JP6506101B2 - Vacuum chuck member and method of manufacturing vacuum chuck member - Google Patents

Description

  The present invention relates to a vacuum chuck member and a method of manufacturing the vacuum chuck member.

  Conventionally, as a jig for fixing a semiconductor wafer used in a semiconductor manufacturing apparatus or the like, there is a vacuum chuck member provided with a mounting portion for mounting the semiconductor wafer in a recess of a support made of a dense ceramic body (for example, Patent Document 1). For example, the mounting portion has a porous ceramic body as a main component, and can suck and fix the semiconductor wafer on the mounting portion by sucking the semiconductor wafer through the mounting portion. In such a vacuum chuck member, for example, a glass paste is applied to the concave portion of the support portion made of a dense ceramic body, and then the mounting portion made of a porous body prepared in advance is fitted into the concave portion to melt the glass paste A supporting portion made of a dense ceramic body and a mounting portion made of a porous body are formed by bonding using a glass layer which is cooled and solidified later as a bonding layer.

Unexamined-Japanese-Patent No. 2010-205789

  In such a conventional vacuum chuck member, since the glass paste is once melted, it is difficult to control the thickness distribution and the like of the melted glass paste with high accuracy. For example, in a semiconductor manufacturing apparatus, it is required to control the position of a semiconductor wafer with an accuracy of nanometer (nm) level, and the shape accuracy of a mounting portion on which the semiconductor wafer is mounted is also required to be high. In the case where there is a thickness distribution in the bonding layer made of solidified glass paste, or in the presence of local unevenness, the pressure applied to the mounting portion via this bonding layer causes a size distribution, or the local In some cases, a strong force may be applied. In this case, the distribution of the force applied to the mounting portion becomes large, or a large force is locally applied, and the distribution of the magnitude of deformation of the mounting portion becomes large, or the local deformation is largely generated. It may be difficult to control the shape accuracy. When it is difficult to control the shape of the mounting unit due to the distribution of the magnitude of deformation, it is possible to control the positional accuracy of the surface of the semiconductor wafer adsorbed to the mounting unit with high accuracy on the nanometer level, for example. There was a problem that it was difficult.

  In addition, for example, in a semiconductor manufacturing apparatus, it is necessary to control with high precision the temperature of the mounting portion and therefore the temperature and temperature distribution of the semiconductor wafer mounted on the mounting portion, but bonding which can not accurately grasp the thickness distribution etc. There is also a problem that it is difficult to control with high precision the temperature and temperature distribution of the mounting portion, that is, the semiconductor wafer mounted on the mounting portion because the layer is interposed between the support portion and the mounting portion.

  In addition, the vacuum chuck member often clogs the holes of the mounting portion made of a porous body by repeated use. However, in the conventional vacuum chuck member, the mounting portion is firmly bonded to the supporting portion by the bonding layer made of glass paste or the like, and it has been difficult to remove the mounting portion made of the porous body and wash it sufficiently. As a result, when the vacuum chuck member is continuously used, even if the suction force (wafer holding force) of the vacuum chuck member is gradually reduced due to clogging of the hole of the mounting portion, the suction force is reduced. There is a problem that it is necessary to continue to use a certain vacuum chuck member.

In order to solve the above-mentioned subject, in one embodiment of the present invention , there is provided a mounting portion made of a porous ceramic body having a planar mounting surface, and the outer peripheral surface surrounding the outer peripheral surface of the mounting portion. An outer wall portion having an inner peripheral surface opposite to the outer surface portion, and a support portion made of a dense ceramic body having a base surface in contact with the surface opposite to the mounting surface of the mounting portion; It is a vacuum chuck member for vacuum-sucking a placed object through the placement portion, wherein the inner circumferential surface is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface. A first area, and a second area spaced apart from the outer peripheral surface and disposed continuously along the circumferential direction of the inner peripheral surface on a side closer to the base surface than the first area; Do Ri, the outer peripheral surface, the portion facing the second region, inclination connected to a surface of the opposite side Comprising a part, the inclined surface portion to provide a vacuum chuck member, characterized in that is inclined so as to approach the center axis of the placement section closer to the surface of the opposite side.
Further, according to another embodiment of the present invention, there is provided a mounting portion made of a porous ceramic body having a planar mounting surface, and an inner peripheral surface surrounding the outer peripheral surface of the mounting portion and facing the outer peripheral surface. And a support made of a dense ceramic body having a base surface that abuts against the mounting surface and the opposite surface of the mounting unit, and the object placed on the mounting surface is A vacuum chuck member for vacuum suction through the placement portion, wherein the inner circumferential surface is a first region which continuously contacts the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface; And a second region spaced apart from the outer circumferential surface and disposed continuously along the circumferential direction of the inner circumferential surface on the side closer to the base surface than the first region, and In the portion, the density in the vicinity of the outer peripheral surface in contact with the support portion is in the vicinity of the center of gravity of the mounting surface Vacuum chuck member being greater than the density
I will provide a.

  Further, a mounting portion made of a porous ceramic body having a planar mounting surface, an outer wall portion surrounding an outer peripheral surface of the mounting portion and having an inner peripheral surface facing the outer peripheral surface, and And a support made of a dense ceramic body having a base surface in contact with the mounting surface and the opposite side of the mounting portion, and a target object placed on the mounting surface is vacuum suctioned through the mounting portion Vacuum chuck member, wherein the inner peripheral surface is a first area which is in direct contact with the outer peripheral surface continuously along the circumferential direction of the inner peripheral surface, and the base surface rather than the first area A method of manufacturing a vacuum chuck member, comprising: a second region disposed on the side closer to and facing the outer peripheral surface away from the outer peripheral surface, wherein at least one of the inner peripheral surface or the outer peripheral surface Forming a concave portion on the side close to the base surface; Heating the portion to thermally expand the support portion at a temperature lower than the temperature of the support portion in a region surrounded by the inner peripheral surface and the base surface of the support portion in the thermally expanded state; The step of disposing and lowering the temperature of the support portion to equalize the temperature of the support portion and the placement portion alleviates the expansion of the support portion, and the inside of the portion corresponding to the concave portion Obtaining a vacuum chuck member in which the inner peripheral surface and the outer peripheral surface are in direct contact with each other at a portion other than the portion corresponding to the concave portion while the peripheral surface and the outer peripheral surface are separated. The present invention also provides a method of manufacturing a vacuum chuck member.

  According to the vacuum chuck member of the present invention, it is possible to suppress the deformation of the mounting surface of the mounting unit, and to control the positional accuracy of the surface of the semiconductor wafer adsorbed by the mounting unit with relatively high accuracy. Further, according to the method for manufacturing a vacuum chuck member of the present invention, the mounting portion can be removed relatively easily from the vacuum chuck member and cleaned, and the decrease in the adsorption force due to clogging of the holes in the mounting portion is suppressed. can do.

It is a perspective view showing a vacuum chuck member concerning a 1st embodiment of the present invention. (A) is a top view which shows the vacuum chuck member of FIG. 1, (b) is sectional drawing in the AA of (a). It is an enlarged view of the B section of FIG.2 (b). It is sectional drawing which shows the state which adsorb | sucked the target object to the vacuum chuck member of FIG. (A) And (b) is a schematic sectional drawing explaining the other embodiment of the vacuum chuck member of this invention. (A)-(d) is the figure which showed typically the manufacturing method of the member for vacuum chucks of FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic perspective view of a vacuum chuck member 1 which is one embodiment of a vacuum chuck member of the present invention, FIG. 2 (a) is a top view, and FIG. 2 (b) is an AA of FIG. FIG. 3 is a cross-sectional view taken along a line, and FIG. 3 is an enlarged view of a portion B of FIG. Further, FIG. 4 is a cross-sectional view showing a state in which the object W is adsorbed to the vacuum chuck member of FIG. The vacuum chuck member 1 faces the outer peripheral surface 2 a which surrounds the outer peripheral surface 2 a of the porous ceramic body 2 (hereinafter also referred to as the mounting unit 2) having the planar mounting surface 2 α and the outer peripheral surface 2 a of the mounting unit 2. A dense ceramic body 4 (hereinafter referred to as a support portion) having an outer wall portion 41 having an inner circumferential surface 4a and a base surface 4α in contact with a surface 2β (also referred to as a lower surface 2β) opposite to the mounting surface 2α of the mounting portion 2 4) and.

  The support portion 4 is a substantially disc-like frame which has a circular recess at the center and, for example, the outer diameter of the outer wall portion 41 is 85 to 100 mm and the thickness is 20 to 60 mm. The placement unit 2 is, for example, a discoid body having a diameter of 70 to 90 mm and a thickness of 10 to 20 mm.

The supporting portion 4 is made of alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), silicon carbonitride (SiC _x N _y (where x and y are 0 <x <1, 0, respectively). In the range of <y <4/3, 4x + 3y = 4))), silicon oxide (SiO ₂ ), sialon (Si ₆ -Z Al _Z O _Z N _8-Z (z is 0.1 ≦ It is a numerical value which satisfy | fills z <= 1.)) etc. It consists of a dense ceramic body. These compositions may be in a fixed ratio or an unfixed ratio. The porosity of the support portion 4 is preferably 5% by volume or less, and particularly preferably 0.1% by volume or less.

  The support portion 4 is provided with a plurality of suction holes 6. The opening of the suction hole 6 is provided in the base surface 4α. When air is sucked from the suction holes 6, the air inside the placement unit 2 is sucked, and the object W placed on the placement surface 2α of the placement unit 2 is adsorbed on the placement surface 2α. The supporting member 4 is also provided with a flow path 9 through which a cooling fluid such as liquid or gas such as pure water flows. The flow path 9 controls the temperature of the vacuum chuck member 1 and thus the temperature of the object W placed on the mounting surface 2α. The flow path 9 is connected to fluid supply means (not shown) and fluid recovery means (not shown). The vacuum chuck member 1 preferably includes the flow path 9 in order to increase the degree of freedom and accuracy of the temperature control of the target body W, but the flow path 9 is not necessarily required.

  In addition, below the support part 4, the fixed base (not shown) for supporting and fixing the vacuum chuck member 1 is provided. The support portion 4 and the fixed base (not shown) are connected and fixed, for example, via bolts or the like inserted into the mounting holes 7 installed at equal intervals along the circumferential direction.

  The placement unit 2 is made of a porous ceramic body whose main component is a component of the support unit 4 and includes a plurality of communication holes (not shown). These compositions may be in a fixed ratio or an unfixed ratio. It is preferable that the porosity of the mounting part 2 exists in the range of 25-50 volume%. When the porosity is in this range, mechanical strength and thermal conductivity can be maintained, and an increase in pressure loss can be suppressed. The porosity of each of the support portion 4 and the mounting portion 2 can be determined in accordance with the Archimedes method.

  Moreover, it is preferable that the average pore diameter of the mounting part 2 exists in the range of 20-100 micrometers. When the average pore diameter is in this range, low pressure loss can be maintained, and the surface flatness of the object W can be reduced. The average pore diameter of the mounting portion 2 can be determined by the mercury intrusion method according to JIS R 1655-2003.

  In the vacuum chuck member 1, as described later, for example, in a state where the mounting portion 2 receives a force such that the outer peripheral surface 2a of the mounting portion 2 is pressed by the first region 41a of the inner peripheral surface 4a It is fixed (supported) to 4.

The vacuum chuck member 1 is a member for vacuum-sucking the object W placed on the placement surface 2α of the placement portion 2 through the placement portion 2 as shown in FIG. The inner circumferential surface 4a of the body 4 is continuous with the first region 41a which is in direct contact with the outer circumferential surface 2a continuously along the circumferential direction of the inner circumferential surface 4a, and the inner circumferential surface closer to the base surface 4α than the first region 41a. Continuously along the circumferential direction of the surface 2a (
and a second region 42a which is disposed apart from the outer peripheral surface 2a of the mounting portion 2 and disposed along the first region 41a.

  In the vacuum chuck member 1, the first region 41a is continuously in direct contact with the outer peripheral surface 2a along the circumferential direction of the inner peripheral surface 4a, and, for example, glass paste or the like is interposed between the first region 41a and the outer peripheral surface 2a. There is no bonding member. That is, there is no variation in the thickness of the bonding layer which causes the distribution of the magnitude of the pressure applied to the placement unit 2. For this reason, deformation or the like of the mounting portion 2 due to uncontrollable pressure distribution or local pressure is suppressed.

  Furthermore, the vacuum chuck member 1 is provided with a second region 42a disposed on the side closer to the base surface 4α than the first region 41a and facing the outer circumferential surface 2a apart from the outer circumferential surface 2a. In the portion corresponding to the second area 42a, no pressure is applied to the placement unit 2 from the second area 42a. The second region 42a may be formed by providing a concave portion on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a and the outer peripheral surface 2a. The concave portion may be a concave portion having a step partially provided on the inner peripheral surface 4a or the outer peripheral surface 2a as shown in the drawing, or the base surface 4α of the inner peripheral surface 4a or the outer peripheral surface 2a. It may be a chamfer provided on the side. The chamfered portion may be a so-called straight C surface or a curved surface (R surface). The shape of the concave portion is not particularly limited. In the vacuum chuck member 2, the inner circumferential surface 4 a has a recess, and the outer circumferential surface 2 a also has a chamfer (inclined surface 22 a).

  As in the case of the vacuum chuck member 1, when the inner peripheral surface 2 a of the support portion 4 has a recess and this recess corresponds to the second region 42 a, the mounting portion 2 is formed on the portion corresponding to the second region 42 a It is possible to put out part of the For example, when the placement unit 2 receives a strong pressure from the first area 41a of the inner circumferential surface 4a, the placement unit 2 tends to be deformed according to this pressure, but in the vacuum chuck member 1, the second area 42a It is easy to deform so that the corresponding part may partially protrude. That is, in the vacuum chuck member 1, even in the state where a strong pressure is applied from the first area 41 a to the placement unit 2, this pressure is easily released by the deformation of the area corresponding to the second region 42 a of the placement unit 2. Excessive deformation of portions other than the portion corresponding to the two regions 42a is suppressed. In particular, by suppressing the deformation of the placement surface 2α of the placement unit 2, the flatness of the placement surface 2α of the placement unit 2 is well maintained, and the surface of the object W adsorbed to the placement unit 2 The position accuracy can be controlled with high accuracy. In the vacuum chuck member 1, the distance L between the second region 42 a and the outer peripheral surface 2 a is, for example, 0.08 mm or more and 0.32 mm or less.

  Further, in the vacuum chuck member 1, the first region 41a is in direct contact with the peripheral edge line 21a of the mounting surface 2α continuously along the circumferential direction of the inner peripheral surface 4a. That is, the peripheral line 21a of the mounting surface 2α is in contact with the inner peripheral surface 4a, and the mounting surface 2α and the inner peripheral surface 4a are in contact without any gap (gap). With such a configuration, it is difficult for particles or the like to intrude between the peripheral region 21a of the mounting surface 2α and the first region 41a, and a local convex portion or a convex portion that is generated when a part of the intruded particle protrudes. Since local stress concentration on the placement unit 2 generated by concentration of pressure from the support unit 4 on the intruded particle portion is suppressed, the object W is accurately adsorbed on the placement surface 2a Can.

  In the thickness direction from base surface 4α to mounting surface 2α, vacuum chuck member 1 extends along the thickness direction of first region 41a as compared to the length along the thickness direction of second region 42a. The length is larger. With such a configuration, the pressing force by the inner peripheral surface 4 a against the outer peripheral surface 2 a of the mounting portion 2 is relatively strong. Therefore, even if bonding is not performed via a bonding layer such as an adhesive, the placement unit 2 can be supported relatively firmly by the support unit 4.

Further, in the vacuum chuck member 1, the outer peripheral surface 2a of the mounting portion 2 of the vacuum chuck member 1 is provided with the inclined surface 22a connected to the lower surface 2β at a portion facing the second region 42a. As it approaches, it inclines so that central axis CL of mounting part 2 may be approached. In other words, the outer edge portion (the corner portion between the base surface and the outer peripheral surface) of the base surface of the mounting portion 2 has a chamfered portion. The chamfered portion may be a so-called C-surface which is linear in a cross-sectional view perpendicular to the base surface, or may be a curved surface (R-surface) in the same cross-sectional view. The central axis CL of the mounting unit 2 is a virtual straight line passing through the center of gravity of the mounting surface 2α and perpendicular to the mounting surface 2α.

  In the case of the vacuum chuck member 1 of the embodiment shown in FIG. 3, the inclined surface 22a and the support 4 (more specifically, the second region 42a of the inner peripheral surface 4a is separated and the region corresponding to the corner of the mounting portion 2 A space can be formed in a region near the portion where the circumferential surface 4a and the base surface 4α are connected. For example, in the embodiment shown in FIG. 5 (b), the region corresponding to the corner of the mounting portion 2 is A corner having a ridge line in which a plane parallel to the first region 41a of the inner circumferential surface 4a and a plane parallel to the base surface 4α are connected, stress and the like are easily concentrated in the corner having the ridge line, In the vacuum chuck member 1 shown in Fig. 3, a space is set in a region corresponding to the corner of the mounting portion 2 (a region in the vicinity of a portion where the inner peripheral surface 4a and the base surface 4α are connected). Because the pressure is formed locally, it is difficult for the pressure to be concentrated locally, and the breakage of the mounting portion 2 and the support portion 4 is suppressed. . Thus, in the vacuum chuck member 1, and good keeping the flatness of the mounting surface 2.alpha, the positional accuracy of the surface of the object W adsorbed on the placing portion can be controlled with high precision.

  Further, in the vacuum chuck member 1, the second region 42 a of the inner circumferential surface 4 a includes the curved surface portion 42 b connected to the base surface 4 α, and the curved surface portion 42 b approaches the central axis of the mounting portion 2 as it approaches the base surface 4. It is crooked. In other words, the corner of the connection portion between the inner peripheral surface 4a and the base surface 4α is a concave surface. As described above, since the connection portion between the inner circumferential surface 4a and the base surface 4α is curved, concentration of stress in the support portion 4 is also suppressed, and breakage of the support portion 4 is also suppressed. Here, the radius of curvature of the curved surface portion 42b is, for example, 1.5 mm or more and 2.5 mm or less.

  Further, the density of the mounting portion 2 in the vicinity of the outer peripheral surface 2 a in contact with the support portion 4 is larger than the density of the gravity center position vicinity G of the mounting surface 2α. This occurs, for example, when the outer peripheral surface 2a of the mounting portion 2 is pressed by the inner peripheral surface 4a and the distance between the ceramic particles in the vicinity of the outer peripheral surface 2a of the mounting portion 2 approaches. When the density in the vicinity of the outer peripheral surface 2a is larger than the density in the vicinity of the gravity center position of the mounting surface 2α (the portion through which the central axis CL passes), the mechanical strength in the vicinity of the outer peripheral surface 2a to which an impact or the like is easily applied becomes stronger The particles are prevented from falling out of the vicinity of the outer peripheral surface 2a.

  5 (a) and 5 (b) are enlarged sectional views of another embodiment of the vacuum chuck member of the present invention. In the present invention, as shown in FIG. 5 (a), the inner peripheral surface 4a of the support 4 is not provided with a concave portion, and only the outer edge of the base surface of the mounting unit 2 is chamfered (FIG. 5 (a) An inclined surface portion 22a may be provided, and a region opposed to the chamfered portion of the inner peripheral surface 4 may be a second region separated from the outer peripheral surface 2a. Also, conversely, without providing a chamfered portion in the mounting portion 2, a recessed portion may be provided only in the inner peripheral surface 4a of the support portion 4, and a portion corresponding to this recessed portion may be used as a second region.

  In the vacuum chuck member 1 of the present embodiment, the accuracy of the surface position of the target object W placed on the placement surface 2α can be controlled with high accuracy. Further, since there is no bonding layer such as glass paste or the thickness distribution of the bonding layer, the temperature distribution of the object W placed on the mounting surface 2α can be controlled with high accuracy.

  Next, an embodiment of a method of manufacturing a vacuum chuck member of the present invention will be described by taking a method of manufacturing a vacuum chuck member 1 as an example.

In the method of manufacturing the vacuum chuck member of the present embodiment, the step of forming a concave portion on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a or the outer peripheral surface 2a; And disposing the mounting portion 2 at a temperature lower than that of the supporting portion 4 in a region surrounded by the inner peripheral surface 4a and the base surface 4a of the supporting portion 4 in a thermally expanded state; The temperature of the support 4 is lowered to equalize the temperatures of the support 4 and the placement unit 2 to alleviate the expansion of the support 4, and the inner circumferential surface at a portion corresponding to at least one of the recessed portion or the chamfered portion. Obtaining a vacuum chuck member in which the inner peripheral surface 4a and the outer peripheral surface 2a are in direct contact with each other at portions other than the corresponding portions while the outer peripheral surface 2a is separated from 4a.

  6 (a) to 6 (d) are schematic cross-sectional views for explaining an embodiment of a method of manufacturing a vacuum chuck member of the present invention. First, as shown in FIG. 6A, the dense ceramic body 4 (supporting portion 4) and the porous ceramic body 2 (mounting portion 2) are prepared. At this time, the concave portion is formed on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a and the outer peripheral surface 2a. In the present embodiment, the concave portion is formed on the side closer to the base surface 4α of the inner peripheral surface 4a of the support portion 4, and the chamfered portion is formed on the outer edge portion of the base surface 4α of the outer peripheral surface 2a. There are no particular limitations on the method of forming these recesses and chamfers, and for example, they may be formed by pressure forming of a formed body, or may be formed by grinding a formed body, or may be ground to a sintered body after firing. You may form by giving etc. Suction holes 6 are provided in advance in the support portion 4. The opening of the suction hole 6 is provided in the base surface 4α. In addition, the code | symbol of the suction hole 6 is abbreviate | omitted in the figure after FIG.6 (b). At this time, the suction holes 6 are filled with an organic substance that evaporates when the temperature becomes high. The organic matter evaporates during heat treatment to be described later, and as a result, the suction holes 6 become hollow.

  Next, as shown in FIG. 6 (b), the support 4 is introduced into a heating furnace or the like to raise the temperature of the support 4 and thermally expand the support 4. For example, the support part 4 is heated and heated up to about 100 degreeC-200 degreeC. The heating causes the support 4 to thermally expand, and the diameter of the inner circumferential surface 4 a becomes larger than that before heating.

  Next, as shown in FIG. 6C, the thermally expanded support portion 4 is taken out of the heating furnace, and the temperature is lower than that of the support portion 4 in a region surrounded by the inner peripheral surface 4a and the base surface 4α. The placement unit 2 of the The diameter of the outer diameter 2a of the mounting portion 2 is set to be smaller than the diameter of the inner peripheral surface 4a of the support 4 when the support 4 is thermally expanded.

  Next, the temperature of the support portion 4 is lowered to make the temperatures of the support portion 4 and the placement portion 2 uniform, thereby alleviating the expansion of the support portion 4. The temperature lowering process may be performed, for example, only at room temperature, without using a cooling device or the like. As a result, as shown in FIG. 6 (d), the diameter of the inner peripheral surface 4a becomes smaller than before the temperature decrease, the inner peripheral surface 4a and the outer peripheral surface 2a abut, and the outer peripheral surface 2a causes the inner peripheral surface 4a. As a result, pressure is applied from the outer peripheral surface 2a to the inner peripheral surface 4a so as to be tightened physically and firmly. Thus, when pressure is applied from the outer peripheral surface 2a to the inner peripheral surface 4a, the mounting portion 2 tends to be deformed by the pressure, but in the vacuum chuck member 1, a portion corresponding to the second region 42a partially protrudes By deforming as described above, this pressure is easily released, so that excessive deformation of parts other than the part corresponding to the second area 42a is suppressed.

  Thereafter, polishing is performed so that the mounting surface 2α has a predetermined flatness. The grindstone used at the time of grinding | polishing is a diamond grindstone, for example, and the count number of the particle size of a diamond is # 230 (grain size 68 micrometers), for example. The polishing margin is about 0.5 to 2 mm. By polishing, as shown in FIG. 5E, the upper surface of the support 4 and the mounting surface 2α of the mounting unit 2 become flush. The vacuum chuck member 1 can be manufactured through such a process.

In the vacuum chuck member manufactured by the manufacturing method of each embodiment described above, for example, since the support portion 4 and the placement portion 2 are joined without using a bonding layer such as glass paste, the support portion 4 is concentrated, for example. The mounting portion 2 can be removed relatively easily from the supporting portion 4 by heating to raise the temperature of the supporting portion 4 compared to the mounting portion 2 and selectively enlarging the diameter of the inner peripheral surface 4a. it can. Since the vacuum chuck member 1 manufactured by such a manufacturing method can remove and wash only the porous ceramic body 2 (mounting portion 2) having the mounting surface 2α, high adsorption for a relatively long period of time The vacuum chuck member 1 can be used continuously while maintaining the force.

  Further, in the vacuum chuck member 1, when the mounting unit 2 is attached to the support unit 4 by heating and lowering the temperature after cleaning the mounting unit 2, residual particles after the cleaning and particles that are disintegrated are the second region. By being arranged at 42a, it is suppressed that an excess pressure is locally applied to the mounting part 2 by the residual particle, the particle which shattered, etc.

  Although the embodiments and examples of the present invention have been described above, the present invention is not limited to the embodiments and examples described above. The present invention may, of course, be subjected to various improvements and modifications without departing from the scope of the present invention.

1 vacuum chuck member 2 porous ceramic body (mounting portion)
2α mounting surface 2β opposite surface (bottom surface)
2a Outer peripheral surface 4 Dense ceramic body (support portion)
4a inner circumferential surface 4α base surface 41 outer wall 22 inclined surface 41a first region 42a second region 42b curved surface

Claims (6)

A mounting portion made of a porous ceramic body having a planar mounting surface;
A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
The inner circumferential surface is a first region that is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and a side closer to the base surface than the first region, of the inner circumferential surface disposed in succession along the circumferential direction, Ri na and a second region that is remote from said outer peripheral surface,
The outer peripheral surface includes an inclined surface portion connected to the opposite surface at a portion facing the second region,
The vacuum chuck member characterized in that the inclined surface portion is inclined so as to approach the central axis of the placing portion as approaching the opposite surface .   A mounting portion made of a porous ceramic body having a planar mounting surface;
A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
The inner circumferential surface is a first region that is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and a side closer to the base surface than the first region, of the inner circumferential surface And a second region spaced apart from the outer circumferential surface, the second region being continuously disposed along the circumferential direction,
A vacuum chucking member characterized in that the placing portion has a density in the vicinity of the outer peripheral surface in contact with the support portion is larger than a density in the vicinity of the center of gravity of the placing surface. The vacuum chuck member according to claim 1 or 2 , wherein the first region is in direct contact with the peripheral edge of the mounting surface continuously along the circumferential direction of the inner peripheral surface. Than the length along the thickness direction of the second region, to one of the claims 1-3, characterized in that the direction of length along said thickness direction of said first region is larger Vacuum chuck member as described. The second region of the inner circumferential surface comprises a curved surface portion connected to the base surface,
The vacuum chuck member according to any one of claims 1 to 4 , wherein the curved surface portion is bent so as to approach the central axis of the placing portion as approaching the base surface. A mounting portion made of a porous ceramic body having a planar mounting surface;
A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
The inner circumferential surface is a first region which is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and the outer periphery which is disposed closer to the base surface than the first region. A method of manufacturing a vacuum chuck member, comprising: a second region facing the outer peripheral surface away from a surface;
Forming a concave portion on the side closer to the base surface of at least one of the inner peripheral surface and the outer peripheral surface;
Heating and thermally expanding the support portion;
Placing the placement portion at a temperature lower than that of the support portion in a region surrounded by the inner peripheral surface and the base surface of the support portion in a thermally expanded state;
The temperature of the support portion is lowered to equalize the temperature of the support portion and the placement portion, thereby alleviating the expansion of the support portion, and the inner peripheral surface and the outer periphery at a portion corresponding to the concave portion. Obtaining a vacuum chuck member in which the inner peripheral surface and the outer peripheral surface are in direct contact with each other at a portion other than the portion corresponding to the concave portion while being separated from the surface; Production method.

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