JP6449552B2 - ガラスフリット焼成膜を有する気密端子 - Google Patents
ガラスフリット焼成膜を有する気密端子 Download PDFInfo
- Publication number
- JP6449552B2 JP6449552B2 JP2014065469A JP2014065469A JP6449552B2 JP 6449552 B2 JP6449552 B2 JP 6449552B2 JP 2014065469 A JP2014065469 A JP 2014065469A JP 2014065469 A JP2014065469 A JP 2014065469A JP 6449552 B2 JP6449552 B2 JP 6449552B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- outer ring
- sleeve
- glass frit
- metal outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims description 69
- 229910052751 metal Inorganic materials 0.000 claims description 78
- 239000002184 metal Substances 0.000 claims description 78
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910000640 Fe alloy Inorganic materials 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000005394 sealing glass Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
40,50・・・琺瑯引き気密端子、
11,21,31,41,51・・・金属外環、
12,22,32,42,52・・・リード、
13,23,33,43,53・・・絶縁ガラス、
14,24,34・・・琺瑯スリーブ、
15,25,35・・金属ベース、
16,26,36,46,56・・ガラスフリット焼成膜、
17,27・・・沿面距離拡張手段。
Claims (2)
- 金属外環と、この金属外環に挿通したリードと、前記金属外環と前記リードとを気密に封着した絶縁ガラスと、前記リードに挿着され前記絶縁ガラスに固着した琺瑯スリーブとを備え、前記琺瑯スリーブは、金属ベースの表面にガラスフリット焼成膜を設けたことを特徴とする琺瑯スリーブ付き気密端子。
- 前記琺瑯スリーブは、表面をひだ状または段状に加工した沿面距離拡張手段を設けたことを特徴とする請求項1に記載の琺瑯スリーブ付き気密端子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014065469A JP6449552B2 (ja) | 2014-03-27 | 2014-03-27 | ガラスフリット焼成膜を有する気密端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014065469A JP6449552B2 (ja) | 2014-03-27 | 2014-03-27 | ガラスフリット焼成膜を有する気密端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015187963A JP2015187963A (ja) | 2015-10-29 |
| JP6449552B2 true JP6449552B2 (ja) | 2019-01-09 |
Family
ID=54430096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014065469A Active JP6449552B2 (ja) | 2014-03-27 | 2014-03-27 | ガラスフリット焼成膜を有する気密端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6449552B2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7013402B2 (ja) * | 2019-02-19 | 2022-01-31 | ショット日本株式会社 | 電動コンプレッサ用気密端子 |
| JP7533593B2 (ja) * | 2020-09-11 | 2024-08-14 | 住友電装株式会社 | 電気接続箱 |
| CN114230199B (zh) * | 2021-11-12 | 2023-12-26 | 中江立江电子有限公司 | 大直径射频绝缘子烧结模具及其使用方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532302Y2 (ja) * | 1975-10-24 | 1980-08-01 | ||
| JPS5258494A (en) * | 1975-11-10 | 1977-05-13 | Nec Home Electronics Ltd | Production of enameled type el |
| JPS53133788A (en) * | 1976-12-29 | 1978-11-21 | Mitsubishi Electric Corp | Sealed terminal |
| JPS5945870U (ja) * | 1982-09-17 | 1984-03-27 | 三菱電機株式会社 | 気密絶縁端子 |
| US4786762A (en) * | 1988-03-03 | 1988-11-22 | Emerson Electric Co. | Sleeve arrangement for a hermetic terminal assembly |
| JPH10214646A (ja) * | 1997-01-31 | 1998-08-11 | Nec Kansai Ltd | 気密端子 |
| JP2001093596A (ja) * | 1999-09-28 | 2001-04-06 | Nec Kansai Ltd | 気密端子 |
| JP2013030663A (ja) * | 2011-07-29 | 2013-02-07 | Nisshin Steel Co Ltd | パワー半導体用絶縁基板、その製造方法及びパワー半導体モジュール |
-
2014
- 2014-03-27 JP JP2014065469A patent/JP6449552B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2015187963A (ja) | 2015-10-29 |
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