JP6497724B1 - 高周波電源システムに設けられるインピーダンス整合装置 - Google Patents
高周波電源システムに設けられるインピーダンス整合装置 Download PDFInfo
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- JP6497724B1 JP6497724B1 JP2018177136A JP2018177136A JP6497724B1 JP 6497724 B1 JP6497724 B1 JP 6497724B1 JP 2018177136 A JP2018177136 A JP 2018177136A JP 2018177136 A JP2018177136 A JP 2018177136A JP 6497724 B1 JP6497724 B1 JP 6497724B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/28—Impedance matching networks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/30—Time-delay networks
- H03H7/34—Time-delay networks with lumped and distributed reactance
- H03H7/345—Adjustable networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
- H03H7/40—Automatic matching of load impedance to source impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/327—Arrangements for generating the plasma
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
図1に、本発明の第1実施例に係るインピーダンス整合装置12を含む高周波電源システム10を示す。高周波電源システム10は、負荷20に必要な電力を供給するためのものであり、同図に示すように、高周波電源11および整合器16をさらに含んでいる。
本発明の第2実施例に係るインピーダンス整合装置12は、第1実施例と同様、整合状態値取得部13と、制御部14と、設定記憶部15とを備えている。ただし、本実施例における制御部14は、第1実施例における制御部とは異なった動作をする。以下、図9および図10を参照しながら、第2実施例における制御部14の動作例について説明する。
なお、本発明に係るインピーダンス整合装置には、以下に例示する変形例がある。
11 高周波電源
12 インピーダンス整合装置
13 整合状態値取得部
14 制御部
15 設定記憶部
16 整合器
20 負荷
Claims (6)
- 機械的に定数が変更される整合器を介して高周波電源の出力を負荷に供給するよう構成された高周波電源システムに設けられるインピーダンス整合装置であって、
前記高周波電源と前記負荷との間における整合状態を示す整合状態値を取得する整合状態値取得部と、
前記整合状態値に基づいて前記高周波電源の発振周波数を制御する制御部と、
を備え、
前記制御部は、前記整合状態値の変化量が予め定められた閾値を上回ると、前記整合状態が悪化したと判定し、前記整合状態が改善する方向に第1の傾きで前記発振周波数を変化させていき、その後、前記第1の傾きよりも緩やかな第2の傾きで前記発振周波数を元に戻していく
ことを特徴とするインピーダンス整合装置。 - 前記制御部は、予め定められた不整合抑制期間の間、前記第1の傾きで前記発振周波数を変化させていく
ことを特徴とする請求項1に記載のインピーダンス整合装置。 - 前記制御部は、前記不整合抑制期間が終了すると、前記整合状態値が示す前記整合状態の如何にかかわらず、前記第2の傾きで前記発振周波数を元に戻し始める
ことを特徴とする請求項2に記載のインピーダンス整合装置。 - 前記制御部は、前記整合状態が予め定められた程度にまで改善したことを前記整合状態値が示すまでの間、前記第1の傾きで前記発振周波数を変化させていく
ことを特徴とする請求項1に記載のインピーダンス整合装置。 - 前記整合状態値は、反射波の大きさに関する値である
ことを特徴とする請求項1〜4のいずれか一項に記載のインピーダンス整合装置。 - 前記負荷は、プラズマ処理装置である
ことを特徴とする請求項1〜5のいずれか一項に記載のインピーダンス整合装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2018177136A JP6497724B1 (ja) | 2018-09-21 | 2018-09-21 | 高周波電源システムに設けられるインピーダンス整合装置 |
CN201811653642.6A CN110942970B (zh) | 2018-09-21 | 2018-12-29 | 设置于高频电源系统中的阻抗匹配装置 |
KR1020190003320A KR102186935B1 (ko) | 2018-09-21 | 2019-01-10 | 고주파 전원 시스템에 설치되는 임피던스 정합장치 |
TW108101579A TWI705735B (zh) | 2018-09-21 | 2019-01-16 | 設於高頻電源系統之阻抗匹配裝置 |
US16/564,234 US11651938B2 (en) | 2018-09-21 | 2019-09-09 | Impedance matching device provided in high-frequency power system |
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JP2018177136A JP6497724B1 (ja) | 2018-09-21 | 2018-09-21 | 高周波電源システムに設けられるインピーダンス整合装置 |
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JP6497724B1 true JP6497724B1 (ja) | 2019-04-10 |
JP2020048157A JP2020048157A (ja) | 2020-03-26 |
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US (1) | US11651938B2 (ja) |
JP (1) | JP6497724B1 (ja) |
KR (1) | KR102186935B1 (ja) |
CN (1) | CN110942970B (ja) |
TW (1) | TWI705735B (ja) |
Cited By (1)
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KR20220128930A (ko) | 2021-03-15 | 2022-09-22 | 가부시키가이샤 아도테쿠 프라즈마 테쿠노로지 | 출력하는 고주파 전력의 경시 변화 패턴을 임의로 설정 가능한 고주파 전원 |
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CN111771269A (zh) * | 2018-02-23 | 2020-10-13 | 朗姆研究公司 | 不断开高功率电路的电容测量 |
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US6309514B1 (en) * | 1994-11-07 | 2001-10-30 | Ti Properties, Inc. | Process for breaking chemical bonds |
US6020794A (en) * | 1998-02-09 | 2000-02-01 | Eni Technologies, Inc. | Ratiometric autotuning algorithm for RF plasma generator |
JP4799947B2 (ja) * | 2005-02-25 | 2011-10-26 | 株式会社ダイヘン | 高周波電源装置および高周波電源の制御方法 |
US8203859B2 (en) * | 2006-12-29 | 2012-06-19 | Daihen Corporation | High frequency device with variable frequency and variable load impedance matching |
DE102011076404B4 (de) * | 2011-05-24 | 2014-06-26 | TRUMPF Hüttinger GmbH + Co. KG | Verfahren zur Impedanzanpassung der Ausgangsimpedanz einer Hochfrequenzleistungsversorgungsanordnung an die Impedanz einer Plasmalast und Hochfrequenzleistungsversorgungsanordnung |
US8576013B2 (en) * | 2011-12-29 | 2013-11-05 | Mks Instruments, Inc. | Power distortion-based servo control systems for frequency tuning RF power sources |
WO2013132591A1 (ja) * | 2012-03-06 | 2013-09-12 | 株式会社日立国際電気 | 高周波電源装置およびその整合方法 |
US10296676B2 (en) * | 2013-05-09 | 2019-05-21 | Lam Research Corporation | Systems and methods for tuning an impedance matching network in a step-wise fashion |
US20140367043A1 (en) * | 2013-06-17 | 2014-12-18 | Applied Materials, Inc. | Method for fast and repeatable plasma ignition and tuning in plasma chambers |
KR101544975B1 (ko) * | 2013-09-30 | 2015-08-18 | 주식회사 플라즈마트 | 임피던스 매칭 방법 및 임피던스 매칭 시스템 |
CN103632927B (zh) * | 2013-12-19 | 2016-03-16 | 中微半导体设备(上海)有限公司 | 等离子体刻蚀系统的阻抗匹配方法 |
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- 2018-12-29 CN CN201811653642.6A patent/CN110942970B/zh active Active
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- 2019-01-10 KR KR1020190003320A patent/KR102186935B1/ko active IP Right Grant
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KR20220128930A (ko) | 2021-03-15 | 2022-09-22 | 가부시키가이샤 아도테쿠 프라즈마 테쿠노로지 | 출력하는 고주파 전력의 경시 변화 패턴을 임의로 설정 가능한 고주파 전원 |
US11875968B2 (en) | 2021-03-15 | 2024-01-16 | Adtec Plasma Technology Co., Ltd. | High frequency power source allowing arbitrary setting of temporal change pattern for high frequency output power |
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US11651938B2 (en) | 2023-05-16 |
JP2020048157A (ja) | 2020-03-26 |
CN110942970A (zh) | 2020-03-31 |
KR102186935B1 (ko) | 2020-12-04 |
CN110942970B (zh) | 2022-03-25 |
US20200098546A1 (en) | 2020-03-26 |
TW202014057A (zh) | 2020-04-01 |
KR20200034554A (ko) | 2020-03-31 |
TWI705735B (zh) | 2020-09-21 |
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