JP6464327B2 - 撮像素子及び撮像装置 - Google Patents
撮像素子及び撮像装置 Download PDFInfo
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- JP6464327B2 JP6464327B2 JP2018541973A JP2018541973A JP6464327B2 JP 6464327 B2 JP6464327 B2 JP 6464327B2 JP 2018541973 A JP2018541973 A JP 2018541973A JP 2018541973 A JP2018541973 A JP 2018541973A JP 6464327 B2 JP6464327 B2 JP 6464327B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
- H01L27/14616—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/34—Systems for automatic generation of focusing signals using different areas in a pupil plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14607—Geometry of the photosensitive area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
- G03B13/36—Autofocus systems
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Focusing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Automatic Focus Adjustment (AREA)
Description
Card)カード、オーディオ・ビデオI/O(Input/Output)端子を介して接続される外部オーディオ・ビデオ機器、無線接続される外部オーディオ・ビデオ機器、有/無線接続されるスマートフォン、有/無線接続されるパーソナルコンピュータ、有/無線接続されるPDA、有/無線接続されるパーソナルコンピュータ、イヤホン等がある。
本出願は、2016年9月27日出願の日本特許出願(特願2016−188705)に基づくものであり、その内容はここに取り込まれる。
2 絞り
4 レンズ制御部
5 撮像素子
40 レンズ装置
50 受光面
51 画素
51A 撮像用画素
51R 第一画素
51L 第二画素
51B 位相差検出用画素
52 画素行
53 駆動回路
54 信号処理回路
X 行方向
Y 列方向
8 レンズ駆動部
9 絞り駆動部
10 撮像素子駆動部
11 システム制御部
14 操作部
17 デジタル信号処理部
20 外部メモリ制御部
21 記憶媒体
22 表示ドライバ
23 表示部
24 制御バス
25 データバス
60,70 半導体基板
61,71R,71L 光電変換部
62,62R,62L,72R,72L 電荷転送部
62a,62ar,62al 転送電極
62b,62br,62bl 転送チャネル
63,73R,73L 電荷保持部
64,74R,74L 読み出し回路
65,65R,65L,75R,75L 開口
69,76R,76L フローティングディフュージョン
66 遮光膜
67 レンズ
68 酸化膜
SG 信号線
200 スマートフォン
201 筐体
202 表示パネル
203 操作パネル
204 表示入力部
205 スピーカ
206 マイクロホン
207 操作部
208 カメラ部
210 無線通信部
211 通話部
212 記憶部
213 外部入出力部
214 GPS受信部
215 モーションセンサ部
216 電源部
217 内部記憶部
218 外部記憶部
220 主制御部
ST1〜STn GPS衛星
Claims (3)
- 撮像光学系を通して被写体を撮像する撮像素子であって、
半導体基板内に形成された画素の中に、前記撮像光学系の瞳領域の一方向に並ぶ異なる部分を通過した一対の光束の一方を受光し受光量に応じた電荷を蓄積する光電変換部を含む第一画素と、前記一対の光束の他方を受光し受光量に応じた電荷を蓄積する光電変換部を含む第二画素と、のペアが複数含まれており、
前記ペアを構成する前記第一画素及び第二画素の各々は、
前記画素内の前記光電変換部から転送された電荷を保持し、前記電荷に応じた信号が読み出し回路によって読み出される電荷保持部と、
前記光電変換部に蓄積された電荷を前記電荷保持部に転送するための前記半導体基板内に形成された転送チャネル及び前記転送チャネル上方に形成された転送電極と、
前記光電変換部の受光領域を除く領域、前記電荷保持部、及び、前記転送電極を遮光する遮光膜と、を含み、
前記第一画素及び第二画素の各々に含まれる前記光電変換部及び電荷保持部は、前記半導体基板に垂直な方向から見た状態において、前記一方向に直交する方向に並んでおり、
前記転送チャネルは、前記半導体基板に垂直な方向から見た状態において、前記第一画素及び第二画素のうちの前記光電変換部の前記受光領域を前記一方向に直交する方向に移動させた場合の軌跡で示される領域を除く領域に形成されている撮像素子。 - 請求項1記載の撮像素子であって、
前記第一画素と前記第二画素の各々は、前記光電変換部の上方に前記光電変換部の受光領域に光を集光するためのレンズを有し、
前記レンズは、前記一方向の幅が前記一方向に直交する方向の幅よりも大きくなっている撮像素子。 - 請求項1又は2記載の撮像素子を備える撮像装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016188705 | 2016-09-27 | ||
JP2016188705 | 2016-09-27 | ||
PCT/JP2017/029201 WO2018061497A1 (ja) | 2016-09-27 | 2017-08-10 | 撮像素子及び撮像装置 |
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JP6464327B2 true JP6464327B2 (ja) | 2019-02-06 |
JPWO2018061497A1 JPWO2018061497A1 (ja) | 2019-04-25 |
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JP2018541973A Active JP6464327B2 (ja) | 2016-09-27 | 2017-08-10 | 撮像素子及び撮像装置 |
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US (1) | US10484632B2 (ja) |
JP (1) | JP6464327B2 (ja) |
CN (1) | CN109792497B (ja) |
WO (1) | WO2018061497A1 (ja) |
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KR20190012812A (ko) * | 2017-07-28 | 2019-02-11 | 에스케이하이닉스 주식회사 | 위상차 검출 픽셀을 구비한 이미지 센서 |
JP2019192769A (ja) * | 2018-04-25 | 2019-10-31 | 株式会社東芝 | 固体撮像素子 |
US11516413B2 (en) | 2020-07-29 | 2022-11-29 | Fingerprint Cards Anacatum Ip Ab | Adaptive readout from an optical biometric sensor to a host device |
US11508180B2 (en) * | 2020-07-29 | 2022-11-22 | Fingerprint Cards Anacatum Ip Ab | Adaptive readout from a global shutter optical biometric sensor |
Citations (7)
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JP2011243735A (ja) * | 2010-05-18 | 2011-12-01 | Fujifilm Corp | 撮像素子とその製造方法、及び撮像装置 |
WO2012023355A1 (ja) * | 2010-08-16 | 2012-02-23 | ソニー株式会社 | 撮像素子および撮像装置 |
WO2012132670A1 (ja) * | 2011-03-31 | 2012-10-04 | 富士フイルム株式会社 | 固体撮像素子及びその駆動方法並びに撮影装置 |
JP2013157883A (ja) * | 2012-01-31 | 2013-08-15 | Sony Corp | 固体撮像素子およびカメラシステム |
WO2015002006A1 (ja) * | 2013-07-05 | 2015-01-08 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
JP2015204381A (ja) * | 2014-04-14 | 2015-11-16 | キヤノン株式会社 | 固体撮像装置及びカメラ |
WO2016098624A1 (ja) * | 2014-12-18 | 2016-06-23 | ソニー株式会社 | 固体撮像素子、撮像装置、および電子機器 |
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JP3885769B2 (ja) * | 2003-06-02 | 2007-02-28 | ソニー株式会社 | 固体撮像装置および固体撮像装置の駆動方法 |
JP5733970B2 (ja) * | 2010-01-15 | 2015-06-10 | キヤノン株式会社 | 焦点検出装置 |
JP5664270B2 (ja) | 2011-01-21 | 2015-02-04 | ソニー株式会社 | 撮像素子および撮像装置 |
JP6045314B2 (ja) * | 2012-11-20 | 2016-12-14 | オリンパス株式会社 | 固体撮像装置、固体撮像装置の制御方法、および撮像装置 |
JP6127869B2 (ja) * | 2013-09-25 | 2017-05-17 | ソニー株式会社 | 固体撮像素子及びその駆動方法、並びに電子機器 |
JP6176062B2 (ja) * | 2013-11-06 | 2017-08-09 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
JP2016058559A (ja) * | 2014-09-10 | 2016-04-21 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
JP2016134587A (ja) * | 2015-01-22 | 2016-07-25 | ソニー株式会社 | 固体撮像装置、及び、電子機器 |
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2017
- 2017-08-10 CN CN201780059212.9A patent/CN109792497B/zh active Active
- 2017-08-10 JP JP2018541973A patent/JP6464327B2/ja active Active
- 2017-08-10 WO PCT/JP2017/029201 patent/WO2018061497A1/ja active Application Filing
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2019
- 2019-03-25 US US16/363,549 patent/US10484632B2/en active Active
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JP2011243735A (ja) * | 2010-05-18 | 2011-12-01 | Fujifilm Corp | 撮像素子とその製造方法、及び撮像装置 |
WO2012023355A1 (ja) * | 2010-08-16 | 2012-02-23 | ソニー株式会社 | 撮像素子および撮像装置 |
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US10484632B2 (en) | 2019-11-19 |
JPWO2018061497A1 (ja) | 2019-04-25 |
US20190222786A1 (en) | 2019-07-18 |
WO2018061497A1 (ja) | 2018-04-05 |
CN109792497A (zh) | 2019-05-21 |
CN109792497B (zh) | 2021-04-20 |
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