern provided in an electrically insulated state from the heat radiation lands. 5. A printed circuit board having a wiring pattern and a terminal portion at an end of the wiring pattern, wherein the electronic component is mounted with the terminal connected to the terminal portion. Having, and
It has a substantially solid shape, and has a configuration having a ground pattern formed in a state where it is not electrically connected to the terminal of the electronic component, with a portion in the thickness direction of the printed board therebetween. Printed board featured.