JP6447292B2 - Light processing equipment - Google Patents

Description

  The present invention relates to an optical processing apparatus and an optical processing method. More specifically, the present invention relates to, for example, resist ashing processing in a manufacturing process of a semiconductor or a liquid crystal panel, removal processing of a resist attached to a pattern surface of a template in a nanoimprint apparatus, a glass substrate for liquid crystal, a silicon wafer, etc. The present invention relates to an optical processing apparatus and an optical processing method suitable for dry cleaning processing, smear removal (desmear) processing in a printed circuit board manufacturing process, and the like.

Conventionally, for example, photo-ashing processing of resist in the manufacturing process of semiconductors, liquid crystal panels, etc., removal processing of resist adhering to the pattern surface of the template in the nanoimprint apparatus, dry cleaning processing of glass substrates for silicon and silicon wafers, printed circuit boards 2. Description of the Related Art As an optical processing apparatus and optical processing method used for smear removal (desmear) processing in a manufacturing process, an optical processing apparatus and optical processing method using ultraviolet rays are known. In particular, an apparatus and method using active species such as ozone and oxygen radicals generated by vacuum ultraviolet rays radiated from an excimer lamp or the like can be used preferably because a predetermined treatment can be performed more efficiently and in a short time. Has been.
For example, Patent Document 1 proposes a method of irradiating a substrate with ultraviolet rays as a desmear process for via holes, and proposes irradiating a substrate with via holes formed with ultraviolet rays in an atmosphere containing oxygen.

International Publication WO2014 / 104154

As a result of intensive studies, the present inventors have made (1) a gas (processing gas) such as oxygen or ozone, or a gas (processing gas) containing oxygen, ozone, etc., for ultraviolet processing for desmear processing. It has been found that the processing efficiency is improved by irradiating the substrate with ultraviolet rays and (2) moving the processing gas so that it flows over the substrate rather than sealing it into the processing chamber.
However, as a result of experiments, the present inventors have found that as the processing gas flows on the substrate, the speed at which smear is removed (desmear processing speed) gradually decreases, and the processing speed differs between upstream and downstream of the flow. In other words, the present inventors have found that unevenness occurs in the substrate with respect to the smear removing process.
An object of the present invention is to suppress processing unevenness in an object on which light processing is performed.

In order to solve the above problems, an aspect of an optical processing device according to the present invention includes a light source unit that emits light, and a surface of an object to be processed exposed to light emitted from the light source unit in an atmosphere of a processing gas. A processing section, a gas supply / discharge section for flowing the processing gas along the surface, and a reversing section for reversing the direction in which the processing gas flows.
According to such an optical processing apparatus, the flow of the processing gas is reversed, so that the difference in the processing speed between the upstream and downstream of the flow is also reversed, and as a result, the processing object (for example, the substrate) is reversed. Differences in processing speed are comprehensively reduced to suppress processing unevenness.
Here, the “processing gas” is a gas for processing an object to be processed, and is a gas that obtains processing capability by being exposed to light from the light source unit. A preferable combination of light and processing gas is, for example, a combination of vacuum ultraviolet light and oxygen. When oxygen is exposed to vacuum ultraviolet light, oxygen radicals (active species) and ozone are generated to oxidize the surface and deposits of the object to be treated.

In the optical processing apparatus according to the present invention, the gas supply / exhaust section opens on one of both sides of the object to be processed sandwiched in the flow direction of the process gas, and is used for both supply and discharge of the process gas. A first supply / discharge path, a second supply / discharge path that opens to the other of the two sides and that is used for both supply and discharge of the processing gas, the first supply / discharge path, and the first A supply device connected to each of the two supply / discharge passages for supplying the processing gas, and a discharge device connected to each of the first supply / discharge passage and the second supply / discharge passage for discharging the processing gas A first connector for selectively connecting the feeder and the discharger to the first supply / exhaust passage, and the feeder and the discharger selectively to the second supply / exhaust passage. And a second connector to be connected. The reversing unit may reverse the flow of the processing gas by switching the connection of the supply device and the discharge device by the first connector and the second connector.
According to the optical processing apparatus having this structure, the structure for reversing the flow of the processing gas is simple and easy to manufacture.

Further, in the optical processing apparatus according to the present invention, the reversing unit includes the processing gas with a time interval longer than a required time for the flow of the processing gas by the gas supply / discharge unit to pass through the surface of the object to be processed. It is also possible to reverse the flow.
According to such an optical processing apparatus, since the reversal of the flow is performed after a sufficient time has elapsed, it is possible to avoid a situation in which the processing exhaust gas is stagnated on the substrate.
In order to solve the above-described problem, an aspect of the light processing method according to the present invention is a first exposure in which the surface of the object to be processed is exposed to light in an atmosphere of a processing gas flowing along the surface of the object to be processed. A process, a reversing process for reversing the flow of the processing gas, and the surface exposed to light in the first exposure process in the atmosphere of the processing gas flowing in the direction reversed by the reversing process. Through a second exposure step.
According to such a light processing method, the flow of the processing gas is reversed by the reversing step, so that the difference in the processing speed between the upstream and downstream of the flow is also reversed, and as a result, the difference in the processing speed in the substrate. Is reduced overall and processing unevenness is also suppressed.

In the light processing method according to the present invention, the reversing step may be executed a plurality of times during the light processing on one surface of one object to be processed. It is conceivable that the stirring action of the processing gas works by such a plurality of reversing steps, and the processing unevenness between the upstream and downstream of the flow is further reduced.
In the optical processing method according to the present invention, the reversing step may be performed with a time interval equal to or longer than a required time for the flow of the processing gas to pass through the surface of the object to be processed.
According to such an optical processing method, since the reversal of the flow is performed after a sufficient time has elapsed, it is possible to avoid a situation in which the exhaust gas of the processing stagnates on the substrate.

  According to the light processing apparatus and the light processing method of the present invention, processing unevenness in an object on which light processing is performed is suppressed.

It is a schematic block diagram which shows the optical processing apparatus of this embodiment. It is a sectional structure figure showing a schematic structure of a substrate. It is a figure which shows the 1st step of the effect | action in a desmear process. It is a figure which shows the 2nd step of the effect | action in a desmear process. It is a figure which shows the 3rd step of the effect | action in a desmear process. It is a figure which shows the last step of the effect | action in a desmear process. It is a figure which shows the specific evaluation example of a desmear process. It is a graph showing the time passage of the C / Cu value in the desmear process example shown in FIG. It is a graph showing the time passage of the C / Cu value when the flow of the processing gas is reversed during the desmear process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram illustrating an optical processing apparatus according to the present embodiment. In this embodiment, an application example to a desmear processing apparatus is shown as an example of an optical processing apparatus.
(Configuration of light processing equipment)
The light processing apparatus 100 stores therein a processing unit 20 that holds and processes the substrate W and a plurality of ultraviolet light sources 11 that emit, for example, vacuum ultraviolet rays, and the substrate W of the processing unit 20 receives the ultraviolet light source 11 from the ultraviolet light source 11. The light irradiation part 10 which irradiates light, and the supply / exhaust part 40 which supplies and exhausts the process gas with respect to the process part 20 are provided.

The light irradiation unit 10 corresponds to an example of the light source unit according to the present invention, the processing unit 20 corresponds to an example of the processing unit according to the present invention, and the supply / exhaust unit 40 corresponds to the gas supply / exhaust unit according to the present invention. It corresponds to an example.
The light irradiation unit 10 includes a box-shaped casing 14, and a window member 12 made of, for example, quartz glass that transmits vacuum ultraviolet rays, for example, is hermetically provided on a lower surface of the casing 14. An inert gas such as nitrogen gas is supplied from the supply port 15 into the light irradiation unit 10 and is maintained in an inert gas atmosphere. A reflecting mirror 13 is provided above the ultraviolet light source 11 in the light irradiation unit 10, and reflects light emitted from the ultraviolet light source 11 toward the window member 12. The light from the ultraviolet light source 11 is irradiated almost uniformly on the entire effective irradiation region R substantially corresponding to the entire width of the reflecting mirror 13.

The ultraviolet light source 11 emits, for example, vacuum ultraviolet light (ultraviolet light having a wavelength of 200 nm or less), and various known lamps can be used. For example, the ultraviolet light source 11 is a xenon excimer lamp (wavelength 172 nm), a low-pressure mercury lamp (wavelength 185 nm), or the like enclosing xenon gas. For example, a xenon excimer lamp is suitable for use in the desmear process.
The processing unit 20 is provided with a stage 21 that attracts and holds the substrate W to be subjected to ultraviolet irradiation processing (desmear processing) on the surface thereof, facing the window member 12 of the light irradiation unit 10. An outer peripheral groove 21 a is provided in the outer peripheral portion of the stage 21, and the O-ring 22 is sandwiched between the outer peripheral groove 21 a and the window member 12 of the light irradiation unit 10, so that the light irradiation unit 10, the processing unit 20, Is airtightly assembled. A thermal resistance heater (not shown) is incorporated in the stage 21, and the substrate W on the stage 21 is heated during the desmear process.

The supply / exhaust section 40 has supply / exhaust pipes 41 opened on both sides of the substrate W on the stage 21 in the left-right direction in FIG. 1, and each supply / exhaust pipe 41 serves to supply and exhaust processing gas. Used for both. In FIG. 1, a pair of supply / exhaust pipes 41 is illustrated with the substrate W interposed therebetween, but the supply / exhaust portion 40 is provided with a plurality of supply / exhaust pipes 41 on both sides of the substrate W. The tubes 41 are arranged in a direction perpendicular to the paper surface of FIG.
A supply device 42 that supplies a processing gas and an exhaust device 43 that exhausts exhaust gas and the like are connected to both the left and right supply / exhaust pipes 41 across the substrate W via a three-way valve 44. The three-way valve 44 is an electromagnetic valve, and connects the pipe (gas supply line) from the supply device 42 and the pipe (exhaust line) to the exhaust device 43 to the supply / exhaust pipe 41 selectively and switchably. Switching of the connection by the three-way valve 44 is controlled by the control unit 45. As shown in FIG. 1, a supply / exhaust pipe 41 used for both supply and discharge is used, and the structure in which supply and discharge are switched by a three-way valve 44 or the like is simple and easy to manufacture.

The left and right supply / exhaust pipes 41 sandwiching the substrate W correspond to examples of the first supply / discharge path and the second supply / discharge path according to the present invention, and the supply device 42 corresponds to an example of the supply machine according to the present invention. The exhaust device 43 corresponds to an example of the discharge machine according to the present invention, the three-way valve 44 corresponds to an example of the first connector and the second connector according to the present invention, and the control unit 45 corresponds to the present invention. This corresponds to an example of the reverse portion.
The control unit 45 controls the connection by the three-way valve 44 so that the supply device 42 is connected to one of the left and right supply / exhaust pipes 41 sandwiching the substrate W, and the exhaust device 43 is connected to the other. As a result, the processing gas is supplied from one of the left and right supply / exhaust pipes 41 and discharged from the other, so that the processing gas passes between the window member 12 and the substrate W from the right to the left in FIG. It will flow from left to right.

While the processing gas is flowing, the light irradiation unit 10 irradiates the substrate W with ultraviolet rays. In addition, while the substrate W is irradiated with ultraviolet rays, the control unit 45 switches the connection of the two three-way valves 44 and periodically reverses the flow of the processing gas every time the set time elapses.
Here, as the processing gas, for example, oxygen gas, a mixed gas of oxygen and ozone or water vapor, a gas obtained by mixing these gases with an inert gas, or the like can be considered. In this embodiment, oxygen gas is used. Shall.

(Substrate structure)
As the substrate W to be processed by the optical processing apparatus 100, substrates W having various structures are used. Here, a simplified structure example will be described.
FIG. 2 is a sectional view showing a schematic structure of the substrate W. As shown in FIG.
The substrate W is an intermediate wiring board material in the middle of manufacturing a multilayer wiring board for mounting a semiconductor element such as a semiconductor integrated circuit element.
In a multilayer wiring board, a via hole extending through one or a plurality of insulating layers in the thickness direction is formed in order to electrically connect one wiring layer and another wiring layer. In the manufacturing process of the multilayer wiring board, via holes 33 are formed by removing a part of the insulating layer 31 by, for example, applying laser processing to the wiring board material in which the insulating layer 31 and the wiring layer 32 are laminated. Is done.

However, smear (residue) S resulting from the material constituting the insulating layer 31 adheres to the bottom and side surfaces of the formed via hole 33. If plating is performed in the via hole 33 with the smear S still adhered, poor connection between wiring layers may be caused. For this reason, a desmear process for removing the smear S adhering to the via hole 33 is performed on the wiring board material (substrate W) on which the via hole 33 is formed.
When the substrate W is placed on the stage 21 shown in FIG. 1, the substrate W is placed so that the opening of the via hole 33 faces the light irradiation unit 10, that is, the smear S is exposed to ultraviolet rays from the ultraviolet light source 11. Placed.

(Desmear processing procedure)
Next, returning to FIG. 1, the procedure of desmear processing executed by the light processing apparatus 100 will be described.
First, the substrate W to be processed is transferred from outside the processing unit 20 into the processing unit 20 and placed on the stage 21. The substrate W is held on the stage 21 by vacuum suction or the like. Further, the connection of the three-way valve 44 is controlled by the control unit 45, the gas supply line is connected to one of the supply / exhaust pipes 41, and the exhaust line is connected to the other supply / exhaust pipe 41. Thereafter, the supply gas is supplied from the supply / exhaust pipe 41 to the processing unit 20 by the supply device 42.

Simultaneously with the supply of the processing gas, the ultraviolet light source 11 is turned on, the ultraviolet rays are irradiated from the irradiation unit 10 toward the processing unit 20, and the substrate W is irradiated with the ultraviolet rays through the processing gas.
The processing gas irradiated with ultraviolet rays generates active species such as ozone and oxygen radicals, and reacts with and removes smear in the via hole, as will be described in detail later. A gas such as carbon dioxide generated by the reaction between the processing gas and smear is carried downstream along the flow of the newly supplied processing gas, and drawn into the other air supply / exhaust pipe 41 to be exhausted 43. It is discharged by.
The controller 45 switches the connection of the three-way valve 44 during the one-side processing of the substrate W and reverses the flow of the processing gas. After the reversal of the flow, the substrate W is continuously irradiated with ultraviolet rays through the processing gas, and the reaction between the processing gas and smear is continued.
The processed substrate W is removed from the stage 21 and carried out of the processing unit 20.

(Desmear treatment effect)
Here, a detailed operation in the desmear process will be described.
3-6 is a figure which shows each step of the effect | action in a desmear process.
In the first stage shown in FIG. 3, the supplied processing gas is irradiated with ultraviolet rays as indicated by an arrow pointing from the upper side to the lower side in the drawing, so that the active species 34 is generated from oxygen contained in the processing gas. Ozone and oxygen radicals (here, only oxygen radicals are shown) are generated. The active species 34 enters the via hole 33 of the substrate W.
In the second stage shown in FIG. 4, the active species 34 reacts with the smear S in the via hole 33 and a part of the smear S is decomposed, and even when the smear S is irradiated with ultraviolet rays, a part of the smear S is formed. Disassembled. By the decomposition of the smear S, a reaction product gas 35 such as carbon dioxide gas or water vapor is generated.

Then, in the third stage shown in FIG. 5, the reaction product gas 35 flows from the supply side (for example, the right side in the figure), and is discharged from the via hole 33 (for example, the figure) by the new processing gas containing the active species 34. To the left). As the reaction product gas 35 is discharged, a new processing gas containing the active species 34 enters the via hole 33.
As a result of repeated irradiation of ultraviolet rays, entry of the active species 34, and discharge of the reaction product gas 35, smear is completely removed from the via hole 33 in the final stage shown in FIG. The reaction product gas 35 pushed out of the via hole 33 rides on the flow of the processing gas on the substrate W and is discharged from the supply / exhaust pipe 41 shown in FIG.
The optical processing steps shown in FIGS. 3 to 6 correspond to an example of the processing steps according to the present invention.

  As described above, in desmear treatment, for example, active species such as oxygen radicals and ozone are generated by ultraviolet irradiation and enter the via hole 33 and the ultraviolet ray itself is irradiated into the via hole 33 in order to improve the processing efficiency. is important. For this reason, the distance between the window member 12 and the substrate W shown in FIG. 1 is preferably 1.0 mm or less, particularly preferably 0.5 mm or less, and more preferably 0.3 mm. Degree. Thereby, oxygen radicals and ozone can be generated stably, and the vacuum ultraviolet rays reaching the surface of the substrate W can be set to a sufficiently large intensity (light quantity).

(Evaluation of throughput)
Although there is no known evaluation standard for evaluating the degree (processing amount) of removal of smear by desmear processing, objective evaluation cannot be performed without some evaluation standard. Therefore, the present inventors decided to use an evaluation standard using EDX analysis (Energy dispersive X-ray spectroscopy). Specifically, in the characteristic X-ray spectrum generated when an electron beam is applied to the bottom of the via hole, evaluation is performed by paying attention to the signal ratio (C / Cu value) of carbon (C) and copper (Cu). ing. Since the characteristic X-ray spectrum of carbon is caused by smear in the via hole and the characteristic X-ray spectrum of copper is caused by the conductive layer at the bottom of the via hole, if the C / Cu value is large, a large amount of smear remains in the via hole. This is because if the C / Cu value is small, no smear remains in the via hole (the desmear process is in progress). Such evaluation by the C / Cu value is in good agreement with the appearance observation result of the via hole by SEM (scanning electron microscope), and it was found that it is appropriate as an evaluation standard. In addition, as a result of intensive studies based on experiments and the like, as a criterion for determining that the desmear process has been completed, a criterion that the C / Cu value is 0.05 or less (C / Cu ≦ 0.05) is adopted. Yes. On the other hand, the C / Cu value before the start of desmear was about 0.3 in the via hole used in this evaluation example (described later).

A specific evaluation example of desmear processing using such an evaluation criterion will be shown below.
FIG. 7 is a diagram illustrating a specific evaluation example of the desmear process.
The evaluation example shown in FIG. 7 shows the amount of smear processing per unit time at each location on the substrate when the processing gas is flowed in a certain direction along the surface of the substrate.
The horizontal axis of FIG. 7 shows the position on the substrate in the direction along the flow of the processing gas, and the end of the most upstream substrate is “0 mm” and the end of the most downstream substrate is “510 mm”. . The vertical axis represents the change amount (decrease amount) of the C / Cu value per second, and this change amount represents the amount of smear processed per second.

  The graph of FIG. 7 shows the C / Cu value at a “45 mm” position located upstream of the flow, a “255 mm” position located in the middle of the flow, and a “465 mm” position located downstream of the flow. The amount of change is shown. From the graph, it can be seen that the amount of change in the C / Cu value is large on the upstream side, that is, the amount of smear processing per unit time is larger on the upstream side than on the downstream side, and the desmear process proceeds faster. This is considered because the active species contained in the processing gas gradually decrease toward the downstream side.

Next, the time course of desmear processing at each of the upstream, middle stream, and downstream locations shown in this graph will be described.
FIG. 8 is a graph showing the passage of time of the C / Cu value in the desmear process example shown in FIG.
The horizontal axis of the graph represents the elapsed time of desmear processing, and the vertical axis represents the C / Cu value. In addition, the thick solid line L1 shown in the graph indicates the progress of the desmear process at the upstream location described above, the dotted line L2 indicates the progress at the midstream location described above, and the thin solid line L3 indicates the above-described progress. The progress in the downstream part is shown.

The slope of each of the lines L1, L2, and L3 shown in the graph is equal to the change amount (decrease amount) of the C / Cu value shown in FIG. Both Cu values are 0.3. Further, the time when each of the lines L1, L2, and L3 reaches the reference line L0 having a C / Cu value of 0.05 is the time when the desmear process is completed at each location.
Since the progress of the desmear process is fast at the upstream location, the thick solid line L1 has a large slope, and it takes 112 seconds to decrease the C / Cu value from 0.3 to 0.05, whereas it takes 156 seconds at the midstream location. And it turned out that 185 seconds are required in the downstream part.

  That is, in the atmosphere of the processing gas flowing in the steady direction, it means that 185 seconds, which is the processing time at the downstream location, is required to complete the desmearing process for the entire substrate surface in the above example. However, at the upstream location, after the smear removal is completed, an excessive process of 185-112 = 73 seconds is performed, resulting in process unevenness in the substrate. Such excessive treatment causes the active species to react not only with smear but also with the insulating layer that is not desired to be removed, resulting in undesirable results such as roughening of the surface of the insulating layer and enlargement of the diameter of the via hole. Therefore, it is desirable to suppress the processing unevenness and shorten the excessive processing.

(Reverse action)
In the optical processing apparatus 100 shown in FIG. 1, the direction of the processing gas flowing between the window member 12 and the substrate W is changed by switching the connection of the three-way valve 44 provided in the supply / discharge unit 40 by the control unit 45. Reverse. Such reversal is performed while processing one surface of one substrate W, and as will be described below, it is possible to reduce the time of the excess processing and the time of the desmear processing.
FIG. 9 is a graph showing the passage of time of the C / Cu value when the flow of the processing gas is reversed during the desmear process.
Also in this graph, the horizontal axis represents the elapsed time of the desmear process, and the vertical axis represents the C / Cu value. Further, the thick solid line L4 shown in the graph indicates the progress of the desmear process at the upstream location described above, the dotted line L5 indicates the progress at the midstream location described above, and the thin solid line L6 indicates the above-described progress. The progress in the downstream part is shown.

  The flow of the processing gas is reversed at 70 seconds after the start of the desmear process, and the concentration distribution of the active species in the direction along the flow is also reversed. As a result, the upstream location at the start of processing becomes a downstream location after the reversal of the flow, and the processing speed decreases, so that the slope of the thick solid line L4 decreases at 70 seconds. On the contrary, the downstream portion at the start of the processing becomes the upstream portion after the reversal of the flow and the processing speed increases, so that the thin solid line L6 increases in inclination at the time of 70 seconds. In this way, the processing speed at the upstream and downstream locations changes due to the reversal of the flow of the processing gas, so that the time required for completion of desmearing at each of the upstream, midstream, and downstream locations is 140 seconds, 156 seconds, and 140 seconds, respectively. It became.

The process from the start of the desmear process to 70 seconds corresponds to an example of the first exposure process according to the present invention, and the reverse at the time of 70 seconds corresponds to an example of the reverse process according to the present invention. The process after 70 seconds from the start corresponds to an example of the second exposure process in the present invention.
In the example shown in FIG. 9, the time difference of desmear completion is shortened to 156-140 = 16 seconds with respect to 73 seconds shown in FIG. 8, and processing unevenness in the substrate is greatly suppressed. Furthermore, the time required to complete the desmear process on the entire surface of the substrate is also 156 seconds required to complete the desmear process at the midstream location, which is 19 seconds (11%) shorter than the case shown in FIG. .

As described above, when the flow of the processing gas is reversed during the desmear process for one surface of one substrate, the concentration of active species is high on one side of the substrate and the concentration is low on the other side. It was found that the processing unevenness of the desmear process can be suppressed and the time for the excessive process can be reduced. Further, it was found that when the flow of the processing gas is reversed during the processing, there is no portion where the concentration of the active species is always low, so that the time required for completing the desmear processing on the entire surface of the substrate is shortened.
In the example shown in FIG. 9, an example in which the flow is reversed only once during the process is shown. However, the flow is reversed a plurality of times during the process under the condition that the stirring action is strong when the flow is reversed. As a result, the concentration of the active species is promoted and the processing unevenness is further suppressed. Therefore, the control unit 45 shown in FIG. 1 periodically reverses the flow of the processing gas as described above.

(Examination of reverse cycle)
Here, the period for reversing the flow of the processing gas is examined.
If the reversal cycle is too short, the flow is reversed before the processing gas whose exhaust species has increased due to the decrease in the concentration of the active species is discharged from the substrate, and the exhaust gas etc. will stagnate on the substrate. Become. Therefore, it is desirable to reverse at least a time period longer than the time required for the processing gas to pass over the substrate in one direction. In other words, when the length of the substrate in the direction along the flow is L (m) and the flow velocity of the processing gas is V (m / s), the reverse rotation period T (s) is T> L / V. Can be represented. For example, when L = 600 mm and V = 300 mm / s, the period T for reversing the processing gas is preferably longer than 2 seconds.
In the above description, an application example to a desmear processing apparatus is shown as an example of the optical processing apparatus of the present invention. However, the optical processing apparatus of the present invention is, for example, an optical ashing processing apparatus, a resist removal processing apparatus, or a dry processing apparatus. You may apply to a washing | cleaning processing apparatus etc.

In the above description, the control unit that switches the flow of the processing gas at regular intervals is illustrated. However, the reversing unit referred to in the present invention is, for example, about half the processing time as shown in FIG. The flow may be switched only once.
In the above description, the supply / exhaust pipe used for both supply and discharge is illustrated, but the gas supply / discharge section referred to in the present invention is provided with dedicated supply and discharge pipes on both sides of the substrate. It may be.
In the above description, an example of supplying and exhausting air with an air supply device or an exhaust device is shown as the gas supply / exhaust unit according to the present invention. However, the gas supply / exhaust unit according to the present invention is, for example, a cylinder The processing gas may be flowed by natural supply / discharge using pressure or the like.

  DESCRIPTION OF SYMBOLS 100 ... Light processing apparatus, W ... Board | substrate, 10 ... Light irradiation part, 20 ... Processing part, 40 ... Supply / exhaust part, 41 ... Supply / exhaust pipe, 42 ... Supply apparatus, 43 ... Exhaust apparatus, 44 ... Three-way valve, 45 ... Control unit

Claims (3)

A light source that emits light;
A processing unit in which the surface of the object to be processed is exposed to the light emitted from the light source unit in an atmosphere of a processing gas;
A gas supply / exhaust section for flowing the processing gas along the surface;
A reversing part for reversing the direction in which the processing gas flows;
Equipped with a,
The gas supply / exhaust section is
A first supply / exhaust passage that opens on one of both sides sandwiching the object to be processed in the flow direction of the processing gas and is used for both supply and discharge of the processing gas;
A second supply / exhaust path that opens to the other of the two sides and that is used for both supply and discharge of the processing gas;
A feeder connected to each of the first supply / discharge passage and the second supply / discharge passage for supplying the processing gas;
A discharger connected to each of the first supply / discharge path and the second supply / discharge path to discharge the processing gas;
A first connector for selectively connecting the feeder and the discharger to the first supply / discharge path;
A second connector for selectively connecting the feeder and the discharger to the second supply / discharge path;
With
The optical processing apparatus , wherein the reversing unit reverses the flow of the processing gas by switching the connection of the supply device and the discharge device by the first connector and the second connector . That the pre-Symbol reversed section, is intended to reverse the flow of the process gas at a predetermined time or more time intervals the flow of the processing gas by the gas supply-discharge portion passes through the surface of the object to be processed object The optical processing apparatus according to claim 1, wherein: The optical processing apparatus according to claim 1, wherein the reversing unit reverses the flow of the processing gas a plurality of times during optical processing on one surface of one object to be processed .

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