JP6486388B2 - モノリシックメッシュ支持型euv膜 - Google Patents
モノリシックメッシュ支持型euv膜 Download PDFInfo
- Publication number
- JP6486388B2 JP6486388B2 JP2016566848A JP2016566848A JP6486388B2 JP 6486388 B2 JP6486388 B2 JP 6486388B2 JP 2016566848 A JP2016566848 A JP 2016566848A JP 2016566848 A JP2016566848 A JP 2016566848A JP 6486388 B2 JP6486388 B2 JP 6486388B2
- Authority
- JP
- Japan
- Prior art keywords
- support mesh
- euv
- membrane layer
- mesh
- zirconium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 30
- 239000012528 membrane Substances 0.000 claims description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 13
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 229910007948 ZrB2 Inorganic materials 0.000 claims 4
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 4
- 230000031700 light absorption Effects 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 25
- 239000010410 layer Substances 0.000 description 18
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461932017P | 2014-01-27 | 2014-01-27 | |
| US61/932,017 | 2014-01-27 | ||
| PCT/US2014/072588 WO2015112310A1 (en) | 2014-01-27 | 2014-12-29 | A monolithic mesh-supported euv membrane |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017504080A JP2017504080A (ja) | 2017-02-02 |
| JP2017504080A5 JP2017504080A5 (enExample) | 2017-03-09 |
| JP6486388B2 true JP6486388B2 (ja) | 2019-03-20 |
Family
ID=53678922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016566848A Expired - Fee Related JP6486388B2 (ja) | 2014-01-27 | 2014-12-29 | モノリシックメッシュ支持型euv膜 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9606459B2 (enExample) |
| EP (1) | EP3100114B1 (enExample) |
| JP (1) | JP6486388B2 (enExample) |
| WO (1) | WO2015112310A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170146902A1 (en) * | 2014-01-27 | 2017-05-25 | Luxel Corporation | Monolithic euv transparent membrane and support mesh and method of manufacturing same |
| US10258930B2 (en) | 2015-06-19 | 2019-04-16 | Mark Larson | High-performance, low-stress support structure with membrane |
| US9835940B2 (en) | 2015-09-18 | 2017-12-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to fabricate mask-pellicle system |
| KR102743373B1 (ko) * | 2015-11-03 | 2024-12-13 | 에이에스엠엘 네델란즈 비.브이. | 멤브레인 어셈블리 제조 방법 |
| CA3008477A1 (en) | 2015-12-17 | 2017-06-22 | Asml Netherlands B.V. | Pellicle and pellicle assembly |
| KR102408195B1 (ko) | 2016-04-25 | 2022-06-13 | 에이에스엠엘 네델란즈 비.브이. | Euv 리소그래피를 위한 멤브레인 |
| KR102691828B1 (ko) * | 2021-07-27 | 2024-08-05 | (주)휴넷플러스 | 관통홀 구조가 형성된 펠리클의 제조방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001108799A (ja) * | 1999-10-08 | 2001-04-20 | Nikon Corp | X線発生装置、x線露光装置及び半導体デバイスの製造方法 |
| US6623893B1 (en) * | 2001-01-26 | 2003-09-23 | Advanced Micro Devices, Inc. | Pellicle for use in EUV lithography and a method of making such a pellicle |
| US7723704B2 (en) * | 2006-11-10 | 2010-05-25 | Globalfoundries Inc. | EUV pellicle with increased EUV light transmittance |
| US8018578B2 (en) * | 2007-04-19 | 2011-09-13 | Asml Netherlands B.V. | Pellicle, lithographic apparatus and device manufacturing method |
| EP2051139B1 (en) * | 2007-10-18 | 2010-11-24 | Shin-Etsu Chemical Co., Ltd. | Pellicle and method for manufacturing the same |
| JP4934099B2 (ja) * | 2008-05-22 | 2012-05-16 | 信越化学工業株式会社 | ペリクルおよびペリクルの製造方法 |
| JP5394808B2 (ja) * | 2009-04-22 | 2014-01-22 | 信越化学工業株式会社 | リソグラフィ用ペリクルおよびその製造方法 |
| JP5921109B2 (ja) | 2010-08-23 | 2016-05-24 | キヤノン株式会社 | トナー |
| JP2012151158A (ja) * | 2011-01-17 | 2012-08-09 | Shin Etsu Chem Co Ltd | Euv用ペリクル膜及びペリクル、並びに該膜の製造方法 |
| KR101303795B1 (ko) | 2011-12-26 | 2013-09-04 | 주식회사 에프에스티 | 초극자외선용 펠리클 및 그 제조방법 |
| JP5748347B2 (ja) * | 2012-02-09 | 2015-07-15 | 信越化学工業株式会社 | Euv用ペリクル |
| JP5711703B2 (ja) * | 2012-09-03 | 2015-05-07 | 信越化学工業株式会社 | Euv用ペリクル |
| US9057957B2 (en) * | 2013-06-13 | 2015-06-16 | International Business Machines Corporation | Extreme ultraviolet (EUV) radiation pellicle formation method |
-
2014
- 2014-12-29 JP JP2016566848A patent/JP6486388B2/ja not_active Expired - Fee Related
- 2014-12-29 US US14/584,928 patent/US9606459B2/en not_active Expired - Fee Related
- 2014-12-29 WO PCT/US2014/072588 patent/WO2015112310A1/en not_active Ceased
- 2014-12-29 EP EP14880310.9A patent/EP3100114B1/en not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| EP3100114A1 (en) | 2016-12-07 |
| EP3100114B1 (en) | 2019-06-19 |
| US20150212434A1 (en) | 2015-07-30 |
| JP2017504080A (ja) | 2017-02-02 |
| US9606459B2 (en) | 2017-03-28 |
| WO2015112310A1 (en) | 2015-07-30 |
| EP3100114A4 (en) | 2017-09-06 |
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