JP6489541B2 - チップ電子部品及びその製造方法 - Google Patents
チップ電子部品及びその製造方法 Download PDFInfo
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- JP6489541B2 JP6489541B2 JP2014104028A JP2014104028A JP6489541B2 JP 6489541 B2 JP6489541 B2 JP 6489541B2 JP 2014104028 A JP2014104028 A JP 2014104028A JP 2014104028 A JP2014104028 A JP 2014104028A JP 6489541 B2 JP6489541 B2 JP 6489541B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000696 magnetic material Substances 0.000 claims description 42
- 229920000642 polymer Polymers 0.000 claims description 39
- 229920001577 copolymer Polymers 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 18
- 238000011049 filling Methods 0.000 claims description 16
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 6
- 239000006247 magnetic powder Substances 0.000 description 31
- 150000001735 carboxylic acids Chemical class 0.000 description 25
- 239000002270 dispersing agent Substances 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 239000002002 slurry Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000004062 sedimentation Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- UUIPAJHTKDSSOK-UHFFFAOYSA-N (2-nonylphenyl) dihydrogen phosphate Chemical class CCCCCCCCCC1=CC=CC=C1OP(O)(O)=O UUIPAJHTKDSSOK-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/42—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of organic or organo-metallic materials, e.g. graphene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/18—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Soft Magnetic Materials (AREA)
Description
以下では、本発明の一実施形態によるチップ電子部品を、特に、薄膜型インダクタで説明するが、これに限定されない。
図5は、本発明の一実施形態によるチップ電子部品の製造方法を示す工程図である。
20 絶縁基板
30 絶縁膜
40 内部コイルパターン
45 ビア電極
50 磁性体本体
55 コア部
80 外部電極
Claims (16)
- 絶縁基板の少なくとも一面に形成された内部コイルパターンを含む磁性体本体と、
前記磁性体本体の少なくとも一端面に形成され、前記内部コイルパターンの端部と接続するように形成された外部電極と、を含み、
前記磁性体本体は、不飽和カルボン酸系重合体及びシロキサン系共重合体を含むチップ電子部品。 - 前記磁性体本体は金属系軟磁性材料を含む、請求項1に記載のチップ電子部品。
- 前記金属系軟磁性材料の粒子径は0.1μm〜30μmである、請求項2に記載のチップ電子部品。
- 前記不飽和カルボン酸系重合体は重量平均分子量が500〜2,300である、請求項1に記載のチップ電子部品。
- 前記シロキサン系共重合体は重量平均分子量が500〜2,300である、請求項1に記載のチップ電子部品。
- 前記不飽和カルボン酸系重合体は前記磁性体本体に含まれる金属系軟磁性材料100重量部に対して0.5重量部〜2重量部の含量で含まれる、請求項1に記載のチップ電子部品。
- 前記シロキサン系共重合体は前記磁性体本体に含まれる金属系軟磁性材料100重量部に対して0.05重量部〜0.2重量部の含量で含まれる、請求項1に記載のチップ電子部品。
- 前記磁性体本体の充填率は80%以上である、請求項1に記載のチップ電子部品。
- 絶縁基板の少なくとも一面に内部コイルパターンを形成する段階と、
前記内部コイルパターンが形成された絶縁基板の上部及び下部に磁性体シートを積層して磁性体本体を形成する段階と、
前記磁性体本体の少なくとも一端面に前記内部コイルパターンの端部と接続するように外部電極を形成する段階と、を含み、
前記磁性体シートは、不飽和カルボン酸系重合体及びシロキサン系共重合体を含んで形成するチップ電子部品の製造方法。 - 前記磁性体シートは金属系軟磁性材料を含んで形成する、請求項9に記載のチップ電子部品の製造方法。
- 前記金属系軟磁性材料の粒子径は0.1μm〜30μmである、請求項10に記載のチップ電子部品の製造方法。
- 前記不飽和カルボン酸系重合体は重量平均分子量が500〜2,300である、請求項9に記載のチップ電子部品の製造方法。
- 前記シロキサン系共重合体は重量平均分子量が500〜2,300である、請求項9に記載のチップ電子部品の製造方法。
- 前記磁性体シートは、前記磁性体シートに含まれる金属系軟磁性材料100重量部に対して、前記不飽和カルボン酸系重合体を0.5重量部〜2重量部含む、請求項9に記載のチップ電子部品の製造方法。
- 前記磁性体シートは、前記磁性体シートに含まれる金属系軟磁性材料100重量部に対して、前記シロキサン系共重合体を0.05重量部〜0.2重量部含む、請求項9に記載のチップ電子部品の製造方法。
- 前記磁性体本体の充填率は80%以上である、請求項9に記載のチップ電子部品の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0027291 | 2014-03-07 | ||
KR1020140027291A KR101994732B1 (ko) | 2014-03-07 | 2014-03-07 | 칩 전자부품 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2015170843A JP2015170843A (ja) | 2015-09-28 |
JP6489541B2 true JP6489541B2 (ja) | 2019-03-27 |
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JP2014104028A Active JP6489541B2 (ja) | 2014-03-07 | 2014-05-20 | チップ電子部品及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6489541B2 (ja) |
KR (1) | KR101994732B1 (ja) |
CN (1) | CN104900375A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101832607B1 (ko) | 2016-05-13 | 2018-02-26 | 삼성전기주식회사 | 코일부품 및 그 제조방법 |
US11515079B2 (en) | 2016-07-29 | 2022-11-29 | Taiyo Yuden Co., Ltd. | Laminated coil |
JP6955382B2 (ja) * | 2016-07-29 | 2021-10-27 | 太陽誘電株式会社 | 積層コイル |
WO2020022393A1 (ja) | 2018-07-25 | 2020-01-30 | 味の素株式会社 | 磁性ペースト |
JP7356270B2 (ja) * | 2019-07-01 | 2023-10-04 | 株式会社豊田中央研究所 | 圧粉磁心 |
WO2021043343A2 (zh) * | 2020-11-17 | 2021-03-11 | 深圳顺络电子股份有限公司 | 一种一体成型电感及其制作方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004210936A (ja) * | 2002-12-27 | 2004-07-29 | Tdk Corp | プリプレグ、シート状樹脂硬化物及び積層体 |
JP2006253320A (ja) * | 2005-03-09 | 2006-09-21 | Tdk Corp | コイル部品 |
JP2007067214A (ja) * | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | パワーインダクタ |
JP5115691B2 (ja) | 2006-12-28 | 2013-01-09 | Tdk株式会社 | コイル装置、及びコイル装置の製造方法 |
JP2009007534A (ja) * | 2007-06-29 | 2009-01-15 | Nippon Zeon Co Ltd | 重合性組成物およびその用途 |
KR101799409B1 (ko) * | 2010-08-18 | 2017-11-20 | 스미토모 세이카 가부시키가이샤 | 카르복실기 함유 중합체 조성물의 제조방법 및 카르복실기 함유 중합체 조성물 |
KR20130072816A (ko) | 2011-12-22 | 2013-07-02 | 삼성전기주식회사 | 인덕터의 제조 방법 |
JP6060508B2 (ja) * | 2012-03-26 | 2017-01-18 | Tdk株式会社 | 平面コイル素子およびその製造方法 |
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2014
- 2014-03-07 KR KR1020140027291A patent/KR101994732B1/ko active IP Right Grant
- 2014-05-20 JP JP2014104028A patent/JP6489541B2/ja active Active
- 2014-12-03 CN CN201410724564.XA patent/CN104900375A/zh active Pending
Also Published As
Publication number | Publication date |
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KR20150105087A (ko) | 2015-09-16 |
CN104900375A (zh) | 2015-09-09 |
JP2015170843A (ja) | 2015-09-28 |
KR101994732B1 (ko) | 2019-07-01 |
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